ELECTRICAL CONNECTOR AND ELECTRICAL CIRCUIT

Abstract

The present disclosure discloses an electrical connecting element for transmitting electrical signals between electrical components, wherein the electrical connecting element comprises: a planar carrier substrate, at least one contact element network, each network comprising a conductor element arranged on a first side of the carrier substrate, at least one first contact element and at least one second contact element for each of the contact element networks, the contact elements being arranged on a second side of the carrier substrate, the second side being opposite the first side, and a via element for each of the contact elements, the via element being configured to electrically contact the respective contact element with the respective conductor element through the carrier substrate. Furthermore, the present disclosure discloses a corresponding electrical circuit.

Description

TECHNICAL AREA

[0001] The present disclosure relates to an electrical connecting element and a corresponding electrical circuit. TECHNICAL BACKGROUND

[0002] The present disclosure is described below mainly in relation to the connection of electrical components that process high-frequency signals with frequencies in the range above 100GHz or 200GHz.

[0003] Electrical and electronic circuits for processing high-frequency signals above 100 GHz place special demands on the quality of signal transmission within the circuits. In particular, transitions between individual components of such circuits can negatively impact the signal quality, for example, due to impedance discontinuities. SUMMARY

[0004] One task of revelation is therefore to simplify the connection of electrical components in electrical circuits in which high-frequency signals are present.

[0005] The problem is solved by the subject matter of the independent claims.

[0006] It is revealed: An electrical connecting element for transmitting electrical signals between electrical components, wherein the electrical connecting element comprises: a planar carrier substrate, at least one contact element network, each comprising a conductor element arranged on a first side of the carrier substrate, at least one first contact element and at least one second contact element for each of the contact element networks, wherein the contact elements are arranged on a second side of the carrier substrate, the second side being opposite the first side, and a via element for each of the contact elements, wherein the via element is configured to electrically contact the respective contact element with the respective conductor element through the carrier substrate.

[0007] Furthermore, it is revealed: An electrical circuit comprising: at least one first electrical component and at least one second electrical component, and at least one electrical connecting element according to one of the preceding claims, wherein the at least one first component and the at least one second component each have a signal line on a first side which is coupled at one end to one of the contact elements of the at least one electrical connecting element.

[0008] The present disclosure is based on the finding that conventional methods of electrically connecting components in electrical circuits are unsuitable for processing high-frequency signals or generate a very high assembly effort.

[0009] In particular, modern circuits built according to the principle of heterogeneous integration allow individual components to be manufactured using the technology best suited to that specific component. Consequently, components manufactured using different technologies must be electrically interconnected in such circuits.

[0010] Typically, connections between MMICs (monolithic microwave integrated circuits) or substrate-to-substrate connections are made using bond wires. Such connections can be used for signals with frequencies up to approximately 130 GHz, but must be very short or include some kind of matching circuit, which limits the usable bandwidth.

[0011] Alternatively, so-called "flip-chip" connections (flip-chip assemblies) can be used. With such connections, an IC is flipped so that its top side rests on the substrate. However, this leads to detuning of the IC and problems with heat dissipation, which is why this type of connection has limited applications.

[0012] The underlying idea of ​​the present disclosure is to take this knowledge into account and to provide an electrical connecting element or an electrical circuit with such a connecting element, which circumvents the aforementioned disadvantages and can be used for signals with frequencies well above 200GHz.

[0013] The electrical connecting element according to the present disclosure provides a planar support substrate. The term "planar" means that the support substrate has a surface area in a plane that is greater than the thickness of the support substrate along an axis perpendicular to that plane.

[0014] On a first side of the substrate, hereinafter also referred to as the top side, at least one network of contact elements is arranged or applied, which includes a corresponding conductor element. On a second side of the substrate, hereinafter also referred to as the bottom side, corresponding first and second contact elements are arranged, which are coupled to the conductor element by corresponding vias. The distinction between first and second contact elements serves only for conceptual classification as components in a corresponding electrical circuit. The distinction between first and second contact elements does not entail any technical differences, although such differences may exist in specific embodiments.

[0015] In embodiments, several contact element networks can be provided, each of which can have its own conductor element on the top side with corresponding first and second contact elements on the bottom side and corresponding via elements.

[0016] A conductor element can be a single conductor connecting exactly one first contact element to exactly one second contact element. In other embodiments, the conductor element can comprise a branched network of interconnected conductors that can be coupled to at least two first contact elements, or to at least two second contact elements, or to at least two first and at least two second contact elements. A combination of different embodiments of the conductor element in an electrical connection element is possible.

[0017] In some embodiments, the through-hole components can be cylindrical, i.e., have a constant diameter, or have a rectangular or square cross-section. In other embodiments, the through-hole components can have a smaller area on the first side than on the second side, or vice versa, i.e., be conical or frustoconical.

[0018] If the electrical connecting element is used in a corresponding electrical circuit, at least one first and one second electrical component can be provided in addition to the electrical connecting element.

[0019] It is understood that a single electrical connection element can be coupled to exactly one first electrical component and exactly one second electrical component. Furthermore, a single electrical connection element can be provided in an electrical circuit, or several electrical connection elements can be provided in an electrical circuit. In further embodiments, a single electrical connection element can be coupled to several first or second components, or to several first and second components.

[0020] Each electrical component has at least one signal line, which is coupled at one end to one of the contact elements of the inserted electrical connector or to one of the inserted electrical connectors. In embodiments, one or all of the electrical components may also have more than one signal line. The signal lines are arranged on a first side of the electrical components, hereinafter also referred to as the top side.

[0021] The individual electrical components can have additional circuit components besides at least one signal line. These circuit components can, for example, serve to process or transmit electrical signals within the electrical circuit and may be at least partially coupled to one of the signal lines.

[0022] The individual electrical components can also be designed as planar components with a support substrate. The support substrate of the electrical components can be made of the same material as the support substrate of the electrical connecting element. Different materials for the support substrates are also possible. In embodiments, the electrical connecting element can be made of an LCP material, while at least one of the electrical components can be made of a ceramic material.

