Removable memory card with efficient card locking mechanism, XY ratios and contact point layout

Abstract

A memory card incorporates various contact layouts to prevent a data signal contact from touching a power contact in a host during insertion and removal. The memory card can have a form factor and features that accommodate a relatively large amount of storage with relatively high performance and associated thermal demands. An efficient card locking mechanism is also provided.

Description

REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to U.S. Provisional Patent Application No. 63 / 522,206, filed June 21, 2023, which is hereby incorporated by reference. BACKGROUND

[0002] A host can use a memory card to read and write data. A host can be, for example, a mobile computing device such as a phone, tablet, or laptop. A memory card can be, for example, a microSD™ card. Other types of hosts and memory cards can be used. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a top perspective view from the rear of a memory card of one embodiment. Fig. 2 is a perspective view from the front of the Fig. 1 memory card shown. Fig. 3 is a plan view of the Fig. 1 memory card shown. Fig. 4 is a left side view of the Fig. 1 shown memory card. Fig. 5 is a right side view of the Fig. 1 shown memory card. Fig. 6 is a front view of the Fig. 1 shown memory card. Fig. 7 is a rear view of the Fig. 1 shown memory card. Fig. 8 is a perspective front view from below of the Fig. 1 shown memory card. Fig. 9 shows the perspective view from below front of the Fig. 8 shown memory card with a first contact point layout. Fig. 10 shows the perspective front view from below of the Fig. 8 shown memory card with a second contact point layout. Fig. 11 is a bottom view of the Fig. 1 shown memory card. Fig. 12 shows the bottom view of the Fig. 11 shown memory card with the first contact point layout. Fig. 13 shows the bottom view of the Fig. 11 shown memory card with the second contact point layout. Fig. 14 shows the bottom view of the Fig. 12 shown memory card with a more detailed view of the first contact point layout. Fig. 15 shows the bottom view of the Fig. 13 shown memory card with a more detailed view of the second contact point layout. Fig. 16 is a rear perspective view of a memory card of another embodiment in which the memory card includes a metal plate. Fig. 17 is a plan view of the Fig. Memory card shown in 16. Fig. 18 is a top perspective rear view of a memory card of another embodiment with different proportional size and placement of the card locking support. Fig. 19 is a front perspective view of the Fig. 18 shown memory card. Fig. 20 is a plan view of the Fig. Memory card shown in 18. Fig. 21 is a left side view of the Fig. 18 shown memory card. Fig. 22 is a right side view of the Fig. 18 shown memory card. Fig. 23 is a front view of the Fig. 18 shown memory card. Fig. 24 is a rear view of the Fig. 18 shown memory card. Fig. 25 is a perspective view from below at the front of the Fig. Memory card shown in 18. Fig. 26 shows the perspective front view from below of the Fig. 25 shown memory card with a first contact point layout. Fig. 27 shows the perspective view from below front of the Fig. 25 shown memory card with a second contact point layout. Fig. 28 is a bottom view of the Fig. 18 shown memory card. Fig. 29 shows the view from below of the Fig. 27 shown memory card with the second contact point layout. Fig. 30 shows the bottom view of the Fig. 26 shown memory card with the first contact point layout. Fig. 31 shows the bottom view of the Fig. 30 shown memory card with a more detailed view of the first contact point layout. Fig. 32 shows the bottom view of the Fig. 29 shown memory card with a more detailed view of the second contact point layout. Fig. 33 is a top perspective view from behind of a memory card of another embodiment in which the memory card includes a metal plate. Fig. 34 is a plan view of the Fig. 33 shown memory card. Fig. 35 shows the bottom view of the Fig. 30 shown memory card with example sizes. Fig. Figure 36 shows a bottom view of a microSD™ memory card with sample sizes. Fig. 37 is a plan view of the Fig. 33 shown memory card. Fig. 38 is a cross-sectional view of the Fig. 37 shown memory card. Fig. 39 is a top perspective view from the rear of a memory card of one embodiment. Fig. 40 is a perspective front view from below of the Fig. 39 shown memory card. Fig. 41 is a plan view of the Fig. 39 shown memory card. Fig. 42 is a left side view of the Fig. 39 shown memory card. Fig. 43 is a right side view of the Fig. 39 shown memory card. Fig. 44 is a front view of the Fig. 39 shown memory card. Fig. 45 is a rear view of the Fig. 39 shown memory card. Fig. 46 is a view from below of the Fig. 39 shown memory card. Fig. 47 is a bottom view of a memory card of another embodiment. Fig. 48 is a detailed illustration of the bottom view of Fig. 46. Fig. 49 is a detailed illustration of the bottom view of Fig. 47. DETAILED DESCRIPTION

