CUTTING DEVICE AND METHOD FOR REPLACEMENT OF DRESSING PLATES

Abstract

A cutting device and a dressing plate exchanging method are provided which are capable of automatically exchanging a dressing plate without increasing the size of the device. The cutting device (1) comprises: a workpiece cutting unit (4) having a blade (22) for cutting a workpiece (W) held on a holding table (2); a cassette (7, 8) in which a tray (50, 50A) with a dressing plate (32) arranged thereon is arranged in a frame (31, 31A); a loading opening (5) in which the cassette (7, 8) is arranged; and a dressing table (3) which receives the dressing plate (32), wherein the tray (50, 50A) has an opening portion (51) which can be inserted into the dressing table (3).

Description

BACKGROUND OF THE INVENTIONField of the invention

[0001] The present invention relates to a cutting device and a method for exchanging dressing plates. Description of the state of the art

[0002] The sharpening ability of a cutting device blade decreases when the blade cuts a workpiece resting on a holding table. For this reason, the blade is dressed (e.g., sharpened) by grinding the blade against a dressing plate to restore the blade's sharpening ability. Furthermore, the blade is dressed using the dressing plate to adjust the blade shape. Dressing and straightening the blade may be necessary while the blade is cutting a workpiece resting on the holding table. Therefore, a cutting device is known in which a dressing plate is arranged next to a holding table.

[0003] If the dressing plate is arranged next to a holding table, the blade can be dressed by the dressing plate while the workpiece is on the holding table. Thus, the blade can be dressed on the dressing plate while the blade grinds the workpiece (see, for example, Patent Document 1). [Patent documents]

[0004] [Patent Document 1] First unexamined Japanese patent application SUMMARY OF THE INVENTION

[0005] Since one step of cutting workpieces has been automated in recent years using cutting devices, automatic replacement of dressing plates is also required. However, enabling automatic replacement of the dressing plate would require a special transport device for the dressing plate and the like, which would generally increase the size of the cutting device.

[0006] The present invention has been made in light of the circumstances described above, and an object of the invention is to provide a cutting apparatus and a dressing plate exchanging method adapted to automatically exchange a dressing plate without increasing the size of the apparatus.

[0007] To solve the problems described above, the present invention proposes the following: <1> A cutting device according to one aspect of the present invention comprises: a workpiece cutting unit having a blade for cutting a workpiece held on a holding table; a cassette in which a tray with a dressing plate arranged thereon is arranged in a frame; a loading opening in which the cassette is arranged; and a dressing table receiving the dressing plate, the tray having an opening portion insertable into the dressing table. <2> With the cutting device according to <1> The bowl on which the dressing plate is arranged can be stacked on the frame. <3> In the cutting device after <1> or <2> The frame may have a concave section into which the shell can be inserted. <4> In the cutting device after <1> or <2> The frame may have a plurality of support pins that carry the shell. <5> A dressing method according to one aspect of the present invention is a method for replacing a dressing plate according to any one of the points <1> until <4> , wherein the opening portion of the tray on which the dressing plate is arranged is inserted into the dressing table and the dressing plate is arranged on a holding surface of the dressing table.

[0008] According to the present invention, the dressing plate can be replaced automatically without having to increase the size of the device. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a cutting device according to a first embodiment of the present invention. Fig. 2 is a plan view of the cutting device according to the first embodiment. Fig. 3 is a perspective view of a planing table. Fig. 4 is a perspective view showing a workpiece mounted on a frame. Fig. 5 is a perspective view showing a state in which a dressing plate is accommodated in a second cartridge according to the first embodiment. Fig. 6 is a perspective view of a second frame in which a tray with a dressing plate according to the first embodiment is arranged. Fig. 7 is a perspective view of the shell. Fig. 8 is a plan view showing a state in which the dressing plate is arranged in the tray. Fig. 9 is a cross-sectional view of the shell of Fig. 5 along line AA. Fig. 10 is a side view showing the step of placing the dressing plate on the dressing table using a tray. Fig. 11 is a side view showing a step of dressing a blade with the dressing plate. Fig. 12 is a perspective view showing a step of transporting the second cassette to a tray of a loading opening. Fig. 13 is a perspective view showing a step of transporting a first cassette above the second cassette. Fig. 14 is a perspective view showing a step of setting down the dressing plate for temporary storage. Fig. 15 is a perspective view showing a step of holding the tray to the second frame by an arm part. Fig. 16 is a perspective view showing a step of transporting the tray to the dressing table by the arm part. Fig. 17 is a plan view showing a step of determining a dressing area E of the dressing plate. Fig. 18 is a perspective view of a modified example of the shell. Fig. 19 is a perspective view of a modified example of the second frame. Fig. 20 is a perspective view of a recording cassette. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, a cutting device and a dressing plate replacement method according to an embodiment of the present invention will be described with reference to the drawings. In the following embodiments, when referring to the number, numerical value, quantity, range, and the like of components, the number is not limited to the specific number and may be more or less than the specific number unless explicitly stated or clearly limited to a specific number.