[0023] In some embodiments, the substrates for the electrical components and the electrical connector can be approximately the same thickness. For example, the substrates can have a thickness of 10 µm, 20 µm, 30 µm, 40 µm, 50 µm, 60 µm, 70 µm, 80 µm, 90 µm, or 100 µm or more. Different thicknesses for the substrates of the electrical connector and the individual electrical components are also possible.

[0024] In exemplary embodiments, the signal line can have a width of 10 µm, 20 µm, 30 µm, 40 µm, 50 µm, 60 µm, 70 µm, 80 µm, 90 µm, or 100 µm, and the conductor element can have a width of 10 µm, 20 µm, 30 µm, 40 µm, 50 µm, 60 µm, 70 µm, 80 µm, 90 µm, or 100 µm. In particular, with the aforementioned material selection of LCP and ceramic, the conductor element can be wider than the signal lines.

[0025] The thickness of the substrates of the electrical connecting element and the electrical components can be selected in particular such that the respective substrate does not exhibit modes at the relevant frequencies.

[0026] The electrical connector can be used in electrical circuits as a replacement for other connectors, such as bond wires. A single electrical connector can couple two or more electrical components and provide one or more signal lines on each of the electrical components.

[0027] In particular, the two-sided embodiment of the electrical connecting element with the conductor element on the top side enables easy assembly of the electrical connecting element in the electrical circuit, e.g., with conventional flip-chip bonders.

[0028] Further embodiments and developments are described in the dependent claims and in the description with reference to the figures. In particular, all embodiments mentioned herein can be combined with one another in any order or number, unless individual features are mutually exclusive. In particular, the dependent claims of one claim category can also be further developed according to another claim category.

[0029] In one embodiment of the electrical connecting element, which can be combined with all embodiments mentioned herein, the contact elements can each have a contact pad rising from the second side of the support substrate. In embodiments, the contact pad can, for example, comprise an electrically conductive metal, in particular gold.

[0030] The contact pads can be formed as small mounds or raised areas of the respective material, protruding from the surface of the underside of the substrate. Such contact pads can be applied, for example, by electroplating.

[0031] The contact pads can have a thickness or height of 1 µm, 2 µm, 3 µm, 4 µm, 5 µm, 6 µm, 7 µm, 8 µm, 9 µm, 10 µm or more.

[0032] The contact pads simplify the contacting or connection of the electrical connecting element with the respective ends of the signal lines.

[0033] For example, an anisotropic adhesive can be applied to the underside of the electrical connector or the top side of the respective electrical component. Such an adhesive can be designed, for instance, to exhibit electrically conductive properties only at the points where pressure is applied. When an electrical connector with corresponding contact pads is pressed onto an electrical component, the anisotropic adhesive becomes conductive at the points where the contact pads are located, establishing an electrical connection between the end of the signal wire and the respective connector. After the adhesive has cured, a permanent connection between the electrical connector and the respective electrical component is ensured.

[0034] In yet another embodiment of the electrical connecting element, which can be combined with all embodiments mentioned herein, the electrical connecting element can further have a first electrically conductive ground plane, which is arranged on the first side of the support substrate in such a way that it surrounds the at least one conducting element.

[0035] The combination of the conductor element and the first ground plane can also be referred to as a "grounded coplanar waveguide" or GCPW. As described below, a second ground plane can also be present in the "grounded coplanar waveguide".

[0036] In embodiments, the distance between the first ground plane and the conductor element can be 10 µm, 11 µm, 12 µm, 13 µm, 14 µm, 15 µm, 16 µm, 17 µm, 18 µm, 19 µm or 20 µm, but also more or less.

[0037] In a further embodiment of the electrical connecting element, which can be combined with all embodiments mentioned herein, the electrical connecting element can further comprise at least one ground contact element on the second side of the support substrate and a ground through-hole element for each of the ground contact elements. The ground through-hole elements can each be configured to electrically connect the first ground plane to the respective ground contact element.

[0038] Grounding vias can be used to electrically connect the ground plane through the substrate of the electrical connector from the underside of the connector. Furthermore, grounding vias can be positioned to create a quasi-coaxial interface between the end of the signal line of an electrical component and the conductor.

[0039] For this purpose, a predetermined number of ground connection elements can be provided at each end of the conductor element, so that the distances between the corresponding via element or contact element and the ground connection elements provide sufficient shielding of the signal transition.

[0040] The grounding elements can have a larger area on the second side than on the first side, the sizes of the areas being chosen in particular such that the electrical connection element has a predetermined impedance.

[0041] In yet another embodiment of the electrical connecting element, which can be combined with all embodiments mentioned herein, the ground contact elements can each have a contact pad rising from the second side of the support substrate. In embodiments, the contact pad can, for example, comprise an electrically conductive metal, in particular gold.

[0042] The explanations given above regarding the contact pads of the contact elements apply analogously to the contact pads of the ground contact elements. The contact pads of the ground contact elements can be designed identically to the contact pads of the contact elements. In some embodiments, the contact pads of the ground contact elements and the contact pads of the contact elements can be applied in a single step.

[0043] In one embodiment of the electrical connecting element, which can be combined with all embodiments mentioned herein, the electrical connecting element may further have a second electrically conductive ground plane, which is arranged on the second side of the support substrate and is electrically coupled to the ground contact elements.

[0044] The second ground plane on the underside of the electrical connection element, mentioned above, serves to further shield the conductor element and completes the "Grounded Co-planar Waveguide" construction.

[0045] In embodiments, the second ground plane can have a recess, i.e., no electrically conductive material, in those sections where the second ground plane lies above a signal line of an electrical component in the electrical circuit.

[0046] The recess can also extend to sections where the respective electrical component does not have a first ground plane. This recess serves to prevent the second ground plane from interfering with the coaxial interface on the electrical component, which is explained in more detail below.

[0047] In yet another embodiment of the electrical connecting element, which can be combined with all embodiments mentioned herein, the thickness of the support substrate, the width of the conductor element, and the distance between the conductor element and the first ground plane can be dimensioned such that the electrical connecting element has a predetermined impedance.

[0048] For the transmission of electrical signals, it is advantageous if all elements involved in the signal transmission have the same impedance, or if there are no impedance discontinuities in the signal path. For example, the specified impedance can be 50 Ω.

