MIXTURE DETECTION METHOD FOR CARDANICALLY MOUNTED SCANNERS

Abstract

Scanning system (100, 300, 400), comprising: an oscillator structure (102, 302, 402) configured to oscillate an inner axis (112) according to a first oscillation and to oscillate an outer axis (110) according to a second oscillation; an inner frame (304, 404) which is mechanically coupled to the oscillator structure (102, 302, 402) by a first support structure (308, 408) and a second support structure (310, 410), wherein the first support structure (308, 408) and the second support structure (310, 410) extend between the inner frame (304, 404) and the oscillator structure (102, 302, 402) along the inner axis (112) and wherein the first support structure (308, 408) is arranged opposite the second support structure (310, 410) relative to the oscillator structure (102, 302, 402); an outer frame (306, 406) which is mechanically coupled to the inner frame (304, 404) by a third support structure (312, 412) and a fourth support structure (314, 414), wherein the third support structure (312, 412) and the fourth support structure (314, 414) extend between the inner frame (304, 404) and the outer frame (306, 406) along the outer axis (110) and wherein the third support structure (312, 412) is arranged opposite the fourth support structure (314, 414) relative to the oscillator structure (102, 302, 402); and an inner axis sensor (318, 418) positioned between the inner frame (304, 404) and the outer frame (306, 406), wherein the inner axis sensor (318, 418) is configured to detect a first relative movement of the inner frame (304, 404) relative to the outer frame (306, 406) and to generate a first sensor signal corresponding to the first relative movement, where the first sensor signal is representative of a first angular position of the oscillator structure (102, 302, 402) around the inner axis (112), wherein the inner frame (304, 404) and the outer frame (306, 406) are structured such that the first oscillation causes the inner frame (304, 404) to oscillate relative to the outer frame (306, 406) in a region of the inner axis sensor (318, 418) via a mixing effect, and wherein the inner axis sensor (318, 418) is arranged near the outer axis (110) such that the inner axis sensor (318, 418) is arranged closer to the outer axis (110) than to the inner axis (112).

Description

JOINT ENTERPRISE

[0001] The project that led to this application was funded by the Electric Component Systems for European Leadership Joint Undertaking under grant agreement No. 826653. This joint undertaking is supported by the European Union’s Horizon 2020 research and innovation program and by Germany, Austria, the Netherlands, France, Finland, Italy, Belgium, the Czech Republic, Spain, Cyprus, Lithuania, and Turkey. BACKGROUND

[0002] A scanning system can use two-dimensional scanning to scan one or more light rays within a field of view (FOV) according to a scanning pattern. The scanning system can use two scanning axes, comprising a first scanning axis configured to direct the one or more light rays in a first direction at a first scanning frequency, and a second scanning axis configured to direct the one or more light rays in a second direction at a second scanning frequency. The second scanning axis is typically perpendicular to the first scanning axis.Microelectromechanical systems (MEMS) scanning systems use precise and accurate feedback to drive the transmission timing of the light beams and correctly synchronize them with the movement of a MEMS scanner, even under challenging conditions such as external vibrations or temperature fluctuations. Additionally, synchronizing the first and second sampling frequencies is crucial to maintaining a specific scanning pattern throughout a scanning operation.

[0003] Publication US 2019 / 0235232 A1 relates to an optical scanning device and a method for manufacturing an optical scanning device.

[0004] Publication JP 2017 - 207 631 A concerns a light deflector.

[0005] Publication DE 10 2021 116 121 B3 concerns a microscanner with meander spring-based mirror suspension. SUMMARY

[0006] There may be a need to provide an improved concept for a scanning system, a system, and a procedure.

[0007] Such a need can be met by the subject matter of one of the claims.

[0008] In some implementations, a sampling system comprises an oscillator structure configured to oscillate an inner axis according to a first oscillation and an outer axis according to a second oscillation; an inner frame mechanically coupled to the oscillator structure by a first support structure and a second support structure, wherein the first support structure and the second support structure extend between the inner frame and the oscillator structure along the inner axis, and wherein the first support structure is positioned opposite the second support structure relative to the oscillator structure;an outer frame mechanically coupled to the inner frame by a third support structure and a fourth support structure, wherein the third support structure and the fourth support structure extend between the inner frame and the outer frame along the outer axis and wherein the third support structure is arranged opposite the fourth support structure relative to the oscillator structure;and an inner axis sensor positioned between the inner frame and the outer frame, the inner axis sensor being configured to detect a first relative movement of the inner frame relative to the outer frame and to generate a first sensor signal corresponding to the first relative movement, the first sensor signal being representative of a first angular position of the oscillator structure around the inner axis. The inner frame and the outer frame are structured such that the first oscillation causes the inner frame, via a mixing effect, to oscillate relative to the outer frame in a region of the inner axis sensor. The inner axis sensor is arranged such that it is located closer to the outer axis than to the inner axis.

[0009] In some implementations, a system comprises a rotating structure configured to rotate an inner axis according to a first rotation and around an outer axis according to a second rotation; an inner frame mechanically coupled to the rotating structure by a first support structure and a second support structure, wherein the first support structure and the second support structure extend between the inner frame and the rotating structure along the inner axis, and wherein the first support structure is positioned opposite the second support structure relative to the rotating structure;an outer frame which is mechanically coupled to the inner frame by a third support structure and a fourth support structure, wherein the third support structure and the fourth support structure extend between the inner frame and the outer frame along the outer axis and wherein the third support structure is arranged relative to the rotating structure opposite the fourth support structure;and an inner axis sensor positioned between the inner frame and the outer frame, the inner axis sensor being configured to detect a first relative movement of the inner frame relative to the outer frame and to generate a first sensor signal corresponding to the first relative movement, the first sensor signal being representative of a rotational position of the rotating structure about the inner axis. The inner frame and the outer frame are configured such that the first oscillation causes the inner frame, via a mixing effect, to oscillate relative to the outer frame in a region of the inner axis sensor. The inner axis sensor is arranged such that it is located closer to the outer axis than to the inner axis.

[0010] In some implementations, a method comprises driving an oscillator structure about an inner axis according to a first oscillation; driving the oscillator structure about an outer axis according to a second oscillation; and detecting a first relative motion of an inner frame relative to an outer frame to generate a first sensor signal corresponding to the first relative motion, wherein the first sensor signal is representative of a first angular position of the oscillator structure about the inner axis, wherein the inner frame is mechanically coupled to the oscillator structure by first support structures extending along the inner axis, and wherein the outer frame is mechanically coupled to the inner frame by second support structures extending along the outer axis.The inner and outer frames are structured such that the first oscillation causes the inner frame, via a mixing effect, to oscillate relative to the outer frame in a region of the inner axis sensor. The inner axis sensor is positioned close to the outer axis such that it is closer to the outer axis than to the inner axis. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Implementations are described herein with reference to the accompanying drawings. Fig. Figure 1 is a schematic block diagram of a 2D scanning system according to one or more implementations. Fig. Figure 2 is a signal diagram of a position signal generated by a 2D scanning system based on a mirror angle, according to one or more implementations. Fig. Figure 3 illustrates a top view of a MEMS mirror according to one or more implementations. Fig. Figure 4A illustrates a top view of a MEMS mirror according to one or more implementations. Fig. 4B illustrates a side view of the in Fig. 4A MEMS mirror shown according to one or more implementations. Fig. Figure 5 is a flowchart of an exemplary process associated with an admixture detection procedure for gimbal-mounted scanners. DETAILED DESCRIPTION

[0012] Details are provided below to offer a more comprehensive explanation of the exemplary implementations. However, it is obvious to experts in the field that these implementations can be executed in practice without these specific details. In other cases, known structures and components are shown in block diagram form or in a schematic view, rather than in detail, to avoid obscuring the implementations. Furthermore, features of the various implementations described herein can be combined unless specifically stated otherwise.

[0013] Furthermore, equivalent or identical elements, or elements with equivalent or identical functionality, are designated by equivalent or identical reference symbols in the following description. Since the same or functionally equivalent elements are given the same reference symbols in the figures, repeated descriptions for elements provided with the same reference symbols can be omitted. Thus, descriptions for elements with the same or similar reference symbols are mutually interchangeable.

[0014] In this context, directional terminology such as "upper," "lower," "below," "above," "front," "behind," "back," "leading," "following," etc., can be used to describe the orientation of the figures described. Since parts of the implementations described here can be positioned in a number of different orientations, the directional terminology serves only for illustration and is in no way restrictive. It is understood that other implementations can be used and structural or logical changes can be made without deviating from the scope of protection defined by the claims. The following detailed description should therefore not be taken in a restrictive sense.

[0015] It should be noted that when an element is described as "connected" or "coupled" to another element, the element may be directly connected or coupled to the other element, or intermediate elements may be present. Conversely, when an element is described as "directly" "connected" or "coupled" to another element, no intermediate elements are present. Other expressions used to describe the relationship between elements should be interpreted similarly (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.).

[0016] In the implementations described herein or shown in the drawings, any direct electrical connection or coupling, e.g., any connection or coupling without any additional intervening elements, may also be implemented by an indirect connection or coupling, e.g., a connection or coupling with one or more additional intervening elements, or vice versa, as long as the general purpose of the connection or coupling, e.g., transmitting a certain type of signal or transmitting a certain type of information, is substantially maintained. Features of different implementations may be combined to form other implementations. For example, modifications or alterations described in relation to one of the implementations may also be applicable to other implementations unless otherwise specified.

[0017] The terms "essentially" and "approximately" can be used here to account for small manufacturing tolerances or other factors (e.g., within 5%) that are considered acceptable in the industry, without deviating from the aspects of the implementations described here. For example, a resistor with an approximate resistance value may practically have a resistance value within 5% of that approximate value.

[0018] In the present disclosure, expressions including ordinal numbers, such as "first," "second," and / or the like, may modify various elements. However, such elements are not limited by the preceding expressions. For example, the preceding expressions do not restrict the sequence and / or importance of the elements. The preceding expressions are used merely for the purpose of distinguishing one element from the others. For example, a first box and a second box denote different boxes, although both are boxes. As another example, a first element could be designated as a second element, and similarly, a second element could be designated as a first element, without departing from the scope of protection of the present disclosure.

