Pack comprising at least two contacts for microtechnology, method for handling a pack and tool for carrying out a method for handling a pack

Abstract

Packing (10) comprising at least two contacts (11) for microtechnology, wherein the contacts (11) each have a contacting surface (12), wherein the contacts (11) are connected to at least one support structure (13) and wherein the contacts (11) are spaced apart from each other and arranged such that the contacting surfaces (12) are arranged in one plane and pointing in the same direction, wherein the support structure (13) is made of a connecting material that can be cut and / or destroyed by a laser, characterized by that the contacts (11) are designed to be so flat that the contacts (11) are significantly smaller in one vertical spatial direction than in the other two spatial directions, and that the contacts (11) are arranged parallel to each other such that side surfaces which limit the height-spatial direction are aligned parallel to each other.

Description

[0001] The invention relates to a package comprising at least two contacts for microtechnology, a method for handling the package comprising at least two contacts for microtechnology and a tool for carrying out the method for handling the package comprising at least two contacts for microtechnology.

[0002] Due to the small size of microstructures, the handling and manufacturing of electronic components is particularly complex and requires high precision. The placement of contacts, in particular, must be exact, otherwise parts of the electronic component will be short-circuited or insufficiently connected due to the incorrectly placed contact, and will not function as expected. Correction is usually impossible, rendering the electronic component unusable. If the placement is not precise, a large number of defective parts are the result. However, precise placement is time-consuming.

[0003] From US patent 5 662 822 A, it is known to arrange flat contacts with their narrow sides facing each other and next to each other to form a package with a connecting support structure, to place the package on a chip, to secure it, and to cut the support structure using a laser.

[0004] From JP H04-284 650 A, it is known to design a packing with contacts for a chip with recesses and to connect them by means of an integrally designed support structure, wherein the recesses in the contacts are intended to ensure retention in a potting material. In one embodiment, it is provided that the support structure is destroyed by means of a laser. The contacts are designed to be flat, with the support structure connecting the narrow sides of the contacts to each other.

[0005] US Patent 5,336,564 A discloses a method for producing a support structure from a resin, in which the entire circuit, including contacts, is immersed in a bath of molten resin and the resin is cured using a laser. Since the support structure is non-conductive, it can remain attached to the contacts.

[0006] From JP H03-116 746 A, a TAB adhesive tape is known to which contacts can be attached. The tape is made of an insulating material, so separation is not necessary. The contacts are flat and are attached to the tape with their wide side facing each other, so that their narrow sides are aligned.

[0007] From EP 1 316 999 A1, a package of contacts is known, each connected to the other by small bridges. Preferably, the bridges can be cut by means of a laser. The contacts are flat, with the bridges connecting the narrow sides of the contacts.

[0008] There is therefore a great need for an accelerated, yet still precise, method for the provision and placement of contacts, which can save time and process costs without compromising the quality of the electronic components.

[0009] The invention therefore aims to provide contacts in a way that allows for simultaneous yet precise placement of the contacts, thereby saving time. This method can still be carried out with the usual high precision.

[0010] This problem is solved in a surprisingly simple but effective way by a package comprising at least two contacts according to claim 1, a method for placing these contacts according to claim 13 and a tool for carrying out this method according to claim 16.

[0011] According to the invention, a packing comprising at least two contacts for microtechnology is proposed, wherein the contacts each have a contact surface, and wherein the contacts are connected to at least one support structure, and wherein the contacts are spaced apart from one another and arranged such that the contact surfaces are arranged in one plane pointing in the same direction. Furthermore, the support structure is made of a bonding material that can be cut and / or destroyed by a laser.

[0012] The packaging is characterized in that the contacts are designed to be so flat that the extent of the contacts in one spatial direction, namely the height, is significantly smaller than in the other two spatial directions, and are arranged parallel to each other in such a way that side surfaces which limit the height are aligned parallel to each other.

[0013] The invention is based on the fundamental idea that, in microtechnology electronic components, the contacts are typically arranged at predefined distances from one another at predefined locations on the electronic component. The position of these predefined locations is determined in advance by the design of the electronic component. Within the scope of the invention, it has been discovered that the predefined locations have a fixed distance from one another to enable compatibility with as many electronic components as possible. The predefined locations are arranged in a plane and oriented in one direction.This means that if at least two contacts are positioned at a defined distance from each other prior to mounting on the electronic component, a distance corresponding to the distance between predefined locations on the electronic component, the precise alignment of one contact is sufficient to also precisely and correctly align at least one other contact. This consequently saves time because multiple contacts can be precisely aligned simultaneously.

