MEMS mirror module, lighting system, assembly method for a MEMS mirror module
The MEMS mirror module addresses heat dissipation challenges by using a support frame, MEMS multi-mirror unit, and bridge component with fluid channels, ensuring efficient cooling through separate assembly steps and sealing elements, thereby reducing thermal stress and improving module reliability.
Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- CARL ZEISS SMT GMBH
- Filing Date
- 2025-05-14
- Publication Date
- 2026-05-13
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Ensuring effective heat dissipation from MEMS mirror arrays in EUV operation is challenging due to absorption of incident EUV radiation, leading to potential thermal issues.
A MEMS mirror module design incorporating a support frame, MEMS multi-mirror unit, and bridge component with fluid channels, allowing for separate assembly steps to ensure a leak-proof fluid connection, utilizing a bridge component to connect fluid channels and employing sealing elements and tensioning forces to maintain a continuous cooling fluid path.
The design effectively dissipates heat from the MEMS mirror array by circulating a cooling fluid through interconnected channels, minimizing thermal stress and enhancing the reliability of the module.
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Abstract
Description
[0001] The invention relates to a MEMS mirror module and an illumination system, for example for use in semiconductor technology systems. The invention also relates to an assembly method for a MEMS mirror module.
[0002] Semiconductor technology equipment refers to systems used for the fabrication or inspection of microstructured devices or the components required for their production. Examples of such equipment include microlithographic projection exposure systems, mask inspection systems, and wafer inspection systems.
[0003] Microlithographic projection exposure systems are used to manufacture microstructured components, such as integrated circuits. The projection exposure system comprises an illumination system and a projection lens. The projection lens projects a photomask, illuminated by the illumination system, onto a lithographic object positioned in the image plane of the projection lens. The lithographic object, which may be a silicon wafer, for example, is coated with a photosensitive layer. A structure formed on the photomask is transferred to the photosensitive coating of the lithographic object.
[0004] The illumination system can be used to direct electromagnetic radiation emitted from a radiation source onto the photomask in such a way that the photomask is illuminated with uniform brightness. Two faceted mirrors can be positioned in the beam path between the radiation source and the photomask, homogenizing the radiation in a manner similar to the principle of a honeycomb condenser. The radiation source can be an EUV source emitting electromagnetic radiation in the extreme ultraviolet spectral range, particularly with wavelengths between 5 nm and 30 nm.
[0005] In order to provide different distributions of intensity and / or angles of incidence of the radiation incident on the photomask, the facets of at least one of the two faceted mirrors can be formed by electromechanically individually pivotable mirror elements, WO 2012 / 130768 A2.
[0006] A small size for the individual mirror elements of a faceted mirror can be achieved by forming groups of mirror elements in the form of a so-called MEMS mirror array, i.e., a mirror array made of microelectromechanical systems (MEMS). In a MEMS mirror array, a large number of small mirror elements are mounted so that they can be moved individually relative to a common base body. Each mirror element has an actuated mechanism that allows its orientation relative to the base body to be adjusted. Often, the mirror elements can be pivoted about two axes that are perpendicular to each other and parallel to the base body. To monitor the orientation of the mirrors, sensors can be provided for each individual mirror element to determine its position relative to the base body. An example of a MEMS mirror array is described in DE 10 2015 204 874 A1.A method for manufacturing a MEMS mirror array is disclosed in DE 10 2015 220 018 A1.
[0007] The faceted mirror of a lighting system can be designed as a MEMS mirror module whose optical surface is composed of a plurality of such MEMS mirror arrays. The MEMS mirror module can have a support frame that carries a plurality of MEMS multi-mirror units, with each of the MEMS multi-mirror units having a MEMS mirror array.
[0008] In EUV operation, some of the incident EUV radiation is absorbed by a MEMS mirror array, which means that heat is added to the MEMS mirror array. Ensuring effective heat dissipation from the MEMS mirror array has proven to be quite challenging.
[0009] The invention is based on the objective of presenting a MEMS mirror module, an illumination system, and a mounting method for a MEMS mirror module, in which the aforementioned disadvantages are reduced. This objective is achieved by the features of the independent claims. Advantageous embodiments are specified in the dependent claims.
[0010] A MEMS mirror module according to the invention comprises a support frame, a MEMS multi-mirror unit, and a bridge component. The MEMS multi-mirror unit is inserted into a socket of the support frame, such that a structural body of the MEMS multi-mirror unit is located in the socket. A first fluid channel is formed in the support frame. A second fluid channel is formed in the structural body. A channel section is formed in the bridge component. The bridge component forms a connection between the first fluid channel and the second fluid channel.
