Connection of a sensor chip to a measuring object

Abstract

The invention relates to a method for the material-to-material connection of components (105, 110, 115, 120), comprising the steps of (1000) providing a first component (105), a second component (110), a third component (115) and a connecting foil (200) having a plurality of connecting sections (205) and a reaction section (210) connecting the connecting sections (205) to one another, wherein the connecting foil (200) contains metallic materials which react exothermically when activated, (2000) placing the connecting foil (200) on the first component (105), (3000) arranging the second and third components (110, 115) on the connecting foil (200) such that a first connecting section (205) is formed between the first component (205) and the second component (110), and a second connecting section (205) is formed between the first component (105) and the third component (115),and (4000) activating the metallic materials of the connecting foil (200) via an activating agent (135) bonded to the reaction section (210), so that the connecting foil (200) heats up such that the first component (105) is bonded to the second component (110) and the third component (115) in a materially bonded manner. Furthermore, the invention relates to an arrangement (100) of a second component (110) and a third component (115) on a first component (105), wherein the second and third components (110, 115) have been bonded by such a method.

Description

[0001] The invention relates to a connection of a first component to a second and third component. In this context, a method for attaching the second and third components to the first component and an arrangement of the second and third components on the first component are particularly claimed. The invention is particularly suitable for applications in which the first component is a measurement object and the second and third components are designed as a chip or a sensor chip.

[0002] DE 10 2021 208 761 A1 discloses a method for connecting a sensor chip to a measurement object. According to this method, a measurement object, a sensor chip, and a connecting foil are provided, wherein the connecting foil contains metallic materials that react exothermically when activated. The connecting foil is then placed between the sensor chip and the measurement object. The metallic materials of the connecting foil are then activated, causing the connecting foil to heat up to such an extent that the sensor chip is bonded to the measurement object.

[0003] The object of the present invention is to provide a method for joining a first component to a second and third component that requires fewer ignition sources and is suitable for component joints with hard-to-reach joining surfaces. The invention achieves this object by means of the subject matter of the independent claims. Subordinate claims specify preferred embodiments.

[0004] The present invention proposes a reactive foil soldering process for obtaining a particularly intermetallic bond between components. The joining process is based on the use of a reactive multilayer foil as a local heat source. The foil consists of a new class of nanotechnological material in which self-propagating exothermic reactions can be triggered at room temperature by an ignition process. By inserting such a foil, for example, between two components, the heat generated by the reaction in the foil melts the foil, so that the bond is completed in approximately one second at room temperature. The heat induced during the reaction is very low due to the fast reaction rate (e.g., 10 m / s) and the low material thickness (e.g., <100 µm).

[0005] In this sense, according to a first aspect of the invention, a method for the material-to-material connection of components is proposed. In a step (1000), a first component, a second component, a third component, and a connecting foil having a plurality of connecting sections and a reaction section connecting the connecting sections to one another are provided, wherein the connecting foil contains metallic materials that react exothermically when activated. In a step (2000), the connecting foil is placed on the first component. In a step (3000), the second and third components are arranged on the connecting foil, such that a first connecting section is arranged between the first component and the second component, and a second connecting section is arranged between the first component and the third component.In a step (4000), the metallic materials of the connecting foil are activated via an activating agent bonded to the reaction section, so that the connecting foil is heated in such a way that the first component is bonded to the second component and the third component in a material-to-material manner.

[0006] The first component can be a measurement object, and the second and / or third component can be configured as a sensor chip, wherein the sensor chip is configured to detect a physical property of the measurement object. The first component is understood as a carrier for the other components.

[0007] A connecting foil, for example, can be a so-called NanoFoil® from the Indium Corporation. The NanoFoil® is a reactive multilayer foil produced by vapor-depositing thousands of alternating nanoscale layers of aluminum and nickel. When activated by a small pulse of localized energy from electrical, optical, or thermal sources, the foil reacts exothermically to generate precise localized heat up to temperatures of 1500 °C in a fraction of a second.