[0003] In summary, there is a need for a removable memory card in mobile computing devices (e.g., smartphones, tablets, laptops, gaming, Internet of Things (IoT)) that is easy to replace, upgrade, or expand, has a low profile, offers relatively large storage, and offers relatively high performance. Existing memory cards, such as microSD™ memory cards, have a form factor that is too small to handle the high performance requirements and thermal conditions resulting from this high performance. The following embodiments provide memory cards with different form factors that can address the above problems.

[0004] In one embodiment, a memory card is provided having an overall shape similar to a microSD™ card, but with larger sizes and different contact pad layouts to support the storage, performance, and thermal capabilities discussed above. Fig. Figures 1-8 and 11 show various views of such a memory card 10 of one embodiment to illustrate its form factor. Various contact pad layouts can be used on the underside of the memory card. Fig. 9, Fig. 12 and Fig. 14 illustrate an example contact point layout, and Fig. 10, Fig. 13 and Fig. 15 illustrate another exemplary contact pad layout. To assist with heat dissipation and potential EMI protection, a metal plate 40 may be used on top of the memory card 10, and the Fig. 16 and Fig. 17 illustrates an example of this.

[0005] The contact pads can be used to connect to corresponding electrical connectors in a host to place the host in communication with the memory card 10. The memory card 10 can include any suitable memory (including three-dimensional memory) and a controller that can be configured to read data from the memory and store data in the memory. The controller can implement other functions, such as error correction and storage algorithms.

[0006] There are several basic assumptions for the two contact point layouts of these embodiments: - Support for four PCIe lanes (Peripheral Component Interconnect Express) with up to two power supplies (e.g. 3.3 V / 1.8 V or 2.7 V / 1.2 V) - Separate the PCIe high-speed I / Os from the rest and group them per PCIe lane - Providing GND isolation if required - Allow balancing of differential interfaces with PWR / GND - Having a separate row of contacts for the power, clock and sideband signals - Avoid conflicts of signal pads touching power pads during hot insertion / removal - Spreading the three rows allows for better heat dissipation from the card to the circuit board and a simpler connector design that enables tight contact points with sufficient strength. - Includes PRSNT# (Present Detect) function contact point for detecting card insertion / removal (without the need for a card detection switch) - Includes two contact points for CardType, allowing the hardware host to detect the card type after card insertion. This can provide advance information about the card type if needed. - Includes some reserved contact points for the future (i.e. Power Line Notification - PLN).

[0007] In both of the aforementioned pad layouts 20, 30, there are three rows of pads. One row includes power supplies, clocks, and sideband signals, and other rows include as many differential high-speed interfaces as required. These pads support a differential high-speed interface based on the PCIe interface standard. The pads are powered by at least one power supply along with some sideband signals. The pads are arranged in such a way that signal pads never touch host-side power pads during card insertion or removal, thus avoiding conflicts in the case of hot insertion / removal (i.e., inserting or removing the card while the host is providing power to the card).Some contact points are assigned to the card type indicator, allowing the host to detect the type of inserted card and / or its characteristics through its hardware. A presence detection contact point is used to detect card insertion / removal, eliminating the need for a card detection switch commonly used in microSD™ cards. In this embodiment, the contact points are arranged such that the connector-side presence detection contact never touches other signal contacts, power, or ground during card insertion or removal, thus avoiding false card detection.

