Method for creating a three-dimensional structure and laser lithography device

Abstract

A method for generating a three-dimensional structure in a lithographic material (12), comprising the following steps: recording the lithographic material (12) using a lithographic material recorder (14); generating an input laser beam (20) using a laser beam source (18); demultiplexing the input laser beam (20) to temporally split the input laser beam (20) to form a plurality of laser writing beams (26); focusing the plurality of laser writing beams (26) using a lens (70); generating the three-dimensional structure in the lithographic material (12) using the focused laser writing beams (26).

Description

[0001] The invention relates to a method for producing a three-dimensional structure and a laser lithography device.

[0002] The technique referred to in this context as laser lithography is also known as stereo lithography or direct laser writing. In this technique, structures are written using a laser writing beam into a usually initially liquid, photosensitive substance, which in this context is referred to as lithography material. The laser writing beam triggers a local solidification effect in the lithography material. The solidification occurs, for example, due to local polymerization of the lithography material induced by photon absorption. In the field of optical lithography, such a lithography material is also called photoresist. In the field of stereolithography, it is also referred to as resin.

[0003] Laser lithography, or direct laser writing, is advantageously used in the creation of micro- or nanostructures when high precision is desired while maintaining design freedom and flexibility in shaping. Unlike mask lithography, for example, various structures can be written without the structure being predefined by a mask or similar device.

[0004] Various techniques are known for this, which can lead to varying degrees of direct contact between the focusing optics or its optical termination element and the lithography material. Basically, it is known that the desired overall structure is created by sequentially writing a series of substructures (e.g., layer by layer or slice by slice), which then combine to form the desired structure.

[0005] In one type of known technique, the writing beam strikes the surface of a volume of lithographic material, causing local solidification at the surface. These processes are generally based on linear processes such as single-photon absorption and the resulting local change in the lithographic material. In order to write three-dimensional structures, such processes apply an additional layer of lithographic material in an application step after writing a layer. This can be achieved, for example, by gradually lowering a substrate with the structure to be written onto it into a bath of lithographic material, with the structuring being carried out on the surface using the writing beam. With such techniques, it can happen that the end element of the focusing optics comes into contact with lithographic material.

[0006] Another approach exploits the physical principle of two-photon polymerization, or more generally multi-photon polymerization, to achieve solidification of lithographic material even within a volume of lithographic material, i.e., even below the surface. This is made possible by matching the writing beam and lithographic material in such a way that a solidification effect occurs with the assistance of nonlinear effects. For example, the writing beam is selected in a spectral range that cannot normally trigger a solidification effect in the lithographic material. For example, the lithographic material and writing beam can be matched in such a way that induced solidification occurs only upon absorption of two or more photons of the writing beam (two-photon polymerization or multi-photon polymerization).In the present context, the term multi-photon polymerization refers to the induced polymerization by the absorption of two or more photons. For the purposes of this description, the term "multi-photon absorption" also includes the process of "two-photon absorption" and "two-stage absorption." The conditions required for multi-photon polymerization are generally only achieved in a zone of increased intensity. This zone of increased intensity is typically provided in an area around a focus of the laser writing beam. The focus is therefore a beam waist of the laser writing beam, which is generated by suitable optics, for example, beam guiding optics, beam shaping optics, and / or an objective lens.For the lithographic production of extended 3D structures, the focus can then be moved through a volume of lithographic material according to geometry description data and locally trigger a solidification process.

[0007] The production of three-dimensional structures using two-photon polymerization often takes place with a working distance of 100 µm (micrometers) to 20 mm (millimeters). The working distance is the distance between the focus and an optical closure element of a lens used to create the focus. At such short working distances, contact between the lens and the lithography material is often unavoidable. In particular, the lens is immersed in the lithography material. A manufacturing process in which the lens is at least partially immersed in the lithography material can also be referred to as dip-in multi-photon polymerization. During the production of three-dimensional structures, the lithography material often comes into contact with the lens and, in particular, with the optical closure element.

[0008] Regardless of the specific technique, one challenge is that the writing process for complex structures can be time-consuming, and acceleration should generally not be achieved at the expense of precision.

[0009] EP 4 163 083 A1 discloses a device for the lithography-based production of a three-dimensional component. The device has a beam splitter for splitting an input beam into several beams, which are focused on focal points within a material. Furthermore, the device has a number of acousto-optical modulators corresponding to the number of beams. An acousto-optical modulator is arranged in each beam path to shift the focal point of the respective beam.

[0010] CN 1 16 500 869 A discloses a device for conducting two-photon polymerization. The device has a femtosecond laser for generating a laser beam, which is guided through a spatial light modulator. The spatial light modulator simultaneously splits the laser beam into a plurality of beams.

[0011] In "Multi-beam two-photon polymerization for fast large-area 3D periodic structure fabrication for bioapplications," Scientific Reports, Vol. 10, Article number: 8740 (2020), Christian Maibohm et al. describe a device for producing three-dimensional structures using two-photon polymerization. The device has a laser source for generating a laser beam, which is guided through a diffraction optical element to simultaneously split the laser beam into a plurality of beams.

[0012] In "Ultrafast 3D nanofabrication via digital holography," Nature Communications Vol. 14, Article number: 1716 (2023), Wenqi Ouyang et al. demonstrate the production of high-resolution, complex three-dimensional structures using two-photon polymerization. For this purpose, a laser beam is guided over a digital micro-mirror device (DMM) that features holograms for simultaneously splitting a laser beam, allowing up to 2000 laser focuses to be created simultaneously in a lithography material.

[0013] US 2023 / 0 004 094 A1 discloses an apparatus for producing flat screens.

[0014] US 2007 / 0 206 172 A1 relates to an apparatus for producing integrated circuits (abbreviation: IC) and flat screens.

[0015] US 4 653 903 A shows an exposure device for the production of semiconductor circuits and for transferring a mask pattern to a wafer.

[0016] The invention is based on the object of enabling, in particular, the rapid production of three-dimensional structures using laser lithography technology.

[0017] This object is achieved by a method having the features of claim 1 and by a laser lithography device having the features of claim 8. Advantageous and preferred embodiments of the invention are contained in the further claims.

[0018] The inventive method for producing a three-dimensional structure in a lithographic material comprises the steps of: receiving the lithographic material by means of a lithographic material holder; generating an input laser beam by means of a laser beam source, wherein the laser beam propagates in a propagation direction; forming a plurality, in particular three, four or five, of laser writing beams by demultiplexing the laser beam by means of a demultiplexer unit arranged between the laser beam source and an objective; focusing the plurality of laser writing beams by means of the objective; generating the three-dimensional structure in the lithographic material by means of the focused laser writing beams.

[0019] By demultiplexing the laser beam, multiple laser writing beams are generated, allowing the three-dimensional structure to be created using the multiple laser writing beams. This reduces the time required to move the lithography material relative to a laser writing beam, thus enabling particularly rapid production of the three-dimensional structure.

