Module arrangement with at least two power modules for a vehicle with internal cooling and manufacturing process

Abstract

Module arrangement (25) with at least two power modules (1) for a vehicle, wherein the at least two power modules (1) are electrically connected to each other, wherein each power module (1) for the vehicle comprises two carrier devices (2), wherein each carrier device (2) has an insulated metal substrate (6) on a rear side (4) and electronic components (5) are arranged on the respective carrier devices (2) on a front side (3) opposite the rear side (4), and wherein each power module (1) comprises a cooling device for cooling the carrier devices (2) and for dissipating heat generated during the operation of the electronic components (5), wherein a recess (7) is provided in the metal substrate (6) of at least one of the carrier devices (2) starting from the rear side (4) and the carrier devices (2) are arranged relative to each other in such a manner,that the rear sides (4) abut each other in a contact area (10), the recess (7) is arranged in the contact area (10) and a cooling channel (9) is formed by the recess (7), which is part of the cooling device for cooling the support devices (2) and the components (5), wherein an inlet opening (12) as an inlet for a cooling medium and an outlet opening (13) as an outlet for the cooling medium are provided in at least one of the support devices (2), wherein the inlet opening (12) and the outlet opening (13) open into the cooling channel (9), wherein the power module (1) has a flange element (15) which is attached to the front side (3) of one of the support devices (2), wherein the flange element (15) has an inlet connection (16) which is fluidically connected to the inlet opening (12) and an outlet connection (17) which is fluidically connected to the outlet opening (13),and wherein the flange element (15) is part of a housing of the module arrangement (25) in which the power modules (1) are arranged.

Description

The present invention relates to a module arrangement with at least two power modules. Each power module for the vehicle comprises two carrier structures, wherein the respective carrier structures have an insulated metal substrate on a rear side and electronic components are arranged on the respective carrier structures on a front side opposite the rear side. The power module further comprises a cooling device for cooling the carrier structures. The present invention further relates to a method for manufacturing a module arrangement with at least two power modules for a vehicle. The focus here is on power modules that can be used in vehicles. Such power modules comprise carrier structures on which electronic components, and in particular semiconductor components, are arranged. To dissipate the heat generated during the operation of the electronic components, the power modules have a corresponding cooling system. Furthermore, carrier structures with an insulated metal substrate are known from the prior art. In these carrier structures or boards, the substrate is made of a metal, preferably aluminum, and enables very good heat dissipation from the electronic components. The electronic components are arranged on a front or component side of the carrier structure.On the reverse side, facing away from the front, such a carrier structure can be connected to a heat sink, for example, a heat sink or a cooling channel. Direct airflow onto the metal substrate of the carrier structure has also been implemented. The electronic components are thermally well connected to the metal substrate on the component side. Only a relatively thin insulating layer is required between the electronic components and the highly thermally conductive sub-substrate for electrical insulation. EP 3 147 941 A1 describes a semiconductor module with a first substrate comprising an insulating layer sandwiched between two metallic layers. A cooling element is connected to the first substrate via one of the metallic layers, and semiconductor devices are arranged on the second metallic layer. A second cooling element comprises a second substrate with further semiconductor devices. Cooling channels are formed between the interconnected cooling elements. DE 203 19 086 U1 describes a cooler for electronic components, which has a heat sink and a connection block with hose connections arranged on the heat sink. DE 10 2007 015 293 A1 describes a liquid cooler with two metal bodies, wherein several metal / ceramic compound substrates are attached to the liquid cooler. Furthermore, methods are known from the prior art that describe the formation of a cooling channel between two surfaces to be cooled. US Patent 8,391,011 B2 describes a cooling device comprising an upper plate and a lower plate. Inserts are provided between the upper and lower plates to guide the coolant and optimize the coolant flow. Such a double-sided cooling system is very complex. It has many individual components and numerous interfaces through which the heat must flow. This results in a relatively high thermal resistance. To better utilize the available installation space, the components, or rather the semiconductor components, are often combined into prefabricated modules. For example, corresponding half-bridges or full-bridges for power controllers can be combined. A key feature is that the semiconductors are mounted in a package, and an external surface for heat dissipation is provided alongside the series-arranged electrical connections. Within the module, the components are connected as