Electronic circuitry on a textile substrate and manufacturing process

Abstract

An electronic circuit on a textile substrate comprises circuit lines with conductive traces lying flat against the textile substrate, and a contact module with a base bonded to the textile substrate for the mechanically detachable mounting of an electronic module. The contact module includes electrically conductive contact surfaces and is designed to hold an electronic module equipped with electrical contacts at a predetermined position relative to the base such that several of its electrical contacts are electrically connected to several contact surfaces of the contact module.The base has an inner base bottom section and is connected on its underside in a planar and material-bonded manner to a base cover section of a lower cover (2800), wherein this planar and material-bonded connection contains one or more intermediate layers, each planarly connected on both sides to adjacent surfaces, in which electrically conductive conductor track sections are located. These are electrically connected through the inner base bottom section to the contact surfaces of the contacting module, or their sides facing the predetermined position serve as contact surfaces of the contacting module through openings in the inner base bottom.

Description

INTRODUCTION AND STATE OF THE ART

[0001] The invention relates to an electronic circuit on a textile substrate, as well as a manufacturing method for such an electronic circuit.

[0002] Electronic circuits on textile substrates are known in various applications, for example in connection with textiles worn on the body or textiles with other functions, such as textile coverings for car or airplane seats. Known as "smart textiles," they are enjoying increasing popularity and use.

[0003] Electronic circuits on textile substrates often contain circuit elements that are either directly attached to or integrated into the textile substrate and are designed to impair the textile's tactile feel, or only minimally so. Examples include discrete circuit elements such as electrodes as sensors for detecting electrical voltages or as actuators for delivering electrical impulses, temperature sensors, sensors for chemical substances or material changes, as well as antennas or heating elements. When textile substrates with such sensors are worn directly on the skin, they can be used to detect the user's biofunctions. Textile substrates with actuators in direct skin contact can be used, for example, for therapeutic stimulation of the human body and / or movement control.

[0004] Electrically conductive circuit lines are often used to connect circuit elements that lie directly on the textile substrate. These lines have conductors that either lie flat against the textile substrate and / or are woven into the fabric. This is done to minimize any impairment of the textile's feel, as in normal clothing, and to meet further requirements such as washability. Many components of such circuits that lie flat against the textile substrate, especially discrete circuit elements and conductors, can be manufactured using additive manufacturing processes such as printed electronics.

[0005] On the other hand, certain electronic functions, such as control, signal amplification, and data processing, cannot be additively manufactured and integrated into textile substrates using current production methods. Instead, such functions are usually implemented partly using conventional silicon-based circuit elements on PCBs. Therefore, electronic circuits that are applied to textile substrates across a surface area regularly form hybrid systems in combination with electronic modules containing conventional electronic components such as microcontrollers, data storage, and communication electronics on PCBs, as well as energy storage devices (batteries).

[0006] In such hybrid systems, the electronic modules are preferably mechanically and electrically detachable from the circuits on textile carriers, for example to change and / or wash and / or replace the textile carriers after use, or to supply the systems with freshly charged energy storage after use.

[0007] If only individual contacts are required, detachable connections are typically made via snap fasteners with sockets (female components) on the textile substrate, often in conjunction with loose cables. Detachable multiple connections are frequently achieved via plug connectors in contact modules that are permanently attached to the textile substrate and mechanically detachable the electronic modules at predetermined relative positions. Such contact modules contain electrically conductive contact surfaces for connecting the contacts of the mounted electronic modules to elements of the electronic circuits on the textile substrate.

[0008] In the prior art, such a contact module typically comprises several parts for the fixed connection of the textile substrate. At least two of these parts enclose the textile from opposite sides and are connected to each other by tensile connections through the textile, usually screws, rivets, or other metal bolts. For electrical connection to such contact modules, conductors lying flat against the textile substrate and conductors bonded to the textile are contacted via the metal bolts. Separately routed electrical conductors and woven-in electrically conductive strands can be detached from the textile substrate at their ends and connected to the conductive contact surfaces of the contact module. Such contact modules are described, for example, in WO 2016 / 054057A1 or WO 2020 / 0257933A1.

[0009] In all the aforementioned solutions, the number of possible electrical connections is limited by the size of the contact module. Such contact modules cannot be miniaturized and, due to their complex structure, are also disadvantageous in terms of manufacturing effort. If the textile carrier with the electronic circuitry is worn on the body and the electronic module is detached and reconnected by the user during everyday use, further limitations arise, including restrictions on the number of detachable electrical connections. These connections must be both mechanically and electrically robust and detachable without requiring significant force. Connectors designed for this purpose typically have no more than 10 and at most approximately 25 contacts.Common connectors for a large number of detachable electrical contacts (for example, for connecting PCBs in electronic devices or in special applications of measurement technology) are neither designed nor suitable for simple and robust disconnection and reconnection by a user in everyday use.

[0010] One object of the present invention is to overcome the aforementioned disadvantages and to create an electronic circuit on a textile substrate with the possibility of mechanically detachable contacting of an electronic module, which enables lower manufacturing costs and a high spatial density of electrical connections between the circuit on the textile substrate and the electronic module. A further object of the present invention is to create an electronic circuit on a textile substrate with the possibility of mechanically detachable contacting of an electronic module, which allows for simple and robust disconnection and reconnection by a user, even when a large number of circuit elements directly attached to or integrated into the textile substrate need to be contacted.A further object of the present invention is to connect an electronic circuit on a textile substrate and a detachable electronic module by means of a contacting module that is designed to be as compact as possible and to impair the textile feel of the substrate as little as possible or only to a minimal extent.

[0011] A further object of the present invention is to overcome the aforementioned disadvantages and to provide a manufacturing method for an electronic circuit on a textile substrate with the possibility of mechanically detachable contacting of an electronic module, which enables lower manufacturing costs and a high spatial density of electrical connections between the circuit on the textile substrate and the electronic module. A further object of the present invention is to provide a manufacturing method for electronic circuits according to the invention.

[0012] In light of these tasks, the present invention provides the electronic circuits according to claims 1 and 2 and the manufacturing methods according to claims 19 and 20. The dependent claims relate to advantageous embodiments and further developments.

[0013] Further features and advantages will become apparent from the following description and the accompanying figures. These, as well as the patent claims, disclose features of the invention in specific embodiments, exemplary embodiments, and combinations. However, the disclosed features can also be considered individually and combined into further combinations or sub-combinations to adapt the invention, as defined in the claims, to specific needs or areas of application. BRIEF DESCRIPTION OF THE FIGURES Fig. 1A and Fig. Figure 1B shows, as a first embodiment, a schematic electronic circuit with two conductor strands on a textile substrate in top views of the substrate from both sides. Fig. Figure 2 shows a section view with contact module and contacted electronic module. Fig. 3A and Fig. Figure 3B shows details of the contacting in the contacting module for a second embodiment. Fig. 4A and Fig. Figure 4B shows a third embodiment of a contacting module with a socket extension along one connection direction. Fig. Figures 5A to 5D show examples of other alternative base designs. Fig. 6A and Fig. Figure 6B shows, as a fourth embodiment, a contacting module with three connection directions. Fig. 7A and Fig. Figure 7B shows, as a fifth embodiment of a contacting module, a further arrangement for connecting the contacting module to the conductors and circuit elements on the opposite side of the textile. Fig. Figure 7C shows an alternative design variant. Fig. 8A and Fig. Figure 8B shows, as the sixth example, a contacting module with a design for two connection directions and a reversal of the conductive layers when connecting to the rest of the circuit. Fig. 9A, Fig. 9B and Fig. Figure 9C shows, as the seventh embodiment, a contacting module with several superimposed conductor tracks. Fig. 10A and Fig. Figure 10B shows, as the eighth embodiment, a contacting module with several superimposed conductor tracks and a selection switching device in the layer system between the inner base floor section and the lower cover. Fig. Figures 11A to 11E show examples of different arrangements of a selection switching device in conjunction with several superimposed conductor tracks. Fig. 12A and Fig. Figure 12B shows, as a ninth embodiment, an arrangement for a side reversal of several superimposed conductor tracks when connecting the contacting module with several superimposed conductor tracks in the further circuit. Fig. Figures 13A to 13G show, as a tenth embodiment, an arrangement for a side reversal of several superimposed conductor tracks of the contacting module when connecting to sections of the electronic circuit without superimposed conductor tracks. Fig. 14A and Fig. 14B shows a variant of the tenth embodiment. Fig. 15A, Fig. 15B and Fig. Figure 15C shows circuits on a textile using the arrangements in the tenth embodiment and its variant. Fig. Figures 16A to 16H show, as an eleventh embodiment, a circuit with a two-dimensional field of M x N circuit elements. Fig. Examples 17A to 17D show, as the twelfth example, a circuit with a two-dimensional field of M x N circuit elements, each of which is contacted with several lines. Fig. 18A and Fig. Figure 18B shows a flowchart and associated arrangement for a first exemplary manufacturing process. Fig. 19A and Fig. Figure 19B shows a flowchart and associated arrangement for a second exemplary manufacturing process. Fig. 20A and Fig. Figure 20B shows a flowchart and associated arrangement for a third exemplary manufacturing process. Fig. Figures 21A to 21D schematically show, as a thirteenth embodiment, a combination of a printed film and a suitably designed base body for use in the manufacture of an exemplary base. Fig. Figures 22A to 22E show, as a fourteenth embodiment, a combination of a further printed film and a suitably designed base body, further designed by way of example to accommodate a textile carrier for use in the manufacture of a base connected with the textile carrier. Fig. Figures 23A to 23H show, as a fifteenth embodiment, a combination of several printed films and a suitably designed base body, designed for use as a base for a contacting module with several superimposed conductor tracks. DESCRIPTION OF THE INVENTION

[0014] In the following description of the invention, reference is made to figures as exemplary embodiments to illustrate features, aspects, and embodiments of the invention. If the same reference numerals are used in different figures, repetitive explanations are omitted. Unless otherwise stated, the respective features and aspects of repeatedly used reference numerals are to be understood based on previously given explanations. Unless and to the extent that figures are schematic drawings and details in the graphical representation are not to be understood as limiting.

[0015] The electronic circuit according to the invention on a textile substrate comprises several circuit lines with conductor tracks lying flat against the textile substrate in one or more layers, as well as a contacting module with a base bonded to the textile substrate, which is designed for the mechanically detachable mounting of an electronic module without contact with the textile substrate. The contacting module comprises several electrically conductive contact surfaces and is designed to mount an electronic module provided with several electrical contacts at a predetermined position (P) relative to the base such that several, for example all, of its electrical contacts are electrically connected to several contact surfaces of the contacting module.

[0016] In a preferred embodiment, the textile carrier is designed for wearing on the human body, and the circuit comprises several electrically conductive electrodes and / or sensors lying flat on the textile carrier, which are connected via several of the circuit lines to a conductive contact surface of the contacting module and are in contact with the skin when the textile carrier is worn.

[0017] Fig. Figure 1 schematically shows a first embodiment, presented here as an example of an electronic circuit worn on the human body on a textile carrier material. The textile carrier 1000 here has the form of trousers, in Fig. 1A in a flat front view from the outside, in Fig. 1B in a corresponding interior view, i.e., the inside facing the human body. The contact module 2000 is located on the front of the right leg at mid-height, in the front view of Fig. 1A drawn on the left, in the interior view of Fig. 1B right. In the interior view, circuit lines 4000 with conductive traces lying flat against the textile carrier are shown. They serve to contact circuit elements 4500, such as electrically conductive electrodes, which in the illustrated example also lie flat against the textile carrier on its inner surface and facing the human body. The axes in the figures are each aligned relative to the textile carrier; the directions x and y are parallel to its main surface, and perpendicular to them are +z, the direction to the outside (+z), and -z, the direction to the inside (-z) of the textile carrier.

[0018] In general, switching elements worn on the human body on textile backing material are often discrete circuit elements, particularly sensors for measuring biological, environmental, or ambient variables, or actuators for stimulating bodily functions. Such body-worn sensors can collect information about the wearer or environmental data and—optionally—provide data or feedback loops for the actuators. The electronic circuitry worn on the human body on textile backing material can be used to measure bodily signals and activate specific parts of the body, for example, by measuring voltages and / or currents generated by the body and activating muscles by applying voltages and / or currents. The actuators can also be operated independently of the sensor elements.