[0011] The invention relates to a cooling concept in which a cooling fluid is guided through a fluid channel in the support frame and through a fluid channel in the structural body of the MEMS multi-mirror unit. The invention proposes connecting the first fluid channel in the support frame and the second fluid channel in the structural body using a bridge component. This achieves functional separation and reduces the potential for errors compared to a method where inserting the MEMS multi-mirror unit into the support frame simultaneously creates a connection between the fluid channels. This functional separation makes it possible to perform the assembly steps of the MEMS mirror module separately.First, the MEMS multi-mirror unit can be inserted into the mounting frame, paying full attention to its correct fit and the mechanical connection of the components. In a second step, the bridge component can be inserted, allowing full attention to ensuring the fluid connection is leak-proof.
[0012] The bridge component may have a first connection opening for connecting to the first fluid channel. When the bridge component is connected to the first fluid channel via this first connection opening, a continuous fluid channel can be created, comprising a section located within the supporting frame and a section located within the bridge component. The transition between the first fluid channel and the channel section of the bridge component should be sealed to prevent fluid from escaping at this point.
[0013] The bridge component may have a second connection opening for connecting to the second fluid channel. If the bridge component is enclosed by this second connection opening to the second fluid channel, a continuous fluid channel can be formed, comprising a section within the bridge component and a section within the structural body. The transition between the channel section of the bridge component and the second fluid channel should be sealed to prevent fluid leakage. If the bridge component is connected to both the first and second fluid channels, a continuous fluid channel can be formed, extending from the supporting frame, through the bridge component, and into the structural body.
[0014] To create a tight connection between the bridge component and the supporting frame, the bridge component can be tensioned against the supporting frame. The tensioning force can be a normal force acting perpendicular to the bearing surface where the bridge component rests against the supporting frame.
[0015] The first connection opening of the bridge component can be located in the bearing surface. When the bridge component is tensioned against the support frame, the bearing surface can be sealed against the opposing surface of the support frame, resulting in a seal extending around the first connection opening. In one embodiment, a first sealing element is provided that extends around the first connection opening and is tensioned by the tensioning force. An opening of the first channel section located in the opposing surface can be aligned with the first connection opening when the bridge component is tensioned against the support frame.
[0016] To create a tight connection between the bridge component and the structural frame, the bridge component can be tensioned against the structural frame. The tensioning force can be a normal force acting perpendicular to the bearing surface through which the bridge component rests against the supporting frame.
[0017] The second connection opening of the bridge component can be located in the bearing surface. When the bridge component is tensioned against the supporting frame, the bearing surface can be sealed against the opposing surface of the structural body, resulting in a seal extending around the second connection opening. A second sealing element can be provided, extending around the second connection opening and held under tension by the tensioning force. An opening of the second channel section located in the opposing surface can be aligned with the second connection opening when the bridge component is tensioned against the supporting frame.
[0018] The clamping force can be applied via a bolted connection. This bolted connection allows the bridge component to be clamped against the supporting frame and / or the structural body. The bolted connection can have a shank that extends through the material of the bridge component. The bolted connection can comprise several individual bolts, each of which clamps the bridge component against the supporting frame or the structural body.
[0019] If the bridge component is tensioned against both the supporting frame and the structural body, the bolted connection can comprise a first bolted element that tensions the bridge component against the supporting frame and a second bolted element that tensions the bridge component against the structural body. Alternatively, the bridge component can be bolted to only one of the two components, while the tension force acting on the other component results from the stiffness of the bridge component. Thus, the bridge component can be tensioned against the supporting frame with a bolted connection, so that the tension force is transmitted via the bridge component to the structural body. Conversely, the bridge component can be tensioned against the structural body with a bolted connection, so that the tension force is transmitted via the bridge component to the supporting frame.In each of the aforementioned cases, it is advantageous if the first connection opening and the second connection opening of the bridge component lie within parallel planes, in particular within the same plane.