[0019] A single microelectromechanical system (MEMS) mirror can be driven around two or more scanning axes for use as a scanning device. A MEMS mirror driven around two scanning axes can be referred to as a two-dimensional (2D) MEMS mirror, for example, because the MEMS mirror can be steered in two dimensions using the two scanning axes. A MEMS mirror-based light beam scanner is one way to implement image projection technologies and object detection technologies such as light detection and ranging (LIDAR).

[0020] A gimbal design can be implemented for the 2D MEMS mirror due to its separation of the two scanning axes. In the gimbal design, a mirror plate moves around an inner axis within a gimbal frame (e.g., an inner frame) supported by internal suspension structures. Additionally, the gimbal frame, the mirror plate, and the internal suspension structures rotate around an outer axis supported by external suspension structures attached to a chip frame (e.g., an outer frame). The gimbal design effectively decouples the two scanning directions.

[0021] To perform feedback acquisition, an inner axis sensor is used to detect the rotational position of an inner axis movement around the inner axis, and an outer axis sensor is used to detect the rotational position of an outer axis movement around the outer axis. Independent measurements of the movement around the inner axis and the movement around the outer axis can then be used as feedback information. This feedback is used to drive and correctly synchronize the transmission times of light beams with the movements of the 2D MEMS mirror and to synchronize an inner axis sampling frequency with an outer axis sampling frequency.

[0022] To drive a 2D MEMS mirror around its inner axis and enable feedback of its motion, wires typically need to be routed across the outer suspension structures. This can degrade the strength and reliability of these structures and potentially lead to premature failure. Therefore, reducing the number of wires routed across the outer suspension structures to drive and sense the inner axis motion increases the design space and reliability of the 2D MEMS mirror.

[0023] In some implementations, an admixture of the gimbal frame, specifically related to inner axis motion, can be used to enable the detection of inner axis motion. This detection can be based, for example, on relative motion between the outer frame and the gimbal frame. Detecting this relative motion allows the inner axis sensor to be placed between the outer frame and the gimbal frame, as opposed to placing it between the gimbal frame and the reflective plate of the 2D MEMS mirror. Placing the inner axis sensor between the outer frame and the gimbal frame reduces the number of wires routed over the outer suspension structures.For example, due to the placement of the inner axis sensor between the outer frame and the gimbal frame, the wires used to detect the inner axis movement (e.g., used to transmit feedback information from the inner axis sensor to a measuring circuit) no longer need to be routed through the outer suspension structures. This reduces the number of wires routed through the outer suspension structures and improves their strength and reliability.

[0024] Fig. Figure 1 is a schematic block diagram of a 2D scanning system 100 according to one or more implementations. In particular, the 2D scanning system 100 may comprise a microelectromechanical system (MEMS) mirror 102, which is implemented as a single scanning structure configured to direct or otherwise deflect light beams according to a 2D scanning pattern. The 2D scanning system 100 further comprises a MEMS driver system 104, a system controller 106, and a light emitter 108.

[0025] At the in Fig. In the example shown, the MEMS mirror 102 is a mechanically movable mirror (e.g., a MEMS micromirror) integrated on a semiconductor chip (not shown). The MEMS mirror 102 is configured to rotate or oscillate about two scanning axes, which are typically orthogonal to each other. The two scanning axes can, for example, include a first scanning axis 110 (e.g., an outer scanning axis), which allows the MEMS mirror 102 to direct light in a first scanning direction (e.g., an x-direction), and a second scanning axis 112 (e.g., an inner scanning axis), which allows the MEMS mirror 102 to direct light in a second scanning direction (e.g., a y-direction). As a result, the MEMS mirror 102 can direct light rays in two dimensions according to the 2D scanning pattern and can be referred to as a 2D MEMS mirror.

[0026] A scan can be performed to illuminate an area called the field of view. The scan, such as an oscillating horizontal scan (e.g., from left to right and right to left of a field of view), an oscillating vertical scan (e.g., from bottom to top and top to bottom of a field of view), or a combination thereof (e.g., a Lissajous scan or a raster scan), can illuminate the field of view in a continuous scanning manner. In some implementations, the 2D scanning system 100 can be configured to send successive beams of light, e.g., as successive light pulses, in different scanning directions to scan the field of view. In some implementations, the 2D scanning system 100 can be configured to send a continuous beam of light, e.g.,The field of view is transmitted as a frequency-modulated continuous wave (FMCW) in various scanning directions to scan the field of view. In other words, the field of view can be illuminated by a scanning operation. Generally, the entire field of view represents a scanning area defined by the entire range of motion of the MEMS mirror 102, within which the MEMS mirror 102 is driven. Thus, the entire field of view is bounded by a left edge, a right edge, a bottom edge, and an top edge. The entire field of view can also be referred to as the illumination area or the projection area in a projection plane onto which an image is projected.

[0027] The MEMS mirror 102 can direct a transmitted light beam to a desired 2D coordinate (e.g., an xy coordinate) within the field of view. In some implementations, such as light detection and ranging (LIDAR), the transmitted light beam can be backscattered by an object towards the 2D scanning system 100 as a reflected light beam, where the reflected light beam is detected by a sensor. The sensor can be, for example, a photodetector array. The sensor can convert the reflected light beam into an electrical signal, such as a current or voltage signal, which can be further processed by the 2D scanning system 100 to generate object data or an image.In such implementations, the desired 2D coordinate can correspond to a specific transmission direction in the field of view, towards which the emitted light beam is directed for object detection, with different 2D coordinates corresponding to different transmission directions. Alternatively, in some implementations, such as image projection systems, the desired 2D coordinate can correspond to an image pixel of a projected image, with different 2D coordinates corresponding to different image pixels of the projected image.

[0028] Accordingly, multiple light beams transmitted at different times, or a single continuous light beam, can be directed by the MEMS mirror 102 to the various 2D coordinates of the field of view according to the 2D scanning pattern. The MEMS mirror 102 can be used to scan the field of view in both scanning directions by changing the deflection angle of the MEMS mirror 102 on each of the first scanning axis 110 and the second scanning axis 112.

[0029] A rotation of the MEMS mirror 102 on the first scanning axis 110 can be performed between two predetermined extreme deflection angles (e.g., + / -5 degrees, + / -15 degrees, etc.). Likewise, a rotation of the MEMS mirror 102 on the second scanning axis 112 can be performed between two predetermined extreme deflection angles (e.g., + / -5 degrees, + / -15 degrees, etc.). In some implementations, depending on the 2D scanning pattern, the two predetermined extreme deflection angles used for the first scanning axis 110 will be the same as the two predetermined extreme deflection angles used for the second scanning axis 112. In some implementations, depending on the 2D scanning pattern, the two predetermined extreme deflection angles used for the first scanning axis 110 may differ from the two predetermined extreme deflection angles used for the second scanning axis 112.

[0030] In some implementations, the MEMS mirror 102 can be a resonator (e.g., a resonant MEMS mirror) configured to oscillate side-to-side around the first scanning axis 110 at a first frequency (e.g., a first resonant frequency) and to oscillate side-to-side around the second scanning axis 112 at a second frequency (e.g., a second resonant frequency). Thus, the MEMS mirror 102 can be continuously driven around the first scanning axis 110 and the second scanning axis 112 to perform a continuous scanning operation. As a result, light rays reflected from the MEMS mirror 102 are scanned into the field of view according to the 2D scanning pattern.

[0031] Different frequencies or the same frequency can be used for the first scanning axis 110 and the second scanning axis 112 to define the 2D scanning pattern. For example, a raster scanning pattern or a Lissajous scanning pattern can be achieved by using different frequencies for the first and second frequencies. Raster scanning and Lissajous scanning are two types of scanning that can be implemented in display applications, light scanning applications, and light guidance applications, among others. Lissajous scanning, for instance, typically uses two resonant scanning axes driven at different constant sampling frequencies with a defined fixed frequency ratio between them, forming a specific Lissajous pattern and frame rate.In order to properly perform the Lissajous scanning and the raster scanning, the synchronization of the two scanning axes is carried out by the system control 106 in conjunction with the transmission times of the light transmitter 108.

[0032] For each scanning axis, comprising the first scanning axis 110 and the second scanning axis 112, the MEMS mirror 102 has an actuator structure used to drive the MEMS mirror 102 around the respective scanning axis. Each actuator structure can include toothed finger electrodes made of toothed mirror combs and frame combs, to which a drive voltage (e.g., an actuation or control signal) is applied by the MEMS driver system 104. Applying a potential difference between interleaved mirror combs and frame combs generates a driving force between the mirror combs and the frame combs, which produces a torque on a mirror body of the MEMS mirror 102 around the intended scanning axis. The drive voltage can be switched (toggled) between two voltages, resulting in an oscillating driving force.The oscillating drive force causes the MEMS mirror 102 to oscillate backward and forward between two extremes on the respective scanning axis. Depending on the configuration, this actuation can be controlled or adjusted by modifying the drive voltage off-time, a voltage level of the drive voltage, or a duty cycle.

[0033] In other examples, the MEMS mirror 102 can use different actuation methods to drive it around the respective scanning axes. These other actuation methods can include, for example, electromagnetic actuation and / or piezoelectric actuators. In electromagnetic actuation, the MEMS mirror 102 can be immersed in a magnetic field, and an alternating electric current through conductive paths can generate the oscillating torque around the scanning axis. Piezoelectric actuators can be integrated into leaf springs of the MEMS mirror 102, or the leaf springs can be made of piezoelectric material to produce alternating beam bending forces in response to an electrical signal, thus generating the oscillating torque.

[0034] The MEMS driver system 104 is configured to generate control signals (e.g., actuation signals) to drive the MEMS mirror 102 about the first scanning axis 110 and the second scanning axis 112. In particular, the MEMS driver system 104 is configured to apply the control signals to the actuator structure of the MEMS mirror 102. In some implementations, the MEMS driver system 104 comprises a first MEMS driver 114 configured to drive the MEMS mirror 102 about the first scanning axis 110, and a second MEMS driver 116 configured to drive the MEMS mirror 102 about the second scanning axis 112.In implementations where the MEMS mirror 102 is used as an oscillator, the first MEMS driver 114 is configured to drive an oscillation of the MEMS mirror 102 around the first scanning axis 110 at the first frequency, and the second MEMS driver 116 is configured to drive an oscillation of the MEMS mirror 102 around the second scanning axis 112 at the second frequency.