[0010] When reference is made to the shape or positional relationship of components and the like, this also includes things that are essentially similar or approximate to these shapes and the like, unless otherwise stated or they are considered to be fundamentally significantly different.

[0011] Furthermore, characteristic parts may be enlarged or exaggerated in the drawings to better understand the features, and the proportions of the components may not necessarily correspond to reality. Furthermore, cross-sectional views may omit hatching of some components to better understand the cross-sectional structure of the components. [First Embodiment]< Cutting Device >

[0012] Fig. 1 is a perspective view showing a cutting device. Fig. 2 is a plan view of the cutting device. As shown in the Fig. 1 and Fig. 2, a cutting device 1 cuts a wafer (workpiece) W held on a holding table 2 with a blade 22, and cuts a dressing plate 32 held on a dressing table 3 with the blade 22 to perform dressing of the blade 22. The cutting device 1 includes, for example, the holding table (suction table) 2, the dressing table 3, a workpiece cutting unit 4, a loading opening 5, and a workpiece transport unit 6 (see Fig. 4, Fig. 13 and Fig. 14). Furthermore, the cutting device 1 comprises, for example, a first cassette 7 and a second cassette 8. Furthermore, the cutting device 1 comprises, for example, an imaging unit 9 and a control unit 10. The second cassette 8 is an example of a cassette within the meaning of the present invention. <haltetisch>

[0013] The holding table 2 holds the wafer W by suction on a holding surface 2a. The holding table 2 is movable in the X-axis direction between a position below the workpiece cutting unit 4 and a loading / unloading position (not shown). The holding table 2 is configured to be rotatable about an axis parallel to the Z-axis direction. <abrichttisch>

[0014] The dressing table 3 holds the dressing plate 32 described below on a holding surface 3a by suction. The dressing table 3 is arranged adjacent to the holding table 2 on the downstream side of the holding table 2. Specifically, the dressing table 3 is arranged such that the holding table 2 is located on the opposite side in the rotation direction of the blade 22 at the contact portion between the blade 22 and the dressing plate 32. With this arrangement, when the dressing plate 32 is cut by the blade 22 to dress the blade 22, cutting waste from the dressing plate 32 can be prevented from coming into contact with the wafer W held on the holding table 2.

[0015] The planing table 3 is configured to be continuously movable in the X-axis direction with the holding table 2 between a position below the workpiece cutting unit 4 and a loading / unloading position (not shown). The planing table 3 is rectangular in shape, for example. In the planing table 3, the holding surface 3a is arranged at the same height as the holding surface 2a of the holding table 2.

[0016] Fig. 3 is a perspective view of the dressing table. The holding surface 3a of the dressing table 3 consists of a plurality of precision surfaces 3b. The positions of the surfaces of the precision surfaces 3b are at the same height. Grooves 3d are provided between the respective precision surfaces 3b and between the precision surface 3b located at the outermost periphery and the edge 3c of the dressing table 3. The groove 3d is connected to a vacuum pump (not shown). The dressing plate 32 arranged on the holding surface 3a is adsorbed onto the holding surface 3a by reducing the pressure in the groove 3d with the aid of a vacuum pump. In this way, the dressing plate 32 is stably held by the holding surface 3a. <Werkstückschneideeinheit>

[0017] The workpiece cutting unit 4 includes a spindle 21 and a blade 22. The spindle 21 is moved in the Y and Z directions by a moving mechanism (not shown). The blade 22 is attached to the tip of the spindle 21. The blade 22 cuts the wafer W.

[0018] As blade 22, a diamond whetstone with fine diamond abrasive grains is used to cut the wafer W. The diamond whetstone is made by bonding super-abrasive diamond grains with metals such as nickel as a bonding material. Generally, the sharpness is not always uniform when grinding with a diamond whetstone. The grinding efficiency of this whetstone is so high that the abrasive grains embedded in the bonding material completely protrude. When the abrasive grains of the whetstone wear out due to grinding, the abrasive grains cannot withstand the grinding resistance and fall off, and new abrasive grains constantly emerge from the bonding material. This maintains the grinding ability through a so-called self-sharpening effect.

