Automatic adhesion and separation device

Abstract

An automatic adhesion and separation device (50) for automatically adhesion or separation between a wireless electrostatic chuck (100) and a thinned substrate (200), wherein the underside of the electrostatic chuck (100) is provided with conductive electrodes (63) by which an electrostatic field is generated, the adhesion and separation device (50) comprising: a frame (51, 52); a static electricity generating group (60) arranged on the frame (51, 52) and having a working plane for lying flat the electrostatic chuck (100), wherein the working plane is provided with a series of separately arranged suction parts (64) corresponding to the underside of the electrostatic chuck (100), wherein the working plane is provided with two or a multiple of two conductive electrodes (63) corresponding to the conductive electrodes (63) located on the underside of the electrostatic chuck (100) in order to generate or cancel the electrostatic field of the electrostatic chuck (100) by actuation, wherein the working plane is further provided with a guide rod group (66), wherein the guide rod group (66) comprises at least two fixed guide rods (660) and one movable guide rod (665) surrounding the outer circumference of the electrostatic chuck (100),wherein the electrostatic chuck (100) is pressed into the correct horizontal position of the fixed guide rods (660) by the movable guide rod (665), the guide rods (660, 665) being configured to position the electrostatic chuck (100) or the substrate (200) in the correct position of the work plane; , a substrate transfer group (80) arranged on the frame (51, 52) and opposite the static electricity generating group (60), wherein the substrate transfer group (80) and the static electricity generating group (60) are displaceable relative to each other so that the substrate transfer group (80) can attract a substrate (200) which is in the correct position; wherein, after the substrate (200) and the electrostatic chuck (100) have been pressed against each other by driving by means of the substrate transfer group (80), an electrostatic field for attracting the substrate (200) can be generated at the electrostatic chuck (100) by actuating the static electricity generating group (60).

Description

Field of the invention

[0001] The present invention relates to automatic clamping technology for electrostatic chucks and, in particular, to an automatic clamping and separating device. State of the art

[0002] In recent years, due to the miniaturization trend in semiconductor manufacturing, the thickness of the silicon wafer has been reduced to less than 100 micrometers. In addition, the thickness of the ultra-thin blue glass filter used for mobile phone camera lenses is close to 200 μm, 100 μm, or even less than 50 μm. When the area of this type of thinned substrate is larger, especially when the substrate has a diameter of 15.24 cm (6 inches) or more and a thickness of 300 μm or less, the thinned substrate becomes very soft and elastic, resulting in warpage. Warpage causes unevenness and stress on the substrate during the manufacturing process, leading to process defects such as uneven thickness during coating.Due to the warpage problem occurring in the substrate, effective focusing cannot be performed during inspection, resulting in detection errors or delays during inspection time, which directly impact the detection of defective products. In addition, the substrates also have problems such as low retention capacity and easy breakage during transportation and assembly. Therefore, substrate warpage has a significant adverse impact on the reliability of the manufacturing process and causes problems such as increased manufacturing costs and defect rates.

[0003] To keep the substrate flat and ensure a smooth transition into the manufacturing process, a temporary bonding process is currently used to reinforce the substrate tension. The temporary bonding process mainly uses multilayer polymer bonding materials to reversibly bond the substrate to a carrier. However, after the manufacturing process, the carrier must be peeled off. It is important to ensure good substrate yield during bonding and peeling. Furthermore, there are some problems encountered during the temporary bonding process, such as the mismatch of the thermal expansion coefficients (CTE) of the bonding materials used and the acid and alkali problems of the bonding materials in the manufacturing environment.

[0004] The current improved method for substrate tightening is to use an electrostatic chuck (e-chuck or supporter) during substrate fabrication. Currently, the electrostatic chuck is used manually for substrate tightening. However, this method has the problems of slow speed, poor tightening quality, and poor efficiency. Cracks or fragments may even occur due to misalignment, displacement, or uneven pressing.