[0020] Splitting the laser writing beam by temporal demultiplexing can offer particular advantages for laser lithography when using two-photon or multi-photon polymerization. In this process, the lithographic material is converted into an exposed state, specifically, polymerized or solidified, due to a nonlinear process. Therefore, when using a pulsed laser beam, the peak power of the individual laser pulses of the laser beam represents a relevant parameter for the two-photon or multi-photon polymerization process. Temporal demultiplexing of the laser beam results in the generation of laser writing beams with a higher peak power than laser writing beams generated by continuous beam splitting, for example, using a beam splitter.Continuous beam splitting can be understood as either continuous-time beam splitting or passive continuous beam splitting. Continuous beam splitting can be achieved using a passive optical element. Thus, temporal demultiplexing improves process efficiency in two-photon or multi-photon polymerization.

[0021] The laser beam source can be designed as a laser diode.

[0022] The laser writing beams impinge on the lithographic material or are focused into the lithographic material. The laser writing beams and the lithographic material can be coordinated in such a way that the lithographic material can be converted into an exposed state, in particular polymerized or solidified, locally within a plurality of regions in or around the respective foci of the laser writing beams to produce the three-dimensional structure by means of multi-photon polymerization.

[0023] The laser writing beams can pass through a frequency doubling device for doubling a frequency of the laser writing beams. The frequency doubling device can be arranged between the waveguide arrangement and the lens. The frequency doubling device can comprise a nonlinear crystal, for example, a lithium niobate crystal. The nonlinear crystal can be arranged in phase with the laser writing beams such that at least a portion of each laser writing beam is frequency-doubled after passing through the nonlinear crystal. The frequency doubling device can be held by a holding matrix.

[0024] The lithographic material holder can be configured to hold the lithographic material for the purpose of producing the three-dimensional structure. In particular, it is provided that the lithographic material holder can hold a volume of lithographic material such that the laser writing beams can be focused into the lithographic material. The lithographic material holder can hold the lithographic material such that the lens can be immersed in the lithographic material for the purpose of producing the three-dimensional structure.

[0025] Preferably, the lithographic material holder is designed to hold the lithographic material in position for creating the three-dimensional structure. The lithographic material holder can be referred to as a lithographic material carrier.

[0026] Various geometric designs are conceivable for the lithographic material holder, each of which can offer different advantages. The lithographic material holder can be designed, for example, as a tub, container, or pot for holding the lithographic material. It is also conceivable for the lithographic material holder to be designed as a table, carrier, or substrate on which the lithographic material rests in droplet form or in layer form. It is also conceivable for a substrate, in particular in the form of a wafer, to be placed on the table for generating the three-dimensional structure, and for the lithographic material to rest on the substrate in droplet form or in layer form. The table can be a machine table of a lithography device.

[0027] The lithographic material holder can be designed to be transparent to the laser writing beams, at least in part. For example, walls, floors, or cover plates of the lithographic material holder, if present in the specific design, can be designed to be transparent to the laser writing beams. This allows the laser writing beams to be focused into the lithographic material through the lithographic material holder. For example, irradiation or exposure of the lithographic material from below can be enabled.

[0028] The input laser beam can be a continuous-wave laser beam or a pulsed laser beam. In particular, a laser pulse of the pulsed laser beam can have a pulse duration of 50 femtoseconds to 500 nanoseconds.

[0029] Demultiplexing the input laser beam can be a temporal and / or spatial demultiplexing of the input laser beam. In particular, the temporal and spatial demultiplexing of the input laser beam can occur simultaneously. Preferably, demultiplexing the input laser beam can result in a temporal and spatial splitting of the input laser beam. Splitting can be understood as deflecting, directing, decoupling, or extracting. Splitting can be performed using an optical switch. The optical switch can be a fiber-integrated optical switch.

[0030] In this respect, the method provides, in particular, for forming a plurality of laser writing beams by demultiplexing the laser beam using a demultiplexer unit arranged between the laser beam source and a lens. Demultiplexing refers, in particular, to the opposite of multiplexing. Demultiplexing can comprise directing or steering at least a power component of the input laser beam to one of several outputs of the demultiplexer unit. The at least one power component of the input laser beam directed or steered toward the output can form a laser writing beam after passing through the output. Demultiplexing can comprise alternately directing or steering at least power components of the input laser beam to mutually different outputs of the demultiplexer unit.

[0031] If the input laser beam is a pulsed laser beam, demultiplexing can be a pulse picking of individual laser pulses or laser pulse groups of the pulsed input laser beam. If the input laser beam is a continuous-wave laser beam, demultiplexing can be a formation of pulsed laser writing beams, wherein, in particular, a pulse width and / or a pulse length is equal to a switching duration of the demultiplexer unit. For example, duty cycle pulses can be generated by the demultiplexer unit. In other words, a continuous-wave laser beam can be overpulsed by the demultiplexer unit.

[0032] The demultiplexing of the input laser beam can occur at a fixed time, periodically, or as a function of a signal. For example, demultiplexing can occur in such a way that each laser write beam is formed from the input laser beam for a specified time period. The specified time period can be, for example, 100 femtoseconds to 500 nanoseconds.

[0033] Each laser writing beam can propagate along a beam axis. The beam axes of the laser writing beams can differ from one another. The beam axes of the laser writing beams can be oriented parallel or offset from one another. The beam axes of the laser writing beams and a beam axis of the input laser beam can differ from one another; in particular, the beam axis of the input laser beam can be oriented orthogonally to the beam axes of the laser writing beams. In other words, the beam axes of the laser writing beams can each be non-collinear with the beam axis of the laser beam.

[0034] The beam axis can be understood as the longitudinal axis of the respective laser beam, extending in the direction of its propagation. In this respect, the beam axis can be defined by the Poynting vector of the radiation. The Poynting vector can be an effective Poynting vector. The effective Poynting vector can, for example, be an intensity-weighted, averaged pointing vector.

[0035] Each laser writing beam can be designed to convert the lithographic material into an exposed state by means of two-photon or multiphoton polymerization, in particular to polymerize it or to solidify it in another way.

[0036] Focusing the plurality of laser writing beams can comprise forming a plurality of foci. In particular, all laser writing beams are focused using the same lens, in particular such that each laser writing beam has its own, assigned focus. The foci can be spatially and temporally separated from one another. In other words, the focusing of the plurality of laser writing beams can be performed such that the laser writing beams each form a focus sequentially in time and spatially adjacent to one another. The arrangement is preferably such that the foci lie within a volume of lithographic material, preferably below the surface of the lithographic material.

[0037] In connection with the step of focusing the plurality of laser writing beams, especially prior to focusing, the method may comprise the step of immersing the lens into the lithography material. In other words, the method may be a dip-in multi-photon polymerization process.

[0038] For example, the lens can have a numerical aperture in the range of 0.01 to 1.6. High numerical apertures, in particular, can contribute to high precision.

