Method, control device and vacuum arrangement

Abstract

Procedure (100), comprising: • Changing (101) a drive force generated by a fluid-mechanical actuator, by means of which a chamber valve (206) of a vacuum chamber (804) is kept closed when the vacuum chamber (804) is evacuated; and • Ventilation (103) of the vacuum chamber (804) after changing the driving force; • Transporting (105) a substrate through the chamber valve (206) when the chamber valve (206) is opened by means of the actuator; • wherein the driving force is changed by means of a rapid vent (404) which connects a pressure chamber of the actuator to the Earth's atmosphere in a fluid-conducting manner.

Description

[0001] Various embodiments relate to a method, a control device and a vacuum arrangement.

[0002] In general, a processing system can be used to process a substrate, such as a glass sheet, a wafer, or the like, under vacuum. The substrate can be processed, for example, in a chamber of the processing system, within which the necessary processing conditions are provided. To this end, it can be helpful to seal the chamber and / or other chambers of the processing system from each other or from the environment.

[0003] Different chambers of a processing plant can be separated from each other by so-called chamber walls, for example, in horizontal continuous coating plants (in-line plants) by means of vertical chamber walls. Each chamber wall can be penetrated by a substrate transfer opening (also called a substrate transfer gap) such that a substrate can be transported through the opening, e.g., from one chamber of a processing plant to another. Similarly, the processing plant can have a substrate transfer opening on the inlet / outlet side, allowing a substrate to be introduced into and / or removed from the processing plant.

[0004] To seal different chambers of the processing plant from each other, or to seal the processing plant from the outside, a substrate transfer opening of the respective chamber can be closed and / or sealed by means of a valve flap. This makes it possible to transfer the substrate between different areas of different pressures. For example, this can be achieved by cyclically venting and / or evacuating a so-called airlock chamber, which is the outlet / inlet chamber of the plant. Reference is also made to US 4,313,815 A, DE 10 2014 008172 A1, US 2006 / 0 188 658 A1, EP 1 712 822 A1, and US 5 837 059 A.

[0005] The resulting problem is solved by the object according to the attached claims.

[0006] According to various embodiments, it has been found that certain conditions during the ventilation of an airlock chamber can cause safety valves to be triggered or other components (for example, the chamber lid) to move, which are not designed to allow large quantities of gas to escape due to overpressure. The safety valve is normally designed to prevent overpressure from building up in the airlock chamber by opening and thereby releasing gas from the chamber.

[0007] Such overpressure can arise, for example, from temperature differences, such as during the quenching of glass panes in an airlock. It has been recognized that the resulting gas volumes can be so large that such a safety valve is at increased risk of damage. To illustrate, the safety valve can be triggered with every ventilation cycle of the airlock, causing it to trigger rapidly until the end of its service life. In other words, it has been recognized that such a safety valve can be damaged prematurely.

[0008] Furthermore, it was recognized in this context that the gas leaving the lock chamber through the safety valve is no longer available for the subsequent process and therefore must be replaced. This also increases the operating costs of the plant, even if the safety valve withstands the increased load.

[0009] According to various embodiments, a method, a control device, and a vacuum arrangement are provided which reduce operating costs, for example, by reducing the load on the safety valve, inhibiting unwanted movement of the chamber lid, and decreasing the amount of gas to be replaced in the process. For example, a fast-acting flap valve is provided which can be moved into a neutral position, allowing it to open freely to allow the gas atmosphere of the last vacuum chamber to flow out towards a downstream cooling tunnel.

[0010] The method, control device, and vacuum arrangement provided according to various embodiments effectively relieve the pressure on the safety valve (also known as a poppet valve), thereby saving costs (e.g., by increasing its operating time). Furthermore, process interruptions are minimized and / or fewer spare parts are required, thus reducing further costs. For example, uninterrupted operation of the vacuum arrangement can be achieved, saving time throughout the entire cycle.

[0011] It shows Fig. 1. A method according to various embodiments in a schematic flowchart; and Fig. 2, Fig. 3A, Fig. 3B and Fig. 4 each a vacuum arrangement according to different embodiments in a schematic side view or cross-sectional view.

[0012] The following detailed description refers to the accompanying drawings, which form part thereof and illustrate specific embodiments in which the invention can be implemented. In this context, directional terminology such as "top," "bottom," "front," "back," "anterior," "rear," etc., is used with reference to the orientation of the described figure(s). Since components of embodiments can be positioned in a number of different orientations, the directional terminology serves only for illustration and is in no way limiting. It is understood that other embodiments may be used and structural or logical modifications may be made without deviating from the scope of protection of the present invention.It is understood that the features of the various exemplary embodiments described herein can be combined with one another, unless specifically stated otherwise. The following detailed description is therefore not to be interpreted in a limiting sense, and the scope of protection of the present invention is defined by the appended claims.

[0013] Within the scope of this description, the terms "connected," "attached," and "coupled" are used to describe both direct and indirect connections (e.g., fluid-conducting connections), direct or indirect connections, and direct or indirect couplings. In the figures, identical or similar elements are designated with identical reference numerals where appropriate.

[0014] Depending on the specific embodiment, the term "coupled" or "coupling" can be understood as a connection and / or interaction (e.g., mechanical, hydrostatic, thermal, and / or electrical), whether direct or indirect. Several elements can be coupled along an interaction chain, for example, along which the interaction (e.g., a fluid) can be transmitted. For instance, two coupled elements can exchange an interaction, such as a mechanical, hydrostatic, thermal, and / or electrical interaction. Depending on the specific embodiment, "coupled" can also be understood as a mechanical (e.g., physical) coupling, for example, by means of direct physical contact. A coupling can be configured to transmit a mechanical interaction (e.g., force, torque, etc.).

