ELECTRICAL CONNECTION UNIT

Abstract

An electrical connection unit comprises an electronic component with a first terminal, an insulating base element with a plate-shaped or sheet-shaped flat surface section having a surface facing the electronic component, a first busbar supported by the flat surface section, electrically connected to the electronic component and comprising a first plate section and a first bent section, wherein the first plate section has a first connection section electrically connected to the first terminal, and the first bent section is bent from the first plate section in a direction that intersects the surface at a position aligned with the first connection section.

Description

[Technical field]

[0001] Embodiments of the present invention relate to an electrical connection unit. [State of the art]

[0002] An electrical connection unit comprising an electronic component and a busbar electrically connected to the electronic component is known. [State of the art document][Patent document]

[0003] [Patent document 1] Japanese unexamined patent application, first publication no. 2024-037492 [Description of the invention][Problems to be solved by the invention]

[0004] Furthermore, an improvement in the heat dissipation properties of an electrical connection unit is expected.

[0005] One embodiment provides an electrical connection unit that is able to improve heat dissipation properties. [Means of solving the problem]

[0006] An electrical connection unit according to one embodiment comprises an electronic component with a first terminal, an insulating base element with a plate-shaped or sheet-shaped flat surface section having a surface facing the electronic component, a first busbar supported by the flat surface section, electrically connected to the electronic component and comprising a first plate section and a first curved section, wherein the first plate section comprises a first connecting section electrically connected to the first terminal, and the first curved section is bent from the first plate section in a direction that intersects the surface at a position aligned with the first connecting section. [Effects of the invention]

[0007] According to one embodiment, it is possible to improve the heat dissipation properties. [Brief description of the drawings] [ Fig. 1] A cross-sectional view showing an electrical connection unit of one embodiment. [ Fig. 2] A perspective view to describe a main body of the embodiment. [ Fig. 3] A perspective view to describe a subunit of the embodiment. [ Fig. 4] A perspective view showing an electronic component and a connecting component of the embodiment. [ Fig. 5] A partially separated perspective view of the routing board of the embodiment. [ Fig. 6] An enlarged top view of the electrical connection unit in relation to F6 as shown in Fig. 3 shown. [ Fig. 7] An enlarged top view of an electronic component in Fig. 6 in transparent representation. [ Fig. 8] A cross-sectional view of the electrical connection unit along the in Fig. 3 shown line F8-F8. [ Fig. 9] A cross-sectional view of the electrical connection unit along the in Fig. 3 shown line F9-F9. [ Fig. 10] A cross-sectional view of the electrical connection unit along the in Fig. 3 shown line F10-F10. [ Fig. 11] A perspective view to describe a subunit in a modification example of the embodiment. [Embodiments of the invention]

[0008] The following descriptions illustrate embodiments with reference to the drawings. In the following description, assemblies with the same or similar functions are named using the same reference numerals. Redundant descriptions of these assemblies may be omitted. Note that the assembly described below does not limit the scope of the embodiment.

[0009] In the present disclosure, the terms are defined as follows. The term "connection" is not limited to a mechanical connection and may also include an electrical connection. That is to say, the term "connection" is not limited to a case in which two elements that are connection targets are directly connected and may include a case in which two elements that are connection targets are connected by another, intervening element. The term "receiving" is not limited to the case in which the entire component is received, but may also include the case in which only a part of the component is received (a state in which the remaining part of the component protrudes). The term "facing" indicates that the virtual projection images of two target objects overlap when viewed from a certain direction.This means that the term "facing" is not limited to the case where two target objects are directly facing each other, but can also include the case where two target objects are facing each other in a state in which another element is located between the two target objects. "Parallel," "orthogonal," or "equal" can each include "substantially parallel," "substantially orthogonal," or "substantially equal," respectively.

[0010] In the present disclosure, a +X direction, a -X direction, a +Y direction, a -Y direction, a +Z direction, and a -Z direction are defined as follows. The +X direction is a direction from a first end 110e1 to a second end 110e2 of a metal plate 110, which is described later (see Fig. 2) The -X direction is a direction opposite to the +X direction. If the +X and -X directions are not distinguished, the directions will be referred to simply as the "X direction" in the following. The +Y direction and the -Y direction are directions that intersect the X direction (for example, orthogonal to it). The +Y direction is a direction from a third end 110e3 to a fourth end 110e4 of the metal plate 110, which will be described later (see Fig. 2) The -Y direction is a direction opposite to the +Y direction. If the +Y and -Y directions are not distinguished, the directions will simply be referred to as the "Y direction" in the following. The +Z direction and the -Z direction are directions that intersect the X and Y directions (for example, orthogonal to them). The +Z direction is a direction from the metal plate 110, which will be described later, to a principal body MU (see Fig. 2) The -Z direction is the opposite of the +Z direction. When the +Z and -Z directions are not distinguished, the directions are simply referred to as the "Z direction" in the following. The Z direction is an example of a "first direction." The Y direction is an example of a "second direction." The X direction is an example of a "third direction."

[0011] If the X and Y directions are not distinguished, the directions can be referred to as the "horizontal direction" in the following. The Z direction can be referred to as the "vertical direction" in the following. The side in the +Z direction can be referred to as "top" and the side in the -Z direction as "bottom". However, these terms are descriptive and do not define a gravity direction of an electrical connection unit 1 (an installation position of the electrical connection unit 1). (Design)<1. Structure of the electrical connection unit>

[0012] Fig. Figure 1 is a cross-sectional view depicting an electrical connection unit 1 of an embodiment. The electrical connection unit 1 is, for example, an in-vehicle device attached to a vehicle such as an electric vehicle (EV), a hybrid electric vehicle (HEV), or a plug-in hybrid electric vehicle (PHEV). The electrical connection unit 1 may be referred to, for example, as an "electrical junction box" or "junction box." However, the electrical connection unit 1 is not limited to a box-shaped device.

[0013] The electrical connection unit 1, for example, has a housing 5, a main body MU, a metal plate 110, a plurality of heat transfer elements 120 (see Fig. 2) and a plurality of insulating covers 130 on (see Fig. 2). <2. Case>

[0014] First, the housing 5 is described. The housing 5 forms a contour of the electrical connection unit 1. The housing 5 has, for example, a base 6 (first element) and a cover 7 (second element). The base 6 is an element that covers the main body MU and the metal plate 110 from below. The base 6 has, for example, a plate-like shape extending horizontally or a shell-like shape open in the +Z direction. The base 6 is made, for example, of a synthetic resin. The cover 7 is an element that covers the main body MU and the metal plate 110 from above. The base 6 has, for example, a shell-like shape open in the -Z direction. The cover 7 is made, for example, of a synthetic resin. In the present embodiment, the box-shaped housing 5 is formed by the combination of the base 6 and the cover 7. The shape of the housing 5 is not limited to the above example.For example, the metal plate 110, which will be described later, can serve as part of the base 6 or as the entire base 6. The housing 5 can be omitted.

[0015] In the present embodiment, the electrical connection unit 1 has a first region (first space) R1 and a second region (second space) R2. The first region R1 is a region where heat dissipation is a primary concern. For example, an electronic component 10S with a high heat generation is located in the first region R1. The second region R2, on the other hand, is a region where ease of assembly is a primary concern. For example, an electronic component 10T is located in the second region R2, which has a lower heat generation than the electronic component 10S and / or requires a more complex assembly structure than the electronic component 10S. However, these details do not limit the electrical connection unit 1 of the present disclosure.For example, the amount of heat generated by electronic component 10T can be greater than the amount of heat generated by electronic component 10S. <3. Main body>

[0016] Next, the main body MU will be described.