[0008] With the method proposed here, multiple adhesive surfaces can be created in order to join two or more components to the first component in a single step. The bonded connection between the first component and all other components to be joined to the first component via the connecting film is triggered and created using a single activating agent or ignition source. Thus, the bonded connection is created in a single activation step. Conversely, each component does not have to be joined to another component separately, i.e., with a separate connecting film and a separate activating agent. This results in advantages in terms of the production process, manufacturing time, and manufacturing costs.This also means that the joining process can be carried out largely independently of the geometry of the components to be joined, because the ignition source and the respective joining surface between the first component and the other component can be spatially separated from each other.

[0009] The reaction section of the connecting foil connects the connecting sections to one another regardless of their number, the shape, geometry and structure of the reaction section being selected such that all connections between the first component and the further components can be created in a single step. The reaction section can have a plurality of strip sections which connect the ignition source to the connecting sections via intersections, branches, ramifications or the like. The reaction section therefore preferably comprises intersections and / or branches. A first strip of the reaction section can be divided into a plurality of further strips, the energy in the first strip being able to be transferred to the further strips essentially without loss. The reaction section of the connecting foil can be net-shaped or tree-shaped with main arms and secondary arms which are connected via intersections or branches.Branches are connected to each other. A main branch can be divided into two or more secondary branches in order to divide the reaction section into several connecting sections.

[0010] Following step (4000), the reaction section can be ablated or removed in a step (5000), leaving no structural or conductive connection between the finished joints where the connecting sections were previously. After step (4000), all subsequent components are connected to the first component. The removal of the reaction section can be achieved, for example, by etching.

[0011] Of course, the method can also be carried out with more than three components, with the connecting foil being designed depending on the number of components to be connected to the first component. Accordingly, steps (1000) to (3000) can be extended as desired with additional components, with each additional component arranged on the connecting foil providing a further connection section between the first component and the respective subsequent component. The reaction section is geometrically adapted accordingly so that, similar to controlled explosions, a precisely defined activation sequence is maintained to ensure that each connection can be reliably established.

[0012] Steps (2000) and (3000) can be carried out or combined such that the connecting film, in a sandwich configuration, either directly abuts the facing surfaces of the first and second or third components. Accordingly, in step (4000), the material of the first component and / or the second component can be locally melted or partially melted, resulting in direct welding.

[0013] Alternatively, steps (2000) and (3000) can be carried out or combined such that the connecting foil is arranged in a sandwich configuration between two solder layers, wherein the solder layers are applied to mutually facing surfaces of the first and second or third components or to the corresponding connecting sections of the connecting foil. These surfaces are, in particular, flat surfaces that can be brought into contact with one another in order to subsequently be joined in a materially bonded manner. If a solder layer is arranged between the connecting section and the respective component, the two components are soldered together in step (4000). Accordingly, the first component can be soldered to the second component or the third component by melting solder layers or other adhesion promoter layers.

[0014] In this sense, according to one embodiment, a first adhesion promoter layer is applied to the first component in a step (1300) prior to step (2000), wherein the connecting film is placed on the first component in step (2000) such that the first adhesion promoter layer is arranged between the first component and the first connecting section and the second connecting section. Alternatively, a first adhesion promoter layer is applied to the first connecting section and to the second connecting section prior to step (2000) in a step (1300). The adhesion promoter layer serves to improve the adhesion between the materials of the components to be joined. It is generally applied to the surface of the components to be joined.

[0015] Preferably, the metallic materials of the connecting foil are activated in step (4000), so that the connecting foil heats up to such an extent that the first adhesion promoter layer melts, and the first component is bonded to the second component and the third component by the molten first adhesion promoter layer. The first adhesion promoter layer is preferably a first solder layer. Accordingly, the connecting foil heats up to such an extent during activation that the first adhesion promoter layer melts, and the first component is soldered to the second component and the third component by the molten first adhesion promoter layer.