[0049] The electrical connection element can therefore be dimensioned to exhibit the specified impedance. To achieve this, the thickness of the substrate, the width of the conductor element, and the distance between the conductor element and the first ground plane can be adjusted. For precise dimensioning, a suitable simulation program can be used, for example. In some embodiments, at least one variable—the thickness of the substrate, the width of the conductor element, and the distance between the conductor element and the first ground plane—can be predefined, and only the other variables are calculated or adjusted.

[0050] In a further embodiment of the electrical connecting element, which can be combined with all embodiments mentioned herein, a distance between the at least one first contact element of a corresponding contact element network and the second ground plane can be selected such that the electrical connecting element has a predetermined impedance.

[0051] The same applies to the second contact elements. In an embodiment that can be combined with all the embodiments mentioned herein, the distance between the at least one second contact element of a corresponding contact element network and the second ground plane can be selected such that the electrical connection element has the specified impedance.

[0052] As explained above, the arrangement of a via with corresponding ground vias arranged around it can form a quasi-coaxial arrangement or interface. To avoid disrupting the character of such a quasi-coaxial arrangement, the distance between the via and the second ground plane can be chosen to achieve the desired impedance.

[0053] As explained above, the exact dimensioning of the electrical connecting element can be done by simulation with a suitable program.

[0054] In the dimensioning process, for example the dimensions of the quasi-coaxial interface can be specified, as these can result from the properties and dimensions of the electrical components.

[0055] In yet another embodiment of the electrical connecting element, which can be combined with all embodiments mentioned herein, the support substrate can comprise a flexible substrate, in particular a polymer, in particular a liquid crystal polymer (LCP) or a polyimide.

[0056] If a flexible substrate is used for the electrical connection element, the electrical connection element can absorb movements that may arise in the electrical circuit due to thermal stress, for example, without damaging the electrical connection.

[0057] In embodiments, the electrical connection element can therefore be designed as a two-sided LCP substrate, on the upper side of which at least one conductor element and the first ground plane are formed, and on the underside of which the contact elements and the second ground plane are formed. The contact elements can be connected to the conductor element by corresponding vias, and the first ground plane can be connected to the second ground plane by corresponding ground vias. Corresponding contact pads can be provided on the underside of the electrical connection element, which serve for the electrical connection to an electrical component.

[0058] In one embodiment of the electrical circuit, which can be combined with all embodiments mentioned herein, the signal line of the at least one first component and the signal line of the at least one second component can each have a contact pad rising from the component at their end coupled to a corresponding contact element. In embodiments, the contact pads can, for example, comprise an electrically conductive metal, in particular gold.

[0059] The explanations given above regarding the contact pads of the contact elements or the ground connection elements apply analogously to the contact pads at the ends of the signal lines. The contact pads at the ends of the signal lines can be designed identically to the contact pads of the contact elements or the ground connection elements.

[0060] In embodiments, the contact pads can be arranged either on the underside of the substrate of the electrical connector or on the top side of an electrical component. In embodiments, contact pads can be arranged on both the underside of the substrate of the electrical connector and on the top side of an electrical component, and the contact pads can be arranged at non-overlapping or overlapping locations.

[0061] As explained above, the contact pads on the electrical components also serve to simplify the connection of an electrical component to an electrical connecting element.

[0062] In yet another embodiment of the electrical circuit, which can be combined with all embodiments mentioned herein, at least one first electrical component or at least one second electrical component can have a first ground plane on its first side. In a further embodiment, at least one first and at least one second electrical component can each have a first ground plane on their first side.

[0063] The first ground plane on the top side of one or more of the first or second components also serves to form a "grounded coplanar waveguide" within the components. The signal path of the respective component can therefore be surrounded by the corresponding first ground plane.

[0064] In yet another embodiment of the electrical circuit, which can be combined with all embodiments mentioned herein, at least one ground plane can have at least one contact pad rising from the first side. In embodiments, the contact pad can, for example, comprise an electrically conductive metal, in particular gold.

[0065] The explanations regarding the contact pads already given above for the contact elements, the ground connection elements and the end of the signal line also apply analogously to the contact pads of the first ground plane of the electrical components.

[0066] The contact pads of the ground plane of electrical components also serve for electrical contact between the electrical component and the electrical connecting element.

[0067] In a further embodiment of the electrical circuit, which can be combined with all embodiments mentioned herein, the thickness of the electrical component, the width of the signal line, and the distance between the ground plane and the signal line of the respective electrical component can each be dimensioned such that the signal path from the first electrical component, electrical connecting element, and second electrical component has a predetermined impedance.

[0068] As explained above, a consistent impedance across the entire signal path, which consists of signal line, via element, conductor element, via element and signal line, is advantageous.

[0069] The electrical components can therefore be dimensioned to exhibit the specified impedance. To achieve this, the thickness of the component's substrate, the width of the signal line, and the distance between the signal line and the first ground plane on the electrical components can be adjusted.

[0070] For precise dimensioning, a suitable simulation program can be used, for example. In some embodiments, at least one variable can be specified: the thickness of the support substrate of the electrical connection element as well as the electrical components, the width of the conductor element or signal lines, and the distance between the conductor element or signal line and the first ground plane. Only the other variables are calculated or adjusted.

[0071] In yet another embodiment of the electrical circuit, which can be combined with all embodiments mentioned herein, the at least one first electrical component or the at least one second electrical component or the at least one first and the at least one second electrical component can each further have a second electrically conductive ground plane, which is arranged on a second side of the respective electrical component, wherein the second side is opposite the first side.

[0072] As with the electrical connector, the second ground plane of the electrical component serves to improve the shielding of the signal line. The second ground plane thus completes the "grounded co-planar waveguide".

[0073] In yet another embodiment of the electrical circuit, which can be combined with all embodiments mentioned herein, ground connection elements can be provided in the at least one first electrical component or the at least one second electrical component or the at least one first and the at least one second electrical component, which electrically couple the first ground plane with the second ground plane.

[0074] The ground contact elements can be used to electrically contact the ground planes through the substrate of the electrical component in order to improve the shielding of the signal line.

