Melt spinning device for extruding a first melt and a second melt

Abstract

The invention relates to a melt spinning device (1) for extruding a first melt (P1) and a second melt (P2), comprising a first heat transfer medium housing (2) for providing a first heat transfer medium (4) and a second heat transfer medium housing (3) for providing a second heat transfer medium (5), wherein a pump support (20) with a first pump device (6) for pumping the first melt (P1) towards the second heat transfer medium housing is mounted in the first heat transfer medium housing (2), and a spinning pump support (30) is mounted in the second heat transfer medium housing (3), in which a spinneret assembly (32) for extruding the first melt (P1) and the second melt (P2) and a second pump device (8) for pumping the second melt (P2) towards the spinneret assembly (32) are mounted, and to a method for disassembling and cleaning the melt spinning device.

Description

[0001] The invention relates to a melt spinning device for extruding a first melt and a second melt and a method for disassembling and cleaning the melt spinning device.

[0002] For the production of synthetic threads consisting of different polymer melts, there are melt spinning devices from the state of the art with which it is possible to react to temperature differences of the respective polymer melts by providing the respective polymer melts via pump devices that are provided in separate heat carrier housings.

[0003] EP2122019B1 discloses a device for melt spinning synthetic filaments, comprising a spinning beam for receiving at least one spinneret assembly and a heating means for controlling the temperature of the spinneret assembly, comprising at least one spinning pump and a second heating means for controlling the temperature of the spinning pump, wherein the spinning pump and the spinneret assembly are connected to one another by a melt line, wherein the spinning pump and the second heating means are held in a separate pump carrier arranged at a distance next to the spinning beam.

[0004] CN116463742A discloses a two-part spinning beam for producing synthetic yarns from two melts, wherein a first spinning beam has only a first pump and a second spinning beam has a second pump and a spinneret. A different temperature can be provided in the first spinning beam than in the second spinning beam because the spinning beams are separate from each other and are in contact with each other via melt supply lines. The first pump and the second pump are connected to the spinneret of the second spinning beam via supply lines.

[0005] To date, there is no melt spinning device in which the melt distribution in the melt spinning device can be dismantled without first having to remove the heating medium or the heat transfer medium.

[0006] Disassembly of the melt spinning device may be necessary to clean the melt spinning device, for example in a burnout furnace

[0007] Cleaning the burnout furnace may be necessary if, for example, the melt solidifies in the melt distribution, which can happen, for example, if the heat transfer medium heater fails. Solidified melt cannot be remelted in a melt spinning device, especially if it is PA6 and / or PA6.6.

[0008] It is therefore an object of the invention to provide a melt spinning device which enables an uncomplicated and simple cleaning of the melt spinning device of solidified melt.

[0009] It is a further object of the invention to provide a method for cleaning a melt spinning device which has been contaminated with solidified melt.

[0010] This object is achieved according to the invention with regard to the melt spinning device with a melt spinning device having the features according to claim 1.

[0011] According to one aspect of the invention, a melt spinning device is provided for extruding a first melt and a second melt, comprising a first heat carrier housing for providing a first heat carrier medium and a second heat carrier housing for providing a second heat carrier medium, wherein a pump support with a first pump device for pumping the first melt towards the second heat carrier housing is mounted in the first heat carrier housing, and a spinning pump support is mounted in the second heat carrier housing, in which a spinneret package for extruding the first melt and the second melt and a second pump device for pumping the second melt towards the spinneret package are mounted.

[0012] By providing two heat transfer housings, the heat transfer medium in each heat transfer housing can be adjusted to the required temperature in a simple manner.

[0013] Additionally, by providing a spinning pump support in one of the heat transfer medium housings, the components held by the spinning pump support can be assembled and disassembled easily and cost-effectively. These components are preferably those used for supplying, conveying, and extruding a PA6.6 plastic melt.

[0014] The spinning pump support allows for quick and easy assembly and disassembly, so that the components held by the spinning pump support, such as a pump device and a spinneret package, can be easily replaced and, if necessary, cleaned in a burnout oven.

