Device and method for receiving a circuit board

Abstract

A device and a method for holding a circuit board (1) are proposed. The device includes a holding element (3) designed to hold the circuit board (1) within the device. Furthermore, the holding element prevents axial and radial movement of the circuit board (1). The holding element (3) also serves as a circuit board carrier and includes a cover (2). The socket for low-voltage contacting is integrated into the cover and protects the sensitive press-fit pins of the circuit board. The circuit board (1) can be positioned between the holding element (3) and the cover (2) by holding the circuit board (1) within the holding element and covering it with the cover (2). This allows for a pre-assembly stage to be implemented during assembly, which can lead to logistical advantages.Finally, the device includes a thermal conducting material (5) which can conduct heat between the high-voltage components and low-voltage components and contacts these components after the circuit board (1) has been inserted between the cover (2) and the holding device (3).

Description

[0001] The present invention relates to a device and a method for receiving a circuit board, such as those required, for example, in charging sockets for charging vehicles with electrical energy storage devices.

[0002] Such boards can consist of a high-voltage path and a low-voltage path. The high-voltage path carries conductors for electrical energy required to charge the energy storage device, while the low-voltage path carries conductors for electrical signals required for control and / or communication with the energy storage device being charged or its charging controller.

[0003] Typically, such circuit boards are held in place in the carrier by means of locking tabs. This means that the locking mechanism holds the board in place. It is also known to caulk the board in the carrier.

[0004] The low-voltage path includes a contact point on the circuit board. Since this point is susceptible to electric fields due to the high-voltage path and also sensitive to the circuit board's mounting, the contact point of the low-voltage path is protected by a collar. This collar is typically integrated into a housing on the rear of the device.

[0005] In known devices, one side of the circuit board is exposed after assembly and thus when the circuit board or device is in use.

[0006] Due to the often limited installation space of the device, the distances between the high-voltage and low-voltage paths are inevitably shortened. This requires creepage paths between the circuit board and the electrical components of the high-voltage path.

[0007] It is also necessary to move the board during assembly. To do this, the board should be protected from external influences to prevent damage to the board's components.

[0008] Additionally, the tolerances for the arrangement of the collar and the contacting option for the low-voltage path must be critically evaluated when integrating the device from the rear. The pins used for contacting are very sensitive during the assembly process and could be damaged.

[0009] The object of the present invention is therefore to disclose a device for holding a printed circuit board that overcomes the aforementioned problems. Thus, the device should provide the required creepage distances, protect the circuit board from external influences during and after assembly, and take into account the tolerance level of the contacting option for the low-voltage part.

[0010] These tasks are solved with the features of the main claim.

[0011] To this end, the present invention claims a device for holding a circuit board, comprising a holding device which is designed to hold the circuit board in the device and to prevent axial movement of the circuit board.

[0012] For this purpose, the holding devices can be designed at least partially as locking lugs that locally lock the circuit board into the holder. Likewise, ribs and / or collar elements on the holding device can at least partially provide the required fixation of the circuit board. Webs and / or retaining domes of the holding device can also engage in corresponding recesses in the circuit board to hold the circuit board in the fixture and prevent it from axially moving.

[0013] The circuit board contains low-voltage electrical components. The present invention protects these from high-voltage components in the device, e.g., an inlet in which the circuit board is installed.

[0014] According to the invention, the holding device is now designed as a board carrier. This means that the holding device can support the board without allowing any axial movement of the board. A holding device supports a board when it is held suspended in the holding device, i.e., not resting with one side of the board on the board carrier. This support is ensured by the aforementioned holding device.

[0015] The device according to the invention further includes a cover designed such that the circuit board, in the assembled state, is arranged between the cover and the holding device. This cover ensures that no side of the circuit board is exposed.

[0016] Finally, it is claimed that the device contains a thermally conductive material that can conduct heat between the high-voltage components and the low-voltage components. The thermally conductive material ensures that the heat from the high-voltage components can be optimally transported to the low-voltage components, e.g., a temperature sensor on the circuit board, during the charging process.