[0005] Document US 2008 / 0 237 819 A1 describes a conventional handling technique for processing ultra-thin wafers in commercially available processing equipment for normal wafers. A carrier wafer and a wafer assembly are disclosed that allow efficient handling of thin or ultra-thin wafers. Object of the invention

[0006] It is an object of the present invention to provide an automatic bonding and separating device which can increase bonding efficiency, greatly reduce bond failure rate and minimize the occurrence of cracks or fragments.

[0007] It is another object of the present invention to provide an automatic adhesion and separation device by which an electrostatic chuck can quickly and accurately automatically attract a substrate, so that the electrostatic chuck and the substrate adhered thereto can be used in the subsequent manufacturing process, whereby the process yield of the substrates can be significantly increased.

[0008] The present invention solves the above-mentioned objects and achieves the advantageous effects mainly by the following technical means: The invention is for automatic adhesion or separation between a wireless electrostatic chuck and a thinned substrate, wherein the underside of the electrostatic chuck is provided with conductive electrodes by which an electrostatic field is generated, wherein the adhesion and separation device comprises: a frame; a static electricity generating group arranged on the frame and having a working plane for lying flat the electrostatic chuck, wherein the working plane is provided with a series of separately arranged suction parts corresponding to the underside of the electrostatic chuck, wherein the working plane is provided with two or a multiple of two conductive electrodes corresponding to the conductive electrodes located on the underside of the electrostatic chuck in order to generate or cancel the electrostatic field of the electrostatic chuck by actuation, wherein the working plane is further provided with a guide rod group, wherein the guide rod group comprises at least two fixed guide rods by which the lateral positions of the carrier are limited, and one movable guide rod,by which the carrier can be pushed sideways to engage the fixed guide rods, whereby the electrostatic chuck or the substrate can be positioned in the correct position of the working plane; a substrate transfer group arranged on the frame and opposite the static electricity generating group, wherein the substrate transfer group and the static electricity generating group are displaceable relative to each other so that the substrate transfer group can attract a substrate which is in the correct position.

[0009] After the substrate and the electrostatic chuck are pressed against each other by driving by the substrate transfer group, the electrostatic chuck can generate an electrostatic field for attracting the substrate by actuating the static electricity generating group. Brief description of the drawings Fig. Fig. 1 is a schematic view showing the appearance of the automatic bonding and separating device according to the present invention; Fig. Figure 2 shows a schematic side view of the automatic adhesion and separation device according to the invention; Fig. Fig. 3 is a schematic view showing the appearance of the static electricity generating group according to the present invention; Fig. 4 shows a schematic plan view of the static electricity generating group according to the invention; Fig. 5 shows a schematic view of the appearance of the substrate transfer group according to the invention; Fig. 6 shows a schematic partial bottom view of the substrate transfer group according to the invention; Fig. Figure 7 shows a schematic side view of the static electricity generating group according to the invention during material lifting; Fig. Fig. 8 is a schematic side view of the static electricity generating group according to the invention during alignment guidance; Fig. 9 is a schematic plan view of the static electricity generating group according to the present invention during alignment guidance; Fig. 10 is a schematic partial plan view of the static electricity generating group according to the invention during alignment guidance; Fig. 11 shows a schematic partial side view of the static electricity generating group according to the invention during separation. Detailed description of the embodiment

[0010] Referring to the Fig. 1 and Fig. 2, the automatic adhesion system for wireless electrostatic chucks according to the invention is used for automatic adhesion and separation between a wireless electrostatic chuck 100 (e-chuck or supporter) and a large-area thinned substrate 200 (based on a substrate with a diameter of 15.24 cm (6 inches) and a thickness of less than 300 µm), wherein the substrate 200 can be a semiconductor wafer, a glass plate, or a plastic plate. The adhesion and separation device 50 comprises a static electricity generating group 60 for attracting the electrostatic chuck 100 and a substrate transfer group 80 for attracting the substrate 200, which are displaceable relative to one another. The adhesion and separation device 50 comprises a frame attachable to the machine body 10, the frame having a lower frame 51 and an upper frame 52.The static electricity generating group 60 is arranged above the lower frame 51. By arranging a lifting-lowering mechanism 82 of the substrate transfer group 80 provided on the upper frame 52 correspondingly above the static electricity generating group 60, the substrate transfer group 80 can drive the substrate 200 so that it is pressed onto the surface of the electrostatic chuck 100 located above the static electricity generating group 60.