[0015] A fluid coupling (e.g., a connection) can be configured to transfer and / or exchange fluid through the coupling. Optionally, the fluid coupling can be configured to inhibit fluid transfer (e.g., block or prevent it) in a closed state and to allow fluid transfer in an open state. The opening and closing of the fluid coupling can be reversible, for example, by means of an interposed valve. A valve, for instance, can provide both closed and open states and / or switch between them.

[0016] More generally, a valve allows at least two components of a vacuum system (also called vacuum components), between which the valve is installed, to be connected by fluid, enabling them to exchange fluid (e.g., containing a gas). Likewise, the valve can also allow the fluid connection to be broken, thus blocking the exchange of fluid. Establishing and / or breaking the connection can be achieved by actuating the valve or switching it (e.g., selectively). The connection can be established when the valve is in the open state and broken when it is in the closed state. Switching between the closed and open states can be performed (also called an actuation process), e.g., reversibly, discretely, or continuously (e.g., by assuming an intermediate state).

[0017] The term "control device" can be understood as any type of logic-implementing entity that may, for example, have circuitry and / or a processor capable of executing software stored in a memory medium, firmware, or a combination thereof, and issuing instructions based on that software. The control device may, for example, be configured by means of code segments (e.g., software) to control the operation of an entity (e.g., its operating point), such as a device or an operational function. The term "processor" can be understood as any type of entity that allows the processing of data or signals. The data or signals may, for example, be processed according to at least one (i.e., one or more than one) specific function performed by the processor.

[0018] Control can be understood as the intentional influencing of an entity (e.g., a device or a process). This involves changing the entity's current state (also called the actual state) according to a specification (also called the target state). Rules can be understood as a form of control, but with the additional benefit of counteracting changes in the entity's state caused by disturbances.

[0019] A processor may be an analog circuit, a digital circuit, a mixed-signal circuit, a logic circuit, a microprocessor, a central processing unit (CPU), a graphics processing unit (GPU), a digital signal processor (DSP), a programmable logic gate array (FPGA), an integrated circuit, or any combination thereof. Any other type of implementation of the respective functions described in more detail below may also be understood as a processor or logic circuit. It is understood that one or more of the procedure steps described in detail herein may be performed (e.g., implemented) by a processor through one or more specific functions executed by the processor.Similarly, the process steps can be represented by code segments, which are set up when executed by the processor to carry out the process steps.

[0020] The valve can be controlled, for example, by means of an electrical control signal and / or a fluid-mechanical control signal (e.g., a pressure change), which can be fed to a control input of the valve. The fluid-mechanical control signal can be applied using electrically controlled valves, i.e., valves that can be controlled by electrical signals. These electrically operated valves can, for example, be controlled by a control device that supplies the corresponding electrical control signal to each valve. In contrast to a purely pneumatic control mechanism, such an electropneumatic control mechanism allows for significantly more complex functions, particularly through the use of electronic circuits such as a programmable logic controller (PLC), a shorter response time, and / or a smaller form factor.

[0021] According to various embodiments, a chamber housing, e.g. a vacuum chamber provided therein, can be configured such that a pressure in a range of approximately 10 mbar to approximately 1 mbar (in other words, rough vacuum) can be provided therein, and / or a pressure in a range of approximately 1 mbar to approximately 10 -3 mbar (in other words, fine vacuum), and / or a pressure in the range of approximately 10 -3 mbar to approximately 10 -7 mbar (in other words, high vacuum) and / or a pressure lower than high vacuum, e.g., lower than approximately 10 -7 mbar.

[0022] According to various embodiments, a chamber housing can be configured to provide a vacuum or at least a negative pressure within the chamber housing. To illustrate, the chamber housing (e.g., its chamber walls) can be designed to be so stable that it can be evacuated (pumped out), allowing external pressure (e.g., the prevailing atmospheric pressure or a pressure several orders of magnitude greater than the pressure inside the chamber housing) to act on the chamber housing (or its chamber walls) when evacuated, without irreversibly deforming and / or damaging the chamber housing.

[0023] The chamber housing can be a component (a base body) of a vacuum assembly and may contain one or more vacuum chambers, e.g., one or more airlock chambers, one or more buffer chambers, one or more transfer chambers, one or more process chambers (e.g., a coating chamber), and / or one or more gas separation chambers. The specific function or operating mode of the vacuum chamber can be defined by the chamber lid used with the chamber housing in conjunction with the internal components arranged within the chamber housing (e.g., gas baffles, valves, packing material, transport device, etc.). For example, the chamber housing can be used as an airlock chamber with an airlock lid, as a buffer or transfer chamber with a buffer chamber lid, and as a coating (or process) chamber with yet another type of lid.

[0024] For processing one or more substrates in a processing chamber of the processing system, the processing chamber of the vacuum arrangement can include a processing source. A processing source can be, for example, a coating source (a magnetron, a tubular magnetron or a double-tubular magnetron, a planar magnetron or double planar magnetron), an exposure device (a light source, a laser, a flash lamp or a flash lamp arrangement), a heat source (e.g., a heater), an etching device (e.g., an etching gas source or etching plasma source), a radiation source (e.g., an electron beam source or ion beam source), or similar.

[0025] According to various embodiments, the substrate transfer opening of the vacuum chamber (by means of a flap valve) is used to discharge a pressure wave from the chamber. The gas thus released continues to surround the substrate and moves with the substrate in the transport direction, which reduces gas consumption.

[0026] To illustrate, the valve flap (e.g., pneumatically, electrically, and / or mechanically operated) for discharging the pressure wave is not held in place but released. Once the substrate has arrived in the airlock chamber and the upstream chamber valves are closed (i.e., there is a vacuum in the chamber), the last chamber valve can be released because it continues to be held "closed" by the vacuum in the chamber and the surrounding atmosphere. The released valve flap can move freely, i.e., swing in or against its opening direction. If the subsequent ventilation pulse occurs, the pressure wave can then open the valve flap.