[0035] The first MEMS driver 114 can be configured to detect an outer axis movement (e.g., a first rotation position) of the MEMS mirror 102 about the first scanning axis 110 using an outer axis sensor and to provide initial position information indicating the first rotation position (e.g., tilt angle or degree of rotation about the first scanning axis 110) to the control unit 106. Similarly, the second MEMS driver 116 can be configured to detect an inner axis movement (e.g., a second rotation position) of the MEMS mirror 102 about the second scanning axis 112 using an inner axis sensor and to provide second position information indicating the second rotation position (e.g., tilt angle or degree of rotation about the second scanning axis 112) to the control unit 106.

[0036] The control unit 106 can use the first and second position information to trigger light beams at the light transmitter 108. For example, the control unit 106 can use the first and second position information to set a transmission time of the light transmitter 108 to target a specific 2D coordinate of the 2D scanning pattern. Thus, higher accuracy in position detection of the MEMS mirror 102 by the first MEMS driver 114 and the second MEMS driver 116 can enable the control unit 106 to provide more accurate and precise control of other components of the 2D scanning system 100.

[0037] As mentioned previously, the first MEMS driver 114 and the second MEMS driver 116 can apply a drive voltage to a corresponding actuator structure of the MEMS mirror 102 as a control signal to drive a rotation (e.g., an oscillation) of the MEMS mirror 102 around a respective scanning axis (e.g., the first scanning axis 110 or the second scanning axis 112). The drive voltage can be switched or toggled between a high-voltage (HV) level and a low-voltage (LV) level, resulting in an oscillating drive force. In some implementations, the LV level can be zero (e.g., the drive voltage is off), but it is not limited to this and can be a non-zero value.When the drive voltage switches between a high-voltage (HV) and a low-voltage (LV) level, and the LV level is set to zero, the drive voltage can be said to be switched between an on and off state (HV on / off). The oscillating drive force causes the MEMS mirror 102 to oscillate backward and forward between two extremes on the first scanning axis 110 or the second scanning axis 112. The drive voltage can be a constant voltage, meaning that the drive voltage is the same voltage when actuated (e.g., switched to an on state), or one or both of the HV or LV levels of the drive voltage can be adjustable. It is understood, however, that the drive voltage is switched between the HV and LV levels to produce the mirror oscillation.Depending on the configuration, this actuation can be controlled or adjusted by the 106 control unit by modifying the drive voltage off-time, the drive voltage level, or the duty cycle. As mentioned previously, the frequency and phase of the drive voltage can also be controlled and adjusted.

[0038] In some implementations, the control unit 106 is configured to set a drive frequency of the MEMS mirror 102 for each scanning axis and is capable of synchronizing the oscillations around the first scanning axis 110 and the second scanning axis 112. Specifically, the control unit 106 can be configured to control the actuation of the MEMS mirror 102 around each scanning axis by controlling the drive signals. The control unit 106 can control the frequency, phase, duty cycle, high-voltage (HV) level, and / or low-voltage (LV) level of the drive signals to control the actuations around the first scanning axis 110 and the second scanning axis 112. Actuation of the MEMS mirror 102 around a specific scanning axis controls its range of motion and its sampling rate around that specific scanning axis.

[0039] For example, to cause a Lissajous scanning pattern to reproduce itself periodically at a frame rate frequency, the first frequency at which the MEMS mirror 102 is driven around the first scanning axis 110 and the second frequency at which the MEMS mirror 102 is driven around the second scanning axis 112 are different. A difference between the first and second frequencies is set by a fixed frequency ratio, which is used by the 2D scanning system 100 to generate a repeatable Lissajous pattern (frame) at a frame rate. A new frame begins each time the Lissajous scanning pattern restarts, which can occur when the phase difference between a mirror phase around the first scanning axis 110 and a mirror phase around the second scanning axis 112 is zero.The system control 106 can set the fixed frequency ratio and synchronize the oscillations around the first scanning axis 110 and the second scanning axis 112 to ensure that this fixed frequency ratio is maintained based on the first position information and the second position information received by the first MEMS driver 114 and the second MEMS driver 116, respectively.

[0040] The light emitter can include one or more light sources, such as one or more laser diodes or one or more light-emitting diodes, to generate one or more light beams. In some implementations, the light emitter 108 can be configured to sequentially transmit a multitude of light beams (e.g., light pulses) when the MEMS mirror 102 changes its transmission direction to target different 2D coordinates. The multitude of light beams can include visible light, infrared, IR, light, or other types of illumination signals, depending on the application of the 2D scanning system 100. A transmission sequence of the multitude of light beams and their timing can be implemented by the light emitter 108 according to a trigger signal received from the system controller 106.Alternatively, in some implementations, the light emitter 108 can be configured to emit a continuous beam of light when the MEMS mirror 102 changes its transmission direction to target different 2D coordinates. The continuous beam of light can include visible light, IR light, or another type of illumination signal, depending on the application of the 2D scanning system 100.

[0041] The control unit 106 is configured to control components of the 2D scanning system 100. In certain applications, the control unit 106 can also be configured to receive programming information relating to the 2D scanning pattern and to control the timing of the multiple light beams generated by the light source 108 based on this programming information. Thus, the control unit 106 can comprise both a processing and a control circuit arrangement configured to generate control signals for controlling the light source 108, the first MEMS driver 114, and the second MEMS driver 116.

[0042] In some implementations, the control unit 106 is configured to use independent measurements of the outer axis movement around the first scanning axis 110 and the inner axis movement around the second scanning axis 112 to drive and correctly synchronize the transmission times of the multitude of light beams with the movements of the MEMS mirror 102 and to synchronize a first sampling frequency of the first scanning axis 110 and a second sampling frequency of the second scanning axis 112. For example, the control unit 106 can be configured to set the drive frequencies of the MEMS mirror 102 for the first scanning axis 110 and the second scanning axis 112 and can be capable of synchronizing the oscillations around the first scanning axis 110 and the second scanning axis 112 to generate the 2D scanning pattern.In some implementations using multiple light beams, the control unit 106 can be configured to generate the trigger signal used to trigger the light source 108 to generate the multiple light beams. Using the trigger signal, the control unit 106 can control the transmission times of the multiple light beams from the light source 108 to achieve a desired illumination pattern within the field of view. The desired illumination pattern is produced by a combination of the 2D scanning pattern produced by the MEMS mirror 102 and the transmission times triggered by the control unit 106. In some implementations using a continuous light beam, the control unit 106 can be configured to control frequency modulation of the continuous light beam via a control signal provided to the light source 108.

[0043] As shown above, Fig. 1 is provided merely as an example. Other examples are possible and may differ from what is provided in relation to Fig. As described in section 1, the 2D scanning system can differ. In practice, it can have 100 additional components, fewer components, different components, or differently arranged components than those described in section 1. Fig. 1. The 2D scanning system shown here includes, without deviating from the disclosure provided above. In addition, in some implementations, the 2D scanning system 100 may include one or more additional 2D MEMS mirrors or one or more additional light emitters used to scan one or more additional fields of view. Furthermore, two or more components that are in Fig. 1 are shown, are implemented within a single component, or a single component that is in Fig. Figure 1 shows that the 2D scanning system 100 can be implemented as multiple, distributed components. Additionally or alternatively, a set of components (e.g., one or more components) of the 2D scanning system 100 can perform one or more functions that are described as being performed by another set of components of the 2D scanning system 100.

[0044] Fig. Figure 2 is a signal diagram 200 of a position signal POS generated by a 2D scanning system based on a mirror angle θ, according to one or more implementations. Fig. Figure 2 illustrates the position signal POS relative to a symbolic mirror orientation of a MEMS mirror and relative to a mirror angle trajectory of the mirror angle θ of the MEMS mirror. A positive reference angle θref and a negative reference angle -θref are used as reference angles for the mirror angle trajectory, where a positive mirror angle corresponds to a MEMS mirror tilt in a left (L) direction and a negative mirror angle corresponds to a MEMS mirror tilt in a right (R) direction.

[0045] The in Fig. The MEMS driver system 104 described in Figure 1 can generate the position signal POS for each of the scanning axes, comprising the first scanning axis 110 and the second scanning axis 112. For example, the first MEMS driver 114 can perform position sensing to monitor a mirror position (e.g., the mirror angle θ) around the first scanning axis 110 and generate the position signal POS, which corresponds to an angular trajectory around the first scanning axis 110. Similarly, the second MEMS driver 116 can perform position sensing to monitor a mirror position (e.g., the mirror angle θ) around the second scanning axis 112 and generate the position signal POS, which corresponds to an angular trajectory around the second scanning axis 112. Thus, while in Fig. 2 where only one position signal POS is shown, it is pointed out that the MEMS driver system 104 can generate two position signals, each position signal POS corresponding to one from the first scanning axis 110 or the second scanning axis 112.

[0046] In some implementations, the position signal POS can be a square wave with a first signal transition (e.g., a falling-edge transition) that is triggered at a zero crossing when a MEMS mirror oscillates in a first rotation direction (e.g., clockwise), and a second signal transition (e.g., a rising-edge transition) that is triggered at a zero crossing when the mirror oscillates in a second rotation direction (e.g., counterclockwise). Furthermore, the position signal POS is "high" when the MEMS mirror is pointing in one direction (e.g., left) and "low" when the mirror is pointing in a second direction (e.g., right).The position signal POS not only indicates a zero-crossing event by triggering a signal transition, but also provides absolute phase information by indicating the tilt direction of the MEMS mirror and / or the direction in which the MEMS mirror is moving. As the intervals between zero-crossing events increase, the frequency of the position signal POS decreases. Conversely, the frequency of the position signal POS increases with increasing intervals between zero-crossing events. Thus, the position signal POS is also representative of the frequency of the MEMS mirror around a given scanning axis.

[0047] Alternatively, in some implementations, the position signal POS can be a pulsed signal, comprising short signal pulses. For example, a short pulse can be generated at each zero-crossing event. In other words, the position signal POS remains low (or high) between signal pulses. In this case, the absolute phase information, which indicates the direction in which the mirror is moving, is not present.

