ADAPTIVE AND CONTEXT-AWARE MICROECTROMECHANICAL SYSTEMS (MEMS) MIRROR CONTROL, METHOD AND LIDAR SYSTEM

A context-based control system for MEMS mirrors adjusts multiple parameters dynamically to maintain accuracy and performance under varying conditions, addressing the limitations of static control methods.

DE102019130645B4Active Publication Date: 2025-01-30INFINEON TECHNOLOGIES AG
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Patent Information

Application Number
DE102019130645
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Priority Date
2018-11-20
Filing Date
2019-11-13
Publication Date
2025-01-30
Estimated Expiration
2039-11-13

AI Technical Summary

Technical Problem

Existing MEMS mirror systems struggle with maintaining accuracy and performance under adverse and changing environmental and operating conditions due to the use of static mirror control parameters that do not adapt to these conditions.

Method used

Implementing a context-based control mechanism that utilizes multiple parameters in parallel to determine the state of the MEMS mirror and adapt dynamic mirror control parameters accordingly, such as phase control loop (PLL), amplitude control, and actuator voltage, to optimize operation under varying conditions.

Benefits of technology

Improves the accuracy and performance of MEMS mirror actuation and position recording by adapting to environmental and operational changes, enhancing the overall system's precision and reliability.

✦ Generated by Eureka AI based on patent content.

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Abstract

One comprehensive system: a microelectromechanical systems (MEMS) mirror (215); and a MEMS driver circuit (220) for: Receiving a plurality of elements of monitoring information associated with the MEMS mirror (215), wherein the plurality of elements of monitoring information includes at least one of: Sensor information received from one or more sensors (315) associated with the MEMS mirror (215), or Operational information received by a controller (245) assigned to the system (200); Determining a state of the MEMS mirror (215) based on the plurality of elements of monitoring information; and Adjusting a mirror control parameter associated with controlling the MEMS mirror (215) based on the state of the MEMS mirror (215), wherein the sensor information includes information associated with at least one of: a temperature at or near the MEMS mirror (215) (315-1); an amount of acceleration at or near the MEMS mirror (215) (315-2); an amount of electromagnetic interference (EMI) at or near the MEMS mirror (215) (315-3); an amount of pressure at or near the MEMS mirror (215); a vibration or shock experienced by the MEMS mirror (215); a current that is associated with driving the MEMS mirror (215) or with maintaining a position condition of the MEMS mirror (215); an aging effect experienced through the MEMS level (215) (315-4); an electrical discharge in the MEMS mirror (215) (315-5); a detection of a fault associated with the MEMS mirror (215) (315-6); or a presence of harmonics in the MEMS mirror (215) (315-7).
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Description

BACKGROUND

[0001] A microelectromechanical systems (MEMS) mirror is a device that can be used to direct light (e.g., a laser beam) in a variety of applications, such as a LiDAR application, a sensing application, an optical communications application, and / or the like. In operation, the MEMS mirror can move (e.g., tilt about one or more axes) to change the direction in which the light is directed by the MEMS mirror. The actuation, control, and position sensing of the MEMS mirror are performed by a MEMS driver circuit.

[0002] Publication US US4686363A proposes integrating the number of times a light beam, scanned in an oscillating trajectory by a self-resonant galvanometer scanner, travels far enough in a first direction to encounter a beginning-of-trace (BOT) sensor and far enough in the opposite direction to encounter an end-of-trace (EOT) sensor. The results are used to separately control the voltage level developed in a first, BOT, electrical tank circuit and in a second, EOT, electrical tank circuit. The voltage from each tank circuit is amplified and applied to drive the self-resonant scanner with a polarity that induces continuous oscillation during half of each oscillation cycle. SUMMARY

[0003] There is a need to provide an improved concept for a system comprising a microelectromechanical systems (MEMS) mirror and a MEMS driver circuit and a method of operating the same.

[0004] Such a need may be satisfied by the subject matter of one or more of the claims.

[0005] Some embodiments relate to a system comprising a MEMS mirror; and a MEMS driver circuit for: obtaining a plurality of items of monitoring information associated with the MEMS mirror, wherein the plurality of items of monitoring information comprises at least one of: Sensor information received from one or more sensors associated with the MEMS mirror or operational information received from a controller associated with the system; determining a state of the MEMS mirror based on the plurality of items of monitoring information; and adjusting a mirror control parameter associated with controlling the MEMS mirror based on the state of the MEMS mirror.

[0006] Optionally, the MEMS driver circuit is further configured to: cause the MEMS mirror to operate based on the adjusted mirror control parameter.

[0007] Again optionally, the system is a LiDAR system in which the MEMS driver circuit is intended to control a tilt of the MEMS mirror in conjunction with directing light associated with the LiDAR system.

[0008] The sensor information includes information associated with at least one of: a temperature at or near the MEMS mirror; an amount of acceleration at or near the MEMS mirror; an amount of electromagnetic interference (EMI) at or near the MEMS mirror; an amount of pressure at or near the MEMS mirror; a vibration or shock experienced by the MEMS mirror; a current associated with driving the MEMS mirror or maintaining a position condition of the MEMS mirror; an aging effect experienced by the MEMS mirror; an electrical discharge in the MEMS mirror; a detection of a fault associated with the MEMS mirror; or the presence of harmonics in the MEMS mirror.

[0009] Again optionally, the operational information includes information associated with at least one of: a request to modify a range of angular operation of the MEMS mirror; or a request to modify an accuracy requirement associated with the MEMS mirror.

[0010] Optionally, the mirror control parameter comprises at least one of: a phase-locked loop (PLL) control parameter associated with the MEMS mirror; an amplitude control parameter associated with the MEMS mirror; or an actuator voltage level control parameter associated with the MEMS mirror.

[0011] Again optionally, the plurality of pieces of monitoring information is a first plurality of pieces of monitoring information, the state is a first state, and the mirror control parameter is a first mirror control parameter, wherein the MEMS driver circuit is further configured to: obtain a second plurality of pieces of monitoring information associated with the MEMS mirror, determine a second state of the MEMS mirror based on the second plurality of pieces of monitoring information; and adjust a second mirror control parameter based on the second state of the MEMS mirror, wherein the second mirror control parameter is different from the first mirror control parameter.

[0012] Optionally, the second plurality of items of monitoring information is received at a different time than the first plurality of items of monitoring information.

[0013] Again optionally, the plurality of pieces of monitoring information is a first plurality of pieces of monitoring information and the state is a first state, wherein the MEMS driver circuit is further configured to: obtain a second plurality of pieces of monitoring information associated with the MEMS mirror, determine a second state of the MEMS mirror based on the second plurality of pieces of monitoring information; and further adjust the mirror control parameter based on the second state of the MEMS mirror.

