PROCESSING ROUTE DISPLAY DEVICE

Abstract

A processing route display device (20) for displaying a processing route in a laser machine (1) for laser processing a workpiece with a laser output from a laser processing head (8) while the laser processing head (8) and the workpiece are relatively moved with at least one drive shaft, the device comprising: a position information acquisition section (21) configured to acquire position information of the at least one drive shaft for each predefined control cycle; a laser processing head coordinate calculator (22) configured to calculate a coordinate value of the laser processing head (8) from the position information of the at least one drive shaft and the machine configuration information of the laser machine (1), a first data acquisition section (23a) configured to acquire first data relating to the laser processing, a second data acquisition section (23b) configured to acquire second data relating to the laser processing, a first display format setting section (24a) configured to set a display color of the first data and / or a hue of the display color as a display format of the first data, a second display format setting section (24b) configured to set a display color of the second data and / or a hue of the display color as a display format of the second data, and a display section (25) configured to display the processing route based on coordinate values ​​of the laser processing head (8) calculated by the laser processing head coordinate calculator (22) and the display formats set by the first display format setting section (24a) and the second display format setting section (24b), wherein the display color of the first data and / or the hue of the display color of the first data is changed in accordance with the first data acquired by the first data acquisition section (23a), and the display color of the second data and / or the hue of the display color of the second data is changed in accordance with the second data acquired by the second data acquisition section (23b).

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention

[0001] The present invention relates to a machining route display device that displays a machining route or track for laser machining. 2. Description of related technology

[0002] When processing, e.g., cutting, an object (hereinafter referred to simply as the "workpiece") with a laser machine, a laser processing head is moved across the workpiece along a desired processing path. The display of a processing path on a display section is widely known.

[0003] JP 6 506 341 B2 discloses that when displaying a machining route, “at least one of the display colors of the laser and the hue of the display color are changed in accordance with the laser output values ​​detected by the laser output detecting section.” SUMMARY OF THE INVENTION

[0004] In JP 6 506 341 B2, when machining errors occur, the location at which the laser power was too high or too low can be determined by referring to the display color and its hue in the machining route.

[0005] However, in actual laser processing, various factors other than the size of the laser power may cause processing errors in the workpiece.

[0006] Therefore, there is a need for a machining route display device that can easily recognize the relationship between the machining route and various data related to laser machining.

[0007] The above object is achieved by a processing route display device according to patent claim 1. Claims 2 to 7 relate to particularly advantageous implementations of the processing route display device according to claim 1.

[0008] In the machining route display device according to claim 1, since the machining route is displayed according to the display formats of the first data and the second data are set according to the respective values ​​of the first data and the second data related to the laser machining, the relationship between the machining route and the first data and the second data is easy to recognize.

[0009] The objects, features and advantages of the present invention will become more apparent from the following description of the embodiments taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a functional block diagram of a machining route display device according to a first embodiment. Fig. 2 is a flowchart illustrating the operation of the machining route display device according to the first embodiment. Fig. 3 is a view showing an example of a machining route. Fig. 4 is a view similar Fig. 3, which shows another example of the processing route. Fig. 5 is a functional block diagram of a machining route display device according to a second embodiment. Fig. Figure 6 is a diagram showing another example of a machining route. DETAILED DESCRIPTION

[0010] The embodiments of the present invention will be described below with reference to the accompanying drawings. Corresponding components are designated by common reference numerals in the drawings.

[0011] Fig. 1 is a functional block diagram of a machining route display device according to a first embodiment.

[0012] As in Fig. 1, the machining route display device 20 is connected to a laser machine 1 via a numerical control device 16.

[0013] The laser machine 1 includes a laser oscillator 2. A laser power sensor 6 is arranged in the laser oscillator 2 for detecting the actual output value of the oscillating laser. Furthermore, a reflected light detection section 7 for detecting the actual values ​​of the light reflected from a workpiece W, which will be described later, is arranged on a laser processing head 8 of the laser machine 1. The reflected light detection section 7 may be a laser power sensor different from the laser power sensor 6.

[0014] A laser output of the laser processing head 8 performs processing, e.g., cutting, of a workpiece W placed on a movable column 9. The movable column 9 is movable on an XY plane. Drive shafts in the X and Y directions of the movable column 9 are coupled to corresponding motors, e.g., servo motors M1 and M2. The servo motors M1 and M2 are each equipped with position detectors E1 and E2, e.g., encoders, which detect the actual positions of the drive shafts for each predefined control cycle. Furthermore, a distance measuring unit 5, e.g., a camera, is arranged to measure a distance G between the workpiece W and the front end of the laser processing head 8 and is connected to a numerical control device 16.

