Component fault indication device

Abstract

A component fault indicator comprising: error data obtaining means (102) for obtaining error data relating to a board mounting work for each component to be mounted on a board (20); a fault data storage means (104) for storing the fault data obtained by the fault data obtaining means (102); an error amount calculating means (106) for calculating an accumulated amount of errors (X2, X3) accumulated for each predetermined group of the error data; an importance factor setting means (108) for setting an importance factor (X4) for each predetermined group of the error data; an error index calculating means (110) for calculating an error index (X5) for each predetermined group of the error data by performing an operation on the importance factor (X4) set by the importance factor setting means (108) with the error amount (X2, X3) calculated by the error amount calculating means (106); and error information accumulation display means (114) for displaying a list of accumulated error information accumulated for each predetermined group sorted in descending order of the error index (X5) calculated by the error index calculating means (110).

Description

[0001] This invention relates to a component error display device that displays an error that has occurred during assembly of a component.

[0002] In a conventional component mounting machine for mounting electronic components on a circuit board, the electronic components are sucked by a suction nozzle and transferred to a position above a circuit board and mounted thereon at the predetermined position thereof. In this conventional machine, such defects occur as the sucked electronic components sucked by the suction nozzle falling off during the transfer process or the electronic components not being accurately mounted at the predetermined positions. For this reason, in this type of component mounting machine, necessary measures are taken to reduce the transfer speed of the components sucked by the suction nozzle during transfer in the suction state of the electronic components, with a high defect occurrence ratio.The ratio of each electronic component is calculated by detecting the occurrence of errors in each electronic component.

[0003] Although normal or standard electronic components can even be repaired after an error has occurred, it would, however, be difficult to repair components A to I, which are mounted under shielding component J, or components K and L, which, as shown in Fig. Figure 4 of the attached drawings, are mounted at a position adjacent to one of the shielding components J, after the shielding component J has been mounted. Therefore, the printed circuit boards on which such components were mounted must be discarded as the defective boards.

[0004] A conventional error display device is known, which is described in JP 2003-186704 A. The conventional display device displays error data of the errors that have occurred in the error window. According to this device, the occurrence of errors is observed during the execution of an application program, and error data of the error that has occurred is generated. The generated error data is stored in an error data storage section. Error data with a priority level equal to or higher than a predetermined value is selected from the stored error data, and the selected error data is displayed by changing the data in priority order.

[0005] JP 2008 - 311 393 A discloses a device for error analysis in medical devices, which identifies components with a high probability of failure. Following an analysis, the failure components are listed according to frequency, and an importance factor can be assigned to the components.

[0006] JP 2009 - 110 281 A discloses a production line for printed circuit boards with a component assembly machine. This component assembly machine has a display means that displays error messages in order of error message prioritization.

[0007] In JP 2004 - 134 774 A, the errors of a production line for assembling electronic components are displayed by a bar chart in an error frequency order.

[0008] DE 696 24 852 T2 relates to a method for supporting the repair of a substrate. For this purpose, defect image files can be sorted for repair according to their error codes.

[0009] In JP H03 - 134 517 A, the faults of a printed circuit board are displayed on a display device in order of their frequency.

[0010] According to the display device described in JP 2003-186704 A, the device displays only the error data whose order is changed from high priority to low priority, and the priority is not adjusted step by step depending on the level of data importance. This means that even a component with a high error occurrence rate must be set to a low priority order if such a component is positioned in the low priority order. Thus, the action to be performed for such components may be delayed.

[0011] Accordingly, it is not sufficient for the elements to decide on the priority of action based solely on the level of importance or the high failure rate. The element that adds the characteristics of the board on which various components are mounted should be considered as one of such elements in the decision-making process to ensure the circuit board is manufactured with good quality and stability.

[0012] The present invention has been made in view of the above problems / issues, and an object of the invention is to provide a component failure display device which can display failure information by sorting the failures in an order of data having a high failure index corresponding to the importance and the high failure occurrence ratio by weighting the importance stepwise depending on the components to be mounted.

[0013] The feature in the structure of the invention according to claim 1, which is made to solve the above problem, is characterized in that the component failure display device comprises: failure data obtaining means for obtaining failure data concerning a board mounting work for each component to be mounted on a board, failure data storing means for storing the failure data obtained by the failure data obtaining means, failure amount calculating means for calculating an accumulated amount of failures accumulated for each predetermined group of the failure data, importance factor setting means for setting an importance factor for each predetermined group of the failure data,an error index calculating means for calculating the error index for each predetermined group of the error data by performing an operation of the importance factor set by the importance factor setting means with the error amount calculated by the error amount calculating means, and an error information accumulation displaying means for displaying a list of accumulated error information accumulated for each predetermined group sorted in descending order of the error index calculated by the error index calculating means.