[0020] Alternatively, it is also possible that the bridge component is tensioned against only one of the two components and that no tension force acts between the connection opening of the bridge component and the opposite opening of the relevant fluid channel. The second connection opening can lie in a plane that forms a right angle with the plane of the first connection opening. In the case of a connection opening in a curved surface, the specification refers to the projection of the curvature onto a plane surrounding the connection opening. In other words, the plane of a connection opening is defined as a plane that is orthogonal to an axis extending through the connection opening. In this case, if a tension force acts on one of the connection openings, the other connection opening is displaced parallel to its extent.In this way, one connection opening can be tensioned without causing mechanical stress at the other connection opening. At the other connection opening, the connection to the fluid channel of the opposite component can be established via an annular space extending between the bridge component and the opposite component. The annular space can extend around a pin formed on the structural body. The annular space can be oriented so that its axis is parallel to the tension force acting between the bridge component and the other component. The annular space can be enclosed axially between two sealing elements. Each of the sealing elements can seal against both the bridge component and the surface opposite the bridge component.
[0021] In one embodiment, the tension force acts between the bridge component and the supporting frame. The annular space can be formed between the bridge component and the structural body. The annular space can be formed between a cylindrical pin and a cylindrical bore. The cylindrical pin can be part of the structural body, the cylindrical bore can be part of the bridge component, or vice versa.
[0022] Alternatively, the tension force can act between the bridge component and the structural body, while the annular space is formed between the bridge component and the supporting frame. A cylindrical pin can be part of the supporting frame and a cylindrical bore part of the bridge component, or vice versa.
[0023] In one embodiment, the connection between the channel section of the bridge component and the first fluid channel and / or the second fluid channel is established via a coupling connection. The coupling connection can be designed such that a fluid-tight connection is automatically established between a first coupling part of the bridge component and an opposing second coupling part when the coupling parts are brought into axial contact with each other. The coupling connection can also be designed such that the connection can be released without further intervention when the coupling parts are moved away from each other in the axial direction.
[0024] Preferably, each coupling part is equipped with a fluid barrier that closes automatically when the coupling connection is disconnected, thus preventing fluid from escaping from separate sections of the fluid channels. The fluid barrier can further be designed to open automatically and allow fluid to pass through when the two coupling parts are connected. This creates a fluid channel extending from the channel section of the bridge component through the coupling connection into the first and second fluid channels, respectively. Additionally or alternatively, the coupling connection can be designed to be free of mechanical reference points. This has the advantage of minimizing the extent of parasitic forces transmitted via the coupling connection between the support frame and the MEMS multi-mirror unit.
[0025] The invention encompasses all combinations of the aforementioned connection options between the bridge component and the support frame, as well as between the bridge component and the structural body. For example, the bridge component can be tensioned against the support frame, while a coupling connection exists between the bridge component and the structural body. The reverse configuration is also possible. In another embodiment, a coupling connection exists between the bridge component and the support frame, and an annular space exists between the bridge component and the structural body. Again, the reverse configuration is also possible. This list is not exhaustive.
[0026] The disclosure also includes embodiments in which the connection between the first fluid channel and the second fluid channel is established via a coupling connection, without a bridge component being arranged between the structural body and the support frame. The coupling connection can have, individually or in combination, the features described in connection with the coupling connection according to the invention.
[0027] The second fluid channel formed in the structural body can be a continuous fluid channel with an inlet opening at one end and an outlet opening at the other. A third fluid channel, also designed to connect to the second fluid channel, can be formed in the support frame. If the first fluid channel is connected to the inlet opening of the second fluid channel and the third fluid channel is connected to the outlet opening of the second fluid channel, a continuous fluid flow is created from the first fluid channel, through the second fluid channel, to the third fluid channel. A cooling fluid can be supplied via the first fluid channel, absorbing heat within the structural body and dissipating it from the structural body via the third fluid channel. The cooling fluid can be circulated in a loop, with the heat being transferred via a heat exchanger before the cooling fluid is returned from the third fluid channel to the first fluid channel.The cooling fluid can be a coolant, especially cooling water.
[0028] The fluid connection between the second fluid channel and the third fluid channel can be established via a bridge component in the same way as the fluid connection between the first fluid channel and the second fluid channel. The features described in connection with the connection to the first fluid channel can also be implemented, individually or in combination, in the bridge component used to establish the connection to the third fluid channel.
[0029] In one embodiment, the connection to the first fluid channel is established via a first bridge component, and the connection to the third fluid channel is established via a second bridge component. The first bridge component can have a first connection opening, a second connection opening, and a first channel section; the second bridge component can have a third connection opening, a fourth connection opening, and a second channel section. The first connection opening can be connected to the first fluid channel, the second connection opening to the inlet opening of the second fluid channel, the third connection opening to the outlet opening of the second fluid channel, and the fourth connection opening to the third fluid channel.