[0015] The movable column 9 can be moved in at least one direction and is provided with a number of drive shafts and motors corresponding to the number of directions of movement. Alternatively, the table on which the workpiece W is placed can be fixed, and the laser processing head 8 can be moved in the XY plane using the servo motors M1 and M2.

[0016] The numerical control device 16 has a machining program 17 for machining the workpiece W using lasers, and the laser machine 1 is controlled according to the machining program 17. The machining program 17 includes information about the movements of the respective drive shafts. This information is converted as needed and acquired as position information by a position information acquisition section 21, which will be described later.

[0017] The machining route display device 20 is a digital computer and includes a CPU, memory, etc., connected to each other via a bus, etc. The machining route display device 20 includes a position information acquisition section 21 for obtaining position information from at least one drive shaft of the movable column 9 for each predetermined control cycle. The position information is determined from the machining program 17 or by position detectors E1 and E2 connected to servomotors M1, where M2 drives at least one drive shaft.

[0018] The machining route display device 20 further includes a laser machining head coordinate calculator 22 for calculating the coordinate values ​​of the laser machining head 8 from the position information of the at least one drive shaft and the machine configuration information of the laser machine 1. The machining route display device 20 further includes a first data acquisition section 23a for acquiring first data related to laser machining and a second data acquisition section 23b for acquiring second data different from the first data and related to laser machining.

[0019] The first data acquired by the first data acquisition section 23a is at least one of the following: a laser output command value of the laser processing head 8 obtained from the machining program 17, the actual laser output value of the laser processing head 8 obtained using the laser power sensor 6, an actual reflected light value obtained using the reflected light detection section 7, or a distance value G obtained using the distance measuring unit 5. The second data acquired by the second data acquisition section 23b is the same as the first data. The machine configuration information of the laser machine 1 mainly relates to the dimensions of the laser machine 1.

[0020] When each of the first data acquisition section 23a and the second data acquisition section 23b acquires the laser output command value of the laser processing head 8 obtained from the processing program 17 and / or the actual laser output value of the laser processing head 8 obtained using the laser power sensor 6, each of the first data acquisition section 23a and the second data acquisition section 23b may be referred to as a laser output acquisition section.

[0021] The machining route display device 20 further includes a first display format setting section 24a for setting a display format of the first data according to the value of the first data acquired by the first data acquisition section 23a, and a second display format setting section 24b for setting a display format of the second data according to the value of the second data acquired by the second data acquisition section 23b. The machining route display device 20 further includes a display section 25 for displaying the laser machining route based on the coordinate values ​​of the laser machining head 8 calculated by the laser machining head coordinate calculator 22 and the display formats set by the first display format setting section 24a and the second display format setting section 24b.

[0022] The CPU of the machining route display device 20 serves as the position information acquisition section 21, the laser machining head coordinate calculator 22, the first data acquisition section 23a, the second data acquisition section 23b, the first display format setting section 24a, and the second display format setting section 24b. The display section 25 may be a liquid crystal display, a cathode ray tube, or the like.

[0023] Fig. Figure 2 is a flowchart illustrating the operation of the machining route display device according to the first embodiment. In the following explanation, it is assumed that the first data acquisition section 23a is the laser power sensor 6 and the second data acquisition section 23b is the distance measuring unit 5.

[0024] First, in step S1 of Fig. 1, the position information acquisition section 21 acquires the position information of each drive shaft of the movable stator 9 for each unit of time. The position information may be a position command for each drive shaft acquired by the machining program 17 and / or an actual position of each drive shaft detected by the position detectors E1 and E2. For brevity, the position information will be described as a position command.

[0025] Then, in S12, the coordinate calculator 22 calculates the coordinates of the laser processing head 8 for each unit of time based on the position information. If the position information is acquired from the processing program 17, the coordinates of the laser processing head 8 constitute the commanded processing route of the laser. If the position information is determined from the position detectors E1 and E2, the coordinates of the laser processing head 8 constitute the actual processing route of the laser.