[0014] Optionally, the MEMS driver circuit is further configured to: identify, based on the state of the MEMS mirror, that influence counteracting is to be performed; and determine an influence condition based on the state of the MEMS mirror; and wherein, when adjusting the mirror control parameter, the MEMS driver circuit is configured to: counteract influences on the MEMS mirror based on the determined influence condition.

[0015] Again optionally, when counteracting the influences on the MEMS mirror, the MEMS driver circuit is configured to: select the mirror control parameter from a plurality of mirror control parameters based on the influence condition; and determine a value for the mirror control parameter to obtain a least hazardous situation for the MEMS mirror.

[0016] Some embodiments relate to a method comprising: obtaining, by a MEMS driver circuit, a plurality of pieces of monitoring information associated with a MEMS mirror, wherein the MEMS driver circuit is to control operation of the MEMS mirror, and wherein the plurality of pieces of monitoring information comprises: sensor information provided by one or more sensors associated with the MEMS mirror or operational information provided by a controller associated with a system; determining, by the MEMS driver circuit and based on the plurality of pieces of monitoring information, a state of the MEMS mirror; and adjusting, by the MEMS driver circuit and based on the state of the MEMS mirror, a mirror control parameter based on which the MEMS driver circuit is to actuate the MEMS mirror.

[0017] Optionally, the method further comprises: actuating the MEMS mirror based on the adjusted mirror control parameter.

[0018] Again, the MEMS driver circuit and the MEMS mirror are optionally included in a LiDAR system.

[0019] Optionally, the sensor information includes information associated with at least one of: a temperature at or near the MEMS mirror; an amount of acceleration at or near the MEMS mirror; an amount of electromagnetic interference (EMI) at or near the MEMS mirror; an amount of pressure at or near the MEMS mirror; a vibration or shock experienced by the MEMS mirror; a current associated with driving the MEMS mirror or maintaining a position condition of the MEMS mirror; an aging effect experienced by the MEMS mirror; an electrical discharge in the MEMS mirror; a detection of a fault associated with the MEMS mirror; or a presence of harmonics in the MEMS mirror.

[0020] Again optionally, the operational information includes information associated with at least one of: a request to modify a range of angular operation of the MEMS mirror; or a request to modify an accuracy requirement associated with the MEMS mirror.

[0021] Optionally, the mirror control parameter comprises at least one of: a phase-locked loop (PLL) control parameter associated with the MEMS mirror; an amplitude control parameter associated with the MEMS mirror; or an actuator voltage level control parameter associated with the MEMS mirror.

[0022] Again optionally, the plurality of pieces of monitoring information is a first plurality of pieces of monitoring information, the state is a first state, and the mirror control parameter is a first mirror control parameter, the method further comprising: obtaining a second plurality of pieces of monitoring information associated with the MEMS mirror; determining a second state of the MEMS mirror based on the second plurality of pieces of monitoring information; and adjusting a second mirror control parameter associated with controlling the MEMS mirror based on the second state, wherein the second mirror control parameter is different from the first mirror control parameter.

[0023] Optionally, the plurality of pieces of monitoring information is a first plurality of pieces of monitoring information and the state is a first state, the method further comprising: obtaining a second plurality of pieces of monitoring information associated with the MEMS mirror; determining a second state of the MEMS mirror based on the second plurality of pieces of monitoring information; and further adjusting the mirror control parameter based on the second state of the MEMS mirror.

[0024] Some embodiments relate to a LiDAR system comprising: a MEMS mirror; and a MEMS driver circuit for obtaining a plurality of pieces of monitoring information associated with the MEMS mirror, comprising: sensor information provided by one or more sensors associated with the MEMS mirror or operational information provided by a controller associated with the LiDAR system; determining a state of the MEMS mirror based on the plurality of pieces of monitoring information; adjusting a mirror control parameter associated with the MEMS mirror based on the state of the MMI; and controlling the MEMS mirror based on the adjusted mirror control parameter. In embodiments, a plurality of pieces of monitoring information comprises at least two pieces of information of different categories (e.g.from sensors measuring different parameters, or from a sensor and a request to modify the operation of the MEMS mirror). For example, a plurality of pieces of monitoring information may include a first piece of information resulting from measurement signals of a first sensor type (e.g., a temperature sensor) and a second piece of information resulting from measurement signals of a second sensor type (e.g., a pressure sensor). As another example, the plurality of pieces of monitoring information may include, for example, a first piece of information resulting from measurement signals of a sensor (e.g., a temperature or pressure sensor) and a second piece of information resulting from an external request (e.g., from a controller) to modify the operation of the MEMS mirror (e.g., a request to modify an accuracy requirement or a field of view). BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a diagram of an example implementation for adjusting a mirror control parameter associated with a MEMS mirror based on a state of the MEMS mirror, as described herein. Fig. 2A and Fig. 2B are diagrams associated with an example LiDAR system in which techniques and / or methods described herein may be implemented. Fig. 3 is a diagram illustrating exemplary components associated with a MEMS driver circuit described herein. Fig. 4 is a diagram illustrating an exemplary implementation of a MEMS driver circuit as described herein. Fig. 5 is a flowchart of an exemplary process for adjusting a mirror control parameter associated with a MEMS mirror based on a state of the MEMS mirror, as described herein. DETAILED DESCRIPTION

[0025] The following detailed description of exemplary implementations refers to the accompanying drawings. The same reference numerals in different drawings may identify the same or similar elements.

[0026] A MEMS mirror may be capable of tilting around one or more axes in conjunction with directing light. In the case of a LiDAR system, for example, light (e.g., emitted by one or more lasers) is directed onto the MEMS mirror, and the MEMS mirror directs the light toward the scene about which information (e.g., a distance measurement, a 3D image, and / or the like) is to be obtained by the LiDAR system. Here, a position (e.g., a tilt angle) of the MEMS mirror can be controlled such that the MEMS mirror oscillates around an axis (e.g., from left to right to left, etc.) while directing light toward the scene (e.g., such that the light scans backward and forward across the scene in a horizontal direction). The light reflected from the scene is received by an array of photodiodes included in the LiDAR system (e.g., via receiving optics). Output signals (e.g.,The information (one or more signals corresponding to the received light) provided by the photodiode array can be used by a system controller of the LiDAR system to determine a distance to the scene (e.g., based on a time elapsed between a time the light was emitted and a time the light is received). This information can be used for distance measurements, 3D imaging, and / or the like.

[0027] During operation of a system comprising a MEMS mirror, a MEMS driver circuit (e.g., a MEMS driver application-specific integrated circuit (ASIC)) actuates the MEMS mirror and also detects the position of the MEMS mirror. During operation, while the MEMS mirror oscillates, the MEMS driver circuit determines and provides the information identifying the position of the MEMS mirror at a given time to a system controller (e.g., information identifying a tilt angle of the MEMS mirror at a given time). Based on this position information, the system controller triggers the one or more light sources to emit light. Thus, the system accuracy (i.e.,The accuracy of the optical sensing application depends not only on the actuation of the MEMS mirror by the MEMS driver circuit, but also on the accuracy of the position information provided by the MEMS driver circuit.

