Semiconductor device and manufacturing process for semiconductor devices
DE102025149758A1Undetermined Publication Date: 2026-07-09TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
- Filing Date
- 2025-12-01
- Publication Date
- 2026-07-09
Abstract
A semiconductor device comprises a substrate with a first side and a second side opposite the first side; a first set of electronic components on the first side of the substrate; and an insulating structure on the second side of the substrate that overlaps the first set of electronic components when viewed in a vertical direction. The insulating structure has an array of conductive strips. The insulating structure also includes an open guard ring structure that extends along one edge of the array of conductive strips and defines a space between the two ends of the open guard ring structure. The semiconductor device further comprises a passive component or a second set of electronic components on the second side of the substrate.
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Citation Information
Patent Citations
U.S.-PATENTANMELDUNGNR.:63/741535
US63741535B1