[0019] Fig. Figure 2 shows a section of the first embodiment with the contacting module 2000 and the contacted electronic module 3000 in a sectional view in an xz plane. In this sectional view, the inside of the textile carrier 1000 is facing downwards, and the conductor tracks 4100, which lie flat against the textile carrier, extend in the x-direction (“connection direction”) to both sides.

[0020] The contacting module 2000 comprises the base body 2100 which is bonded to the textile carrier and mechanically detachably receives the electronic module at a predetermined position (P) relative to the base without contact with the textile carrier.

[0021] In the example shown, the contact module has a cover 2200 on the side facing away from the body, which together with the base body 2100 forms a cavity H. Generally, for circuits worn on textile backing material on the human body, it is preferred to house the electronic module in a dustproof and water-jet-proof cavity (protection class IP65). The electronic module 3000 and the cover 2200 can be separate from each other, as in the illustrated embodiment, or formed as a single piece, i.e., permanently connected to each other. Furthermore, in this embodiment, the base body projects in the z-direction up to the total height of the contact module from the side of the textile facing away from the body and encloses the cover laterally without the cover protruding. Alternatively, the cover can project beyond the base body in the z-direction and, for example, have a depth adapted to the space requirements of the electronic module.This has the advantage for the electronic circuit according to the invention that textile carriers with similar bases can be used for contacting electronic modules with different space requirements.

[0022] Other elements of the illustrated embodiment that have not been mentioned are described below.

[0023] Fig. Figure 3 shows details of the electrical contacting in the contacting module for a second embodiment, namely Fig. 3A as a section view in an xy-plane at height S2S2' in Fig. 3B, and Fig. 3B as a section view in an xz-plane at S1S1' in Fig. 3A. For the purpose of graphical representation, in this figure the electronic module 3000 has been moved upwards from contact position P, so that its electrical contacts 3101, 3102, 3103 are clearly visible, separate from the electrically conductive contact surfaces 2101, 2102, 2103 of the socket. Functionally, the electronic module is held at position P relative to the socket such that several of its electrical contacts (here shown: all contacts 3101, 3102, 3103) are electrically connected to several contact surfaces (here shown: all contact surfaces 2101, 2102, 2103) of the contacting module, as shown in Fig. 2 is shown functionally for the first embodiment.

[0024] In a first aspect of the invention, the base body has an inner base bottom section and, on the side of the base facing away from the predetermined position P (hereinafter referred to as the underside), a lower cover. The lower cover has a section (hereinafter referred to as the base cover section) that is bonded to the underside of the inner base bottom section in a planar and material manner. This planar and material connection between the inner base bottom section and the base cover section includes one or more intermediate layers, each bonded to adjacent surfaces on both sides, in which conductive trace sections are located. These conductive trace sections serve for the electrical connection between the circuit lines with the conductive traces lying flat against the textile carrier and the electronic module in the predetermined position in the contacting module.For this purpose, the conductor track sections are electrically connected at their ends furthest from the predetermined position to the circuit lines outside the base. At their ends closer to the predetermined position, the conductor track sections are electrically connected in and / or through the inner base base section to contact surfaces of the contacting module, or their sides facing the predetermined position serve as contact surfaces (2101, 2102, 2103) of the contacting module through openings (2161, 2162, 2163) in the inner base base. This arrangement according to the invention enables a detachable mechanical and electrical connection between the electronic circuit on a textile substrate and the electronic module, which is detachably mounted at the predetermined position in the contacting module.

[0025] The contact module is firmly connected to the textile substrate via its base. This mechanical connection is material-bonded and can be achieved by gluing and / or fusing, with the base preferably being formed from one or more electrically non-conductive thermoplastic elastomers. The mechanical connection between the underside of the inner base section and the base cover section is also planar and material-bonded, and comprises one or more intermediate layers, each planarly bonded to adjacent surfaces on both sides. These intermediate layers contain the conductor sections for electrical connection to the circuit traces of the electronic circuit on the textile substrate.It is advantageous if the lower cover is also formed with an electrically non-conductive thermoplastic elastomer, preferably TPU, and the conductor track sections are bonded directly and / or via electrically insulating intermediate layers to the thermoplastic elastomer. Preferably, but not necessarily, the aforementioned non-conductive thermoplastic elastomers are elastic, so that when the electronic circuit is worn on the human body, the base, together with the textile carrier, can adapt to the shape of the body. This is particularly relevant when, for example, the electronic circuit is worn on the textile carrier on a thigh or forearm, and the base is positioned on an outwardly curved outer surface of the thigh or forearm, allowing it to adapt to the curved shape of the body together with the textile carrier.

[0026] The one or more intermediate layers containing the conductive traces can be manufactured in the desired layout using known additive manufacturing processes, particularly printing processes for printed electronics. These processes utilize printing inks which, in their solidified state after post-treatment involving the application of heat and / or pressure, exhibit the desired electrical properties (e.g., electrically conductive, electrically insulating, semiconducting).

[0027] These printing processes allow for a high spatial density of electrical connections, in which conductor track sections per layer plane can be arranged at grid spacings (track width + adjacent spacing) in the range of a few hundred micrometers (preferably about between 50 µm and 500 µm) or more and at layer spacings (height of conductor track section + height of insulator layer) perpendicular to the underside of the inner base bottom section of a size on the order of a few tens of micrometers (about between 5 µm and 200 µm, preferably between 10 µm and 40 µm) or more. Printed conductor tracks can be provided with an electrically conductive layer with a thickness in the range of 10 µm to 200 µm, preferably in the range of 4 µm to 60 µm, and with cross-sectional widths in the range of 100 µm to 30mm, preferably in the range of 300 µm to 3mm.

[0028] The associated manufacturing costs are primarily determined by the process steps of the respective printing methods and are largely independent of the specific print pattern, such as the number of parallel connections to be made between the contact surfaces of the contacting module and the circuit lines to be contacted on the textile substrate outside the base. Therefore, printing methods for printed electronics are also advantageous from a cost perspective, especially when a larger number of circuit lines need to be contacted on the textile substrate.

[0029] Conductive tracks, whether single- or multi-layered and lying flat against the textile substrate, can also be manufactured using known additive manufacturing processes, in particular printing processes of "printed electronics". They are electrically insulated by a printing process over a length of at least 20 mm, preferably 100 mm, and provided inside the insulation with an electrically conductive layer in the dimensions specified above.

[0030] According to the invention, connections between the contact surfaces in the contacting module and the circuit lines on the textile carrier outside the base can be designed as direct connections with an unchanging 1:1 relationship or can be made variably selectable via a selection switching element.

[0031] In a second aspect of the invention, the electronic circuit in a section rigidly connected to the textile carrier comprises a selection switching device by which one of several circuit lines outside the base can be selected for one or more contact surfaces of the contacting module and electrically connected to the respective contact surface. Such a selection switching element 2600, for example a multiplex switching element, allows the contact surfaces of the contacting module and the circuit lines outside the base to be variably selected during operation of the circuit and thus connected in a larger number overall.

[0032] This is of practical importance because if the electronic circuit is worn on the body on the textile carrier, the electronic module's connection within the contact module must be mechanically and electrically robust, yet also easily detachable by the user. Connectors typically designed for no more than 25 to 50 contacts are suitable for this purpose. In some cases, connectors for up to 200 contacts are used, but these are not suitable for manual detachment and robust connection by a user in everyday use.

[0033] Both aspects of the invention described above will be explained below using several exemplary embodiments with reference to the accompanying figures.

[0034] As in Fig. As shown in Figure 3B, the base body 2100 has an inner base bottom section 2150 and on its underside 2150U a lower cover 2800 with base cover section 2850. Viewed perpendicularly to the underside, the lower cover and the rest of the base can have identical or different outer outlines; in particular, the lower cover can completely or only partially cover the underside of the rest of the base, for example, in Fig. 3A the lower cover 2800 separates the underside of the remaining base 2100 only with its base cover section 2850. On the other hand, the lower cover may comprise one or more section(s) projecting beyond the outer outline of the remaining base, as for example in Fig. 2 drawn.

[0035] The base cover section 2850 is bonded to the underside 2150U of the inner base floor section 2150 in a continuous and material manner. In the exemplary embodiment in Fig. 3B, this planar and material connection according to the invention between the inner base floor section and the base cover section is direct in the left part of the base shown, while in the middle and right parts of the base the planar and material connection is made via intermediate layers 2510, which are on both sides (i.e., upwards and downwards) Fig. 3B) are connected to adjacent areas over a wide area.

[0036] Within these intermediate layers 2510 are the conductor sections 2511, 2512, 2513 for the electrical connection between the circuit lines 4000 outside the base and the electronic module 3000 in the predetermined position in the contacting module. For this purpose, the conductor sections are connected at their ends closest to the predetermined position via through-holes 2550 through the inner base base section 2150 to the contact surfaces 2101, 2102, 2103 of the contacting module, and at their ends furthest from the predetermined position to circuit lines 4000 of the electronic circuit on the textile substrate. These through-holes can be permanently attached to the material or detachable.

[0037] The base, which is bonded to the textile support in a form-fitting and material-locking manner, has a stiffening effect on the latter. As schematically illustrated in the figures for the exemplary embodiments, it is advantageous if the thickness of the base decreases upwards (in the z-direction) and outwards (in the x and y directions, adapted to the circuit leads) and its elasticity increases. This outward increase in elasticity can be promoted by suitably shaped cavities and outwardly tapered ribs (in the x and y directions) within the base and / or by using different base materials with outwardly increasing elasticity (in the x and y directions) (not shown in the figures).An elasticity that increases towards the outside is advantageous in order to allow the different stiffnesses of the base and the textile support to transition into each other as smoothly as possible and to avoid buckling of the textile support and, in particular, of the circuit lines lying flat against it at the edge of the base.

[0038] In the exemplary embodiment in Fig. 2. The planar and material connection between the inner base base section and the base cover section in the middle and left-hand part of the base is achieved via intermediate layers 2510, which are planarly connected to adjacent surfaces on both sides (i.e., above and below). The conductor track sections contained therein are electrically connected to circuit lines 4000 shown on the left of the drawing outside the base. In the right-hand part of the base, in the area between the inner base base section and the base cover section, is the selection switching device 2600. This device allows one of the circuit lines shown on the right outside the base to be selected and electrically connected to the contact surface(s) of the contact module shown on the right.

[0039] The selection switching device 2600 can, for example, be designed as an analog multiplex circuit and implemented using a silicon-based component. In such a case, the arrangement in the base of the contacting module, here, for example, between the inner base bottom section and the base cover section, allows for a compact design of the contacting module without otherwise noticeably impairing the textile feel of the carrier. In such an arrangement, the planar and material connection between the inner base bottom section and the base cover section via intermediate layers, which are planarly connected to adjacent surfaces on both sides, is interrupted by the silicon-based component and is only possible in an area that excludes—and preferably surrounds—it. With this in mind, in the exemplary embodiment in Fig. 2. The lower cover 2800 was chosen to be sufficiently large.

[0040] Fig. 4A and Fig. Figure 4B shows, as a third embodiment, a contacting module in which the base above the textile carrier 1000 is extended along a connection direction x of the contacted conductor tracks by an upper connection section 2900 – preferably in one piece. This upper connection section is positively and materially bonded to the textile carrier and has a stiffening effect on it. Preferably, its thickness decreases upwards (z-direction) along the connection direction and its elasticity increases. On the lower side of the textile carrier 1000, opposite the upper connection section 2900, the lower cover 2800 is also extended along the connection direction. A selection switching device 2600, for example in the form of a silicon-based component, is arranged between the lower cover and the textile carrier in the area of ​​the base extended along the connection direction.

[0041] Such an extension of the base along the connection direction with increasing elasticity towards the outside is also advantageous, regardless of the space gained for arranging the selection switching device, in order to ensure that the different stiffnesses of the base and the textile support transition into each other as smoothly as possible along the connection direction and to avoid kinking of the circuit lines at the edge of the base.