[0028] A given set of environmental conditions (e.g., high temperature, acceleration, mechanical shock, electromagnetic interference (EMI), and / or the like) and / or operating conditions (e.g., changing from a first maximum angle to a second maximum angle) can affect the performance and accuracy of the MEMS mirror actuation and position sensing by the MEMS driver circuit. Typically, the MEMS driver circuit uses static mirror control parameters in conjunction with controlling the MEMS mirror. However, the use of such static mirror control parameters is not well suited to dealing with adverse and / or changing environmental and / or operating conditions because static mirror control parameters do not allow the MEMS driver circuit to adapt to adverse and / or changing conditions.

[0029] Some of the implementations described herein provide adaptive and context-aware MEMS mirror control. Instead of controlling the operation of the MEMS mirror based on one parameter (e.g., temperature), the embodiments described herein provide context-based control, in which multiple parameters (of different categories) are included to determine a condition under which the MEMS mirror is or will be operating, in order to find optimal parameters for operating the MEMS mirror under the particular and / or intended context. The number of parameters may comprise at least two in some embodiments. In some embodiments, more than two (e.g., five or more parameters) may be included for context-based control.Instead of optimizing MEMS mirror operation based on a first parameter and then based on a second parameter, context-based control considers multiple parameters in parallel as a whole (e.g., as a set of input parameters to a functional model for the MEMS mirror). Context-based control may allow the MEMS mirror to be operated where at least one (or even all) of the parameters are not optimized individually, given the trade-offs that must be made to achieve context-level operation of the MEMS mirror. In some implementations, a MEMS driver circuit may adjust a mirror control parameter associated with actuating a MEMS mirror based on a state of the MEMS mirror (e.g., a range of conditions under which the MEMS mirror operates).In some implementations, the state of the MEMS mirror may be determined based on sensor information associated with the MEMS mirror and / or operational information associated with the MEMS mirror. As such, the MEMS driver circuit may utilize adjustable (i.e., dynamic) mirror control parameters in conjunction with controlling the MEMS mirror, allowing adverse and / or changing environmental and operating conditions to be accounted for. Consequently, the accuracy of both actuation and position sensing of the MEMS mirror is improved, thereby improving the accuracy and performance of the overall system. Additional details regarding the aspects described above are provided below.

[0030] Fig. 1 is a diagram of an exemplary implementation for adjusting a mirror control parameter associated with a MEMS mirror based on a state of the MEMS mirror, as described herein. As in Fig. 1, a system (e.g., a LiDAR system) may include a system controller, a MEMS mirror, and a MEMS driver circuit. As shown, the MEMS driver circuit may include one or more sensors (e.g., one or more components for sensing and / or identifying one or more conditions associated with the MEMS mirror), one or more mirror control parameter components (e.g., one or more components associated with applying one or more control parameters associated with actuating the MEMS mirror), and an adjustment component (e.g., one or more components associated with adjusting the one or more mirror control parameters).

[0031] As indicated by reference numerals 105a and 105b, the MEMS driver circuit (e.g., the adjustment component) may receive sensor information and / or operational information (collectively referred to herein as monitoring information) associated with the MEMS mirror. The monitoring information may include a plurality of pieces of information based on which the MEMS driver circuit may determine a state of the MEMS mirror in connection with adjusting a mirror control parameter, as described below.

[0032] In some implementations, the sensor information may include information associated with a condition (e.g., an environmental condition) at or near the MEMS mirror or a condition of the MEMS mirror itself. For example, the sensor information may include information identifying a temperature at or near the MEMS mirror. As another example, the sensor information may include information identifying an amount of acceleration at or near the MEMS mirror. As another example, the sensor information may include information identifying an amount of electromagnetic interference (EMI) at or near the MEMS mirror. As another example, the sensor information may include information identifying an amount of pressure at or near the MEMS mirror.As another example, the sensor information may include information associated with a vibration or shock experienced by the MEMS mirror. As another example, the sensor information may include information related to a current associated with driving the MEMS mirror or obtaining a position characteristic of the MEMS mirror (e.g., whether a ripple is present in the current, an amount of the current, and / or the like). As another example, the sensor information may include information associated with an aging effect experienced by the MEMS mirror (e.g., information indicating that an aging effect has been detected). As another example, the sensor information may include information associated with an electrical discharge in the MEMS mirror (e.g.,Information indicating that an electrical discharge was detected, an amount of the electrical discharge, and / or the like). As another example, the sensor information may include information associated with the detection of a fault associated with the MEMS mirror (e.g., information indicating that a fault was detected, information identifying the fault, and / or the like). As another example, the sensor information may include information indicating the presence of harmonics in the MEMS mirror. The examples of types of sensor information described above are not limiting, and the MEMS driver circuit may, in some cases, receive one or more other types of sensor information.

[0033] In some implementations, the MEMS driver circuit may receive the sensor information from one or more sensors. In some implementations, a given one of these one or more sensors may be integrated into the MEMS driver circuit. Additionally or alternatively, a given one of the one or more sensors may be separate from (i.e., external to) the MEMS driver circuit.

[0034] In some implementations, the MEMS driver circuit may obtain the sensor information based on the sensor information automatically provided to the MEMS driver circuit. For example, the MEMS driver circuit may obtain sensor information from a given sensor if the given sensor is configured to automatically provide sensor information on a periodic basis, based on detecting a condition or event, based on measuring or determining a value that meets a threshold, and / or the like. Additionally or alternatively, the MEMS driver circuit may obtain the sensor information based on requesting the sensor information.

[0035] In some implementations, the operational information may include information associated with modifying a manner in which the MEMS mirror is to operate. For example, the operational information may include information indicating that a range of angular operation of the MEMS mirror is to be modified. As a particular example, the operational information may include information indicating that a range of angular operation of the MEMS mirror is to be changed from a first range of angular operation (e.g., ±10° tilt) to a second range of angular operation (e.g., ±15° tilt). As another example, the operational information may include information indicating that an accuracy requirement associated with the MEMS mirror is to be modified (e.g., relaxed or tightened).As a particular example, the operating information may include information indicating that an accuracy requirement for detecting a zero crossing of the MEMS mirror (e.g., a point at which the MEMS mirror is at 0° tilt) should be relaxed from a first requirement (e.g., ±5 millidegrees) to a second requirement (e.g., ±10 millidegrees). The examples of types of operating information described above are not limiting, and the MEMS driver circuit may, in some cases, receive one or more other types of operating information.

[0036] In some implementations, the MEMS driver circuit may obtain the operating information from one or more other components of the system, such as the system controller. In some implementations, the MEMS driver circuit may obtain the operating information based on the operating information provided to the MEMS driver circuit. For example, the MEMS driver circuit may obtain operating information from the system controller when the system controller provides the operating information (e.g., after the system controller makes a determination that the operation of the MEMS mirror should be modified). As another example, the MEMS driver circuit may obtain the operating information based on requesting the operating information (e.g., from the system controller).