[0075] In yet another embodiment of the electrical circuit, which can be combined with all embodiments mentioned herein, at least one first electrical component or at least one second electrical component can have a matching network at the end of its signal line coupled to a corresponding contact element. The same applies to both components in embodiments. In such embodiments, at least one first and at least one second electrical component can each have a matching network at the end of their signal line coupled to a corresponding contact element.

[0076] The term "matching network" can refer to any type of component or conductor that adapts one conductor or interface type, e.g., a GCPW conductor, to another conductor or interface type, e.g., a coaxial interface, or performs impedance matching. Such a matching network might, for example, have a taper or widening between the signal conductor and the actual end of the signal conductor, which is coupled to a contact element or contact pad of the electrical connector. Other configurations of the matching network are possible.

[0077] In such an matching network, the end of the signal lines can be designed, for example, as a circular contact element with a predetermined diameter.

[0078] In yet another further embodiment of the electrical circuit, which can be combined with all embodiments mentioned herein, the first ground plane of at least one electrical component at the end of the signal line coupled to a via element can have a recess which excludes a predetermined area around the respective end in order to form a coaxial interface.

[0079] The recess can have a circular, oval or rectangular shape around its respective end and may have an opening or passage for the respective signal line.

[0080] This recess in the ground plane, together with the signal line, creates a coaxial interface. The impedance of the coaxial interface can be adjusted by appropriately dimensioning the recess. A suitable simulation program can be used for precise dimensioning.

[0081] As explained above, the second ground plane of the electrical connector can have a predetermined distance around the respective contact element, resulting in a further recess. This recess on the underside of the electrical connector can correspond to the recess on the electrical component. The recess on the underside of the electrical contact element can also be located where it lies above the signal line. This will be explained in more detail in conjunction with the figures.

[0082] In some embodiments, the substrate of the electrical connection element can be made of an LCP material. The substrate of the electrical components can be a ceramic substrate, e.g., AL₂O₃. The structures on the substrates can be copper structures.

[0083] In such embodiments, the width of the signal lines can be smaller than the width of the respective conductor element of the electrical connection element. The width of the signal lines and the conductor element depends essentially on the permittivity εr of the respective substrate. This is approximately 3 for an LCP material and approximately 10 for a ceramic substrate.

[0084] In embodiments with LCP material for the electrical connecting element and a ceramic substrate for the electrical components, the width of the signal lines can be between 15 µm and 25 µm, particularly 20 µm, 21 µm, or 22 µm. The distance between the signal line and the first ground plane of the electrical component can be between 10 µm and 20 µm, particularly 16 µm, 17 µm, or 18 µm. The diameter of the circular contact element at the end of the signal line can be between 10 µm and 50 µm, particularly 20 µm, 30 µm, or 40 µm. The distance between the contact element at the end of the signal line and the first ground plane on the top side of the electrical component can be between 70 µm and 110 µm, in particular 80 µm, 90 µm, or 100 µm. The diameter of the contact elements on the underside of the substrate of the electrical connection element can be between 20 µm and 60 µm, in particular 30 µm, 40 µm, or 50 µm.The distance between a contact element and a ground connection element can be between 100 µm and 120 µm, in particular 113 µm, 114 µm, or 115 µm. The width of the conductor element can be between 60 µm and 70 µm, in particular 64 µm, 65 µm, or 66 µm. The distance between the conductor element and the first ground plane on the top surface of the electrical connection element can be between 10 µm and 20 µm, in particular 14 µm, 15 µm, or 16 µm. The thickness of the substrates of the electrical component and the electrical connection element can be 50 µm.

[0085] The dimensions given here are merely examples and result in a signal path impedance of approximately 50 Ω. Such a signal path exhibits insertion losses of only 2 dB and 18 dB for back-to-back signals (back-to-back configuration or return loss). CONTENT OF THE DRAWINGS

[0086] The present disclosure will be explained in more detail below with reference to the exemplary embodiments shown in the schematic figures of the drawings. Fig. Figure 1 shows a schematic view of an embodiment of an electrical connecting element according to the present disclosure; Fig. Figure 2 shows a schematic view of another embodiment of an electrical connecting element according to the present disclosure; Fig. Figure 3 shows a schematic view of another embodiment of an electrical connecting element according to the present disclosure; Fig. Figure 4 shows a schematic view of another embodiment of an electrical connecting element according to the present disclosure; Fig. Figure 5 shows a schematic view of an embodiment of an electrical circuit according to the present disclosure; Fig. Figure 6 shows a schematic view of another embodiment of an electrical circuit according to the present disclosure; Fig. Figure 7 shows a schematic view of another embodiment of an electrical connecting element according to the present disclosure; Fig. Figure 8 shows a schematic view of a further embodiment of an electrical connecting element according to the present disclosure; and Fig. Figure 9 shows a schematic view of an embodiment of an electrical component according to the present disclosure.

[0087] In all figures, functionally identical elements and devices – unless otherwise specified – have been provided with similar reference symbols that are identical at least in the two least significant places (ones and tens). DETAILED DESCRIPTION OF THE FIGURES

[0088] Fig. Figure 1 shows a schematic view of an electrical connection element 100 in a side sectional view through the plane of the planar support substrate 101. The electrical connection element 100 serves to transmit electrical signals between electrical components, in particular signals with high frequencies above 200 GHz, e.g., up to 240 GHz or 250 GHz. For this purpose, the electrical connection element 100 comprises: a planar support substrate 101, and at least one contact element network 102, of which only one is shown for clarity. The contact element network 102 includes a conductor element 103, which is arranged on a first side 104 of the support substrate 101.Furthermore, the connecting element 100 has at least one first contact element 106 and at least one second contact element 107 for each of the contact element networks 102, wherein the contact elements 106, 107 are arranged on a second side 105 of the carrier substrate 101, which is opposite the first side 104. The connecting element 100 also has a through-hole plated through-hole element 108-1, 108-2 for each of the contact elements 106, 107, wherein the through-hole plated through-hole element 108-1, 108-2 is configured to electrically contact the respective contact element 106, 107 with the respective conductor element 103 through the carrier substrate 101. The explanations disclosed herein regarding further embodiments of the connecting element apply analogously to the connecting element 100.