[0027] Optionally, the valve flap can be mounted using a holding mechanism to prevent it from closing on its own (i.e., solely due to gravity). The holding mechanism can keep the valve flap in its closing position. For this purpose, the holding mechanism can, for example, incorporate a locking mechanism or a spring that absorbs the weight of the valve flap. Since this process occurs very quickly, it can facilitate and accelerate the opening of the valve flap in the next step. The gas that escapes through the substrate transfer port can then exit the vacuum chamber along with the substrate.

[0028] In various embodiments, a neutral center position can be provided by means of a 5 / 3-way valve, which releases the valve flap. Optionally, quick-release vents can be used to achieve faster release of the opening direction. Optionally, self-regulating damping of the pneumatic actuator cylinder movement can be used to protect the mechanism.

[0029] According to various embodiments, the aforementioned functionalities can be optimized by adjusting the geometry of the valve flap (e.g., effective area and / or weight) in order to save even more gas and / or achieve even faster opening / closing of the valve flap.

[0030] Fig. Figure 1 illustrates a method 100 according to various embodiments in a schematic flowchart. The method comprises, in 101, changing (e.g., decreasing) a (e.g., mechanical) driving force (e.g., a torque) by means of which a chamber valve of a vacuum chamber is kept closed when the vacuum chamber is evacuated; in 103, venting the vacuum chamber after decreasing the driving force; and in 105, transporting a substrate through the chamber valve or its substrate transfer opening when the chamber valve is open.

[0031] The chamber valve can, for example, have a valve flap (then also referred to as a flap valve), which will be discussed below. The description can also apply analogously to other types of chamber valves.

[0032] By means of the driving force, a valve flap of the chamber valve can be pressed against a sealing surface that surrounds the substrate transfer opening.

[0033] For example, the driving force can be generated by means of a drive device. Changing the driving force can be achieved by switching the drive device between several operating modes, as will be described in more detail later.

[0034] The actuator can be coupled to the chamber valve. The actuator can, for example, include or be formed from a fluid-mechanical (e.g., pneumatic and / or hydraulic) actuator. Alternatively or additionally, the actuator can include or be formed from an electrical actuator (e.g., an electric drive).

[0035] The drive device may optionally include a lever or other gear unit designed to transmit the drive force (e.g., as torque) to the chamber valve.

[0036] The fluid-mechanical actuator can be configured to convert hydrostatic energy into driving force, for example, by means of a piston. The electrical actuator can be configured to convert electrical energy into driving force. For the sake of simplicity, the following description refers to an actuator in the form of a piston. The described functions of the drive device can also apply analogously to a drive device of another type. For example, a rotary actuator can be used as an alternative or additional to the piston, and a passive mode (figuratively, a force-free mode) can be provided to it. For example, the passive mode of the rotary actuator can be provided by switching it off.

[0037] Fig. Figure 2 illustrates a vacuum arrangement 200 according to various embodiments in a schematic side view or cross-sectional view, which implements the method 100 by means of a control device 106.

[0038] The drive unit 120 of the vacuum arrangement 200 can include the piston 202 and a compressor 204 (also referred to as a compression device). The compressor 204 can be configured to compress a fluid (e.g., a gas or a liquid) to provide hydrostatic energy. For the sake of simplicity, the following description refers to a gas as the fluid. The described functions of the drive unit can also apply analogously to other fluids, e.g., liquids.

[0039] The reciprocating piston 202 can have one or more pressure chambers 401, to which the compressed gas is assigned.

[0040] The actuator 120 can provide several operating modes, e.g., a first operating mode (also referred to as closed mode), a second operating mode (also referred to as passive mode), and a third operating mode (also referred to as open mode). In closed mode, the actuator 120 can close and / or hold closed the chamber valve 206 by means of the provided drive force (e.g., torque). In open mode, the actuator 120 can open and / or hold open the chamber valve 206 by means of the provided drive force.

[0041] The closed and open modes can therefore differ in the direction and / or magnitude of the actuating force transmitted to the chamber valve 206. In the passive mode, the actuating force transmitted to the chamber valve 206 (e.g., its magnitude) can be smaller than in the closed and / or open modes.

[0042] In closed mode, the chamber valve 206 can be pressed against a sealing surface of a vacuum chamber by means of the actuating force. In open mode, the chamber valve 206 can be pulled away from the sealing surface of the vacuum chamber by means of the actuating force, e.g., against its own weight. In passive mode, the actuating force transmitted to the chamber valve 206 (e.g., its magnitude) can be so small that the chamber valve 206 is freely movable (i.e., released). This allows the chamber valve 206 to open even at a slight overpressure (e.g., less than 0.1 bar) in the vacuum chamber. In essence, the chamber valve 206 can act as a pressure relief valve in passive mode. Optionally, the actuating force in passive mode can act against the weight of the valve flap. This allows the chamber valve 206 to open even at a very low overpressure (e.g., less than 0.05 bar).

[0043] The control device 106 can be configured to switch the drive device 120 from closed mode to passive mode when the chamber valve 206 is subjected to a pressure differential that keeps the chamber valve closed. This pressure differential can be, for example, the difference between atmospheric pressure and the chamber pressure (also referred to as internal chamber pressure). This allows the chamber valve 206 to be released before an overpressure has built up in the vacuum chamber.

[0044] The control device 106 can further be configured to switch the drive device 120 from passive mode to open mode when the pressure differential has decreased. The pressure differential can be reduced by venting the vacuum chamber. This allows the chamber valve 206 to be opened after pressure equalization has occurred in the vacuum chamber.