[0014] The feature in the structure of the invention according to claim 2 is characterized in that in claim 1, the component failure display device according to claim 1, wherein a high importance factor is set for at least one of a component associated with a shield component and difficult to repair, an LED component, and a resistance component associated with the LED component.

[0015] The feature in the structure of the invention according to claim 3 is characterized in that in claim 1 or 2, the error amount calculating means calculates an error ratio of each component.

[0016] The feature in the structure of the invention according to claim 4 is characterized in that in claim 1 or 2, the defect amount calculating means calculates the number of defects in each component.

[0017] According to the invention associated with claim 1, the component failure display device comprises: failure data obtaining means for obtaining failure data concerning a board mounting work for each component to be mounted on a board, failure data storing means for storing the failure data obtained by the failure data obtaining means, failure amount calculating means for calculating an accumulated amount of failures accumulated for each predetermined group of the failure data, importance factor setting means for setting an importance factor for each predetermined group of the failure data, failure index calculating means for calculating the failure index for each predetermined group of the failure data by performing an operation of the importance factor set by the importance factor setting means with the failure amount calculated by the failure amount calculating means,and error information accumulation display means for displaying a list of accumulated error information accumulated for each predetermined group sorted in descending order of the error index calculated by the error index calculating means.

[0018] According to the above structure, since the failure data can be displayed in descending order of the failure index calculated using the failure amount accumulated according to the predetermined group of failure data and the importance factor set for the predetermined group, not only the failure information with a high importance factor but also the failure information with a high failure amount can be displayed in a high-ranked position depending on how the importance factor is set. Accordingly, the necessary actions can be taken for the components that require early action.

[0019] According to the invention associated with claim 2, a high importance factor is set for at least one of a component that is difficult to repair with respect to a shield component, an LED component, and a resistance component associated with the LED component. Accordingly, the components mounted under the shield component and the components mounted at a position adjacent to the shield component, and further, the combined components such as the LED components and the resistance components, can be given priority.

[0020] According to the invention associated with claim 3, the error amount calculating means calculates the error ratio of each component, and accordingly, the error information can be displayed in order of high error index calculated based on the importance factor set for each of the components and the error ratio thereof.

[0021] According to the invention associated with claim 4, the defect amount calculating means calculates the defect number of each component, and accordingly, the defect information can be displayed in order of high defect index calculated based on the importance factor set for each of the components and the occurred defect number thereof. BRIEF EXPLANATION OF THE ATTACHED DRAWINGS Fig. 1 is a plan view of a component mounting machine showing an embodiment of the invention; Fig. 2 is a view showing a control device that controls the component mounting machine; Fig. 3 is a view showing an example of the error information. Fig. 4 is a view showing an example of components mounted on a circuit board; Fig. 5 is a view showing another example of the components mounted on the circuit board; Fig. 6 shows a state of input importance factors; Fig. 7 is a flowchart explaining a procedure of displaying a list of error information; Fig. 8 is a view showing an error data list indicating the contents of errors; Fig. 9 is a view showing a list of error information sorted based on the error index; Fig. 10 is a flowchart explaining another embodiment of the invention; and Fig. 11 is a view showing a list of importance factors depending on the component groups. THE EMBODIMENTS FOR IMPLEMENTING THE INVENTION

[0022] The embodiments of the invention are explained with reference to the accompanying drawings. Fig. 1 is a plan view of a component assembly machine 10 as a whole. The component assembly machine 10 is constituted by a fan-type component feeder 11, a component loading device 12, a component installation device 13, a board holding device 14, and a board transfer device 15.

[0023] The board transfer device 15 is provided on a base 21 and comprises a conveyor belt 22 for transferring a circuit board 20. The board transfer device 15 transfers the circuit board 20 on the conveyor belt 22 to the board holding device 14 and then carries the board out of the board holding device 14. In Fig. 1, the board transfer direction is set to be the X-axis direction, and the direction perpendicular to the board transfer direction is set to be the Y-axis direction. The board holding device 14 includes a board support device (not shown in the drawings) for supporting the board 20 from below, and a clamping device (also not shown) for clamping the circuit board 20.

[0024] The component installation device 13 includes an X-axis slider 23 supported at an upper position of the base 21 of the component mounting machine 10 and movable in an X-axis direction, a Y-axis slider 24 supported on the X-axis slider 23 and movable relative thereto in a Y-axis direction, and an installation head 25 provided on the Y-axis slider 24. The installation head 25 is provided with a suction nozzle (not shown) for holding the components by suction. The X-axis slider 23 and the Y-axis slider 24 are moved by an X-axis direction moving device and a Y-axis direction moving device, respectively, so that the installation head 25 can be moved to any random position within the XY plane.

[0025] A board image pickup device 26 with a CCD camera is provided on the Y-axis slider 24. The board image pickup device 26 captures images of a board position reference mark (not shown) applied to the circuit board 20 positioned at a predetermined position of the component installation device 13 and a board ID (identification) mark applied to the circuit board 20 to obtain board position reference information and board ID information. Based on the board reference information obtained by the board image pickup device 26, the position of the installation head 25 in the X and Y directions relative to the circuit board 20 is corrected, and the mounting work of the electronic components is controlled based on the board ID information.