[0014] The flat design of the contacts allows them to be positioned at the preferred distance from one another. Typically, the predefined points that determine the contact spacing are arranged next to each other, and the contacts are later intended to be arranged parallel to each other at these points. Therefore, it is advantageous for the contacts to be flat and arranged parallel to each other. Particularly preferred are the contacts designed as extruded bodies, especially prisms, with the extrusion occurring in the vertical direction.

[0015] The precise distance according to the invention is ensured by the support structure, which stabilizes the contacts at fixed distances from each other and enables the contacts to move together.

[0016] After assembly, however, it is necessary to remove the support structure, as otherwise an unwanted short circuit will occur between the at least two contacts, impairing the function of the electronic component. Since the structures in microtechnology are very small, the separation and / or destruction of the support structure must be carried out with high precision. A laser beam is characterized by its coherent light and high intensity, making it possible to deliver energy precisely and in a targeted manner. Due to the small size of the structures in microtechnology, the laser enables the targeted and precise separation and / or destruction of the laser-destructible support structure without damaging other areas of the package, especially the contacts, and / or the electronic component.In microelectronics, a contact serves to establish an electrically conductive connection, for example, with another electronic component or an electrical conductor. For this purpose, the contacts must be attached to the electronic component at predefined locations, which are generally arranged at predefined intervals. These predefined locations are connected to an internal circuit of the electronic component, which enables its functionality. In addition to or instead of an electrical connection, some contacts can establish a mechanical connection with another electronic component. Typically, the contacts are designed to allow for the simple insertion of a contact from another electronic component. Other contact designs are also possible.

[0017] The package comprises at least two contacts, which are to be placed and mounted simultaneously. Preferably, the package comprises at least 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, or 100 contacts. The contacts have a contact surface that serves to be electrically and / or mechanically connected to the electronic component at predefined locations. Therefore, it is necessary that the at least two contacts with the contact surface are arranged such that the contact surfaces lie in one plane, point in the same direction, and are arranged at the predefined distance. In this way, the contacts can be placed simultaneously on two or more adjacent predefined locations of the electronic component.To ensure this alignment and the spacing of the contacts throughout handling, the packaging incorporates a support structure. This support structure serves to fix the contacts together so that the contact surfaces remain in the same plane and facing in the same direction, while also maintaining the correct spacing. Suitable materials possessing both the required separability and / or destructiveness as well as the necessary stability are known to those skilled in the art. Suitable materials include, in particular, metals and metal alloys. A suitable method for separability and / or destruction using a laser is described elsewhere.

[0018] Preferably, the connecting material has a thermal conductivity of at least 10 W / mK. Within the scope of the invention, it has been recognized that several methods for applying contacts to the electronic component are used in microtechnology. These methods require heat or are heat-induced to create the connection between the electronic component and the contact during assembly. Applying heat to all contacts is complex. Within the scope of the invention, it has been recognized that the support structure is fundamentally suitable for conducting heat from one contact to another. For this purpose, the support structure is made of a material that has a thermal conductivity of at least 10 W / mK. The heat can then be transferred from one contact to all other contacts of the package, so that all contacts can be sufficiently heated when one of the contacts is heated.This enables not only the simultaneous placement but also the simultaneous attachment of all contacts of the package to the electronic component. The support structure also serves the additional function of conducting the heat required for the contact connection process during assembly to all contacts of the package. To achieve this, the support structure is made of a bonding material with a thermal conductivity of at least 10 W / mK. Given the small size of structures in microtechnology, this is a sufficiently high thermal conductivity, although a higher thermal conductivity is preferred.

[0019] The term "pack" refers to a mutually agreed and ordered group of at least two contacts.

[0020] The term "contact" refers to a conductive component that serves to electrically and / or mechanically connect one electronic component to another electronic component or an electrical conductor.

[0021] The term "support structure" refers to a structure that establishes at least two contacts in a suitable manner.

[0022] The term "connecting material" refers to the material from which the support structure is made.

[0023] The packing according to the invention makes it possible to integrate several contacts simultaneously into an electronic component in microtechnology, since the contacts can be placed and connected to the electronic component at the same time. This results in significant time and cost savings.