[0089] As explained above, the support substrate 101 can, for example, be a flexible support substrate 101, in particular an LCP substrate. The conduction element 103, the contact elements 106, 107 and the via elements 108-1, 108-2 can, for example, be made of copper.

[0090] Fig. Figure 2 shows a schematic view of an electrical connection element 200. The connection element 200 is based on the electrical connection element 100 and also serves to transmit electrical signals between electrical components, in particular signals with high frequencies above 200 GHz, e.g., up to 240 GHz or 250 GHz. Consequently, the electrical connection element 200 comprises: a planar carrier substrate 201, and at least one contact element network 202, of which only one is shown for clarity. The contact element network 202 has a conductor element 203, which is arranged on a first side 204 of the carrier substrate 201.Furthermore, the connecting element 200 has at least one first contact element 206 and at least one second contact element 207 for each of the contact element networks 202, wherein the contact elements 206, 207 are arranged on a second side 205 of the carrier substrate 201, which is opposite the first side 204. The connecting element 200 also has a through-hole plated ...

[0091] To facilitate contacting the contact elements 206, 207, the connecting element 200 has a corresponding contact pad 210-1, 210-2 beneath each of the contact elements 206, 207. The contact pads 210-1, 210-2 can be made of a conductive metal, such as gold. In some embodiments, the contact pads 210-1, 210-2 can be electroplated onto the contact elements 206, 207.

[0092] Fig. Figure 3 shows a schematic view of an electrical connection element 300. The connection element 300 is based on the electrical connection element 200 and also serves to transmit electrical signals between electrical components, in particular signals with high frequencies above 200 GHz, e.g., up to 240 GHz or 250 GHz. Consequently, the electrical connection element 300 comprises: a planar carrier substrate 301, and at least one contact element network 302, of which only one is shown for clarity. The contact element network 302 has a conductor element 303, which is arranged on a first side 304 of the carrier substrate 301.Furthermore, the connecting element 300 has at least one first contact element 306 and at least one second contact element 307 for each of the contact element networks 302, wherein the contact elements 306, 307 are arranged on a second side 305 of the carrier substrate 301, which is opposite the first side 304. Furthermore, the connecting element 300 has a through-hole plated ...

[0093] The connecting element 300 has a corresponding contact pad 310-1, 310-2, below each of the contact elements 306, 307. The explanations disclosed herein regarding further embodiments of the connecting element apply analogously to the connecting element 300.

[0094] To ensure the quality of signal transmission in the connecting element 300, the connecting element 300 has a first electrically conductive ground plane 312 on its upper surface 304. Furthermore, a ground contact element 310-3 is provided on the second side 305 of the carrier substrate 301, and a ground through-hole element 313 is provided for the ground contact element 310-3. More than one ground contact element 310-3 and one corresponding ground through-hole element 313 may be provided.

[0095] The ground connection elements 313 are designed to electrically connect the first ground plane 312 to the respective ground contact element 310-3 in order to enable ground contact between the components and the connecting element 300.

[0096] Fig. Figure 4 shows a schematic view of an electrical connecting element 400. The connecting element 400 is based on the electrical connecting element 300 and also serves to transmit electrical signals between electrical components, in particular signals with high frequencies above 200 GHz, e.g., up to 240 GHz or 250 GHz. Consequently, the electrical connecting element 400 comprises: a planar carrier substrate 401, and at least one contact element network 402, of which only one is shown for clarity. Each contact element network 402 has a conductor element 403, which is arranged on a first side 404 of the carrier substrate 401.Furthermore, the connecting element 400 has at least one first contact element 406 and at least one second contact element 407 for each of the contact element networks 402, wherein the contact elements 406, 407 are arranged on a second side 405 of the carrier substrate 401, which is opposite the first side 404. Furthermore, the connecting element 400 has a through-hole plated element 408-1, 408-2 for each of the contact elements 306, 307, wherein the through-hole plated element 408-1, 408-2 is configured to electrically contact the respective contact element 406, 407 with the respective conductor element 403 through the carrier substrate 401.

[0097] The connecting element 400 has a corresponding contact pad 410-1, 410-2, below each of the contact elements 406, 407. The explanations disclosed herein regarding further embodiments of the connecting element apply analogously to the connecting element 400.

[0098] On its underside 405, the connecting element 400 has a second electrically conductive ground plane 415, which is coupled to the ground contact element 410-3. With multiple ground contact elements, the ground plane 415 can be coupled to all of them.

[0099] Fig. Figure 5 shows a schematic view of an electrical circuit 518. The electrical circuit 518 comprises: a first electrical component 519 and a second electrical component 520, wherein several first electrical components and several second electrical components are possible. Furthermore, the electrical circuit 518 comprises an electrical connecting element 500, wherein several connecting elements are possible. The first component 519 and the second component 520 each have on a first side, the top side of which, a signal line 521-1, 521-2 is coupled at one end to one of the contact elements of the at least one electrical connecting element 500, which for clarity are not separately designated with reference numerals.

[0100] The electrical connecting element 500 can be an electrical connecting element according to any of the embodiments shown herein. An electrical circuit with an electrical connecting element, as shown in Fig. As shown in 4, it is discussed below in connection with Fig. 6 explained.

[0101] The connection between the ends of the signal lines 521-1, 521-2 and the contact elements can be made in various ways. Besides the gluing mentioned above, the connection can also be made by soldering, for example.

[0102] Fig. Figure 6 shows a schematic view of an electrical circuit 618. The electrical circuit 618 is based on the electrical circuit 518. Therefore, the electrical circuit 618 comprises: a first electrical component 619 and a second electrical component 620, with the possibility of multiple first electrical components and multiple second electrical components. Furthermore, the electrical circuit 618 comprises an electrical connecting element 600, with the possibility of multiple connecting elements. The reference numerals of the connecting element 600 are not shown for clarity. The connecting element 600 is a connecting element as described in Figure 518. Fig. Figure 4 shows that any other embodiment of the connecting element shown herein can be used. The first component 619 and the second component 620 each have a signal line 621-1, 621-2 on a first side, the upper side of which is coupled at one end to one of the contact pads of the electrical connecting element 600.