[0026] Then, in step S13a, the first data acquisition section 23a (laser power sensor 6) acquires the first data (actual laser output value) for each unit time, and in step S13b, the second data acquisition section 23b (distance measuring unit 5) acquires the second data (distance amount G) for each unit time.

[0027] In step S14a, the first display format setting section 24a sets the display format of the machining route in accordance with the first data obtained in step S13a.

[0028] Fig. 3 is a view showing an example of a machining route. In Fig. 3 shows the machining routes A and B, which consist of a large number of line segments extending in the X and Y directions, side by side. Fig. Machining route A shown in Figure 3 consists of line segments A1 to A4, and machining route B consists of line segments B1 to B4. Line segments A1, A3 and line segments B1, B3 extend only in the X direction, and line segments A2, A4 and line segments B2, B4 extend only in the Y direction. Each of the line segments A1 to A4 and line segments B1 to B4 can have components in both the X and Y directions. Fig. The arrow shown in Figure 3 indicates the direction of movement of the laser processing head 8. The same applies to other Fig. 4 and Fig. 6.

[0029] Bottom left in Fig. 3, Tables T1 and T2 are shown. Table T1 shows the color tones of the colors of processing route A, which are determined according to the magnitude of the actual laser output value. Table T1 is created in advance in the first display format setting section 24a. Specifically, in Table T1, the laser output values ​​are divided into a plurality of levels, for example, six levels. The lowest level of the laser output value (up to 300W) is set to the brightest color, such as white, and the highest level of the laser output value (2700W and above) is set to the darkest color, such as black. In the intermediate levels, the color tones gradually darken from the brightest to the darkest color level.

[0030] Table T2 shows the color tones of the processing route B, which were determined depending on the gap amount G. In the same way as described above, in Table T2, the gap amount G is divided into multiple levels, for example, six levels. The level with the largest gap amount G is set to the lightest color, e.g., white, and the level with the smallest gap amount G is set to the darkest color, e.g., black.

[0031] In step S14a, the first display format setting section 24a sets the color tones of the coordinate values ​​for each control cycle of the laser processing head 8 in accordance with the magnitude of the actual laser output value. Further, in step S14b, the second display format setting section 24b sets the color tones of the coordinate values ​​for each control cycle of the laser processing head 8 in accordance with the distance amount G. In Fig. 3, the first display format setting section 24a and the second display format setting section 24b are set so that their color tones alternate between white and black.

[0032] In an embodiment not shown, the display format setting sections 24a, 24b can vary in hue for a large number of colors. For example, the lowest level of the actual laser output value or distance amount G is set to blue, the highest level of the actual laser output value or distance amount G is set to yellow, and the intermediate level in between is set to red. The hues can gradually change between the blue and red levels, and between the red and yellow levels.

[0033] With further reference to Fig. 2, the display section 25 displays the machining route A and the machining route B in S15 based on the coordinate values ​​of the laser machining head 8 and the first and second display formats, respectively. Fig. As shown in Figure 3, the processing route A and the processing route B are displayed after the display formats of the lasers, such as the color tones, are adjusted according to the actual laser output value and the distance amount G, respectively. With such a configuration, it is assumed that the operator can intuitively understand the relationship between the processing route and the laser power and the distance amount G.

[0034] For example, in Fig. 3 shows that the laser power decreases at the corner areas of the processing route A, ie at the connecting areas of the respective line segments A1 to A4. In addition, Fig. 3 Line segment A2 is shorter than the other line segments A1, A3, and A4. As a result, line segment A2 does not exhibit the largest and lightest color tone level of the laser output values. In other words, since line segment A2 is short, it is understandable that line segment A2 cannot exhibit the highest laser power.

[0035] The surface of the workpiece W to be laser processed is not consistently smooth, and the surface may be wavy. In such cases, the laser processing head 8 collides with the workpiece W along the processing routes A and B during laser processing, and the laser processing head 8 is damaged or a processing error occurs in the workpiece W.

[0036] In this context, Fig. 3, the distance amount G between the laser processing head 8 and the workpiece W can be recognized in connection with the processing route B. For example, referring to the section B11 of the line segment B1 of the processing route B, it can be understood that the workpiece W is wavy at this position, and the distance amount G is small. Therefore, when the laser processing head 8 collides with the workpiece W, it is easy to know that the collision position of the laser processing head 8 is the section B11. Therefore, it is possible to prevent the laser processing head 8 from colliding with the subsequent workpiece W by locally raising the position of the laser processing head 8 relative to the workpiece W or by smoothing the workpiece W in advance.