[0017] Fig. Figure 2 is a perspective view illustrating the main body MU. The main body MU is a section that performs a main function (for example, switching electrical connection states or overcurrent protection) of the electrical connection unit 1. In the present embodiment, the main body MU is divided into a plurality of subunits SU. The main body MU is formed, for example, by connecting the plurality of subunits SU. In the present embodiment, the main body MU contains two subunits SU (the subunits SUS and SUT). Each subunit SU can be referred to as a "circuit assembly body".

[0018] The subunit SUS has a primary electrical function. For example, the subunit SUS contains a plurality of electronic components 10S and a routing board 40S. The plurality of electronic components 10S are electrically connected to the routing board 40S. The base plate 41S contained in the subunit SUS (which will be described later) is an example of a "primary element".

[0019] The subunit SUT has a secondary electrical function. This secondary function differs from the primary function. For example, the subunit SUT contains a plurality of electronic components 10T and a routing structure 40T. The plurality of electronic components 10T are electrically connected to the routing structure 40T. The basic element 41T contained within the subunit SUT (described later) is an example of a "second basic element".

[0020] In the present embodiment, the subunit SUS is a subunit SU in which heat dissipation is the primary function. The subunit SUS is arranged in the first region R1 of the electrical connection unit 1, as described above. The subunit SUS faces a first region A1 of the metal plate 110, which will be described later, in the Z-direction.

[0021] Subunit SUT, on the other hand, is a subunit SU where mountability is paramount. For example, subunit SUT is positioned laterally in the +Y direction relative to subunit SUS. Subunit SUT is located in the second region R2 of electrical connection unit 1, as described above. Subunit SUT faces a second region A2 of metal plate 110, which will be described later, in the Z direction. When electronic component 10S and electronic component 10T are not distinguished, they will be referred to simply as "electronic component 10" in the following.

[0022] Note that the main body MU need not be subdivided into multiple subunits SU, as in the example described above. For example, the multiple subunits SU can be formed as a single piece. For example, the base plate 41S of the routing board 40S and the base element 41T of the routing structure 40T can be formed as a single piece. Note that the base element 41T of the routing structure 40T has a three-dimensional structure that is thicker in the Z-direction than the base plate 41S of the routing board 40S. If the routing board 40S and the routing structure 40T are not distinguished from each other, they can simply be referred to as "routing structure 40". <4. Structure of the SUS subunit>

[0023] Next, the structure of the SUS subunit will be described.

[0024] Fig. Figure 3 is a perspective view illustrating the subunit SUS. The subunit SUS contains, for example, a plurality of electronic components 10, a plurality of connection components 20, and a routing board 40S. The connection component 20 is an element that forms a power supply path in the vertical direction. The connection component 20 can be referred to as a "vertical routing element". <4.1 Electronic Component>

[0025] First, the electronic component 10 is described. The electronic component 10 is an electronic component that is attached according to a function required for each subunit SU. For example, the electronic component 10 could be a connector, a fuse, a relay (for example, a mechanical relay or a solid-state relay), a capacitor, a branching component, any of several different sensors (for example, a current sensor or a voltage sensor), an electronic control unit, or an electronic component unit in which two or more of these components are combined. However, the type of electronic component 10 is not limited to the above example. The electronic component 10 could, for example, be a heat-generating component that produces heat when energy is supplied.

[0026] In the present embodiment, the majority of electronic components 10 include an electronic component 10S that generates a relatively large amount of heat when energy is supplied. The electronic component 10S is a relay (for example, a mechanical relay or a solid-state relay), a pyrolytic fuse, a current sensor (for example, a current sensor with a shunt resistor), or the like. However, the type of electronic component 10S is not limited to the example above.

[0027] Fig. Figure 4 is a perspective view showing the electronic component 10S and the connection component 20. The electronic component 10S is, for example, an electronic component in which a plurality of terminals 13 are arranged at one end of the electronic component 10S. The electronic component 10S includes, for example, a housing 11, a component body 12, a plurality of terminals 13, and a plurality of mounting sections 14. (Housing)

[0028] The housing 11 is an outer element that forms most of the outer shape of the electronic component 10S. The housing 11 is made of, for example, synthetic resin and has insulating properties. The housing 11 contains the component body 12. The housing 11 and the component body 12 can be formed from a single piece.

[0029] In the present embodiment, the housing 11 has an insulating rib 11a that projects horizontally (for example, in the Y-direction) and extends in the Z-direction. The insulating rib 11a has, for example, a plate-like shape formed horizontally (for example, in the Y-direction) and in the Z-direction. The insulating rib 11a extends, for example, over the entire length of the housing 11 in the Z-direction. The insulating rib 11a is arranged between the plurality of terminals 13 (a terminal 13A and a terminal 13B, which will be described later). The insulating rib 11a electrically isolates terminal 13A from terminal 13B. In the present embodiment, a portion of the insulating rib 11a is arranged between first sections 21 (which will be described later) of the two connection components 20 that are connected to the electronic component 10S.The insulating rib 11a provides electrical insulation between the first sections 21 of the two connecting components 20, which are connected to the electronic component 10S. (Component body)

[0030] The component body 12 is a section that performs a main function of the electronic component 10S. For example, if the electronic component 10S is a relay, the component body 12 contains a switch (for example, a contact) that toggles between a conductive and a non-conductive state. For example, if the electronic component 10S is a fuse, the component body 12 contains a melting section that blows when an overcurrent flows. For example, if the electronic component 10S is a capacitor, the component body 12 contains a section that stores electrical charge. (Connection)

[0031] Terminal 13 is an electrical connection section exposed to the outside of the housing 11. Terminal 13 is electrically connected to the component body 12 inside the housing 11. In the present embodiment, the electronic component 10S includes one terminal 13A and one terminal 13B as the plurality of terminals 13. One of the terminals 13A and 13B is a terminal on the positive electrode side. The other of the terminals 13A and 13B is a terminal on the negative electrode side. Terminal 13A is an example of a "first terminal." Terminal 13B is an example of a "second terminal."

[0032] In the present embodiment, terminal 13A and terminal 13B are provided at one end of the electronic component 10S in a horizontal direction (for example, in the Y direction). Both terminal 13A and terminal 13B are oriented horizontally (for example, in the X direction). Each terminal 13 has a mounting hole 13h to which a fastening element 71 (for example, a screw or a bolt), which will be described later, is attached. The mounting hole 13h is open in the horizontal direction (for example, in the Y direction). An inner circumferential surface of the mounting hole 13h of the electronic component 10S has a groove for the screw. (Fortification section)

[0033] Mounting section 14 is a section for fixing the electronic component 10S. Mounting section 14 has a mounting hole 14h, to which the fastening element 116 (for example, a screw or a bolt, see...) is attached. Fig. 3) is fastened. The fastening hole 14h is open in the Z-direction. The fastening hole 14h is an insertion hole through which the fastening element 116 passes. A fixing objective for the fastening section 14 will be described later. <4.2 Connection component>

[0034] Next, the connection component 20 is described. The connection component 20 is a component that electrically connects the electronic component 10S to the routing board 40S. The connection component 20 forms part of a power supply path in the subunit SUS. The connection component 20 is made of metal (for example, copper, a copper alloy, aluminum, or an aluminum alloy). The connection component 20 can be referred to as a "metal component".

[0035] In the present embodiment, the connecting component 20 electrically connects the electronic component 10S to the busbar 42 (see Fig. 3), which is included in the routing board 40S. In the present embodiment, the longitudinal length L12 of the connecting component 20 (for example, in the Y-direction) of the electronic component 10S is less than the longitudinal length L11 of the electronic component 10S. The connecting component 20 includes, for example, a first section 21 and a second section 22. (First section)

[0036] The first section 21 of the connecting component 20 is a section connected to terminal 13 of the electronic component 10S. The first section 21 is a plate-shaped or rectangular parallelepiped section extending in the Z direction. The first section 21 extends in the Z direction along one end (for example, an end in the Y direction) of the electronic component 10S. The first section 21 is a vertical section oriented in the Z direction with respect to the routing board 40S (for example, with respect to a busbar 42, which will be described later). The first section 21 is horizontally adjacent (for example, in the Y direction) to the electronic component 10S.For example, the first section 21 borders the terminal 13 of the electronic component 10S in a horizontal direction (for example, in the Y direction) and is connected to the terminal 13 of the electronic component 10S in a horizontal direction (for example, in the Y direction).