[0019] However, since the abrasive grains do not sufficiently protrude from the bonding material of a new blade 22, a sharpening step, called dressing, is required. Furthermore, clogging may occur during cutting of the wafer W, and the grinding performance may gradually decrease. In this case, too, the grinding ability of the blade 22 can be restored by dressing the blade 22. Dressing the blade 22 is performed, for example, by grinding a special workpiece, the so-called dressing plate 32. The dressing plate 32 will be described in detail later. <Ladeöffnung>

[0020] The second cassette 8 is arranged on a support surface 5a of the loading opening 5. The first cassette 7 can be arranged on the support surface 5a of the loading opening 5. The loading opening 5 lifts and lowers the first cassette 7 and the second cassette 8, which are arranged on the support surface 5a, in the vertical direction (Z-axis direction). The first cassette 7 and the second cassette 8 can be automatically transported by an external transport device 25 (see Fig. 11), e.g., by an automated guided vehicle (AGV) or a rail-guided vehicle (OHT). The transported first cassette 7 and the second cassette 8 are positioned, e.g., on the storage surface 5a of the loading opening 5. <Erste Kassette>

[0021] The first cassette 7 accommodates a plurality of wafers W arranged in a first frame (dicing frame) (see Fig. 4). The plurality of first frames in which the wafers W are arranged are arranged at intervals in the Z-axis direction inside the first cassette 7. The plurality of first frames can be inserted into and removed from the opening portion of the first cassette 7 by a finger part 41 (described later) of the workpiece transfer unit 6. The first cassette 7 is arranged in a first insertion / removal position in which the first frame on which the wafer W is arranged can be inserted and removed by raising and lowering the loading opening 5. <Zweite Kassette>

[0022] Fig. 5 is a perspective view showing a state in which the second frame 31 is housed in the second cassette 8.

[0023] As in the Fig. 1 and Fig. 5, the second cassette 8 is located below the first cassette 7 and is arranged on the support surface 5a of the loading opening 5. The second cassette 8 accommodates a plurality of trays 50 arranged on the second frame 31. The second frame 31 is an example of a frame according to the present invention. The dressing plate 32 is arranged in the tray 50. The plurality of second frames 31 on which the trays 50 are arranged are spaced from one another in the Z-axis direction in the second cassette 8. The plurality of second frames 31 can be inserted into and removed from an opening portion 8a of the second cassette 8 by the finger part 41 of the workpiece transport unit 6. The second cassette 8 is arranged in a second insertion / removal position in which the second frame 31 can be inserted and removed by raising and lowering the loading opening 5.

[0024] Fig. 6 is a perspective view of the second frame 31 in which a bowl with a dressing plate is arranged.

[0025] The second frame 31 has the same shape as the first frame (dicing frame). Furthermore, the shape of the second frame 31 is not limited to the same shape as the dicing frame, but may be, for example, a rectangular flat plate. On the surface of the second frame 31, for example, a dressing plate 32 is provided before dressing the blade 22 (see Fig. 1) and a dressing plate 33 is arranged after dressing the blade 22. Hereinafter, the dressing plate 32 before dressing is simply referred to as "dressing plate 32." Furthermore, the dressing plate 33 after dressing may be referred to as "used dressing plate 33." The dressing plate 32 will be described in detail later.

[0026] As in Fig. 6, the tray 50 and the dressing plate 32 arranged on the tray 50 are arranged on the surface of the second frame 31. The second frame 31 has support pins 34 that protrude from the surface of the second frame 31 at positions facing the four sides of the tray 50. The plurality of trays 50 are arranged in a stacked state on the surface of the second frame 31. The plurality of stacked trays 50 are held by the support pins 34. The support pin 34 is formed, for example, in a columnar shape. Thus, the area where the support pin 34 comes into contact with the four sides can be made small. In addition, the shape of the support pin 34 can be arbitrarily selected, and the support pin 34 may have a shape with a tapered tip. The tray 50 arranged on the second frame 31 is sucked and lifted by the suction pad and then transported to the dressing table 3.The dressing plate 32 transported to the dressing table 3 is held on the holding surface 3a by suction force. As shown in . Fig. As shown in Figure 6, the second frame 31 may be provided with a plurality of regions for receiving the shells 50. In other words, a plurality of regions surrounded by four support pins may be provided.

[0027] As described above, the trays 50 on which the dressing plates 32 are arranged are stacked on the second frame 31. When the uppermost dressing plate is lifted by suction while only dressing plates are stacked, the dressing plate directly below it can also be sucked due to the air permeability of the dressing plate, thereby lifting two dressing plates. However, in the above example, the dressing plates 32 are stacked together with the trays 50 and are transported to the trays 50 by suction. Therefore, the dressing plates 32 can be reliably transported individually.

[0028] Fig. 7 is a perspective view of the shells 50. The shell 50 supports the dressing plate 32 by means of the support pins 52. The support pins 52 protrude in the Z-axis direction from the surface of the shell 50 at positions facing the four sides of the dressing plate 32. The support pin 52 has, for example, a circular shape in the XY cross-section and is shaped such that its diameter decreases from any position in the Z direction toward the tip. Since the shape of the XY cross-section is circular, the area where the support pin 52 comes into contact with the four sides can be made small. In addition, the support pin 52 has a shape with the tip tapered in the Z direction. When the dressing plate 32 is placed on the shell 50, the dressing plate 32 may come into contact with the support pins 52 due to misalignment.However, since the tip of the support pin 52 has a reduced diameter in the Z direction, it is possible to reduce the impact on the dressing plate 32 in the event of contact and guide the dressing plate 32 to an opening portion 51. Furthermore, the shape of the support pin 52 is not limited to the above-described shape but can be arbitrarily selected. The used dressing plates 33 are held by the support pins 52 in the same manner as the dressing plates 32 and arranged on the surface of the second frame 31 by stacking a large number of them together with the trays 50.