[0037] For this purpose, it is also possible to include a servo motor M3 for driving the movable column 9 in the Z direction and an encoder E3 mounted on the servo motor M3 (both not shown). In this case, it is possible to prevent the laser processing head 8 from colliding with the workpiece W by locally lowering the movable column 9.

[0038] Fig. 4 is a similar view to Fig. 3 and shows another example of a processing route. In this case, the first data acquisition section 23a is the laser power sensor 6, and the second data acquisition section 23b is the reflected light detection section 7. Table T3 in Fig. Figure 4 shows the color tones of processing route C, which were determined according to the magnitude of the reflected light. In the same way as described above, in Table T3, the magnitude of the reflected light is divided into a plurality of levels, e.g., six levels. The lowest level of reflected light is set to the brightest color, e.g., white, and the highest level of reflected light is set to the darkest color, e.g., black. Since the processes of processing routes A and C in Fig. 4 are the same as those referred to in Fig. 2, their description has been omitted.

[0039] For example, during laser processing, the light reflected from the laser onto the workpiece W may enter the laser processing head 8 and damage the laser processing head 8 and the laser oscillator 2. However, since the magnitude of the reflected light varies not only depending on the processing routes A, B and the actual laser output value, but also on the shapes of the laser processing head 8 and the type of workpiece W, the user usually cannot predict the magnitude of the reflected light. For this reason, there is a risk that the reflected light may change dramatically at a location that the user does not intend. If the laser processing head 8 or the laser oscillator 2 is damaged by the reflected light, the workpiece W may have processing defects.

[0040] In this context, Fig. 4, the reflected light associated with the machining route C can be detected. For example, referring to sections C31 of the line segment C3 and C41 of the line segment C4 of the machining route C, it can be seen that the reflected light locally increases as the laser machining head 8 rotates clockwise. Therefore, if the laser machining head 8 or the laser oscillator 2 is damaged by the reflected light, it can be easily seen that the positions of the laser machining head 8 that are damaged are sections C31 and C41. Therefore, for a subsequent workpiece, it is possible to prevent damage to the laser machining head 8 and the laser oscillator 2 by locally reducing the laser output in sections C31 and C41.

[0041] Fig. 5 is a functional block diagram of a machining route display device according to the second embodiment. Fig. The machining route display device 20 shown in FIG. 5 is connected to the laser machine 1 via the numerical control device 16. The machining route display device 20 includes a third data acquisition section 23c in addition to the first data acquisition section 23a and the second data acquisition section 23b. The third data acquired by the third data acquisition section 23c may be the same as the first data and second data described above. In addition to the first display format setting section 24a and the second display format setting section 24b, the machining route display device 20 includes a third display format setting section 24c. The CPU of the machining route display device 20 functions as the third data acquisition section 23c and the third data display format setting section 24c.

[0042] Fig. Fig. 6 is a diagram showing another example of a processing route. In this case, the first data acquisition section 23a is the laser power sensor 6, the second data acquisition section 23b is the distance measuring unit 5, and the third data acquisition section 23c is the reflected light detection section 7. Since the processes of the processing routes A, B, and C in Fig. 6 are the same as those relating to Fig. 2, their description has been omitted.

[0043] In Fig. 6 shows that the laser power is extremely small in section A31 of line segment A3 of machining route A. Furthermore, in the same manner as described above, in section B11 of line segment B1 of machining route B, the workpiece W is corrugated, while the clearance G is small. In addition, the reflected light is locally increased in sections C31 of line segment C3 and C41 of line segment C4 of machining route C.

[0044] Therefore, when a machining error occurs in the workpiece W, it is possible to immediately determine whether the machining error is caused by the laser output, the reflected light, or the size of the gap based on the location where the machining error occurs. In other words, in the second embodiment, since three sets of information are included by the machining routes A, B, and C, the user can identify the cause of the machining errors more clearly and quickly. Incidentally, the provision of a larger number of data acquisition sections and display format setting sections falls within the scope of the present invention.

[0045] As described above, the laser emission detection sections (first data acquisition section 23a to third data acquisition section 23c) acquire laser emission command values ​​or actual laser emission values. Therefore, the display section 25 displays the machining route A using a display format determined from the laser emission command value, or displays the machining route A using a display format determined from the actual laser emission value. The laser emission detection sections can also detect deviations between the laser emission command value and the actual laser emission value to display the deviations along with the machining route in the same manner as described above.