[0037] The first section 21 of the connecting component 20 has a first mounting hole 21h through which the fastening element 71 (for example, a screw or a bolt) passes. The first mounting hole 21h is open in the horizontal direction (for example, in the Y direction). The fastening element 71, passing through the first mounting hole 21h, is connected to the mounting hole 13h of the terminal 13 of the electronic component 10S, so that the first section 21 is physically and electrically connected to the terminal 13 of the electronic component 10S. (Second Section)

[0038] The second section 22 of the connecting component 20 is a section that is connected to the busbar 42 (see Fig. 3) The second section 22 projects horizontally (for example, in the Y direction) from the end of the first section 21 on the side in the -Z direction. The second section 22 is a plate section provided in the horizontal direction. The second section 22 borders the busbar 42 in the Z direction and is connected to the busbar 42 in the Z direction. The second section 22 of the connecting component 20 is attached to the fastening element 43 (for example, a screw or a bolt; see Fig. 3) is attached, projecting from the busbar 42 in the +Z direction and out of the Z direction, and is physically and electrically connected to the busbar 42. In the present embodiment, the second section 22 of the connecting component 20 has a second mounting hole 22h through which the fastening element 43 passes. The second mounting hole 22h is open in the Z direction. In the second section 22, the fastening element 43 passes through the second mounting hole 22h. A coupling element 44 (for example, a nut; see Fig. 3) is coupled to the tip of the fastening element 43, which passes through the second fastening hole 22h, thereby fixing the second section 22 to the busbar 42. In the present embodiment, the first section 21 and the second section 22 form an L-shaped connecting component 20.

[0039] In the present embodiment, the busbar 42 is arranged at a position remote from the terminal 13 of the electronic component 10S (for example, at a position remote in the Z direction). The connecting component 20 is arranged between the electronic component 10S and the busbar 42. In the present disclosure, the phrase "the connecting component is arranged between the electronic component and the busbar" is not limited to the case where part of the connecting component is arranged between the electronic component and the busbar when viewed from the X or Y direction.The phrase "the connecting component is arranged between the electronic component and the busbar" can correspond to a case in which part of the connecting component is located between the electronic component and the busbar when viewed from a direction inclined with respect to the X-direction or the Y-direction. The connecting component 20 electrically connects the terminal 13 of the electronic component 10S to the busbar 42. <4.3 Installation board>

[0040] Next, the 40S routing board will be described.

[0041] Fig. Figure 5 is a perspective view illustrating the routing board 40S. The routing board 40S is a component that forms at least part of a power supply path between a plurality of electronic components 10 (for example, a plurality of electronic components 10S) and / or at least part of a power supply path between the electronic component 10 contained in the subunit SUS (for example, the electronic component 10S) and the electronic component 10 contained in another subunit SU (for example, the subunit SUT). In this disclosure, the “routing board” denotes a board-like routing structure. The term “board-like” indicates a plate-like shape along a plane when viewed as a whole, regardless of any fine detail.In the present disclosure, the term "plate-shaped," "sheet-shaped," or "flat" shape is not limited to the case where it is completely flat and may include a case in which a fixing structure, a rib, or the like, projecting in the Z-direction, is partially present, a case in which a non-uniform shape, following the thickness of the busbar, is present on the surface, and the like. In the present embodiment, the routing board 40S has a plate-shaped form in the X and Y directions.

[0042] The distribution board 40S includes, for example, a base plate 41S, one or more (for example, a plurality of) busbars 42, and a plurality of fastening elements 43. In the present embodiment, the base plate 41S and the plurality of busbars 42 are integrated by insert forming. For example, the distribution board 40S is formed as a single element by insert forming the busbar 42 with the base plate 41S after the fastening element 43 has been fixed to the busbar 42. That is, the busbar 42 is integrated with the base plate 41S without the use of a fastening element such as a screw or bolt. Note that the distribution board 40S can also be formed by using a different structure instead of insert forming. A modification example in which the distribution board 40S is formed by using a different structure is described later.

[0043] Fig. Figure 6 is a partially unfolded perspective view showing the routing board 40S. For the sake of simplicity, the base plate 41S, the busbar 42, and the fastening element 43 are described below with reference to the drawings in which the routing board 40S is partially unfolded. <4.3.1 Base plate>

[0044] The base plate 41S is a support element that integrally carries the plurality of busbars 42 arranged horizontally at intervals. The base plate 41S is made, for example, of a synthetic resin and has insulating properties. The base plate 41S electrically insulates the plurality of busbars 42 from one another. The base plate 41S is an example of a "base element." The base plate 41S can also be referred to as an "insulating substrate." The base plate 41S has, for example, a flat surface section 51, a frame section 52, and a plurality of fixing sections 53 (see Fig. 10). (Flat surface section)

[0045] The flat surface section 51 is a section formed in the base plate 41S in a plate-like shape. The flat surface section 51 is plate-like in the horizontal direction. The flat surface section 51 forms a main section of the base plate 41S. The flat surface section 51 forms an (insulating) base section of the base plate 41S. In the present embodiment, the flat surface section 51 extends over the entire width in the X direction of the base plate 41S and over the entire width in the Y direction of the base plate 41S, with the exception of the frame section 52 of the base plate 41S.

[0046] The flat surface section 51 has a first surface 51a and a second surface 51b (see Fig. 10). The first surface 51a is a surface oriented in the +Z direction. The first surface 51a is a flat surface provided in the horizontal direction. The first surface 51a faces the majority of electronic components 10 (for example, the majority of electronic components 10S). The first surface 51a is an example of a "surface". The second surface 51b is located on the side opposite the first surface 51a. The second surface 51b is a surface oriented in the -Z direction. The second surface 51b is a flat surface provided in the horizontal direction. The second surface 51b faces the metal plate 110 (see Fig. 2) One thickness direction (plate thickness direction) of the flat surface section 51 is the Z-direction. In the present embodiment, a thickness T11 of the flat surface section 51 in the Z-direction is less than a thickness T1 of the busbar 42 in the Z-direction (for example, a thickness of a horizontal plate section 42p, which will be described later, in the Z-direction) (see Fig. 10) The thickness T11 of the flat surface section 51 in the Z direction can be equal to or greater than the thickness T1 of the busbar 42 in the Z direction.

[0047] The flat surface section 51 has, for example, one or more (for example, a plurality of) receiving sections 55 in which the busbars 42 are each received. The plurality of receiving sections 55 are spaced apart from one another in the X or Y direction. Each of the receiving sections 55 is, for example, a through-hole that penetrates the flat surface section 51 in the Z direction. Note that the receiving section 55 can be a recess provided on the first surface 51a or the second surface 51b of the flat surface section 51 and is recessed in the Z direction, instead of a through-hole.In the present disclosure, the phrase “the receiving section penetrates the flat surface section in the first direction (Z-direction)” may include a case in which part of the total length of the receiving section 55 penetrates the flat surface section 51 in the Z-direction (for example, the remaining part of the receiving section 55 may be a recess in the Z-direction or be provided within the base plate 41S and not be exposed to the outside of the base plate 41S).Similarly, in the present disclosure, the phrase “the receiving section is recessed in the first direction (Z direction)” may include a case in which part of the total length of the receiving section 55 is recessed in the Z direction (for example, a remaining part of the receiving section 55 may be a through hole penetrating the flat surface section 51 in the Z direction, or it may be provided within the base plate 41S and is not exposed to the outside of the base plate 41S).