[0103] The connecting element 600 of the electrical circuit 618 has the first ground plane and the second ground plane, as shown in Fig. 4 shown. Furthermore, the connecting element 600 has the contact pads for coupling to the via elements and the ground via elements.

[0104] The electrical components 619, 620 each have a first ground plane 625-1, 625-2 on their first side, the top side. Furthermore, the electrical components 619, 620 each have a second ground plane 626-1, 626-2 on their second side, the bottom side. The first ground plane 625-1, 625-2 is coupled to the second ground plane 626-1, 626-2 by means of ground through-hole components 627-1, 627-2, 627-3, 627-4.

[0105] Although not explicitly shown or apparent, the ground planes 626-1, 626-2 can enclose or surround the signal lines 621-1, 621-2. This is shown, for example, in the top view of the Fig. 9 is visible.

[0106] Fig. Figure 7 shows an exploded view of an electrical connector 700. The connector 700 has a carrier substrate 701. A conductor element 703 and a first ground plane 712 are arranged on the top side of the carrier substrate 701. A second ground plane 715 is arranged on the bottom side of the carrier substrate 701. The carrier substrate 701 has two vias 708-1, 708-2, each coupled to one end of the conductor element 703 and coupling the corresponding end to a contact pad 710-1, 710-2, which is arranged on the bottom side of the carrier substrate 701. A plurality of ground vias 713 are also arranged in the carrier substrate 701, which electrically couple the first ground plane 712 to the second ground plane 715.

[0107] The second ground plane 715 also has a recess around each of the contact pads 710-1 and 710-2. The recess is open towards the edge of the substrate 701 and the second ground plane 715, respectively. This is the area where a coaxial interface is present on each of the electrical components, or where the signal line transitions into the coaxial interface. Distributed around the circumference of the recess, the second ground plane 715 has four contact pads 710-3, which serve to connect the second ground plane 715 to a corresponding first ground plane on one of the electrical components. A corresponding ground connection element 713 is provided for each of the contact pads 710-3.

[0108] The four contact pads 710-3 for grounding are merely an example. More or fewer contact pads for grounding can be provided. The arrangement consisting of a via element 708-1, 708-2 with corresponding ground via elements 713 forms a so-called quasi-coaxial interface.

[0109] The second ground plane 715 of the connecting element 700 has circular or semicircular recesses below each end of the signal line 703. The recesses therefore have a circular arc circumference. The radius of the circle can be, for example, between 70 µm and 150 µm, in particular 80 µm, 90 µm, 100 µm, 110 µm, 113 µm, 114 µm, 115 µm, 120 µm, 130 µm or 140 µm.

[0110] In other embodiments, the recess can have a different shape, e.g. an oval shape, or a rectangular shape.

[0111] Fig. Figure 8 shows a schematic top view of an electrical connector 800. The connector 800 is based on the connector 700. Therefore, the connector 800 has a carrier substrate. A conductor 803 and a first ground plane 812 are arranged on the top side of the carrier substrate. A second ground plane 815 is arranged on the bottom side of the carrier substrate. The carrier substrate has two vias 808-1, 808-2, each coupled to one end of the conductor 803 and coupling the corresponding end to a contact pad located on the bottom side of the carrier substrate. A plurality of ground vias 813 are also arranged in the carrier substrate, electrically coupling the first ground plane 812 to the second ground plane 815.

[0112] In the connecting element 800, the grounding contacts 813 are arranged on both sides next to the conductor element 803 and, so to speak, frame it. It is understood that more conductor elements 803 and grounding contacts 813 than shown can be provided.

[0113] In the top view of the connecting element 800, the arc-shaped recesses in the second ground plane 815 at both ends of the conductor element 803 are visible, open to the outside. Furthermore, it can be seen how four ground connection elements 813 are arranged around each recess, forming a quasi-coaxial interface. There may also be more or fewer than four ground connection elements 813.

[0114] The recess can be designed in such a way that no ground plane or grounding vias are placed over a signal line of an electrical component. This could negatively affect the signal quality in the signal line, especially its impedance.

[0115] The connecting element 800 is designed, by way of example, to bridge a gap of approximately 500 µm between the two ends of the signal lines of two electrical components. It goes without saying that other lengths are also possible.

[0116] Fig. Figure 9 shows a schematic view of an electrical component 919 in a transparent top view. The electrical component 919 can be used, for example, with any embodiment of an electrical connecting element shown herein, such as the connecting element of the Fig. 8.

[0117] The electrical component 919 has a support substrate 934, which can be, for example, a ceramic substrate. A signal line 921 is arranged on the top side of the support substrate 934 and is surrounded by a first ground plane 925. The first ground plane 925 is coupled to a second ground plane on the underside of the support substrate 934 via ground through-holes 927.

[0118] At the end of signal line 921, the signal line 921 transitions into a coaxial interface. The coaxial interface has a circular recess in the first ground plane 925. Furthermore, the coaxial interface has a matching network consisting of a tapered section and a circular contact.

[0119] It is understood that the electrical component 919 may have further elements, not explicitly shown here, which may in particular be coupled to the signal line 921 in order to process electrical signals in the electrical component 919, i.e. e.g. to generate or receive them.

[0120] It is understood that all dimensions given herein are merely exemplary and describe embodiments in which an impedance of 50 Ω was used as the target for the calculations and dimensions. Different dimensions may result for other impedances or materials.

[0121] The processes, methods, or algorithms disclosed herein may be transferred to or implemented by a computing unit, controller, or computer. These may include any existing programmable electronic control unit or dedicated electronic control unit. Likewise, the processes, methods, or algorithms may be stored as data and instructions that can be executed by a controller or computer in many forms, including, but not limited to, information permanently stored on non-writable storage media such as ROM devices, and information modifiably stored on writable storage media such as floppy disks, magnetic tapes, CDs, RAM memory, and other magnetic and optical media. The processes, methods, or algorithms may also be implemented in a software-executable object.Alternatively, the processes, methods or algorithms can be embedded wholly or partially in suitable hardware components such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), state machines, controllers or other hardware components or devices, or a combination of hardware, software and firmware components.