[0016] Alternatively or additionally, before step (3000), in a step (1500), a second adhesion promoter layer is applied to the second component and the third component, wherein the second and third components are arranged on the connecting film in step (3000), so that a second adhesion promoter layer is arranged between the first connecting section and the second component, as well as between the second connecting section and the third component. Furthermore, alternatively, before step (3000), in a step (1500), a second adhesion promoter layer is applied to the first connecting section and the second connecting section, respectively.

[0017] Preferably, the metallic materials of the connecting foil are activated in step (4000) such that the connecting foil heats up such that the second adhesion promoter layer melts, and the first component is integrally bonded to the second component and the third component by the molten second adhesion promoter layer. The second adhesion promoter layer is preferably a second solder layer, so that upon activation, the connecting foil heats up such that the second adhesion promoter layer melts, and the first component is soldered to the second component and the third component by the molten second adhesion promoter layer.

[0018] The respective connecting section is to be understood as a joining section which, after step (4000), forms a connecting layer between the first component and the second component or the third component. The reaction section is to be understood as an activation section or reactive part of the connecting foil, wherein the activating agent is applied at a defined location in the reaction section at which the metallic material of the connecting foil can be initially activated. The reactive part of the connecting foil is only required to provide energy for activating the connecting section. If further layers, such as adhesion promoter layers or solder layers, are provided between the connecting section and the respective component, the reaction section is dimensioned such that sufficient activation energy is provided for melting the further layer or layers.

[0019] The reaction of the metallic material of the connecting foil spreads along the reaction section until it reaches the connecting sections, where the metallic material is activated to create the bonded connection between the two components. Each connecting section is dimensioned such that the activated connecting foil bonds the first component to the second or third component via the bonding layer defined by the connecting section. The reaction section of the connecting foil lies outside the joining surface defined by the bonding layer between the first component and the second or third component.

[0020] In its simplest form, the connecting film has a substantially constant layer thickness over its entire surface. In other words, the connecting sections and the reaction section that integrally connects the connecting sections have the same thickness. However, it is conceivable for the connecting section of the connecting film to have a first layer thickness and the reaction section to have a second layer thickness that is different from the first layer thickness. In other words, the connecting film can be designed with a variable thickness. The reaction section is preferably thinner than the connecting sections. This makes it possible to save material in the connecting film because the reaction section needs to be just thick enough to transfer enough energy to activate the respective connecting section.In contrast, the respective connecting section can be made thicker in order to provide sufficient energy for the exothermic reaction of the metallic material of the connecting foil during activation in step (4000), in particular if adhesion promoter layers are provided.

[0021] The metallic materials of the connecting foil can be activated, for example, by ignition using the activating agent. The process requires no special heat, no vacuum, and no gas atmosphere. The connecting foil can be ignited, for example, using a commercially available 9V battery, whereby the battery is connected to the connecting foil via the respective activating agent. The activating agent can comprise wires, for example a positive pole and a negative pole, with a potential difference existing between the poles. The wires can be formed and handled separately. Alternatively, the two wires can be combined at their ends to form a type of plug in order to maintain a defined distance between the wires or to ensure that this distance is not exceeded. The activating agent can also be or comprise a voltage source, in particular a battery, or a heat needle.

[0022] During the process, no high pressures or high temperatures need to be applied to the components. Strong electromagnetic fields are also eliminated. The metallic bonding layer between the components created by activating the metallic materials of the bonding foil exhibits particularly high dimensional stability as well as high thermal and electrical conductivity. Furthermore, the manufacturing process and bonding process are simplified, enabling particularly cost-effective production.

[0023] The inventive method is characterized by lower temperatures and stresses during joining. These lower stresses induce less prestress in the components. Furthermore, the low temperatures and low pressure enable a wider range of materials, such as polymers. The bond between the components created by the inventive method does not age over time or with temperature. Steam, pressure, or the like do not cause any changes in the bond parameters. The composite material is particularly resistant to moisture, chemicals, high / low temperatures, and rapid temperature changes. The bond therefore does not change its parameters, especially due to temperature, humidity, pressure, or the like. The composite material also offers elastic deformation for repeatability.