[0048] Each receiving section 55 has an outer shape that, viewed from the Z-direction, corresponds to the shape of the busbar 42 to be received. For example, the majority of receiving sections 55 contain four receiving sections 55A, 55B, 55C, and 55D. Receiving section 55A is designed to correspond to a busbar 42A, which will be described later, and receives at least a portion of the busbar 42A. Receiving section 55B is designed to correspond to a busbar 42B, which will be described later, and receives at least a portion of the busbar 42B. Receiving section 55C is designed to correspond to a busbar 42C, which will be described later, and receives at least a portion of the busbar 42C. Receiving section 55D is designed to correspond to a busbar 42D, which will be described later, and receives at least a portion of the busbar 42D. (Frame section)

[0049] Frame section 52 is provided at one circumferential end of the base plate 41S. Frame section 52 is a reinforcing rib that projects vertically from one end of the flat surface section 51 (see Fig. 9) For example, the width (thickness) H11 of the frame section 52 in the Z-direction is less than half the width (thickness) H12 of the electronic component 10 in the Z-direction (see Fig. 9). Note that section 52 of the framework can be omitted. (Fixation section)

[0050] The fixing section 53 is a section that is fixed to the metal plate 110 (see Fig. 10) The fixing section 53 has a mounting hole 53h that penetrates the base plate 41S in the Z direction. A fastening element 115 (for example, a screw or a bolt), which will be described later, passes through the mounting hole 53h. This will be described later. <4.3.2 Busbar>

[0051] The busbar 42 is a routing element (electrical connection element) contained in the routing board 40S. The busbar 42 is, for example, a routing element for electrically connecting a plurality of electronic components (for example, a plurality of electronic components 10S). Alternatively, the busbar 42 can also be a routing element for electrically connecting the electronic component 10 (for example, the electronic component 10S) to the electronic component 10 contained in another subunit SU (for example, the subunit SUT). The busbar 42 is made of metal (for example, copper, a copper alloy, aluminum, or an aluminum alloy) and is conductive and has heat transfer properties. As in Fig. As shown in Figure 3, a plurality of busbars 42 in the present embodiment comprises, for example, four busbars 42A, 42B, 42C, and 42D. The four busbars 42A, 42B, 42C, and 42D are arranged at intervals in the horizontal direction. The four busbars 42A, 42B, 42C, and 42D contain sections arranged in the same plane. The four busbars 42A, 42B, 42C, and 42D are supported by the flat surface section 51 of the base plate 41S. In the present disclosure, the phrase "the busbar is supported by the flat surface section" is not limited to the case where the busbar 42 is received in the receiving section 55, but can also include the case where the busbar 42 is attached to the first surface 51a or the second surface 51b of the flat surface section 51.

[0052] As in Fig. As shown in Figure 5, at least a portion of each busbar 42 has a plate-like shape extending in the horizontal direction. At least a portion of each busbar 42 is received in the receiving section 55 and extends along the flat surface section 51. That is, at least a portion of each busbar 42 extends along the first surface 51a of the flat surface section 51. At least a portion of each busbar 42 extends horizontally within the receiving section 55. Hereinafter, a plate-like portion of each busbar 42 extending horizontally can be referred to as the "horizontal plate section 42p". The horizontal plate section 42p is an example of a "plate section". The busbar 42 is an element that forms a horizontal energy supply path. The busbar 42 can also be referred to as a "horizontal routing element".

[0053] Each busbar 42, for example, has a connecting section 61, a connecting section 62, and an extending section 63. The connecting section 61 is located in the middle of the busbar 42 or at the first end of the busbar 42. The connecting section 61 is a section that is connected directly to the electronic component 10 (for example, the electronic component 10S) or via the connecting component 20. As shown in Fig. 6 and Fig. As shown in Figure 7, the connecting section 61 can, for example, have a section that overlaps the second section 22 of the connecting component 20 when viewed from the Z-direction. The connecting section 61 can, for example, have a section that is in direct contact with the second section 22 of the connecting component 20. The connecting section 61 borders the connecting component 20 in the Z-direction and is connected to the connecting component 20 in the Z-direction.

[0054] Busbar 42A is an example of a "first busbar". Horizontal plate section 42p of busbar 42A is an example of a "first plate section". Connecting section 61 of busbar 42A is an example of a "first connecting section".

[0055] Busbar 42B is an example of a "second busbar". The horizontal plate section 42p of busbar 42B is an example of a "second plate section". The connecting section 61 of busbar 42B is an example of a "second connecting section".

[0056] Instead of the example above, the connecting section 61 can, for instance, be adjacent to the terminal 13 of the electronic component 10 in the Z-direction and be directly connected to the terminal 13 of the electronic component 10 in the Z-direction. In this case, the connecting section 61 can, for example, have a section that overlaps the terminal 13 when viewed from the Z-direction. The connecting section 61 can, for example, have a section that is in direct contact with the terminal 13.

[0057] The connecting section 62 is located in the middle of the busbar 42 or at the second end of the busbar 42. The connecting section 62 is a section that is connected to another electronic component 10 directly or via another connecting component 20. Instead of the example above, the connecting section 62 can be connected to another busbar 42 (for example, the busbar 42 contained in another subunit SU) or to an external connecting busbar.

[0058] Extending section 63 extends from connecting section 61 in the X-direction or in the Y-direction. Extending section 63 is provided between connecting section 61 and connecting section 62. Extending section 63 extends over connecting section 61 and connecting section 62. Extending section 63 connects connecting section 61 to connecting section 62.

[0059] In the present embodiment, the horizontal plate section 42p described above comprises at least the entire connecting section 61 and a part of the extending section 63. That is to say, at least the entire connecting section 61 and a part of the extending section 63 are received in the receiving section 55 and are located on the same plane.

[0060] In the present embodiment, the extending sections 63 of some busbars 42 are received in the receiving section 55, such that they pass through a region that overlaps the electronic component 10 as viewed from the Z-direction and extend over both sides of the region overlapped by the electronic component 10. For example, the extending section 63 over the region overlapped by the electronic component 10 as viewed from the Z-direction extends over one side in the -Y-direction and one side in the +Y-direction of the region overlapping the electronic component 10. That is, the busbar 42 is received in the receiving section 55 in such a way that it can easily be routed along a better path (for example, a path with a shorter distance) without being obstructed by the presence of the electronic component 10.

[0061] One or more busbars 42 may have an extension 64 in addition to the connecting section 61, the connecting section 62, and the extending section 63. The extension 64 is a section in which the busbar 42 extends to increase a heat dissipation area and / or to increase heat storage capacity (heat absorption). The extension 64 is a section that is not used for electrical connection. For example, the extension 64 is located on the side opposite the extending section 63 with respect to the connecting section 61 (or the connecting section 62). The extension 64 has a plate-like shape formed in the horizontal direction. The extension 64 is contained within the horizontal plate section 42p. The extension 64 is contained within the receiving section 55 and extends along the flat surface section 51.The extension 64 extends to a region that overlaps the electronic component 10 as seen from the Z direction, and has an end 42e1 of the busbar 42 at a position that overlaps the electronic component 10 as seen from the Z direction. (Curved section)

[0062] As in Fig. As shown in Figures 6 to 8, busbar 42A and busbar 42B further comprise a plurality of bent sections 90. Busbar 42A further comprises a first bent section 91 and a second bent section 92 as a pair of bent sections 90 from the plurality of bent sections 90. Busbar 42B further comprises a third bent section 93 and a fourth bent section 94 as another pair of bent sections 90 from the plurality of bent sections 90. Viewed from the Z-direction, the plurality of bent sections 90 can, for example, surround the pair of connecting sections 61, which are connected to the nearest electronic component 10S, from three directional sides (the side in the +X direction, the side in the -X direction, and the side in the -Y direction).Viewed from the Z direction, the majority of curved sections 90 can, for example, surround the pair of connecting components 20 that are connected to the nearest electronic component 10S from three directional sides (the side in the +X direction, the side in the -X direction and the side in the -Y direction).