[0122] Although exemplary embodiments are described above, it is understood that these embodiments do not encompass all possible forms of implementation of the present disclosure covered by the claims. The terms used in the specification serve to describe, not to limit, the invention, and it is understood that various modifications may be made without departing from the spirit and scope of the disclosure. As previously described, the features of different embodiments may be combined to form further embodiments of the invention that may not be explicitly described or illustrated.While various embodiments may be described as advantageous or preferred over other embodiments or implementations of the prior art with respect to one or more desired properties, those skilled in the art recognize that one or more properties or characteristics may be modified to favor desired overall system properties, depending on the specific application and implementation. These properties may include, but are not limited to, cost, strength, durability, life-cycle costs, marketability, appearance, packaging, size, ease of maintenance, weight, manufacturability, ease of assembly.Therefore, insofar as embodiments have been described as less desirable than other embodiments or implementations of the prior art with regard to certain properties, these embodiments nevertheless fall within the scope of disclosure and may be desirable for certain applications.

[0123] With regard to the processes, systems, methods, heuristics, etc., described herein, it is understood that, although the steps of such processes, etc., have been described in a specific order, such processes may also be carried out in a different order than that described here. Likewise, it is understood that certain steps may be performed simultaneously, that other steps may be added, or that certain steps described herein may be omitted. In other words, the descriptions of the processes herein serve to illustrate certain embodiments and should in no way be interpreted as limiting the claims.

[0124] In summary, it is understood that the disclosed subject matter can be modified and varied without leaving the scope of the present disclosure.

[0125] All terms used in the claims are intended to retain their broadest reasonable interpretations and their general meanings as understood by those familiar with the technologies described herein, unless expressly stated otherwise. In particular, the use of singular articles such as "a", "the", "said", etc., should be read as including one or more of the specified elements, unless a claim expressly excludes the contrary. REFERENCE MARK LIST 100, 200, 300, 400, 500, 600, 700, 800 electrical connector 101, 201, 301, 401, 701 Carrier substrate 102, 202, 302, 402 Contact element network 103, 203, 303, 403, 703, 803 Conductor element 104, 204, 304, 404 first page 105, 205, 305, 405 second page 106, 206, 306, 406 first contact element 107, 207, 307, 407 second contact element 108-1, 108-2, 208-1, 208-2, 308-1, 308-2 Through-hole plating element 408-1, 408-2, 708-1, 708-2, 808-1, 808-2 through-hole plating 210-1, 210-2, 310-1, 310-2, 310-3 contact pad 410-1, 410-2, 410-3, 710-1, 710-2, 710-3 contact pad 312, 412, 712, 812, 912 first mass surface 313, 413, 713, 813, 913 Grounding via element 415, 715, 815 second mass surface 518, 618 electrical circuit 519, 619, 919 first electrical component 520, 620 second electrical component 521-1, 521-2, 621-1, 621-2, 921 Signal line 625-1, 625-2, 925 first mass surface 626-1, 626-2 second mass surface 627-1, 627-2, 627-3, 627-4, 927 Grounding via element 830 Exclusion 934 Carrier substrate 935 Adaptation network 936 Exclusion