[0029] Fig. 8 is a plan view showing a state in which the dressing plate 32 is arranged on the shell 50. Fig. 9 is a cross-sectional view of the shell 50 of Fig. 8 along line AA. Fig. 10 is a side view showing a step of placing the dressing plate 32 on the dressing table 3 through the tray 50. Fig. 11 is a side view showing a step of dressing a blade by the dressing plate. Also shown in the Fig. 8 to 11 the support pin 52 is omitted. As in the Fig. 8 and Fig. As shown in Figure 9, the dressing bowl 32 is arranged on a surface 50a of the bowl 50. The bowl 50 has a rectangular outer shape. The bowl 50 has an opening portion 51 formed in the center. The opening portion 51 has a rectangular shape to fit into the dressing table 3 (see Fig. 9). For example, the dressing plate 32 is arranged in the opening portion 51 when it is arranged on the surface 50a of the shell 50. The shells 50 are arranged, for example, stacked together with the dressing plate 32 on the second frame 31.

[0030] As in Fig. As shown in Figure 10, the tray 50 is held by a suction cup or a clamp (not shown) during the transport of the dressing plate 32. The dressing plate 32 is located on the tray 50. The tray 50 is transported to the dressing table 3 and lowers toward the dressing table 3. The opening portion 51 of the tray 50 is inserted into the dressing table 3, and the tray 50 is arranged below the dressing table 3.

[0031] On the other hand, the dressing plate 32 arranged in the opening portion 51 of the shell 50 is arranged on the holding surface 3a of the dressing table 3. The arranged dressing plate 32 is held on the holding surface 3a by negative pressure. At this time, the dressing plate 32 protrudes from the holding surface 3a. The dressing plate 32 is held in a position that is slightly offset (inclined) from the predetermined position. A dressing area E (see Fig. 17) of the dressing plate 32 is defined. The dressing area E will be described later.

[0032] As in Fig. As shown in Figure 11, in the step of dressing the blade 22, the blade 22 starts grinding the dressing plate 32 from the dressing position. That is, the blade 22 is moved in the Y-axis direction to the dressing position. In this state, the dressing plate 32 is moved in the X-axis direction toward the blade 22 on the dressing table 3. In the dressing area E of the dressing plate 32, grinding of the blade 22 starts from the dressing position. The blade 22 is dressed in the dressing area E by grinding the dressing area E of the dressing plate 32 with the blade 22.

[0033] After the blade 22 has been dressed, the shell 50 is held by a suction gripper, a clamp, or the like. The held shell 50 is lifted so that the dressing plate 32 is arranged on the shell 50. In this state, the dressing plate 32 is transported together with the shell 50.

[0034] The dressing plate 32 arranged on the dressing table 3 serves to dress the blade 22, so that a plurality of dressing grooves 54 are formed in the blade 22. For this reason, the dressing grooves 54 can prevent the dressing plate 32 from being sucked when the dressing plate 32 is transported by, for example, a suction cup. Furthermore, the plurality of dressing grooves 54 can reduce the rigidity of the dressing plate 32 after use, which can prevent the dressing plate 32 from sticking to the surface. Therefore, the tray 50 is transported by being sucked by a suction cup. Therefore, the tray 50 can be stably sucked by the suction cup. Accordingly, the dressing plate 32 can be replaced automatically and conveniently.

[0035] The dressing plate 32 is designed, for example, as a rectangular flat plate with four corners 32a (see Fig. 17). On the surface of the dressing plate 32, for example, an identification mark (not shown) is applied. The identification mark is, for example, a barcode or a two-dimensional code. The identification mark stores information about the dressing plate 32, such as the type, shape, and size of the dressing plate 32. Furthermore, the identification mark may contain information linked to the corresponding information of the cutting board, which is stored in a recording unit (not shown) in the cutting device 1. The information recorded in the identification mark is obtained by reading the information with a reader 37 (see Fig. 14).

[0036] The information about the dressing plate 32 can be acquired by a dressing plate acquisition unit (not shown). The dressing plate acquisition unit can acquire information about the dressing plate 32 through the user's operation of an operating unit (not shown). The operating unit is a user-operated input device, which can be a keyboard, a touch panel, or a reader for reading barcodes or two-dimensional codes. <Werkstücktransporteinheit>

[0037] As in the Fig. 5 and Fig. 15, the workpiece transfer unit 6 includes, for example, the finger part 41 and an arm part 42. The finger part 41 pulls out the first frame in which the wafers W are arranged from the interior of the first cassette 7 when the first cassette 7 is arranged in the first loading / unloading position through the loading opening 5. The finger part 41 positions the pulled-out first frame on a frame transfer positioning rail 45. The first frame is placed on the frame transfer positioning rail 45 so that the wafer is temporarily stored.