[0045] The passive mode can, for example, involve venting a pressure chamber 401 of the piston 202. This venting can, for example, involve connecting the pressure chamber 401 fluidically to the atmosphere or at least releasing the gas within the piston 202. This allows the pressure chamber 401 to exchange gas with the atmosphere. Alternatively or additionally, the venting can involve connecting two pressure chambers 401 of the piston 202 fluidly to each other. This allows the two pressure chambers 401 to exchange gas with each other (so that less air enters the piston).

[0046] The pressure described herein, or its difference (also referred to as pressure differential) to a pressure used as a reference pressure, can be detected by means of a suitable sensor, e.g., a pressure sensor. The detected pressure could, for example, be the internal chamber pressure.

[0047] A sensor (also called a detector) can be understood as a transducer designed to qualitatively or quantitatively detect a property of its environment corresponding to the sensor type, e.g., a physical or chemical property and / or a material composition. The measured quantity is the physical quantity to which the sensor applies its measurement. A sensor can be part of a measurement chain, which includes the necessary infrastructure (e.g., a processor, storage medium, and / or bus system, or similar components). The measurement chain can be configured to control the corresponding sensor (e.g., a water sensor, pressure sensor, and / or actuation sensor), process its detected measured quantity as an input, and, based on this, provide an electrical signal as an output that represents the state of the input quantity at the time of detection.The measuring chain can be implemented, for example, by means of the control device 106.

[0048] Fig. 3A and Fig. Figure 3B illustrates a vacuum arrangement 200 according to various embodiments 300 in a schematic side view or cross-sectional view, the vacuum arrangement 200 being illustrated in different phases of an operating sequence. The vacuum arrangement 200 according to various embodiments 300 can have one or more vacuum chambers 804, each chamber having a chamber wall penetrated by a chamber opening 804o (also referred to as a substrate transfer opening 804o). Several vacuum chambers 804 can be connected to form a common vacuum system by means of corresponding chamber openings 804o.

[0049] The chamber valve 206 can have the chamber opening 804o and a valve flap which covers or seals the chamber opening 804o in the closed state. In the closed state of the chamber valve 206, the (e.g. pivotable) valve flap can be in a closed position and pressed against a chamber wall of the vacuum chamber 804, which limits the chamber opening 804o, by means of the drive force.

[0050] The following refers to two chambers 804, which are connected to each other by means of the chamber valve 804o or its chamber opening 804o (e.g., a vacuum chamber 804a and an atmospheric chamber 804b). The description can also apply analogously if one of the two chambers 804 (e.g., the atmospheric chamber 804b) is omitted, or if both chambers are configured as vacuum chambers.

[0051] According to various embodiments, a vacuum chamber can be provided by means of a chamber housing in which one or more chambers can be provided. The chamber housing can, for example, be coupled to a pump arrangement 816, e.g., a vacuum pump arrangement (e.g., gas-conducting), for providing a negative pressure or a vacuum (vacuum chamber housing), and be designed to be stable enough to withstand the effects of atmospheric pressure in the evacuated state. The pump arrangement (comprising at least one vacuum pump, e.g., a high-vacuum pump, e.g., a turbomolecular pump) can enable a portion of the gas to be pumped out of the interior of the vacuum chamber. Accordingly, one or more vacuum chambers can be provided in a chamber housing.

[0052] The chamber opening 804o can be covered by the valve flap 206k when the actuator is in the closed mode. Then the chamber valve 206 can be closed (also referred to as the closed state). In the closed state, a fluid-conducting connection between the two chambers 804 can be interrupted through the chamber opening 804o.

[0053] The chamber opening 804o can be exposed (i.e., have a gap from) by means of the valve flap 206k when the drive device is in the open mode. Then the chamber valve 206 can be open (also referred to as the open state). In the open state, the fluid-conducting connection between the two vacuum chambers can be established through the chamber opening 804o.

[0054] In general, the chamber opening 804o can be designed to be large enough to allow the transport of a substrate through it. For example, the chamber opening can have an extension (e.g., along the vertical) of more than approximately 0.5 m (meters), e.g., approximately 1 m, e.g., approximately 2 m, e.g., approximately 3 m. This allows a substrate to be exchanged between the two chambers 804.

[0055] According to various embodiments, the substrate can be plate-shaped and comprise or be formed from at least one of the following: a ceramic, a glass, a semiconductor (e.g., amorphous, polycrystalline, or monocrystalline semiconductor such as silicon), a metal, and / or a polymer (e.g., plastic). For example, the substrate can be a wafer (a semiconductor substrate), a metal foil, a metal sheet, or a glass plate, and may optionally be coated. Optionally, the substrate can be transported by means of a substrate carrier.

[0056] For transporting the substrate, the vacuum arrangement 200 can have a transport device (not shown) with a plurality of transport rollers on which the substrate or the substrate carrier in which the substrate is placed can be transported. The transport device can provide a transport path through the chamber valve 206 (e.g., its substrate transfer opening 8040).

[0057] Optionally, the vacuum chamber 804a can have a pressure relief valve 302. The pressure relief valve 302 can be configured to release the flow of gas in the through-direction (out of the vacuum chamber 804a) as soon as a pressure differential across the pressure relief valve 302 exceeds a predefined pressure differential (also referred to as the release pressure or response pressure). In other words, the response pressure can be greater than zero. For this purpose, the pressure relief valve 302 can, for example, have a spring element that defines the release pressure. The spring element can, for example, provide a force that opposes the opening of the pressure relief valve 302 in the through-direction, e.g., by holding the pressure relief valve 302 closed by means of the spring element.