[0042] Alternatively, and independent of the base design, the selection switching device itself can be designed – wholly or partially – as a circuit lying flat against the textile substrate. In particular, for example, transistors of the selection switching device can be designed as printed electronics and manufactured using suitable printing inks, including those that exhibit electrically semiconducting properties after printing and / or heat treatment. In such a case, the selection switching device can be designed as a printed layer system with intermediate layers bonded flatly to adjacent surfaces on both sides, and it can be arranged both inside and outside the base of the contact module without significantly impairing the textile feel of the substrate.

[0043] From these considerations it becomes clear that both aspects of the present invention mentioned at the outset can be realized both together and separately, and that the problems mentioned at the outset of the present invention can be solved by both aspects of the present invention.

[0044] Numerous other features shown in the drawings of the three exemplary embodiments described above are optional and can be configured alternatively. For example, in the first three exemplary embodiments, plug connectors are provided for the electrical connection between the contacts 3101, 3102, 3103 of the electronic module and the contact surfaces 2101, 2102, 2103 of the contacting module, in which the contacts of the electronic module are configured as male elements of a plug connector, i.e., as protruding pins, and the contact surfaces of the contacting module are configured as female elements of a plug connector to receive such pins. Alternatively, the contact surfaces of the contacting module can be configured as protruding pins to be connected to corresponding contacts of the electronic module via plug connectors. (not shown).Frictional forces between protruding pins and contact surfaces designed as female elements to receive the pins contribute significantly to the mechanical cohesion of the electrical connections.

[0045] According to a third aspect of the present invention, instead of plug connections, electrical pressure connections are used, in which the contact surfaces of the contacting module and the contacts of the electronic module are pressed against each other using elastic material and thereby brought into electrical contact with each other. The mutual pressure between the contact surfaces of the contacting module and the contacts of the electronic module is essentially perpendicular, i.e., the mutual pressure forces are directed at least 50%, preferably at least 90%, in a direction perpendicular to the mutual contact surface.For example, such pressure can be created by the cover 2200 being in contact or integral connection with the electronic module 3000 in the z-direction above the electronic module and being elastically designed, and by the electronic module 3000 pressing its contacts against the contact surfaces of the contacting module.

[0046] Unlike plug connectors, these electrical clamping connections do not contribute to the mechanical cohesion of the connection between the contact module and the electronic module and can be disconnected and reconnected without friction, because the mechanical cohesion of the connection is separate from the electrical connection. Such separation is particularly advantageous when a user needs to be able to easily and robustly disconnect and reconnect a large number of electrical connections. In this case, the user can be provided with a mechanical connection suitable for simple yet robust disconnection and reconnection, the functionality of which (including wear) is independent of the number of electrical connections.

[0047] Plug connectors can also be used in combination with clamp connections, for example, with plug connectors at the outer corners or edges of a clamp connection array, to combine the advantages of plug connectors (easy and robust positioning of the modules to be connected, as well as a connection supported and stabilized by friction) with the advantages of clamp connections (ease of use when disconnecting and reconnecting, regardless of the number of electrical connections). When plug connectors are combined with clamp connections, the requirements for the elastic properties of the elastic material used can be reduced.

[0048] In principle, the elastic material can be used in the contacting module and / or in the electronic module to be contacted, preferably on both sides of the contact connection, as explained below with examples. Fig. 5A, Fig. 5B and Fig. Figure 5D shows examples of socket configurations designed for electrical pressure connections with electrically conductive contact surfaces 2101, 2102, 2103 facing the predetermined position of the electronic module, which can be essentially flat, convex, or concave. These contact surfaces 2101, 2102, 2103 can be formed with an electrically conductive and simultaneously elastic material and / or with an outer layer of electrically conductive and simultaneously flexible material and backed by an elastic material.

[0049] And regardless of their elastic properties, they can be brought into electrical contact with the electronic module by means of elastically acting pressure contacts, for example in the form of metallic conductive spring contacts (pogo pins) with pressure in the direction -z (direction away from the predetermined position of the electronic module) (not shown).

[0050] Fig. Figures 5A to D show exemplary arrangements. In each of these, the base body 2100 with its inner base bottom section 2150 is shown separated from the lower part of the contacting module with the lower cover 2800 and the intermediate layers 2510 with the electrically conductive conductor track sections 2511, 2512, 2513 for illustrative purposes, whereas according to the first aspect of the invention, the inner base bottom section is connected on its underside in a planar and materially bonded manner to a section of the lower cover, and this connection includes one or more intermediate layers that are planarly connected on both sides to adjacent surfaces.

[0051] Fig. Figure 5A shows an example of a base design with through openings 2161, 2162, 2163 in the inner base bottom section 2150, through which conductor track sections in the intermediate layers 2510 between the inner base bottom section and the base cover section are accessible on their sides facing the predetermined position and serve there as contact surfaces 2101, 2102, 2103 of the contacting module.

[0052] This base design with open through-holes is characterized by the simplicity of its construction and the required manufacturing steps. Furthermore, the lower cover can be made of an elastically deformable material, which is not only advantageous for the elastic backing of the conductor track sections serving as contact surfaces for the electrical pressure connections with the electronic module, but also enables the aforementioned advantages when wearing the electronic circuit on the human body, as the base, together with the textile carrier, can adapt to the shape of the body.

[0053] Fig. Figure 5B shows an example of a different base design, namely with electrically conductive sections 2151, 2152, 2153 in the inner base bottom section, which are connected on their underside facing away from the predetermined position to the conductor track sections between the inner base bottom section and the base cover section and whose upper sides facing the predetermined position serve as contact surfaces 2101, 2102, 2103 of the contacting module.

[0054] Such conductive sections in an inner base section can be produced, for example, by using a material for the inner base section such as any common 3D printing material, whose electrical conductivity in an initial state corresponds to that of an electrical insulator, but which can be increased at the locations of the electrically conductive sections 2151, 2152, 2153 by additive treatment with conductive particles. Preferably, the electrically conductive sections can consist of silicone or polymers and be made conductive by adding silver, PEDOT, or carbon black. In such a case, both the shape and the elastic properties of the contact surfaces of the contact module correspond to those of the material of the inner base section after the addition of silver flakes or silver nanowires.For example, the electrically conductive sections can be produced using a direct printing process and can be in the form of 3D filament or a viscous liquid. In the case of inflexible pins, materials such as PLA or ABS can also be used.

[0055] Different shapes and / or elastic properties of the contact surfaces of the contacting module can be achieved, for example, by using open through-holes in an inner base section made of electrically non-conductive material, as in Fig. 5A is provided and is wholly or partially filled with an electrically conductive material (possibly after post-treatment), so that electrically conductive sections 2151, 2152, 2153 are formed with the conductor track sections between the inner base bottom section and the base cover section. The material used for forming these conductive sections can give the contact surfaces of the contacting module a different, preferably higher, elasticity than that of the material of the inner base bottom section.

[0056] The shape of the contact surfaces 2101, 2102, 2103 on the upper surface of the electrically conductive sections 2151, 2152, 2153 facing the predetermined position can also differ from the shape of the surrounding upper surface of the inner base bottom section. For example, the contact surfaces can be convex and project beyond the surrounding upper surface of the inner base bottom section towards the predetermined position in order to make contact with flat contacts of the electronic module, or the contact surfaces can be recessed behind the surrounding upper surface of the inner base bottom section so that, when the electronic module is inserted into the contacting module, the inner walls of the partially filled openings can serve as lateral guides for the contacts of the electronic module.

[0057] In one embodiment, a foam-forming material can be used to create the conductive sections, which, in its solidified foam form, exhibits higher elasticity than the corresponding bubble-free material. And as shown by way of example and schematically in Fig. As shown in Figure 5C, when producing such electrically conductive sections in foam form, a foam-forming material SBM in a pre-foaming state can be brought into contact with the conductor sections in the intermediate layers 2150 between the inner base bottom section and the base cover section. An inner base bottom provided with open through-holes 2161, 2162, 2163 and positioned appropriately can then be used to shape the foam during foaming, so that the foam formation is directed towards the interior of the through-holes and electrically conductive sections 2151, 2152, 2153 are formed in the inner base bottom section.

[0058] And is, as exemplified and schematically in Fig. As shown in Figure 5D, if the volume of the electrically conductive sections 2151, 2152, 2153 formed with foam in this way is larger than the volume of the through-openings 2161, 2162, 2163, then this larger volume protrudes in a convex shape at the ends of the through-openings facing the predetermined position, in front of the upper surface of the surrounding inner base section 2150. In this way, the shape of the contact surfaces 2101, 2102, 2103 can protrude beyond the upper surface of the surrounding inner base section 2150 at the upper surface of the electrically conductive sections 2151, 2152, 2153 facing the predetermined position.

[0059] Finally, they show Fig. 5A and Fig. 5B also alternative base designs with regard to the material-bonded connection between the textile carrier and the base. In the exemplary embodiment of Fig. In 5B, the textile support 1000 rests against a substantially smooth underside of the inner base, and the shapes of the lower cover and the conductor-carrying intermediate layers follow the resulting stepped height profile in the z-direction. Such an arrangement offers greater freedom in the xy-plane when joining the base and the textile support during the manufacture of the circuit according to the invention. In the exemplary embodiment of Fig. In contrast, 5A has a circumferential recess 2200 in an edge area of ​​its underside for receiving the textile support, so that the inner base and the textile support form an essentially smooth common underside, which allows a correspondingly smoother height profile of the lower cover, lower requirements for the thickness and stability of the conductor-carrying intermediate layers, and a higher density of electrical connections through the inner base section.

[0060] Fig. 6A and Fig. Figure 6B schematically shows, as a fourth embodiment, a contact module with three connection directions. A contact module with multiple connection directions may be dictated by the geometry of the electronic circuit as a whole. For example, in the embodiment consisting of Fig. 1B if the position of the contacting module is specified at the mid-height of a trouser leg, then two connection directions (+x and -x) of the contacting module enable short connection paths to the circuit elements 4500.

[0061] Furthermore, multiple connection directions are advantageous when the area density of adjacent conductor tracks limits the number of connections that can be made. For example, if an arrangement of connections is made through the base plate with adjacent conductor tracks in one plane and with the same connection direction, the total width of the adjacent conductor tracks and their spacing between them limit the number of connections that can be made through the base plate from this connection direction. If the spacing of the adjacent conductor tracks is, for example, 1 mm, then a maximum of 20 connections can be made through the base plate from one connection direction over a total width of 2 cm. If a larger number of connections are to be made, connections via conductor tracks from more than one direction and / or in multiple planes are required.

[0062] In all illustrated embodiments, the predetermined position P of the electronic module 3000 and the circuit lines 4000 with the conductor tracks 4100 lying flat against the textile support are located on opposite sides of the textile support, and the electrically connecting change of the electronic circuit from one side to the other of the textile support is effected by an opening in the textile support in the area between the inner base 2150 and the base cover section 2850.

[0063] Fig. 7A and Fig. Figure 7B shows an alternative arrangement as a fifth embodiment of a contacting module. Here, the inner base bottom section 2150, the base cover section 2850, and the intermediate layers 2510 with the electrically conductive conductor track sections 2511 are located on the same (upper) side of the textile carrier 1000 as the predetermined position of the electronic module with the contact surfaces 2101, 2102, 2103 of the contacting module and are bonded to one another. On this upper side of the textile carrier, the base is extended along the connection direction x by an upper connection section 2900 – preferably in one piece.Furthermore, the lower cover 2800 is extended along the connection direction x beyond the base cover section 2850 by a lower connection section 2880, and adjacent to the lower cover 2800, the intermediate layers 2510 with the electrically conductive conductor track sections 2511 are extended along the connection direction by a (first) connecting section (2580) with electrically conductive layers 2581. The electrical connection change of the electronic circuit from the upper to the lower side of the textile carrier is effected through an opening in the textile carrier in an area below the upper connection section 2900. Preferably, the lower connection section and the base cover section are formed in one piece.