[0038] Furthermore, the finger part 41 pulls out the second frame 31 from the inside of the second cassette 8 in a state where the second cassette 8 is located at the second loading / unloading position at the loading opening 5. The finger part 41 places the removed second frame 31 on the frame transport positioning rail 45. The second frame 31 is placed on the frame transport positioning rail 45, so that the dressing plate 32 is temporarily stored.

[0039] The arm part 42 (see Fig. 15) transports the first frame, which has been pulled out to be temporarily stored by the finger part 41, together with the wafer W to the holding table 2. The arm part 42 places the wafer W on the holding surface 2a of the holding table 2. The wafer W is held on the holding surface 2a of the holding table 2 by suction. That is, the workpiece transport unit 6 transports the wafer W between the loading port 5 and the receiving table 2.

[0040] Furthermore, the arm part 42 transports the dressing plate 32 together with the tray 50 from the second frame 31, which has been pulled out to be temporarily stored by the finger part 41, to the dressing table 3. Specifically, the arm part 42 picks up the tray 50 by suction and places the dressing plate 32 on the holding surface 3a of the dressing table 3. The tray 50 is held by suction on the holding surface 3a of the dressing table 3. That is, the workpiece transport unit 6 transports the tray 50 with the dressing plate 32 between the loading opening 5 and the dressing table 3. <Bildgebende Einheit>

[0041] The imaging unit 9 captures an image of the wafer W held on the holding surface 2a of the holding table 2 by suction. Furthermore, the imaging unit 9 captures an image of the dressing plate 32 held on the holding surface 3a of the dressing table 3 by negative pressure. Specifically, the imaging unit 9 captures images of, for example, two of the four corners 32a of the dressing plate 32. An alignment microscope, for example, is used as the imaging unit 9. Hereinafter, the imaging unit 9 is referred to as an alignment microscope 9. However, the imaging unit 9 is not limited to an alignment microscope 9. <Steuergerät>

[0042] The control unit 10 positions the wafer W at a predetermined cutting position based on the information acquired by the imaging unit 9. After positioning the wafer W at the cutting position, the control unit 10 moves the holding table 2 in the X-axis direction toward the workpiece cutting unit 4. Accordingly, the wafer W is cut by the blade 22.

[0043] Furthermore, the control unit 10 determines the position of the dressing plate 32 based on information acquired by the imaging unit 9, e.g., the two corners 32a of the dressing plate 32, and information acquired from the barcode, e.g., the shape (size) of the dressing plate 32. Furthermore, the control unit 10 determines the dressing area E (see Fig. 17) that can be ground by the blade 22 based on the obtained posture of the dressing plate 32. After determining the dressing area E of the dressing plate 32, the control unit 10 moves the dressing table 3 in the X-axis direction toward the workpiece cutting unit 4. As a result, the dressing area E of the dressing plate 32 is ground by the blade 22.

[0044] A dressing method will be described below with reference to Figs. 12 to 17.

[0045] Fig. 12 is a perspective view showing a step of transporting the second cassette to the storage surface of the loading opening. As shown in Fig. As shown in Figure 12, in the step of transporting the second cassette 8, the second cassette 8 is automatically transported to the storage surface 5a of the loading opening 5 by an external transport device 25. In the second cassette 8, a plurality of second frames 31 are arranged spaced apart from each other in the Z-axis direction. A plurality of dressing plates 32 are stacked on the surface of the second frame 31.

[0046] Fig. 13 is a perspective view showing a step of transporting the first cassette over the second cassette. As shown in Fig. 13, the first cassette 7 is transported by the external transport device 25 (see Fig. 12) is automatically moved above the second cassette. Thus, the second cassette 8 is located below the first cassette 7 while being arranged on the support surface 5a of the loading opening 5.

[0047] Fig. 14 is a perspective view showing a step of placing the dressing plate for temporary positioning.

[0048] As in Fig. As shown in Fig. 14, in the step of arranging the dressing plate 32 for temporary positioning, the second cassette 8 is placed in the second insertion / removal position, where the second cassette 8 can be inserted into and removed from the opening portion 8a through the loading port 5. The second frame 31 is pulled out of the opening portion 8a of the second cassette 8, which is in the second insertion / removal position, by means of the finger part 41, with the frame transport positioning rail 45 serving as a guide.

[0049] In this state, the dressing plate 32 arranged on the second frame 31 is temporarily stored. The barcode of the temporarily stored dressing plate 32 is read by the reader 37 to obtain the type, shape, size, and the like of the dressing plate 32.