[0063] The first bent section 91 is located near the nearest electronic component 10S of the majority of electronic components 10S and near the connecting section 61, which corresponds to the electronic component 10S that is connected to the nearest electronic component 10S. The first bent section 91 is bent in the +Z direction from an edge on the side in the -X direction of the horizontal plate section 42p of the busbar 42A at a position aligned with the connecting section 61 of the busbar 42A in the X direction. For example, viewed from the Y direction, the first bent section 91 can be bent in an L shape and at a right angle from the edge on the side in the -X direction of the horizontal plate section 42p of the busbar 42A.The first curved section 91 is aligned in the -X direction with respect to the nearest connection component 20 (the connection component 20 that is connected to terminal 13A of the nearest electronic component 10S) and the nearest electronic component 10S. The distance between the first curved section 91 and the nearest electronic component 10S in the X direction can be less than, for example, the width of the nearest electronic component 10S in the alignment direction (e.g., the X direction). The distance between the first curved section 91 and the nearest electronic component 10S in the X direction can be less than, for example, 1 / 2 the width of the electronic component 10S in the alignment direction (e.g., the X direction).However, the distance between the first curved section 91 and the nearest connecting component 20 in the X-direction can be less than, for example, the width of the nearest connecting component 20 in the orientation direction (e.g., the X-direction). The distance between the first curved section 91 and the nearest connecting component 20 in the X-direction can be less than, for example, 1 / 2 the width of the nearest connecting component 20 in the orientation direction (e.g., the X-direction). The distance between the first curved section 91 and the nearest connecting component 20 in the X-direction can be less than, for example, 1 / 4 the width of the nearest connecting component 20 in the orientation direction (e.g., the X-direction).

[0064] The first bent section 91 extends in the Z-direction with a length that does not exceed the height of the nearest electronic component 10S. The first bent section 91 has a first bending surface 91a oriented in the +X direction. At least a portion of the first bending surface 91a faces, for example, a surface of the nearest electronic component 10S oriented in the -X direction and a surface of the nearest connecting component 20 oriented in the -X direction at a distance in the X direction. At least a portion of the first bending surface 91a faces, for example, a surface of the nearest electronic component 10S oriented in the -X direction and a surface of the nearest connecting component 20 oriented in the -X direction directly, without any other element intervening. The first bending surface 91a can, for example, be a planar surface.

[0065] Among the majority of electronic components 10S, the second curved section 92 is located near the nearest electronic component 10S and near the connecting section 61, which corresponds to the electronic component 10S that is connected to the nearest electronic component 10S. The second curved section 92 is bent in the +Z direction from the edge on the side in the -Y direction of the horizontal plate section 42p of the busbar 42A at a position aligned with the connecting section 61 of the busbar 42A in the Y direction. For example, viewed from the X direction, the second curved section 92 can be bent in an L shape and at a right angle from the edge on the side in the -Y direction of the horizontal plate section 42p of the busbar 42A.The second curved section 92 is aligned in the -Y direction with respect to the nearest connection component 20 (the connection component 20 that is connected to terminal 13A of the nearest electronic component 10S) and the nearest electronic component 10S. The distance between the second curved section 92 and the nearest electronic component 10S in the Y direction can be less than, for example, the width (e.g., the length L11; see ). Fig. 4) of the electronic component 10S in the orientation direction (e.g., the Y-direction). The distance between the second curved section 92 and the nearest electronic component 10S in the Y-direction can be less than, for example, 1 / 2 the width of the electronic component 10S in the orientation direction (e.g., the Y-direction). Conversely, the distance between the second curved section 92 and the nearest connecting component 20 in the Y-direction can be less than, for example, the width (e.g., the length L12; see Fig. 4) the nearest connection component 20 in the orientation direction (e.g., the Y-direction). The distance between the second curved section 92 and the nearest connection component 20 in the Y-direction can be less than, for example, 1 / 2 the width of the nearest connection component 20 in the orientation direction (e.g., the Y-direction). The distance between the second curved section 92 and the nearest connection component 20 in the Y-direction can be less than, for example, 1 / 4 the width of the nearest connection component 20 in the orientation direction (e.g., the Y-direction).

[0066] The second bent section 92 extends in the Z-direction with a length that does not exceed the height of the nearest electronic component 10S. The second bent section 92 has a second bending surface 92a oriented in the +Y direction. At least a portion of the second bending surface 92a faces, for example, a surface of the nearest electronic component 10S oriented in the -Y direction and a surface of the nearest connecting component 20 oriented in the -Y direction at a distance in the Y direction. At least a portion of the second bending surface 92a faces, for example, a surface of the nearest electronic component 10S oriented in the -Y direction and a surface of the nearest connecting component 20 oriented in the -Y direction directly, without any other element intervening. The second bending surface 92a can, for example, be a planar surface.

[0067] The third curved section 93 is located near the nearest electronic components 10S and near the connecting section 61, which is connected to the nearest electronic component 10S. The third curved section 93 is bent in the +Z direction from the edge on the side in the +X direction of the horizontal plate section 42p of the busbar 42B at a position aligned with the connecting section 61 of the busbar 42B in the X direction. For example, viewed from the Y direction, the third curved section 93 can be bent in an L shape and at a right angle from the edge on the side in the +X direction of the horizontal plate section 42p of the busbar 42B.The third curved section 93 is aligned in the +X direction with respect to the nearest connection component 20 (the connection component 20 that is connected to terminal 13B of the nearest electronic component 10S) and the nearest electronic component 10S. The distance between the third curved section 93 and the nearest electronic component 10S in the X direction can be less than, for example, the width of the nearest electronic component 10S in the alignment direction (e.g., the X direction). The distance between the third curved section 93 and the nearest electronic component 10S in the X direction can be less than, for example, 1 / 2 the width of the electronic component 10S in the alignment direction (e.g., the X direction).However, the distance between the third curved section 93 and the nearest connection component 20 in the X-direction can be less than, for example, the width of the nearest connection component 20 in the orientation direction (e.g., the X-direction). The distance between the third curved section 93 and the nearest connection component 20 in the X-direction can be less than, for example, 1 / 2 the width of the nearest connection component 20 in the orientation direction (e.g., the X-direction). The distance between the third curved section 93 and the nearest connection component 20 in the X-direction can be less than, for example, 1 / 4 the width of the nearest connection component 20 in the orientation direction (e.g., the X-direction).

[0068] The third curved section 93 extends in the Z-direction with a length that does not exceed the height of the nearest electronic component 10S. The third curved section 93 has a third curved surface 93a oriented in the -X direction. At least a portion of the third curved surface 93a faces, for example, a surface of the nearest electronic component 10S oriented in the +X direction and a surface of the nearest connecting component 20 oriented in the +X direction at a distance in the X direction. For example, at least a portion of the third curved surface 93a faces a surface of the nearest electronic component 10S oriented in the +X direction and a surface of the nearest connecting component 20 oriented in the +X direction directly, without any other element intervening.The third bending surface 93a can, for example, be a flat surface that runs parallel to the first bending surface 91a.