[0064] This arrangement can be produced, for example, by forming the lower cover 2800 as a film, for example TPU film, and applying the intermediate layers 2510 with the electrically conductive conductor track sections 2511 and the connecting section 2580 with electrically conductive layers 2581 to it using additive processes, in particular printing processes of “Printed Electronics”, wherein the layer structure and the manufacturing steps required for this, including the post-treatment with the application of heat and / or pressure, can be the same for the (first) connecting section 2580 with the electrically conductive layers 2581 and for the intermediate layers 2510 with the electrically conductive conductor track sections 2511.If the inner base section 2150 and the upper connection section 2900 are made of a suitable thermoplastic material, they can also be bonded to the film used as the lower cover 2800 and the printed layers 2510 and 2580 in the same post-treatment step. An advantage of this arrangement and the associated manufacturing process is that essential components of the base 2100 of the contacting module 2000 can be manufactured and assembled separately from the textile substrate.

[0065] Furthermore, and independent of the features described so far, the electrically connecting change of the electronic circuit from the upper to the lower side of the textile carrier shows Fig. 7A and Fig. 7B a fourth aspect of the present invention: If the conductor track sections 2511 between the base cover section (2850) and the inner base bottom section 2150 are applied to the foil, For example, TPU film, formed bottom cover printed 2800, so they are located on the side facing the predetermined position, i.e. in the arrangement of the in Fig. 1 and Fig. 2 shown in the first embodiment on the side facing away from the body in the direction +z.

[0066] If, as in the first embodiment, the electronic circuit on the textile carrier is to be worn on the human body and essential parts of the circuit are located on the inside of the textile carrier facing the human body, with conductor tracks 4100 lying flat against the textile carrier beneath these essential parts and associated circuit elements 4500 also lying flat against the textile carrier, such as electrically conductive electrodes facing the human body, then it is advantageous in the interest of stable operation of the circuit to provide an insulating layer between the textile carrier and the conductor tracks 4100 and circuit elements 4500 lying against it.In particular, an electrically insulating thermoplastic film, for example TPU film, can serve as such an insulating layer. This film is printed with the conductive traces 4100 and circuit elements 4500, post-treated by applying heat and / or pressure, and then bonded to the textile substrate in this step – or a separate one. In such a case, the conductive traces are located on the side facing the body in the direction -z.

[0067] As a result, the conductor track sections of the contact module printed on the lower cover 2800 and the conductor tracks of the circuit lines printed on the insulating layer are located outside the contact module on opposite sides of a printed film and are arranged according to the fourth aspect of the present invention as shown in Fig. 7 electrically connected examples shown:

[0068] The electrical connection of the conductor track section 2511 between the base cover section 2850 and the inner base bottom section 2150 with a conductor track 4101 outside the base comprises (at least) the aforementioned first connection section 2580 lying flat against the lower connection section 2880 with the electrically conductive layer 2581 also mentioned above, and the circuit line 4000 with the conductor track 4101 outside the base comprises (at least) a second connection section 4200 lying flat against the textile carrier with an electrically conductive material 4201.

[0069] The vertical projections (in the z-direction, P2 in Fig. 9B) The electrically conductive layer 2581 of the first connection section and the electrically conductive material 4201 of the second connection section overlap in an overlap area R on the side of the textile support 1000 facing them; in addition, the electrically conductive layer 2581 of the first connection section and the electrically conductive material 4201 of the second connection section are electrically connected to each other via a contact connection K, and the perpendicular projection of the contact connection onto the side of the textile support facing it is contained in the overlap area.

[0070] In this overlap and contact area R and K, the printed sides alternate between the side of the lower cover facing away from the body and the side of the insulating layer facing the body.

[0071] The fourth aspect of the present invention described above is not related to the invention described in Fig. 7A and Fig. The arrangement of the fifth embodiment shown in 7B is limited. Fig. Figure 7C shows an alternative arrangement. For example, if a deformable film with a lower connection section 2880 is used as the printed lower cover 2800, the printed sides can also be changed between the side of the lower cover facing away from the body and the side of the insulating layer facing the body by passing the lower connection section 2880 of the printed film through an opening in the textile carrier that is laterally offset from the openings through the inner base in the connection direction (x) and folding it over in the opposite direction on the side of the carrier opposite the base. Compared to the arrangement in Fig. 7B This arrangement is particularly advantageous if circuit elements facing the body are to be arranged and contacted under or near the base.

[0072] As a further development of the fifth embodiment, we show Fig. 8A and Fig. 8B as a sixth embodiment, a contacting module with two connection directions and reversal of the conductive layers when connecting to the further circuit.

[0073] The electrical connection of the conductor track section 2511 between the base cover section 2850 and the inner base bottom section 2150 with a conductor track 4101 outside the base comprises – on both the left and right sides – the first connection section 2580 with the electrically conductive layer 2581, which lies flat against the lower connection section 2880, and the circuit line 4000 with the conductor track 4101 outside the base comprises – on both the left and right sides – the second connection section 4200 with the electrically conductive material 4201, which lies flat against the textile carrier. In this embodiment as well, the vertical projections P2 of the electrically conductive layer 2581 of the first connection section and of the electrically conductive material 4201 of the second connection section overlap on the side of the textile carrier 1000 facing them in an overlap area R.Furthermore, on the left and right sides, the electrically conductive layer 2581 of the first connection section and the electrically conductive material 4201 of the second connection section are electrically connected to each other via a contact connection K, and the perpendicular projection of the contact connection onto the side of the textile support facing it is included in the overlap area.

[0074] Fig. 9A, Fig. 9B and Fig. 9C demonstrates, by way of example, a fifth aspect of the present invention, namely a contacting module with several superimposed conductor tracks in its base.

[0075] According to this aspect of the invention, (in the example shown, three) conductor track sections 2511, 2512, 2513 are arranged in several stacked intermediate layers such that their vertical projections (P1 in Fig. 9A) overlap the underside 2150U of the inner base floor section 2150 and are electrically insulated from each other in the overlap areas by non-conductive intermediate layers (2516, 2517). In a preferred arrangement, a perpendicular projection onto the underside 2150U of the inner base floor section overlaps (at least) a conductor track section 2511, 2512 in an intermediate layer further away from the inner base floor section with an electrical connection 2153 running through the inner base floor section between a contact surface 2103 of the contacting module and a conductor track section 2513 in an intermediate layer closer to the inner base floor section.

[0076] The arrangement with conductor track sections in several stacked intermediate layers is advantageous when a larger number of circuit lines need to be contacted. As can be inferred from the... Fig. 6A and Fig. As can be seen in the fourth embodiment explained in 6B, it is advantageous if a larger number of circuit lines can be contacted in several stacked intermediate layers without limitation by the area density of conductor tracks arranged next to each other in a plane, and the number of connection directions can be freely chosen.

[0077] Furthermore, it is advantageous if, similar to the in Fig. 4 and Fig. In the 7 illustrated embodiments, the base above the textile support 1000 is extended along a connection direction x of the contacted conductor tracks 4101, 4102, 4103 by an upper connection section 2900 – preferably in one piece – and this in turn is positively and materially connected to the textile support and has a stiffening effect on it. Preferably, the thickness of the connection section 2900 (in the z-direction) decreases outwards along the connection direction and its elasticity increases.On the lower side of the textile carrier 1000, the lower cover 2800 is also extended along the connection direction beyond the base cover section 2850 by a lower connection section 2880, and adjacent to the lower cover 2800, the intermediate layers 2510 with the electrically conductive conductor track sections 2511 to 2513 are extended along the connection direction by a (first) connecting section (2580) with electrically conductive layers 2581 to 2583. Preferably, the lower connection section 2880 and the base cover section 2850 are formed in one piece.

[0078] The advantages of such an extension of the socket along the connection direction, with increasing elasticity towards the outside, have already been discussed elsewhere. In this case, stiffening along the connection direction is particularly advantageous because multi-layered circuit traces are especially susceptible to kinking at the edge of the socket.

[0079] Fig. 10A and Fig. Figure 10B shows, as the eighth embodiment, a contacting module with several superimposed conductor tracks and a selection switching device in the layer system between the inner base section and the lower cover. Similar to the one in Fig. 4a and Fig. In the embodiment shown in Figure 4B, the base is extended along a connection direction x above the textile support 1000 by an upper connection section 2900 – preferably in one piece – and below the textile support 1000, the lower cover 2800 is also extended beyond the base cover section 2850 by a lower connection section 2880 to provide space for the arrangement of the selection switching device 2600. At the same time, not all connections are necessarily subject to the selection switching device 2600; in the example shown, the connection between the conductor tracks 2511 and 2581 bypasses the selection switching device. To avoid repetition, reference is made to the explanations in the description above.

[0080] Fig. Figures 11A to 11E show further examples of a selection switching device in conjunction with several superimposed conductor tracks. As can be seen directly from the figures, the selection switching device 2600 can, for example, be arranged in the base at the following locations: Fig. 11A: between the predetermined position (P) for receiving the electronics module (3000) and the inner base bottom section (2150), and / or Fig. 11B+C: on the underside of the inner base floor section (2150) with openings or conductive sections in the inner base floor facing upwards for connection with the cavity H for receiving the electronics module, and / or Fig. 11D: in place of the inner base floor section (2150) below the cavity H for the accommodation of the electronics module.

[0081] Furthermore, the 2600 selection switching device can be used for connections in one or more connection directions ( Fig. 11E: two connection directions) can be used.

[0082] Fig. 12A and Fig. Figure 12B shows, as a ninth embodiment, an arrangement for a side reversal of several superimposed conductor tracks when connecting the contacting module with several superimposed conductor tracks in the further circuit.

[0083] For further explanation, reference is made to the description of the fourth aspect of the present invention in connection with Fig. Reference is made to Figure 7 and the fifth embodiment. Unlike in the fifth embodiment, the base of the ninth embodiment is not extended above the textile support 1000 along the connection direction x. However, the lower cover 2800 is extended in one piece along the connection direction x beyond the base cover section 2850 by the lower connection section 2880, which has a stiffening effect.

[0084] Fig. Figures 13A to 13G show, as a tenth embodiment, an arrangement for a side reversal of several superimposed conductor tracks of the contacting module when connecting to sections of the electronic circuit without superimposed conductor tracks.

[0085] Fig. Figure 13A shows a view of this arrangement from its underside. Visible are the base cover section 2850 and the lower connection section 2880 as components of the lower cover 2800 of the contacting module, as well as elements of the circuit lines 4000, namely, following the lower connection section 2880, the second connection section 4200 with electrically conductive materials 4201, 4202 and 4203, which form downward-oriented conductor tracks, and following these, downward-oriented conductor tracks 4101, 4102 and 4103.

[0086] Fig. Figure 13B shows a sectional view in an xz plane, with the conductor track sections 2511 to 2513 between the inner base and the base cover section 2850 of the contacting module on the left half of the figure, and the overlap and contact areas R1 to R3 between the stacked electrically conductive layers 2581 to 2583 of the contacting module and the electrically conductive materials 4201 to 4203 of the connection section 4200, each separated from the textile support only by an insulating layer. As can be seen from this, the conductive layers 2583 and 4203, which are closest to the textile support in the x-direction and closest in the z-direction, overlap and contact each other in an overlap area R3 and terminate there.

[0087] The two layers 2582 and 2581, located furthest away in the z-direction, extend in the x-direction beyond the overlap region R3. The conductive layer 2582, located closest to the textile substrate after the removal of the already contacted layer 2583, overlaps / contacts with the nearest uncontacted conductive layer 4202 in the nearest overlap region R2. The layer 2581, located furthest away in the z-direction, also extends in the x-direction beyond the overlap region R2 and, as the only remaining layer of the contacting module, overlaps / contacts with the furthest and only remaining conductive layer 4201 of the connection section 4200 in the overlap region R1. All layers of the contacting module are covered from below by the connection section 2880 and the base cover section 2850.

[0088] The Fig. Figures 13C to 13E are sectional views in yz planes through the electrically conductive materials 4201 to 4203 and show that in the present embodiment these are arranged as conductive layers, i.e. apart from insulating layer(s), as close as possible to the textile substrate.

[0089] The Fig. 13F and Fig. Figure 13G shows in sectional views in xz planes and a top view in the -z direction of the lower cover how this comparatively complex contact arrangement of the Fig. 13A to 13E can be produced from a correspondingly printed lower cover, the remaining base and foils of the connecting section 4200 printed with conductive materials 4201 to 4203, largely using the additive processes described.