[0008] As mentioned above, the multi-row pad layouts 20, 30 of these embodiments address the potential conflicts of signal shorts during hot insertion / removal. Due to the small card dimensions and the need to support multiple PCIe lanes, a large number of pads may be required to be placed in a relatively small area. Therefore, three rows of pads may be required to be placed sequentially. Hot insertion / removal can be supported once consumers can remove a card without cueing.This means that power could be applied to the connector's power contacts during card insertion or removal, and it is desirable that no damage be caused to either the card or the host if any signal or ground contact could touch any of the power contacts during the card insertion / removal path. The same potential problem could occur if the host's currently detected contact touches any signal, power, or ground during the card insertion / removal path. This inadvertent contact could cause the host to falsely detect the card, which is something to be avoided. Furthermore, the host can obtain information about the card type, specific properties, or configuration using its hardware logic, without having to initialize the card and read its internal information.This requirement may be necessary for hardware-related support that is expected to be provided before a card operation is performed (i.e., applying a specific power voltage level or allowing a specific maximum power consumption during initialization time, etc.). A method shall be provided to enable this information to be provided to the host without being misrecognized due to path conflicts during hot insertion / removal.

[0009] As between the first and second pad layouts of these embodiments, the power rails in the first pad layout 20 are located at the rear of the card 10, closer to the thicker surface of the card 10 (which may include the internal power circuitry). This requires an open path between the front pad rows, eliminating contact between the front row pads and power contacts during hot card insertion or removal. In the second pad layout 30, the power / control line is located at the front, so the contacts of connectors from other rows never touch it. This allows for greater spacing between the pads, providing more flexibility.

[0010] In one embodiment, the following pad sizes are used. Of course, this is only an example, and other sizes may be used. - Contact point width of approximately 0.75 mm and a distance between the centers of the contact points of approximately 1.05 mm (the distance between the contact points is approximately 0.3 mm).

[0011] The length of the short contact point is about 1.35 mm, and the length of the long contact point is about 1.65 mm.

[0012] The distance between differential high-speed signal series can be about 2 mm.

[0013] As mentioned above, the advantage of these simplified contact pad layouts 20, 30 is that they avoid possible electrical conflicts or false card detection indication that could potentially be caused by contact of any card pads with power contacts on the connector side or the present detection (PRSNT#) contact during hot insertion / removal.

[0014] Current cards do not adequately address the above problems. For example, card-edge connectors (such as those used on motherboards) have a very high profile and are less preferred in small, thin devices such as mobile devices. Furthermore, hinged connectors (such as old "under battery" SIM cards or XFF Express cards) have the problem of card contact points sliding under other connector contacts during card insertion / removal. However, due to their mechanical strength, these connectors have a rather high profile and are not well suited for external removable card applications. Other solutions allow these contacts (such as in SD UHSII cards and SD Express cards) with special consideration of the care required to ensure no damage will occur.This consideration limits the continuous development of the card's functionality and could expose the card to risk if card / host manufacturers fail to comply with the limited protection rules.

[0015] In addition, the card type contacts allow hardware indication to the host of different card types / configurations after card insertion detection. Furthermore, today this information is typically provided through physical cuts on the board (i.e., in M.2 cards). This solution requires different circuit boards for each card type, as well as a configurable connector. It also does not allow for electrical indication of the specific configuration (programmed by software on the card or in the field). Other solutions provide the information simultaneously with card insertion. In these cases, these card type contacts must also be protected against conflicts during card insertion / removal and require a dedicated path. While in the given solution, the card type contacts are expected to be read by the host only after card detection has been indicated to the host.This solution makes it possible to protect the path of these contact points / contacts during card insertion / removal and to provide the card, after it has been inserted, with a logical value corresponding to the card type / configuration.