[0069] Among the majority of electronic components 10S, the fourth bent section 94 is located near the nearest electronic component 10S and near the connecting section 61, which is connected to the nearest electronic component 10S. The fourth bent section 94 is bent in the +Z direction from the edge on the side in the -Y direction of the horizontal plate section 42p of the busbar 42B at a position aligned with the connecting section 61 of the busbar 42B in the Y direction. For example, viewed from the X direction, the fourth bent section 94 can be bent in an L shape and at a right angle from the edge on the side in the -Y direction of the horizontal plate section 42p of the busbar 42B.The fourth curved section 94 is aligned in the -Y direction with respect to the nearest connection component 20 (the connection component 20 that is connected to terminal 13B of the nearest electronic component 10S) and the nearest electronic component 10S. The distance between the fourth curved section 94 and the nearest electronic component 10S in the Y direction can be less than, for example, the width of the nearest electronic component 10S in the alignment direction (e.g., the Y direction). The distance between the fourth curved section 94 and the nearest electronic component 10S in the Y direction can be less than, for example, 1 / 2 the width of the electronic component 10S in the alignment direction (e.g., the Y direction).However, the distance between the fourth curved section 94 and the nearest connection component 20 in the Y-direction can be less than, for example, the width of the nearest connection component 20 in the orientation direction (e.g., the Y-direction). The distance between the fourth curved section 94 and the nearest connection component 20 in the Y-direction can be less than, for example, 1 / 2 the width of the nearest connection component 20 in the orientation direction (e.g., the Y-direction). The distance between the fourth curved section 94 and the nearest connection component 20 in the Y-direction can be less than, for example, 1 / 4 the width of the nearest connection component 20 in the orientation direction (e.g., the Y-direction).

[0070] The fourth bent section 94 extends in the Z-direction with a length that does not exceed the height of the nearest electronic component 10S. The fourth bent section 94 has a fourth bending surface 94a oriented in the +Y direction. At least a portion of the fourth bending surface 94a faces, for example, a surface of the nearest electronic component 10S oriented in the -Y direction and a surface of the nearest connecting component 20 oriented in the -Y direction at a distance in the Y direction. For example, at least a portion of the fourth bending surface 94a faces a surface of the nearest electronic component 10S oriented in the -Y direction and a surface of the nearest connecting component 20 oriented in the -Y direction directly, without any other element intervening.The fourth bending surface 94a can, for example, be a flat surface that runs parallel to the second bending surface 92a.

[0071] If the majority of the curved sections are 90°, the height of the routing structure 40T in the Z-direction can be greater than the height of the routing plate 40S in the Z-direction. By providing a height difference between the routing plate 40S and the routing structure 40T, sufficient space is created above the routing plate 40S for easy airflow. Furthermore, by making the routing plate 40S thinner than the routing structure 40T, it is easier to incorporate the majority of curved sections 90° and to allow the majority of these curved sections to extend in the Z-direction. (Exposed structure on the upper surface side of each busbar)

[0072] In the present embodiment, at least a portion of the busbar 42 is exposed towards the upper surface of the base plate 41S. For example, the connecting section 61, the connecting section 62, and the extending section 63 of the busbar 42 are exposed on the upper surface (the first surface 51a of the flat surface section 51) of the base plate 41S. For example, the extending section 63 of the busbar 42 is exposed on the upper surface of the base plate 41S at least over its entire length between the connecting section 61 and the connecting section 62. (Exposed structure on the lower surface side of each busbar)

[0073] In the present embodiment, at least a portion of the busbar 42 is exposed towards the lower surface of the base plate 41S. For example, the entire connecting section 61 and at least a portion of the extending section 63 are exposed on the lower surface of the base plate 41S (the second surface 51b of the flat surface section 51) facing the outside of the base plate 41S. In the present embodiment, a gap S1 is formed between the flat surface section 51 of the base plate 41S and the metal plate 110 (see Fig. 9). The busbar 42 has an exposed section 42u, which is exposed towards the gap S1 (see Fig. 9). The exposed section 42u, for example, includes the entire connecting section 61 and at least part of the extending section 63. <4.3.3 Fastener>

[0074] Next, the fastening element 43 will be described.

[0075] As in Fig. As shown in Figure 9, the fastening element 43 is a component for fixing the busbar 42 to the connecting component 20, which corresponds to the busbar 42. The fastening element 43 is, for example, a crimping bolt fixed to the busbar 42. The fastening element 43 is an example of a "fastening section".

[0076] In the present embodiment, the connecting section 61 and / or the connecting section 62 of the busbar 42 have a through-hole 42h. The through-hole 42h penetrates the busbar 42 in the Z-direction. The fastening element 43 is, for example, a bolt with a shank 43a and a head 43b. A circumferential surface of the shank 43a has a groove for the screw. The head 43b has a diameter larger than that of the shank 43a. The head 43b of the fastening element 43 is riveted and fixed to the busbar 42 in such a way that the shank 43a passes through the through-hole 42h of the busbar 42. With this fixing, the fastening element 43 is electrically and physically connected to the busbar 42, in a state in which the shaft 43a protrudes from the through hole 42h of the busbar 42 in the +Z direction.The fastening element 43 is not limited to fixing by riveting, but can also be fixed to the busbar 42 by welding or other methods.

[0077] In the present embodiment, the connecting component 20, having previously been fixed to the electronic component 10 via the fastening element 71, is attached to the fastening element 43 in the Z-direction. For example, in the connecting component 20, the shaft 43a of the fastening element 43 is inserted into the second fastening hole 22h of the second section 22. The coupling element 44 (for example, a nut) is connected to the shaft 43a of the fastening element 43, which protrudes from the second fastening hole 22h of the second section 22 of the connecting component 20. The coupling element 44 is attached to the shaft 43a in the Z-direction. This coupling secures the second section 22 of the connecting component 20 to the fastening element 43. <5. Heat transfer element>

[0078] First, the heat transfer element 120 is described.

[0079] The heat transfer element 120 is an element for transferring the heat generated by the electronic component 10 (for example, the electronic component 10S) at the time of energy supply and / or the heat generated by the busbar 42 itself at the time of energy supply (Joule heat) to the metal plate 110. The heat transfer element 120 is, for example, a heat transfer film (for example, a thermally conductive silicone film) that is elastic. The heat transfer element 120 consists of a material with a higher thermal conductivity than, for example, the base plate 41S (or the base element 41T). However, the heat transfer element 120 is not limited to the above example, but can also be a heat transfer element made of a thermally conductive gel or another material. In the present embodiment, the heat transfer element 120 has an insulating property.

[0080] In the present embodiment, the heat transfer element 120 is partially provided in the routing board 40S (see Fig. 2) For example, the heat transfer element 120 is arranged in a position that overlaps a portion of the busbar 42 as viewed from the Z-direction. The heat transfer element 120 is located between the busbar 42 and a flat surface section 111 of the metal plate 110, which will be described later. For example, the heat transfer element 120 is located between the exposed section 42u of the busbar 42 and the flat surface section 111 of the metal plate 110, and is in contact with both the exposed section 42u of the busbar 42 and the flat surface section 111 of the metal plate 110. The heat transfer element 120 transfers the heat transferred from the electronic component 10 (for example, the electronic component 10S) to the busbar 42 and / or the heat generated by the busbar 42 from the busbar 42 to the flat surface section 111 of the metal plate 110.

[0081] In the present embodiment, the heat transfer element 120 is arranged in a position that overlaps a portion of the busbar 42 near the electronic component 10 (for example, the electronic component 10S) when viewed from the Z-direction. In the present embodiment, the heat transfer element 120 is arranged in a position that overlaps the connecting component 20 when viewed from the Z-direction. In other words, the heat transfer element 120 is arranged in a position that overlaps the connecting section 61 or the connecting section 62 of the busbar 42 when viewed from the Z-direction. The heat transfer element 120 transfers the heat transferred from the electronic component 10S to the busbar 42 via the connecting component 20 from the busbar 42 to the flat surface section 111 of the metal plate 110. <6. Fixing structure of the installation board and electronic component>

[0082] Next, a fixing structure for the routing board 40S and the electronic component 10 is described.

[0083] As in Fig. As shown in Figure 10, the metal plate 110, for example, has in addition to a flat surface section 111, which will be described later, a fixing section 112 and a fixing section 113.