[0017] To protect the contacting of the low-voltage components, it is proposed that the device include a base that can accommodate several connection pins. These connection pins are then at least largely enclosed by the base, thus protecting them. The connection pins are electrically connected to the low-voltage components and can thus serve as a contacting option.

[0018] A seal on the base, which is integrated into a cover of the holding device, can ensure the required tightness of the device.

[0019] The circuit board can be locked into the holding device by means of locking hooks on the holding device, which can be used to lock the circuit board into the holding device. Additional locking hooks can also be provided on the holding device, which can also be used to lock the cover into or onto the holding device. For this purpose, the cover includes counter-locks by means of which the cover can be releasably locked to the holding device.

[0020] Heat equalization between the high-voltage components and the low-voltage components, such as the temperature sensor on the circuit board, is achieved via the thermally conductive material. This is preferably designed as a soft component and integrated into the holding device. This integration ensures local contact between the circuit board and the components of the circuit board during assembly of the device. If the circuit board is positioned between the cover and the holding device, the circuit board and the components of the circuit board automatically come into contact with the soft component.

[0021] The low-voltage component can include at least one sensor, e.g., a temperature sensor. In this case, the heat-conducting medium can serve as a temperature path between the temperature sensor and at least one of the contacts or conductors of the high-voltage components. Thus, the heat from the high-voltage components to be measured is conducted through the heat-conducting medium to the sensor.

[0022] The present invention is not limited to the aforementioned example for forming a temperature path. A temperature path can be formed between different high-voltage components and low-voltage components. For this purpose, the thermally conductive material can also be integrated into the holding device in certain areas to create different temperature paths.

[0023] The thermally conductive material is preferably designed in such a way that when the device is mounted or when the circuit board is arranged between the cover and the holding device, the components of the circuit board to be contacted are immersed in the thermally conductive material and thus enable heat conduction between the components.

[0024] In order to ensure the creepage distances between high-voltage components and low-voltage components mentioned above and required, ribs and collars are provided in the holding device.

[0025] On the other hand, the ribs, collars and retaining domes can prevent unwanted leakage currents by acting as barriers between high-voltage components and low-voltage components.

[0026] To secure the cover and facilitate installation, it is proposed that the retaining device and the cover be connected via a hinge. The use of a film hinge has proven advantageous in this case, as it requires little installation space and ensures easy installation. In this case, the cover is pivotably connected to the retaining device via the hinge.

[0027] If such a hinge is used, it is also advantageous to arrange the thermally conductive material over the hinge. This preferably extends the thermally conductive material from the retaining device across the hinge to the cover, enabling defined thermal conduction paths after assembly.

[0028] For assembling the device, a method is further proposed in which the aforementioned device is assembled as follows: First, the circuit board is placed between the holding device and the cover. To do this, the circuit board is first held over the holding device and locked if necessary. The cover is then attached to the holding device and locked if necessary, so that the circuit board is arranged between the cover and the holding device.

[0029] The thermally conductive material, which is at least integrated into the holding device, is brought into contact with the board or the components on the board by the arrangement of the board in the holding device, so that the board or the components automatically come into contact with the thermally conductive material during the assembly process. This allows heat to be conducted or equalized between the high-voltage and low-voltage components after assembly.

[0030] Attaching the cover to the retaining device further secures the circuit board and is preferably also done by locking it to the retaining device. The locking mechanism can be released at any time. The soft component presses the circuit board into place when the cover is locked to the retaining device, thus securing it axially.

[0031] If a device with a hinge is used between the cover and the holding device, the circuit board is arranged or fixed by pivoting and fastening the cover to the holding device.

[0032] The circuit board is then inserted into the holding device and then fixed by pivoting and fastening the cover to the holding device.

[0033] Further features are shown in the attached figures. Fig. 1: schematic representation of an assembled device according to the invention Fig. 2: Exploded view of a device according to the invention Fig. 3: Schematic representation of a holding device Fig. 4: Holding device and cover with hinge

[0034] Fig. 1 shows a device according to the invention for holding a circuit board 1, with a holding device 3 which is designed to hold the circuit board 1 in the device and to prevent an axial movement of the circuit board 1.