[0090] Based on the Fig. 13F and Fig. Figure 13G explains a sixth aspect of the present invention, which has already been drawn in other figures but not mentioned there, namely the formation of electrically conductive connections in the z-direction through several stacked layers in the area between the lower base section 2150 and the lower base cover section of the lower cover 2800. In this area (left area of ​​the layer structure on the lower cover 2800 in Fig. 13F) Electrically conductive connections exist in high spatial density through several stacked layers in the z-direction, and it is advantageous in this region if the number and thickness of the stacked layers do not vary or vary only slightly in order to avoid height variations in the z-direction of the layers as much as possible. Therefore, it is preferred if electrically conductive connections in this region are formed by electrically conductive sections in stacked insulating layer environments. When manufacturing such preferred layer structures using printed electronics methods, for example, through holes produced layer by layer in stacked insulating layers are filled layer by layer with (after post-treatment) electrically conductive material.

[0091] However, if conductor tracks in different stacked layers are connected in the z-direction at a comparatively lower spatial density (right area of ​​the layer structure on the lower cover 2800 in Fig. 13F), it is advantageous to provide stacked electrically conductive and mutually insulated layers in a stepped arrangement, in which the conductor tracks are contacted in overlapping contact with conductor tracks of other layers at larger intervals corresponding to the lower spatial density, wherein, due to the lower spatial density, the overlap areas can be formed with larger extents and height changes in the z-direction.

[0092] Fig. 14A and Fig. Figure 14B shows a variant of the tenth embodiment, which differs in that the connecting section 4200 is formed from a continuous film printed with the conductive materials 4201 to 4203 side by side.

[0093] Fig. 15A, Fig. 15B and Fig. Figure 15C shows schematic representations of circuits on a textile substrate using the arrangements in the tenth embodiment and its variant, namely in Fig. 15A in an exterior view and Fig. 15B and Fig. 15C in the corresponding interior views, i.e., the sides of the textile facing the body. In the present embodiments, the textile carrier is designed as a flat textile 1000, which is provided with fastening straps 1100 and 1101 and can be held in contact with the human body at certain body parts (for example, forearm or thigh) by means of fastening mechanisms such as hook and loop fasteners 1150, 1151, 1160, 1161.

[0094] Fig. Figure 16, the eleventh embodiment, shows a circuit with a two-dimensional field (“array”) of M x N circuit elements. Similar to the tenth embodiment, the textile carrier 1000 is a flat textile provided with fastening straps and closure mechanisms, as shown in a schematic drawing. Fig. Figure 16A is an interior view, i.e., the side of the textile facing the body, looking towards the outside (+z). The electronic circuit shows the lower cover of the contact module with socket cover section 2850 and lower connection section 2880, pointing downwards in the connection direction (here in the -x direction, downwards in the figure), as well as the array of circuit elements 4500 with associated conductor tracks 4100 lying flat against the textile substrate, which are drawn as simple lines in this representation. In this case, the array is a rectangular field of M x N circuit elements 4500 with M columns (parallel to the connection direction, numbered with a running index m from 1 to M) and N rows (perpendicular to the connection direction, numbered with a running index n from 1 to N), shown by way of example as 30 circuit elements in M ​​= 5 columns and N = 6 rows.

[0095] Fig. Figure 16B shows, from the same viewing angle, a projection into the xy-plane of the electrical connections from the circuit elements (shown here as dotted lines) via conductor tracks 4100 lying flat against the textile substrate and electrically conductive layers of the connection section 2580 to the through-holes 2550 through the inner base section in the +z direction to the contact surfaces for connecting the electronic module at the predetermined position. The conductor tracks are distributed over several layers stacked in the z direction and are electrically insulated from each other and from the circuit elements they overlap. Reference drawings 11 and M1 exemplify the conductor tracks to the circuit elements (m=1, n=1; in the upper left of the field) and (m=M, n=1; in the upper right of the field).

[0096] Fig. Figure 16C shows, from the same perspective, an enlarged view of the through-wires 2550 through the inner base section. In the present embodiment, each circuit element is connected to exactly one circuit wire; therefore, the number of through-wires corresponds to the number of circuit elements. Furthermore, the MxN through-wires 2550 are arranged in an array, here a rectangular field with M columns (numbered with index m from 1 to M) and N rows (numbered with index n from 1 to N). The arrangements of the through-wires 2550 and the circuit wires 4100 connected to them are oriented in opposite directions. For example, the circuit element 4500 in the upper left (m=1, n=1) is connected to the through-wire 2550 in the lower right, and the circuit element in the upper right of the array (m=M, n=1) is connected to the through-wire 4100 in the lower left (m=M, n=1).

[0097] The opposing orientation of the leads to the circuit elements results from the path of the electrical connections. This is shown in the diagram. Fig. 16D a sectional view of the embodiment in an xz-plane through the markings S1S1' in Fig. 16B and through the connections with m=1 in Fig. 16C. In this view, the connection located furthest to the left in the z-direction and the uppermost connection in the x-direction is assigned the row index n=1 and labeled 11. It leads to the throughput with m=1 and n=1. Connections with m>1 (to the left of S1S1' in Fig. 16B and to the left of m=1 in Fig. 16C) are located in the z-direction in the same plane as n=1, i.e., in the viewing direction of Fig. 16D behind the connection labeled 11, i.e. below the image plane.

[0098] The course of the connections in the xy-plane is in Fig. 16E is recognizable. In the array of MxN switching elements, a group of M adjacent conductor tracks 4100 running transversely to the connection direction is provided for each row (i.e., for M switching elements with the same row index n). These conductor tracks are connected to M lines of the connection section 2580 along the connection direction and are arranged in different planes (one above the other in the z-direction) for different rows (different n). In each plane / row, the longest connection is that for the switching element with column index m=1, and the shortest connection is that for m=M. This explains the oppositely oriented arrangement of the through-lines to the switching elements with respect to the column index m.

[0099] The arrangement of the lines of connection section 2580 in different levels for different lines (different n) is also in Fig. 16D is recognizable. The row with row index n=1 has the shortest connections, the row with row index n=N has the longest connections. This explains the oppositely oriented arrangement of the through-lines 2550 to the circuit elements 4500 with respect to the row index n.

[0100] Fig. Figure 16F shows a sectional view of the embodiment in a yz-plane through the markings S2S2' in Fig. 16B through connection 11 to switching element n=1 and m=1. Similar to the Fig. 16D connections with m>1 (above S2S2') are located in Fig. 16B and to the left of m=1 in Fig. 16C) in the z-direction in the same plane as n=1, i.e. in the viewing direction of Fig. 16D after the connection labeled 11.

[0101] This figure shows, as an example of the connecting line of the circuit element 1 designated "11", the electrically conductive connection between the conductor track 4100, which lies flat against the textile, transversely to the connection direction, and the electrically conductive layer of the connecting section 2580 along the connection direction. In this embodiment, the conductor track 4100 lying against the textile and the electrically conductive layer of the connecting section 2580 are not arranged in the same layer plane, but rather, when viewed in the z-direction (perpendicular to the inside of the textile facing the human body, projection direction P in Fig. 16F) in an overlapping area R and arranged in touching and electrically conductive contact K. Such a touching and electrically conductive contact in an overlapping area has already been exemplified in Fig. 13E is presented and explained.

[0102] Fig. 16 G and Fig. Figure 16H shows, for the present embodiment, a structure of the lower cover 2800 with the base cover section 2850 in the upper part of the image and the connection section 2880 extending in the connection direction, i.e., downwards in the figure, with the electrically conductive layers of the connection section 2580, which are stacked in multiple layers. In order to enable overlapping contact with the conductor tracks 4100 in contact with the textile, the electrically conductive layers of the connection section exit the stacked arrangement layer by layer at the ends to be contacted by overlapping in a lateral direction different from the connection direction (in Fig. 16G to the left, in -y direction) towards the conductor tracks 4100 that are adjacent to the textile and to be contacted.

[0103] Such a comparatively complex structure can be manufactured using additive manufacturing processes of “Printed Electronics”, for example by first printing the electrically conductive layers of the connection section distributed across a plurality of films and then connecting them together in a stacked arrangement and optionally with the lower cover 2800. Fig. Figure 16H schematically shows a plurality of such films, each printed with conductive layers, placed next to each other for the eleventh embodiment.

[0104] Regardless of the details of the eleventh embodiment, when manufacturing multiply stacked layer structures using additive manufacturing processes in printed electronics, it is advantageous to first print the electrically conductive layers of the interconnection section across several films and then stack and bond the printed films together. If the printed electronics process uses inks that require post-treatment with heat and / or pressure to achieve the desired electrical properties, suitable thermoplastic properties can be selected for the films to be printed. This allows for the simultaneous application of heat and / or pressure to perform both the post-treatment of the inks and the bonding of the printed and stacked films to each other and, optionally, to adjacent surfaces.Furthermore, suitable mechanical, especially elastic, and electrical properties can be selected for the films to be printed. For example, TPU films are simultaneously thermoplastic, elastic, and electrically insulating, with harder materials tending to exhibit higher electrical resistance. If electrically conductive layers stacked on top of each other in several levels are to be electromagnetically shielded, the films to be printed can also be designed with a corresponding shielding function, for example, by being provided with electrically conductive shielding layers.

[0105] Similar to the eleventh embodiment, Fig. 17A for a twelfth embodiment, a circuit with a two-dimensional field (“array”) of M x N circuit elements 4500 with M columns (parallel to the connection direction (-x) and numbered with running index m from 1 to M) and N rows (perpendicular to the connection direction (-x) and numbered with running index n from 1 to N), shown by way of example as 30 circuit elements in M=5 columns and N=6 rows, of which the circuit element M1 is arranged at the top right and the circuit element 1N at the bottom left. In contrast to the eleventh embodiment, however, each circuit element is contacted with several lines, as shown by way of example in Fig. Figure 17B shows an enlarged representation of the circuit element 1N. In this embodiment, each circuit element is contacted with C (with running index c from 1 to C, shown for C=3) conductors, of which the conductor tracks 4100 lying against the textile run parallel next to each other in the xy plane transversely to the connection direction, and the electrically conductive layers of the connection section 2580 run parallel one above the other in the z-direction in the connection direction (downwards in the figure).

[0106] Fig. Figure 17C shows, from the same viewing direction (perpendicular to the surface of the textile support, looking from its inside to the outside), the through-wires 2550 through the inner base section for the twelfth embodiment. In this example, each circuit element is connected with C circuit wires, as exemplified for circuit element M1 (in Fig. 17A in the array at the top right, in Fig. 17C in the array at the bottom left) is shown. The total number of passes is therefore M x N x C, arranged in a rectangular array with M columns (numbered with index m from 1 to M) and N x C rows (grouped into row groups numbered with index n from 1 to N, each of which is numbered with index c from 1 to C).

[0107] Similar to the eleventh embodiment and as explained therein, the through-lines and the circuit elements are oriented in opposite directions. Furthermore, for each circuit element with running index c from 1 to C, the arrangements of the through-lines 2550 and the arrangements of the circuit lines 4100 connected to them are oriented in opposite directions; for example, for each circuit element, the through-lines with running index c=1 are in Fig. 17C at the top and the circuit line 4100 with running index c=1 in the textile. Fig. 17B is located below.

[0108] This opposing orientation of the through-wires results from the course of the electrical connections. This is shown below. Fig. Figure 17D shows a sectional view of this embodiment in an xz-plane through the markings S1S1' in Fig. 17A and Fig. 17C. In this view, the connection located at the top in the z-direction and furthest to the left in the x-direction is assigned the running index c=C and the row index n=1 and leads to the routing with m=1, n=1 and c=C in the bottom right of the field. Fig. 17C.

[0109] In Fig. Figure 17D further shows the layer structure of the electrically conductive layers of the interconnect section 2580, comprising one group of C electrically conductive layers (numbered with running index c from 1 to C) for each of the N circuit elements (numbered with running index n from 1 to N). For different circuit elements, the respective groups of C electrically conductive layers are separated from each other by intermediate layers “TS”. These intermediate layers correspond to a structure producible using printed electronics methods involving printed and stacked films, as is generally known in connection with Fig. 16G and Fig. As explained in section 16H. In particular, these intermediate layers TS can possess the electrical properties described therein; for example, these intermediate layers can not only electrically isolate electrically conductive layers of the connection section to different circuit elements from each other, but also electromagnetically shield them.