[0037] As represented by reference numeral 110, the MEMS driver circuit (e.g., the matching component) may determine a state of the MEMS mirror based on the monitoring information (i.e., based on the sensor information and / or the operating information). The state of the MEMS mirror describes the particular set of operating conditions of the MEMS mirror at a given time.For example, the state of the MEMS mirror may identify whether the MEMS mirror is operating within an allowable temperature range, whether the MEMS mirror is experiencing an allowable amount of acceleration, whether the MEMS mirror is experiencing a threshold amount of shock and / or vibration, whether the MEMS mirror is operating in the presence of an allowable amount of EMI, an aging effect is being experienced by the MEMS mirror, whether a threshold amount of electrical discharge has been detected by the MEMS mirror, whether a fault associated with the MEMS mirror has been detected, whether a manner in which the MEMS mirror is to operate should be modified, and / or the like. In general, the state of the MEMS mirror describes the overall operating condition of the MEMS mirror, as determined based on any sensor information and operational information obtained from the MEMS driver circuitry.

[0038] In some implementations, the MEMS driver circuit may determine the state of the MEMS mirror based on the monitoring information. For example, the MEMS driver circuit may receive a plurality of pieces of monitoring information (e.g., sensor information provided by one or more sensors and / or operational information provided by the system controller) and may determine the state of the MEMS mirror based on the plurality of pieces of monitoring information.

[0039] As represented by reference numeral 115, the MEMS driver circuit may adjust a mirror control parameter associated with actuating the MEMS mirror based on the state of the MEMS mirror. The mirror control parameter includes a parameter based on which the MEMS driver circuit is to actuate or control the MEMS mirror. The mirror control parameter may include, for example, a phase-locked loop (PLL) control parameter, an amplitude control parameter, an actuator voltage level control parameter, and / or the like. The examples of types of mirror control parameters described above are not limiting, and in some cases, the MEMS driver circuit may adjust one or more other types of mirror control parameters based on which the MEMS driver circuit actuates the MEMS mirror.

[0040] In some implementations, the MEMS driver circuit can adjust the mirror control parameter based on the state of the MEMS mirror. For example, the state of the MEMS mirror may indicate that the MEMS mirror is experiencing shock and / or oscillation. Here, the MEMS driver circuit can adjust the PLL control parameter by increasing the proportional-integral-derivative (PID) gains of the PLL control parameter by a certain amount (e.g., to increase the aggressiveness of the control loop).

[0041] As an additional example, the state of the mirror may indicate that an amount of acceleration at or near the MEMS mirror meets a threshold, and the MEMS driver circuit may adjust the PLL control parameter by increasing the PID gains of the PLL control parameter by a certain amount.

[0042] As another example, the state of the MEMS mirror may indicate that an amount of EMI at or near the MEMS mirror meets a threshold. In such a case, the MEMS driver circuit may adjust the PLL parameter by decreasing a proportional gain associated with the PLL control parameter by a specified amount.

[0043] As yet another example, the state of the MEMS mirror may indicate that a range of the MEMS mirror's angular operation should be expanded (e.g., from ±10° to ±15°). In this case, the MEMS driver circuit can adjust the amplitude control parameter to utilize comparatively higher proportional and incremental gains through the amplitude control parameter.

[0044] As yet another example, the state of the MEMS mirror may indicate that a range of angular operation of the MEMS mirror should be reduced (e.g., from ±15° to ±10°). Here, the MEMS driver circuit can adjust the amplitude control parameter to move from a setpoint of 15° to the 10° setpoint. In some implementations, the control gains of the amplitude control parameter can be increased to move from the 15° setpoint to the 10° setpoint at a comparatively faster rate, or can be decreased to move from the 15° setpoint to the 10° setpoint at a comparatively slower rate.

[0045] As yet another example, the state of the MEMS mirror may indicate that an electrical discharge has been detected by the MEMS mirror. In this case, the MEMS driver circuit can adjust the PLL control parameter and the amplitude control parameter such that these mirror control parameters do not utilize any gain for a specific period of time.

[0046] As another example, the state of the MEMS mirror may indicate that a temperature at or near the MEMS mirror is higher than a threshold. Here, the MEMS driver circuit can adjust one or more mirror control parameters to begin using alternative control circuitry that performs fewer computations and thus reduces power dissipation.

[0047] As an additional example, the condition of the MEMS mirror may indicate that the MEMS mirror has experienced an aging effect. Depending on the nature of the aging effect, the MEMS driver circuitry may adjust filters and / or gains associated with one or more mirror control parameters to compensate for the aging effect.

[0048] As yet another example, the state of the MEMS mirror may indicate that the MEMS mirror has experienced a fault (i.e., that a fault has been detected). Depending on the nature of the detected fault, the MEMS driver circuit may adjust one or more mirror control parameters to compensate for the fault (e.g., to provide degraded functionality despite the fault).

[0049] As yet another example, the state of the MEMS mirror may indicate that an accuracy requirement associated with the MEMS mirror should be modified. Depending on the nature of the modification, the MEMS driver circuit may adjust one or more mirror control parameters to accommodate the modification (e.g., by increasing or decreasing control aggressiveness by adjusting PID gains).

[0050] As another example, the state of the MEMS mirror may indicate that a ripple in the current on the MEMS mirror has been detected. Here, the MEMS driver circuit can adjust the actuator voltage level control parameter to reduce or eliminate the ripple in the current on the MEMS mirror.

[0051] The examples described above are not limiting, and the MEMS driver circuit may adjust one or more mirror control parameters based on the state of the MEMS mirror in additional and / or different ways than those described. Other examples of adjusting mirror control parameters include switching, adjusting low-pass filters associated with one or more mirror control parameters, switching from a first actuator voltage level to a second actuator voltage level, and / or the like.

[0052] As illustrated in the examples above, the MEMS driver circuit may adjust a single mirror control parameter based on one or more conditions described by the state of the MEMS mirror. Alternatively, the MEMS driver circuit may adjust multiple mirror control parameters based on one or more conditions described by the state of the MEMS mirror.

[0053] In some implementations, the MEMS driver circuit may adjust the mirror control parameter based on identifying that an influence counteraction should be performed. For example, the MEMS driver circuit may determine that one or more conditions exist that cause an undesirable influence on the MEMS mirror (e.g., a value that meets a threshold or is outside a permissible range, a detection of an event, and / or the like) and thus that the MEMS driver circuit should counteract such influences. In such a case, the MEMS driver circuit may determine an influence condition based on the state of the MEMS mirror. The influence condition is a condition, described by the state information, that should be prioritized by the MEMS driver circuit when adjusting the one or more mirror control parameters.