[0015] According to a preferred embodiment, an exchangeable coupling device for fluid-tight coupling of the second pump device to the spinneret package is accommodated in the spinning pump carrier between the second pump device and the spinneret package.

[0016] A coupling device is a part of the spinning pump support that is designed for the fluid-tight assembly and disassembly of a pump device and a spinneret assembly. The coupling device is positioned in the spinning pump support between the pump device and the spinneret assembly.

[0017] The coupling device allows for particularly simple and inexpensive assembly and disassembly of the pump device and the spinneret package, since all required lines are fluid-tightly coupled to it via easily removable assembly connections.

[0018] The term “replacement” refers to a simple and uncomplicated assembly and / or disassembly of the coupling device in the heat transfer medium housing.

[0019] Coupling is understood to mean a mechanically detachable assembly and disassembly of the respective components, whereby this can be carried out non-destructively and repeatedly.

[0020] According to a further preferred embodiment, the coupling device is arranged in the second heat carrier housing for coupling a first supply line to the first pump device and / or for coupling a second supply line to the second pump device with the spinneret package.

[0021] The different melts are fed to the spinneret package on the one hand and to the first and second pumping devices via the feed lines, whereby a separation of the melts takes place via the feed lines and the melts are only combined in the spinneret package to form a synthetic filament of two melts.

[0022] This makes it possible to separate the supply lines contaminated with PA6 and / or PA6.6 and clean them in a burnout furnace.

[0023] According to a preferred embodiment, the coupling device has a first feed line for feeding the first melt to the spinneret assembly and / or a second feed line for feeding the second melt to the spinneret assembly and / or a supply line for supplying the second pump device with the second melt.

[0024] With the first feed line and the second feed line in the coupling device, different melts can be fed to the spinneret package.

[0025] The coupling device can be provided with appropriate lines and / or the lines can be formed within the coupling device. The coupling device can be made of V6A steel, which does not react with the melts and is particularly easy to clean and burn out.

[0026] According to a further preferred embodiment, the spinning pump carrier has a first mounting space for receiving the second pump device and the coupling device and a second mounting space for receiving the spinneret pack, wherein the first mounting space and / or the second mounting space is accessible via a first through-opening and / or a second through-opening, so that the second pump device, the coupling device and / or the spinneret pack can be inserted and mounted via the respective through-opening.

[0027] The spinning pump support features separate assembly compartments, each of which can accommodate a pump assembly and a spinneret assembly. Furthermore, the assembly compartments feature through-openings that allow easy and convenient access to the components mounted therein.

[0028] According to a further preferred embodiment, the spinning pump support has a mountable and dismountable first connection component for the first supply line and / or a mountable and dismountable second connection component for the second supply line, wherein the first connection component and / or the second connection component can be mounted and dismounted with the first supply line and / or the second supply line by means of a first flange component and / or by means of a second flange component, wherein the first connection component and / or the second connection component are sealed in a fluid-tight manner against the heat transfer medium.

[0029] The supply lines are coupled to the spinning pump support via connecting components and also have flange components that are coupled to the spinning pump support via bolts and / or screw connections for easy assembly and disassembly.

[0030] The flange component is a coupling part for pipes and lines, which allows for easy and fluid-tight assembly and disassembly.

[0031] According to a preferred embodiment, the first heat transfer housing and / or the second heat transfer housing has a heat transfer supply for supplying and / or discharging a heat transfer medium.

[0032] The heat transfer fluid supply allows for separate supply of the heat transfer fluid. Furthermore, the pump assembly, spinneret assembly, and coupling assembly can be removed without having to drain the heat transfer fluid.

[0033] With regard to the method, the object is achieved according to the invention with a method having the features according to claim 8.

[0034] According to a further aspect of the invention, a method is provided for dismantling and cleaning a melt spinning device according to at least one of the preceding embodiments, comprising the steps: - Disassembly of a second pump device from a first assembly space of a coupling device, - Dismantling a first supply connection from a second connection component, - Dismantling a first supply line from the coupling device, - Dismantling of a spinneret package from a second assembly space of the coupling device; - Removing the pump assembly from the first assembly room, - Removing the spinneret package from the second assembly chamber.