[0016] In summary, the memory cards 10 of these embodiments address several problems and provide several advantages. For example, the pad layout 20, 30 of these embodiments avoids any potential electrical conflicts or false card detection indications that could be caused by contacting any pad that touches the power contacts on the connector side or the card present (PRSNT#) during hot insertion / removal. This is achieved by either placing all power pads and the existing sense pads in the front row or maintaining a unique path for these specific pads when placed in the second or third row. Additionally, card type pads allow hardware indication to the host of different card types / configurations immediately after card insertion is detected.A few card contact points are provided for this purpose and they are only active after the card 10 has been inserted and are only recognized by the host after the card insertion has been detected.

[0017] In another embodiment, a memory card with a different form factor is used. Fig. 18-25 and 28 show various views of such a memory card 50 of one embodiment to illustrate its form factor. Fig. 35 shows example sizes of an implementation of the memory card 50, and Fig. Figure 36 shows the sizes of a standard microSD™ card 55 for comparison. Various contact point layouts can be used on the bottom of the memory card. Fig. 26, Fig. 30 and Fig. 31 illustrate an exemplary contact point layout 30, and Fig. 27, Fig. 29 and Fig. 32 illustrate another example contact point layout 20.

[0018] While the contact pad layouts 20, 30 provided above have three rows, contact pad layouts including a different number of rows (e.g., to support different numbers of differential interfaces) may also be used.

[0019] While the pad layouts 20, 30 provided above have all sideband signal and power pads in separate rows of differential signals, some of the pads may also be placed in other rows.

[0020] To assist heat dissipation, a metal plate 80 may be used on top of the memory card 50, and Fig. 33 and Fig. 34 illustrate an example of this. Fig. 37 and Fig. 38 show the metal plate 80 and a cross-sectional view, respectively. This optional metal plate 80 not only provides better thermal conductivity but also offers better protection against electromagnetic interference (EMI) if the connector is insufficient. As shown in the cross-sectional view, the memory card 50 includes plastic 90, a substrate 92 (upon which the metal plate 80 can stand), and internal components 94.

[0021] As can be seen by comparing the form factors of the memory cards 10, 50 of these two embodiments, the card locking mechanism 52 of the memory card 50 of the second embodiment has the shape and size of the microSD™ card, while the actual card size is larger than the microSD™ card.

[0022] In general, these embodiments solve the problem of the larger form factor and the need for a new card locking mechanism. The removable memory card 10, 50 of these embodiments is larger in size than a typical microSD™ card, allowing for higher capacity and better thermal performance at higher speeds. A card locking mechanism is desirable to enable better locking of the card in mobile and / or other moving devices. Regardless of the need for the shape of the card, enabling efficient card locking, the area of ​​the card is maximized to allow for maximum memory die as well as a large number of contact pads with enough space for manufacturable support connectors.

[0023] In addition, the asymmetrical front edge of the memory card protects against reverse insertion, the far edge of the memory card allows easy pulling of the card using a fingernail, a partially thin plane is useful in low-profile applications, and the partially thicker edge can accommodate thicker internal components

[0024] Both providing a new card locking mechanism and simply enlarging the overall microSD™ size in the same proportions (including its locking mechanism) are possible. If the card is designed by simply enlarging it but otherwise using the same ratio of a standard microSD™ card (as in the first embodiment above), the front, narrow part of the card consumes a large portion of the card, and there is a fairly large unused area at the front half that limits the memory die, as well as the number of contact pads in a row, or contact pads with enough space to allow for a simple connector design. The solution is to further increase the overall size of the card. Another method would be to have a wider area in the front, but with a new, small, efficient locking mechanism 55, as shown in the second embodiment.However, using the same size and shape of the existing microSD™ locking mechanism, which increases the overall card size, allows for the use of the existing mechanical locking mechanism used in older connectors for more than 15 years, which can increase confidence and reduce costs. By maintaining the original locking mechanism size while increasing the overall card size, the front end of the card is much larger, resulting in more card area, more storage, better thermal capabilities, and more area for more contact points. Note that in this embodiment, the size relationship between the locking shape and the overall card size differs from the microSD™. Only the locking mechanism has the same shape and size.