[0024] Advantageous further developments of the invention, which can be implemented individually or in combination, are presented in the dependent claims.

[0025] It is conceivable that the contacts are made of a contact material where the connecting material has a lower burning and / or melting point than the contact material. As described above, it is necessary to cut and / or destroy the support structure after mounting the contacts on the electronic component in order to eliminate the short circuit between two contacts created by the support structure. This is achieved, for example, by burning and / or melting the support structure. To avoid impairing the functionality of the contacts during this process, it is advantageous if the connecting material of the support structure has a lower burning and / or melting point than the contact material.

[0026] Alternatively, it is conceivable that the connecting material and the contact material are identical and therefore have identical properties, in order to enable quick and easy production of the packing according to the invention.

[0027] Furthermore, it is conceivable that the contacts are identically designed. Identical contact designs allow for simple and predictable handling. Different contact designs allow for targeted adaptation of the contacts to the electronic component into which they will later be used. It is conceivable that a package contains at least one first set of contacts, i.e., a first number of contacts, in a first configuration, and at least one second set of contacts, i.e., a second number of contacts, in a second configuration. For example, the first set of contacts could comprise identically designed contacts, and the second set of contacts could also comprise identical contacts, but with different configurations compared to the first set.

[0028] It is also conceivable that the contacts are oriented the same and / or differently. The contacts are arranged such that the contact surfaces are aligned in one plane and point in the same direction. However, this allows the contacts to be rotated relative to each other about an axis perpendicular to this plane, and / or to be moved parallel to each other within this plane. If the contacts are oriented the same, they can be moved into each other by a simple movement within the plane, without requiring any rotation of the individual contacts. If they are oriented differently, a rotation within the plane is necessary to move the contacts into each other. It is particularly preferred that the contacts are oriented differently relative to each other. Most preferably, the contacts are oriented rotated 180° relative to each other.It is also conceivable that in packages having three or more contacts, a first part of the contacts is aligned in the same way, and a second part of the contacts is aligned in the same way, and the first part is aligned differently with respect to the second part.

[0029] In a further embodiment of the invention, it is conceivable that at least one contact comprises at least one recess. Preferably, at least 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, or 100 contacts, and in particular all contacts, of the packing comprise at least one recess. Even more preferably, at least one contact comprises 2, 3, 4, 5, 6, 7, 8, 9, or 10 recesses of identical or different shapes. The shape of the recess is essentially arbitrary; a rectangular shape is particularly preferred. Part of the support structure can be incorporated into the recess, so that the contacts are connected to the support structure in a simple but reliable way and can be fixed by it.

[0030] Furthermore, it is conceivable that the support structure comprises at least one web. A web is an elongated component, preferably round or rectangular. A web is simple to manufacture, yet effective as a support structure. It is conceivable that the web is at least partially arranged in at least one recess described elsewhere in one, two, several, or all contacts. It is even more preferably conceivable that the web is arranged laterally on the contacts.

[0031] It is also conceivable that the support structure comprises at least one block, wherein the block is arranged between two contacts. A block is a polyhedron, preferably a restricted polyhedron and / or a polyhedron constructed from cuboids. Particularly preferably, the block is a cuboid. A first contact is arranged at least on a first face of the block, and a second contact is arranged on at least a second face of the block, the second face preferably being opposite the first face. A block is preferably applied to a contact, in particular a face of the contact.

[0032] In a further development, it is conceivable that the package comprises at least three contacts and that the support structure is designed in multiple parts with a first part, wherein the first part of the support structure is connected to two contacts. This means that the first part of the support structure is connected to only two of the three contacts. It is conceivable that the first part is a block. Preferably, the first part is arranged between two adjacent contacts. Alternatively, it is conceivable that the first part is connected to two non-adjacent contacts. This is particularly possible if at least two of the three contacts have different designs and / or different orientations.

[0033] It is conceivable that the support structure is bonded to the contacts by a material bond and / or is monolithic with the contacts. A material bond and / or a monolithic design guarantees a secure connection between the support structure and the contacts, ensuring optimal contact stability and heat transfer from the support structure to the contacts.

[0034] The term "monolithic" refers to an object that is designed as a single, coherent piece without joints and cannot be separated without destruction.