[0046] When the position information serving as a position command is obtained from the machining program 17, the relationship between the laser output and the machining route composed of the command positions can be easily recognized. Similarly, when the position information is determined as the actual positions determined by the position detectors E1 and E2, the relationship between the laser output and the machining route composed of the actual positions can be easily recognized. Aspects of Revelation

[0047] According to the first aspect, a machining route display device (20) for displaying a machining route in a laser machine (1) for laser machining a workpiece with a laser output from a laser machining head (8) is provided while the laser machining head and the workpiece are relatively moved with at least one drive shaft, the device comprising a position information acquisition section (21) configured to acquire position information of the at least one drive shaft for each predefined control cycle, a laser machining head coordinate calculator (22) configured to calculate a coordinate value of the laser machining head from the position information of the at least one drive shaft and machine configuration information of the laser machine, a first data acquisition section (23a) configured to acquire first data related to the laser machining,a second data acquisition section (23b) configured to acquire second data relating to the laser processing, a first display format setting section (24a) configured to set a display color of the first data and / or a hue of the display color as a display format of the first data, a second display format setting section (24b) configured to set a display color of the second data and / or a hue of the display color as a display format of the second data, and a display section configured to display the processing route based on coordinate values ​​of the laser processing head calculated by the laser processing head coordinate calculator and the display formats set by the first display format setting section and the second display format setting section,wherein the display color of the first data and / or the hue of the display color of the first data is changed in accordance with the first data acquired by the first data acquisition section, and the display color of the second data and / or the hue of the display color of the second data is changed in accordance with the second data acquired by the second data acquisition section.

[0048] According to the second aspect, in the first aspect, the first data acquisition section is a laser output detection section (6) configured to detect a laser output value of the laser output from the laser processing head, and the second data acquisition section is a reflected light detection section (7) configured to detect reflected light reflected from the laser on the workpiece.

[0049] According to a third aspect, in the first aspect, the first data acquisition section is a laser output detection section (6) configured to detect a laser output value of the laser output from the laser processing head, and the second data acquisition section is a distance measuring unit (5) configured to measure a distance between the laser processing head and the workpiece.

[0050] According to the fourth aspect, the first aspect further includes a third data acquisition section (23c) configured to acquire third data related to laser processing, and a third display format setting section (24c) configured to set at least one of a display color of the third data and a hue of the display color as a display format of the third data, wherein the display section displays the processing route based on the coordinate values ​​of the laser processing head and the display formats set by the first display format setting section, the second display format setting section, and the third display format setting section, and at least one of the display color of the third data and the hue of the display color is changed according to the third data acquired by the third data acquisition section.

[0051] According to the fifth aspect of the aspect, in the fourth aspect, the first data acquisition section is a laser output detection section (6) configured to detect a laser output value of the laser output from the laser processing head, the second data acquisition section is a reflected light detection section (7) configured to detect reflected light reflected from the laser on the workpiece, and the third data acquisition section is a distance measuring unit (5) configured to measure a distance between the laser processing head and the workpiece.

[0052] According to a sixth aspect, the laser output command value of the laser processing head detected by the laser output detecting section, which is detected by a processing program, is an actual laser output command value of the laser processing head detected by a laser power sensor, or a difference between the laser output command value and the actual laser output value.

[0053] According to a seventh aspect, in any one of the first to sixth aspects, the position information acquired by the position information acquisition section is position information determined by a machining program for machining the workpiece with the laser, or position information determined by a position detector configured to drive the at least one drive shaft. Effects of the aspects

[0054] In the first aspect, since the machining route is displayed after setting the display formats of the first data and the second data according to the respective values ​​of the first data and the second data regarding laser machining, the relationship between the machining route and the first data and the second data is easy to recognize.

[0055] In the second aspect, the position of the laser processing head can be easily understood when the reflected light may damage the laser processing head or laser oscillator. Thus, damage to the laser processing head or laser oscillator can be avoided for a subsequent workpiece by locally reducing the laser output, etc.

[0056] In the third aspect, the position of the laser processing head can be easily understood when the laser processing head may collide with the workpiece. For a subsequent workpiece, collision of the laser processing head with the workpiece can be prevented by locally raising the position of the laser processing head relative to the workpiece or by pre-smoothing the workpiece.