[0054] In some implementations, identifying the influence condition may be useful when two or more conditions, identified by the MEMS mirror state, would result in conflicting adjustments of the mirror control parameters. For example, the MEMS mirror state is assumed to indicate that an amount of acceleration at or near the MEMS mirror meets a threshold (e.g., indicating that the PLL control parameter should be adjusted by increasing the PID gains of the PLL control parameter), and that an amount of EMI at or near the MEMS mirror meets a threshold (e.g., indicating that the PLL control parameter should be adjusted by decreasing the PID gains of the PLL control parameter). Here, the MEMS driver circuit can identify either the acceleration condition or the EMI condition as the influence condition and proceed with adjusting the PLL control parameter accordingly.In some implementations, the MEMS driver circuit may identify the influence condition based on information stored or accessible by the MEMS driver circuit (e.g., information identifying a priority level or value associated with different conditions, a model that receives information associated with the state of the MEMS mirror as an input and provides information identifying one or more influence conditions as an output).

[0055] In some implementations, based on identifying the influence condition, the MEMS driver circuit may adjust the mirror control parameter to counteract (e.g., reduce or eliminate) the influence condition. In some implementations, when counteracting the influence condition, the MEMS driver circuit may select the mirror control parameter (e.g., from a plurality of mirror control parameters) based on the influence condition. In other words, the MEMS driver circuit may identify the mirror control parameter that, if adjusted, would counteract any influences on the MEMS mirror caused by the influence. In some implementations, the MEMS driver circuit may determine a value for the mirror control parameter (e.g., a value to which the mirror control parameter should be changed) and adjust the mirror control parameter accordingly.In some implementations, the MEMS driver circuit can adjust the mirror control parameter to obtain a least hazardous situation for the MEMS mirror (e.g., the safest possible operating state given the current state of the MEMS mirror).

[0056] As represented by reference numeral 120, the MEMS driver circuit may actuate the MEMS mirror based on the one or more adjusted mirror control parameters. In other words, the MEMS driver circuit may cause the MEMS mirror to operate based on the adjusted mirror control parameter. For example, the MEMS driver circuit may provide a signal associated with the adjusted mirror control parameter to the MEMS mirror to cause the MEMS mirror to operate based on the adjusted mirror control parameter (e.g., such that the MEMS mirror operates based on an adjusted PLL control parameter, an adjusted amplitude control parameter, an adjusted actuator voltage level control parameter, and / or the like).

[0057] The steps described above may be repeated for further and / or additional adjustment of one or more mirror control parameters. For example, the MEMS driver circuit may receive additional monitoring information associated with the MEMS mirror (e.g., at a later time) and may determine an updated state of the MEMS mirror based on the additional monitoring information. Here, the MEMS driver circuit may further adjust the mirror control parameter (e.g., the same one or more mirror control parameters that were previously adjusted) based on the updated state of the MEMS mirror. Additionally or alternatively, the MEMS driver circuit may adjust one or more other mirror control parameters (e.g., one or more mirror control parameters other than the previously adjusted ones) based on the updated state of the MEMS mirror.

[0058] In this way, the MEMS driver circuit can provide adaptive and context-aware MEMS mirror control through the use of adjustable (i.e., dynamic) mirror control parameters. Adapting the mirror control parameters allows for adverse and / or changing environmental and / or operating conditions to be taken into account, thereby improving the accuracy of MEMS mirror actuation and position detection, thus improving the accuracy and performance of the overall system.

[0059] As shown above, Fig. 1 is provided as an example only. Other examples are possible and may differ from what is stated in relation to Fig. 1 described.

[0060] Fig. 2A and Fig. 2B are diagrams associated with an example LiDAR system 200 in which techniques and / or methods described herein may be implemented. As in Fig. 2A, the LiDAR system 200 may include an emitter path comprising one or more light sources 205, a transmitter optics 210, a MEMS mirror 215 (e.g., a MEMS device comprising a reflective portion, a spring structure, a substrate, and / or the like), and a MEMS driver circuit 220 capable of communicating with a system controller 245.

[0061] In operation, as in Fig. 2A, the one or more light sources 205 (e.g., one or more lasers) each emit light that is incident on the transmitter optics 210. The transmitter optics 210 (e.g., one or more lenses) focuses and / or directs the light onto the MEMS mirror 215. In particular, the light sources 205 and the transmitter optics 210 can be designed and arranged such that the light emitted by each light source 205 is incident on the MEMS mirror 215 at a different angle (e.g., different vertical angles are Fig. 2A). As a result, and as shown in Fig. 2A, the light from each light source 205 is directed by the MEMS mirror 215 such that the light from each light source 205 is incident on the scene 225 in a different section of the scene 225. In Fig. 2A, for example, light from each of the four light sources 205 is incident on the scene 225 (in a vertical line) at a different vertical portion of the scene 225. In operation, the MEMS mirror 215 may oscillate about an axis (e.g., such that the light scans backward and forward across the scene 225). As described herein, the MEMS mirror 215 is actuated and controlled by the MEMS driver circuit 220, which is capable of communicating with the system controller 245 (e.g., a controller configured to control the operation of the LiDAR system 200).

[0062] As in Fig. 2A, the scenery 225 reflects the light received on a receiver path of the LiDAR system 200. As shown, the receiver path may include the receiver optics 230, a photodiode array 235, and a receiver circuit 240 capable of communicating with the system controller 245. In operation, the light reflected from the scenery 225 is received via the receiver optics 230 (e.g., one or more lenses) at the photodiode array 235 (e.g., a one-dimensional array of photodiodes or a two-dimensional array of photodiodes). The photodiode array 235 then generates and provides one or more signals (e.g., to the system controller 245) based on which distance measurement, 3D imaging, and / or the like may be performed.

[0063] Another exemplary diagram of the LiDAR system 200 is shown in Fig. 2B. As in Fig. 2B, and as described herein, the MEMS driver circuit 220 may be configured to actuate the MEMS mirror 215 (e.g., based on providing actuation signals to the MEMS mirror 215). As further shown, the MEMS driver circuit 220 may be configured to sense a position of the MEMS mirror 215 (e.g., based on receiving current sense signals from the MEMS mirror 215). As further shown, the system controller 245 may be capable of triggering, configuring, and / or otherwise controlling light sources 205. As described above, the accuracy of the position information provided by the MEMS driver circuit 220 is important to ensure accurate triggering and / or configuration of the light sources 205.

[0064] The number and arrangement of the Fig. 2A and Fig. 2B are provided as examples. In practice, there may be additional components, fewer components, different components, or differently arranged components than those shown in Fig. 2A and Fig. 2B. Furthermore, two or more components shown in Fig. 2A or Fig. 2B, be implemented within a single component, or a single component that is implemented in Fig. 2A or Fig. 2B may be implemented as multiple distributed components. Additionally or alternatively, a set of components (e.g., one or more components) included in Fig. 2A or Fig. 2B, perform one or more functions described as being performed by a different set of components.