[0035] In a further development of the invention, it is conceivable that the packing is built up layer by layer. It is preferred that, to shape the contact, a mask is first applied to a suitable structure and / or substrate using photolithography, and then a first contact is produced using ion plating. The photoresist forming the mask is removed along with the excess coating, and then another mask is produced using photolithography, and the support structure is formed using ion plating. The photoresist of the support structure mask is removed along with the excess coating, and another mask is produced for a further contact. These steps are repeated until the desired number of contacts in the packing is achieved. Due to the layer-by-layer construction, the packing can be manufactured quickly, easily, and precisely.

[0036] In a further embodiment of the invention, it is conceivable that the packing has a length, width, and / or height of no more than 2500 µm. As described above, the packing is intended for use in microtechnology. Such dimensions correspond to those used in microtechnology.

[0037] It is assumed that the definitions and / or explanations of the above-mentioned terms apply to all aspects described below in this description, unless otherwise stated.

[0038] According to the invention, a method for handling a package described elsewhere is further proposed, which comprises the following steps: a. Picking up the package by means of a gripper comprising at least two jaws, wherein the jaws each grasp the package on an outer side surface of the outermost contacts or on side surfaces of a contact of the package; b. Heating at least one of the contacts of the pack by means of heat transfer via the jaws to at least one of the contacts or the side surfaces of the outer contacts and bonding the contact surfaces of all contacts of the pack; c. Cutting and / or destroying the support structure using a laser.

[0039] Within the scope of the invention, it has been recognized that simultaneous processing of the contacts, in particular simultaneous bonding of the contacts of the package, saves time. This is achieved by handling several contacts simultaneously. The advantage is particularly evident because the predefined locations of the electronic components, where the contacts are attached, generally have a predefined distance and orientation relative to one another. Therefore, it is possible to pre-arrange the contacts at this distance during manufacturing using the support structure. In this way, it is possible to pick up several contacts simultaneously, which can then be precisely positioned at the various predefined locations by precisely positioning the first contact. The support structure according to the invention allows for the simultaneous heating of all contacts by heating only one contact at a time.However, the support structure causes a short circuit that impairs the functionality of the electronic component. Therefore, the support structure must be destroyed in a final step.

[0040] A laser beam is characterized by its coherent light and high intensity, making it possible to deliver energy precisely and in a targeted manner. Due to the small structures involved in microtechnology, the laser enables the targeted cutting and / or destruction of the support structure without damaging other areas of the package, especially the contacts, and / or the electronic component.

[0041] First, the package is picked up using a suitable tool, namely a gripper. After picking it up, the package can be transported using the tool, specifically to the electronic component into which it is to be installed. In the next step, which can occur before, during, and / or after transporting the package to the predefined locations, the package is heated in preparation for bonding. During this process, the contact surfaces of the contacts are brought into contact with the predefined locations and / or with materials applied there that facilitate bonding. Subsequently, the support structure is destroyed and / or cut away.

[0042] Gripping with a gripper is a manageable method for picking up the package. The package can be gripped by the outer surfaces of the outermost package, as this is a particularly simple and quick method from a process engineering perspective. Alternatively, the package can be gripped by one of the contacts, which allows for particularly precise placement of the package, since the gripper jaws prevent the shifting or damage of already placed packages or contacts.

[0043] The contacts are heated by heating one or more of the jaws and transferring the heat to one or more contacts via the jaws. This offers the advantage that heating can occur during transport to the predefined location and, if a laser is used for heating, prevents damage to the support structure before bonding. Preferably, the gripper is designed as a two-jaw parallel gripper. It is conceivable that one or both jaws can be driven to enable gripping of a contact or a package, for example, by a combination of form and / or force.

[0044] Preferably, the heating in step b. is also carried out using a laser. The laser allows for targeted and localized heating of the packing at at least one contact without damaging other areas of the packing, particularly the contacts, and / or the electronic component. In a preferred embodiment, the laser beam is directed precisely at at least one of the contacts during heating.

[0045] The term "bonding" refers to the formation of a permanent electrical and / or mechanical connection between a contact and a predefined location of an electronic component.

[0046] The term "separation" refers to the process in which the supporting structure is divided and / or split into two or more parts.

[0047] The term "destruction" refers to the process of damaging the support structure, causing it to lose its functionality. The functionality of the support structure is to establish the connections between its components.

[0048] In a further development of the process, it is conceivable that the separation and / or destruction of the support structure in step c. is achieved by ablation using a laser. Ablation is a simple, fast, and precise method for separating and / or destroying the support structure.