[0035] The process enables quick and easy disassembly and assembly of the melt spinning device. This is achieved by positioning the pump assembly and spinneret assembly in a spinneret carrier with assembly spaces for the pump assembly and spinneret assembly. Coupling points for the pump assembly and spinneret assembly are provided in the assembly spaces, allowing for quick and easy assembly and disassembly. This allows, in particular, components that have come into contact with PA6 and / or PA6.6 to be easily and quickly disassembled and cleaned separately in a burnout furnace.

[0036] According to a preferred embodiment of the procedure, the following is carried out: - Dismantling a second supply connection from the second heat transfer housing, - spacing the first heat transfer housing away from the second heat transfer housing, and - Dismantling a second flange component from the coupling device.

[0037] In addition to easy and quick disassembly using suitable couplings, the heat transfer housings are suspended and mounted in such a way that the housings can be easily and quickly repositioned relative to each other. For example, the distance between the first heat transfer housing and the second heat transfer housing can be adjusted using a mobile suspension. For example, at least one of the two heat transfer housings is mounted on a rail support, which allows the distance to the other heat transfer housing to be adjusted or increased.

[0038] According to a further preferred embodiment of the method, the following is carried out: - burning out the second pump device, the first supply line and / or the spinneret package in a burnout oven, - Cleaning the second pump assembly, the first supply line and / or the spinneret package of burnout residues.

[0039] Once the coupled components have been disassembled, they can be placed in a burnout furnace as needed and completely cleaned of contaminants. After the burnout, a further cleaning step is required. The components can then be reassembled and used for extruding synthetic filaments.

[0040] With the coupling points at a suitable position of the spinneret package and the spinneret carrier, this can be done easily and in a short time.

[0041] The device according to the invention is explained in more detail below using some embodiments of the device according to the invention with reference to the attached figures.

[0042] They represent: Fig. 1 schematically shows a sectional view of a first embodiment of the melt spinning device according to the invention for extruding a first melt and a second melt, Fig. 2 schematically shows a sectional view of a second embodiment of the melt spinning device according to the invention for extruding a first melt and a second melt, Fig. 3 schematically shows a sectional view of a third embodiment of the melt spinning device according to the invention for extruding a first melt and a second melt, Fig. 4 schematically shows a sectional view of a fourth embodiment of the melt spinning device according to the invention for extruding a first melt and a second melt, and Fig. 5 a block diagram of the process steps for assembling and disassembling the melt spinning device.

[0043] Fig. 1 schematically shows a first embodiment of the melt spinning device 1 according to the invention for extruding a first melt P1 and a second melt P2.

[0044] On the left side of the two-part spinning beam is the area for PA 6.6. Here, a first melt P1 is distributed by a second pump device 8. This can be disassembled in the event of an emergency. On the right side is the area for the second meltable polymer (PA 6, PA6.6).

[0045] The second heat transfer housing 3 and the first heat transfer housing 2 have different heat transfer medium temperatures and they are separated from each other until shortly before the spinneret package 32.

[0046] The Fig. The melt spinning device 1 shown in Fig. 1 has a first heat carrier housing 2 for providing a first heat carrier medium 4 and a second heat carrier housing 3 for providing a second heat carrier medium 5.

[0047] The heat transfer medium 4, 5 is a heat transfer fluid, particularly Diphyl®, which evaporates even at low temperatures. Heat transfer fluids 4 and 5 develop a lower vapor pressure than water, so the heat transfer housings 2 and 3 must withstand lower pressure and can therefore have a thinner wall thickness.

[0048] In the first heat carrier housing 2, a pump carrier 20 is provided, which has a first pump device for pumping a first melt P1.

[0049] The pump device 6 preferably has an external gear pump which is driven by means of a first drive shaft 10 and can thus convey a first melt P1 which is guided to the first pump device 6 via a second supply line 54.

[0050] The first melt P1 is converted into a plastic melt via an extruder (not shown). The same applies to the second melt P2, which, for example, comes from plastic chips from another extruder.