effectively as possible to the cooling metal surfaces to distribute the heat over the largest possible area, thus enabling a large-area cooling connection for the module and resulting in lower thermal resistance. Furthermore, power modules are known in the prior art that are, for example, surrounded by a coolant on three sides to achieve optimal heat dissipation. The methods described above require many manufacturing steps before the complete circuit is integrated into a power module. In some cases, the electrical connection options are limited to one side. This leads to long connection paths and therefore slow circuits. However, circuits will become faster in the future as increasingly faster semiconductors become available. There is a conflict between good cooling and short connections, which makes short connection paths difficult to achieve. This is especially true when additional components are present that require little or no cooling. Semiconductor modules with so-called dual or single inline terminal blocks and a heat sink must, by design, be relatively small to avoid a difficult-to-manufacture, very flat cooling surface.Furthermore, depending on the concept used, there are restrictions on the arrangement of the connections; for example, this is only possible in a row with some of the modules. The object of the present invention is to provide a solution for how a power module for a vehicle with a cooling device can be implemented in such a way as to enable efficient operation of the power modules. This problem is solved according to the invention by a modular arrangement and by a method with the features according to the independent claims. Advantageous embodiments of the present invention are specified in the dependent claims. A module arrangement according to the invention comprises at least two power modules. The at least two power modules are electrically connected to each other. Each power module for the vehicle comprises two carrier units, each carrier unit having an insulated metal substrate on its rear side. Electronic components are arranged on the respective carrier units on a front side opposite the rear side. The power module also includes a cooling device for cooling the carrier units. A recess is formed in the metal substrate of at least one of the carrier units, extending from the rear side. Furthermore, the carrier units are arranged relative to each other such that their rear sides are in contact with each other. The recess is also located within this contact area.Furthermore, the recess forms a cooling channel, which is part of the cooling system for cooling the support structures or components. At least one of the support structures has an inlet opening for a cooling medium and an outlet opening for the cooling medium. The inlet and outlet openings open into the cooling channel. Each inlet and outlet opening can be designed as a through-hole extending completely through at least one of the support structures. Both the inlet and outlet openings can be located within one of the support structures. Alternatively, the inlet opening can be located in a first support structure and the outlet opening in a second. The cooling channel can be easily connected to a cooling circuit via the inlet and outlet openings. This allows for effective cooling of a large number of components, particularly semiconductor devices. The power module is provided with a flange element, which has an inlet port and an outlet port, both fluidically connected to the inlet opening. This flange element is attached to the front of one of the support structures. A corresponding connection nozzle can be arranged at the inlet and / or outlet opening of the at least one support structure. A fluidic connection to the inlet and / or outlet port of the flange element can then be established via this connection nozzle. The inlet and outlet ports of the flange element can then be connected to a cooling circuit. The flange element is provided to be part of a housing of the module assembly in which the power modules are arranged.Overall, the flange element allows for a simple connection to a cooling circuit. The module assembly comprises several power modules. This enables a modular design in which identical assemblies can be used multiple times. As previously explained, the individual power modules or their support structures can have electrical contact elements that can be connected by electrical connecting cables. This allows for an electrical connection between at least two power modules. Furthermore, the power modules are arranged in a common housing. As previously explained, each power module features a flange element that enables fluidic application within the cooling circuit. This flange element is part of the module assembly's housing. The power module can preferably be used in a vehicle. The power module comprises at least two carrier units. These carrier units include a substrate, which can be made of a metal, such as aluminum or copper. Such an insulated metal substrate is also known as IMS® (Insulated Metal Substrate). The insulated metal substrate is located on the back of each carrier unit. Electronic components can be arranged on the front, or component side. For example, conductive traces can be provided on the front side to which the electronic components can be connected. An electrically insulating layer, which electrically isolates the conductive traces from the metal substrate, can be provided between the metal substrate and the conductive traces on the front side.The electronic components