[0065] Fig. 3 is a diagram illustrating example components associated with MEMS driver circuit 220. As shown, MEMS driver circuit 220 may include one or more mirror control parameter (MCP) components 305 (e.g., mirror control parameter components 305-1 through 305-X (X ≥ 1)), an adjustment component 310, and one or more sensors 315 (e.g., sensors 315-1 through 315-Y (Y ≥ 1)). As further shown, MEMS driver circuit 220 (e.g., adjustment component 310) may be capable of communicating with one or more operating components 320 (e.g., operating components 320-1 through 320-Z (Z ≥ 1)).

[0066] The mirror control parameter component 305 includes a component associated with managing and applying one or more control parameters associated with actuating the MEMS mirror 215. For example, the mirror control parameter component 305 may include a component (e.g., one or more circuits) capable of managing and applying a PLL control parameter, a component capable of managing and applying an amplitude control parameter, a component capable of managing and applying an actuator voltage level control parameter, and / or the like. As shown in Fig. 3, the mirror control parameter component 305 may be capable of communicating with the adaptation component 310 (e.g., such that the adaptation component 310 may adapt the one or more mirror control parameters to be managed and applied by the mirror control parameter component 305).

[0067] The adjustment component 310 includes a component capable of adjusting the one or more mirror control parameters to be managed and applied by the mirror control parameter component 305, as described herein. In some implementations, the adjustment component 310 may include a processing device (e.g., a microprocessor, a microcontroller, and / or the like) capable of receiving monitoring information, determining a state of the MEMS mirror 215 based on the monitoring information, and adjusting one or more mirror control parameters based on the state of the MEMS mirror 215, as described herein. As described in Fig. 3, the adaptation component 310 may be capable of communicating with the mirror control parameter component 305. In some implementations, as shown in Fig. 3, the adaptation component may be capable of receiving information (e.g., sensor information) from sensor 315 and / or receiving information (e.g., operational information) from the operational component 320.

[0068] Sensor 315 includes a component capable of sensing and / or identifying one or more conditions associated with the MEMS level and providing sensor information to the matching component 310, as described herein. For example, the sensor 315 may include a temperature sensor, an acceleration sensor, an EMI monitor, an aging effect monitor, an electrical discharge monitor, a fault monitor, a harmonic monitor, and / or another type of sensing and / or monitoring device. In some implementations, the sensor 315 may be integrated into the MEMS driver circuit 220 and / or external to the MEMS driver circuit 220.

[0069] The operational component 320 includes a component capable of providing operational information to the adjustment component 310, as described herein. For example, the operational component 320 may be a component capable of providing an indication that a range of angular operation is to be modified, a component capable of providing information associated with changing an accuracy requirement associated with the MEMS mirror 215, and / or the like. In some implementations, the operational component 320 may be included in the system controller 245.

[0070] The number and arrangement of the Fig. 3 are provided as an example. In practice, there may be additional components, fewer components, different components, or differently arranged components than those shown in Fig. 3. Furthermore, two or more components shown in Fig. 3, be implemented within a single component, or a single component that is implemented in Fig. 3 may be implemented as multiple distributed components. Additionally or alternatively, a set of components (e.g., one or more components) included in Fig. 3, perform one or more functions described as being performed by another set of components.

[0071] Fig. 4 is a diagram illustrating an example associated with a possible implementation of the MEMS driver circuit 220. As in Fig. 4, the MEMS driver circuit 220 may include a mirror PLL component 305-1 associated with managing and applying a PLL control parameter, an amplitude control parameter 305-2 associated with managing and applying an amplitude control parameter, and an actuator voltage level control parameter 305-3 associated with managing and applying an actuator voltage level control parameter.

[0072] As further shown, the MEMS driver circuit 220 may include a temperature sensor 315-1, an acceleration sensor 315-2, an EMI monitor 315-3, an aging effect monitor 315-4, an electrical discharge monitor 315-5, a fault monitor 315-6, and a harmonic monitor 315-7. As described above, these sensors 315 may provide sensor information to the matching component 310.

[0073] As further shown, the MEMS driver circuit 220 may be configured to communicate with a maximum angle change component 320-1 (e.g., an operating component 320 configured to provide an indication that a range of angular operation is to be modified) and an accuracy change component 320-2 (e.g., an operating component 320 configured to provide information associated with changing an accuracy requirement associated with the MEMS mirror 215). As described above, these operating components 320 may provide operating information to the adjustment component 310.

[0074] The number and arrangement of the Fig. 4 are provided as an example. In practice, there may be additional components, fewer components, different components, or differently arranged components than those shown in Fig. 4. Furthermore, two or more components shown in Fig. 4, be implemented within a single component, or a single component that is implemented in Fig. 4 may be implemented as multiple distributed components. Additionally or alternatively, a set of components (e.g., one or more components) included in Fig. 4, perform one or more functions described as being performed by a different set of components.

[0075] Fig. 5 is a flowchart of an exemplary process for adjusting a mirror control parameter associated with a MEMS mirror based on a state of the MEMS mirror, as described herein. In some implementations, one or more process blocks of Fig. 5 by the MEMS driver circuit 220. In some implementations, one or more process blocks of Fig. 5 may be performed by another device or group of devices separate from or including the MEMS driver circuit 220, such as MEMS mirror 215 or system controller 245.

[0076] As in Fig. 5, process 500 may include obtaining a plurality of items of monitoring information associated with a MEMS mirror (block 510). For example, MEMS driver circuitry 220 may obtain a plurality of items of monitoring information associated with MEMS mirror 215, as described above. In some implementations, MEMS driver circuitry 220 may be configured to control the operation of MEMS mirror 215, as described above. In some implementations, the plurality of items of monitoring information may include sensor information provided by one or more sensors associated with MEMS mirror 215 or operational information provided by system controller 245, as described above.

[0077] As in Fig. 5, process 500 may include determining, based on the plurality of pieces of monitoring information, a state of the MEMS mirror (block 520). For example, MEMS driver circuit 220 may determine a state of MEMS mirror 215 based on the plurality of pieces of monitoring information, as described above.

[0078] As in Fig. 5, process 500 may include adjusting, based on the state of the MEMS mirror, a mirror control parameter on which the MEMS driver circuitry should actuate the MEMS mirror (block 530). For example, based on the state of the MEMS mirror, the MEMS driver circuitry 220 may adjust a mirror control parameter on which the MEMS driver circuitry 220 should actuate the MEMS mirror 215, as described above.

[0079] The process 500 may include additional implementations, such as any single implementation or any combination of implementations described below and / or in conjunction with one or more other processes described elsewhere herein.

[0080] In some implementations, the MEMS driver circuit 220 may cause the MEMS mirror 215 to operate based on the adjusted mirror control parameter.