[0030] It is also possible to establish the fluid connection between the structural body and the two fluid channels of the support frame via a single bridge component, within which the two channel sections and all connection openings are formed. All necessary connections can then be made in a single step, in which the bridge component is attached to the structural body and the support frame. If two of the fluid connections are made via an annular space, the two annular spaces can be coaxial and axially spaced apart.
[0031] The mounting frame can be designed so that the MEMS multi-mirror unit can be inserted into the mounting with an axial movement. The MEMS multi-mirror unit can be clamped against the mounting frame to fix it in the desired position relative to the frame. A clamping force acting between the bridge component and the structural body and / or the mounting frame can act in the opposite direction to the direction in which the MEMS multi-mirror unit is inserted into the mounting.
[0032] A MEMS mirror array can be attached to the structural body, the MEMS mirror array comprising a plurality of mirror elements formed on a substrate. Each mirror element can be provided with an actuable mechanism, the actuable mechanism being designed to adjust the orientation of the mirror element relative to the substrate.
[0033] The invention further relates to a MEMS mirror module with a plurality of MEMS multi-mirror units, wherein several or all of the MEMS multi-mirror units of the MEMS mirror module are configured according to the invention. A socket can be provided in the support frame for each of the MEMS multi-mirror units.
[0034] The invention further relates to an illumination system for a semiconductor technology system. The illumination system comprises a first faceted mirror and a second faceted mirror, which are designed to define a beam path such that an object arranged in an object plane is illuminated with uniform brightness by electromagnetic radiation emitted from a radiation source, wherein at least one of the faceted mirrors is designed as a MEMS mirror module according to the invention. The semiconductor technology system can be, for example, a microlithographic projection exposure system, a mask inspection system, or a wafer inspection system. In a microlithographic position exposure system, a photomask is arranged in the object plane, which is projected onto a lithography object, in particular a wafer, by means of a projection lens.In a mask inspection system, a photomask is positioned in the object plane and projected onto an image sensor using a projection lens. In a wafer inspection system, a wafer is positioned in the object plane and projected onto an image sensor using a projection lens.
[0035] The invention also relates to an assembly method for a MEMS mirror module, in which a MEMS multi-mirror unit is inserted into a socket of a support frame, such that a structural body of the MEMS multi-mirror unit is located in the socket, and in which the MEMS multi-mirror unit is mechanically fixed to the support frame. A first fluid channel is formed in the support frame, and a second fluid channel is formed in the structural body. A bridge component is arranged on the support frame and on the structural body, such that a connection between the first fluid channel and the second fluid channel is formed via a channel section formed in the bridge component.
[0036] The disclosure includes further developments of the assembly method with features that are described in connection with the MEMS mirror module according to the invention.
[0037] The invention is described below by way of example with reference to the accompanying drawings and advantageous embodiments. The drawings show: Fig. 1: a schematic representation of a microlithographic projection exposure system; Fig. 2: A top view of one of the MEMS mirror modules made of Fig. 1; Fig. 3: A cross-sectional view of a MEMS mirror array of the MEMS mirror module from Fig. 2; Fig. 4: a mirror element of the MEMS mirror array made of Fig. 3 in enlarged view; Fig. 5: a schematic representation of a MEMS multi-mirror unit; Fig. 6: a schematic representation of a MEMS mirror module with a plurality of MEMS multi-mirror units; Fig. 7: a MEMS multi-mirror unit according to the invention in a support frame of a MEMS mirror module; Fig. 8: A view from above of the bridge component Fig. 7; Fig. 9: a view from below of the bridge component Fig. 7; Fig. 10, Fig. 11: the view according to Fig. 8, Fig. 9 in an alternative embodiment of the invention; Fig. 12, Fig. 13: the view according to Fig. 8, Fig. 9 in a further embodiment of the invention; Fig. 14: the view according to Fig. 7 in another embodiment of the invention; Fig. 15: a detail from Fig. 14 in enlarged view; Fig. 16: a coupling connection between two fluid channels.
[0038] In Fig. Figure 1 schematically depicts a microlithographic EUV projection exposure system. The projection exposure system comprises an exposure beam source 14, an illumination system 10, and a projection lens 22, which are operated together in a vacuum chamber 23.
[0039] The exposure source 14 generates electromagnetic radiation in the EUV range with a wavelength between 5 nm and 30 nm, particularly 13.5 nm. The exposure radiation emitted by the exposure source 14 is focused by a collector 15 into an intermediate focal plane 16. Exposure radiation passing from the intermediate focal plane 16 is directed by the illumination system 10 into an object plane 12, so that an object field in the object plane 12 is illuminated with uniform radiation intensity.