[0051] The first melt P1 and the second melt P2 differ, for example, in their plastic composition or their properties. In particular, the plastic melt P2 provided in the second heat transfer medium housing 3 may be PA6 or PA6.6, which can make cleaning the contaminated components particularly difficult when this plastic melt hardens.

[0052] The second supply line 54 is fluid-tightly coupled to the first heat transfer housing 2 via a third supply connection 57, so that no heat transfer medium can leave the heat transfer housing 2. "Coupled" refers in particular to simple and easy assembly and disassembly.

[0053] The second supply line 54 can either be mounted on the first heat transfer medium housing 2, or coupling components such as a bayonet lock and / or a screw connection are provided, which can be operated and opened and closed without the need for tools. The same applies to the coupling components and coupling connections of the second heat transfer medium housing 3.

[0054] To facilitate assembly of the second supply line 54 and a first feed line 51, a mounting plate 60 is provided on the first pump device 6, to which a first feed line 51 for feeding the melt P1 to the second heat transfer medium housing 3 and the second supply line 54 can be easily coupled to the first pump device 6.

[0055] The first melt 1 is conveyed via a first feed line 51 from the first pump device to a spinneret pack 32. The spinneret pack 32 is arranged in a spinning pump support 30 in a second assembly chamber 34. The second assembly chamber 34 has a second through-opening 36. The plastic melt extruded from the spinneret pack can be extruded through the second through-opening 36. Furthermore, the second through-opening 36 is designed to be large enough to allow easy insertion of the spinneret pack 32.

[0056] The second assembly space 34 also contains the coupling points for the first supply line 51 of the first heat transfer medium housing 2 and the second supply line 52 of the second heat transfer medium housing 3. The first supply line 51 and the second supply line 52 are both housed in the spinning pump support 30. The spinning pump support 30 can be made of a material suitable for burnout. However, the first supply line and the second supply line 52 can also be formed separately in the spinning pump support 30.

[0057] Furthermore, a coupling device 50 is provided in the spinning pump support 30, which fluid-tightly couples the second supply line 52 to a second pump device 8. Like the first pump device 6, the second pump device 8 also has its own drive shaft 12. The drive shaft 12 serves to operate the second pump device 8, which is preferably also an external gear pump.

[0058] The coupling device 50 is coupled to the second pump device 8 in a manner that can be disassembled and assembled and additionally has a first supply line 53 for the second melt P2. The second melt 2 is transported to the second pump device 8 via the first supply line 53.

[0059] A second connection component 39 is coupled to the coupling device 50. The second connection component 39 connects the first supply line 53 to a first flange portal 40. The first flange component 40 enables coupling to a first supply connection 55.

[0060] The melt P2 is transported from the extruder to the second pump device 8 via the first supply connection 55.

[0061] Fig. Figure 2 shows a second embodiment of the melt spinning device 1, wherein the elements indicated or indicated with the same reference numerals are identical to the elements of Fig. 1 are.

[0062] The spinning pump device 1 of Fig. 2 differs essentially in the routing of the first supply line 51 towards the spinneret package 32 and an additional first and second flange component 40 and 41, which improves the coupling of the first supply line 51 to the coupling device 50.

[0063] The first flange component 40 is as in the first embodiment of Fig. 1 for coupling the first supply connection 55 with the second connection structure 39, in which the first supply line 53 for supplying the second pumping device 8 is provided.

[0064] The first flange component 40 is preferably connected to the connection component 39 via mounting bolts 42, which allow safe and easy assembly and disassembly of the first flange component 40 with the first supply connection 55 and the second connection component 39.

[0065] The second flange component 41 serves to connect the second supply connection 56 of the first heat transfer housing 2 to the first connection part 38 of the second heat transfer housing 3.

[0066] Furthermore, the first connecting component 38 is detachably coupled to the coupling device 50 via bolts 42 with the flange component.

[0067] In addition, a first supply line 51 is formed in the coupling device 50 so that the melt P1 of the first heat transfer medium housing can be supplied via the first pump device 6.

[0068] In addition, a spinneret pack flange 80 is formed in the spinning pump support 30, which separates the coupling device 50 and the spinneret pack 32 from each other, so that an additional cleaning possibility exists.