[0084] The fixing section 112 is a section for fixing the base plate 41S to the metal plate 110. The fixing section 112 is located in a position corresponding to the fixing section 53 of the base plate 41S when viewed from the Z-direction. The fixing section 112 is a cylindrical or prismatic projection that extends in the +Z direction from the flat surface section 111 of the metal plate 110. The fixing section 112 has a coupling hole 112h that is open in the +Z direction. An inner circumferential surface of the coupling hole 112h has a groove for the screw.

[0085] As described above, the fixing section 53 of the base plate 41S has a mounting hole 53h. A fastening element 115 (for example, a screw or a bolt) passes through the mounting hole 53h. When the fastening element 115, which passes through the mounting hole 53h of the fixing section 53 of the base plate 41S, engages in the coupling hole 112h of the fixing section 112 of the metal plate 110, the base plate 41S is fixed to the metal plate 110.

[0086] The fixing section 113 is a fixing section for directly fixing the electronic component 10 (for example, the electronic component 10S) to the metal plate 110 without the base plate 41S being interposed. The fixing section 113 is located in a position corresponding to the mounting section 14 of the electronic component 10 when viewed from the Z-direction. The fixing section 113 is a cylindrical or prismatic projection that extends from the flat surface section 111 in the +Z direction. The fixing section 113 has a coupling hole 113h that is open in the +Z direction. An inner circumferential surface of the coupling hole 113h has a groove for the screw.

[0087] In the present embodiment, the flat surface section 51 of the base plate 41S has a through-hole 51h. The through-hole 51h penetrates the flat surface section 51 in the Z-direction. The through-hole 51h is located at a position corresponding to the fixing section 113 of the metal plate 110 when viewed from the Z-direction. The fixing section 113 of the metal plate 110 passes through the through-hole 51h of the base plate 41S and projects to the same position as the first surface 51a of the flat surface section 51 or closer to the side in the +Z direction than the first surface 51a of the flat surface section 51.The fastening section 14 of the electronic component 10 is in contact with the fixing section 113 at the same position as the first surface 51a of the flat surface section 51 or at a position closer to the side in the +Z direction than the first surface 51a of the flat surface section 51.

[0088] A fastening element 116 (for example, a screw or a bolt) passes laterally in the +Z direction through the fastening hole 14h of the fastening section 14 of the electronic component 10. When the fastening element 116, passing through the fastening hole 14h of the fastening section 14 of the electronic component 10, engages in the coupling hole 113h of the fixing section 113 of the metal plate 110, the electronic component 10 is fixed to the metal plate 110 without the base plate 41S being interposed. Note that instead of the above example, the electronic component 10 can be fixed to a fixing section provided in the base plate 41S. <8. Metal plate and insulating cover>

[0089] Next, with further reference to Fig. 2 the metal plate 110 and the insulating cover 130 are described. <8.1 Metal plate>

[0090] The metal plate 110 is an element used to ensure the rigidity of the electrical connection unit 1 and to improve its heat dissipation properties. The metal plate 110 is made of metal (for example, aluminum or an aluminum alloy). The metal plate 110 is an example of a "rigid element." The metal plate 110 can also be referred to as a "metal element" or a "heat dissipation element."

[0091] The metal plate 110 has a rectangular shape formed in the X and Y directions. The metal plate 110 has a first end 110e1, a second end 110e2, a third end 110e3, and a fourth end 110e4. The first end 110e1 and the second end 110e2 are a pair of ends of the metal plate 110 in the longitudinal direction, separated from each other in the X direction. The third end 110e3 and the fourth end 110e4 are a pair of ends of the metal plate 110 in the lateral direction, separated from each other in the Y direction. The metal plate 110 contains, for example, the flat surface section 111 and the plurality of fixing sections 112 described above (see Fig. 10) and the majority of fixing sections described above 113 (see Fig. 10).

[0092] The flat surface section 111 is a section formed in the metal plate 110 in a plate-like shape. The flat surface section 111 is plate-like in the horizontal direction. The flat surface section 111 forms a main section of the metal plate 110. The flat surface section 111 forms a base section (metal base section) of the metal plate 110. The flat surface section 111 is large enough to cover the two subunits SU from below.

[0093] In the present embodiment, the flat surface section 111 has a first region A1 and a second region A2. The first region A1 is, for example, a region on the side in the -Y direction of the flat surface section 111. The subunit SUS described above faces the first region A1 of the flat surface section 111 when viewed from the Z direction. That is, the majority of electronic components 10S and the base plate 41S contained in the subunit SUS face the first region A1 of the flat surface section 111 in the Z direction.

[0094] The second region A2, for example, is a region on the side in the +Y direction of the flat surface section 111. The subunit SU described above faces the second region A2 of the flat surface section 111 when viewed from the Z direction. That is, the majority of electronic components 10T and the basic element 41T contained in the subunit SU face the second region A2 of the flat surface section 111 in the Z direction. <8.2 Insulating cover>

[0095] The insulating cover 130 is a component that prevents a user's finger from coming into contact with the power supply path of the subunit SU. The insulating cover 130 is made, for example, of a synthetic resin and has insulating properties. The insulating cover 130 has, for example, a box-shaped form that is open on the side in the -Z direction. The insulating cover 130 has multiple ventilation holes 130h. The insulating cover 130 partially or completely covers the corresponding subunit SU. Note that the insulating cover 130 is not limited to a box-shaped form; it can also be a sheet-metal element that covers the power supply path of the main body MU. The insulating cover 130 can be omitted. <9. Advantages><A. Vorteile des gebogenen Abschnitts>

[0096] The first curved section 91 of the present embodiment is bent in the Z direction from the horizontal plate section 42p at a position aligned with the connecting section 61. In this configuration, a portion of the space around the electronic component 10S can be effectively used for heat dissipation. The heat trapped in the busbar 42 near the electronic component 10S is stored in each curved section 90. Furthermore, the heat trapped in the busbar 42A near the electronic component 10S is dissipated to the surroundings of the electronic component 10S via the first curved section 91. This improves the heat dissipation properties.

[0097] The first curved section 91 of the present embodiment extends in the Z direction. In this design, a space extending in the Z direction around the electronic component 10S can be effectively used for heat dissipation. This improves the heat dissipation properties.

[0098] The second curved section 92 of the present embodiment is bent in the Z-direction at a position aligned with the connecting section 61. The second curved section 92 intersects the direction in which the first curved section 91 is oriented. In this configuration, a pair of spaces around the electronic component 10S, i.e., a pair of spaces oriented in intersecting directions, can be effectively used for heat dissipation. The heat trapped in the busbar 42A near the electronic component 10S is stored in the second curved section 92. Furthermore, the heat trapped in the busbar 42A near the electronic component 10S is dissipated to the surroundings of the electronic component 10S via the second curved section 92. This improves the heat dissipation properties.

[0099] In the present embodiment, the second curved section 92 is aligned in the Y-direction with the connecting component 20 connected to terminal 13A. The first curved section 91 is aligned in the X-direction with the connecting component 20 connected to terminal 13A. In this configuration, one space aligned with the connecting component 20 in the Y-direction and another aligned with the connecting component 20 in the X-direction can be effectively used for heat dissipation in some of the spaces around the electronic component 10S. This improves the heat dissipation properties.

[0100] In the present embodiment, the third curved section 93 is bent in the Z-direction at a position aligned with the connecting section 61. The fourth curved section 94 is also bent in the Z-direction at a position aligned with the connecting section 61. With this design, spaces in other sections around the electronic component 10S can be used more effectively for heat dissipation. The heat trapped in the busbar 42B near the electronic component 10S is stored in the third curved section 93 and the fourth curved section 94. Furthermore, the heat trapped in the busbar 42B near the electronic component 10S is dissipated to the surroundings of the electronic component 10S via the third curved section 93 and the fourth curved section 94. This improves the heat dissipation properties. <B. Vorteile im Zusammenhang mit der Aufteilung in eine Mehrzahl von Regionen in der elektrischen Verbindungseinheit>

[0101] As a comparative example, consider a setup in which an electronic component where heat dissipation is a priority and an electronic component where mountability is a priority are attached to a base element. With such a setup, it can be difficult to improve mountability by choosing a thin base element, while it can be difficult to improve heat dissipation by choosing a relatively thick base element.