[0039] Creating the three-dimensional structure in the lithography material can involve spatially superimposing the focus of the laser writing beams on the lithography material. In other words, the laser writing beams are focused into the lithography material for the purpose of creating the three-dimensional structure. Creating the three-dimensional structure in the lithography material can be achieved by multi-photon polymerization of the lithography material.

[0040] In a further development of the method, demultiplexing comprises forming each laser writing beam by extracting a portion of the laser beam sufficient to transfer the lithographic material into an exposed state from the input laser beam. In particular, the extraction can be performed such that the respective laser writing beam has at least the exposure dose, energy dose, and / or intensity sufficient for two- or multiphoton polymerization of the lithographic material at its focus. Exposure can be performed using two- or multiphoton polymerization.

[0041] For example, the lithographic material can be liquid in an unexposed state and solid in an exposed state. In other words, by locally converting the lithographic material into an exposed state, the lithographic material can be locally solidified. Subsequently, the unexposed and liquid lithographic material can be separated from the lithographic material that has solidified as a result of exposure, e.g., during a development step.

[0042] In an alternative example, the lithographic material may be solid in an unexposed state, and in an exposed state, its structure, e.g., chemical structure, molecular structure, cross-linking of the lithographic material, degree of polymerization, or similar, may be altered compared to the unexposed state. In other words, the local conversion of the lithographic material in an exposed state may be achieved by changing the cross-linking of the lithographic material. Subsequently, the unexposed lithographic material may be separated from the exposed lithographic material, e.g., in a development step.

[0043] In a further development of the method, the input laser beam is a pulsed laser beam comprising a plurality of laser pulses. The formation of the plurality of laser writing beams occurs by coupling out a first group of laser pulses and at least one second group of laser pulses from the pulsed input laser beam. The first group of laser pulses form a first laser writing beam, and the second group of laser pulses form a second laser writing beam. The first group of laser pulses and the second group of laser pulses can be separated from each other temporally and spatially. The coupling out can be referred to as pulse picking.

[0044] In a further development of the method, the method comprises the step of detecting a power of the input laser beam in the beam path of the input laser beam after demultiplexing. The formation of the plurality of laser writing beams occurs depending on the detected power. The detection of the power can be a detection of the power of a residual beam of the input laser beam. The residual beam is preferably not a laser writing beam. In particular, the residual beam can be a laser beam that remains after the input laser beam has been demultiplexed. The demultiplexing can be carried out using a demultiplexer unit. The detection of the power can occur after the demultiplexer unit. The power can be a power of the input laser beam after passing through the demultiplexer unit.

[0045] In a further development of the method, the method comprises the step of coupling the plurality of laser writing beams into a waveguide arrangement which has a plurality of waveguides. Each waveguide is assigned to a laser writing beam. The waveguides are arranged in the beam path between the laser beam source and the lens. The waveguide arrangement advantageously allows the method to be carried out in a particularly stable and reliable manner. The waveguide arrangement can establish a defined, spatial arrangement of the laser writing beams relative to one another and maintain this arrangement in a robust manner against interference. Each waveguide can be designed to guide or direct the respective laser writing beam. Each waveguide can be designed as or comprise a hollow-core fiber or a solid-core fiber.

[0046] In a further development of the method, each waveguide has a first end and a second end opposite the first end. Each first end is configured to couple in a laser writing beam, and each second end is configured to couple out the laser writing beam coupled into the first end. The second ends of the plurality of waveguides are held by a holding matrix of the waveguide arrangement. The method can provide for a displacement of the focuses relative to the lithography material holder by displacing the holding matrix. The waveguides can optionally follow the movement of the holding matrix, for example, by corresponding (elastic) deformation, bending, or the like. The displacement of the focuses relative to the lithography material holder can also be carried out or supported by displacing the objective.Alternatively or in addition to the aforementioned options, the focus can be shifted relative to the lithographic material holder by shifting the lithographic material holder and / or shifting the focus relative to the lithographic material holder by means of an optical deflection device by deflecting the laser writing beams.

[0047] The provision of the holding matrix enables a particularly compact and precise holding of the second ends of the waveguides in a defined arrangement relative to one another.

[0048] The holding matrix can be formed from plastic, resin, glass or silicon, in which the second ends of the waveguides are at least partially embedded, in particular in sections.

[0049] The holding matrix can comprise a substrate with precision-machined V-shaped notches for inserting the waveguides. Alternatively, the holding matrix can comprise a microstructured perforated plate, wherein the waveguides can be inserted into holes in the perforated plate. Alternatively, the holding matrix can comprise a plurality of ferrules, wherein the waveguides can be inserted into the ferrules. Alternatively, the holding matrix can be a welded connection between the second ends of the waveguides of the waveguide array.

[0050] Displacement can be understood as the execution of a movement. Any displacement can be achieved by means of a drive, in particular a linear drive and / or a rotary drive.

[0051] The displacement of the holding matrix can be effected by means of a movement of the holding matrix transverse to the laser writing beams and / or a movement of the holding matrix longitudinal to the laser writing beams.

[0052] During the shifting of the focus relative to the lithography material holder by shifting the holding matrix, the lens can be stationary or shifted together with the holding matrix. Shifting the holding matrix together with the lens can mean that the holding matrix and the lens are shifted simultaneously in the same direction and by the same distance. The joint shifting of the holding matrix and the lens can, for example, be achieved using the same drive.

[0053] During the shifting of the focus relative to the lithography material holder by shifting the lithography material holder, the holding matrix and / or the lens may be stationary.

[0054] The optical deflection device can be arranged between the waveguide arrangement and the lens. The optical deflection device can comprise a scanner mirror, a mirror galvanometer, an acousto-optical deflector, an acousto-optical modulator, and / or a membrane mirror for deflecting the laser writing beams.

[0055] In a further development of the method, each waveguide is designed as a hollow-core optical fiber. This significantly reduces unwanted absorption and significantly increases the waveguide's destruction threshold. Furthermore, each hollow-core fiber can be tuned to its associated laser writing beam in such a way that no pulse broadening of a laser pulse of the laser writing beam occurs after passing through the hollow-core fiber. The hollow-core optical fiber can be an optical fiber with a hollow fiber core.

[0056] In a further development of the method, each waveguide is selected from the group comprising: HC-PCF fibers, in particular HC-Kagome fibers, HC-PBGF fibers, HC-ARF fibers, HC-IC fibers, RH fibers, LMA fibers, PCF fibers.

[0057] HC-PCF fibers can be called Hollow Core Photonic Crystal Fibers, HC-Kagome fibers can be called Hollow Core Kagome Fibers, HC-PBGF fibers can be called Hollow Core Photonic Bandgap Fibers, HC-ARF fibers can be called Hollow Core Anti-Resonant Fibers, HC-IC fibers can be called Hollow Core Inhibited Coupling Fibers, RH fibers can be called Radiation Hardened Fibers, LMA fibers can be called Large Mode Area Fibers, PCF fibers can be called Photonic Crystal Fibers. Photonic crystal fibers).