[0049] In the context of lasers, the term "ablation" refers to a process in which the support structure is removed using a laser. The laser energy is directed precisely, particularly in pulsed mode, onto the material, causing it to vaporize or be removed in the form of particles. During this process, the surface of the support structure's bonding material is briefly heated to such a high temperature that the electrons forming the chemical bond within the bonding material are excited to thermal vibrations. This causes the electrons to break the chemical bond and escape the bonding material. This can lead to material spalling due to a Coulomb explosion, which further accelerates the ablation process.

[0050] It is also conceivable that the bonding in step b. is carried out by soldering, in particular by means of a previously applied solder deposit. It is preferably conceivable that the solder deposit is applied to the predefined locations of the electronic component and melted by the heat applied to the packing by the contacts, which also extends to the contact surfaces, when the packing is placed on the predefined locations. Soldering is a simple but effective method for permanently connecting the contacts to the electronic component at the predefined locations, both electrically and mechanically.

[0051] According to the invention, a tool for carrying out a method described elsewhere is proposed, wherein the tool comprises a gripper, the gripper comprising at least two jaws. The tool is characterized in that at least one of the jaws includes a heat transfer area. The heat transfer area enables the heating of at least one contact while the gripper holds the package. A laser beam is directed onto the heat transfer area, and the heat is transferred via the jaw to the contact that the jaw touches. This has the advantage of preventing damage to the support structure before bonding.

[0052] The term "jaw" refers to the part of the gripper that comes into direct contact with the object being gripped, i.e., the contact or package, during the gripping process. The jaw can be replaceable and may be equipped with special friction linings to increase static friction. In particular, a jaw can be designed as a gripping finger, which, in conjunction with at least one other gripping finger, serves to hold the package or contact. At least one of the jaws is movably mounted about an axis. The jaw preferably has a shape adapted to its function. It is particularly preferred that the jaw be flat and / or tapered.

[0053] The term "heat transfer area" refers to a surface or part, in particular an exposed surface or part, on a jaw which can be heated by means of a laser and is suitable for transferring the heat introduced by the laser to a contact or a packing of several contacts.

[0054] Further details, features, and advantages of the invention will become apparent from the following description of the preferred embodiments in conjunction with the dependent claims. The respective features can be implemented individually or in combination with one another. The invention is not limited to the embodiments shown. The embodiments are illustrated schematically in the figures. Identical reference numerals in the individual figures denote identical or functionally equivalent elements, or elements that correspond to one another with respect to their function.

[0055] Specifically, we show: Fig. 1 an isometric view of a first packing according to the invention; Fig. 2 a top view and a front view of a second embodiment of a packing according to the invention; Fig. 3 an isometric view of a third embodiment of a packing according to the invention; Fig. 4 a side view, a front view and a top view of a fourth embodiment of a packing according to the invention; Fig. 5 individual steps of the inventive process; Fig. 6 a first embodiment of a gripper according to the invention during the execution of step b. of the method according to the invention; Fig. 7 a second embodiment of a gripper according to the invention; Fig. 8 a third embodiment of a gripper according to the invention; and Fig. 9 a fourth embodiment of the gripper according to the invention.

[0056] Fig. Figure 1 shows an isometric view of a first embodiment of a packing 10 according to the invention. The packing 10 according to the invention comprises three flat, identically designed, identically aligned and parallel contacts 11. The contacts 11 each comprise a contact surface 12, which is located in the Fig. The contacts 11 are arranged below. The contact surfaces 12 of the contacts 11 are aligned in one plane and point in the same direction. The contacts 11 are connected by a support structure 13, which is designed in two parts, the two parts being formed as beams. The beams of the support structure 13 are each arranged in a recess 14, with each contact 11 having two recesses 14. The contacts 11 of the packing 10 are fixed in their distance and orientation to each other by a material-bonded connection of the support structure 13 in the recesses 14.

[0057] Fig. 2A shows a top view and Fig. Figure 2B shows a frontal view of a second packing 10 according to the invention. The packing 10 also comprises three contacts 11, which are connected by a support structure 13 and thereby fixed in their spacing and orientation. The contacts 11 each comprise a contact surface 12, which is located in the Fig. 2A and Fig. 2B are arranged at a predefined location 21 of an electronic component 20 and are connected to it.