[0040] The illumination system 10 comprises a deflecting mirror 17, which deflects the illumination radiation onto a first faceted mirror 18. A second faceted mirror 19 is arranged downstream of the first faceted mirror 18, which maps the facets of the first faceted mirror 18 onto the object plane 12.
[0041] In the object plane 12, a photomask 13 is arranged, which is imaged onto an image plane 21 via a plurality of mirrors M1-M6 of the projection lens 22. The penultimate mirror M5 and the last mirror M6 each have a passage aperture for the exposure radiation, thus constituting a double-obscured optic. The projection lens 22 has an image-side numerical aperture that is greater than 0.3, preferably greater than 0.5, and more preferably greater than 0.7.
[0042] The projection lens 22 has a large object-image offset in the y-direction, i.e., between a y-coordinate at the center of the object and a corresponding y-coordinate at the center of the image. The object-image offset in the y-direction can be approximately as large as the distance in the z-direction between the object plane 12 and the image plane 21.
[0043] The projection lens 22 can be anamorphic, i.e., different image scales β. x , β y exhibiting in the x and y directions. The two image scales β x , β y of the projection lens 22 can be used at (β x , β yThe values are approximately 0.25 and 0.125. A magnification β of 0.25 corresponds to a reduction in the ratio of 4:1, while a magnification β of 0.125 corresponds to a reduction in the ratio of 8:1. A positive sign for the magnification β indicates a magnification without image inversion, a negative sign indicates a magnification with image inversion.
[0044] The photomask 13 can have an aspect ratio between 1:1 and 1:3, preferably between 1:1 and 1:2, and particularly preferably between 1:1 or 1:2. The photomask can be substantially rectangular. The photomask can preferably be 5 to 7 inches (12.70 cm to 17.78 cm) long and wide, and particularly preferably 6 inches (15.24 cm) long and wide. Alternatively, the photomask can be 5 to 7 inches (12.70 cm to 17.78 cm) long and 10 to 14 inches (25.40 cm to 35.56 cm) wide, and preferably 6 inches (15.24 cm) long and 12 inches (30.48 cm) wide.
[0045] A structure formed on the photomask 13 is transferred by the projection lens 22 onto a radiation-sensitive layer of a wafer 20 arranged in the image plane 21. The photomask 13 is suspended from a first scanning device 24, and the wafer 20 rests on a second scanning device 25, so that the wafer 20 can be exposed in a single scanning operation in which the photomask 13 and the wafer 20 are moved synchronously. The scanning direction can correspond to the y-direction.
[0046] In the illumination system 10, EUV radiation emitted by the exposure beam source 14 is directed via the deflecting mirror 17 and the faceted mirrors 18, 19 onto the photomask 13. The deflecting mirror 17 can be a flat deflecting mirror or, alternatively, a mirror with a beam-shaping effect in addition to its simple deflection function. Alternatively or additionally, the deflecting mirror 17 can be designed as a spectral filter that separates a useful wavelength of the illumination radiation from stray light of a different wavelength.
[0047] The first faceted mirror 18 can be a field faceted mirror arranged in a field plane of the illumination system 10 that is optically conjugate to the object plane 12. The first faceted mirror 18 comprises a plurality of mirror elements, each of which can be individually pivoted about two mutually perpendicular axes. The second faceted mirror 19 is arranged downstream of the first faceted mirror 18, resulting in a double-faceted system, the basic principle of which is also referred to as a honeycomb condenser. The second faceted mirror 19 can be arranged as a pupil faceted mirror in a pupil plane of the illumination optics 16. Alternatively, a specular reflector is also possible, as described, for example, in US 2006 / 0132747 A1, EP 1 614 008 B1 and US 6,573,978, in which the second faceted mirror 19 is at a distance from the pupil plane.The second faceted mirror 19 can be arranged tilted relative to a pupil plane of the projection lens 22, as described, for example, in DE 10 2017 220 586 A1.
[0048] The second faceted mirror 19 can also comprise a multitude of mirror elements, each of which can be individually pivoted about two mutually perpendicular axes. Alternatively, the second faceted mirror may comprise a smaller number of significantly larger mirrors that are either fixed or tiltable only between two defined end positions. The second faceted mirror 19 projects the individual facets of the first faceted mirror 18 onto the object plane 12, although this is usually only an approximate projection.