[0058] A laser lithography device according to the invention for producing a three-dimensional structure in a lithography material. To the extent that features and components of the laser lithography device are also described in connection with the method, the statements therein also apply accordingly to the laser lithography device. The device has a lithography material holder, a laser beam source, a demultiplexer unit, an objective, and a scanning device. The lithography material holder is designed to hold the lithography material. The laser beam source is designed to generate an input laser beam. The demultiplexer unit is arranged, in particular in the propagation direction of the input laser beam, between the laser beam source and the objective. The demultiplexer unit is configured to temporally divide the input laser beam into a plurality of laser writing beams by demultiplexing.The lens is designed to focus the laser writing beams into a focus associated with each laser writing beam. The scanning device is designed to shift the focus relative to the lithography material holder.

[0059] The laser lithography device is particularly designed and specifically configured to carry out a previously described method. The above description of the method can also apply to identical or functionally equivalent features of the laser lithography device.

[0060] The scanning device can have a previously described optical deflection device for shifting the focus relative to the lithography material holder by deflecting the laser writing beams. The optical deflection device of the scanning device can be arranged between the demultiplexer unit and the lens.

[0061] Additionally or alternatively, the scanning device can be configured to shift the focus relative to the lithographic material holder by shifting the lens and / or to shift the focus relative to the lithographic material holder by shifting the lithographic material holder. For this purpose, the scanning device can comprise actuators, in particular servo motors or linear actuators, preferably vibrating piezo actuators, for the shifting.

[0062] The lithography material holder can hold lithography material. The lithography device can also include the lithography material.

[0063] In a further development of the laser lithography device, the laser beam source is configured to generate a pulsed input laser beam comprising a plurality of laser pulses. The demultiplexer unit is configured such that demultiplexing occurs by coupling out a first group of laser pulses and at least one second group of laser pulses from the pulsed input laser beam. The first group of laser pulses forms a first laser writing beam, and the second group of laser pulses forms a second laser writing beam.

[0064] In a further development of the laser lithography device, the demultiplexer unit comprises a plurality, in particular three, four, or five, of optical switches arranged in series in the beam path of the input laser beam. In a switched position, each optical switch is configured to form a respective laser writing beam by coupling out a laser beam portion sufficient to transfer the lithography material in an exposed state from the input laser beam. In a non-switched position, in particular, no laser writing beam is coupled out. Each optical switch can be designed as a fiber-integrated optical switch.

[0065] The optical switches can be arranged in series in the propagation direction of the input laser beam. The plurality of optical switches can be identical to the plurality of laser writing beams. One optical switch can be provided for each laser writing beam.

[0066] Each optical switch may include an acousto-optic modulator or an acousto-optic deflector for extracting a laser beam portion sufficient to transfer the lithography material into an exposed state from the input laser beam. Each optical switch may include a digital input for transferring the optical switch to the switched position. A signal may be applied to the digital input to transfer the optical switch between the switched position and a non-switched position. For example, the optical switch may be in the switched position when the signal is present at the digital input and in the non-switched position when no signal is present at the digital input.

[0067] When the optical switch is in the non-switched position, it is particularly provided that the input laser beam can pass through the optical switch without forming a laser writing beam.

[0068] It is conceivable that the output coupling level of each optical switch is adjustable, in particular continuously. The output coupling level of an optical switch can be a ratio of the power, in particular a peak power or an average power, of the laser writing beam formed by the optical switch relative to a power, in particular a peak power or an average power, of the input laser beam upstream of the optical switch. In the non-switched position, the output coupling level can be 0%. In other words, with an output coupling level of 0%, the input laser beam can pass through the optical switch without a laser writing beam being formed. In the switched position, the output coupling level can be, for example, 10%, 20%, 30%, 40%, 50%, 60%, 80%, 90% or 95%.In other words, a power of the laser writing beam formed by the optical switch is 10%, 20%, 30%, 40%, 50%, 60%, 80%, 90% or 95% of the power of the input laser beam in front of the optical switch when the latter is continuously in the switched position.

[0069] The optical switch can have an analog input to which a signal can be applied to adjust the output coupling level. By adjusting the output coupling level, different exposure levels of the lithography material can be achieved.

[0070] In a further development of the laser lithography device, the demultiplexer unit comprises an optical switch arranged in the beam path of the input laser beam downstream of the laser beam source. The demultiplexer unit comprises an optical arrangement configured to guide the input laser beam multiple times over the optical switch. In a switched position, the optical switch is configured to form a laser writing beam by extracting a portion of the laser beam from the input laser beam that is sufficient to transfer the lithography material in an exposed state.

[0071] The demultiplexer unit can, in particular, comprise a single optical switch. The optical arrangement can then be configured to guide the input laser beam over the optical switch twice, three times, or four times. The optical arrangement can be configured to guide the input laser beam over the optical switch multiple times at different angles of incidence. The above description of an optical switch can also apply to the optical switch over which the input laser beam is guided multiple times.

[0072] In a further development of the laser lithography device, the laser lithography device comprises a power detection unit for detecting the power of the input laser beam in the beam path downstream of the demultiplexer unit. The laser lithography device comprises a control unit configured to control the demultiplexer unit for the purpose of forming the plurality of laser writing beams by demultiplexing the input laser beam depending on the detected power. The control unit can be a computer or a processing unit.

[0073] The power detection unit may be a photodiode or a power detector for detecting the power of the input laser beam. The power detection unit may be arranged such that the power detection unit detects a power of a residual beam of the input laser beam. The residual beam may not be a laser write beam. The residual beam may be a laser beam remaining from the input laser beam after passing through the demultiplexer unit. The power may be a power of the residual beam.

[0074] In a further development of the laser lithography device, the laser lithography device has a waveguide arrangement comprising a plurality of waveguides for guiding the plurality of laser writing beams. Each waveguide is assigned to a laser writing beam. The waveguides in the beam path are arranged between the demultiplexer unit and the lens. Each waveguide has a first end and a second end opposite the first end. Each first end is configured to couple in a laser writing beam, and each second end is configured to couple out the laser writing beam coupled into the first end. The second ends of the plurality of waveguides are held by a holding matrix of the waveguide arrangement. Within the holding matrix, the waveguides can run parallel to one another and offset from one another.Each waveguide may be formed as a hollow core fiber or as a solid core fiber, or comprise a corresponding fiber.

[0075] The second ends can be spaced apart from one another in the propagation direction of the laser writing beams coupled out from the second ends. In other words, each second end of the plurality of waveguides can have an end face configured to couple out the laser writing beam coupled into the first end, wherein the end faces of the second ends are arranged in different planes. In other words, the second ends protrude by different distances. This advantageously enables simultaneous exposure of the lithography material in different planes. This can increase the stability of the three-dimensional structure during the creation or printing process. In addition, the three-dimensional structure can be created more quickly. In particular, this can enable the realization of a higher packing density of the focuses.