[0069] The coupling device 50 can also be removed from the spinning pump support 30 so that it can be cleaned separately in a burnout oven.

[0070] This also applies to all other components.

[0071] In addition, Fig. 2 indicates that the first heat transfer housing 2 and the second heat transfer housing 3 each have mounting openings 21 to 27 through which the connecting components 38 and 39, the first pump support 20 and the spinning pump support 30 can be inserted.

[0072] The first mounting opening 21 allows the insertion of the spinning pump support 30 and at the same time access to the second pump device 8.

[0073] Furthermore, the coupling device 50 is designed such that disassembly and assembly of the second pump device 8 and / or the spinneret package 32 can be carried out without the second heat transfer medium 5 in the second heat transfer housing 3 having to be removed.

[0074] The Fig. 2 shown coupling device 50 differs from that shown in Fig. 1 shown coupling device 50, in that the Fig. 2, the coupling device 50 has a first supply line 53 leading to the second pump device 8, a second feed line 52 leading from the second pump device to the spinneret package 32, and a first feed line 51 leading from the first heat transfer medium housing 2.

[0075] It should also be noted that the first heat transfer medium 4 and the second heat transfer medium 5 are each separately located in the first heat transfer housing 2 and the second heat transfer housing 4, respectively, and thus the heat transfer mediums 4, 5 can each provide different temperatures. This prevents deterioration of the respective melt because the heat transfer mediums can be optimally adjusted to the respective temperature conditions.

[0076] The Fig. 3 and Fig. The embodiments of the melt spinning device 1 shown in Figure 4 differ essentially only by an additional heat transfer medium supply 70, via which the second heat transfer medium 5 can be separately supplied to and removed from the second heat transfer medium housing 3. This is particularly relevant for the second heat transfer medium 5, since melts are supplied here in particular that require extra and specific cleaning of the components that come into contact with them, such as placing the components in a separate burnout furnace.

[0077] Fig. Figure 5 shows a schematic representation of the essential process steps for dismantling and cleaning the melt spinning device 1.

[0078] In method step S1, the second pump device 8 is disassembled from the first assembly space 33 of the coupling device 50. For this purpose, suitable coupling points are provided in the coupling device and in the pump device 8.

[0079] In step 2, the first supply connection 55 is dismantled from the connection structure 39, in particular the supply line 53 present therein in steps S2 and S3.

[0080] In step S4, the spinneret package is disassembled from the second assembly space 34 from the coupling device 15.

[0081] Thereafter, in steps S5 and S6, the pump device 8 and the spinneret pack 32 are removed from the first assembly space 33 and the second assembly space 34, respectively.

[0082] In step S7, the second supply line 56 is disassembled from the second heat carrier housing 3 so that in step S8 the first heat carrier housing 2 can be spaced apart from the second heat carrier housing 3.

[0083] This is necessary so that the lines present in the second supply connection 56 can be removed.

[0084] For this purpose, the second flange component 41 is removed from the coupling device 50 in step S9.

[0085] In step S10, the components contaminated with PA6 or PA6.6, the second pump device 8, the first supply line 53 and / or the spinneret package, are then burned out.

[0086] After the second pump device 8, the first supply line 53 and / or the spinneret package 32 have been burned out, additional cleaning and removal of the burnout residues takes place. List of reference symbols: 1 melt spinning device 2 first heat transfer housing 3 second heat transfer housing 4 first heat transfer medium 5 second heat transfer medium 6 first pump device 8 second pump device 10 first drive shaft 12 second drive shaft 20 bellhousings 21 first assembly opening 22 second mounting opening 23 third mounting opening 24 fourth mounting opening 25 fifth mounting opening 26 sixth mounting opening 27 seventh mounting opening 30 spinning pump carriers 32 spinneret pack 33 first assembly room 34 second assembly room 35 first passage opening 36 second passage opening 37 third passage opening 38 first connecting component 39 second connecting component 40 first flange component 41 second flange component 42 mounting bolts 50 Coupling device 51 first supply line 52 second supply line 53 first supply line 54 second supply line 55 first supply connection 56 second supply connection 57 third supply connection 60 mounting plate 70 Heat transfer medium supply 80 spinneret package flange P1 first melt P2 second melt QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] EP 2122019B1