[0048] In some implementations, the first MEMS driver 114 can receive a measurement signal to continuously acquire a rotational position (e.g., an angular position) around the first scanning axis 110 and generate the position signal POS for the first scanning axis 110, which indicates detected zero-crossing events. For example, the first MEMS driver 114 can detect zero-crossing events where a value of the measurement signal is detected as equal to a predefined value corresponding to a zero rotation angle around the first scanning axis 110, and generate the position signal POS, which indicates each of the detected zero-crossing events corresponding to the first scanning axis 110.

[0049] Similarly, the second MEMS driver 116 can receive a measurement signal to continuously detect a rotational position around the second scanning axis 112 and generate the position signal POS for the second scanning axis 112, which indicates detected zero-crossing events. For example, the second MEMS driver 116 can detect zero-crossing events where a value of the measurement signal is detected as equal to a predefined value corresponding to a zero rotation angle around the second scanning axis 112, and generate the position signal POS, which indicates each of the detected zero-crossing events corresponding to the second scanning axis 112.

[0050] In some implementations, the measurement signals used by the first MEMS driver 114 and the second MEMS driver 116 can be obtained as follows. When a MEMS mirror rotates, a capacitance of the actuating structure (e.g., a capacitance between toothed finger electrodes) can change according to the rotational position of the MEMS mirror. The first MEMS driver 114 and the second MEMS driver 116 can be configured to measure the capacitance of the actuating structure of a respective scanning axis (e.g., the first scanning axis 110 or the second scanning axis 112) and determine the rotational position from this. For example, when the MEMS mirror 112 moves about the first scanning axis 110, a geometry of the actuating structure corresponding to the first scanning axis 110 changes, resulting in a change in the geometry of the capacitance. When the geometry of the capacitance changes, the capacitance itself changes.Thus, a specific capacitance can directly correspond to a specific rotational position (e.g., a specific tilt angle) of the MEMS mirror 102 about the first scanning axis 110. As an example, one way to measure the capacitance is to measure a current flowing through the actuating structure, convert the current into a voltage, and then further correlate the voltage with a capacitance and / or the rotational position. However, any method can be used to measure the capacitance. A direction of rotation (e.g., positive or negative, left-to-right or right-to-left, clockwise or counterclockwise, etc.) is also detected by measuring a change in capacitance over time, with a positive or negative change indicating opposite directions of rotation.

[0051] Accordingly, the first MEMS driver 114 can be configured to detect the capacitance of the actuation structure corresponding to the first scanning axis 110 in order to monitor and track the angular trajectory of the MEMS mirror 102 around the first scanning axis 110 and to determine a specific rotational position of the MEMS mirror 102 around the first scanning axis 110, including the zero crossings. Similarly, the second MEMS driver 116 can detect the capacitance of the actuation structure corresponding to the second scanning axis 112 in order to monitor and track the angular trajectory of the MEMS mirror 102 around the second scanning axis 112 and to determine a specific rotational position of the MEMS mirror 102 around the second scanning axis 112, including the zero crossings.

[0052] The MEMS driver system 104 can be configured to send the position signal POS for each scanning axis as position information to the control unit 106. Based on the position signal POS, the control unit 106 can compare the phase and / or frequency of two or more position signals POS to synchronize oscillations around the first scanning axis 110 and the second scanning axis 112. For example, based on the position signal POS of the first scanning axis 110, the control unit 106 can obtain at least one phase or frequency information from the MEMS mirror 102 around the first scanning axis 110. Similarly, based on the position signal POS of the second scanning axis 112, the control unit 106 can obtain at least one phase or frequency information from the MEMS mirror 102 around the second scanning axis 112.The system control 106 can use the phase information, the frequency information, or both the phase information and the frequency information to synchronize the oscillations around the first scanning axis 110 and the second scanning axis 112.

[0053] Furthermore, in some implementations, the control unit 106 can use the position information to control the triggering of the light beams. The control unit 106 can also use the position information as feedback, enabling it to maintain stable operation of one or more MEMS mirrors via control signals provided to the MEMS driver system 104. The control unit 106 can also use the position information as feedback to maintain synchronization between the two or more scanning axes, comprising the first scanning axis 110 and the second scanning axis 112.The position information can also be used by the control unit 106 to achieve a fast Lissajous locking between two oscillations when starting up a 2D scanner system, thus reducing the time until the 2D scanner system is ready to send the light beams.

[0054] As shown above, Fig. 2 is provided merely as an example. Other examples are possible and may differ from what is provided in relation to Fig. 2, as described. In practice, the position signal POS can be any signal capable of indicating position information, comprising at least one of the following: phase information, frequency information, or zero-crossing information. Accordingly, the waveform of the position signal POS can differ from that described in 2. Fig. The two shown differ.

[0055] Fig. Figure 3 illustrates a top view of a MEMS mirror 300 according to one or more implementations. The MEMS mirror 300 is similar to the one above in conjunction with Fig. The MEMS mirror 300, described in Figure 1, has an inner axis (e.g., the second scanning axis 112) and an outer axis (e.g., the first scanning axis 110). The MEMS mirror 300 comprises an oscillator structure 302 (e.g., a mirror plate or mirror body), an inner frame 304 (e.g., a gimbal frame), and an outer frame 306 (e.g., a chip frame). The oscillator structure 302 is configured to oscillate the first scanning axis 110 (e.g., the outer axis) according to a first oscillation and to oscillate the second scanning axis 112 (e.g., the inner axis) according to a second oscillation.

[0056] The inner frame 304 is mechanically coupled to the oscillator structure 302 by internal suspension structures, such as a first support structure 308 and a second support structure 310. The first support structure 308 and the second support structure 310 extend between the inner frame 304 and the oscillator structure 302 along the second scanning axis 112 (e.g., the inner axis). Furthermore, the first support structure 308 is positioned relative to the second support structure 310 and thus relative to the oscillator structure 302.

[0057] The outer frame 306 is mechanically coupled to the inner frame 304 by external suspension structures comprising a third support structure 312 and a fourth support structure 314. The third support structure 312 and the fourth support structure 314 extend between the inner frame 304 and the outer frame 306 along the first scanning axis 110 (e.g., the outer axis). Furthermore, the third support structure 312 is positioned relative to the oscillator structure 302, opposite the fourth support structure 314. Accordingly, the inner frame 304 surrounds the oscillator structure 302, and the outer frame 306 surrounds the inner frame 304 and the oscillator structure 302.

[0058] The first support structure 308 and the second support structure 310 suspend the oscillator structure 302 above a cavity 316 to enable the second oscillation. The third support structure 312 and the fourth support structure 314 suspend the oscillator structure 302 above the cavity 316 to enable the first oscillation. The cavity 316 provides sufficient free space to allow a first range of motion of the oscillator structure 302 around the first scanning axis 110 and a second range of motion of the oscillator structure 302 around the second scanning axis 112.

[0059] In some implementations, the oscillator structure 302, the inner frame 304, the outer frame 306, the first support structure 308, the second support structure 310, the third support structure 312, and the fourth support structure 314 can be formed from a single semiconductor substrate of a semiconductor chip. Accordingly, the oscillator structure 302, the inner frame 304, the outer frame 306, the first support structure 308, the second support structure 310, the third support structure 312, and the fourth support structure 314 can form a single, integral component made from the semiconductor substrate. Consequently, the outer frame 306 can be referred to as the chip frame of the semiconductor chip, which is rotationally fixed. A reflective film, reflective coating, or reflective substrate can be applied to the semiconductor substrate of the oscillator structure 302 to form a mirror.

[0060] The MEMS mirror 300 further comprises a first inner axis sensor 318, which is positioned between the inner frame 304 and the outer frame 306. The first inner axis sensor 318 is configured to detect a first relative movement of the inner frame 304 relative to the outer frame 306 and to generate a first sensor signal corresponding to this first relative movement. The first relative movement corresponds to the inner axis movement of the oscillator structure 302 (e.g., the rotation of the oscillator structure 302 about the second scanning axis 112). Accordingly, the first sensor signal is representative of a first angular position of the oscillator structure 302 about the second scanning axis 112 (e.g., the inner axis) and is essentially independent of the outer axis movement of the oscillator structure 302 about the first scanning axis 110 (e.g., the outer axis).More precisely, the first sensor signal is essentially independent of the outer axis movement of the oscillator structure 302 around the first scanning axis 110 (e.g., the outer axis) as well as any movement of the first support structure 308, the second support structure 310, and the inner frame 304 around the first scanning axis 110. The second MEMS driver 116 can receive the first sensor signal from the first inner axis sensor 318 and use the first sensor signal to generate a position signal POS for the second scanning axis 112, as described above in conjunction with [reference missing]. Fig. 2 described.

[0061] The inner frame 304 and the outer frame 306 are structured such that the second oscillation of the oscillator structure 302 about the second scanning axis 112 causes the inner frame 304, via a mixing effect, to oscillate relative to the outer frame 306 in a region of the first inner axis sensor 318. Accordingly, the oscillation of the inner frame 304 relative to the outer frame 306 can be used as a measurement of the second oscillation of the oscillator structure 302, which is essentially independent of the outer axis movement of the oscillator structure 302 about the first scanning axis 110 when the first inner axis sensor 318 is located near the first scanning axis 110 (e.g., near the fourth support structure 314). By placing the first inner axis sensor 118 near the first scanning axis 110, sensor cross-coupling between the first scanning axis 110 and the second scanning axis 112 can be minimized.

[0062] For example, the outer axis movement of the oscillator structure 302 is most pronounced and therefore most easily detectable along the second scanning axis 112, and the outer axis movement of the oscillator structure 302 is least pronounced and therefore least detectable along the first scanning axis 110. Conversely, the inner axis movement of the oscillator structure 302 is most pronounced and therefore most easily detectable along the first scanning axis 110, and least pronounced and therefore least detectable along the second scanning axis 112. Accordingly, the first inner axis sensor 318 can be located near the first scanning axis 110 and the fourth support structure 314, and away from the second scanning axis 112, in order to avoid being affected by the outer axis movement and to maximize the first sensor signal.In other words, the first inner axis sensor 318 can be arranged near the first scanning axis 110 such that the first inner axis sensor 318 is located closer to the first scanning axis 110 than to the second scanning axis 112.