[0076] In a further development of the laser lithography device, the second ends of the plurality of waveguides are held by the holding matrix in a linear arrangement or in a two-dimensional arrangement. The linear arrangement and / or the two-dimensional arrangement can be a regular arrangement.

[0077] If the second ends are arranged in a linear configuration, the second ends can be equally spaced from one another. If the second ends are arranged in a two-dimensional configuration, the second ends can be arranged in a crystal-like structure. Crystal-like structure can be understood to mean that the second ends are arranged like a dot lattice with a periodic, repeating pattern.

[0078] In a further development of the laser lithography device, the distance between two adjacent second ends of the plurality of waveguides is 25 µm to 1000 µm, in particular 115 µm to 600 µm. This results in a particularly compact waveguide arrangement.

[0079] In a further development of the laser lithography device, each second end of the plurality of waveguides has an end face configured to decouple the laser writing beam coupled into the first end. The end faces of the second ends are arranged in a plane. The plane can be oriented perpendicular to a propagation direction of the decoupled laser writing beams.

[0080] In a further development of the laser lithography device, the scanning device is configured to shift the foci relative to the lithography material holder by shifting the holding matrix. For this purpose, the scanning device can comprise actuators, in particular servo motors or linear actuators, that shift the holding matrix.

[0081] In a further development of the laser lithography device, each waveguide is designed as a hollow-core optical fiber.

[0082] In a further development of the laser lithography device, each waveguide is selected from the group comprising: HC-PCF fibers, in particular HC-Kagome fibers, HC-PBGF fibers, HC-ARF fibers, HC-IC fibers, RH fibers, LMA fibers, PCF fibers.

[0083] Further advantages and aspects of the invention emerge from the claims and the following description of preferred embodiments of the invention, which are explained below with reference to the figures. Identical and functionally corresponding elements are provided with identical reference numerals. Here: Fig. 1 is a schematic view of a laser lithography device, Fig. 2 is a schematic diagram of an operation of a demultiplexer unit of the laser lithography apparatus, Fig. 3 a schematic view of an end face of a waveguide arrangement of the laser lithography device, Fig. 4 a schematic view of Fig. 3 to a variant of the waveguide arrangement, Fig. 5 a schematic representation of focuses of the laser writing beams in a focal plane, Fig. 6 a schematic representation of the foci of Fig. 5 in a plane orthogonal to the focal plane, and Fig. 7 a schematic view of Fig. 1 of a variant of the laser lithography device.

[0084] Fig. 1 shows a laser lithography device 10 for creating a three-dimensional structure in a lithography material 12 by means of multi-photon polymerization.

[0085] The laser lithography device 10 has a lithography material holder 14. The lithography material holder 14 is designed as a table in the form of a machine table. A substrate 16 in the form of a wafer, on which the three-dimensional structure is to be created, is placed on the lithography material holder 14.

[0086] The lithographic material 12 lies in drop form on the lithographic material holder 14 and on the substrate 16. In Fig. 1 shows that the lithography material 12 contacts the lithography material holder 14 and the substrate 16. In an alternative embodiment not shown, the lithography material only contacts the substrate. In both cases, the lithography material holder 14 is configured to receive the lithography material 12 for the purpose of producing the three-dimensional structure.

[0087] The laser lithography device 10 has a laser beam source 18 for generating an input laser beam 20. The input laser beam 20 propagates in a propagation direction 22.

[0088] The input laser beam 20 is a pulsed laser beam comprising a plurality of laser pulses. Each laser pulse of the pulsed input laser beam 20 has a pulse duration of 250 femtoseconds. The laser pulses of the pulsed input laser beam 20 have a repetition rate of 80 MHz.

[0089] The laser lithography device 10 has a demultiplexer unit 24. The demultiplexer unit 24 is arranged downstream of the laser beam source 18 in the propagation direction 22 of the input laser beam 20. The demultiplexer unit 24 is configured to temporally and spatially divide the input laser beam 20 into a plurality of laser writing beams 26 by demultiplexing.

[0090] Each laser write beam 26 propagates along a beam axis. The beam axis is a longitudinal axis of the respective laser write beam 26, which extends in the direction of its propagation. The beam axes of the laser write beams 26 differ from one another. The beam axes of the laser write beams 26 are oriented parallel to one another and offset from one another. The beam axes of the laser write beams 26 and a beam axis of the input laser beam 20 are oriented orthogonally to one another. In other words, the beam axes of the laser write beams 26 are not collinear with the beam axis of the laser beam 20.

[0091] In the example shown, the Fig. 1, the input laser beam 20 is split into a total of four laser writing beams 26 by the demultiplexer unit 24. For this purpose, the demultiplexer unit 24 has a total of four optical switches 28 arranged in series along the propagation direction 22. In other words, when the optical switches 28 are not switched, the input laser beam 20 can pass through the optical switches 28 one after the other without being influenced by them.

[0092] One optical switch 28 is provided for forming a laser writing beam 26. Each optical switch 28, in a switched position, is configured to form a respective laser writing beam 26 from the input laser beam 20. Each optical switch 28 is designed as an acousto-optical modulator. The laser writing beams 26 are formed by coupling out a laser beam portion sufficient to solidify the lithography material 12 from the input laser beam 20. In other words, demultiplexing is directing or steering the sufficient laser beam portion to one of several outputs 29 of the demultiplexer unit 24. In the illustrated embodiment, this is done by means of the optical switches 28 and deflection mirrors (not shown for the sake of simplicity).

[0093] In total, the demultiplexer unit 24 has four outputs 29. The number of outputs 29 is equal to the number of laser writing beams 26 formed by the demultiplexer unit 24. A sufficient portion of the laser beam directed or steered toward an output 29 forms a laser writing beam 26 after passing through the output 26.

[0094] In order to form the four laser writing beams 26 by means of the demultiplexer unit 24, an optical switch 28 is successively moved into the switched position, which then decouples a sufficient laser beam portion from the input laser beam 20 and directs it to the associated output 29.

[0095] Each optical switch 28 has a digital input for switching the optical switch between the non-switched position and the switched position. Switching to the switched position or the non-switched position is accomplished by means of a signal applied to the digital input. In the example shown, the optical switch 28 is in the switched position when a signal is present at the digital input and in the non-switched position when no signal is present at the digital input.

[0096] The laser lithography device 10 has a control unit 30 configured to control the demultiplexer unit 24 for the purpose of forming the laser writing beams 26 by demultiplexing the input laser beam 20. The optical switches 28 are successively switched to the switched position by the control unit 30. To this end, the control unit 30 applies a signal to the digital inputs of the individual optical switches 28 in succession.

