Semiconductor device and manufacturing process for semiconductor devices

DE102025149758A1Undetermined Publication Date: 2026-07-09TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
Filing Date
2025-12-01
Publication Date
2026-07-09
Patent Text Reader

Abstract

A semiconductor device comprises a substrate with a first side and a second side opposite the first side; a first set of electronic components on the first side of the substrate; and an insulating structure on the second side of the substrate that overlaps the first set of electronic components when viewed in a vertical direction. The insulating structure has an array of conductive strips. The insulating structure also includes an open guard ring structure that extends along one edge of the array of conductive strips and defines a space between the two ends of the open guard ring structure. The semiconductor device further comprises a passive component or a second set of electronic components on the second side of the substrate.
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Citation Information

Patent Citations

  • U.S.-PATENTANMELDUNGNR.:63/741535

  • US63741535B1