[0058] In a first phase 300a, the vacuum chamber 804a can be pumped out (also referred to as evacuated) and / or have at least a lower pressure than the atmosphere chamber 804b. In the pumped-out state, the vacuum chamber can have a pressure lower than atmospheric pressure. Atmospheric pressure (hereafter simplified as 1 bar) can be the pressure of the Earth's atmosphere at the location of the vacuum arrangement 200, which arises due to the hydrostatic pressure of the Earth's atmosphere.

[0059] When evacuated, the vacuum chamber (e.g., its interior) can have a vacuum (i.e., a pressure less than 0.3 bar) or less, e.g., a pressure in the range of approximately 1 mbar to approximately 10 -3 mbar (in other words, fine vacuum) or less, e.g., a pressure in the range of approximately 10 -3 mbar to approximately 10 -7 mbar (in other words, high vacuum) or less, a pressure smaller than high vacuum, e.g., less than approximately 10 -7mbar (in other words, ultra-high vacuum). Alternatively or additionally, the atmosphere chamber 804 (e.g., its interior) can have atmospheric pressure.

[0060] In the first phase 300a, the chamber valve 206 can also be or become closed. In other words, the drive device 120 can be in the closed mode.

[0061] For example, a pressure difference dropping across the chamber valve 206 (i.e., in this case, the pressure difference between the two chambers 804) can be greater than approximately 0.1 bar, e.g., than approximately 0.2 bar, e.g., than approximately 0.3 bar, e.g., than approximately 0.4 bar, e.g., than approximately 0.5 bar, e.g., than approximately 0.6 bar, e.g., than approximately 0.7 bar, e.g., than approximately 0.8 bar, e.g., than approximately 0.9 bar.

[0062] The pressure difference can press the valve flap 206k against the chamber wall (e.g., its sealing surface) of the vacuum chamber 804a, which is penetrated by the chamber opening 804o. For example, the pressure difference can exert a force on the valve flap 206k, which, together with the driving force, pushes the valve flap 206k against the chamber wall.

[0063] In the second phase 300b, a substrate 102 may be or be placed in the vacuum chamber 804a. Subsequently, a gas 301 may be supplied to the vacuum chamber 804a, in which the substrate is arranged (also referred to as venting the vacuum chamber). Venting the vacuum chamber 804a may involve increasing the pressure in the vacuum chamber 804a (also referred to as chamber pressure) or decreasing the pressure differential across the chamber valve 206. The pressure differential across the chamber valve 206 (i.e., the pressure difference acting on it) may be the difference between the pressures acting on opposite sides of the valve flap (or its valve leaf).

[0064] In the second phase 300b, the chamber valve 206 can be released by reducing the drive force. In other words, the drive device can be, or become, in passive mode. This can occur when the chamber pressure of the vacuum chamber 804a meets a predefined criterion (also referred to as the release criterion). The release criterion can be met, for example, when the chamber pressure exceeds a threshold value, e.g., 50% of atmospheric pressure or 0.5 bar. Of course, another threshold value can also be used, for example, approximately 0.6 bar, approximately 0.7 bar, approximately 0.8 bar, or approximately 0.9 bar. Alternatively or additionally, a corresponding pressure differential across the chamber valve 206 can also be used as a release criterion.For example, the release criterion may be met if the pressure difference across the chamber valve 206 is less than approximately 50% of atmospheric pressure or 0.5 bar, e.g., approximately 0.4 bar, approximately 0.3 bar, approximately 0.2 bar, or approximately 0.1 bar.

[0065] Optionally, the release criterion can be met if the chamber pressure is lower than the response pressure of the pressure relief valve 302, i.e., before the chamber pressure reaches the response pressure. This prevents the supplied gas 301 from parasitically escaping through the pressure relief valve 302 (represented here by a crossed-out arrow). For example, the chamber valve 206 opens as soon as the pressure differential across the chamber valve is eliminated or reversed. This causes the gas to escape primarily (e.g., only) through the chamber opening 804, e.g., before the response pressure of the pressure relief valve 302 is exceeded.

[0066] To illustrate, the chamber valve 206, switched in this way without force, can implement an additional pressure relief valve whose opening pressure is lower than the opening pressure of the pressure relief valve 302. The actuating force can (but does not necessarily have to) be reduced to zero in passive mode. In any case, the remaining actuating force can be so small and / or directed such that the opening pressure of the chamber valve 206 (i.e., the pressure at which the chamber valve 206 opens) is lower than the opening pressure of the pressure relief valve 302.

[0067] Alternatively or additionally, in the second phase 300b more gas can escape through the chamber valve 206 than through the pressure relief valve 302.

[0068] Optionally, the substrate 102 may be heated. For example, before being placed in and / or within the vacuum chamber 804a, the substrate 102 may be heated to a temperature (also referred to as the substrate temperature) higher than room temperature. For example, the substrate temperature may be approximately 100 °C or more, approximately 200 °C or more, approximately 300 °C or more, or approximately 400 °C or more.

[0069] The substrate 102, which is arranged in the vacuum chamber 804a, can have the substrate temperature when or before the vacuum chamber 104a is vented 301. The temperature of the gas 301 supplied during this process (also referred to as the gas temperature) can be lower than the substrate temperature. For example, the difference between the substrate temperature and the gas temperature can be greater than approximately 100 °C, e.g., approximately 200 °C, e.g., approximately 300 °C, e.g., approximately 400 °C.

[0070] This temperature difference between the substrate temperature and the gas temperature can cause the gas to heat up when it comes into contact with the substrate, thereby expanding (also known as the initial shock or venting shock) and cooling the substrate. The expansion of the gas can accelerate the increase in pressure in the vacuum chamber 804a, potentially leading to overpressure if the gas could not escape through the chamber opening 804o. The gas supplied in this way can then be used, for example, to rapidly cool the heated substrate 102 (also known as quenching).