[0097] The laser lithography device 10 has a power detection unit 32 in the form of a power detector for detecting a power of the input laser beam 20 after the demultiplexer unit 24. Thus, the power detection unit 32 detects the power of the input laser beam 20 that is left over from the input laser beam 20 after passing the demultiplexer unit 24. In the illustrated example of the Fig. 1, the power detection unit 32 is arranged such that, when the optical switches 28 are in the unswitched position and the input laser beam 20 passes through the optical switches 28 one after the other without being influenced by them, the input laser beam 20 impinges on the power detection unit 32. The power detection unit 32 detects a power of the input laser beam 20 that is equal to a power of the input laser beam 20 before the demultiplexer unit 24.

[0098] If one of the optical switches 28 is in the switched position and, for example, 80% of the peak power of the input laser beam 20 is coupled out to form a laser writing beam 26, then the power detection unit 32 detects a power of the input laser beam 20, wherein the peak power of the input laser beam 20 incident on the power detection unit 32 is 20% of the peak power of the input laser beam 20 before the demultiplexer unit 24.

[0099] The control unit 30 is configured to control the demultiplexer unit 24 depending on the power detected by the power detection unit 32.

[0100] An example of operation of the demultiplexer unit 24 is shown in Fig. 2 shown.

[0101] In Fig. 2 a), individual laser pulses 34 of the pulsed input laser beam 20 are shown in front of the demultiplexer unit 24 along a time axis 36 in the form of arrows. In Fig. 2 b) to e) each show a temporal progression of a signal that the control unit 30 applies to the digital input of the respective optical switch 28, along the time axis 36. When the signal has the value 1, the respective optical switch 28 assumes the switched position, and when the signal has the value 0, the respective optical switch 28 assumes the non-switched position.

[0102] The control unit 30 is configured to successively apply signals for a predetermined duration to the digital inputs of the optical switches 28. The predetermined duration is, for example, the same for all optical switches 28. In the exemplary embodiment, the predetermined duration is Fig. 2 is selected such that each optical switch 28 extracts ten laser pulses 34 from the input laser beam 20. In other words, the control unit 30 is configured to apply signals for a duration of ten laser pulses 34 to the digital inputs of the optical switches 28. However, the predetermined duration can also be selected differently, so that more or fewer laser pulses 34 are extracted. The extracted laser pulses 34 at least partially form the laser writing beams 26.

[0103] Between two signals successively applied to the optical switches 28, no signal is applied to the optical switch 28 for a predetermined time period. The predetermined time period is in the embodiment of the Fig. 2 is selected such that between the decoupled laser pulses 34, two laser pulses 34 are not decoupled by the optical switches 28. The uncoupled laser pulses 34 reach the power detection unit 32. However, the predetermined time period can also be selected differently, so that more or fewer laser pulses reach the power detection unit 32.

[0104] In detail, Fig. 2, that two laser pulses 34 of a time period 38 reach the power detection unit 32. The control unit 30 sets the Fig. 2 b) to a first optical switch 28 for a time period 40, which contains ten laser pulses 34. The ten laser pulses 34 coupled out by means of the first optical switch 28 form at least partially a first laser writing beam 26. Subsequently, two laser pulses 34 of a time period 42 reach the power detection unit 32. The control unit 30 applies the signal in Fig. 2 c) to a second optical switch 28 for a time period 44, which contains ten laser pulses 34. The ten laser pulses 34 coupled out by means of the second optical switch 28 form at least partially a second laser writing beam 26. Subsequently, the two laser pulses 34 of a time period 46 reach the power detection unit 32. The control unit 30 applies the Fig. 2 d) to a third optical switch 28 for a time period 48, which contains ten laser pulses 34. The ten laser pulses 34 coupled out by means of the third optical switch 28 form at least partially a third laser writing beam 26. Subsequently, the two laser pulses 34 of the time period 50 reach the power detection unit 32. The control unit 30 applies the Fig. 2 e) to a fourth optical switch 28 for a time period 52 containing ten laser pulses 34. The ten laser pulses 34 coupled out by the fourth optical switch 28 at least partially form a fourth laser writing beam 26. With the subsequent two laser pulses 34, the sequence of applying the signal to the optical switches 28 begins again.

[0105] Calibration of the optical switches 28, in particular calibration of the time offsets for the operation of the optical switches 28, is carried out by applying a periodic signal to two optical switches 28, whereas no signal is applied to the remaining optical switches 28. Thereafter, a time offset between the two periodic signals is changed and, at the same time, the average power is recorded by means of the power recording unit 32. In this case, a maximum average power is recorded at the power recording unit 32 when the two optical switches 28 are simultaneously in the switched position. Based on the time offset of this state, it is possible to determine at which time offset the Fig. 2 occurs for these two optical switches 28. Calibration of the remaining optical switches 28 is carried out accordingly.

[0106] The demultiplexer unit 24 is configured such that demultiplexing occurs by extracting groups of laser pulses from the pulsed input laser beam 20. The groups of laser pulses form the laser write beams 26. In other words, the demultiplexer unit 24 forms the laser write beams 26 by pulse picking. The laser write beams 26 are formed by temporally and spatially splitting the laser pulses 34 of the input laser beam 20.

[0107] The optical switches 28 each have an analog input to which a signal for adjusting the output coupling level can be applied. The output coupling level of each optical switch 28 is continuously adjustable. The output coupling level is a ratio of the peak power of a laser writing beam 26 formed by an optical switch 28 relative to a peak power of the input laser beam 20 upstream of the optical switch 28.

[0108] The control unit 30 is configured to apply a signal for adjusting the output coupling level to the respective optical switch 28. In the example shown, the control unit 30 applies a signal to the analog input such that the output coupling level is 80%. In other words, the peak power of the laser pulses output by the optical switches 28 is reduced by 20% compared to the peak power of the laser pulses of the input laser beam 20.

[0109] The laser lithography device 10 has a waveguide arrangement 54, see Fig. 1. The waveguide arrangement 54 has a plurality of waveguides 56 for guiding the plurality of laser writing beams 26. Each waveguide 56 is assigned to a laser writing beam 26.

[0110] The waveguides 56 are arranged in the beam path downstream of the demultiplexer unit 24. Each waveguide 56 is a hollow-core optical fiber, specifically a hollow-core photonic crystal fiber. Each waveguide 56 is configured to guide or direct the laser writing beam 26 associated with the waveguide 56.

[0111] Each waveguide 56 has a first end 58 and a second end 60 opposite the first end. Each first end 58 is configured to couple the laser writing beam 26 associated with the waveguide 56. The laser writing beams 26 are coupled into the waveguide 56 via a free-beam coupling. Each second end 60 has an end face configured to couple out the laser writing beam 26 coupled into the first end 58. Thus, each second end 60 is configured to couple out the laser writing beam 26 coupled into the first end 58.