[0049] The illumination system 10 can be designed such that illumination channels are formed by the facets of the faceted mirrors 18, 19. The illumination channels can be superimposed so that the illumination of the photomask 13 is as homogeneous as possible. The uniformity error can be less than 2%. Each illumination channel can function like a Köhler illumination system and be configured so that the entire object field, but only a portion of the entrance pupil of the projection lens 22, is illuminated. By appropriately selecting and adjusting the illumination channels, the intensity distribution in the entrance pupil of the downstream projection lens 22 can be influenced. This intensity distribution is also referred to as the illumination setting.
[0050] Each of the faceted mirrors 18, 19 is designed as a MEMS mirror module. According to the in Fig. In the top view of the first faceted mirror 18 shown in Figure 2, the MEMS mirror module comprises a support frame 30 that carries a plurality of MEMS mirror arrays 31. Each MEMS mirror array 31 comprises a plurality of mirror elements 33 arranged in a two-dimensional grid. The optical surface 35 of each mirror element 33 is formed by a multilayer system with alternating layers of molybdenum and silicon, which has high reflectivity for EUV radiation. The mirror elements 33 are each individually and independently pivotable in two rotational degrees of freedom relative to a base body 32 of the MEMS mirror array 31. The base body 32 is formed by a substrate of the MEMS mirror array 31. The mirror elements 33 are located close together and together form the optical surface 35 of the MEMS mirror module, at which the incident EUV radiation is reflected.The MEMS mirror array 31 can be a microelectromechanical system (MEMS system) as described, for example, in DE 10 2008 009 600 A1.
[0051] According to the schematic cross-sectional view of a MEMS mirror array in Fig. 3 Each mirror element 33 is connected to the base body 32 via an actuated mechanism 34. Through the actuated mechanism 34, which is in Fig. As only simplified in Figure 3, the mirror element 33 is held at a distance from the base body 32. The space enclosed between a mirror element 33 and the base body 32 is called the substructure space 39. There is such a substructure space 39 between each of the mirror elements 33 and the base body 32.
[0052] In Fig. Figure 4 shows an enlarged representation of the substructure space 39 of a single mirror element 33. The representation in Fig. Section 4 applies equally to the other mirror elements 33. The mirror element 33 is mechanically connected to the base body 32 via a solid-state joint 36. In addition to the solid-state joint 36, the actuable mechanism 34 comprises several actuator elements 37 and several sensor elements 38. Each actuator element 37 comprises a first sub-element connected to the base body 32 and a second sub-element connected to the mirror element 33. By applying electrical signals to an actuator element 37, an attractive or repulsive force can be generated between the sub-elements. If two opposing actuator elements 37 are controlled such that one exerts an attractive force and the other a repulsive force, a pivoting movement of the mirror element 33 about a pivot axis provided by the solid-state joint 36 results. This pivoting movement changes the orientation of the mirror element 33 relative to the base body 32.The sensor elements 38 are controlled in an analogous manner with electrical signals, so that the sensor elements 38 provide measured values about the current orientation of the mirror element 33 relative to the base body 32.
[0053] The optical surface 35 of the MEMS mirror module 18 is composed of a plurality of MEMS multi-mirror units 40. In Fig. Figure 5 shows a single MEMS multi-mirror unit 40 in a schematic representation. The MEMS multi-mirror unit 40 comprises a structural body 41 that encloses an interior space 45. Control electronics 42 for controlling the actuable mechanisms 34 of the mirror elements 33 of a MEMS mirror array 31 attached to the structural body 41 are arranged in the interior space. The control electronics 42 are controlled via electrical lines 43 that extend from the interior space 45 of the structural body 41. A plurality of sockets 46 are formed in the support frame 30 of the MEMS mirror module 18. Each of the sockets 46 accommodates one of the MEMS multi-mirror units 40, see Figure 5. Fig. 6.
[0054] In Fig. Figure 7 shows a single MEMS multi-mirror unit 40 in a socket 46 of the support frame 30. In the upper section, which projects from the support frame 30, the structural body 41 has a square cross-section that matches the square shape of the MEMS mirror array 31. The part of the structural body 41 located in the socket 46 has a round cross-section that matches the round recess of the socket 46.
[0055] The MEMS mirror module is equipped with a cooling channel that extends into the structural body 41 via the support frame 30 and exits the structural body 41 via the support frame 30. The cooling channel comprises a first fluid channel 51 in the support frame 30, a first channel section 58 in a bridge component 48, a second fluid channel 52 in the structural body 41, a second channel section 59 in the bridge component 48, and a third fluid channel 53 in the support frame 30. A cooling fluid is supplied via the first fluid channel 51 and flows through the bridge component 48 into the second fluid channel 52 and from there back through the bridge component 48 into the third fluid channel 53. Heat absorbed during operation of the MEMS mirror module is dissipated from the structural body 41 by the cooling fluid.The coolant is circulated in a circuit (not shown) in which heat is released via a heat exchanger before the coolant is returned to the first fluid channel 51.