Claims

Electrical connecting element (100, 200, 300, 400, 500, 600, 700, 800) for transmitting electrical signals between electrical components (519, 619, 520, 620, 919), wherein the electrical connecting element (100, 200, 300, 400, 500, 600, 700, 800) comprises: a planar carrier substrate (101, 201, 301, 401, 701); at least one contact element network (102, 202, 302, 402) each comprising a conductor element (103, 203, 303, 403, 703, 803) which is located on a first side (104, 204, 304, 404) of the carrier substrate (101, 201, 301, 401, 701);at least one first contact element (106, 206, 306, 406) and at least one second contact element (107, 207, 307, 407) for each of the contact element networks (102, 202, 302, 402), wherein the contact elements (106, 206, 306, 406, 107, 207, 307, 407) are arranged on a second side (105, 205, 305, 405) of the support substrate (101, 201, 301, 401, 701), the second side (105, 205, 305, 405) being opposite the first side (104, 204, 304, 404);and a through-hole component (108-1, 108-2, 208-1, 208-2, 308-1, 308-2, 408-1, 408-2, 708-1, 708-2, 808-1, 808-2) for each of the contact elements (106, 206, 306, 406, 107, 207, 307, 407), wherein the through-hole component (108-1, 108-2, 208-1, 208-2, 308-1, 308-2, 408-1, 408-2, 708-1, 708-2, 808-1, 808-2) is formed, the respective contact element (106, 206, 306, 406, 107, 207, 307, 407) to electrically contact the respective conductor element (103, 203, 303, 403, 703, 803) through the carrier substrate (101, 201, 301, 401, 701). Electrical connecting element (100, 200, 300, 400, 500, 600, 700, 800) according to claim 1, wherein the contact elements (106, 206, 306, 406, 107, 207, 307, 407) each have a contact pad (210-1, 210-2, 310-1, 310-2, 310-3, 410-1, 410-2, 410-3, 710-1, 710-2, 710-3) rising from the second side (105, 205, 305, 405) of the carrier substrate (101, 201, 301, 401, 701), which in particular is an electrically conductive metal, in particular Gold, exhibits. Electrical connecting element (100, 200, 300, 400, 500, 600, 700, 800) according to one of the preceding claims, further comprising a first electrically conductive ground plane (312, 412, 712, 812) which is arranged on the first side (104, 204, 304, 404) of the carrier substrate (101, 201, 301, 401, 701) such that it surrounds the at least one conducting element (103, 203, 303, 403, 703, 803). Electrical connecting element (100, 200, 300, 400, 500, 600, 700, 800) according to claim 3, further comprising at least one ground contact element on the second side (105, 205, 305, 405) of the carrier substrate (101, 201, 301, 401, 701) and a ground through-hole element (313, 413, 713, 813, 913) for each of the ground contact elements; wherein the ground through-hole elements (313, 413, 713, 813, 913) are each configured to electrically connect the first ground plane (312, 412, 712, 812) to the respective ground contact element. Electrical connecting element (100, 200, 300, 400, 500, 600, 700, 800) according to claim 4, wherein the ground contact elements each have a contact pad (210-1, 210-2, 310-1, 310-2, 310-3, 410-1, 410-2, 410-3, 710-1, 710-2, 710-3) rising from the second side (105, 205, 305, 405) of the carrier substrate (101, 201, 301, 401, 701), which in particular comprises an electrically conductive metal, in particular gold. Electrical connecting element (100, 200, 300, 400, 500, 600, 700, 800) according to one of claims 4 and 5, further comprising a second electrically conductive ground plane (415, 715, 815) which is arranged on the second side (105, 205, 305, 405) of the carrier substrate (101, 201, 301, 401, 701) and is electrically coupled to the ground contact elements. Electrical connecting element (100, 200, 300, 400, 500, 600, 700, 800) according to any one of the preceding claims 3 to 6, wherein a thickness of the support substrate (101, 201, 301, 401, 701) and a width of the conductor element (103, 203, 303, 403, 703, 803) and a distance between the conductor element (103, 203, 303, 403, 703, 803) and the first ground plane (312, 412, 712, 812) are dimensioned such that the electrical connecting element (100, 200, 300, 400, 500, 600, 700, 800) has a predetermined exhibits impedance. Electrical connecting element (100, 200, 300, 400, 500, 600, 700, 800) according to the preceding claims 6 and 7, wherein a distance between the at least one first contact element (106, 206, 306, 406) of a corresponding contact element network (102, 202, 302, 402) and the second ground plane (415, 715, 815) is selected such that the electrical connecting element (100, 200, 300, 400, 500, 600, 700, 800) has a predetermined impedance; and / or wherein a distance between the at least one second contact element (107, 207, 307, 407) of a corresponding contact element network (102, 202, 302, 402) and the second ground plane (415, 715, 815) is selected such that the electrical connecting element (100, 200, 300, 400, 500, 600, 700, 800) has the specified impedance. Electrical connecting element (100, 200, 300, 400, 500, 600, 700, 800) according to the preceding claims, wherein the support substrate (101, 201, 301, 401, 701) comprises a flexible substrate, in particular a polymer, in particular a liquid crystal polymer or a polyimide. Electrical circuit (518, 618) comprising: at least one first electrical component (519, 619) and at least one second electrical component (520, 620); and at least one electrical connecting element (100, 200, 300, 400, 500, 600, 700, 800) according to one of the preceding claims; wherein the at least one first component (519, 619) and the at least one second component (520, 620) each have on a first side a signal line (521-1, 521-2, 621-1, 621-2, 921) which is coupled at one end to one of the contact elements (106, 206, 306, 406, 107, 207, 307, 407) of the at least one electrical connecting element (100, 200, 300, 400, 500, 600, 700, 800). Electrical circuit (518, 618) according to claim 10, wherein the signal line (521-1, 521-2, 621-1, 621-2, 921) of the at least one first component (519, 619) and the signal line (521-1, 521-2, 621-1, 621-2, 921) of the at least one second component (520, 620) each have a contact pad (210-1, 210-2, 310-1, 310-2) rising from the component (519, 619, 520, 620, 919) at their end coupled with a corresponding contact element (106, 206, 306, 406, 107, 207, 307, 407) at their respective ends. 310-3, 410-1, 410-2, 410-3, 710-1, 710-2, 710-3) which in particular comprises an electrically conductive metal, especially gold. Electrical circuit (518, 618) according to one of the preceding claims 10 and 11, wherein at least one first electrical component (519, 619) or at least one second electrical component (520, 620) has a first ground plane (625-1, 625-2, 925) on the first side; or wherein at least one first and at least one second electrical component (519, 619, 520, 620, 919) each have a first ground plane (625-1, 625-2, 925) on the first side. Electrical circuit (518, 618) according to claim 12, wherein at least one of the first ground planes (625-1, 625-2, 925) has at least one contact pad (210-1, 210-2, 310-1, 310-2, 310-3, 410-1, 410-2, 410-3, 710-1, 710-2, 710-3) rising from the first side, which in particular comprises an electrically conductive metal, in particular gold. Electrical circuit (518, 618) according to one of the preceding claims 12 and 13, wherein the thickness of the electrical component (519, 619, 520, 620, 919) and the distance between the first ground plane (625-1, 625-2, 925) and the signal line (521-1, 521-2, 621-1, 621-2, 921) of the respective electrical component (519, 619, 520, 620, 919) are dimensioned such that the signal path from the first electrical component (519, 619), electrical connecting element (100, 200, 300, 400, 500, 600, 700, 800) and second electrical component (520, 620) has a predetermined exhibits impedance. Electrical circuit (518, 618) according to one of the preceding claims 12 to 14, wherein the at least one first electrical component (519, 619) or the at least one second electrical component (520, 620) or the at least one first and the at least one second electrical component (519, 619, 520, 620, 919) furthermore each have a second electrically conductive ground plane (626-1, 626-2) which is arranged on a second side of the respective electrical component, the second side being opposite the first side; wherein, in particular, ground connection elements (627-1, 627-2, 627-3, 627-4, 927) are provided which electrically couple the first ground plane (625-1, 625-2, 925) with the second ground plane (626-1, 626-2). Electrical circuit (518, 618) according to one of the preceding claims 10 to 15, wherein at least one first electrical component (519, 619) or at least one second electrical component (520, 620) has an matching network (935) at the end of the signal line (521-1, 521-2, 621-1, 621-2, 921) coupled with a corresponding contact element (106, 206, 306, 406, 107, 207, 307, 407); or wherein at least one first and at least one second electrical component (519, 619, 520, 620, 919) each have an matching network (935) at their end of the signal line (521-1, 521-2, 621-1, 621-2, 921) coupled with a corresponding contact element (106, 206, 306, 406, 107, 207, 307, 407). Electrical circuit (518, 618) according to claim 12 and none or at least one of the preceding claims 13 to 15, wherein the first ground plane (625-1, 625-2, 925) of at least one electrical component (519, 619, 520, 620, 919) at the end of the signal line (521-1, 521-2, 621-1, 621-2, 921) coupled with a via element (108-1, 108-2, 208-1, 208-2, 308-1, 308-2, 408-1, 408-2, 708-1, 708-2, 808-1, 808-2) has a recess (830) which recesses a predetermined area around the respective end to provide a to form a coaxial interface.

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