[0112] The second ends 60 are held by a holding matrix 62 of the waveguide arrangement 54. Within the holding matrix 62, the waveguides 56 run parallel and offset from one another. In the example shown, the holding matrix 62 has a substrate with precision-machined, parallel V-shaped notches. The substrate can be formed from plastic, resin, glass, or silicon, for example. The waveguides 56 are inserted into the notches. Free spaces between the waveguides 56 and the substrate are filled with an adhesive suitable for optics, for example in the form of UV adhesive. A cover of the holding matrix 62 is glued on, which presses the waveguides 56 into the V-shaped notches.

[0113] The end faces of the second ends 60 are arranged in a plane. The plane and the end faces 64 are aligned perpendicular to a propagation direction of the coupled-out laser writing beams 26.

[0114] Fig. Figure 3 shows a schematic representation of the end face 64 of the waveguide array 54. The second ends 60 of the waveguides 56 are held in a regular linear array by the holding matrix 62. In other words, the second ends 60 are spaced equally apart by 66. The distance 66 between two adjacent second ends 60 is 250 µm.

[0115] Fig. 4 shows a further embodiment of the waveguide arrangement 54 of the Fig. 3, which is suitable for use with up to eight laser writing beams. The same reference numerals are used for identical and functionally equivalent elements and in this respect, reference can be made to the above explanations regarding the embodiment of the Fig. 3, so that essentially only the existing differences are discussed.

[0116] The second ends 60 of the waveguide arrangement 54 of the Fig. 4 are held by the holding matrix 62 in a regular two-dimensional arrangement. The second ends 60 are arranged in a crystal-like structure. In other words, the second ends 60 are arranged in a periodic, repeating pattern.

[0117] Fig. 1 shows that the lithography device 10 has an optical deflection device 68 in the form of a mirror galvanometer and an objective 70 in the beam path of the laser writing beams 26 downstream of the waveguide arrangement 54. The optical deflection device 68 is designed to deflect the laser writing beams 26, and the objective 70 is designed to focus the laser writing beams 26.

[0118] The lens 70 is immersed in the lithographic material 12. The lens 70 focuses the laser writing beams 26 into the lithographic material 12 for the purpose of creating the three-dimensional structure. The foci of the laser writing beams 26 all lie in one focal plane.

[0119] Fig. Figure 5 is a schematic representation of a view of the focal plane and the individual foci 72. By demultiplexing the input laser beam 20, the foci 72 are formed within the lithography material 12, separated from each other in time and space. This is shown in Fig. 5 is illustrated by the dashed and solid representation of the foci 72.

[0120] Fig. Figure 6 is a schematic representation of the foci 72 of Fig. 5 in a plane orthogonal to the focal plane 74. Regions 76 around the foci of the laser writing beams are shown, in which the lithographic material 12 solidifies by multiphoton polymerization. Thus, the laser writing beams 26 formed by demultiplexing comprise a laser beam portion from the input laser beam 20 sufficient to solidify the lithographic material 12.

[0121] Fig. 1 shows that the lithography apparatus 10 has a scanning device 78 for displacing the focuses 72 relative to the lithography material holder 14. The scanning device 78 includes the optical deflection device 68. Furthermore, the scanning device 78 has an actuator 80 arranged on the lithography material holder 14, an actuator 82 arranged on the objective lens 70, and an actuator 84 arranged on the holding matrix 62. Each actuator 80, 82, 84 is a linear actuator in the form of a piezo actuator. In an alternative embodiment not shown, other actuator types are also conceivable.

[0122] In an alternative embodiment not shown, the lithography device 10 may comprise at least one actuator from the actuators 80, 82, 84.

[0123] By means of the actuator 80 arranged on the lithographic material holder 14, the scanning device 78 can displace the focal points 72 relative to the lithographic material holder 14 by displacing the lithographic material holder 14. By means of the actuator 82 arranged on the lens 70, the scanning device 78 can displace the focal points 72 relative to the lithographic material holder 14 by displacing the lens 70. By means of the actuator 84 arranged on the holding matrix 62, the scanning device 78 can displace the focal points 72 relative to the lithographic material holder 14 by displacing the holding matrix 62. By means of the optical deflection device 68, the scanning device 78 can displace the focal points 72 relative to the lithographic material holder 14 by deflecting the laser writing beams 26.

[0124] The laser lithography device 10 is designed to carry out a method for producing a three-dimensional structure in the lithography material 12.The method comprises the steps of: receiving the lithography material 12 by means of the lithography material holder 14; generating the input laser beam 20 by means of the laser beam source 18; forming four laser writing beams 26 by demultiplexing the input laser beam 20 by means of a demultiplexer unit 62 arranged between the laser beam source 18 and the lens 70; coupling the plurality of laser writing beams 26 into a waveguide arrangement 54 having a plurality of waveguides 56; immersing the lens into the lithography material; focusing the plurality of laser writing beams 26 by means of the lens 70 into the lithography material 12; generating the three-dimensional structure in the lithography material 12 by means of the focused laser writing beams 26 through multi-photon polymerization.

[0125] Fig. 7 shows a further embodiment of the laser lithography device 10 of Fig. 1, wherein identical and functionally equivalent elements are given the same reference numerals and in this respect reference is made to the above explanations regarding the embodiment of the Fig. 1, so that essentially only the existing differences are discussed.

[0126] The laser lithography device 10 has an additional laser beam source 86. The additional laser beam source 86 is designed to generate a continuous wave laser beam.

[0127] In an alternative embodiment not shown, the additional laser beam source can be designed to generate a pulsed laser beam.

[0128] In the example of Fig. 7, the additional laser beam source 86 is coupled to a waveguide 56 of the waveguide arrangement 54. In other words, the additional laser beam source 86 provides its generated laser beam at a fiber output, which is coupled to the first end of a waveguide 56 of the waveguide arrangement 54. To couple the generated laser radiation, the fiber output can be spliced ​​to the first end of the waveguide 56. Alternatively, the fiber output and the first end of the waveguide 56 can be held by a coupler for the purpose of coupling the generated laser radiation into the first end.

[0129] The additional laser beam source 86 can have integrated power modulation. The integrated power modulation can be implemented, for example, by means of an integrated acousto-optical modulator. Alternatively, the additional power beam source 86 can be power modulated by electrical switching, for example, by alternating on and off. Alternatively, the additional power beam source 86 can be modulated by direct modulation, for example, by electrically switching the supply current.

[0130] The demultiplexer unit 24 of the laser lithography device 10 of the Fig. 7 has three optical switches 28, each generating a laser write beam 26 by demultiplexing the input laser beam 20. The three laser write beams 26 are coupled into the remaining three waveguides 56 of the waveguide array 54 via a free-beam coupling.