[0063] In some implementations, the first inner axis sensor 318 may comprise two sensor components arranged symmetrically around the first scanning axis 110. In some implementations, the first inner axis sensor 318 may be coupled to the inner frame 304 and the outer frame 306. In some implementations, the first inner axis sensor 318 may be a capacitive sensor having a capacitance configured to change based on the initial relative movement of the inner frame 304 relative to the outer frame 306. Consequently, the initial sensor signal is a measure of the capacitance of the first inner axis sensor 318. For example, the first inner axis sensor 318 may comprise fixed electrostatic combs and movable electrostatic combs nested with the fixed electrostatic combs.The fixed electrostatic combs can be part of the outer frame 306, and the movable electrostatic combs can be part of the inner frame 304. The movable electrostatic combs are configured to move relative to the fixed electrostatic combs when the inner frame 304 moves relative to the outer frame 306, thereby changing the capacitance geometry of the first inner axis sensor 318. The first inner axis sensor 318 is positioned close to the first scanning axis 110 and far from the second scanning axis 112 to increase the relative movement of the movable electrostatic combs relative to the fixed electrostatic combs. When the capacitance geometry changes, the capacitance of the first inner axis sensor 318 itself changes. Thus, a specific capacitance of the first inner axis sensor 318 can be directly related to a specific rotational position (e.g.,a specific tilt angle) of the MEMS mirror 300 about the second scanning axis 112 (e.g., the inner axis). The first inner axis sensor 318 can output a displacement current as the first sensor signal, which is representative of the capacitance of the first inner axis sensor 318 and therefore representative of the first angular position of the oscillator structure 302 about the second scanning axis 112 (e.g., the inner axis).

[0064] The first sensor signal can be received by the second MEMS driver 116 and used to generate the position signal POS for the second scanning axis 112, as described above in conjunction with Fig. 2 described. For example, the second MEMS driver 116 can include a sensor circuit configured to receive the first sensor signal and determine the first angular position of the oscillator structure 302 about the second scanning axis 112 based on the first sensor signal. Alternatively or additionally, the sensor circuit of the second MEMS driver 116 can be configured to receive the first sensor signal and measure an angular trajectory of the oscillator structure 302 about the second scanning axis 112. The second MEMS driver 116 can provide position information (e.g., the position signal POS for the second scanning axis 112) to the system controller 106 for use in synchronizing the transmission times with the inner axis movement and in synchronizing a frequency and / or phase of the first oscillation about the first scanning axis 110 with the second oscillation about the second scanning axis 112.

[0065] Detecting the first relative movement between the outer frame 306 and the inner frame 304 allows the first inner axis sensor 318 to be placed between the outer frame 306 and the inner frame 304, as opposed to placing it between the inner frame 304 and the oscillator structure 302. Placing the first inner axis sensor 318 between the outer frame 306 and the inner frame 304 reduces the number of wires routed via the third support structure 312 and the fourth support structure 314 (e.g., the outer suspension structures). For example, because of the placement of the first inner axis sensor 318 between the outer frame 306 and the inner frame 304, wires used to detect the inner axis movement (e.g.,(for transmitting feedback information from the first inner axis sensor 318 to a measuring circuit), no longer need to be routed via the outer suspension structures. This reduces the number of wires routed via the outer suspension structures and improves their strength and reliability.

[0066] Furthermore, removing the wires used to detect the inner axis movement eliminates electrical crosstalk between the detection signals and the drive signals routed through the outer suspension structures. This crosstalk can occur if the wires used to detect the inner axis movement were routed through the outer suspension structures. Eliminating this electrical crosstalk results in more accurate detection and drive signals because they no longer interfere with each other, which can lead to signal errors.

[0067] In some implementations, the MEMS mirror 300 can include a second inner axis sensor 320 positioned between the inner frame 304 and the outer frame 306. The second inner axis sensor 320 is configured to detect the first relative movement of the inner frame 304 relative to the outer frame 306 and to generate a second sensor signal corresponding to the first relative movement. For example, the inner frame 304 and the outer frame 306 are structured such that the second oscillation of the oscillator structure 302 about the second scanning axis 112 causes the inner frame 304, via a mixing effect, to oscillate relative to the outer frame 306 in a region of the second inner axis sensor 320.Accordingly, the oscillation of the inner frame 304 relative to the outer frame 306 can be used as a measurement of the second oscillation of the oscillator structure 302, which is essentially independent of the outer axis movement of the oscillator structure 302 about the first scanning axis 110, if the second inner axis sensor 320 is located near the first scanning axis 110 (e.g., near the third support structure 312). In some implementations, the second inner axis sensor 320 can comprise two sensor components arranged symmetrically around the first scanning axis 110. In some implementations, the second inner axis sensor 320 can be coupled to the inner frame 304 and the outer frame 306.In some implementations, the second inner axis sensor 320, similar to the first inner axis sensor 318, can be a capacitive sensor having a capacitance designed to change based on the first relative movement of the inner frame 304 relative to the outer frame 306.

[0068] Detecting the first relative movement between the outer frame 306 and the inner frame 304 allows the second inner axis sensor 320 to be placed between the outer frame 306 and the inner frame 304, as opposed to placing it between the inner frame 304 and the oscillator structure 302. Placing the second inner axis sensor 320 between the outer frame 306 and the inner frame 304 reduces the number of wires routed via the third support structure 312 and the fourth support structure 314 (e.g., the outer suspension structures). For example, because of the placement of the second inner axis sensor 320 between the outer frame 306 and the inner frame 304, wires used to detect the inner axis movement (e.g.,(for transmitting feedback information from the second inner axis sensor 320 to a measuring circuit), no longer need to be routed via the outer suspension structures. This reduces the number of wires routed via the outer suspension structures and improves their strength and reliability.

[0069] Furthermore, removing the wires used to detect the inner axis movement eliminates electrical crosstalk between the detection signals and the drive signals routed through the outer suspension structures. This crosstalk can occur if the wires used to detect the inner axis movement were routed through the outer suspension structures. Eliminating this electrical crosstalk results in more accurate detection and drive signals because they no longer interfere with each other, which can lead to signal errors.

[0070] The second MEMS driver 116 can combine the second sensor signal with the first sensor signal generated by the first inner axis sensor 318 to generate the position signal POS for the second scanning axis 112, as described above in conjunction with Fig. 2 described. For example, the second MEMS driver 116 can generate a sum, a difference, or an average of the first sensor signal and the second sensor signal to produce the position signal POS for the second scanning axis 112. Using a combination of the first sensor signal and the second sensor signal can provide a more robust and accurate measurement of the internal axis movement of the oscillator structure 302 (e.g., the first angular position of the oscillator structure).

[0071] The MEMS mirror 300 further comprises an outer axis sensor 322, which is positioned between the inner frame 304 and the outer frame 306. The outer axis sensor 322 is configured to detect a second relative movement of the inner frame 304 relative to the outer frame 306 and to generate a third sensor signal corresponding to this second relative movement. This second relative movement of the inner frame 304 relative to the outer frame 306 corresponds to the outer axis movement of the oscillator structure 302 (e.g., the rotation of the oscillator structure 302 about the first scanning axis 110). Accordingly, the third sensor signal is representative of a second angular position of the oscillator structure 302 around the first scanning axis 110 (e.g. the outer axis) and is essentially independent of the inner axis movement of the oscillator structure 302 around the second scanning axis 112 (e.g. the inner axis).In general, the outer axis sensor 322 can be placed anywhere between the inner frame 304 and the outer frame 306, but should be symmetrical around the second scanning axis 112 to minimize any influence of the admixture effect that might distort the measurement of the second relative movement. The first MEMS driver 114 can receive the third sensor signal from the outer axis sensor 322 and use the third sensor signal to generate a position signal POS for the first scanning axis 110, as described above in conjunction with [reference missing]. Fig. 2 described.

[0072] In some implementations, the outer axis sensor 322 can be a capacitive sensor with a capacitance configured to change based on the second relative motion of the inner frame 304 relative to the outer frame 306. Consequently, the third sensor signal is a measure of the capacitance of the outer axis sensor 322. For example, the outer axis sensor 322 can include fixed electrostatic combs and movable electrostatic combs nested with the fixed electrostatic combs. The fixed electrostatic combs can be part of the outer frame 306, and the movable electrostatic combs can be part of the inner frame 304. The movable electrostatic combs are configured to move relative to the fixed electrostatic combs when the inner frame 304 moves relative to the outer frame 306, thereby changing a geometry of the capacitance of the outer axis sensor 322.When the geometry of the capacitance changes, the capacitance of the outer axis sensor 322 itself changes. Thus, a specific capacitance of the outer axis sensor 322 can directly correspond to a specific rotational position (e.g., a specific tilt angle) of the MEMS mirror 300 about the first scanning axis 110 (e.g., the outer axis). The outer axis sensor 322 can output a displacement current as the third sensor signal, which is representative of the capacitance of the outer axis sensor 322 and therefore representative of the second angular position of the oscillator structure 302 about the first scanning axis 110 (e.g., the outer axis).

[0073] The third sensor signal can be received by the first MEMS driver 114 and used to generate the position signal POS for the first scanning axis 110, as described above in conjunction with Fig. 2 described. For example, the first MEMS driver 114 can include a sensor circuit configured to receive the third sensor signal and determine the second angular position of the oscillator structure 302 about the first scanning axis 110 based on the third sensor signal. Alternatively or additionally, the sensor circuit of the first MEMS driver 114 can be configured to receive the third sensor signal and measure an angular trajectory of the oscillator structure 302 about the first scanning axis 110. The first MEMS driver 114 can provide position information (e.g., the position signal POS for the first scanning axis 110) to the system controller 106 for use in synchronizing the transmission times with the outer axis movement and in synchronizing a frequency and / or phase of the first oscillation about the first scanning axis 110 with the second oscillation about the second scanning axis 112.

[0074] As shown above, Fig. 3 is provided merely as an example. Other examples are possible and may differ from what is provided in relation to Fig. The MEMS mirror described in section 3 differs. In practice, the MEMS mirror can have 300 additional components, fewer components, different components, or differently arranged components than those described in section 3. Fig. 3. The components shown are included, without deviating from the disclosure provided above. Furthermore, two or more components that are shown in Fig. 3 are shown, to be implemented within a single component, or a single component that is in Fig. As shown in Figure 3, it can be implemented as multiple, distributed components. Additionally or alternatively, a set of components (e.g., one or more components) of the MEMS mirror 300 can perform one or more functions that are described as being performed by another set of components of the MEMS mirror 300.