[0011] Referring to the Fig. 3 and Fig. 4, the static electricity generating group 60 comprises a main frame plate 61 and two side wing plates 65 pivotably arranged on two side edges of the main frame plate 61. The main frame plate 61 and the two side wing plates 65 form a working plane on which the electrostatic chuck 100 can lie flat. The main frame plate 61 of the working plane is provided with a detection element 610 for detecting whether the electrostatic chuck 100 or the substrate 200 is present. Furthermore, a material lifting element 62 is arranged in the main frame plate 61, the material lifting element 62 being displaceable between the working plane and a higher material receiving plane (as shown in FIGS. Fig. 7 and Fig. 8), which is convenient for the transfer device 20, such as the gripper of a robot arm, to be guided through the electrostatic chuck 100 or the substrate 200 and placed thereon or removed therefrom. The material lifting element 62 may consist of at least three synchronously raised and lowered lifting rods or a raised and lowered lifting plate. A telescopic cylinder 70 is arranged between the center of the outer lower edge of the two side wing plates 65 not belonging to the main frame plate 61 and the lower frame 51 in order to selectively actuate the outer side edges of the side wing plates 65, which do not belong to the two side wing plates 65 provided with a downwardly inclined outer side edge, so that they can be selectively tilted downwards (as in Fig. 11), and to cause the electrostatic chuck 100 and the substrate 200 adhered thereto to separate from each other along an outer edge. Furthermore, the main frame plate 61 and the side wing plates 65 are each provided with a series of suction parts 64 (such as vacuum chucks) corresponding to the bottom surface of the electrostatic chuck 100, for selectively fixing the electrostatic chuck 100 to the working plane of the main frame plate 61 and the side wing plates 65, respectively.The main frame plate 61 is provided with two or a multiple of two conductive electrodes 63 for supplying current, which correspond to the positive and negative conductive electrodes 63 located on the underside of the electrostatic chuck 100, so that an electrostatic field can be generated or canceled on the surface of the electrostatic chuck 100 with respect to the substrate 200, and thus the electrostatic chuck 100 and the substrate 200 can be adhered to or separated from each other. The two side wing plates 65 are each provided with a guide rod group 66, wherein the guide rod group 66 comprises at least two fixed guide rods 660 and at least one movable guide rod 665 surrounding the outer periphery of the electrostatic chuck 100.In the present invention, two fixed guide rods 660 and two movable guide rods 665 represent the main embodiment, wherein the electrostatic chuck 100 can be pressed into the correct horizontal position of the fixed guide rods 660 by the movable guide rods 665 (as shown in . Fig. 9). In addition, the upper periphery of each of the fixed guide rods 660 and 665 is provided with a sloped guide surface 661, 666 so that the electrostatic chuck 100 or the substrate 200 can be guided to the correct area of the work plane when the material lifting member 62 is lowered. Furthermore, a contact detection group 67 and an optical detection group 68 are arranged at a position of the static electricity generating group 60 corresponding to the outer circumference of the electrostatic chuck 100, wherein the contact detection group 67 comprises at least two retractable touch rods 670 surrounding the outer circumference of the electrostatic chuck 100 and at least one forward and backward slidable alignment guide rod 675, wherein the alignment guide rod 675 is engageable with a positioning notch 101, 201 of the electrostatic chuck 100 orof the substrate 200, so that the alignment guide rod 675 is rotated about the axis by means of the positioning notch 101, 201 of the electrostatic chuck 100 or the substrate 200 for alignment (as shown in . Fig. 10). An alarm may be triggered if the electrostatic chuck 100 or the substrate 200 is not aligned and comes into contact with one of the touch bars 670. The optical detection group 68 includes at least three optoelectronic elements 680 surrounding the outer periphery of the electrostatic chuck 100, which serve to trigger an alarm if the electrostatic chuck 100 or the substrate 200 is not aligned and obscures one of the optoelectronic elements 680. In this way, accurate alignment of the electrostatic chuck 100 and the substrate 200 can be ensured. As shown in Fig. 9, a blowing unit 69 is arranged on the lower frame of the static electricity generating group 60 at the positions corresponding to the two side wing plates 65, wherein each blowing unit 69 has a jet nozzle 690 extending from the outer circumference of the electrostatic chuck 100 in the axial direction (as shown in Fig. 11). When the electrostatic chuck 100 begins to separate and is driven by the two side wing plates 65 to peel off the substrate 200, a high-speed gas may be injected, whereby the electrostatic chuck 100 and the substrate 200 can be effectively separated from each other.