[0050] Fig. 15 is a perspective view illustrating a step of holding the tray from the second frame by the arm part. As shown in Fig. As shown in Figure 15, in the step of holding the tray 50, a suction cup 43 of the arm portion 42 is moved over the uppermost tray 50 under the temporarily stored tray 50. The uppermost dressing plate 32 is held by suction with the aid of the suction cup 43 of the arm portion 42. By moving the arm portion 42, the tray 50 sucked by the suction cup 43 is lifted. Moreover, the means for holding the tray 50 is not limited to suction. The tray 50 can be held, for example, by clamping the edges of the tray 50.

[0051] Fig. 16 is a perspective view showing a step of transporting a tray to the dressing table through the arm part. As shown in Fig. As shown in Figure 16, when transporting the dressing plate 32 together with the tray 50, the tray 50 is lifted by the suction cup 43, and then the arm portion 42 is moved to transport the tray to the dressing table 3. The dressing plate 32 transported to the dressing table 3 is placed on the holding surface 3a. The placed dressing plate 32 is held on the holding surface 3a by suction. In this case, the dressing plate 32 is held, for example, in a position that is slightly offset (oblique) from a predetermined position.

[0052] Fig. 17 is a plan view showing a step of determining the dressing area E of the dressing plate. In Fig. In Figure 17, the state in which the dressing plate 32 is arranged in a specific position is represented by dashed lines. The state in which the dressing plate 32 is arranged at an angle with respect to the predetermined position is represented by solid lines.

[0053] As in the Fig. 1 and Fig. 17, in the step of taking an image of the dressing plate 32, for example, images of two corners 32a of the four corners 32a of the dressing plate 32 arranged at an angle are taken by the alignment microscope 9.

[0054] In the next step, determining the position of the dressing plate 32, the position of the dressing plate 32 is determined based on the two corners 32a determined by the alignment microscope 9 and the shape and size of the dressing plate 32 determined by the barcode.

[0055] Next, in the step of determining the dressing range E of the dressing plate 32, a range M in which the blade 22 cannot cut in the index direction of the blade 22 (e.g., in the Y-axis direction) is determined based on the obtained position of the dressing plate 32.

[0056] Accordingly, the dressing range E of the dressing plate 32 is determined in the feed direction of the blade 22. Furthermore, based on the determined dressing range E, a dressing position is determined at which the first grinding of the dressing plate 32 by the blade 22 begins.

[0057] The appearance of the surface of the dressing plate 32 varies depending on the type. Therefore, for example, the surface information of the dressing plate 32 is recorded in a barcode, and the surface information is acquired by the reader 37. Based on the acquired surface information of the dressing plate 32, the imaging conditions for the dressing plate 32 are determined. Accordingly, for example, the brightness of the illumination can be adjusted according to the type of the dressing plate 32. By adjusting the brightness of the illumination, an image of the dressing plate 32 can be appropriately captured. In this way, the dressing area E can be determined according to the type of the dressing plate 32.

[0058] As in the Fig. 2 and Fig. 17, in the step of dressing the blade 22, the first grinding of the dressing plate 32 is started by the blade 22 from the dressing position. That is, the blade 22 is moved in the Y-axis direction and positioned at the first dressing position. In this state, the dressing table 3 moves the dressing plate 32 in the X-axis direction toward the workpiece cutting unit 4. In the dressing area E of the dressing plate 32, grinding of the blade 22 is started from the dressing position. The blade 22 is dressed in the dressing area E by grinding the dressing plate 32 to perform first dressing of the blade 22 in the dressing area E.

[0059] Here, it is possible to reuse the dressing plate 32 after the initial dressing. The step of reusing the dressing plate 32 is described below.

[0060] When the dressing plate 32 is reused, the dressing plate 32 that was first dressed is temporarily stored on a temporary storage section (not shown). When the temporarily stored dressing plate 32 is reused, the dressing plate 32 is transported from the temporary storage section to the dressing table 3 and held on the holding surface 3a by suction.

[0061] The dressing area E of the dressing plate 32 held on the holding surface 3a by suction is newly determined. A dressing position at which grinding by the blade 22 is restarted is determined to avoid the determined new dressing area E and the previously cut first dressing groove (not shown). Specifically, first, the dressing plate 32 is placed on the dressing table 3 so that the dressing plate 32 faces the same direction as the previous dressing. Then, at least two of the four corners 32a are imaged to determine the posture of the dressing plate 32. After that, the position of the previous dressing groove is determined from the information on the previous dressing, a position (edge) that does not overlap with the position of the previous dressing groove is determined, and a new dressing position at which grinding is started is determined.

[0062] As in the Fig. 3 and Fig. 5, the used dressing plate 33, which has been dressed by the blade 22, is returned together with the shell 50 by the workpiece transport unit 6 to the second frame 31 (see Fig. 14 to 16). A used dressing plate 33 is stacked on the second frame 31 in place of the dressing plate 32. The second frames 31, on which the used dressing plates 33 are stacked, are successively accommodated in the second cassette 8.