[0071] After the second phase 300b, the substrate can be transported through the open chamber valve 206 (i.e., its substrate transfer opening 804o), for example, into the atmosphere chamber 804b. In the atmosphere chamber 804b, the substrate 102 can be cooled further to atmospheric pressure. In other words, the atmosphere chamber 804b can be configured as a cooling chamber.

[0072] In one example, in the first phase 300a, the flap valve 206 can be held in the closed position (e.g., by means of a pneumatic circuit 120). In the second phase 300b, the initial impulse can only escape through the chamber opening 804o.

[0073] To ensure that the escaping gas is fed into the atmosphere chamber 804b and / or remains available for the process or moves in the direction of transport, the drive device 120 can be switched to passive mode. This protects the safety valve 302 (also known as the safety pressure relief valve) and prevents it from needing to be triggered.

[0074] In one example, during the second phase 300b, the flap valve 206 cannot be held in the closed position. The chamber door (i.e., the flap valve 206) is then opened by means of the control device 106. The initial shock can escape primarily through the flap valve 206 (also referred to as the chamber door). This allows the gas to remain available for the process and move along with the substrate 102 in the transport direction. Furthermore, the safety valve 302 is protected or not triggered at all.

[0075] According to various embodiments, the chamber valve 206 (e.g., flap valve) can be configured to seal a vacuum chamber housing. The chamber valve can have: a sealing surface penetrated by a substrate transfer opening; a valve flap comprising a first end section, a second end section, and a sealing section between them; a bearing arrangement for pivotally mounting the valve flap, wherein the bearing arrangement is coupled, for example, to the first end section and the second end section and optionally to the sealing section, wherein the valve flap (e.g., its sealing section) presses against the sealing surface in a closed state of the chamber valve and is spaced away from it in an open state of the chamber valve.

[0076] Fig.Figure 4 illustrates a vacuum arrangement 200 according to various embodiments 400 in a schematic side view or cross-sectional view, which implements the method 100 by means of a control device 106. Reference is made below to a reciprocating piston 202. Optionally, the drive device can, for example, have several reciprocating pistons 202 which can be controlled / connected, as described with reference to the single reciprocating piston 202.

[0077] The vacuum assembly 200 can include the compressor 204 (more generally also referred to as the pressure generator), the reciprocating piston 202, and a three-way valve acting as a control valve 402 connected between them. The control valve 402 can be coupled on its output side to either of the two pressure chambers of the reciprocating piston 202. Alternatively, in a more complex implementation, a 5 / 3-way valve, for example, can be used as the control valve 402 instead of the three-way valve 402.

[0078] In the open mode, a first pressure chamber 401 of the piston 202 can be pressurized, i.e., fluid-conducted to the pressure generator 204 via the control valve 402. In the closed mode, a second pressure chamber 403 of the piston 202 can be pressurized, i.e., fluid-conducted to the pressure generator 204 via the control valve 402. In the passive mode, the pressure in the second pressure chamber 403 can be reduced, e.g., by fluid-conducting it to the first pressure chamber 401.

[0079] A quick-release vent 404 can be connected between the second pressure chamber 403 and the control valve 402, which reduces the pressure of the second pressure chamber 403 in passive mode (i.e., vents it). For this purpose, the quick-release vent 404 can, for example, connect the second pressure chamber 403 to the Earth's atmosphere in passive mode.

[0080] In passive mode, the pressure in the second pressure chamber 403 can be reduced, e.g. by connecting it fluidly to the first pressure chamber 401 via the control valve and / or by connecting it fluidly to the Earth's atmosphere via the quick vent 404.

[0081] To switch between the different modes, the control device can actuate the control valve 402 and / or the quick vent 404 411.

[0082] A 5 / 3-way valve can additionally have a so-called neutral position, into which it can be set in passive mode, by means of which the second pressure chamber 403 can be vented. Of course, one or more valves of a different type can also be used as the control valve 402. Optionally, the control valve 402 and / or the quick vent 404 can be a fluid-mechanical valve or be formed from one.

[0083] A fluid-mechanical valve (e.g., a pneumatic valve) can have a valve body (e.g., a flap, a slide, or similar) and a fluid-mechanical actuator, which has the control input, e.g., a diaphragm, a piston, or similar. The fluid-mechanical actuator can be configured to convert the fluid-mechanical pressure change into a mechanical movement (or a change thereof) and to transmit the mechanical movement to the valve body, so that a reduction or enlargement of the cross-sectional area of ​​the fluid-conducting connection occurs.

[0084] In one example, the flap valve 206 is not held in the closed position in the second phase 300b, but rather released. After the substrate 102 is positioned in the closed chamber 104a, a pneumatic valve 402 (e.g., a 5 / 3-way valve) is switched to a neutral mode, and the "opening" direction of movement is enabled via a quick-release vent 404. The chamber valve 206, thus released (in passive mode), can open freely.

[0085] The passive mode was previously described using a mechanical implementation. The same applies analogously to an electronically implemented passive mode. In other words, a circuit (e.g., a pneumatic circuit) and / or software can be used to implement a mode (referred to herein as passive mode for simplicity) in which the ventilation pulse can escape primarily through the flap valve.

[0086] Optionally, the passive mode can be configured such that the valve flap 206k of the chamber valve 206, opened by the escaping gas, does not close automatically. In other words, a holding function can be implemented that is configured to maintain a position of the valve flap, e.g., against its own weight.

[0087] Optionally, the drive device 120 and / or the control device 106 can be configured to implement end-position damping, as described in more detail below. End-position damping allows for faster switching of the chamber valve 206, for example, to switch between the open and closed states.