[0110] As from Fig. As can also be seen in Figure 17D, the electrically conductive layers of the connection section terminate in the connection direction (-x) at different positions for each circuit element (n from 1 to N) and for each conductor (c from 1 to C) per circuit element at different positions, which allows contact between the conductor tracks 4100 lying on the textile and the conductor in Fig. 17A and Fig. The parallel path shown in Figure 17B in the xy plane perpendicular to the connection direction is possible. Details of an exemplary arrangement suitable for this purpose were described in connection with the tenth embodiment. Fig. 13 and Fig. 14 explained.

[0111] According to a seventh aspect of the present invention, the electronic circuit on a textile substrate according to the invention can further be designed to prevent incorrect insertion of the electronic module or confusion when inserting an electronic module.

[0112] According to an initial further development of this design, the circuit can contain a storage element permanently attached to the textile carrier, in which information that individually characterizes and preferably identifies the circuit is stored. Such a storage element can, for example, be designed as an RFID module and read wirelessly. To facilitate its location and wireless connection, such a storage element, like an RFID module, can be arranged on and / or in the base of the contact module, for example in its lower cover, or alternatively, the position of the storage element can be indicated by a visible marking on the textile carrier.Such individually typifying and preferably identifying information can, for example, be read out and checked when the circuit is put into operation in order to avoid confusion when inserting the electronic module, for example when several electronic circuits according to the invention are in use on textile carriers with similar contact modules.

[0113] According to a second related development, two or more contact surfaces of the contacting module on the circuit side are electrically connected to the textile substrate. By checking the electrical connection when the electronic module's circuit is put into operation, it can be determined whether the electronic module to be contacted is positioned in the predetermined location within the contacting module and whether a correct electrical connection has been established.

[0114] According to a third embodiment of this invention, two or more contact surfaces of the contacting module, selected differently for several circuits according to the invention, are electrically connected on the textile substrate on the side of the respective circuit. This allows for the encoding and storage of information that characterizes or identifies the electronic circuit through the different selection of the interconnected contact surfaces. By checking the respective electrical connection during commissioning of the circuit, it is not only possible to determine whether correct electrical contact of the electronic module has been made in the contacting module, but also to avoid confusion when inserting an electronic module, for example, when several identical electronic modules and / or several electronic circuits according to the invention are in use on textile substrates with identical contacting modules.

[0115] In addition to the above explanations of manufacturing processes according to the invention, these are further described using three exemplary manufacturing processes.

[0116] Fig. 18A and Fig. Figure 18B shows a flowchart and accompanying arrangement for a first exemplary manufacturing process.

[0117] As in Fig. As shown schematically in Figure 18A, in step 1a) of this exemplary manufacturing process, a textile with an opening (through hole) is provided. The opening is located at a position intended for the base of the contact module and has a shape designed for a planar connection of the upper and lower parts of the base through the opening. In step 1b), a printed circuit with printed electrodes 2500 and printed conductive traces, produced using printed electronics methods on a substrate film (in this example, TPU film), is provided. In a step designated "Mating 1", the printed circuit provided in step 1b) and the textile provided in step 1a) are aligned relative to each other and bonded together planarly and materially, for example, by applying pressure and / or heat.

[0118] In step 2a) of this exemplary manufacturing process, a lower cover printed with a circuit is provided. This cover is printed with conductive traces, particularly on its side facing the electronic module to be contacted, using printed electronics methods. The result is, for example, a printed TPU film. In a step designated as "Mating 2," the printed circuit provided in step 2b) on the lower cover and the printed circuit 1 bonded to the textile in step "Mating 1" are aligned with an overlap relative to each other. The lower cover and the textile are then bonded together, preferably materially, and especially electrically, for example, by applying pressure and / or heat.The overlapping connection electrically connects a printed circuit facing the electronic module to be contacted in the contacting module with a printed circuit facing away from the electronic module to be contacted, with conductor tracks lying flat on the textile, thus connecting two parts of the circuit, each producible using printed electronics methods, on opposite sides of the respective carriers.

[0119] In step 3a) of this exemplary manufacturing process, a base element with through holes or conductive sections in the base bottom is provided as an inner base bottom, which - as for Fig. 5A explains that the device has a circumferential recess on its outer lower edge that matches the opening in the textile and its thickness. In a step referred to as "Mating 3", the printed circuit on the lower cover, which is already connected to the textile and the associated printed circuit, is aligned with the holes or conductive sections of the base relative to each other. Subsequently, through the opening in the textile, the lower cover is connected to the inner base, and a surrounding area of ​​the textile is connected to the base via a base surface designed for a planar connection with the textile, preferably bordering the inner base, in a planar, preferably form-fitting, and materially bonded, again for example, by applying pressure and / or heat.

[0120] The steps designated as "mating" each include a) mutual alignment and b) a surface-based and material bond, preferably a form-fit connection (for example, by applying pressure and / or heat) of the elements to be joined. The mutual alignment and surface-based and material bonding can be carried out sequentially, and it is also possible to align the elements to be joined relative to each other during the bonding process, as long as they are still movable relative to each other, i.e., before their mutual bond has solidified.

[0121] Fig. Figure 18B shows a corresponding arrangement in which the areas to be aligned and connected in steps 1, 2, and 3 are schematically depicted. The inner base and the lower cover are located on opposite sides of the textile substrate, and their surface connection is achieved through the opening in the textile in step 3. The required accuracy of the mutual alignment between the inner base and the printed lower cover in step 3 is particularly high, since the printed electronic structures in the base of the contact module exhibit the highest spatial density and finest detail among the components to be aligned.

[0122] Fig. 19A and Fig. Figure 19B shows a flowchart and associated arrangement for a second exemplary manufacturing process.

[0123] Here, as in Fig. Figure 19A schematically depicts the elements to be joined according to this method, first provided in steps 1a, 1b, 2a, and 2b, namely a base element (in the example with a perforated base, step 1a), a contact-side printed underside cover (step 1b), a textile with an opening (step 2a), and a circuit with electrodes printed on a carrier film (in the example TPU, step 2b). The contact-side printed underside cover comprises a base cover section to be joined to the base element and a lower connection section extending beyond the connection to the base element, as exemplified in Figure 19A. Fig. 7A and Fig. 7B are described.

[0124] In a step designated "Mating 1", the base element provided in step 1a), with its inner base base, and the cover provided in step 1b), printed with conductive traces and optionally insulating layers, are aligned relative to each other in their respective base cover sections and bonded together, for example, by applying pressure and / or heat. Unlike the first exemplary process, the bond between the inner base base and the printed base cover section of the underside cover is achieved without the presence of the textile, which facilitates the required accuracy of mutual alignment and bonding for the creation of electrical connections.

[0125] In a step called “Mating 2”, the printed circuit provided in step 2b) on a carrier film (TPU in the example) and the textile provided in step 2a) are aligned relative to each other and connected both in terms of surface area, material and electrically.

[0126] In a step designated as "Mating 3," the two printed circuits—that is, the printed circuit with conductor tracks lying flat against the textile in step "Mating 2," and the circuit printed on the lower cover and connected to the inner base in the area of ​​the base cover section in step "Mating 1"—are aligned relative to each other and bonded together in a region of the connection section of the lower cover, preferably materially and, in particular, also electrically. Similar to step "Mating 2" of the first exemplary manufacturing process, the circuits to be joined, each printed on a substrate, are aligned and connected in an overlapping and mutually facing manner, thereby effecting a change of sides for the circuits on the respective printed substrates (e.g., TPU films), from the side facing the electronic module to the side facing away from the electronic module.Furthermore, after step “Mating 3”, the connection section of the lower cover is located on the side of the textile opposite the predetermined position for the electronic module to be accommodated, thus also realizing a change of sides of the circuits from the side facing the electronic module to the side opposite the electronic module with respect to the textile.

[0127] In a step called “Mating 4”, the base, which until then had only been indirectly connected via the base cover section and the lower connection section of the lower cover, is finally aligned and connected directly to the textile.

[0128] Regardless of the details of the preceding steps, directly connecting the base to the textile after prior indirect connection via the lower cover has the advantage that, firstly, not only the planar and material connections, but especially the electrical connections can be made with high accuracy of the respective alignments, by, for example, aligning the circuit printed on the connection section of the lower cover with the circuit with the conductor tracks lying flat against the textile without restriction through a direct connection between the base and the textile.This is particularly important for the ability to produce electrical connections with good accuracy when – as in preferred embodiments of the present invention – the circuits to be electrically connected in the contacting module and on the textile carrier are each applied to flexible carriers and these can be plastically deformed in the context of pressure and heat treatment to produce planar and material connections.

[0129] Fig. Figure 19B shows a corresponding arrangement in which the elements to be aligned and connected in steps 1 to 4 are schematically depicted. In the example shown, the inner base and the lower base cover section are located on the same side of the textile support; the change to the opposite side of the textile support occurs—similar to the embodiment in Figure 19B. Fig. - through an opening in the textile, offset laterally relative to the center of the base and the direction of connection, through which, in this case, the connection section of the lower base cover is guided. Alternatively (not shown), it is possible to guide a section of the circuit lines with conductor tracks lying flat against the textile substrate in one and / or multiple layers through an opening in the textile, offset laterally relative to the center of the base, to the side of the textile containing the inner base and the lower base cover section, and to make the flat, material, and electrical connection to be carried out in step "Mating 3" on this side of the textile substrate.

[0130] Fig. 20A and Fig. Figure 20B shows a flowchart and associated arrangement for a third exemplary manufacturing process. Fig. The steps of this procedure are shown as examples in section 20A. Fig. 20B the associated arrangement. The method comprises providing a textile 1000 with an opening (step 1a), providing a printed circuit on a carrier film 2590 (step 1b, TPU in the example), providing a base element (step 2a, in the example with a perforated base and a recess matching the opening in the textile), and providing the lower cover 2800 (step 3a). In the area of ​​the base, the printed circuit on the carrier film forms the intermediate layers 2510 between the inner base base 2150 and the lower cover 2800, which are bonded to adjacent layers on both sides. In an area outside the base, the printed circuit on the carrier film forms the electronic circuit 4000, including, among other things, the conductive traces that are bonded to the textile carrier in one or more layers and form an area, as well as—as shown in the example—an electrode 4500 on the side of the textile opposite the base.

[0131] In step "Mating 1," the printed circuit provided in step 1b) on the carrier film and the textile provided in step 1a) are aligned relative to each other and bonded together across their entire surface. In step "Mating 2," the circuit printed on the carrier film and bonded to the textile is aligned through the opening in the textile with the inner base provided in step 2a) (in the example shown, with the holes in the base) and bonded across its entire surface, for example, by applying pressure and / or heat. In this step, the base is also bonded across its entire surface to the part of the textile surrounding the opening in the textile.In step “Mating 3”, the lower cover 2800 provided in step 3a) is aligned with the base, in particular with the inner base base 2150 and the associated printed circuit on the carrier film, which forms the intermediate layers 2510 between the inner base base 2150 and the lower cover 2800, and bonded over its entire surface and materially, for example by applying pressure and / or heat. The alignment and bonding in steps Mating 1, Mating 2 and Mating 3 can also be carried out wholly or partially simultaneously, so that, for example, the application of pressure and / or heat occurs only once or only twice.

[0132] If part of the printed circuit on the carrier film 2590 is to be exposed in an area outside the base on the side of the textile opposite the base and, for example, includes an electrode 4500 directed towards this side, the exposed part of the circuit can be formed by removing a corresponding section 2591 of the carrier film 2590.

[0133] This third exemplary manufacturing process is characterized by the fact that, compared to the other two manufacturing processes, it comprises fewer process steps and, in particular, all elements to be joined can be bonded in a single step, for example, by applying pressure and / or heat, across a surface and preferably using a material bond. Furthermore, it is also characterized by the fact that, compared to the other two manufacturing processes, fewer components may be required to manufacture a circuit according to the invention. For example, an overlapping connection of different conductive layers in different parts of the circuit, as described in the explanations regarding the Fig. 7A and Fig. 7B and Fig. 8A and Fig. 8B will be explained. Rather, the same conductive layers can be used for electrical connection with the contact surfaces of the contacting module and for electrical connection with electrodes on the side of the textile opposite the base of the contacting module.