[0063] As in Fig. As shown in Figure 13, the second cassette 8 is located below the first cassette 7 while being arranged at the loading opening 5. Therefore, it is necessary to move the first cassette 7 from above when replacing the second cassette 8. For example, if the cutting of all wafers W (see Fig. 1) accommodated in the first cassette 7 is completed, while the used dressing plate 33 is located in the second cassette 8, the second cassette 8 is replaced according to the replacement of the first cassette 7. Thus, the second cassette 8 can be transported by the external transport device 25 (see Fig. 12) to replace the first cassette 7. However, the completion of cutting all wafers W does not necessarily coincide with the completion of use of all dressing plates 33. Therefore, when the number of unused dressing plates 33 falls below a predetermined number or when the first cassette 7 has been replaced a predetermined number of times, the second cassette 8 can be replaced at the time of replacing the first cassette 7.

[0064] According to the cutting device 1 described above, as shown in the Fig. 12 and Fig. As shown in Figure 13, the dressing plate 32 is arranged on the second frame 31, and the second frame 31 is housed in the second cassette 8. The second cassette 8, which accommodates the second frame 31, is arranged at the loading opening 5 by automatic transport. The first cassette 7 is arranged above the second cassette 8 by automatic transport. Accordingly, the second cassette 8 can be automatically transported by the external transport device 25, which also automatically transports the first cassette 7. The second cassette 8 is located below the first cassette 7.

[0065] As in Fig. 1 and Fig. As shown in Figures 14 to 16, the dressing plate 32 housed in the second cassette 8 is placed on the dressing table 3 by the workpiece transport unit 6. Thus, the workpiece transport unit 6 for transporting the wafer W can also be used for transporting the dressing plate 32. The dressing plate 32 can thus be automatically replaced without having to enlarge the cutting device 1.

[0066] In addition, the second frame 31 is pulled out of the second cassette 8 with the finger part 41 of the workpiece transport unit 6. By pulling the second frame 31 out of the second cassette 8, the dressing plate 32 arranged on the second frame 31 can be easily transported to the dressing table 3.

[0067] As in the Fig. 5 and Fig. As shown in Figure 6, the dressing plate 32 was stacked together with the tray 50 on the second frame 31. Thus, multiple dressing plates 32 or a series of different dressing plates can be mounted on the second frame 31 with a minimal number of configurations. Accordingly, the frequency of replacing the first cassette 7 can be reduced.

[0068] As in the Fig. 1 and Fig. As shown in Figure 17, an image of the dressing plate 32 is captured by the alignment microscope 9, and the position of the dressing plate 32 is determined by the control device 10 based on the image. Based on the obtained position, the dressing range E that can be ground by the blade 22 is determined. For example, the dressing range E that can be ground by the blade 22 can be determined even if the position of the dressing plate 32 deviates from a predetermined position. Thus, the positioning of the dressing plate 32, which was previously required to determine the dressing range E, is no longer necessary.

[0069] Furthermore, according to the above-described method for dressing the blade 22 provided in the cutting device 1, as shown in the Fig. 1 and Fig. As shown in Figure 17, after the step of capturing an image of the dressing plate 32, the orientation of the dressing plate 32 is determined based on the image. In a subsequent step, the dressing area E that can be ground by the blade 22 is determined. For example, the dressing area E that can be ground by the blade 22 can be determined even if the position of the dressing plate 32 deviates from a specific position. The positioning of the dressing plate 32, which was previously required to determine the dressing area E, is thus no longer necessary.

[0070] When the dressing plate 32 is reused, the dressing position at which the blade 22 restarts grinding is determined by taking into account the previously cut first dressing groove (not shown). In this way, the dressing plate 32 can be used efficiently by determining the dressing position at which new grinding begins by taking into account the previously cut dressing groove.

[0071] Furthermore, the imaging conditions for the dressing plate 32 are determined based on the surface information of the dressing plate 32. For example, the brightness of the illumination can be adjusted according to the type of the dressing plate 32. Accordingly, an image of the dressing plate 32 can be appropriately captured, and the dressing area E can be appropriately determined according to the type of the dressing plate 32.

[0072] As in the Fig. 12 and Fig. As shown in Fig. 13, the replacement of the second cassette 8 is synchronized with the replacement of the first cassette 7. Thus, the second cassette 8 can be replaced with the external transport device 25 that replaces the first cassette 7. That is, the external transport device 25 that replaces the first cassette 7 can also be used to replace the second cassette 8. Accordingly, the dressing plate 32 can be replaced automatically without increasing the size of the cutting device 1, and the second cassette 8 can be replaced efficiently.