[0088] End-position damping can be understood as a mechanism that slows down a movement before reaching an end position (also referred to as the end position). The end position can be the position of the valve flap in the closed state (also referred to as the closed position) or the position of the valve flap in the open state (also referred to as the open position). End-position damping, for example, slows down the piston and thus prevents damage to the piston and / or its end positions in the pressure chambers caused by a rapid piston impact.

[0089] End-position damping can be implemented mechanically. For example, a mechanical damping element (e.g., comprising an elastomer) can be attached to the end position and / or to the moving parts of the actuator. The damping element can be configured to dissipate the kinetic energy of the piston (i.e., convert it into heat via friction). For example, the piston head can have damping pistons on both sides.

[0090] The end-position damping can be implemented electronically, either alternatively or additionally, for example as self-regulating damping. For this purpose, the control device 106 can have an electronic damping element configured to actuate the control valve 402 such that it decelerates the switching process when the end position is reached. By means of the electronic end-position damping, the drive force provided by the actuator is changed depending on the position of the valve flap 206k, for example, when the valve flap 206k reaches the open and / or closed position. Optionally, the damping factor of the electronic damping element can be adjustable. This makes it possible to adapt the end-position damping to the prevailing conditions.

[0091] The following are various examples that refer to what has been described previously and depicted in the figures.

[0092] Example 1 is a method according to the attached claim 1, comprising, among other things: changing (e.g., decreasing) a driving force by which a chamber valve of a vacuum chamber is kept closed when the vacuum chamber is evacuated; and venting the vacuum chamber (i.e., supplying gas to the vacuum chamber) after changing the driving force; transporting a substrate through the chamber valve when the chamber valve is open.

[0093] Example 2 is the method according to Example 1, wherein the driving force is generated by means of a drive device.

[0094] Example 3 is the method according to Example 2, wherein reducing the driving force involves venting a pressure chamber of the drive device by means of which the driving force is generated.

[0095] Example 4 is the procedure according to one of Examples 1 to 3, wherein the reduction of the driving force (e.g., venting) is carried out by means of a quick vent.

[0096] Example 5 is the method according to any one of Examples 1 to 4, wherein the chamber valve comprises: a valve flap having a first end section, a second end section and a sealing section between these; and a bearing arrangement by means of which the valve flap is pivotably mounted, wherein optionally the bearing arrangement is further configured to pivot the valve flap between an open position (in an open state of the chamber valve) and a closed position (in a closed state of the chamber valve); and wherein, for example, the sealing section is configured to seal a substrate transfer opening in the closed position of the valve flap, wherein, for example, the bearing arrangement has several pivotally mounted pivot arms, wherein the sealing section has, for example, a circumferential groove for receiving a seal in the groove (and / or wherein the sealing section has the seal).

[0097] Example 6 is the method according to one of Examples 1 to 5, wherein the drive device has one or more than one reciprocating piston, e.g. one reciprocating piston per swivel arm.

[0098] Example 7 is the method according to one of Examples 1 to 6, wherein changing the driving force causes a reduction in the contact force of the chamber valve, e.g. the contact force with which the valve flap is pressed against a sealing surface surrounding the substrate transfer opening.

[0099] Example 8 is the method according to one of Examples 1 to 7, wherein the driving force is changed (e.g. reduced) in such a way that the chamber valve is at least partially opened when the vacuum chamber is vented, e.g. upstream of a pressure relief valve of the vacuum chamber.

[0100] Example 9 is the method according to Example 8, wherein a gas supplied for ventilating the vacuum chamber escapes at least partially through the at least partially open chamber valve, e.g. into a chamber adjacent to the vacuum chamber (e.g. atmosphere chamber).

[0101] Example 10 is the method according to one of Examples 1 to 9, wherein the substrate is arranged in the vacuum chamber when the vacuum chamber is vented.

[0102] Example 11 is the method according to one of Examples 1 to 10, wherein the substrate has a higher temperature during ventilation than a gas supplied to ventilate the vacuum chamber.

[0103] Example 12 is the method according to one of Examples 1 to 11, wherein a vacuum is formed in the evacuated vacuum chamber, for example by supplying gas to the vacuum chamber before changing the driving force.

[0104] Example 13 is the method according to one of Examples 1 to 12, wherein an atmospheric pressure is created in the ventilated vacuum chamber.

[0105] Example 14 is the method according to one of Examples 1 to 13, wherein changing the driving force involves relaxing a lifting cylinder (e.g. its pressure chamber) of the drive device.

[0106] Example 15 is the method according to one of Examples 1 to 14, wherein the driving force is reduced to a value at which the chamber valve has a lower response pressure than a pressure relief valve of the vacuum chamber.

[0107] Example 16 is the method according to one of Examples 1 to 15, further comprising: transporting the substrate into the vacuum chamber when the chamber valve is kept closed by means of the driving force and / or by means of a pressure difference acting on the chamber valve.

[0108] Example 17 is the method according to Example 16, further comprising: processing the substrate before it is transported into the vacuum chamber.

[0109] Example 18 is the process according to Example 17, further comprising: wherein the processing comprises heating the substrate (e.g. to a substrate temperature) and / or coating it (e.g. when the substrate is heated).

[0110] Example 19 is the method according to any of Examples 1 to 18, wherein reducing the driving force involves changing the driving force from a first value to a second value, wherein the second value is essentially zero or at least less than 50% (e.g., less than 25%, e.g., less than 10%, e.g., less than 5%) of the first value.

[0111] Example 20 is the procedure according to one of Examples 1 to 19, wherein the reduction of the driving force (also referred to as power disengagement) occurs when a pressure difference acting on the chamber valve is less than 50% (e.g. less than 25%, e.g. less than 10%, e.g. less than 5%) of atmospheric pressure.