[0057] In the fourth aspect, since the machining route is displayed after setting the display format of the third data according to the value of the third data related to laser processing, the relationship between the machining route and the third data can be recognized. This makes it possible to immediately determine which of the first to third data are the cause of the machining errors in the workpiece.

[0058] Fifth, when a machining error occurs in the workpiece, it can be immediately determined whether the cause of the machining error is the laser output, the reflected light, or the size of the gaps in addition to the location where the machining error occurred.

[0059] In the sixth aspect, the relationship between the laser output command value or the actual laser output value and the machining route can be easily seen.

[0060] In the seventh aspect, the position information determined by the machining program is the position command, and the position information determined by the position detector is the actual position. The relationship between the laser output and the machining route formed by the commanded position and the relationship between the laser output and the machining route formed by the actual position is easily recognized.

[0061] While embodiments of the present invention have been described above, it will be understood by those skilled in the art that various modifications and changes may be made therein without departing from the scope of the following claims.

Claims

[1] A machining route display device (20) for displaying a machining route in a laser machine (1) for laser machining a workpiece with a laser output from a laser machining head (8) while the laser machining head (8) and the workpiece are relatively moved with at least one drive shaft, the device comprising: a position information acquisition section (21) configured to acquire position information of the at least one drive shaft for each predefined control cycle; a laser processing head coordinate calculator (22) configured to calculate a coordinate value of the laser processing head (8) from the position information of the at least one drive shaft and the machine configuration information of the laser machine (1), a first data acquisition section (23a) configured to acquire first data relating to the laser processing, a second data acquisition section (23b) configured to acquire second data relating to the laser processing, a first display format setting section (24a) configured to set a display color of the first data and / or a hue of the display color as a display format of the first data, a second display format setting section (24b) configured to set a display color of the second data and / or a hue of the display color as a display format of the second data, and a display section (25) configured to display the processing route based on coordinate values ​​of the laser processing head (8) calculated by the laser processing head coordinate calculator (22) and the display formats set by the first display format setting section (24a) and the second display format setting section (24b), wherein the display color of the first data and / or the hue of the display color of the first data is changed in accordance with the first data acquired by the first data acquisition section (23a), and the display color of the second data and / or the hue of the display color of the second data is changed in accordance with the second data acquired by the second data acquisition section (23b). [2] The machining route display device (20) according to claim 1, wherein the first data acquisition section (23a) is a laser output detection section (6) configured to detect a laser output value of the laser output from the laser machining head (8), and the second data acquisition section (23b) is a reflected light detection section (7) configured to detect light reflected from the laser on the workpiece. [3] The machining route display device (20) according to claim 1, wherein the first data acquisition section (23a) is a laser output detection section (6) configured to detect a laser output value of the laser output from the laser machining head (8), and the second data acquisition section (23b) is a distance measuring unit (5) configured to measure a distance between the laser machining head (8) and the workpiece. [4] The machining route display device (20) according to claim 1, further comprising a third data acquisition section (23c) configured to acquire third data related to the laser machining, and a third display format setting section (24c) configured to set a display color of the third data and / or a hue of the display color as a display format of the third data, wherein the display section (25) displays the machining path based on the coordinate values ​​of the laser machining head (8) and the display formats set by the first display format setting section (24a), the second display format setting section (24b) and the third display format setting section (24c), and the display color of the third data and / or the hue of the display color is changed according to the third data acquired by the third data acquisition section (23c). [5] The machining route display device (20) according to claim 4, wherein the first data acquisition section (23a) is a laser output detection section (6) configured to detect a laser output value of the laser output from the laser machining head (8), the second data acquisition section (23b) is a reflected light acquisition section (7) configured to acquire light reflected from the laser on the workpiece, and the third data acquisition section (23c) is a distance measuring unit (5) configured to measure a distance between the laser processing head (8) and the workpiece. [6] The machining route display device (20) according to any one of claims 2, 3 and 5, wherein the laser output value obtained by the laser output detecting section (6) is a laser output command value of the laser machining head (8) obtained from a machining program (17), an actual laser output value of the laser machining head (8) obtained using a laser power sensor, or a difference between the laser output command value and the actual laser output value. [7] The machining route display device (20) according to any one of claims 1 to 6, wherein the position information obtained by the position information detecting section (21) is position information determined by a machining program (17) for machining the workpiece with the laser, or position information determined by a position detector configured to drive the at least one drive shaft.

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