can be semiconductor devices, especially power semiconductor devices. They can also be resistors, capacitors, and / or inductors. Electronic components can also be purely electromechanical devices, such as chokes and transformers. To dissipate the heat generated during operation of the electronic components, the power module incorporates a cooling system. According to a key aspect of the invention, a recess is provided in the metal substrate of at least one of the support devices. Alternatively, the metal substrates of both support devices may be provided in the recess. The recess is formed into the metal substrate of the at least one support device starting from a rear surface. The recess can be formed into the metal substrate by means of a separation process. A milling process or the like may be used for this purpose. Furthermore, the two support devices are connected to each other such that their rear surfaces are in contact with each other, at least in certain areas. The respective rear surfaces of the support devices or the isolated metal substrates are generally flat. The recess is formed in at least one of the support devices.Subsequently, the support structures can be connected to each other at their rear sides. The respective rear sides are connected in a contact area. This contact area can encompass at least a portion of the respective rear sides of the support structures. The recess is positioned within this contact area. This ensures that the recess is closed by the connection of the two support structures, thus forming a closed cooling channel. A cooling medium, particularly a coolant, can then be circulated through this cooling channel. It is therefore proposed to connect the two support structures, or the two boards with the metallic substrates, in such a way that a cooling channel is formed between them on the unpopulated back side. This allows the cooling medium to flow through the support structures on their facing back sides. The electronic components are mounted on the respective front sides. Thus, a power module with internal cooling and externally mounted components can be provided. Such a power module can be manufactured simply and cost-effectively. Furthermore, this approach offers the advantage of enabling efficient operation of the components. Preferably, the recess of the at least one support device is designed such that at least one closed sealing line is formed in the contact area, with a sealing element arranged along the sealing line for connecting the support devices and / or for providing a seal between the support devices. The sealing line can be formed in the contact area where the rear surfaces of the support devices abut each other, preferably allowing the rear surfaces to lie flat against each other. This sealing line or sealing area is preferably closed and circumferential. The recess can be arranged within this sealing line. A sealing element can then be arranged along this sealing line. This sealing element can serve, on the one hand, to seal a connection between the two support devices.This ensures that the cooling channel, formed by the at least one recess, is sealed. This sealing element can also serve to connect the two support structures. For example, a suitable adhesive can be used as the sealing element, serving both to connect the support elements and to seal them. Alternatively, a separate seal can be provided, and the connection between the support structures can be achieved using an adhesive bond. A screw connection can also be used to join the support structures. Overall, this allows for a reliable seal of the cooling channel, thus enabling the reliable operation of the power module. According to a further embodiment, the recess of the at least one support structure is designed such that a plurality of webs for guiding a cooling medium are formed in the metal substrate. The recess is thus designed such that webs remain in the sub-substrate of the at least one support structure. These webs form at least one cooling channel, which serves to guide the cooling medium, in particular a cooling liquid. Specifically, the respective upper surface of the plurality of webs is planar in a plane on the rear side of the support structures. In the assembled state, the two support structures touch at this plane, apart from any sealing element that may be interposed. At an outer edge, the webs can form a circumferential planar surface on which the sealing line runs.It is also possible for the webs to be designed in such a way that they do not touch the other support structure. In principle, the webs can be shaped so that the flow of the cooling medium achieves the most optimal cooling effect possible with low back pressure. Local flow velocities and eddies are generated, as well as a large surface area on the back side of the support structures. In another embodiment, the power module has a through-hole that extends through the support structures. The support structures or boards can, in principle, have any flat contours. In particular, corresponding openings or through-holes are also possible. The power module can therefore have multiple through-holes. Such a through-hole extends through both support structures. An additional sealing line can be provided in the area of ​​the through-holes, surrounding them. This allows for a seal to be created at the through-hole. Electrical connections, such as cables or wires, can be routed through this through-hole. This enables a space-saving arrangement and shorter lengths for the electrical connections.Thus, the