[0056] During the assembly of such a MEMS mirror module, the MEMS multi-mirror unit 40 is first inserted into the socket 46 of the support frame 30 and mechanically secured. The openings of the fluid channels 51, 52, 53 are exposed in this intermediate assembly stage. The closed cooling channel is created by placing the bridge component 48 onto the support frame 30 and onto the rear of the MEMS multi-mirror unit 40 from behind. Fig. Figure 8 shows a top view of the inside of the bridge component 48, which, in its assembled state, rests on the support frame 30 and the structural body 41 of the MEMS multi-mirror unit 40. Fig. Figure 9 shows the opposite outer side of the bridge component 48, which faces outwards when the bridge component 48 is connected to the support frame 30.
[0057] The first channel section 58 of the bridge component 48 opens into a first connection opening 61 and a second connection opening 62. The second channel section 59 of the bridge component 48 opens into a third connection opening 63 and a fourth connection opening 64. In the assembled state, the first connection opening 61 forms a connection to the first fluid channel 51, the second connection opening 62 a connection to the inlet opening of the second fluid channel 52, the third connection opening 63 a connection to the outlet opening of the second fluid channel 52, and the fourth connection opening 64 a connection to the third fluid channel 53.
[0058] Each of the connection openings 61, 62, 63, 64 can be surrounded by a sealing ring 49, which is tensioned when the bridge component 48 is clamped against the support frame 30. Common sealing elements for several of the connection openings 61, 62, 63, 64 are also possible. The clamping force is generated by screw elements 55, which pass through bores in the bridge component 48 and engage in the support frame 30. The clamping force acts in a direction opposite to the direction in which the MEMS multi-mirror unit 40 is inserted into the socket 46.
[0059] The bridge component 48 is provided with a central bore 54. The lines 43, which supply the control electronics 42, are routed through the bore 54.
[0060] In the embodiment according to Fig. 10, Fig. In section 11, the bridge component 48 is provided with a second set of bores 55, which are arranged in the immediate vicinity of the central bore 54. These bores are used for further bolted connections 55, so that a direct clamping force exists both between the bridge component 48 and the support frame 30 and between the bridge component 48 and the structural body 41.
[0061] In the Fig. 12, Fig. 13 The bridge component 48 is clamped against the structural body 41 of the MEMS multi-mirror unit 40 by a single central screw connection 55. The bore 54, through which the lines 43 pass, is slightly offset to the side.
[0062] In Fig. Figure 14 shows an alternative embodiment in which the structural body 41 of the MEMS multi-mirror unit 40 projects downwards beyond the support frame 30. The MEMS multi-mirror unit 40 is fixed relative to the support frame by means of a nut 65, which engages the outer circumferential surface of the structural body 41.
[0063] The structural body 41 comprises a downwardly projecting pin 67, in the circumferential surface of which the inlet and outlet openings of the second fluid channel 52 are arranged. The bridge component 48 has a central opening that is placed onto the pin 67 until the pin 67 projects downwards beyond the bridge component 48. The bridge component 48 is clamped against the support frame 30 by a nut 66, which engages a circumferential surface of the pin 67. This is done as in the embodiment according to Fig. 7 a fluid connection was established between the first fluid channel 51 and the first channel section 58 and between the second channel section 59 and the third fluid channel 53.
[0064] The fluid connection between the bridge component 48 and the second fluid channel 52 is established via the outer circumferential surface of the pin 67 and the inner circumferential surface of the bridge component 48. The opposing openings between the first and second channel sections 58, 59, as well as between the second fluid channel 52, are formed by opposing connection openings, each of which opens into an annular space 73, 74 enclosed between them (see the enlarged illustration in [reference]). Fig. 15. The two annular spaces 73, 74 are separated from each other by three sealing rings 68, which extend over the circumference of the pin 67. In this embodiment, there is a right angle between the planes 71, 72 of the connection openings. A plane of a connection opening is defined as a plane that is orthogonal to an axis extending through the connection opening.