[0003] CN 116463742A

[0004]

Claims

[1] Melt spinning device (1) for extruding a first melt (P1) and a second melt (P2), comprising a first heat carrier housing (2) for providing a first heat carrier medium (4) and a second heat carrier housing (3) for providing a second heat carrier medium (5), wherein a pump support (20) with a first pump device (6) for pumping the first melt (P1) towards the second heat carrier housing is mounted in the first heat carrier housing (2), and a spinning pump support (30) is mounted in the second heat carrier housing (3), in which a spinneret pack (32) for extruding the first melt (P1) and the second melt (P2) and a second pump device (8) for pumping the second melt (P2) towards the spinneret pack (32) are mounted. [2] Melt spinning device (1) according to claim 1, characterized bythat in the spinning pump support (30) between the second pump device (6) and the spinneret pack (22) there is accommodated an exchangeable coupling device (50) for fluid-tight coupling of the second pump device (6) to the spinneret pack (32). [3] Melt spinning device (1) according to at least one of the preceding claims 1 or 2, characterized by that the coupling device (50) is arranged in the second heat carrier housing (3) for coupling a first supply line (51) to the first pump device (6) and / or for coupling a second supply line (52) to the second pump device (8) with the spinneret package (32). [4] Melt spinning device (1) according to at least one of the preceding claims, characterized bythat the coupling device (50) has a first feed line (51) for feeding the first melt (P1) to the spinneret pack (32) and / or a second feed line (52) for feeding the second melt (P2) to the spinneret pack (32) and / or a supply line (3) for supplying the second pump device (8) with the second melt (P2). [5] Melt spinning device (1) according to at least one of the preceding claims, characterized byin that the spinning pump support (30) has a first mounting space (33) for receiving the second pump device (8) and the coupling device (50) and a second mounting space (34) for receiving the spinneret pack (32), wherein the first mounting space (33) and / or the second mounting space (34) is accessible via a first through-opening (35) and / or a second through-opening (36), so that the second pump device (8), the coupling device (50) and / or the spinneret pack (32) can be inserted and mounted via the respective through-opening (35, 36). [6] Melt spinning device (1) according to at least one of the preceding claims, characterized byin that the spinning pump support (30) has a mountable and dismountable first connection component (38) for the first supply line (51) and / or a mountable and dismountable second connection component (39) for the second supply line (52), wherein the first connection component (38) and / or the second connection component (39) can be mounted and dismounted with the first supply line and / or the second supply line by means of a first flange component (40) and / or by means of a second flange component, wherein the first connection component and / or the second connection component are sealed in a fluid-tight manner against the heat transfer medium. [7] Melt spinning device (1) according to at least one of the preceding claims, characterized by that the first heat transfer housing (2) and / or the second heat transfer housing (3) has a heat transfer medium supply (70) for supplying and / or discharging the heat transfer medium (4, 5). [8] Method for dismantling and cleaning a melt spinning device (1) according to at least one of the preceding claims 1 to 7, comprising the steps: - Disassembly of a second pump device (8) from a first assembly space (33) of a coupling device (50), (S1), - Disassembly of a first supply connection (55) from a second connection component (39), (S2), - dismantling a first supply line (53) from the coupling device (50) (S3), - dismantling a spinneret package (32) from a second assembly space (34) of the coupling device (50), (S4); - Removing the second pump device (8) from the first assembly space (33), (S5), - Removing the spinneret package from the second assembly chamber (34), (S6) [9] Method according to the preceding claim 8, characterized by - Dismantling a second supply connection (56) from the second heat carrier housing (3), (S7), - spacing the first heat carrier housing (2) from the second heat carrier housing (3), (S8), and - Dismantling a second flange component (41) from the coupling device (50), (S9). [10] Method according to at least one of the preceding claims 8 or 9, characterized by - burning out the second pump device (8), the first supply line (53) and / or the spinneret package in a burnout furnace (S10), - Cleaning the second pump device (8), the first supply line (53) and / or the spinneret package (S11) of burnout residues.

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