[0035] For this purpose, the holding device 3 has an edge that forms an interior of the holding device 3. The circuit board 1 can be accommodated in the interior. Locking lugs are arranged on the edge, which can locally lock the circuit board 1 in the holding device 3. Likewise, rib and / or collar elements on the holding device 3 can at least partially ensure the required fixation of the circuit board 1. Webs and / or retaining domes of the holding device 3 can also engage in corresponding recesses in the circuit board 1 so that the circuit board 1 is held in the device and prevented from radial movement.

[0036] In the Fig. 1, the holding device 3 is now designed as a circuit board carrier. This means that the holding device 3 can support the circuit board 1 without allowing any axial movement of the circuit board 1.

[0037] The device according to the invention further comprises a cover 2 which is designed in such a way that the circuit board 1 in the mounted state (which in Fig. 1) is arranged between the cover 2 and the holding device 3. This cover 2 ensures that no side of the circuit board 1 is exposed, as it is surrounded by the holding device 3 and the cover 2.

[0038] The aforementioned retaining domes can be arranged on the cover 2 and engage in the circuit board 1. The firm stop on the retaining domes, in conjunction with the compression by locking with the retaining device and a possible soft component designed as a thermally conductive material (see Fig. 3) for axial fixation of the board 1.

[0039] In order to protect the contacting of the low-voltage components, the device contains Fig. 1 a socket 4, which can accommodate several connection pins. These connection pins are then at least largely enclosed by the socket 4, thus protecting them. The connection pins are electrically connected to the low-voltage components and can thus serve as a contact point.

[0040] Fig. Figure 2 shows the individual parts of the device as an exploded view. A seal is arranged between the holding device 3 and the base 4 to protect the contacting device from moisture and / or wetness.

[0041] The circuit board is secured or locked in the holding device by providing locking hooks on the holding device 3, via which the circuit board 1 can be locked in the holding device 3. Further locking hooks are also provided on the holding device 3, via which the cover 2 is also locked in or onto the holding device 3. For this purpose, the cover 2 includes counter-locks by means of which the cover 2 is releasably locked to the holding device 3.

[0042] Fig. Figure 3 shows that the device includes a thermally conductive material 5 which can conduct heat between the high-voltage components and the low-voltage components.

[0043] The heat balance between the high-voltage components, e.g., an inlet or a charging socket, and low-voltage components, e.g., a temperature sensor on the circuit board 1, is achieved by the device's thermally conductive material 5. This is preferably designed as a soft component and integrated into the holding device 3. This integration ensures local contact with the circuit board 1 or the components of the circuit board 1 during assembly of the device. Fig. 3, the thermal conduction material 5 is designed as a soft component.

[0044] The thermally conductive material 5 is preferably designed such that when the device is mounted or when the circuit board 1 is arranged between the cover 2 and the holding device 3, the components of the circuit board 1 to be contacted are immersed in the thermally conductive material and thus enable heat conduction between the components.

[0045] In order to enable the creepage distances between high-voltage components and low-voltage components mentioned above, ribs and collars are provided in the holding device, which are Fig. 3 can be seen.

[0046] To hold the cover and facilitate assembly, it is proposed that the holding device and the cover be connected via a hinge 6. This is shown in the embodiment according to Fig. 4. The use of a film hinge has proven advantageous here, as it requires little installation space and ensures easy assembly. In this case, the cover 2 is pivotally connected to the holding device 3 via the hinge 6.

[0047] If such a hinge 6 is used, it is further advantageous to arrange the thermally conductive material 5 over the hinge 6.

[0048] To assemble the device, the following steps must be carried out, which are based on the Fig. 4 are explained: First, the circuit board 1 is placed between the holding device 3 and the cover 2. The circuit board is initially positioned on the retaining domes of the cover 2. This holds the circuit board radially in position. By locking the holding device 3 to the cover 2, the circuit board 1, with the integrated thermally conductive material 5, is pressed against the axial stop of the retaining domes. This prevents vertical or radial movement of the circuit board 1.