requirements for a high electrical connection density can be met with short connection lengths between the support devices. As previously explained, the electronic components can be designed as semiconductor devices, such as diodes and / or transistors. Furthermore, at least one of the electronic components can be an integrated circuit. It is also possible for the electronic components to be designed as resistors, capacitors, inductors, and / or transformers. It is also possible for different components to be arranged on the front sides or component sides of the respective carrier devices. The electronic components can thus be grouped. For example, semiconductor devices, capacitors, and / or resistors can be arranged as electronic components on the front side of one carrier device, and inductors or coils can be arranged as electronic components on the front side of the other carrier device.At least one connecting line can be used to provide an electrical connection between the components of the two support devices. This at least one connecting line can be routed through the through-hole(s). The respective coils can also be arranged in a pot, for example an aluminum pot, without insulation. The coils can then also be encapsulated in this pot. Furthermore, it can be provided that the pot is manufactured by deep drawing the metal substrate. Furthermore, it is advantageous if an electrical contact element for providing an electrical connection is arranged on the front of at least one of the carrier devices. It is necessary to provide corresponding electrical connections radiating from the respective carrier devices. On the one hand, electrical connections can be provided between the two carrier devices themselves. In addition, electrical connections to other power modules and electrical connections to external components, such as corresponding plugs or terminals on a housing, can be provided. Thus, the respective components of the carrier devices or power modules can be electrically connected. The respective electrical contact elements can, in principle, be positioned arbitrarily on the front of the carrier devices.It is also possible for the electrical contact elements to be arranged on a side area of ​​the power module. In particular, it is possible for the electrical contact elements to be designed as pin headers. According to a further embodiment, the module arrangement comprises a fluidic connection device which has channels for guiding a cooling medium, wherein the channels are fluidically connected to the cooling channels of the respective power modules. For example, the fluidic connection device can be essentially plate-shaped. The connection device can have the corresponding channels through which the cooling medium or coolant can be guided. The respective channels can open into corresponding openings, which in turn can be fluidically connected to the inlet and / or outlet openings of the respective power modules. It is particularly provided that the fluidic connection device is arranged perpendicular to the respective power modules. For example, the respective power modules can be arranged along a vertical axis of the module arrangement.This allows for a virtually three-dimensional cooling effect. Cooling can occur on multiple levels. Therefore, the described arrangement offers the advantage that any air bubbles present can escape upwards through the connections. A vehicle according to the invention comprises a module arrangement according to the invention. The module arrangement can be part of the vehicle's electronics. For example, the module arrangement can be part of the vehicle's electric drive system. The vehicle can be designed as an at least partially electrically powered vehicle. A method according to the invention serves to manufacture a module arrangement with at least two power modules for a vehicle, wherein the at least two power modules are electrically connected to one another. For the manufacture of each power module for the vehicle, two carrier devices are provided, each carrier device having an insulated metal substrate on a rear side. Electronic components are arranged on the respective carrier devices on a front side opposite the rear side. Furthermore, a cooling device is provided for cooling the carrier devices. It is provided that a recess is formed in the metal substrate of at least one of the carrier devices, starting from the rear side. The carrier devices are arranged relative to each other such that their rear sides abut each other in a contact area, and the recess is located in this contact area.Furthermore, the recess forms a cooling channel, which is part of the cooling system for cooling the support structures or components. At least one of the support structures has an inlet opening for a cooling medium and an outlet opening for the cooling medium, with both openings leading into the cooling channel. The power module has a flange element attached to the front of one of the support structures. The flange element has an inlet port, which is fluidically connected to the inlet opening, and an outlet port, which is fluidically connected to the outlet opening. The flange element is part of a housing for the module assembly, in which the power modules are arranged. In summary, this concept presents a method for producing power modules using simple means. Compared to conventional power modules, the only additional step required is the creation of a recess on the back of at least one carrier element. Other components, such as the gasket or sealing element, are