[0024] Advantageously, the electrical connection between the activating agent and the connecting foil can be made with the same device with which the second and third components are placed on the first component and the pressure is exerted for the material connection.

[0025] If solder layers are intended as adhesion promoters, they can be made of copper, gold, palladium, or nickel, for example. These materials can be applied as metallic starter layers, particularly advantageously using plasma processes, sputtering, or vapor deposition. Further options include two-shot injection molding, additive manufacturing, etc.

[0026] The connecting foil can be formed particularly precisely and efficiently to the desired dimensions by laser cutting and placed between the two surfaces. The structure and geometry of the connecting foil can be created after the connecting foil has been applied to the first component. Laser cutting takes place, in particular, before step (3000).

[0027] To prevent unforeseeable deformation of the bond between the first and second components or between the first and third components, a fixing pad can be placed on the layers with low pressure. In this sense, deformation of the connecting foil and optional solder layers during activation and material bonding in step (4000) is preferably counteracted by means of a fixing pad that exerts pressure on the first component and / or the second and third components. The pressure is so low that it does not lead to any stresses within the components that could impair the strength of the bond or the measurement accuracy.

[0028] According to a second aspect of the invention, an arrangement of a second component and a third component on a first component is provided, wherein the second and third components have been connected to the first component by a method according to the first aspect of the invention. The first component can be significantly larger than the second component and / or the third component. The first component can be a measurement object or a carrier component, wherein the second and third components are each designed as a chip, in particular as a sensor chip, wherein the respective sensor chip is configured to detect a physical property of the measurement object. The measurement object can be, for example, an axle or a shaft for an engine or a transmission of a motor vehicle or a robot arm segment for a robot. The sensor chip can in particular be configured to measure a deformation, an extension, a force and / or a torque.which is generated by the measuring object, in particular by the axle, the motor shaft or the gear shaft.

[0029] To the extent that elements are designated by means of a numbering, for example “second component”, “third component” and “further component”, this numbering or designation is intended purely for differentiation in the designation and does not represent any dependency of the elements on one another or a mandatory sequence of the elements. This means in particular that a device does not have to have a “second component” in order to have a “third component”, and vice versa.

[0030] The arrangement may also comprise a “third component” and a “fourth component”, but without necessarily having a “second component”.

[0031] The invention will now be described in more detail with reference to the accompanying figures, in which: Fig. 1 a plan view of an inventive arrangement of a first component on a second component according to a preferred embodiment; Fig. 2 a longitudinal section of a section of the arrangement according to the invention according to Fig. 1 to illustrate a layer structure; Fig. 3 an exploded view of layers and tools for connecting a first component to a second component and a third component by means of the connecting film, as well as the arrangement resulting from the connection; Fig. 4 is a block diagram illustrating a sequence of a method according to the invention for connecting a first component to a second component and a third component; and Fig. 5 a greatly enlarged cross-sectional view of the connecting foil for the arrangement according to Fig. 1, Fig. 2 or Fig. 5;, wherein identical or similar elements are provided with the same reference numerals.

[0032] Fig. 1 and Fig. 2 shows an arrangement 100 in which a first component 105 as a carrier plate or measurement object is materially connected to several further components 110, 115, 120, wherein the further components 110, 115, 120 can be, for example, chips, in particular sensor chips, or the like. By means of the respective sensor chip, a physical property of the first component 105 can be detected. The second component 110, the third component 115 and all further components 120 are connected by a method which takes into account Fig. 4, is integrally connected to the first component 100. The first component 105 is significantly larger than the other components 110, 115, and 120.