[0012] Referring to the Fig. 5 and Fig. 6, the substrate transfer group 80 consists of a frame base 81 that can selectively attract the substrate 200. The frame base 81 can be moved linearly up and down by a lifting-lowering mechanism 82 to selectively press the substrate 200 against the electrostatic chuck 100 located below it. The surface of the frame base 81 is provided with a detection element 810 for detecting the presence of a substrate 200. The frame base 81 has a suction surface, wherein the suction surface of the frame base 81 is provided with a plurality of suction parts 83, which may include the surface suction parts 830 located in the area corresponding to the substrate 200 or the edge suction parts 835 located near the edge of the substrate 200, wherein a suction technique based on Bernoulli's law may be used for the surface suction parts 830 in order to reduce possible damage to the substrate 200 during the adhesion process.Furthermore, an optical detection group 85 is arranged at a location on the substrate transfer group 80 corresponding to the outer circumference of the substrate 200. The optical detection group 85 comprises at least three optoelectronic elements 850 surrounding the outer circumference of the substrate 200. If the substrate 200 is not aligned and obscures one of the optoelectronic elements 850, an alarm can be triggered to ensure that the substrate 200 is accurately aligned. According to some embodiments, the circumference of the substrate transfer group 80 can be provided with a retractable and extendable waste protection element 86. When extended, the area covered by it is smaller than the outer diameter of the substrate 200.When the substrate 200 enters the suction surface of the substrate transfer group 80, the waste protection member 86 may be extended to prevent the substrate 200 from falling due to ineffective suction and to ensure that the substrate 200 is effectively sucked by the substrate transfer group 80. The waste protection member may then be retracted. According to some embodiments, the substrate transfer group 80 may be a robotic arm capable of grasping the substrate 200 relative to the static electricity generating group 60.

[0013] In this way, an automatic adhesion system is constructed by which the electrostatic chuck 100 and the substrate 200 can be automatically adhered to or separated from each other.

[0014] It is based on the Fig. 1, Fig. 2, Fig. 3 and Fig. 4. In actual operation, the electrostatic chuck 100 is placed by means of the transfer device 20 on the working plane of the main frame plate 61 and the side wing plates 65 of the static electricity generating group 60 (as shown in the Fig. 7 and Fig. 8). To ensure that the electrostatic chuck 100 is positioned exactly in the specified orientation and position, the touch detection group 67 and the optical detection group 68 are used (as shown in the Fig. 8 and Fig. 9). Subsequently, the static electricity generating group 60 can fix the electrostatic chuck 100 by means of the suction parts 64. As shown in the Fig. 5 and Fig. As shown in Figure 6, the substrate 200 is placed on the underside of the substrate transfer group 80 by means of the transfer device 20. To ensure that the substrate 200 is positioned precisely in the specified orientation and position, the touch detection group 84 and the optical detection group 85 are used. Subsequently, the substrate transfer group 80 can fix the substrate 200 using the suction parts 83, with the electrostatic chuck 100 and the substrate 200 facing each other in the same specified orientation and position.