[0081] In some implementations, the MEMS driver circuit 220 and the MEMS mirror 215 may be included in a LiDAR system in which the MEMS driver circuit 220 is to control a tilt of the MEMS mirror 215 in conjunction with directing light associated with the LiDAR system.

[0082] In some implementations, the sensor information may include information associated with at least one of: a temperature at or near the MEMS mirror 215; an amount of acceleration at or near the MEMS mirror 215; an amount of electromagnetic interference (EMI) at or near the MEMS mirror 215; an amount of pressure at or near the MEMS mirror 215; a vibration or shock experienced by the MEMS mirror 215; a current associated with driving the MEMS mirror 215 or maintaining a position condition of the MEMS mirror 215; an aging effect experienced by the MEMS mirror 215; an electrical discharge in the MEMS mirror 215; a detection of a fault associated with the MEMS mirror 215; or a presence of harmonics in the MEMS mirror 215.

[0083] In some implementations, the operational information may include information associated with at least one of: a request to modify a range of angular operation of the MEMS mirror 215; a request to modify an accuracy requirement associated with the MEMS mirror 215; a request to modify a resolution requirement associated with a lidar system using the MEMS mirror 215.

[0084] In some implementations, the mirror control parameter may include at least one of: a phase-locked loop (PLL) control parameter associated with the MEMS mirror 215; an amplitude control parameter associated with the MEMS mirror 215; or an actuator voltage level control parameter associated with the MEMS mirror 215.

[0085] In some implementations, the plurality of pieces of monitoring information is a first plurality of pieces of monitoring information, the state is a first state, and the mirror control parameter is a first mirror control parameter. Here, the MEMS driver circuit 220 may receive a second plurality of pieces of monitoring information associated with the MEMS mirror 215; determine a second state of the MEMS mirror 215 based on the second plurality of pieces of monitoring information; and adjust a second mirror control parameter associated with controlling the MEMS mirror 215 based on the second state of the MEMS mirror 215, wherein the second mirror control parameter is different from the first mirror control parameter.In some implementations, the second plurality of items of monitoring information is received at a different time than the first plurality of items of monitoring information.

[0086] In some implementations, the plurality of pieces of monitoring information is a first plurality of pieces of monitoring information, and the state is a first state. Here, the MEMS driver circuit 220 may receive a second plurality of pieces of monitoring information associated with the MEMS mirror 215; determine a second state of the MEMS mirror 215 based on the second plurality of pieces of monitoring information; and further adjust the mirror control parameter based on the second state. In some implementations, the second plurality of pieces of monitoring information are received at a different time than the first plurality of pieces of monitoring information.

[0087] In some implementations, the MEMS driver circuit 220 may identify that influence counteracting should be performed based on the state of the MEMS mirror 215; and determine an influence condition based on the state of the MEMS mirror 215. Here, the MEMS driver circuit 220, when adjusting the mirror control parameter, may counteract influences on the MEMS mirror 215 based on the determined influence condition. In some implementations, the MEMS driver circuit 220, when counteracting the influences on the MEMS mirror 215, may select the mirror control parameter from a plurality of mirror control parameters; and determine a value for the mirror control parameter to obtain a least hazardous situation for the MEMS mirror 215.

[0088] Although Fig. 5 shows exemplary blocks of the process 500, in some implementations the process 500 may include additional blocks, fewer blocks, different blocks, or differently arranged blocks than those shown in Fig. 5. Additionally or alternatively, two or more of the blocks of process 500 may be executed in parallel.

[0089] The above disclosure provides illustration and description, but is not intended to be exhaustive or to limit implementations to the particular form disclosed. Modifications and variations are possible in light of the above disclosure and may be learned from practice of the implementations.

[0090] Although certain combinations of features are recited in the claims and / or disclosed in the description, these combinations are not intended to limit the disclosure of possible implementations. Indeed, many of these features may be combined in ways not specifically recited in the claims and / or disclosed in the description. Although each dependent claim listed below may directly depend on only one claim, the disclosure of possible implementations encompasses each dependent claim in combination with every other claim in the claim set.

[0091] No element, step, or instruction used herein should be construed as critical or essential unless explicitly described as such. Further, as used herein, the articles "a," "an," and "a" are intended to include one or more elements and may be used synonymously with "one or more." Further, as used herein, the term "set" is intended to include one or more elements (e.g., related elements, unrelated elements, a combination of related and unrelated elements, etc.) and may be used synonymously with "one or more." In cases where only one element is intended, the term "a" or similar language is used. Further, as used herein, the terms "comprises," "have," "having," or the like are intended to be open-ended terms. Furthermore, the phrase "based on" is intended to mean "based, at least in part, on" unless expressly stated otherwise.