[0058] As especially in the Fig. As can be seen in Figure 2B, the contact surfaces 12 are located in one plane and are aligned in one direction. The contacts 11 are identically designed, aligned in the same way, flat, and arranged parallel to each other.

[0059] Fig. Figure 3 shows an isometric view of a third embodiment of a packing 10 according to the invention. The packing 10 according to the invention comprises three flat, identically designed, identically aligned and parallel contacts 11. The contacts 11 each comprise a contact surface 12, which is located in the Fig. The contacts 11 are arranged below. The contact surfaces 12 of the contacts 11 are aligned in one plane and point in the same direction. The contacts 11 are connected by a support structure 13, which is designed in multiple parts, the parts being formed as blocks. Two blocks are arranged between each pair of contacts 11. Two blocks are also arranged externally on the outermost contact 11, to which a fourth contact 10 (not shown) can be attached. The contacts 11 of the packing 10 are fixed in their spacing and orientation to each other by a material-bonded connection of the blocks of the support structure 13.

[0060] Fig. 4A shows a side view, Fig. 4B a frontal view and Fig. 4C is a top view of a fourth embodiment of a packing 10 according to the invention. In the side view in Fig. 4A is a sectional view of the package 10, which is located along axis A in the Fig. The package 10 also comprises three contacts 11, the spacing and orientation of which are defined by a support structure 13. The contacts 11 are flat and each comprises a contact surface 12, which is arranged on three predefined locations 21 of an electronic component 20. The contacts 11 are arranged in parallel but with different orientations, with the two outer contacts 11 oriented identically and the inner contact 11 rotated by 180°. The support structure 13 is divided into three parts. It is clearly visible that in the lower part of the contacts 11, a block-shaped portion of the support structure 13 is arranged between each contact 11. The block-shaped support structure 13 is arranged with one side surface against a first contact 11 and with a second side surface against a second contact 11.Between the two outer contacts 11 of the packing 10, a further part of the support structure 13 is arranged, which as a block is connected with a first side surface to one of the contacts 11 and with a second side surface opposite the first side surface to the other contact 11.

[0061] Fig. Figure 5A shows step a. of the method according to the invention. In this step, a packing 10, comprising three contacts 11 which are connected to each other by a support structure 13, is picked up by a receiving tool 31. Fig. 5A also shows a second, identically designed package 10, which is not included.

[0062] Fig. Figure 5B shows step b of the method according to the invention, in which the packing 10 received in step a is heated by a heating tool 32. The receiving tool 31 is not shown. The heating tool 32 is a laser that heats the packing 10 by means of a laser beam 40. Furthermore, an electronic component 20 with a plurality of predefined locations 21 is shown. Packs 10 are already arranged at the predefined locations 21. It is also apparent at which predefined location 21 the packing 10 is located. Fig. 5B heated packing 10 is to be arranged. Here, the contacts 11 of the heated packing 10 are placed on the predefined locations 21 of the electronic component 20, which are still free, and soldered on using heat.

[0063] Fig. Figure 5C shows step c of the inventive method, in which the support structures 13 of the packings 10 are cut by means of a cutting tool 33. This results in the separation of the contacts 11, which have no direct electrical connection to each other. The electronic component 20 can then be connected to other electronic components via the contacts 11. The support structure 13 is cut by means of a laser beam 40 emitted by a laser.

[0064] Fig. Figure 6 shows a first embodiment of a gripper 50 according to the invention during the execution of step b. of the method according to the invention. The gripper 50 has grasped a pack 10 with two jaws 51. Each jaw 51 rests against an outer side surface of the outer contacts 11. The gripper 11 transports the pack 11 to predefined, unused locations 21 on an electronic component 20, on which further packs 11 are already arranged. A laser beam 40 from a heating tool 32, designed as a laser, is directed onto a heat transfer area 52. This heats the heat transfer area 52, and the heat is conducted via the jaw 51 to the contact 11, causing it to also heat up, so that the heated contacts 11 can be bonded to the predefined locations 21.

[0065] Fig. Figure 7 shows a second embodiment of a gripper 50 according to the invention. The gripper 50 corresponds to the one shown in Figure 7. Fig. The gripper 50 shown in Figure 6 has a heat transfer area 52 on the other jaw 51. The gripper 50 has grasped a pack 10 with three contacts 11. A laser beam 40 from a heating tool 32 designed as a laser is directed onto the heat transfer area 52. This heats the heat transfer area 52, and the heat is transferred via the jaw 51 to the contacts 11 in the Fig. The heat is transferred to contact 11 shown on the right, so that it also heats up. The other contacts are heated via the support structure 13, which transfers the heat from the contact shown in the Fig. The contact shown on the right (contact 11) is forwarded to the other contacts.