also necessary when manufacturing power modules with conventional metal substrates. The components can be placed on the carrier elements or insulated metal substrates using standard pick-and-place machines. For soldering the components, a standard reflow process, for example, can be used. Furthermore, this approach offers the advantage of producing and using prefabricated modules. For instance, identical circuit structures can be used in multiple components. The preferred embodiments and their advantages presented with reference to the module arrangement according to the invention apply accordingly to the vehicle according to the invention and to the method according to the invention. Further features of the invention will become apparent from the claims, the figures, and the description of the figures. The features and combinations of features mentioned above in the description, as well as the features and combinations of features mentioned below in the description of the figures and / or shown in the figures alone, are not only usable in the combinations specified, but also in other combinations or on their own. The invention will now be explained in more detail with reference to a preferred embodiment and the drawings. The drawings show: Fig. 1, a schematic perspective view of a power module comprising two support elements connected to each other; Fig. 2, a schematic perspective view of one of the support elements, wherein a recess is formed in a metal substrate starting from a rear side; Fig. 3, a schematic perspective view of the power module, which also has a flange element; Fig. 4, a sectional side view of the power module according to Fig. 3; Fig. 5, a power module according to a further embodiment, which has electrical contact elements; Fig. 6, a schematic representation of a region of a power module, which has a through-opening; Fig. 7, a sectional side view of a power module with a through-opening; and Fig.8 a schematic representation of a modular arrangement with a plurality of power modules and a fluidic connection device. The figures shown here only depict partial aspects of the subject matter or process claimed by the independent claims. In the figures, identical or functionally equivalent elements are given the same reference symbols. Fig. 1 shows a schematic perspective view of a power module 1. This power module 1 can be part of a vehicle's electronics. The power module 1 comprises two carrier units 2, which are connected to each other. Each carrier unit 2 has a front surface 3, which can also be referred to as the component side. A plurality of electronic components 5 are arranged on this front surface 3. The electronic components 5 can be, in particular, semiconductor devices. The electronic components 5 can also be designed as resistors, capacitors, inductors, or the like. The components 5 are, in particular, designed in surface-mount devices (SMD). On a rear surface 4 opposite the front surface 3, each carrier unit 2 has a metal substrate 6. This metal substrate 6 can, for example, be made of aluminum or copper.An electrical insulation layer, not shown in detail here, is provided between the metal substrate 6 and the components 5 or corresponding conductor tracks on the front surface 3. In this case, the two support structures 2 are arranged relative to each other such that they are connected at their rear surfaces 4. Fig. 2 shows a schematic perspective view of one of the support structures 2, starting from the rear side 4. It can be seen that a recess 7 is formed in the metal substrate 6, extending from the rear side 4. This recess 7 is formed in the metal substrate 6 such that a plurality of webs 8 remain. A cooling channel 9 is formed by the recess 7 and the webs 8. This cooling channel 9 serves to guide a cooling medium, in particular a cooling liquid. The cooling channel 9 is part of a cooling device for cooling the support structures 2 and / or the components 5. The recess 7 can be formed in the metal substrate 6 of at least one of the support structures 2. In this design, the rear surfaces 4 of the two support structures 2 are connected to each other in a contact area 10. This contact area 10 extends over the respective rear surfaces 4 of the support structures 2. The recess 7 is located within this contact area 10. The connection of the two support structures then forms the cooling channel 9, through which the cooling medium can be conveyed. As can be seen in Fig. 2, the recess 7 is formed in the metal substrate 6 such that an area with a circumferential sealing line 11 remains. A sealing element or gasket can be arranged along this sealing line 11 to seal the cooling channel 9. It is also possible for this sealing element to simultaneously serve to connect the two support structures 2 to each other.For connecting the support devices 2 to each other, an adhesive connection or a screw connection together with a circumferential seal can generally be provided. As can be seen in Fig. 1, an inlet opening 12 is also provided in the upper support structure 2. This inlet opening 12 extends through the support structure 2 and opens into the cooling channel 9. The inlet opening 12 serves as the inlet for the cooling medium or coolant. Analogous to the inlet opening 12, an outlet opening 13 is provided, to which a connection nozzle 14 is arranged. This outlet opening 13 also opens into the cooling channel 9. Fig. 3 shows a further embodiment of a power module 1 in a perspective view. Compared to the power module 1 according to Fig. 1, this power module 1 additionally