[0073] A modified embodiment of the shell 50 is described below. Fig. Figure 18 is a perspective view of the modified embodiment of the shell. Fig. The tray 50A shown in FIG. 18 has a step portion 53 on the outer periphery of the opening portion 51. The outer dimension of the step portion 53 is larger than the outer dimension of the dressing plate 32, and the step portion 53 is shaped so that the dressing plate 32 can be fitted into the step portion 53. Since the dressing plate 32 is fitted into the step portion 53, the dressing plate 32 is held without significant positional deviation. In addition, the inner dimension of the step portion 53 is larger than the outer dimension of the dressing table 3. Thus, the dressing table 3 can be fitted into the opening portion 51.

[0074] Even if the tray 50 or the tray 50A is used, the opening portion 51 of the tray 50 or 50A is fitted into the planing table 3, and the tray 50 or 50A is arranged under the planing table 3, as shown in Fig. 10. On the other hand, the dressing plate 32 is arranged to protrude from the holding surface 3a of the dressing table 3 and is held by suction. The dressing plate usually has a rougher surface than the wafer and adheres poorly to the dressing table. As a result, water may penetrate through the gap between the dressing plate and the dressing table, so that suction may be unstable, or the suction of water containing abrasive grains may damage a piping system including pipes, control valves, and vacuum generators. However, since the dressing plate 32 protrudes from the holding surface 3a, the water is not directly splashed between the dressing plate 32 and the holding surface 3a, thereby preventing the suction from becoming unstable and damaging the piping system described above.

[0075] Next, a modified embodiment of the second frame will be described with reference to Fig. 19 described. Fig. 19 is a perspective view of the modified embodiment of the second frame. As shown in Fig. 19, the tray 50A and the dressing plate 32 fitted into the step portion 53 of the tray 50A are arranged on a surface of a second frame 31A. The second frame 31A has a concave portion 31a into which the tray 50A can be fitted. The tray 50A is fitted into the concave portion 31a. The arranged dressing plate 32 is either the unused dressing plate 32 or the used dressing plate 33. The tray 50A arranged on the second frame 31A is sucked and lifted by the suction pad 43 and then transported to the dressing table 3. The dressing plate 32 transported to the dressing table 3 is held on the holding surface 3a by the suction action. The second frame 31A may be provided with a plurality of concave portions 31a.

[0076] As in Fig. As shown in Fig. 20, the plurality of trays 50 and 50A on which the dressing plates 32 are arranged can be accommodated in the accommodation cassette 11. The plurality of trays 50 and 50A are arranged at intervals in the Z-axis direction within the accommodation cassette 11. The plurality of trays 50 and 50A can be inserted into and removed from the opening portion 11a of the accommodation cassette 11 by the finger part 41 of the workpiece transfer unit 6. The accommodation cassette 11 is arranged in a position where the trays 50 and 50A can be inserted and removed by raising and lowering the loading opening 5.

[0077] Furthermore, the technical scope of the present invention is not limited to the above-described embodiment, and various changes may be made without departing from the spirit of the present invention.

[0078] In Fig. 6, for example, the shell 50 is arranged on the second frame 31, however, the shell 50A may be arranged on the second frame 31. In Fig. 19, the tray 50A is arranged on the second frame 31A having the concave portion 31a, but the tray 50 may be arranged on the second frame 31A.

[0079] Furthermore, the components in this embodiment may be replaced with known components if necessary without departing from the spirit of the present invention. Reference symbol 1 cutting device 2 holding table 2a Holding surface 3 planing table 4 Workpiece cutting unit 5 Loading opening 6 Workpiece transport unit 7 First cassette 8 Second cassette 9 Imaging Unit 10 Control unit 22 blade 31, 31A Second frame 31a Concave section 32 dressing plate 34 Support pin 41 Finger part 42 armrest 50, 50A shell 51 opening section 52 support pin 53 step section W Wafer (workpiece)< / abrichttisch> < / haltetisch>

Claims

[1] A cutting device (1) comprising: - a workpiece cutting unit (4) having a blade (22) for cutting a workpiece (W) held on a holding table (2); - a cassette (7, 8) in which a shell (50, 50A) with a dressing plate (32) arranged thereon is arranged in a frame (31, 31A); - a loading opening (5) in which the cassette (7, 8) is arranged; and - a dressing table (3) which receives the dressing plate (32), wherein the shell (50, 50A) has an opening portion (51) which can be inserted into the dressing table (3). [2] The cutting device (1) according to claim 1, wherein the tray (50, 50A) on which the dressing plate (32) is arranged can be stacked on the frame (31, 31A). [3] The cutting device (1) according to claim 1 or 2, wherein the frame (31, 31A) has a concave part (31a) into which the tray (50, 50A) can be inserted. [4] The cutting device (1) according to claim 1 or 2, wherein the frame (31, 31A) has a plurality of support pins (34) supporting the tray (50, 50A). [5] A method for replacing a dressing plate (32) for the cutting device (1) according to claim 1 or 2, wherein the opening portion (51) of the tray (50, 50A) on which the dressing plate (32) is arranged is inserted into the dressing table (3) and the dressing plate (32) is arranged on a holding surface (2a) of the dressing table (3).

Images