[0066] Fig. Figure 8 shows a third embodiment of a gripper 50 according to the invention. It corresponds to the one in Fig. The gripper 50 shown in Figure 7 is a different gripper, but the jaws 51 are narrower. This allows the jaws 51 of the gripper 50 to be inserted, at least partially, into the space between two contacts 11. Thus, the gripper 50 can grasp the package 10 at the central contact 11. A laser beam 40 from a heating tool 32, designed as a laser, is directed onto a heat transfer area 52. This heats the heat transfer area 52, and the heat is transferred via the jaw 51 to the central contact 11.

[0067] Fig. Figure 9 shows a third embodiment of a gripper 50 according to the invention. It corresponds to the one in Fig. 7 shown gripper 50, wherein both jaws 51 comprise a heat transfer area 52, onto which a laser beam 40 of a heating tool 32 can be directed.

Claims

[1] Packing (10) comprising at least two contacts (11) for microtechnology, wherein the contacts (11) each have a contacting surface (12), wherein the contacts (11) are connected to at least one support structure (13) and wherein the contacts (11) are spaced apart from each other and arranged such that the contacting surfaces (12) are arranged in one plane and pointing in the same direction, wherein the support structure (13) is made of a connecting material that can be cut and / or destroyed by a laser, characterized by , that the contacts (11) are designed to be so flat that the contacts (11) are significantly smaller in one vertical spatial direction than in the other two spatial directions, and that the contacts (11) are arranged parallel to each other such that side surfaces which limit the height-spatial direction are aligned parallel to each other. [2] Pack (10) according to claim 1, characterized by , that the contacts (11) are made of a contact material, wherein the connecting material has a lower burning and / or melting point than the contact material. [3] Pack (10) according to claim 1 or 2, characterized by , that the contacts (11) are identical and / or differently designed. [4] Pack (10) according to claim 3, characterized by , that the contacts (11) are oriented the same and / or differently. [5] Packaging (10) according to any of the preceding claims, characterized by , that at least one contact (11) includes at least one exclusion (14). [6] Packaging (10) according to any one of the preceding claims, characterized by , that the supporting structure (13) includes at least one web. [7] Pack (10) according to claim 6, characterized by , that the bridge is arranged laterally at the contacts (11). [8] Packaging (10) according to any of the preceding claims, characterized by, that the support structure (13) comprises at least one block, wherein the block is arranged between the contacts (11). [9] Packaging (10) according to any of the preceding claims, characterized by , that the packing (10) comprises at least three contacts (11) and the support structure (13) is designed in multiple parts, with a part of the support structure (13) being connected to two contacts (11). [10] Packaging (10) according to any of the preceding claims, characterized by , that the support structure (13) is materially bonded to the contacts (11) and / or is monolithic with the contacts (11). [11] Packaging (10) according to any of the preceding claims, characterized by , that the packing (10) is built up layer by layer, in particular by means of ion plating. [12] Packaging (10) according to any of the preceding claims, characterized by , that the package (10) has a length, width and / or height of not more than 2500 µm. [13] A method for handling a package (10) according to any of the preceding claims, comprising the following steps: a. Picking up the package (10) by means of a gripper (50) comprising at least two jaws (51), wherein the jaws (51) grasp the package (10) at an outer side surface of the outermost contacts (11) or at side surfaces of a contact (11) of the package (10); b. Heating at least one contact of the contacts (11) by means of heat transfer via the jaws (51) to one of the contacts (11) or to the side surfaces of the outermost contacts and bonding the contact surfaces of all contacts (11) of the packing (10); c. Cutting and / or destroying the support structure (13) using a laser. [14] Method according to claim 13, wherein the separation and / or destruction in step c. is carried out by ablation using the laser. [15] Method according to claim 13 or 14, wherein the bonding in step b. is carried out by soldering, in particular by means of a previously applied solder deposit. [16] Tool for carrying out a method according to one of claims 13 to 15, wherein the tool comprises a gripper (50) comprising at least two jaws (51), characterized by , that at least one of the jaws (51) includes a heat transfer area (52).

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