[0075] Fig. Figure 4A illustrates a top view of a MEMS mirror 400 according to one or more implementations. Fig. Figure 4B illustrates a side view of the MEMS mirror 400 according to one or more implementations. The side view is taken parallel to the first scanning axis 110.

[0076] The MEMS mirror 400 is similar to the one above in conjunction with Fig. The MEMS mirror 300 described in Section 3 has an inner axis (e.g., the second scanning axis 112) and an outer axis (e.g., the first scanning axis 110). Similar to the MEMS mirror 300, the MEMS mirror 400 comprises an oscillator structure 402 (e.g., a mirror plate or mirror body), an inner frame 404 (e.g., a gimbal frame), an outer frame 406 (e.g., a chip frame), a first support structure 408, a second support structure 410, a third support structure 412, and a fourth support structure 414. The oscillator structure 402 is configured to oscillate the first scanning axis 110 (e.g., the outer axis) according to a first oscillation and to oscillate the second scanning axis 112 (e.g., the inner axis) according to a second oscillation.The first support structure 408, the second support structure 410, the third support structure 412 and the fourth support structure 414 are used as suspensions to suspend the oscillator structure 402 above a cavity 416.

[0077] The MEMS mirror 400 comprises a first inner axis sensor 418, a second inner axis sensor 420, and an outer axis sensor 422. In some implementations, the first inner axis sensor 418, the second inner axis sensor 420, and the outer axis sensor 422 use one or more pairs of toothed finger electrodes, made of toothed movable combs and fixed combs, to detect the inner axis motion or the outer axis motion. As previously described, a capacitor between the toothed finger electrodes of a sensor can be used to measure the inner axis motion and the outer axis motion.

[0078] For example, the first inner axis sensor 418 can comprise a first pair of toothed finger electrodes 424, made of toothed movable combs coupled to the inner frame 404 and fixed combs coupled to the outer frame 406, and a second pair of toothed finger electrodes 426, made of toothed movable combs coupled to the inner frame 404 and fixed combs coupled to the outer frame 406. The first pair of toothed finger electrodes 424 and the second pair of toothed finger electrodes 426 are arranged near the first scanning axis 110. Furthermore, the first pair of toothed finger electrodes 424 and the second pair of toothed finger electrodes 426 are arranged symmetrically around the first scanning axis 110.The toothed movable combs of the first pair of toothed finger electrodes 424 and the toothed movable combs of the second pair of toothed finger electrodes 426 can be coupled to the inner frame 404 via mechanical arms extending from a main body of the inner frame 404. Thus, the mechanical arms rotate with the inner frame 404. In some implementations, the mechanical arms can extend parallel to the fourth support structure 414.

[0079] The first inner axis sensor 418 generates a first sensor signal based on a capacitance formed by the first pair of toothed finger electrodes 424 and a capacitance formed by the second pair of toothed finger electrodes 426. Thus, the first inner axis sensor 418 is configured to detect a first relative movement of the inner frame 404 relative to the outer frame 406 and to generate the first sensor signal corresponding to this first relative movement. The first relative movement corresponds to the inner axis movement of the oscillator structure 402 (e.g., the rotation of the oscillator structure 402 about the second scanning axis 112).

[0080] The second inner axis sensor 420 can include a third pair of toothed finger electrodes 428, made of toothed movable combs coupled to the inner frame 404 and fixed combs coupled to the outer frame 406, and a fourth pair of toothed finger electrodes 430, made of toothed movable combs coupled to the inner frame 404 and fixed combs coupled to the outer frame 406. The third pair of toothed finger electrodes 428 and the fourth pair of toothed finger electrodes 430 are arranged near the first scanning axis 110. Furthermore, the third pair of toothed finger electrodes 428 and the fourth pair of toothed finger electrodes 430 are arranged symmetrically around the first scanning axis 110.The toothed movable combs of the third pair of toothed finger electrodes 428 and the toothed movable combs of the fourth pair of toothed finger electrodes 430 can be coupled to the inner frame 404 via mechanical arms extending from a main body of the inner frame 404. Thus, the mechanical arms rotate with the inner frame 404. In some implementations, the mechanical arms can extend parallel to the third support structure 412.

[0081] The second inner axis sensor 420 generates a second sensor signal based on a capacitance formed by the third pair of toothed finger electrodes 428 and the fourth pair of toothed finger electrodes 430. Thus, the second inner axis sensor 420 is configured to detect the first relative movement of the inner frame 404 relative to the outer frame 406 and to generate the second sensor signal corresponding to this first relative movement. The first relative movement corresponds to the inner axis movement of the oscillator structure 402 (e.g., the rotation of the oscillator structure 402 about the second scanning axis 112).

[0082] The outer axis sensor 422 can include a fifth pair of toothed finger electrodes 432, which are made of toothed movable combs coupled to the inner frame 404 and fixed combs coupled to the outer frame 406. The fifth pair of toothed finger electrodes 432 can also be part of an actuation structure that drives a first oscillation of the oscillation structure 402 around the first scanning axis 110 (e.g., the outer axis). For example, both drive signals and feedback signals can be based on capacitance changes between the fifth pair of toothed finger electrodes 432. The fifth pair of toothed finger electrodes 432 is arranged symmetrically around the second scanning axis 112. In some implementations, such as in Fig. As shown in Figure 4A, the fifth pair of toothed finger electrodes 432 can extend laterally from one side of the second scanning axis 112 across the second scanning axis 112 to the other side of the second scanning axis 112. In some implementations, the outer axis sensor 422 can comprise two pairs of toothed finger electrodes arranged symmetrically around the second scanning axis 112.

[0083] The MEMS mirror 400 can include a sixth pair of toothed finger electrodes 434, which are made of toothed movable combs coupled to the inner frame 404 and fixed combs coupled to the outer frame 406. The sixth pair of toothed finger electrodes 434 can form an actuating structure that drives the first oscillation of the oscillation structure 402 about the first scanning axis 110 (e.g., the outer axis). In some implementations, the sixth pair of toothed finger electrodes 434 can be used as an additional outer axis sensor. For example, both drive signals and feedback signals can be based on capacitance changes between the sixth pair of toothed finger electrodes 434. The sixth pair of toothed finger electrodes 434 is arranged symmetrically about the second scanning axis 112. In some implementations, as in Fig. As shown in Figure 4A, the sixth pair of toothed finger electrodes 434 can extend laterally from one side of the second scanning axis 112 across the second scanning axis 112 to the other side of the second scanning axis 112. In some implementations, the sixth pair of toothed finger electrodes 434 can be subdivided into two or more pairs of toothed finger electrodes arranged symmetrically around the second scanning axis 112.

[0084] The MEMS mirror 400 also includes actuation structures that drive the second oscillation of the oscillation structure 402 around the second scanning axis 112 (e.g. the inner axis).For example, the MEMS mirror 400 can include a seventh pair of toothed finger electrodes 436, made of toothed movable combs coupled to the inner frame 404 and fixed combs coupled to the outer frame 406; an eighth pair of toothed finger electrodes 438, made of toothed movable combs coupled to the inner frame 404 and fixed combs coupled to the outer frame 406; a ninth pair of toothed finger electrodes 440, made of toothed movable combs coupled to the inner frame 404 and fixed combs coupled to the outer frame 406; and a tenth pair of toothed finger electrodes 442, made of toothed movable combs coupled to the inner frame 404 and fixed combs coupled to the outer frame 406. Combs that are coupled to the outer frame 406 include.

[0085] The seventh pair of toothed finger electrodes 436 and the eighth pair of toothed finger electrodes 438 are arranged symmetrically about the second scanning axis 112. The ninth pair of toothed finger electrodes 440 and the tenth pair of toothed finger electrodes 442 are arranged symmetrically about the second scanning axis 112. The seventh pair of toothed finger electrodes 436 and the ninth pair of toothed finger electrodes 440 are arranged symmetrically about the first scanning axis 110. The eighth pair of toothed finger electrodes 438 and the tenth pair of toothed finger electrodes 442 are arranged symmetrically about the first scanning axis 110.

[0086] The seventh pair of toothed finger electrodes 436, the eighth pair of toothed finger electrodes 438, the ninth pair of toothed finger electrodes 440 and the tenth pair of toothed finger electrodes 442 are configured to receive control signals to drive the second oscillation of the oscillation structure 402 around the second scanning axis 112 based on capacitance changes induced by the control signals.

[0087] As shown above, Fig. 4A and Fig. 4B is provided merely as an example. Other examples are possible and may differ from what is provided in relation to Fig. 4A and Fig. 4B described, differ. In practice, the MEMS mirror 400 can have additional components, fewer components, different components, or differently arranged components than those described in 4B. Fig. 4A and B include those shown, without deviating from the disclosure provided above. In addition, two or more components shown in Fig. 4A and Fig. 4B are shown, being implemented within a single component, or a single component that is in Fig. 4A and Fig. As shown in Figure 4B, the MEMS mirror 400 can be implemented as multiple, distributed components. Additionally or alternatively, a set of components (e.g., one or more components) of the MEMS mirror 400 can perform one or more functions that are described as being performed by another set of components of the MEMS mirror 400.

[0088] Fig. Figure 5 is a flowchart of an example process 500, which is associated with an admixture detection procedure for gimbal-mounted scanners. In some implementations, one or more process blocks of Fig. 5 is executed by a 2D scanning system (e.g., the 2D scanning system 100). In some implementations, one or more process blocks of Fig. 5 is executed by a MEMS mirror (e.g., MEMS mirror 102, MEMS mirror 300, or MEMS mirror 400). In some implementations, one or more process blocks of Fig. 5. performed by another device or group of devices that are separate from or encompass the MEMS mirror, such as a MEMS driver system (e.g., the MEMS driver system 104) and / or a control system (e.g., the control system 106). Additionally or alternatively, one or more process blocks of Fig. 5 are performed by one or more components of the MEMS mirror, such as a first inner axis sensor (e.g. the first inner axis sensor 318), a second inner axis sensor (e.g. the second inner axis sensor 320) and / or an outer axis sensor (e.g. the outer axis sensor 322).