Claims

[1] A system comprising: a microelectromechanical systems (MEMS) mirror (215); and a MEMS driver circuit (220) for: Obtaining a plurality of items of monitoring information associated with the MEMS mirror (215), wherein the plurality of items of monitoring information comprises at least one of: Sensor information received from one or more sensors (315) associated with the MEMS mirror (215), or Operational information received from a controller (245) associated with the system (200); Determining a state of the MEMS mirror (215) based on the plurality of items of monitoring information; and Adjusting a mirror control parameter associated with controlling the MEMS mirror (215) based on the state of the MEMS mirror (215), wherein the sensor information comprises information associated with at least one of: a temperature at or near the MEMS mirror (215) (315-1); an amount of acceleration at or near the MEMS mirror (215) (315-2); an amount of electromagnetic interference (EMI) at or near the MEMS mirror (215) (315-3); an amount of pressure at or near the MEMS mirror (215); a vibration or shock experienced by the MEMS mirror (215); a current associated with driving the MEMS mirror (215) or maintaining a position condition of the MEMS mirror (215); an aging effect experienced by the MEMS mirror (215) (315-4); an electrical discharge in the MEMS mirror (215) (315-5); a detection of a fault associated with the MEMS mirror (215) (315-6); or a presence of harmonics in the MEMS mirror (215) (315-7). [2] The system of claim 1, wherein the MEMS driver circuit (220) is further configured to: Causing the MEMS mirror (215) to operate based on the adjusted mirror control parameter. [3] The system of any preceding claim, wherein the system is a LiDAR system (200) in which the MEMS driver circuit (220) is to control a tilt of the MEMS mirror (215) in conjunction with directing light associated with the LiDAR system (200). [4] The system according to any one of the preceding claims, wherein the operational information comprises information associated with at least one of: a request to modify a range of angular operation of the MEMS mirror (215); or a request to modify an accuracy requirement associated with the MEMS mirror (215). [5] The system according to any one of the preceding claims, wherein the mirror control parameter comprises at least one of: a phase-locked loop (PLL) control parameter associated with the MEMS mirror (215); an amplitude control parameter associated with the MEMS mirror (215); or an actuator voltage level control parameter associated with the MEMS mirror (215). [6] The system according to any one of the preceding claims, wherein the plurality of items of monitoring information is a first plurality of items of monitoring information, the state is a first state, and the mirror control parameter is a first mirror control parameter, the MEMS driver circuit (220) being further configured to: Obtaining a second plurality of items of monitoring information associated with the MEMS mirror (215), Determining a second state of the MEMS mirror (215) based on the second plurality of items of monitoring information; and Adjusting a second mirror control parameter based on the second state of the MEMS mirror (215), wherein the second mirror control parameter differs from the first mirror control parameter. [7] The system of claim 6, wherein the second plurality of items of monitoring information are obtained at a different time than the first plurality of items of monitoring information. [8] The system according to any one of the preceding claims, wherein the plurality of items of monitoring information is a first plurality of items of monitoring information and the state is a first state, wherein the MEMS driver circuit (220) is further configured to: Obtaining a second plurality of items of monitoring information associated with the MEMS mirror (215), Determining a second state of the MEMS mirror (215) based on the second plurality of items of monitoring information; and further adjusting the mirror control parameter based on the second state of the MEMS mirror (215). [9] The system according to any one of the preceding claims, wherein the MEMS driver circuit (220) is further configured to: Identifying, based on the state of the MEMS mirror (215), that an influence counteracting action is to be performed; and Determining an influence condition based on the state of the MEMS mirror (215); and wherein, when adjusting the mirror control parameter, the MEMS driver circuit (220) is configured to: Counteracting influences on the MEMS mirror (215) based on the determined influence condition. [10] The system according to claim 9, wherein, in counteracting the influences on the MEMS mirror (215), the MEMS driver circuit (220) is configured to: Selecting the mirror control parameter from a plurality of mirror control parameters based on the influence condition; and Determining a value for the mirror control parameter to obtain a least hazardous situation for the MEMS mirror (215). [11] A method comprising: Obtained (510), by a microelectromechanical systems (MEMS) driver circuit (220), a plurality of elements of monitoring information associated with a MEMS mirror (215), wherein the MEMS driver circuit (220) is intended to control the operation of the MEMS mirror (215), and wherein the plurality of elements of monitoring information comprises: Sensor information provided by one or more sensors (315) associated with the MEMS mirror (215), or Operational information provided by a controller (245) associated with a system (200); Determining (520), by the MEMS driver circuit (220) and based on the plurality of items of monitoring information, a state of the MEMS mirror (215); and Adjusting (530), by the MEMS driver circuit (220) and based on the state of the MEMS mirror (215), a mirror control parameter on the basis of which the MEMS driver circuit (220) is to actuate the MEMS mirror (215), wherein the sensor information comprises information associated with at least one of: a temperature at or near the MEMS mirror (215) (315-1); an amount of acceleration at or near the MEMS mirror (215) (315-2); an amount of electromagnetic interference (EMI) at or near the MEMS mirror (215) (315-3); an amount of pressure at or near the MEMS mirror (215); a vibration or shock experienced by the MEMS mirror (215); a current associated with driving the MEMS mirror (215) or maintaining a position condition of the MEMS mirror (215); an aging effect experienced by the MEMS mirror (215) (315-4); an electrical discharge in the MEMS mirror (215) (315-5); a detection of a fault associated with the MEMS mirror (215) (315-6); or a presence of harmonics in the MEMS mirror (215) (315-7). [12] The method according to claim 11, further comprising: Actuating the MEMS mirror (215) based on the adjusted mirror control parameter. [13] The method of claim 11 or 12, wherein the MEMS driver circuit (220) and the MEMS mirror (215) are included in a LiDAR system (200). [14] The method according to any one of claims 11 to 13, wherein the sensor information comprises information associated with at least one of: a temperature at or near the MEMS mirror (215); an amount of acceleration at or near the MEMS mirror (215); an amount of electromagnetic interference (EMI) at or near the MEMS mirror (215); an amount of pressure at or near the MEMS mirror (215); a vibration or shock experienced by the MEMS mirror (215); a current associated with driving the MEMS mirror (215) or maintaining a position condition of the MEMS mirror (215); an aging effect experienced by the MEMS mirror (215); an electrical discharge in the MEMS mirror (215); a detection of a fault associated with the MEMS mirror (215); or a presence of harmonics in the MEMS mirror (215). [15] The method according to any one of claims 11 to 14, wherein the operational information comprises information associated with at least one of: a request to modify a range of angular operation of the MEMS mirror (215); or a request to modify an accuracy requirement associated with the MEMS mirror (215). [16] The method according to any one of claims 11 to 15, wherein the mirror control parameter comprises at least one of: a phase-locked loop (PLL) control parameter associated with the MEMS mirror (215); an amplitude control parameter associated with the MEMS mirror (215); or an actuator voltage level control parameter associated with the MEMS mirror (215). [17] The method according to any one of claims 11 to 16, wherein the plurality of items of monitoring information is a first plurality of items of monitoring information, the state is a first state, and the mirror control parameter is a first mirror control parameter, the method further comprising: Obtaining a second plurality of items of monitoring information associated with the MEMS mirror (215); Determining a second state of the MEMS mirror (215) based on the second plurality of monitoring information items; and adjusting a second mirror control parameter associated with controlling the MEMS mirror (215) based on the second state, wherein the second mirror control parameter differs from the first mirror control parameter. [18] The method according to any one of claims 11 to 17, wherein the plurality of items of monitoring information is a first plurality of items of monitoring information and the state is a first state, the method further comprising: Obtaining a second plurality of items of monitoring information associated with the MEMS mirror (215); Determining a second state of the MEMS mirror (215) based on the second plurality of items of monitoring information; and further adjusting the mirror control parameter based on the second state of the MEMS mirror (215). [19] A LiDAR system (200) comprising: a microelectromechanical mirror (215); and a MEMS driver circuit (220) for: Obtaining a plurality of items of monitoring information associated with the MEMS mirror (215), comprising: Sensor information provided by one or more sensors (315) associated with the MEMS mirror (215), or Operational information provided by a controller (245) associated with the LiDAR system (200); Determining a state of the MEMS mirror (215) based on the plurality of items of monitoring information; adjusting a mirror control parameter associated with the MEMS mirror (215) based on the state of the MEMS mirror (215); and Controlling the MEMS mirror (215) based on the adjusted mirror control parameter, wherein the sensor information comprises information associated with at least one of: a temperature at or near the MEMS mirror (215); an amount of acceleration at or near the MEMS mirror (215); an amount of electromagnetic interference (EMI) at or near the MEMS mirror (215); an amount of pressure at or near the MEMS mirror (215); a vibration or shock experienced by the MEMS mirror (215); a current associated with driving the MEMS mirror (215) or maintaining a position condition of the MEMS mirror (215); an aging effect experienced by the MEMS mirror (215); an electrical discharge in the MEMS mirror (215); a detection of a fault associated with the MEMS mirror (215); or a presence of harmonics in the MEMS mirror (215).

Citation Information

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