[0033] According to Fig. 1, ten additional components 110, 115, 120 are arranged on the first component 105 and thus integrally connected. The distinction between "second component," "third component," and "further component" is made here solely to clarify that this method can be advantageously used for arrangements in which the additional components 110, 115, 120, in particular the joining surfaces to the first component 105, are either difficult to access and / or all additional components 110, 115, 120 are to be connected to the first component 105 in a single activation step.

[0034] After Fig. 2 shows a state of the arrangement 100 before the material connection between the first component 105 and the further components 110, 115, 120 is created. For easier illustration and explanation, Fig. 2 shows only an example of a connection area between the first component 105 and the second component 110. The above statements apply equally and analogously to the connection areas between the first component 105 and the second component 115, as well as the other components 120.

[0035] A connecting foil 200 is provided to realize a firm, at least materially bonded connection of the first component 105 with the further components 110, 115, 120 arranged thereon. The connecting foil 200 is a so-called NanoFoil®, i.e., a reactive multilayer foil produced by vapor deposition of thousands of alternating nanoscale layers of aluminum 202 and nickel 203. A greatly enlarged cross-sectional view of the connecting foil 200 with the aluminum and nickel layers 202, 203 is shown in Fig. 5. When the connecting foil 200 is activated by a small pulse of local energy from electrical, optical, or thermal sources, it reacts exothermically to generate precise local heat up to temperatures of 1500°C in fractions of a second. The aluminum and nickel layers 202, 203 are to be understood as metallic materials of the connecting foil 200 within the meaning of the invention.

[0036] In a first method step 1000 of the method according to the invention, the components 105, 110, 115, 120 and the connecting film 200 are first provided. The connecting film 200 has a number of connecting sections 205 corresponding to the number of components 110, 115, 120 to be fastened to the first component 105, which form the joining area between the first component 105 and the further component 110, 115, 120. The support or joining surface of the connecting section 205 is selected such that the further component 110, 115, 120 completely covers the associated connecting section 205.

[0037] The connecting sections 205 are integrally connected to a reaction section 210 of the connecting foil 200, wherein the reaction section 210 is arranged according to the plan view according to Fig. 1 is ring-shaped and has intersections 125 and branches 130 for branching the reaction section 210 to the connecting sections 205. An activating agent 135 is connected to the reaction section 210, wherein the connection point of the activating agent 135 to the reaction section 210 is to be understood as the activation point 140 of the connecting film 200. The activating agent 135 comprises Fig. 3 a battery 300, which provides an ignition source for electrical current to activate the metallic materials of the connecting foil 200 and introduces it at the activation point 140. The reaction section 210 is to be understood as a distribution network, wherein electrical energy introduced into the connecting foil 200 at the activation point 140 activates the metallic material of the connecting foil 200, thereby triggering a type of chain reaction that gradually activates all connecting sections 205 at the end of each branch 130 or intersection 125. In this case, the energy is directly divided into two paths to the left and right at the activation point 140. This can shorten the reaction time for establishing the integral connection.

[0038] After Fig. 2 in conjunction with Fig. 3, a first adhesion promoter layer 215 is arranged between the connecting section 205 of the connecting foil 200 and the first component 105. The first adhesion promoter layer 215 is applied in a method step 1300 to the first component 105 or alternatively to a surface of the connecting section 205 facing the first component 105. Furthermore, a second adhesion promoter layer 220 is arranged between the connecting section 205 of the connecting foil 200 and the second component 110. The second adhesion promoter layer 220 is applied in a method step 1500 to the second component 110 or alternatively to a surface of the connecting section 205 facing the second component 110. The adhesion promoter layers 215, 220 are solder layers that comprise tin.

[0039] Depending on the application as well as the design and material of the components 105, 110, 115, 120, the adhesion promoter layers 215, 220 can be omitted, so that process step 1000 can be followed directly by process step 2000, which is illustrated by the dashed arrow between the two process steps 1000, 2000. After process step 2000, the connecting film 200 is placed on the first component 105. In other words, the connecting film 200 is arranged on the surface of the first component 105 and prepared to receive the additional components 110, 115, 120.