[0015] It is based on the Fig. 7 to 10. After the electrostatic chuck 100 and the substrate 200 are fixed in the same specified orientation and position on opposite surfaces, the substrate 200 is driven by the substrate transfer group 80 to be linearly displaceable relative to the electrostatic chuck 100 of the static electricity generating group 60, so that the substrate 200 can be attached to the surface of the electrostatic chuck 100 in the same specified orientation and position with the outer peripheries of the two completely overlapping.After the electrostatic chuck 100 and the substrate 200 are adhered to each other, the static electricity generating group 60 may be electrically connected to the electrostatic chuck 100 so that an electrostatic field can be generated at the electrostatic chuck 100 with respect to the substrate 200, thus completing the work of the electrostatic chuck 100 for electrostatically attracting the substrate 200.

[0016] Furthermore, the substrate 200 and the electrostatic chuck 100, which are adhered to each other, can also be separated from each other. The electrostatic chuck 100 adhered to the substrate 200 is placed and fixed on the static electricity generating group 60, and the substrate transfer group 80 is linearly displaced and fixed to the surface of the substrate 200 not belonging to the electrostatic chuck 100. Subsequently, the electrostatic field of the electrostatic chuck 100 is canceled by the static electricity generating group 60, so that the static electricity of the electrostatic chuck 100 is discharged and the substrate 200 can be separated. The substrate 200 is driven by the backward displacement of the substrate transfer group 80 to be separated from the electrostatic chuck 100.Finally, the electrostatic chuck 100 and the substrate 200 are placed by means of the opposite transfer device 20 in the material inlet and outlet opening of the carrier 18 and the material inlet and outlet opening of the substrate 16, respectively. It is shown on , Fig. 11. According to some embodiments, after the electrostatic chuck 100 is discharged, the outer periphery of the electrostatic chuck 100 may be moved downward so that the outer periphery of the electrostatic chuck 100 may be preliminarily peeled from the substrate 200 to form an opening. Subsequently, a high-speed gas is injected from the outer periphery of the electrostatic chuck 100 via the jet nozzle 690 of a blowing unit 69, so that the electrostatic chuck 100 and the substrate 200 can be effectively separated from each other. List of reference symbols 100 electrostatic chuck 200 substrate 50 Adhesive and separating device 51 lower frame 52 upper frame 60 static electricity generating group 61 Main frame plate 62 Material lifting element 620 detection element 63 conductive electrode 64 Suction part 65 Side wing plate 66 Command Staff Group 660 fixed guide rod 661 inclined guide surface 665 movable guide rod 666 inclined guide surface 67 Touch detection group 670 touch bar 675 Alignment guide rod 68 optical detection group 680 optoelectronic element 69 Blow unit 690 jet nozzle 70 drive element 80 Substrate transfer group 81 frame base 810 Detection element 82 Lifting and lowering mechanism 83 Suction part 830 Surface suction part 835 edge suction part 85 optical detection group 850 optoelectronic element 86 Waste protection element