[0065] In Fig.In Figure 16, the first fluid channel 51 is connected to a first coupling part 69, and the second fluid channel 52 is connected to a second coupling part 70. The coupling parts 69 and 70 form a coupling that automatically establishes a fluid connection between the fluid channels 51 and 52 when the coupling parts 69 and 70 are brought close together axially. This eliminates the need to apply an axial clamping force. Conversely, the connection can be broken by moving the coupling parts 69 and 70 apart axially. Each coupling part 69 and 70 is equipped with a fluid stop that closes automatically when the coupling parts 69 and 70 are separated, preventing coolant from escaping the fluid channels 51 and 52. QUOTES INCLUDED IN THE DESCRIPTION
[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature
[0000] WO 2012 / 130768 A2
[0005] DE 10 2015 204 874 A1
[0006] DE 10 2015 220 018 A1
[0006] US 2006 / 0132747 A1
[0047] EP 1 614 008 B1
[0047] US 6,573,978
[0047] DE 10 2017 220 586 A1
[0047] DE 10 2008 009 600 A1
[0050]
Claims
[1] MEMS mirror module comprising a support frame (30), a MEMS multi-mirror unit (40) and a bridge component (48), wherein the MEMS multi-mirror unit (40) is inserted into a socket (46) of the support frame (30) such that a structural body (41) of the MEMS multi-mirror unit (40) is located in the socket (46), wherein a first fluid channel (51) is formed in the support frame (30), wherein a second fluid channel (52) is formed in the structural body (41), wherein a channel section (58) is formed in the bridge component (48), and wherein the bridge component (48) forms a connection between the first fluid channel (51) and the second fluid channel (52). [2] MEMS mirror module according to claim 1, wherein the bridge component (48) has a first connection opening (61) and a second connection opening (62) for connection to the first fluid channel (51) and to the second fluid channel (52). [3] MEMS mirror module according to claim 2, wherein the bridge component (48) is clamped against the support frame (30) and / or against the structural body (41) to generate a clamping force acting between the first connection opening (61) and the first fluid channel (51). [4] MEMS mirror module according to claim 2 or 3, wherein the first connection opening (61) is provided with a sealing element (49) which extends around the first connection opening (61). [5] MEMS mirror module according to one of claims 2 to 4, wherein the bridge component (48) is clamped against the support frame (30) and / or against the structural body (41) to generate a clamping force acting between the second connection opening (62) and the second fluid channel (52). [6] MEMS mirror module according to one of claims 2 to 5, wherein the first connection opening (61) and the second connection opening (62) are in planes parallel to each other. [7] MEMS mirror module according to one of claims 2 to 4, wherein the second connection opening (62) lies in a plane (72) which forms a right angle with the plane (71) of the first connection opening (61). [8] MEMS mirror module according to one of claims 2 to 4 or 7, wherein the second fluid channel (52) is connected to the first fluid channel (51) and / or to the second fluid channel (52) via an annular space (73, 74). [9] MEMS mirror module according to claim 8, wherein the annular space (73, 74) extends around a pin (67) formed by the structural body (41). [10] MEMS mirror module according to claim 8 or 9, wherein each annular space (73, 74) is enclosed between two sealing rings (68). [11] MEMS mirror module according to any one of claims 1 to 10, wherein the bridge component (48) comprises a first channel section (58) and a second channel section (59), wherein the first channel section (58) is connected to the first fluid channel (51) via a first connection opening (61), wherein the first channel section (58) is connected to an inlet opening of the second fluid channel (52) via a second connection opening (62), wherein the second channel section (59) is connected to an outlet opening of the second fluid channel (52) via a third connection opening (63), and wherein the second channel section (59) is connected to the third fluid channel (53) via a fourth connection opening (64). [12] Illumination system for a semiconductor technology system, comprising a first faceted mirror (18) and a second faceted mirror (19) designed to define a beam path such that an object (13) arranged in an object plane (12) is illuminated with uniform brightness by electromagnetic radiation emitted from a radiation source (14), wherein at least one of the faceted mirrors (18, 19) is configured as a MEMS mirror module according to any one of claims 1 to 11. [13] Assembly method for a MEMS mirror module, in which a MEMS multi-mirror unit (40) is inserted into a socket (46) of a support frame (30), such that a structural body (41) of the MEMS multi-mirror unit (40) is located in the socket (46), and in which the MEMS multi-mirror unit (40) is mechanically fixed to the support frame (30), wherein a first fluid channel (51) is formed in the support frame (30), wherein a second fluid channel (52) is formed in the structural body (41), and wherein a bridge component (48) is arranged on the support frame (30) and on the structural body (41), such that a connection is formed between the first fluid channel (51) and the second fluid channel (52) via a channel section (58) formed in the bridge component (48).