[0049] The thermally conductive material 5, which is at least integrated in the holding device 3, is brought into contact with the circuit board 1 or with the components on the circuit board 1 by the arrangement of the circuit board in the holding device, so that the circuit board 1 or the components automatically come into contact with the thermally conductive material 5 during the assembly process. This allows heat to be conducted or equalized between the high-voltage components and the low-voltage components after assembly.

[0050] Attaching the cover 2 to the holding device 3 further secures the circuit board 1 and is preferably also done by locking it to the holding device. The locking mechanism can be released at any time.

[0051] The arrangement or fixing of the circuit board 1 is done by pivoting and fastening the cover 2 to the holding device 3 by means of the hinge 6.

[0052] The circuit board 1 is then inserted into the holding device 3 and subsequently fixed by pivoting and fastening the cover 2 to the holding device 3.

[0053] The present invention is not limited by the above features. Rather, further embodiments are conceivable. For example, the hinge could be designed as an elastic element connecting the cover and the retaining device. Likewise, the device could be filled to protect the components. LIST OF REFERENCE SYMBOLS 1 board 2 Cover 3 Holding device 4 bases 5 Thermal conductive material 6 Hinge

Claims

[1] Device for receiving a circuit board (1), with a holding device (3) which is designed to hold the board (1) in the device and to prevent axial and radial movement of the board (1), with low-voltage electrical components on the circuit board (1), characterized by , that the holding device (3) is designed as a circuit board carrier, that the device includes a cover (2) which is designed such that the circuit board (1) can be arranged between the holding device (3) and the cover (2) and that the device includes a thermally conductive material (5) which can conduct heat between the high-voltage components of a higher-level system and low-voltage components of the circuit board (1). [2] Device according to claim 1, characterized bythat the holding device (3) includes holding domes which can engage in corresponding recesses in the circuit board (1) in order to prevent the axial and radial movement of the circuit board (1). [3] Device according to claim 1 or 2, characterized by that the device includes a base (4) which serves as a connection geometry for connection pins for connecting the low-voltage components and protects connection pins of the circuit board (1) during and after assembly. [4] Device according to claim 3, characterized by that a seal is arranged on the base (4) of the cover (2). [5] Device according to one of claims 1 to 4, characterized by that locking hooks are included on the holding device (3), via which the cover (4) can be releasably locked to the holding device (4) by means of counter-locks. [6] Device according to one of claims 1 to 5, characterized bythat the thermally conductive material (5) is designed as a soft component which is integrated in the holding device (3) and locally contacts the circuit board (1) arranged between the holding device (3) and the cover (2). [7] Device according to claim 6, characterized by that the soft component is designed to serve as a temperature path formation between a temperature sensor on the circuit board (1) and at least one contact of the high-voltage component. [8] Device according to claim 7, characterized by that when the circuit board (1) is arranged between the holding device (3) and the cover (2), the temperature sensor is immersed in the soft component. [9] Device according to one of claims 1 to 8, characterized by that the holding device (3) has ribs and collars to prevent unwanted creepage distances. [10] Device according to one of claims 1 to 9, characterized bythat the holding device (3) and the cover (2) are pivotally connected to one another via a hinge, in particular a film hinge. [11] Device according to claim 10, characterized by that the heat-conducting material is arranged from the holding device (3) via the film hinge to the cover (2). [12] Method for holding a circuit board (1) by means of a device according to one of claims 1 to 11, characterized by , that the circuit board (1) is arranged between the holding device (3) and a cover (2) and that when the circuit board (1) is arranged between the cover (2) and the holding device (3), a heat-conducting material (5) which can conduct heat between the high-voltage components and low-voltage components contacts the high-voltage components and low-voltage components. [13] Method according to claim 12, characterized bythat locking hooks are included on the holding device (3), via which the cover (4) is releasably locked to the holding device (4) by means of counter-locks. [14] Method according to claim 12 or 13, characterized by that the holding device (3) and the cover (2) are pivotally connected to one another via a hinge, in particular a film hinge, and the arrangement of the circuit board (1) between the cover (4) and the holding device (3) takes place by pivoting the cover (4). [15] Method according to one of claims 12 to 14, characterized by that holding geometries for contacts of the low-voltage components integrated in the device hold them axially in position.

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