Claims

[1] An automatic adhesion and separation device (50) for automatically adhesion or separation between a wireless electrostatic chuck (100) and a thinned substrate (200), the underside of the electrostatic chuck (100) being provided with conductive electrodes (63) by which an electrostatic field is generated, the adhesion and separation device (50) comprising: a frame (51, 52); a static electricity generating group (60) arranged on the frame (51, 52) and having a working plane for lying flat the electrostatic chuck (100), wherein the working plane is provided with a series of separately arranged suction parts (64) corresponding to the underside of the electrostatic chuck (100), wherein the working plane is provided with two or a multiple of two conductive electrodes (63) corresponding to the conductive electrodes (63) located on the underside of the electrostatic chuck (100) in order to generate or cancel the electrostatic field of the electrostatic chuck (100) by actuation, wherein the working plane is further provided with a guide rod group (66), wherein the guide rod group (66) comprises at least two fixed guide rods (660) and one movable guide rod (665) surrounding the outer circumference of the electrostatic chuck (100),wherein the electrostatic chuck (100) is pressed into the correct horizontal position of the fixed guide rods (660) by the movable guide rod (665), the guide rods (660, 665) being configured to position the electrostatic chuck (100) or the substrate (200) in the correct position of the work plane; a substrate transfer group (80) arranged on the frame (51, 52) and opposite the static electricity generating group (60), wherein the substrate transfer group (80) and the static electricity generating group (60) are displaceable relative to each other so that the substrate transfer group (80) can attract a substrate (200) which is in the correct position; wherein, after the substrate (200) and the electrostatic chuck (100) have been pressed against each other by driving by means of the substrate transfer group (80), an electrostatic field for attracting the substrate (200) can be generated at the electrostatic chuck (100) by actuating the static electricity generating group (60). [2] Automatic adhesion and separation device (50) according to claim 1, wherein the working plane consists of a main frame plate (61) and two side wing plates (65) pivotally arranged on two side edges of the main frame plate (61), wherein the end of the respective side wing plate (65) not belonging to the main frame plate (61) is selectively displaceable downwards. [3] Automatic bonding and separating device (50) according to claim 2, wherein a selectively raiseable and lowerable material lifting element (62) is arranged in the main frame plate (61), the material lifting element (62) being displaceable between the working level and a higher material receiving level. [4] Automatic adhesion and separation device (50) according to claim 1, wherein the upper periphery of a respective fixed guide rod (660) and the movable guide rod (665) is each provided with an inclined guide surface (661, 666). [5] The automatic adhesion and separation device (50) according to claim 1, wherein a contact detection group (67) is arranged at a position of the static electricity generating group (60) corresponding to the outer circumference of the electrostatic chuck (100), the contact detection group comprising at least two retractable contact rods (670) surrounding the outer circumference of the electrostatic chuck (100) and at least one alignment guide rod (675) which can be moved forward and backward, the alignment guide rod (675) corresponding to a positioning notch (101, 201) of the electrostatic chuck (100) and the substrate (200) and can be aligned accordingly. [6] The automatic bonding and separating device (50) according to claim 1 or 5, wherein an optical detection group (68) is arranged at a position of the static electricity generating group (60) corresponding to the outer circumference of the electrostatic chuck (100), the optical detection group (68) comprising at least three optoelectronic elements (680) surrounding the outer circumference of the electrostatic chuck (100) for triggering an alarm when the electrostatic chuck (100) or the substrate (200) is not aligned and obscures one of the optoelectronic elements (680). [7] Automatic adhesion and separation device (50) according to claim 2, wherein in the static electricity generating group (60), a blowing unit (69) is arranged at the positions corresponding to the two side wing plates (65), wherein each blowing unit (69) has a jet nozzle (690) extending from the outer circumference of the electrostatic chuck (100) in the axial direction. [8] The automatic adhesion and separation device (50) according to claim 1, wherein the substrate transfer group (80) comprises a frame base (81), the surface of the frame base (81) being provided with a plurality of suction parts (83) including the surface suction parts (830) located in the area corresponding to the substrate (200) or the edge suction parts (835) located near the edge of the substrate (200), wherein a suction technique based on Bernoulli's law is used for the surface suction parts (830). [9] Automatic adhesion and separation device (50) according to claim 1 or 8, wherein an optical detection group (85) is arranged at a position of the substrate transfer group (80) corresponding to the outer circumference of the substrate (200), the optical detection group (85) comprising at least three optoelectronic elements (850) surrounding the outer circumference of the substrate (200). [10] Automatic adhesion and separation device (50) according to claim 1, wherein the periphery of the substrate transfer group (80) is provided with a retractable and extendable waste protection element (86), the area covered by it when extended being smaller than the outer diameter of the substrate (200).

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