[0089] As in Fig. As shown in Figure 5, process 500 can include driving an oscillator structure around an inner axis according to a first oscillation (block 510). For example, the MEMS driver system 104 can drive the oscillator structure around an inner axis according to a first oscillation, as described above.

[0090] As further in Fig. As shown in Figure 5, process 500 can include driving the oscillator structure around an outer axis according to a second oscillation (block 520). For example, the MEMS driver system 104 can drive the oscillator structure around an outer axis according to a second oscillation, as described above.

[0091] As in Fig. As further shown in Figure 5, the process 500 can include detecting a first relative motion of an inner frame relative to an outer frame to generate a first sensor signal corresponding to the first relative motion, wherein the first sensor signal is representative of a first angular position of the oscillator structure about the inner axis, wherein the inner frame is mechanically coupled to the oscillator structure by first support structures extending along the inner axis, and wherein the outer frame is mechanically coupled to the inner frame by second support structures extending along the outer axis (Block 530).For example, the first inner axis sensor 318 and / or the second inner axis sensor 320 can detect a first relative movement of an inner frame relative to an outer frame to generate a first sensor signal corresponding to the first relative movement, where the first sensor signal is representative of a first angular position of the oscillator structure around the inner axis, as described above. In some implementations, the inner frame is mechanically coupled to the oscillator structure by first support structures extending along the inner axis. In some implementations, the outer frame is mechanically coupled to the inner frame by second support structures extending along the outer axis.

[0092] Process 500 may include additional implementations, such as any single implementation or any combination of implementations described below and / or in conjunction with one or more other processes described elsewhere herein.

[0093] Although Fig. The five example blocks of process 500 show that in some implementations, process 500 includes additional blocks, fewer blocks, different blocks, or differently arranged blocks than those shown in Fig. 5 are shown. Additionally or alternatively, two or more of the blocks of process 500 can be carried out in parallel.

[0094] The following is an overview of some aspects of the present revelation: Aspect 1: A scanning system comprising: an oscillator structure configured to oscillate an inner axis according to a first oscillation and to oscillate an outer axis according to a second oscillation; an inner frame mechanically coupled to the oscillator structure by a first support structure and a second support structure, wherein the first support structure and the second support structure extend between the inner frame and the oscillator structure along the inner axis and wherein the first support structure is arranged opposite the second support structure relative to the oscillator structure;an outer frame mechanically coupled to the inner frame by a third support structure and a fourth support structure, wherein the third support structure and the fourth support structure extend between the inner frame and the outer frame along the outer axis and wherein the third support structure is arranged relative to the fourth support structure and relative to the oscillator structure; and an inner axis sensor positioned between the inner frame and the outer frame, wherein the inner axis sensor is configured to detect a first relative movement of the inner frame relative to the outer frame and to generate a first sensor signal corresponding to the first relative movement, wherein the first sensor signal is representative of a first angular position of the oscillator structure about the inner axis. Aspect 2: The scanning system according to Aspect 1, wherein the inner frame and the outer frame are structured such that the first oscillation causes the inner frame to oscillate relative to the outer frame in a region of the inner axis sensor. Aspect 3: The scanning system according to one of aspects 1-2, wherein the inner axis sensor is arranged near the outer axis, such that the inner axis sensor is located closer to the outer axis than to the inner axis. Aspect 4: The scanning system according to one of aspects 1-3, wherein the inner axis sensor is a capacitive sensor having a capacitance configured to change based on the first relative movement, the first sensor signal being a measure of the capacitance. Aspect 5: The scanning system according to aspect 4, wherein the capacitive sensor comprises fixed electrostatic combs and movable electrostatic combs nested with the fixed electrostatic combs, wherein the movable electrostatic combs are configured to move based on the first relative movement relative to the fixed electrostatic combs in order to cause the capacitance to change. Aspect 6: The scanning system according to any one of aspects 1-5, further comprising: an outer axis sensor positioned between the inner frame and the outer frame, the outer axis sensor being configured to detect a second relative movement of the inner frame relative to the outer frame and to generate a second sensor signal corresponding to the second relative movement, the second sensor signal being representative of a second angular position of the oscillator structure about the outer axis. Aspect 7: The scanning system according to aspect 6, wherein the outer axis sensor is arranged symmetrically around the inner axis. Aspect 8: The scanning system according to aspect 6, wherein the outer axis sensor is a capacitive sensor having a capacitance configured to change based on the second relative motion, the second sensor signal being a measure of the capacitance. Aspect 9: The scanning system according to aspect 8, wherein the capacitive sensor comprises fixed electrostatic combs and movable electrostatic combs nested with the fixed electrostatic combs, wherein the movable electrostatic combs are configured to move based on the second relative motion relative to the fixed electrostatic combs in order to cause the capacitance to change. Aspect 10: The scanning system according to one of aspects 1-9, further comprising: a sensor circuit configured to receive the first sensor signal and to determine the first angular position of the oscillator structure around the inner axis based on the first sensor signal. Aspect 11: The scanning system according to one of aspects 1-10, further comprising: a sensor circuit configured to receive the first sensor signal and to measure an angular trajectory of the oscillator structure around the inner axis. Aspect 12: The scanning system according to one of aspects 1-11, wherein: the first support structure and the second support structure are formed to suspend the oscillator structure over a cavity to enable the first oscillation, and the third support structure and the fourth support structure are formed to suspend the inner frame over the cavity to enable the second oscillation. Aspect 13: The sampling system according to one of aspects 1-12, wherein the inner frame surrounds the oscillator structure and the outer frame surrounds the inner frame and the oscillator structure. Aspect 14: The scanning system according to one of aspects 1-13, wherein the inner frame is a gimbal frame and the outer frame is a chip frame of a semiconductor chip. Aspect 15: The scanning system according to one of aspects 1-14, wherein the oscillator structure, the inner frame and the outer frame form a single integral component. Aspect 16: The scanning system according to one of aspects 1-15, wherein the inner axis sensor is coupled to the inner frame and the outer frame. Aspect 17: A system comprising: a rotating structure configured to rotate an inner axis in accordance with a first rotation and to rotate an outer axis in accordance with a second rotation; an inner frame mechanically coupled to the rotating structure by a first support structure and a second support structure, wherein the first support structure and the second support structure extend between the inner frame and the rotating structure along the inner axis and wherein the first support structure is positioned opposite the second support structure relative to the rotating structure;an outer frame mechanically coupled to the inner frame by a third support structure and a fourth support structure, wherein the third support structure and the fourth support structure extend between the inner frame and the outer frame along the outer axis and wherein the third support structure is arranged relative to the fourth support structure with respect to the rotating structure; and an inner axis sensor positioned between the inner frame and the outer frame, wherein the inner axis sensor is configured to detect a first relative movement of the inner frame relative to the outer frame and to generate a first sensor signal corresponding to the first relative movement, wherein the first sensor signal is representative of a rotational position of the rotating structure about the inner axis. Aspect 18: The system according to aspect 17, wherein the inner frame and the outer frame are structured such that the first rotation causes the inner frame to move relative to the outer frame in a region of the inner axis sensor. Aspect 19: The system according to any of aspects 17-18, wherein the inner axis sensor is located adjacent to at least one of the third support structure or the fourth support structure. Aspect 20: The system according to any of aspects 17-19, wherein the inner axis sensor is a capacitive sensor having a capacitance configured to change based on the first relative motion, the first sensor signal being a measure of the capacitance. Aspect 21: A method comprising: driving an oscillator structure about an inner axis according to a first oscillation; driving the oscillator structure about an outer axis according to a second oscillation; and detecting a first relative motion of an inner frame relative to an outer frame to generate a first sensor signal corresponding to the first relative motion, wherein the first sensor signal is representative of a first angular position of the oscillator structure about the inner axis, wherein the inner frame is mechanically coupled to the oscillator structure by first support structures extending along the inner axis, and wherein the outer frame is mechanically coupled to the inner frame by second support structures extending along the outer axis. Aspect 22: A system that is trained to perform one or more of the operations mentioned in one or more of Aspects 1-21. Aspect 23: A device comprising means for performing one or more of the operations mentioned in one or more of Aspects 1-21. Aspect 24: A non-volatile, computer-readable medium that stores a set of instructions, wherein the set of instructions comprises one or more instructions which, when executed by a device, cause the device to perform one or more operations specified in one or more of Aspects 1-21. Aspect 25: A computer program product comprising instructions or code for performing one or more of the operations mentioned in one or more of Aspects 1-21.

[0095] The foregoing disclosure provides an illustration and description, but is not intended to be exhaustive or to limit implementations to the specific form disclosed. Modifications and variations are possible, taking the above disclosure into account, and can be derived from practical implementation experience.

[0096] Although the implementations described herein refer, for example, to MEMS devices with a mirror, it should be noted that other implementations may include optical devices other than MEMS mirror devices or other MEMS oscillation structures. Additionally, although some aspects have been described in the context of a device, it is evident that these aspects also represent a description of the corresponding process, where a block or device corresponds to a process step or a feature of a process step. Similarly, aspects described in the context of a process step also represent a description of a corresponding block, element, or feature of a corresponding device.Some or all of the process steps can be performed by (or using) a hardware device, such as a microprocessor, a programmable computer, or an electronic circuit.

[0097] It is evident that the systems and / or procedures described herein can be implemented in various forms of hardware, firmware, or a combination of hardware and software. The actual specialized control hardware or software code used to implement these systems and / or procedures is not limiting to the implementations. The operation and behavior of the systems and / or procedures are thus described here without reference to any specific software code—it being assumed that software and hardware can be designed to implement the systems and / or procedures based on this description.

[0098] Furthermore, it is understood that the disclosure of several steps or functions revealed in the description or claims may not be interpreted as being in a specific order. Therefore, the disclosure of multiple steps or functions does not restrict them to a specific order unless these steps or functions are not interchangeable for technical reasons. Furthermore, in some implementations, a single step may comprise several substeps or may be divided into several substeps. Such substeps may be included and form part of the disclosure of that single step unless they are explicitly excluded.

[0099] Instructions can be executed by one or more processors, such as one or more central processing units (CPUs), digital signal processors (DSPs), general-purpose microprocessors, application-specific integrated circuits (ASICs), field-programmable logic arrays (FPLAs), or any other equivalent integrated or discrete logic circuit arrangement. Accordingly, as used herein, the terms "processor" or "processing circuit arrangement" refer to any of the foregoing structures or any other structure suitable for implementing the techniques described herein. Additionally, in some aspects, the functionality described herein may be provided within dedicated hardware and / or software modules.Furthermore, the techniques could be fully implemented in one or more circuits or logic elements.