has a flange element 15. This flange element 15 is arranged on the upper support structure 2. The flange element 15 has an inlet port 16, which is fluidically connected to the inlet opening 12 of the support structure 2. Furthermore, the flange element 15 has an outlet port 17, which is fluidically connected to the outlet opening 13 of the support structure 2. The flange element 15 also includes a plurality of bores 18 for screw connections and for mounting the power module 1 within the overall electronics of the vehicle. The flange element 15 is part of a housing and can be manufactured during the casting process of the housing. In this case, there is no need to connect the flange element 15 to the housing. Fig. 4 shows the power module 1 according to Fig. 3 in a sectional side view. The sections through the cooling channel 9 are visible. The dashed line 19 describes the edge or boundary of the cooling channel 9. It can also be seen that the flange element 15 establishes a fluidic connection between the inlet port 16, the cooling channel 9, and the outlet port 17. A corresponding seal can also be provided in a connection area 20 between the upper support structure 2 and the flange element 15. Fig. 5 shows a perspective view of the power module 1 according to a further embodiment. This power module 1 differs from the power module 1 according to Fig. 1 in that additional electrical contact elements 21 are arranged on the front faces 3 of the carrier devices 2. The present illustration clarifies that these electrical contact elements 21 can be arranged arbitrarily on the top face 3 of the carrier devices 2. The electrical contact elements 21 are designed as pin headers and can, for example, be soldered onto the carrier devices 2. The contacts of the electrical contact elements 21 can be oriented perpendicular to the front face 3 or parallel to the front face 3. The electrical contact elements 21 serve to electrically connect the power module 1 to the other power modules 1 or other terminals. Fig. 6 shows a partial view of the power module 1 according to a further embodiment. A section of the power module 1 is shown from above, or from the front 3. In this example, the power module 1 has a through-opening 22 that extends through both support structures 2. Furthermore, line 19 describes the boundary of the cooling channel 9. A surface 23 is provided between the boundary of the cooling channel 9 and the through-opening 22, which serves to connect the support structures 2 to each other and to seal the cooling channel 9. For example, a suitable adhesive can be applied to this surface 23 and / or a sealing element can be inserted. Fig. 7 shows a power module 1 with a through-opening 22 according to a further embodiment. It can be seen that the through-opening 22 can be used to provide an electrical connection between the components 5 of the upper support structure 2 and the components 5 of the lower support structure 2. For this purpose, a connecting line 24 is provided, which passes through the through-opening 22. The connecting line 24 is electrically connected to an electrical contact element 21 of the upper support structure 2 and a contact element 21 of the lower support structure 2. Fig. 8 shows a schematic perspective view of a module arrangement 25. This module arrangement 25 comprises a plurality of power modules 1. In the present embodiment, the module arrangement 25 comprises three power modules 1 arranged parallel to one another. Electrical contact elements 21 are provided on each power module 1, enabling electrical connection between the individual power modules 1 via connecting lines 24. Additional contact elements 21 are arranged on the power module 1 on the right-hand side, which serve for electrical connection to other assemblies. Furthermore, the module arrangement 25 includes a fluidic connection device 26. The fluidic connection device 26 is essentially plate-shaped. The connection device 26 includes channels 27, which serve to guide the cooling medium or coolant. The flow of the cooling medium is illustrated by the arrows 28. The connection device 26 is arranged perpendicular to the respective power modules 1. The fluidic connection device 26 also includes openings 29, which are fluidically connected to the inlet openings 12 of the respective power modules 1. Furthermore, the fluidic connection device 26 includes openings 30, which are fluidically connected to the outlet openings 13 of the respective power modules 1. The fluidic connection device 26 is closed on its upper surface 31 to provide the channels 27.This upper surface 31 can also serve as a cooling surface for other components or as the outer wall of a housing. A lower surface 32 of the fluidic connection device 26 can likewise be used as a cooling surface for other components. The flow rate of the cooling medium, and thus the cooling capacity of the respective power modules, can be individually dimensioned via the cross-section of the channels 27 and / or the openings 29 and 30. The illustration in Fig. 8 represents one possible embodiment. A multitude of geometric configurations are possible to adapt the concept to the respective component architecture. For example, the described power modules 1 can be used in a wide variety of configurations. It is also possible to implement conventionally designed cooling levels, such as the top surface of the fluidic connection device 26. Reference symbol list 1 Power module 2 Carrier device 3 Front 4 Back 5 Component 6 Metal substrate 7 Recess 8 Web 9 Cooling channel 10 Contact area 11 Sealing line 12 Inlet opening 13 Outlet opening 14 Nozzle 15 Flange element 16 Inlet connection 17 Outlet connection 18 Bore 19 Line 20 Connection area 21 Electrical contact element 22 Through opening 23 Surface 24 Connecting line 25 Module arrangement 26 Fluidic connection device 27 Channel 28 Arrow 29 Opening 30 Opening 31 Top 32 Bottom