[0134] All the exemplary manufacturing processes mentioned utilize additive manufacturing techniques in printed electronics for the formation of electronic structures, as well as the application of pressure and / or heat for post-treatment of printing inks and for the planar and – preferably – material bonding of various components. This allows for low manufacturing costs and enables a high spatial density of electrical connections between the circuit on the textile substrate and the electronic module.

[0135] These processes can be modified by applying pressure and / or heat for the post-treatment of printing inks and for the surface and material bonding of various components in just a few steps, for example, only one or two steps of aligning and surface bonding the elements to be aligned and joined together. Simultaneously, i.e., without additional process steps, the application of pressure and / or heat can also serve for the post-treatment of printing inks. Such treatments with heat and / or pressure are typically carried out at temperatures in the range of 50°C to 180°C and pressures in the range of 1 bar to 8 bar.

[0136] In general, when selecting thermoplastic materials, it is important to ensure a suitable and coordinated choice of softening temperatures. For example, if joining steps are carried out at different temperatures, the corresponding temperature compatibility of all materials involved, as well as all previously made joints, must be taken into account. In particular, shape-defining and functionally dimensionally stable elements, such as carrier films or the base element with the inner base plate, should have higher softening temperatures than the layers produced using printed electronics processes or other elements that form planar and material bonds while adapting to their own shape. For example, as in the example of Fig. As shown and explained in Figure 5B, the textile carrier 1000 rests against a substantially smooth underside of the inner base and the shape of the lower cover follows a resulting stepped height profile. This results in a lower softening temperature for the lower cover than for the inner base. To form positive-locking and preferably material connections, joining materials with low softening temperatures, for example in the form of thin films or fine particles of low-melting-point material, can be used in addition to the elements to be joined. Shape-giving and functionally dimensionally stable elements, such as carrier films to be printed, can be provided with higher-melting-point carrier layers and low-melting-point joining layers on the respective surfaces to be joined.

[0137] For recycling the material of the circuit according to the invention, it is also advantageous if the elements of the electronic circuit can be separated from the textile support in a straightforward manner and in as few parts as possible. For this purpose, the materials used for the connections between the electronic circuit and the textile support ("connecting materials") can be selected with a lower softening temperature ("recycling temperature") than the other materials used. Since a firm connection between the base and the textile support is required due to the necessary mechanical strength, it is also advantageous for the recyclability of the circuit if the base—for example, on a side opposite the connection direction—has a receiving device for mechanical tensile forces, such as a handle or a loop, made of a tensile-strength material with a high softening temperature.During recycling, the circuit according to the invention can then be heated to the recycling temperature and, after softening the connecting materials, separated from the carrier, whereby the circuit can then be gripped at the aforementioned receiving device for mechanical tensile forces and pulled off the textile carrier.

[0138] If, in the manufacture of the circuit according to the invention, the base element with the inner base base and the intermediate layers adhering to it with the conductor track sections are manufactured in separate components and subsequently connected to each other over a surface and preferably materially as well as electrically, then care must be taken to ensure precise mutual alignment of the components relative to each other, especially if a high area and / or spatial density of electrical connections in the area of ​​the base requires high precision in the manufacturing process.To facilitate this, it corresponds to an eighth aspect of the present invention that the inner base bottom section has, on its underside facing away from the predetermined position for receiving the electronic module, an inhomogeneous height structure (raised areas and / or depressions in the z-direction) on the surface of this underside, and if the component to be aligned positionally relative to the inner base bottom section, with the intermediate layers including conductor track sections, has a corresponding outer shape on the surface of this underside that facilitates the mutual alignment of the components to each other, in that the inhomogeneous height structure can serve as a mechanical stop or several mechanical stops for the component with the intermediate layers.

[0139] Fig. Figures 21A to 21D schematically show, as a thirteenth embodiment, a combination of a printed film and a suitably designed base body for use in the manufacture of an exemplary base with a lower cover extended as a lower connection piece. Viewed from the side transverse to the connection direction, i.e., in the y-direction, the figure shows Fig. 21A shows a base body as the first component to be connected, with cross-section showing electrically conductive sections through the inner base base (hatched), and with a recess 2700 (planar in the z-direction) for receiving the printed film as the second component to be connected, which in this embodiment serves as the lower cover with printed intermediate layers including conductor track sections. Viewed from the same direction, Fig. 21D shows the appropriately aligned combination of the two components to be joined, consisting of the base body and the lower cover (extended in the x-direction as the connection direction). The height of the recess in the z-direction corresponds to the thickness of the foil, which is advantageous for forming a smooth common underside of the base, but not necessary solely for the mutual alignment of the components to be joined. Fig. 21B and Fig. Figure 21C shows top views of the surfaces to be joined in the z-direction, with electrically conductive sections through the inner baseboard shown hatched. Fig. 21B and with - also hatched - correspondingly arranged connection areas on the side surfaces of the conductor track sections on the lower cover in Fig. 21C. The outer outline of the recess in the base body corresponds to the outer outline of the film to be received in three directions of the xy-plane and serves as a mechanical stop in three directions. This arrangement enables a precise and robust alignment of the two components to be joined relative to each other, as is particularly necessary for a high area density of electrical connections in the base area.

[0140] The complementary shapes of the recess in the base body and the film to be received form a smooth, common underside, allowing the base to lie flush against the textile support. In this case, the extension of the lower cover can serve as a connection piece for the electrical connection of the base to the opposite side of the textile support, passing through an opening in the textile support to the side of the base body, as shown, for example, in the [reference to be added]. Fig. Arrangement shown in 19B.

[0141] Fig. Figures 22A to 22E show, as a fourteenth embodiment, a further combination of a printed film and a correspondingly designed base body, which, similar to the thirteenth embodiment, are designed for precise mutual alignment. However, unlike the thirteenth embodiment, the base body in this fourteenth embodiment has a circumferential recess 2200 in an edge region of its underside for receiving a section of the textile carrier 1000, which in turn has an opening shaped to fit the inner base base 2150, through which the base can be electrically connected to the opposite side of the textile carrier. In this fourteenth embodiment, the printed film serves as the entirety of the intermediate layers 2510 with conductor track sections contained therein between the lower base base and a separately formed lower cover 2800.

[0142] Similar to Fig. 21A for the thirteenth embodiment shows Fig. 21A a base body in cross-section with hatched electrically conductive sections through the inner base base and with a recess 2700 planar in the z-direction for receiving a section of the printed film 2150. Similar to Fig. 21D for the thirteenth embodiment shows Fig. 22D, viewed from the same direction, shows the appropriately aligned combination of the base body, the textile carrier 1000, and the printed film. The height of the recess 2700 in the z-direction corresponds to the thickness of the printed film 2150, which is advantageous for forming a smooth common underside, but not necessary solely for the mutual alignment of the components to be joined. Furthermore, the fourteenth embodiment, as shown in Fig. Figure 22E shows a lower cover 2800 covering the entire lower side of the base in the area of ​​the base body including the section of the textile support and the section of the printed film contained therein.

[0143] The Fig. 22B and Fig. 22C, similar to Fig. 21B and Fig. 22C for the thirteenth embodiment, are top views of the surfaces to be joined in the z-direction, with electrically conductive sections through the inner baseboard shown hatched. Fig. 22B and correspondingly arranged connection areas on the side surfaces of the conductor track sections on the printed foil in Fig. 22C. For further explanation, to avoid repetition, please refer to the description of the Fig. 21 referred.

[0144] Fig. Figures 23A to 23H show, as a fifteenth embodiment, a combination of several (three in the illustrated example) printed foils and a suitably shaped base body, designed for precise mutual alignment in the manufacture of a base for a contacting module with superimposed conductor tracks on several (three in the illustrated example) superimposed foils.

[0145] Fig. Figures 23A to 23E show the base body with hatched drawings of electrically conductive sections through the inner base floor, namely Fig. 23A in a lower view of the lower base floor in the z-direction as well as Fig. 23B to 23E as section views through the section planes designated S1S1' or S2S2' or S3S3' and S4S4' respectively. Fig. 23F shows top views of the printed top sides of the printed foils, which in the drawn top views are sectionally connected with the in Fig. The lower base shown in Figure 23A, as well as the adjacent foils, are to be connected to each other on both sides. For these surface connections, the hatched connection areas on the side surfaces of the conductor track sections on the printed foils are to be connected to the areas shown in Figure 23A. Fig. The electrically conductive sections shown in section 23A are to be electrically connected through the inner base plate. To enable these electrical connections for the conductor track sections on all printed foils, these sections have different lengths in the connection direction (x-direction) in the example shown, and at their respective ends are the (hatched) connection areas on the side surfaces of the printed conductor track sections. The printed foils are to be stacked on top of each other in such a way that for each stacked foil, the respective end section with the connection areas on the side surfaces of the conductor track sections remains free for contact with the inner base plate and for electrical connection with the electrically conductive sections contained therein.In the illustrated example, the respective ends of the stacked foils are arranged offset from each other in the direction opposite to the connection direction (-x direction).

[0146] A corresponding arrangement, in which the stacked foils are connected to the base, is shown schematically in Fig. 23G shown, Fig. Figure 23H shows the same arrangement, supplemented by a lower cover (shown as a dotted line) to compensate for the stepped gradient of the stacked foils.

[0147] To facilitate the mutual alignment of this complex arrangement, in the example shown, the printed films to be stacked on top of each other have different widths in a lateral direction (y-direction) perpendicular to the connection direction, and the base body is provided on its underside with a flat recess whose width decreases section by section in the lateral direction along the opposite direction to the connection direction (-x-direction), in that its width section by section corresponds to the different widths of the printed films to be stacked on top of each other and with the positions of the width reductions at intervals corresponding to the sizes of the respective end sections to be kept clear with the connection areas on the side surfaces of the conductor track sections.

[0148] In this way, the widest printed sheet is picked up only by the widest section of the recess and guided laterally by it, reaching its stop in the opposite direction to the connection direction (-x direction) at the first narrowing in that direction. The second widest printed sheet is picked up by the widest and second-widest sections of the recess and guided laterally by them, reaching its stop in the opposite direction to the connection direction (-x direction) at the next narrowing in that direction. And so on. Finally, the narrowest printed sheet is the only one picked up by the narrowest and last section of the recess and guided laterally by it, reaching its stop in the opposite direction to the connection direction (-x direction) at the end of the recess.

[0149] If the printed foils are inserted into the recess starting with the widest foil and proceeding in descending order of width, this arrangement results in a precise and stable alignment of all printed foils with their respective connection areas on the side surfaces of the conductor track sections relative to the base plate and its electrically conductive sections. This arrangement enables a precise and robust alignment of a large number of components to be connected relative to each other, as required for a high area density and high spatial density of electrical connections in the base plate area.

[0150] The example shown is not limited to three printed sheets stacked on top of each other and aligned relative to the base and to each other, and can also be used for a larger number of sheets according to the diagram shown. Further details of the example shown are also not important; for instance, the inner base can have one or more protrusions on its underside, and the printed sheets can each have one or more holes and / or lateral recesses at individually different positions, corresponding to the protrusions, in order to enable individually different, yet precise and robust alignments of several printed sheets relative to the base in conjunction with the protrusions.