[0102] On the other hand, in the electrical connection unit 1 of the present embodiment, the base element 41T of the routing structure 40T has a three-dimensional structure that is thicker in the Z direction than the base plate 41S of the routing board 40S.

[0103] According to this design, by using the base plate 41S with the flat surface section 51, the electronic component 10S, for which heat dissipation is paramount, can be positioned near the metal plate 110, thus promoting heat dissipation with the metal plate 110 acting as a heat sink. Alternatively, by using the base element 41T with a thick, three-dimensional structure in the Z-direction, it is possible to mount the electronic component 10T, for which ease of assembly is paramount, in a suitable manner. By properly utilizing these regions, it is possible to provide the electrical connection unit 1, which exhibits both heat dissipation properties and ensures ease of assembly. <10. Modification Examples>

[0104] The following are some modification examples. Note that a different setup than the one described below in each modification example corresponds to the setup of the embodiment described above. (First modification example)

[0105] In the embodiment above, terminal 13A is an example of a "first terminal." Terminal 13B is an example of a "second terminal." However, the first and second terminals can be any pair of terminals, as long as the terminals are a pair of terminals included in the electronic component 10S. As a modification example, terminal 13A can be an example of a "second terminal." Terminal 13B can be an example of a "first terminal." (Second modification example)

[0106] In the embodiment above, busbar 42A is an example of a "first busbar." Busbar 42B is an example of a "second busbar." However, the first and second busbars can be any pair of busbars, as long as they are a pair electrically connected to the electronic component 10S. As a modification example, busbar 42A can be an example of a "second busbar." Busbar 42B can be an example of a "first busbar." (Third modification example)

[0107] In the embodiment above, the horizontal plate section 42p of busbar 42A is an example of a "first plate section". The horizontal plate section 42p of busbar 42B is an example of a "second plate section". However, both the first and second plate sections can be any plate section as long as a corresponding busbar contains the plate section. As a modification example, the horizontal plate section 42p of busbar 42A can be an example of a "second plate section". The horizontal plate section 42p of busbar 42B can be an example of a "first plate section". (Fourth modification example)

[0108] In the embodiment above, the connecting section 61 of busbar 42A is an example of a "first connecting section". The connecting section 61 of busbar 42B is an example of a "second connecting section". However, both the first and second connecting sections can be any connecting section as long as a corresponding busbar contains the connecting section. As a modification example, the connecting section 61 of busbar 42A can be an example of a "second connecting section". The connecting section 61 of busbar 42B can be an example of a "first connecting section". (Fifth modification example)

[0109] In the embodiment above, the connecting section 61 of busbar 42A is an example of a "first connecting section". The connecting section 61 of busbar 42B is an example of a "second connecting section". However, both the first and the second connecting section can be any one of the connecting sections 61 and 62 of any busbar 42, as long as a corresponding busbar contains the connecting section. As a modification example, the connecting section 61 or the connecting section 62 of busbar 42 from the plurality of busbars 42 can be an example of a "first connecting section". The connecting section 61 or the connecting section 62 of another busbar from the plurality of busbars can be an example of a "second connecting section". (Sixth modification example)

[0110] Positions where the majority of curved sections 90 are provided are not limited to the position aligned with the connecting section 61 of busbar 42A and the position aligned with the connecting section 61 of busbar 42B. As a modification example, as in Fig. As shown in Figure 11, positions where the majority of curved sections 90 are provided may, in addition to the position aligned with the connecting section 61 of the busbar 42A and the position aligned with the connecting section 61 of the busbar 42B, include a position aligned with the connecting section 61 of the busbar 42C and a position aligned with the connecting section 61 of the busbar 42D. (Seventh modification example)

[0111] The routing board 40S is not limited to a structure in which the base plate 41S and the busbar 42 are integrated by insert forming. For example, the busbar 42 can be positioned in the receiving section 55 after the base plate 41S, which provides the receiving section 55 for receiving the busbar 42, has been formed. In this case, the busbar 42 can be fitted to the receiving section 55 or fixed to the receiving section 55 by an adhesive or other fastener. In these cases, potting can be performed to fill any gap between the busbar 42 and the receiving section 55. (Eighth modification example)

[0112] The basic element of the busbar 40S is not limited to the base plate 41S with the plate-shaped, flat surface section 51. The busbar 40S can be a basic element (for example, an insulating foil) with a sheet-shaped, flat surface section 51. In this case, the receiving section 55 can be formed by a portion of the flat surface section 51 that follows the outer shape of the busbar 42. In the present disclosure, the term "sheet-shaped" or "sheet" is not limited to an element with a thickness of 1 mm or more, and an element (a so-called foil) with a thickness of less than 1 mm can also be used. (Ninth modification example)

[0113] The base plate 41S of the installation board 40S can contain a plurality of elements (plate elements or sheet metal elements). These elements are provided to accommodate the plurality of busbars 42, which are arranged horizontally. For example, the plurality of elements are integrated by joining the plurality of busbars 42 together, for instance, by laminate forming. The plurality of elements forms the flat surface section 51. In this case, the receiving section 55 can be formed in a hollow shape within the base plate 41S (between the plurality of elements). The plurality of elements can be a plurality of plate elements, a plurality of sheet metal elements, or a combination of a plate element and a sheet metal element. The plate element can, for example, be a flexible plate element.The flat surface section 51 formed from the majority of elements has an opening at which at least the connecting section 61 and the connecting section 62 of the busbar 42 are exposed. (Tenth modification example)

[0114] The connection between the electronic component 10 and the busbar 42 is not limited to the connection via the connecting component 20. The electronic component 10 can be directly connected to the busbar 42 by a fastening element (for example, a bolt or a screw), by welding, or similar means.

[0115] Several embodiments and modification examples have been described above. However, the embodiment and modification examples are not limited to those described above. For example, most of the modification examples described above can be implemented in combination. [List of reference symbols] 1 electrical connection unit 5 cases 6 Base 7 Cover section 10 electronic components 10S electronic component 10T electronic component 11 cases 11a Insulating rib 12 component bodies 13 connection 13A connection (first connection) 13B port (second port) 13h Mounting hole 14 Fastening section 14h Mounting hole 20 connection components 21 first section 21h first mounting hole 22 second section 22h second mounting hole 40 Laying structure 40S routing board 40T laying structure 41S Base plate (base element) 41T basic element 42 busbar 42A busbar (first busbar) 42B Busbar (second busbar) 42C busbar 42D busbar 42e1 End 42h through hole 42p horizontal plate section (first plate section, second plate section) 42u exposed section 43 Fastening element 43a shaft 43b Head 44 Coupling element 51 flat surface section 51a first surface (surface) 51b second surface 51h Through hole 52 Frame section 53 Fixing section 53h Mounting hole 55 Recording section 55A Recording section 55B Recording section 55C Recording section 55D recording section 61 Connecting section (first connecting section, second connecting section) 62 Connecting section 63 extending section 64 Extension 71 Fastening element 90° curved section 91 first curved section 91a first bending surface 92 second curved section 92a second bending surface 93 third curved section 93a third bending surface 94 fourth curved section 94a fourth bending surface 110 metal plate 110e1 first end 110e2 second end 110e3 third end 110e4 fourth end 111 flat surface section 112 Fixing section 112h coupling hole 113 Fixing section 113h coupling hole 115 Fastening element 116 Fastening element 120 Heat transfer element 130 insulating cover 130h vent hole A1 first region A2 second region H11 Width (Thickness) H12 Width (Thickness) MU main body R1 first region R2 second region S1 gap SU subunit SUS subunit SUT subunit

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