Claims

Module arrangement (25) with at least two power modules (1) for a vehicle, wherein the at least two power modules (1) are electrically connected to each other, wherein each power module (1) for the vehicle comprises two carrier devices (2), wherein each carrier device (2) has an insulated metal substrate (6) on a rear side (4) and electronic components (5) are arranged on the respective carrier devices (2) on a front side (3) opposite the rear side (4), and wherein each power module (1) comprises a cooling device for cooling the carrier devices (2) and for dissipating heat generated during the operation of the electronic components (5), wherein a recess (7) is provided in the metal substrate (6) of at least one of the carrier devices (2) starting from the rear side (4) and the carrier devices (2) are arranged relative to each other in such a manner,that the rear sides (4) abut each other in a contact area (10), the recess (7) is arranged in the contact area (10) and a cooling channel (9) is formed by the recess (7), which is part of the cooling device for cooling the support devices (2) and the components (5), wherein an inlet opening (12) as an inlet for a cooling medium and an outlet opening (13) as an outlet for the cooling medium are provided in at least one of the support devices (2), wherein the inlet opening (12) and the outlet opening (13) open into the cooling channel (9), wherein the power module (1) has a flange element (15) which is attached to the front side (3) of one of the support devices (2), wherein the flange element (15) has an inlet connection (16) which is fluidically connected to the inlet opening (12) and an outlet connection (17) which is fluidically connected to the outlet opening (13),and wherein the flange element (15) is part of a housing of the module arrangement (25) in which the power modules (1) are arranged. Module arrangement (25) according to claim 1, characterized in that the recess (7) of the at least one support device (2) is designed such that at least one closed sealing line (11) is formed in the contact area (10), wherein a sealing element for connecting the support devices (2) and / or for providing a seal between the support devices (2) is arranged along the sealing line (11). Module arrangement (25) according to claim 1 or 2, characterized in that the recess (7) of the at least one support device (2) is designed such that a plurality of webs (8) for guiding the cooling medium are formed in the metal substrate (6). Module arrangement (25) according to one of the preceding claims, characterized in that the power module (1) has a through-opening (22) which extends through the two support devices (2). Module arrangement (25) according to one of the preceding claims, characterized in that an electrical contact element (21) for providing an electrical connection is arranged on the front side (3) of at least one of the carrier devices (2). Module arrangement (25) according to one of the preceding claims, characterized in that the module arrangement (25) has a fluidic connection device (26) which has channels (27) for guiding the cooling medium, wherein the channels (27) are fluidically connected to the cooling channels (9) of the respective power modules (1). Method for manufacturing a module arrangement (25) with at least two power modules (1) for a vehicle, wherein the at least two power modules (1) are electrically connected to each other, wherein two carrier devices (2) are provided for manufacturing the respective power module (1) for the vehicle, wherein the respective carrier devices (2) have an insulated metal substrate (6) on a rear side (4), electronic components (5) are arranged on the respective carrier devices (2) on a front side (3) opposite the rear side (4), and a cooling device is provided for cooling the carrier devices (2) and for dissipating heat generated during the operation of the electronic components (5), wherein a recess (7) is provided in the metal substrate (6) of at least one of the carrier devices (2) starting from the rear side (4), and the carrier devices (2) are arranged relative to each other in such a manner.that the rear sides (4) abut each other in a contact area (10), the recess (7) is arranged in the contact area (10) and a cooling channel (9) is formed by the recess (7), which is part of the cooling device for cooling the support devices (2) and the components (5), wherein an inlet opening (12) as an inlet for a cooling medium and an outlet opening (13) as an outlet for the cooling medium are provided in at least one of the support devices (2), wherein the inlet opening (12) and the outlet opening (13) open into the cooling channel (9), wherein the power module (1) has a flange element (15) which is attached to the front side (3) of one of the support devices (2), wherein the flange element (15) has an inlet connection (16) which is fluidically connected to the inlet opening (12), and an outlet connection (17) which is fluidically connected to the outlet opening (13),and wherein the flange element (15) is part of a housing of the module arrangement (25) in which the power modules (1) are arranged.

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