[0040] In the subsequent method step 3000, the second component 110, the third component 115, and the further components 120 are arranged on the respective connecting section 205 of the connecting film 200, so that the respective connecting section 205 is arranged between the first component 105 and an associated further component 110, 115, 120. It is conceivable to alternatively perform method step 1500 before method step 3000.

[0041] After steps 2000 and 3000, the connecting foil 200 contacts the first adhesion promoter layer 215 of the first component 205 on one side and the second adhesion promoter layer 220 of the second component 210 on the other side. After method step 3000, the aluminum layers 202 and the nickel layers 203 of the connecting foil 200 are still arranged alternately next to each other, as shown in Fig. 2 and Fig. 5 is shown.

[0042] In method step 4000, a pulse is applied via the battery 300 to the activation point 140 of the reaction section 210. The aluminum and nickel layers 202, 203 of the connecting foil 200 then react strongly exothermically, so that the adhesion promoter layers 215, 220 melt and thus the first component 105 is integrally connected to the other components 110, 115, 120.

[0043] Fig. 2 also shows that the connecting section 205 of the connecting foil 200 has a first layer thickness that is thicker than a second layer thickness of the reaction section 210. The reaction section 210 is designed to be thick enough that sufficient energy is introduced from the activation point 140 into the respective connecting section 205 to initiate the exothermic reaction for the integral connection of the first component 105 to the other components 110, 115, 120. This allows aluminum and nickel to be saved for the production of the connecting foil 200. However, the method can be simplified if the connecting foil 200 has a substantially constant thickness over its entire surface.

[0044] In the left part of the Fig. 3 shows a state in which no material connection has yet been created between the first component 105 and the exemplary second component 105. The right part of the Fig. 3 shows the state after formation of the material connection between the two components 105, 110 to realize the arrangement 100.

[0045] Before being placed between the components 105, 110, 115, 120, the connecting foil 200 is processed by laser cutting such that the connecting foil 200 assumes a shape and dimensions that include, on the one hand, the connecting section 205, which are to be understood as joining sections, and, on the other hand, the reaction section 210. The battery 300 of the activation means 18 is electrically connected to the activation point 140 via wires 305 in this example. After process step 3000, all layers are in the Fig. 3 stacked on top of each other in the order shown on the left. At the beginning of method step 4000, or before, a fixing pad 310 exerts a pressure p via a flexible layer 315 on the stack formed by the first component 105, the connecting film 200, the second component 205 and the two adhesion promoter layers 215, 220. This pressure p is very low and acts perpendicularly on the upper side of the second component 110. The pressure p serves to counteract deformation of the adhesion promoter layers 215, 220 and the connecting film 200 during activation in method step 4000. The activation creates a stable connection layer 325 between the first component 105 and the second component 110, see. Fig. 3, right.

[0046] What is happening here in Fig. 2 and Fig. 3 is shown as an example for the connection between the first and second components 105, 110, in reality for the connection between the first component 105 on the one hand and all other components 110, 115, 120 on the other hand according to Fig.1. The additional components 110, 115, 120 are arranged in a common plane and each rest on the one-piece connecting foil 200. The fixing pad 315 and the flexible layer 320 are designed such that the pressure p is exerted simultaneously and uniformly on all additional components 110, 115, 120 before the activation of the metallic material of the connecting foil 200 takes place in method step 4000 as described above. As a result, after the pulse is introduced at the activation point 140, all of the integral connections are created in a single activation step. The connecting foil 200 is thus heated such that the first component 105 is integrally connected to the second component 110, the third component 115, and each additional component 120, partly simultaneously and / or partly immediately one after the other.Since the reaction speed of the connecting foil is approximately 10 m / s due to its small thickness, the activation and the associated material connection of the first component 105 with the other components 110, 115, 120 is perceived as a simultaneous process.

