Protective element application device and protective element application method for applying a thermoplastic film
The protector mounting device and method address wrinkling and sagging issues by using a pressure reduction chamber and controlled heating to securely attach a thermoplastic resin film to a substrate with protrusions and recesses, ensuring adhesion without adhesive residue.
Patent Information
- Application Number
- DE102022201029
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2021-02-09
- Filing Date
- 2022-02-01
- Publication Date
- 2025-07-31
- Estimated Expiration
- 2042-02-01
AI Technical Summary
Existing methods for attaching a film without an adhesive layer to a substrate, such as a semiconductor wafer, face issues with wrinkling and sagging due to pressure differences and high temperatures, leading to adhesive residue and poor adhesion.
A protector mounting device and method using a pressure reduction chamber with a separable upper and lower case, a support table, and a heating unit to soften the film, controlled by a pressure difference to ensure close contact with the substrate, utilizing a transition fixing portion with a resin layer and ventilation holes to prevent wrinkling.
The method effectively attaches a thermoplastic resin film to a substrate with protrusions and recesses without an adhesive layer, preventing wrinkling and ensuring secure adhesion by controlling pressure and temperature to achieve uniform contact.
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Abstract
Claims
[1] A protective element attachment device (1) for attaching a thermoplastic film (210) to a front surface (201) of a substrate (200) having projections and recesses (202) on the side of the front surface (201), the protective element attachment device (1) comprising: a pressure reduction chamber (10) having an upper housing (11) and a lower housing (12) separable from the upper housing (11), wherein a pressure reduction unit (13, 14) and a unit for opening to atmospheric air are connected to the upper housing (11) and the lower housing (12), respectively; a support table (20) provided in the lower housing (12) and to which the substrate (200) is attached; a film fixing portion (30) for fixing the film (210) in such a manner that an interior of the pressure reduction chamber (10) is divided into the upper case (11) side and the lower case (12) side when the upper case (11) and the lower case (12) are connected; a heating unit (40) which heats the film (210) to soften the film (210); and a control unit (50) which controls the pressure reduction chamber (10) and the heating unit (40) to reduce pressures in the upper housing (11) and the lower housing (12), and then softens the film (210) and brings it into close contact with the substrate (200) attached to the support table (20) by a pressure difference which is generated by opening the upper housing (11) to the atmospheric air, wherein the film fastening section (30) comprises: an outer periphery fixing portion (31) fixing an outer periphery of the film (210), and a transitional fixing portion (31) which holds the portion of the film (210) facing the support table (20) from the side of the upper case (11) and temporarily fixes the film (210) to the substrate (200) mounted on the support table (20) through a gap between the film (210) and the substrate (200), and the transition fixing portion (31) is a support plate (34) provided on a lower surface thereof with a plastic layer (33) for holding the film (210) by an adhesive force, and the plastic layer (33) and the support plate (34) are formed with ventilation holes (35). [2] The protective member attaching device (1) according to claim 1, wherein the heating unit (40) heats the support table (20). [3] A protective element attachment method for attaching a thermoplastic resin film (210) to a front surface (201) of a substrate (200) having projections and recesses (202) on the side of the front surface (201), using a protective element attachment device (1), the protective element attachment device (1) comprising: a pressure reduction chamber (10) comprising an upper housing (11) and a lower housing (12) separable from the upper housing (11), wherein a pressure reduction unit (13, 14) and a unit for opening to atmospheric air are connected to the upper housing (11) and the lower housing (12), respectively, a support table (20) provided in the lower housing (12) and to which the substrate (200) is attached, a film fixing portion (30) that fixes the film (210) in such a manner that an interior of the pressure reduction chamber (10) is divided into the upper case (11) side and the lower case (12) side when the upper case (11) and the lower case (12) are connected; a heating unit (40) which heats the film (210) to soften the film (210); and a control unit (50) which controls the pressure reduction chamber (10) and the heating unit (40) to reduce pressures in the upper housing (11) and the lower housing (12), and then softens the film (210) and brings it into close contact with the substrate (200) attached to the support table (20) by a pressure difference which is generated by opening the upper housing (11) to the atmospheric air, wherein the film fastening section (30) comprises: an outer periphery fixing portion (31) fixing an outer periphery of the film (210), and a transitional fixing portion (31) that holds the portion of the film (210) facing the support table (20) from the side of the upper case (11) and temporarily fixes the film (210) to the substrate (200) attached to the support table (20) through a gap between the film (210) and the substrate (200), and wherein the transitional fixing portion (31) is a support plate (34) provided on a lower surface thereof with a plastic layer (33) for holding the film (210) by an adhesive force, wherein the plastic layer (33) and the support plate (34) are formed with ventilation holes (35), wherein the protective element attachment method comprises: a heating step (101) of operating the heating unit (40); a preparation step (102) of attaching the film (210) to the film attaching portion (30) and attaching the substrate (200) to the support table (20); a pressure reduction step (103) of connecting the upper case (11) and the lower case (12) and reducing pressures within the upper case (11) and the lower case (12) in a state in which the film (210) held by the transition fixing portion (31) on an upper side of the substrate (200) faces the substrate (200) after the heating step (101) and the preparation step (102) have been performed; and a step for closely contacting (104) the film (210), causing the pressure inside the upper case (11) to approach atmospheric pressure to set a difference in atmospheric pressure between the inside of the upper case (11) and the inside of the lower portion to be equal to or greater than a predetermined value, thereby causing the film (210) to be separated from the transition fixing portion (31) and brought into close contact with the substrate (200) after the pressure reducing step (103) has been carried out. [4] The protective member mounting method according to claim 3, wherein the step of closely contacting (104) the film (210) comprises: a preliminary close contact step (104-1) of causing the interior of the upper case (11) to approach atmospheric pressure and bringing a center of the film (210) into close contact with the substrate (200), and a final close contact step (104-2) of bringing the inside of the upper case (11) to atmospheric pressure to enlarge an area of close contact of the film (210), which was brought into close contact with the substrate (200) in the preliminary close contact step, from the center to the outside of the film (210).
Citation Information
Patent Citations
Processing method of wafer
JP2019201016A
JP002019201016A