[0151] For precise and robust alignment of a larger number of printed films relative to a base body, it is important that the inner base bottom section, on its underside facing away from the predetermined position for receiving the electronic module, has an inhomogeneous height structure (raised areas and / or depressions in the z-direction) across the surface of this underside, which, in conjunction with differently shaped film outlines (including possibly holes) of several printed films to be stacked, is suitable to enable different and at the same time precise and robust alignments relative to the base body. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] WO 2016 / 054057A1

[0008] WO 2020 / 0257933A1

[0008]

Claims

[1] Electronic circuit on a textile substrate (1000), comprising several circuit lines (4000) with conductor tracks (4100) lying flat against the textile substrate in one and / or multiple layers, and a contacting module (2000) with a base (2100) materially connected to the textile support for the mechanically detachable mounting of an electronic module (3000) without contact with the textile support; wherein the contacting module comprises several electrically conductive contact surfaces (2101, 2102, 2103) and is configured to receive an electronic module provided with several electrical contacts (3101, 3102, 3103) at a predetermined position (P) relative to the socket such that several of its electrical contacts (3101, 3102, 3103) are electrically connected to several contact surfaces (2101, 2102, 2103) of the contacting module, characterized by that the base has an inner base floor section (2150) and is connected on its underside (2150U) facing away from the predetermined position (P) in a planar and materially bonded manner to a base cover section (2850) of a lower cover (2800), and that the planar and material-bonded connection between the inner base floor section and the The base cover section contains one or more intermediate layers (2510) which are connected on both sides to adjacent surfaces, in which electrically conductive conductor track sections (2511, 2512, 2513) are located, which are electrically connected at their ends furthest from the predetermined position to the circuit lines (4000) outside the base and which are electrically connected at their ends closer to the predetermined position in the inner base base section and / or through the inner base base section to contact surfaces (2101, 2102, 2103) of the contacting module or whose sides facing the predetermined position serve as contact surfaces (2101, 2102, 2103) of the contacting module through openings (2161, 2162, 2163) in the inner base base. [2] Electronic circuit on a textile substrate (1000), comprising several circuit lines (4000) with conductor tracks (4100) lying flat against the textile substrate in one and / or multiple layers, and a contacting module (2000) with a base (2100) materially connected to the textile support for the mechanically detachable mounting of an electronic module (3000) without contact with the textile support; wherein the contacting module comprises several electrically conductive contact surfaces (2101, 2102, 2103) and is configured to receive an electronic module provided with several electrical contacts (3101, 3102, 3103) at a predetermined position (P) relative to the socket such that several of its electrical contacts (3101, 3102, 3103) are electrically connected to several contact surfaces (2101, 2102, 2103) of the contacting module, characterized by, that the electronic circuit in a section firmly connected to the textile carrier comprises a selection switching device (2600) by means of which one of several circuit lines outside the base can be selected for one or more contact surfaces (2101, 2102, 2103) of the contacting module and electrically connected to the respective contact surface. [3] Electronic circuit according to claim 2, wherein the selection switching device is arranged in the base (2100) of the contacting module (2000) and the latter has an inner base bottom section (2150) and on its underside (2150U) facing away from the predetermined position (P) a base cover section (2850) of a lower cover (2800) as well as one or more intermediate layers (2510) between the inner base bottom section and the base cover section, in which conductor track sections (2511, 2512, 2513) are located, which are electrically connected at their ends closer to the predetermined position through the inner base bottom section, either directly or selectably via the selection switching device (2600), to contact surfaces (2101, 2102, 2103) of the contacting module and at their ends further away from the predetermined position to circuit lines (4000) outside the base. [4] Electronic circuit according to claim 3, wherein the selection switching device is arranged - between the predetermined position (P) for receiving the electronics module (3000) and the inner base floor section (2150), and / or - inside the inner base floor section (2150), and / or - on its underside and / or top side, and / or - between the inner base floor section and the base cover section of the lower cover, and / or - in a vertical view of the textile support next to the inner base floor, between a lower connection section (2880) of the lower cover (2800) and the textile support, and / or - inside the lower cover. [5] Electronic circuit according to one of the preceding claims, wherein the conductor track sections between the underside of the inner base bottom section and the base cover section of the lower cover are each provided with an electrically conductive layer having a layer thickness perpendicular to the underside of the inner base bottom section of up to 200 µm and a cross-sectional width parallel to the The underside of the inner base floor section is provided with a thickness of 100 µm to 8 mm, preferably in the range of 300 µm to 3 mm. [6] Electronic circuit according to claim 1, wherein the electrical connections between the contact surfaces of the contacting module and the conductor track sections in one or more intermediate layers run through electrically conductive sections (2151, 2152, 2153) and / or openings (2161, 2162, 2163) in the inner base floor and through the sides of the conductor track sections facing the inner base floor. [7] Electronic circuit according to one of the preceding claims, wherein the conductor track sections (2511, 2512, 2513) are arranged in several stacked intermediate layers such that their perpendicular projections onto the underside of the inner base floor section overlap and they are electrically isolated from each other in overlap areas by non-conductive intermediate layers (2516, 2517). [8] Electronic circuit according to claim 7, wherein a perpendicular projection onto the underside (2150U) of the inner base floor section of a conductor track section (2511) in an intermediate layer further away from the inner base floor section overlaps with an electrical connection (2153) passing through the inner base floor section between a contact surface (2103) of the contacting module and a conductor track section (2513) in an intermediate layer closer to the inner base floor section. [9] Electronic circuit according to one of the preceding claims, wherein the base is formed with an electrically non-conductive thermoplastic elastomer. [10] Electronic circuit according to one of the preceding claims, wherein the lower cover is formed with an electrically non-conductive thermoplastic elastomer, preferably TPU, and the conductor track sections are directly and / or via electrically insulating intermediate layers bonded to the thermoplastic elastomer. [11] Electronic circuit according to one of the preceding claims, wherein the lower cover (2800) further comprises at least one lower connection section (2880) which is arranged on the same side of the textile carrier (1000) as the base cover section (2850) and is connected to the textile carrier in a planar and material manner via one or more connection section intermediate layers (2580) which are connected to adjacent surfaces on both sides, and the connection section intermediate layers (2580) contain electrical connections (2581, 2582, 2583) of conductor tracks (4101, 4102, 4103) outside the socket with conductor track sections (2511, 2512, 2513) inside the socket between the socket cover section (2850) and the inner socket bottom section (2150). [12] Electronic circuit according to claim 8, wherein an electrical connection of a conductor track section (2511) between the base cover section (2850) and the inner base bottom section (2150) with a conductor track (4101) outside the base comprises at least one first connection section (2580) with an electrically conductive layer (2581) lying flat against the lower connection section (2880); wherein the circuit line (4000) with the conductor track (4101) outside the base comprises at least one second connecting section (4200) lying flat against the textile support with an electrically conductive material (4201); wherein the perpendicular projections of the electrically conductive layer (2581) of the first connecting section and of the electrically conductive material (4201) of the second connecting section onto the side of the textile support facing them overlap in an overlap area (R); and wherein the electrically conductive layer (2581) of the first connecting section and the electrically conductive material (4201) of the second connecting section are electrically connected to each other via a contact connection (K) and the perpendicular projection of the contact connection onto the side of the textile support facing it is contained in the overlap area. [13] Electronic circuit according to claim 9 and having the features of claim 4, wherein the at least one first connection section (2580) lying flat against the lower connection section (2880) comprises as an electrically conductive layer a first (2581) and at least one further (2582, 2583) connecting conductor tracks contained in stacked connection section intermediate layers and electrically insulated from each other by non-conductive intermediate layers, which are electrically connected to a first (2511) and at least one further (2512, 2513) conductor track sections contained within the base in stacked connection section intermediate layers, wherein the perpendicular projections of the first connecting conductor (2581) and the electrically conductive material (4201) of the second connecting section onto the side of the textile support facing them overlap in a first overlap area (R1) and the perpendicular projection of the contact connection between the first connecting conductor and the electrically conductive material of the second connecting section onto said side of the textile support is contained in the first overlap area, wherein the circuit further comprises at least one additional connecting section lying flat against the textile support with an electrically conductive material (4202, 4203) and at least one additional contact connection between the at least one additional connecting conductor track (2582, 2583) and the electrically conductive material of the at least one additional connecting section, wherein the perpendicular projections of the at least one further connecting conductor track and of the electrically conductive material of the at least one further connecting section onto said side of the textile carrier overlap in at least one further overlap area (R2, R3) different from the first overlap area (R1) and the perpendicular projection of the at least one further contact connection onto said side of the textile carrier is contained in the at least one further overlap area. [14] Electronic circuit according to claim 9 or 10, wherein the connecting section is arranged on one side of the textile support opposite the predetermined position and the first connecting section is in a flat and materially bonded position on both the connecting section and the textile support, and the second connecting section is located in an overlap area between the first connecting section and the textile support. [15] Electronic circuit according to one of claims 9 to 12, wherein the second connecting section (4200) is formed as part of a conductor track (4100) of a circuit line which lies flat against the textile support. [16] Electronic circuit according to one of claims 8 to 13, wherein the lower connection section is formed integrally with the base cover section. [17] Electronic circuit according to one of the preceding claims, wherein the conductor tracks, which are laid flat on the textile substrate in one or more layers, are electrically insulated around a length of at least 20 mm, preferably 100 mm, and are formed inside the circumferential insulation with an electrically conductive layer having a cross-sectional width in the range of 100 µm to 10 mm, preferably in the range of 300 µm to 5 mm, and a layer thickness of up to 200 µm, preferably a layer thickness in the range of 4 µm to 60 µm. [18] Electronic circuit according to any of the preceding claims, wherein the textile carrier is designed for wearing on the human body and the circuit comprises several electrically conductive electrodes and / or sensors lying flat on the textile carrier, which are connected via several of the circuit lines to a conductive contact surface of the contacting module and are in contact with the skin when the textile carrier is worn. [19] Manufacturing method for an electronic circuit according to any one of claims 1 to 17, comprising: Providing the base with the inner base bottom section, which is designed for making electrical connections from the contact surfaces of the contacting module through the base bottom section to predetermined areas on the underside of the base bottom section; Providing the bottom cover with the base cover section to which one or more layers produced using a printing process are adhered, in which the conductor track sections are located, Aligning the bottom cover and the base bottom section relative to each other, such that the one or more layers adhering to the base cover section are located as one or more intermediate layers between the base cover section and the underside of the base bottom section, and that conductor track sections located in the one or more layers are brought into contact with the predetermined areas on the underside of the base bottom section; and Creating a continuous material bond between the base cover section of the lower cover and the base floor section, so that the one or more intermediate layer(s) on both sides of it connect continuously and materially with adjacent surfaces. [20] Manufacturing method for an electronic circuit according to any one of claims 1 to 17, comprising: Providing the base with the inner base bottom section, which is designed for making electrical connections from the contact surfaces of the contacting module through the base bottom section to predetermined areas on the underside of the base bottom section; Providing an interim carrier to which one or more layers produced using a printing process are adhered, in which the conductor track sections are located, Aligning the interim carrier and the base bottom section relative to each other, so that the one or more layers adhering to the interim carrier are located as one or more intermediate layers between the interim carrier and the underside of the base bottom section, and conductor track sections located in the one or more layers are brought into contact with the predetermined areas on the underside of the base bottom section; Bringing about a planar and material connection between the base floor section and the one or more intermediate layer(s) adhering to the interim support, so that the base floor section connects planarly and materially with the intermediate layer directly adjacent to it, and several intermediate layers connect planarly and materially with each adjacent intermediate layer; Removal of the interim support from the one or more intermediate layers that are bonded to the base floor section in a surface and material manner; and Providing the lower cover and creating a surface and material connection between the lower cover and the intermediate layer(s) that are surface and materially connected to the one or more surface and materially connected to the base floor section. [21] Manufacturing method according to one of the preceding claims, wherein the formation of the planar material bond between the base bottom section and the base cover section of the lower cover and / or the one or more intermediate layer(s) adhering to the interim carrier is carried out by introducing heat and / or pressure, preferably by heating the underside of the base bottom section as well as the lower cover and / or the interim carrier to a temperature in the range of 50°C to 180°C at a pressure in the range of 1 bar to 8 bar. [22] Manufacturing method according to one of the preceding claims, wherein, upon the application of heat and / or pressure, the conductor track sections brought into contact with the predetermined areas on the underside of the base floor section form an electrically conductive connection with an electrically conductive material in the predetermined areas of the base floor section. [23] Manufacturing method according to one of the preceding claims, further comprising a planar material bonding of the textile carrier with the lower cover and / or the base floor section when heat and / or pressure is applied, preferably by heating the underside of the base floor section as well as the lower cover and / or the interim carrier to a temperature in the range of 50°C to 180°C at a pressure in the range of 1 bar to 8 bar. [24] Manufacturing process according to any of the preceding claims, wherein the base and the lower cover or the interim support are located on opposite sides of the textile support when aligned with each other, and the creation of the planar material connection between the underside of the base floor section and the base cover section of the lower cover and / or the one or more intermediate layer(s) adhering to the interim support is achieved through an opening in the textile support.

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