[0112] Example 21, according to the appended claim 12, is a method for controlling a drive device for a chamber valve according to several operating modes (e.g., the chamber valve of the method according to any one of Examples 1 to 20), of which a first operating mode closes and / or keeps the chamber valve closed; a second operating mode releases the chamber valve; and a third operating mode opens and / or keeps the chamber valve open; wherein the method comprises: switching from the first operating mode to the second operating mode when the chamber valve is subjected to a pressure differential (e.g., less than 0.3 bar and / or more than 0.01 bar, detected by a sensor) which keeps the chamber valve closed; and switching from the second operating mode to the third operating mode after the pressure differential (e.g., detected by a sensor) has been reduced, e.g., by at least 50% (e.g., 75%) and / or before the pressure differential is lifted orwhose direction is reversed, whereby, for example, a pressure is measured that represents the pressure difference (e.g., with respect to atmospheric pressure).

[0113] Example 22 is a control device or a non-volatile storage medium, wherein the control device is, for example, configured to perform the method according to Example 21, and wherein the storage medium has, for example, code segments configured, when executed by a processor, to perform the method according to Example 21.

[0114] Example 23 is a vacuum arrangement comprising: a control device according to Example 22; and the drive device coupled to the control device. Example 24 is the vacuum arrangement according to Example 23, wherein the drive device comprises a rapid vent, the switching between the several operating modes of the rapid vent being performed.

[0115] Example 25 is the vacuum arrangement according to Example 23 or 24, further comprising: the chamber valve, which (e.g. its valve flap) is coupled to the drive device.

[0116] Example 26 is the vacuum arrangement according to one of Examples 23 to 25, wherein the drive device and / or the control device are configured such that end-position damping is implemented, wherein the end-position damping slows down a movement of the drive device upon reaching an open state or closed state of the chamber valve (e.g., open position or closed position of the valve flap).

[0117] Example 27 is the vacuum arrangement according to Example 26, wherein the end position damping is implemented by means of a mechanical damping element (e.g. the drive device) and / or by means of an electrical damping element (e.g. the control device).

[0118] Example 28 is the vacuum arrangement according to Example 27, wherein the electrical damping element is adjustable (e.g. its damping factor can be changed).

Claims

[1] Method (100), comprising: • Changing (101) a driving force generated by a fluid-mechanical actuator, by means of which a chamber valve (206) of a vacuum chamber (804) is kept closed when the vacuum chamber (804) is evacuated; and • Ventilating (103) the vacuum chamber (804) after changing the driving force; • Transporting (105) a substrate through the chamber valve (206) when the chamber valve (206) is opened by means of the actuator; • wherein the change in the driving force is effected by means of a quick vent (404) which fluidically connects a pressure chamber of the actuator to the earth's atmosphere. [2] Method (100) according to claim 1, wherein the driving force is generated by means of a driving device (120) comprising the actuator. [3] The method (100) according to any one of claims 1 to 2, wherein the quick vent (404) comprises a fluid mechanical valve. [4] Method (100) according to one of claims 1 to 3, wherein changing a driving force causes a reduction in a contact force of the chamber valve (206). [5] Method (100) according to one of claims 1 to 4, wherein the driving force is changed such that the chamber valve (206) is at least partially opened when the vacuum chamber (804) is vented, wherein a gas supplied for venting the vacuum chamber (804) at least partially escapes through the at least partially opened chamber valve (206). [6] Method (100) according to one of claims 1 to 5, wherein during venting of the vacuum chamber (804) the substrate is arranged in the vacuum chamber (804), wherein the substrate has a higher temperature during venting than a gas supplied for venting the vacuum chamber (804). [7] Method (100) according to one of claims 1 to 6, wherein the driving force is changed to a value at which the chamber valve (206) has a lower response pressure than a pressure relief valve of the vacuum chamber (804). [8] Method (100) according to one of claims 1 to 7, further comprising: Transporting the substrate (102) into the vacuum chamber (804) when the chamber valve (206) is kept closed by means of the driving force. [9] The method (100) of claim 8, further comprising: Heating the substrate before it is transported into the vacuum chamber (804). [10] The method (100) of any one of claims 1 to 9, wherein changing the driving force comprises changing the driving force from a first value to a second value, wherein the second value is substantially zero or at least less than 50% of the first value. [11] Method (100) according to one of claims 1 to 10, wherein the changing of the driving force occurs when a pressure difference falling across the chamber valve (206) is less than 50% of an atmospheric pressure. [12] Method (100) for controlling a drive device (120) for a chamber valve (206) according to several operating modes, of which • a first operating mode closes and / or keeps the chamber valve (206) closed by means of a drive force generated by a fluid-mechanical actuator of the drive device; • a second operating mode releases the chamber valve (206) by means of a quick vent (404) which fluidically connects a pressure chamber of the actuator to the earth's atmosphere; • a third operating mode opens and / or keeps the chamber valve (206) open by means of the fluid-mechanical actuator; the method (100) comprising: • Switching from the first operating mode to the second operating mode when the chamber valve (206) is subjected to a pressure difference superimposed on the driving force that keeps the chamber valve (206) closed; and • Switching from the second operating mode to the third operating mode after the pressure difference has been reduced. [13] Control device arranged to carry out the method (100) according to claim 12. [14] Vacuum arrangement, comprising: • a control device according to claim 13; • the drive device (120) which is coupled to the control device. [15] Vacuum arrangement according to claim 14, wherein the drive device (120) and / or the control device are arranged such that an end position damping is implemented, wherein the end position damping brakes a movement of the drive device (120) when an open state or a closed state of the chamber valve is reached. [16] Vacuum arrangement according to claim 15, wherein the end position damping is implemented by means of a mechanical damping element and / or by means of an electrical damping element. [17] Vacuum arrangement according to claim 16, wherein the electrical attenuator is adjustable.

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