[0047] An optional method step 5000 may be provided, after which, after activating the metallic material of the connecting foil 200, i.e., after method step 4000, excess material of the reaction section 210 that is not required for the bond between the first component 105 and the further components 110, 115, 120 is removed. This may be necessary, for example, if the assembly 100 is to be freed of contaminants, in particular if the assembly 100 is to be encapsulated and / or assembled in a further manufacturing step. Reference symbol p pressure 100 arrangement 105 first component 110 second component 115 third component 120 Additional component 125 intersection 130 junction 135 activating agents 140 activation point 200 connecting foil 202 aluminum layer 203 nickel layer 205 connecting section 210 Reaction section 215 first adhesion promoter layer 220 second adhesion promoter layer 300 battery 310 wire 315 Fixing pad 320 flexible layer 325 connection layer 1000 process steps 1300 process steps 1500 process steps 2000 process steps 3000 process steps 4000 process steps 5000 process steps QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] DE 10 2021 208 761 A1

[0002]

Claims

[1] Method for the material-locking connection of components (105, 110, 115, 120), comprising the steps (1000) Providing a first component (105), a second component (110), a third component (115) and a connecting foil (200) having a plurality of connecting sections (205) and a reaction section (210) connecting the connecting sections (205) to one another, wherein the connecting foil (200) contains metallic materials which react exothermically when activated, (2000) Placing the connecting foil (200) on the first component (105), (3000) Arranging the second and third components (110, 115) on the connecting film (200) such that a first connecting section (205) is arranged between the first component (205) and the second component (110) and a second connecting section (205) is arranged between the first component (105) and the third component (115), and (4000) Activating the metallic materials of the connecting foil (200) via an activating agent (135) bonded to the reaction section (210), so that the connecting foil (200) heats up in such a way that the first component (105) is bonded to the second component (110) and the third component (115) in a material-to-material manner. [2] Method according to claim 1, wherein prior to step (2000) in a step (1300) a first adhesion promoter layer (215) is applied to the first component (105), wherein the connecting film (200) is placed in step (2000) on the first component (105) such that the first adhesion promoter layer (215) is arranged between the first component (105) and the first connecting section (205) and the second connecting section (205). [3] Method according to claim 1, wherein before step (2000) in a step (1300) a first adhesion promoter layer (215) is applied respectively to the first connecting portion (205) and to the second connecting portion (205). [4] Method according to claim 2 or claim 3, wherein the metallic materials of the connecting foil (200) are activated in step (4000) so that the connecting foil (200) is heated such that the first adhesion promoter layer (215) melts and the first component (105) is integrally connected to the second component (110) and the third component (115) by the melted first adhesion promoter layer (215). [5] Method according to one of claims 1 to 4, wherein before step (3000) in a step (1500) a second adhesion promoter layer (220) is applied to the second component (110) and the third component (115), wherein the second and third components (110, 115) are arranged in step (3000) on the connecting film (200) so that a second adhesion promoter layer (220) is arranged between the first connecting section (205) and the second component (110) and between the second connecting section (205) and the third component (115). [6] Method according to one of claims 1 to 4, wherein before step (3000) in a step (1500) a second adhesion promoter layer (220) is applied to the first connecting section (205) and to the second connecting section (205). [7] Method according to claim 5 or claim 6, wherein the metallic materials of the connecting foil (200) are activated in step (4000) so that the connecting foil (200) is heated such that the second adhesion promoter layer (220) melts and the first component (105) is integrally connected to the second component (110) and the third component (115) by the melted second adhesion promoter layer (220). [8] Method according to one of the preceding claims, wherein the connecting section (205) of the connecting film (200) has a first layer thickness and the reaction section (210) has a second layer thickness different from the first layer thickness. [9] Method according to one of the preceding claims, wherein the reaction section (210) comprises intersections (125) and / or branches (130). [10] Arrangement (100) of a second component (110) and a third component (115) on a first component (105), wherein the second and third components (110, 115) have been connected to the first component (105) by a method according to one of the preceding claims.

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