Claims

[1] A method for producing a three-dimensional structure in a lithographic material (12), the method comprising the following steps: - picking up the lithographic material (12) by means of a lithographic material holder (14), - generating an input laser beam (20) by means of a laser beam source (18), - demultiplexing the input laser beam (20) to form a plurality of laser writing beams (26) by temporally dividing the input laser beam (20), - focusing the laser writing beams (26) by means of a lens (70), - generating the three-dimensional structure in the lithographic material (12) by means of the focused laser writing beams (26). [2] Method according to claim 1, - wherein each laser writing beam (26) is formed by coupling out a laser beam portion sufficient to convert the lithographic material (12) into an exposed state from the input laser beam (20). [3] Method according to claim 1 or 2, - wherein the input laser beam (20) is a pulsed laser beam having a plurality of laser pulses (34), - wherein the demultiplexing of the input laser beam (20) is carried out by coupling out a first group of laser pulses (34) and at least one second group of laser pulses (34) from the pulsed input laser beam (20) in such a way, - that the first group of laser pulses (34) forms a first laser writing beam and the second group of laser pulses (34) forms a second laser writing beam. [4] Method according to one of the preceding claims, - the method comprising the step of: - detecting a power of the input laser beam (20) in the beam path of the input laser beam (20) after demultiplexing, wherein the formation of the plurality of laser writing beams (26) takes place as a function of the detected power. [5] Method according to one of the preceding claims, - the method comprising the step of: - coupling the plurality of laser writing beams (26) into a waveguide arrangement (54) which has a plurality of waveguides (56), wherein each waveguide (56) is assigned to a laser writing beam (26), and wherein the waveguides (56) are arranged in the beam path between the laser beam source (18) and the objective (70). [6] Method according to claim 5, - wherein each waveguide (56) has a first end (58) and a second end (60) opposite the first end (58), - wherein each first end (58) is adapted to couple in a laser writing beam (26) and each second end (60) is adapted to couple out the laser writing beam (26) coupled into the first end (58), - wherein the second ends (60) of the plurality of waveguides (56) are held by a holding matrix (62) of the waveguide arrangement (54), - the method comprising the step of: - displacing the focuses (72) relative to the lithographic material holder (14) by displacing the holding matrix (62), and / or - shifting the focuses (72) relative to the lithographic material holder (14) by means of a shift of the lens (70), - displacing the focuses (72) relative to the lithographic material holder (14) by means of a displacement of the lithographic material holder (14), and / or - Displacing the focuses (72) relative to the lithographic material holder (14) by means of an optical deflection device (68) by deflecting the laser writing beams (26). [7] Method according to claim 5 or 6, - wherein each waveguide (56) is selected from the group comprising: HC-PCF fibers, in particular HC-Kagome fibers, HC-PBGF fibers, HC-ARF fibers, HC-IC fibers, RH fibers, LMA fibers, PCF fibers. [8] Laser lithography device (10) for producing a three-dimensional structure in a lithography material (12), comprising: - a lithographic material holder (14) for holding the lithographic material (12), - a laser beam source (18) for generating an input laser beam (20), - a demultiplexer unit (24) arranged between the laser beam source (18) and the lens (70), - wherein the demultiplexer unit (24) is designed to divide the input laser beam (20) into a plurality of laser writing beams (26) by demultiplexing, - a lens (70) for focusing the laser writing beams (26) in a respective focus (72) associated with the laser writing beam (26), and - a scanning device (78) for displacing the focuses (72) relative to the lithographic material holder (14). [9] Laser lithography device (10) according to claim 8, - wherein the laser beam source (18) is designed to generate a pulsed input laser beam (20) having a plurality of laser pulses (34), - wherein the demultiplexer unit (24) is designed such that the demultiplexing is carried out by coupling out a first group of laser pulses (34) and at least one second group of laser pulses (34) from the pulsed input laser beam (20), - wherein the first group of laser pulses (34) forms a first laser writing beam (26) and the second group of laser pulses (34) forms a second laser writing beam (26). [10] Laser lithography device (10) according to claim 8 or 9, - wherein the demultiplexer unit (24) comprises a plurality of optical switches (28) arranged in series in the beam path of the input laser beam (20), - wherein each optical switch (28) is configured in a switched position to form a respective laser writing beam (26) by coupling out a laser beam portion sufficient to convert the lithographic material (12) into an exposed state. [11] Laser lithography device (10) according to one of the preceding claims 8 or 9, - wherein the demultiplexer unit (24) comprises an optical switch (28) arranged in the beam path of the input laser beam (20) after the laser beam source (18), - wherein the demultiplexer unit (24) has an optical arrangement which is designed to guide the input laser beam (20) several times over the optical switch (28), - wherein the optical switch (28) is configured in a switched position to form a laser writing beam (26) by coupling out a laser beam portion sufficient to convert the lithographic material (12) into an exposed state. [12] Laser lithography device (10) according to one of the preceding claims 8 to 11, - wherein the laser lithography device (10) has a power detection unit (32) for detecting a power of the input laser beam (20) in the beam path after the demultiplexer unit (24), - wherein the laser lithography device (10) has a control unit (30) which is configured to control the demultiplexer unit (24) for the purpose of forming the plurality of laser writing beams (26) by demultiplexing the input laser beam (20) as a function of the detected power. [13] Laser lithography device (10) according to one of the preceding claims 8 to 12, - wherein the laser lithography device (10) comprises a waveguide arrangement (54) having a plurality of waveguides (56) for guiding the plurality of laser writing beams (26), wherein each waveguide (56) is assigned to a laser writing beam (26), - wherein the waveguides (56) are arranged in the beam path between the demultiplexer unit (24) and the lens (70), - wherein each waveguide (56) has a first end (58) and a second end (60) opposite the first end (58), - wherein each first end (58) is adapted to couple in a laser writing beam (26) and each second end (60) is adapted to couple out the laser writing beam (26) coupled into the first end (58), - wherein the second ends (60) of the plurality of waveguides (56) are held by a holding matrix (62) of the waveguide arrangement (54). [14] Laser lithography device (10) according to claim 13, - wherein the second ends (60) of the plurality of waveguides (56) are held by the holding matrix (62) in a linear arrangement or in a two-dimensional arrangement. [15] Laser lithography device (10) according to one of the preceding claims 13 or 14, - wherein the distance between two adjacent second ends (60) of the plurality of waveguides (56) is 25 µm to 1000 µm, in particular 115 µm to 600 µm. [16] Laser lithography device (10) according to one of the preceding claims 13 to 15, - wherein each second end (60) of the plurality of waveguides (56) has an end face adapted to couple out the laser writing beam (26) coupled into the first end (58), - wherein the end faces of the second ends (60) are arranged in one plane. [17] Laser lithography device (10) according to one of the preceding claims 13 to 16, - wherein the scanning device (78) is configured to displace the focuses (72) relative to the lithography material holder (14) by means of a displacement of the holding matrix (62). [18] Laser lithography device (10) according to one of the preceding claims 13 to 17, - wherein each waveguide (56) is formed as a hollow core optical fiber. [19] Laser lithography device (10) according to one of the preceding claims 13 to 18, - wherein each waveguide (56) is selected from the group comprising: HC-PCF fibers, in particular HC-Kagome fibers, HC-PBGF fibers, HC-ARF fibers, HC-IC fibers, RH fibers, LMA fibers, PCF fibers.

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