[0100] Thus, the techniques described in this disclosure may be implemented, at least partially, in hardware, hardware-executing software, firmware, or any combination thereof. For example, various aspects of the described techniques may be implemented within one or more processors, comprising one or more microprocessors, DSPs, ASICs, or any other equivalent integrated or discrete logic circuit arrangement, as well as any combination of such components.

[0101] A controller comprising hardware may also execute one or more of the techniques described in this disclosure. Such hardware, software, and firmware may be implemented within the same component or within separate components to support the various techniques described in this disclosure. Software may be stored on a non-volatile, computer-readable medium such that the non-volatile, computer-readable medium comprises program code or a program algorithm stored thereon which, when executed, causes the controller, via a computer program, to execute the steps of a procedure.

[0102] Although certain combinations of features are described in the claims and / or disclosed in the description, these combinations are not intended to limit the disclosure of possible implementations. In fact, many of these features can be combined in ways not specifically described in the claims and / or disclosed in the description. Although each dependent claim listed below may depend directly on only one other claim, the disclosure of possible implementations includes each dependent claim in combination with each other claim in the claim set.

[0103] No element, step, or instruction used herein shall be construed as crucial or essential unless explicitly described as such. Furthermore, according to our usage, the articles "one" and "an" shall encompass one or more elements and may be used synonymously with "one or more." Similarly, according to our usage, the term "sentence" shall encompass one or more elements (e.g., related elements, unrelated elements, a combination of related and unrelated elements, etc.) and may be used synonymously with "one or more." In cases where only one element is intended, the term "one" or similar language shall be used. Furthermore, according to our usage, the terms "includes," "show," "showing," or the like shall be open-ended. Furthermore, the expression "based on" shall mean "based, at least in part, on" unless explicitly stated otherwise.

Claims

[1] Scanning system (100, 300, 400), comprising: an oscillator structure (102, 302, 402) configured to oscillate an inner axis (112) according to a first oscillation and to oscillate an outer axis (110) according to a second oscillation; an inner frame (304, 404) which is mechanically coupled to the oscillator structure (102, 302, 402) by a first support structure (308, 408) and a second support structure (310, 410), wherein the first support structure (308, 408) and the second support structure (310, 410) extend between the inner frame (304, 404) and the oscillator structure (102, 302, 402) along the inner axis (112) and wherein the first support structure (308, 408) is arranged opposite the second support structure (310, 410) relative to the oscillator structure (102, 302, 402); an outer frame (306, 406) which is mechanically coupled to the inner frame (304, 404) by a third support structure (312, 412) and a fourth support structure (314, 414), wherein the third support structure (312, 412) and the fourth support structure (314, 414) extend between the inner frame (304, 404) and the outer frame (306, 406) along the outer axis (110) and wherein the third support structure (312, 412) is arranged opposite the fourth support structure (314, 414) relative to the oscillator structure (102, 302, 402); and an inner axis sensor (318, 418) positioned between the inner frame (304, 404) and the outer frame (306, 406), wherein the inner axis sensor (318, 418) is configured to detect a first relative movement of the inner frame (304, 404) relative to the outer frame (306, 406) and to generate a first sensor signal corresponding to the first relative movement, where the first sensor signal is representative of a first angular position of the oscillator structure (102, 302, 402) around the inner axis (112), wherein the inner frame (304, 404) and the outer frame (306, 406) are structured such that the first oscillation causes the inner frame (304, 404) to oscillate relative to the outer frame (306, 406) in a region of the inner axis sensor (318, 418) via a mixing effect, and wherein the inner axis sensor (318, 418) is arranged near the outer axis (110) such that the inner axis sensor (318, 418) is arranged closer to the outer axis (110) than to the inner axis (112). [2] Scanning system (100, 300, 400) according to claim 1, wherein the inner axis sensor (318, 418) is a capacitive sensor having a capacitance configured to change based on the first relative movement, wherein the first sensor signal is a measure of the capacitance. [3] Sampling system (100, 300, 400) according to claim 2, wherein the capacitive sensor comprises fixed electrostatic combs and movable electrostatic combs nested with the fixed electrostatic combs, wherein the movable electrostatic combs are configured to move based on the first relative movement relative to the fixed electrostatic combs to cause the capacitance to change. [4] Scanning system (100, 300, 400) according to any one of the preceding claims, further comprising: an outer axis sensor (322, 422) positioned between the inner frame (304, 404) and the outer frame (306, 406), wherein the outer axis sensor (322, 422) is configured to detect a second relative movement of the inner frame (304, 404) relative to the outer frame (306, 406) and to generate a second sensor signal corresponding to the second relative movement, where the second sensor signal is representative of a second angular position of the oscillator structure (102, 302, 402) around the outer axis (110). [5] Scanning system (100, 300, 400) according to claim 4, wherein the outer axis sensor (322, 422) is arranged symmetrically around the inner axis (112). [6] Scanning system (100, 300, 400) according to claim 4 or 5, wherein the outer axis sensor (322, 422) is a capacitive sensor having a capacitance configured to change based on the second relative movement, wherein the second sensor signal is a measure of the capacitance. [7] Sampling system (100, 300, 400) according to claim 6, wherein the capacitive sensor comprises fixed electrostatic combs and movable electrostatic combs nested with the fixed electrostatic combs, wherein the movable electrostatic combs are configured to move based on the second relative movement relative to the fixed electrostatic combs to cause the capacitance to change. [8] Scanning system (100, 300, 400) according to any one of the preceding claims, further comprising: a sensor circuit configured to receive the first sensor signal and to determine the first angular position of the oscillator structure (102, 302, 402) around the inner axis (112) based on the first sensor signal. [9] Scanning system (100, 300, 400) according to any one of the preceding claims, further comprising: a sensor circuit configured to receive the first sensor signal and to measure an angular trajectory of the oscillator structure (102, 302, 402) around the inner axis (112). [10] Scanning system (100, 300, 400) according to any one of the preceding claims, wherein: the first support structure (308, 408) and the second support structure (310, 410) are formed to suspend the oscillator structure over a cavity to enable the first oscillation, and the third support structure (312, 412) and the fourth support structure (314, 414) are formed to suspend the inner frame (304, 404) above the cavity to allow the second oscillation. [11] Scanning system (100, 300, 400) according to one of the preceding claims, wherein the inner frame (304, 404) surrounds the oscillator structure (102, 302, 402) and the outer frame (306, 406) surrounds the inner frame (304, 404) and the oscillator structure (102, 302, 402). [12] Scanning system (100, 300, 400) according to one of the preceding claims, wherein the inner frame (304, 404) is a gimbal frame and the outer frame (306, 406) is a chip frame of a semiconductor chip. [13] Scanning system (100, 300, 400) according to one of the preceding claims, wherein the oscillator structure (102, 302, 402), the inner frame (304, 404) and the outer frame (306, 406) form a one-piece integral component. [14] Scanning system (100, 300, 400) according to one of the preceding claims, wherein the inner axis sensor (318, 418) is coupled to the inner frame (304, 404) and the outer frame (306, 406). [15] System (100, 300, 400), comprising: a rotating structure (102, 302, 402) which is configured to rotate about an inner axis (112) according to a first rotation and to rotate about an outer axis (110) according to a second rotation; an inner frame (304, 404) which is mechanically coupled to the rotating structure by a first support structure (308, 408) and a second support structure (310, 410), wherein the first support structure (308, 408) and the second support structure (310, 410) extend between the inner frame (304, 404) and the rotating structure along the inner axis (112) and wherein the first support structure (308, 408) is arranged relative to the rotating structure opposite the second support structure (310, 410); an outer frame (306, 406) which is mechanically coupled to the inner frame (304, 404) by a third support structure (312, 412) and a fourth support structure (314, 414), wherein the third support structure (312, 412) and the fourth support structure (314, 414) extend between the inner frame (304, 404) and the outer frame (306, 406) along the outer axis (110) and wherein the third support structure (312, 412) is arranged relative to the rotating structure opposite the fourth support structure (314, 414); and an inner axle sensor (318, 418) located between the inner frame (304, 404) and the outer frame (306, 406), wherein the inner axis sensor (318, 418) is configured to detect a first relative movement of the inner frame (304, 404) relative to the outer frame (306, 406) and to generate a first sensor signal corresponding to the first relative movement, wherein the first sensor signal is representative of a rotational position of the rotating structure around the inner axis (112), wherein the inner frame (304, 404) and the outer frame (306, 406) are structured such that the first rotation causes the inner frame (304, 404) to rotate relative to the outer frame (306, 406) in a region of the inner axis sensor (318, 418) via a mixing effect, and wherein the inner axis sensor (318, 418) is arranged near the outer axis (110) such that the inner axis sensor (318, 418) is arranged closer to the outer axis (110) than to the inner axis (112). [16] System (100, 300, 400) according to claim 15, wherein the inner axis sensor (318, 418) is a capacitive sensor having a capacitance configured to change based on the first relative movement, wherein the first sensor signal is a measure of the capacitance. [17] System (100, 300, 400) according to claim 15 or claim 16, wherein the inner frame (304, 404) is a gimbal frame and the outer frame (306, 406) is a chip frame of a semiconductor chip. [18] Method (500) for a scanning system according to any one of claims 1 to 14, comprising: Driving (510) of the oscillator structure (102, 302, 402) around the inner axis (112) according to a first oscillation; Driving (520) the oscillator structure (102, 302, 402) around the outer axis (110) according to a second oscillation; and Detecting (530) a first relative movement of the inner frame (304, 404) relative to the outer frame (306, 406) in order to to generate a first sensor signal corresponding to the first relative movement, wherein the first sensor signal is representative of a first angular position of the oscillator structure around the inner axis, wherein the inner frame is mechanically coupled to the oscillator structure (102, 302, 402) by the first support structure (308, 408) and the second support structure (310, 410) which extend along the inner axis (112), wherein the outer frame is mechanically coupled to the inner frame (304, 404) by the third support structure (312, 412) and the fourth support structure (314, 414) which extend along the outer axis (110).

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