[0025] Referring again to the drawings, Fig. 39-46 are a rear top perspective view; a bottom front perspective view; a top view; a left side view; a right side view; a front view; a rear view and bottom views of a memory card 300 of another embodiment. As shown in these drawings, the memory card 300 of this embodiment has a width (i.e., the rear edge in the insertion direction) that is wider than its length and is shorter and wider than the memory cards discussed above. Despite this difference in length and width, the notch on the side of the memory card 300 can have the same shape and size as conventional microSD™ cards.

[0026] In an example implantation (see Fig. 41), the form factor of memory card 300 is approximately 14 mm x 18 mm. In one embodiment, the thickness of memory card 300 is between (a) approximately 1.0 + / - 0.1 mm at its thinner edge and 1.4 + / - 0.1 mm at its thicker edge, and (b) approximately 1.4 + / - 0.1 mm at its thinner edge and 2 + / - 0.1 mm at its thicker edge. It should be noted that other dimensions may be used, and these dimensions should not be included in the claims unless expressly recited therein. For example, in another embodiment, the memory card has dimensions of approximately 18 mm x 16 mm with a thickness of approximately 1 mm at its thinner edge and approximately 1.4 mm at its thicker edge.

[0027] Fig. 40 and Fig. 46 illustrate the pad layout at the bottom of the memory card 300 of this embodiment. In an example implementation, the length of the longer pad is approximately 1.6 mm or 1.65 mm, the length of the shorter pad is approximately 1.35 mm, the pad width is approximately 0.70 mm, 0.71 mm, or 0.72 mm, and the spacing between the pads is approximately 0.15 mm. Again, these dimensions are merely examples.

[0028] Fig. Figure 48 is a detailed illustration of the function of each of these contact points in an exemplary embodiment. As shown in Fig. As shown in Figure 48, the power pads (the three VDD1 pads and the three VDD2 pads) are located on both sides of the rear row, and there are no pads forward (toward the card insertion) of the power pads. Therefore, the signal pads of the memory card 300 never contact power pads of a host during card insertion or removal, thereby avoiding conflicts in the case of hot insertion / removal (i.e., inserting or removing the card 300 while the host is supplying power to the card).

[0029] Fig. 47 and Fig.49 illustrates an alternative pad layout of another memory card 400 of one embodiment (the other views of this memory card 400 may be the same as those of the memory card 300 discussed above). In this embodiment, instead of three VDD1 pads and three VDD2 pads on either side of the back row, there is a single, larger VDD pad on each side of the back row. In one implementation, the single, larger VDD pad is approximately 1.5 mm x 2.5 mm. Other alternatives are possible, such as using an additional (e.g., fourth / back) row containing additional VDD pads.

[0030] Several advantages are associated with these embodiments. For example, the disclosed form factor allows a relatively large number of pads to fit in a row, in contrast to memory cards that use smaller pads and / or closer spacing between pads to increase the number of rows with fewer pads in each row. By increasing the pad width and / or spacing between pads, these embodiments can reduce connector design complexity, lower manufacturing costs due to reduced required accuracy, and avoid signal integrity issues that might occur with the other designs.Furthermore, reducing the complexity of the connector design by reducing the number of rows in relatively small memory cards can be advantageous and can reduce the risk of signal conflicts when performing hot insertion / removal of the memory card. Furthermore, these embodiments can be advantageous for side-inserting a memory card with similar dimensions and a similar number of pads and / or four PCIe channels using similar (or larger) pad dimensions.

[0031] It is intended that the foregoing detailed description be construed as an illustration of selected forms the invention may take, rather than as a definition of the invention. Only the following claims, including all equivalents, are intended to define the scope of the claimed invention. Finally, it is to be understood that each aspect of each of the embodiments described herein may be used alone or in combination with one another. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] US 63 / 522,206

[0001]

Claims

[1] Memory card, comprising: an upper surface; and a lower surface opposite the upper surface, the lower surface comprising a plurality of contact points; where: a first row of contact points located toward a front side of the memory card comprising a plurality of contact points, none of which are power contact points; a last row of contact points located towards a rear side of the memory card comprises at least one power contact point; at least one power contact point on the memory card is positioned so that that no other non-power contact points are present between the at least one power contact point and the front of the memory card; and a width of the memory card is greater than a length of the memory card, wherein the width of the memory card corresponds to a trailing edge of the memory card in an insertion direction into a host. [2] The memory card according to claim 1, wherein the width of the memory card is about 18 mm and the length of the memory card is about 14 mm. [3] The memory card according to claim 1, wherein the width of the memory card is about 18 mm and the length of the memory card is about 16 mm. [4] The memory card of claim 1, wherein a thickness of a portion of the memory card is between about 1.0 mm and about 1.4 mm. [5] The memory card of claim 1, wherein a thickness of a portion of the memory card is between about 1.4 mm and about 2 mm. [6] A memory card according to claim 1, wherein: a thickness of a first portion of the memory card is between about 1.0 mm and about 1.4 mm and a thickness of a second portion of the memory card is between about 1.4 mm and about 2 mm. [7] The memory card of claim 1, wherein the at least one power pad comprises one or more power pads located at a first end of the last row and one or more power pads located at a second end of the last row. [8] A memory card according to claim 7, wherein: the one or more power contact points located at the first end of the last row comprise three power contact points and the one or more power contact points located at the second end of the last row comprise three power contact points. [9] A memory card according to claim 7, wherein: the one or more power contact points located at the first end of the last row comprise a single power contact point and the one or more power contact points located at the second end of the last row comprise a single power contact point. [10] The memory card of claim 9, wherein the single power pad at the first end of the last row and / or the single power pad at the second end of the last row is larger than any other pad of the plurality of pads. [11] The memory card of claim 9, wherein the single power contact point at the first end of the last row and / or the single power contact point at the second end of the last row is about 1.5 mm x about 2.5 mm. [12] The memory card of claim 1, wherein the plurality of contact points includes at least one contact point having a length of about 1.6 mm to about 1.65 mm. [13] The memory card of claim 12, wherein the plurality of contact points includes at least one additional contact point having a length of approximately 1.35 mm. [14] The memory card of claim 1, wherein the plurality of contact points comprises at least one contact point having a width of about 0.70 mm to about 0.72 mm. [15] The memory card according to claim 1, wherein a distance between two adjacent contact points of the plurality of contact points is about 0.15 mm. [16] The memory card of claim 1, further comprising a microSD™ card locking mechanism. [17] Memory card, comprising: an upper surface; and a lower surface opposite the upper surface, the lower surface comprising a plurality of contact points; where: a first row of contact points located toward a front side of the memory card comprising a plurality of contact points, none of which are power contact points; a last row of contact points located towards a rear side of the memory card comprises at least one power contact point; the at least one power contact point on the memory card is positioned such that no other non-power contact points are present between the at least one power contact point and the front of the memory card; the at least one power contact point comprises one or more power contact points located at a first end of the last row and one or more power contact points located at a second end of the last row; and a width of the memory card is approximately 18 mm and a length of the memory card is approximately 14 mm, wherein the width of the memory card corresponds to a rear edge of the memory card in an insertion direction into a host. [18] A memory card according to claim 17, wherein: the one or more power contact points located at the first end of the last row comprise three power contact points and the one or more power contact points located at the second end of the last row comprise three power contact points. [19] A memory card according to claim 17, wherein: the one or more power contact points located at the first end of the last row comprise a single power contact point and the one or more power contact points located at the second end of the last row comprise a single power contact point. [20] Memory card, comprising: an upper surface; a lower surface opposite the upper surface, the lower surface comprising a plurality of contact points; and means for preventing a signal pad of the plurality of pads from contacting a power pad of a host during insertion and removal of the memory card; wherein a width of the memory card is about 18 mm and a length of the memory card is about 16 mm, the width of the memory card corresponding to a rear edge of the memory card in an insertion direction into a host.

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