[0026] Furthermore, a component image capturing device 27 with a CCD camera on the base 21 is provided. The component image capturing device 27 captures images of the electronic components that move from the component supply devices 11 and 12 to the circuit board 20, in order to detect the suction state of the components sucked by the suction nozzle and the deviation of the center of the electronic components relative to the center of the suction nozzle. Based on the center deviation, the amount of displacement of the mounting head 25 in the X and Y directions is corrected, so that the electronic components can be correctly mounted on the circuit board at a predetermined coordinate position on the circuit board 20.

[0027] The compartment-type component feeder 11 and the loader-type component feeder 12 are positioned on both sides of the board transfer device 15 so as to be separated from each other in a Y-axis direction. The compartment-type component feeder 11 feeds the electronic components housed in a plurality of compartments 31 and includes a carriage 32 as the feeder main body, and the carriage 32 is connectable to and detachable from the component mounting machine 10.

[0028] On the other hand, the loader-type component supplying device 12 supplies the electronic components housed in a plurality of loaders 33 and includes a carriage 34 as a loader support table, and the carriage 34 is connectable to and detachable from the component mounting machine 10. The plurality of loaders 33 are detachably installed in the loader support table (carriage) 34 at positions parallel to each other in an X-axis direction, and a spool is detachably installed on each of the loaders 33, and tapes are wound around the spools, which accommodate the plurality of electronic components in a row spaced apart by a distance.

[0029] Fig. 2 shows the controller 40 that controls the operation of the component mounting machine 10. The controller 40 is provided with a memory section composed of the CPU 41, the ROM 42, and the RAM 43, and a bus 44 connecting the CPU 41, the ROM 42, and the RAM 43. An input / output interface 45 is connected to the bus 44, and an input device 46 and an output device 47 are connected to the input / output interface 45. The input device 46 is constituted by a keyboard and a mouse. An operator operates the input device 46 to input necessary information. The input information is stored in a storage device (ROM 42 and RAM 43) of the controller 40. For example, by manipulating the mouse, the importance factors corresponding to the importance of the electronic components are input and stored in a predetermined memory area.The output device 47 includes a display means 48 formed by an LCD and an alarm device for alerting the operator that an abnormality occurs, and a list of error information is displayed by a display means 48, which will be explained later.

[0030] Furthermore, the input / output interface 45 is connected to motors for the loading device 33 and the installation head 25 via driver circuits 49 and 50, respectively, and is further connected to an image processing device 51 which processes the images captured by the image capturing device 27.

[0031] The ROM 42 of the control device 40 includes an assembly control program that controls the assembly work of the component assembly machine 10, and further includes component data such as the component model number, size, etc., related to identifying the component, and assembly coordinate data indicating the component mounting position on the circuit board 20. As shown in Fig. 3, the component failure information is stored in the RAM 43 of the controller 40, for example, as follows: the usage number X1, the failure number X2, the failure ratio X3, the importance factor X4, and the failure index X5 for each component (name: PD 1 to PD6).

[0032] It is noted here that according to this embodiment of the invention, the error ratio X3 means the value (X2 / X1), which is the value X2 of the error divided by the usage number X1, and the error index X5 means the value (X3*X4), which is the value of the product of the error ratio X3 and the importance factor X4.

[0033] Fig. 4 shows an example of mounting the electronic components on the circuit board 20. In Fig. 4, a plurality of electronic components A to O are mounted on the board 20. Components A to F are of the same type, while components G to I are of the same type. A shield component (housing part) J is mounted over components A to I to cover the components A to I, and components K and L are mounted at the position adjacent to the shield component J. The other components M, N, and O are mounted separately on the board 20.

[0034] According to the circuit board 20, components M, N, and O are always repairable, even if an assembly error is discovered after the components are mounted on the board. However, with respect to components A to I under the shielding component J, and also with respect to components K and L mounted adjacent to the shielding component J, repair would be very difficult once the shielding component is mounted on the circuit board.

[0035] Accordingly, in order to consistently produce a high-quality circuit board in a stable manner, it is important to reduce the assembly errors for the critical components PD1, PD2 and PD3 by taking care of the components A to F mounted under the shielding component J (these are referred to as critical component PD1, as in Fig. 3), the components G to I mounted under the shielding component J (these are referred to as important component PD2, as also shown in Fig. 3) and the components K and L mounted on the board adjacent to the shielding component J (these are referred to as important component PD3) are taken care of on a priority basis. Thus, the high integers greater than one (1) are assigned to the important components PD1, PD2, and PD3 mounted under or adjacent to the shielding component J, and, as shown in Fig. 3, the importance factor is entered for these important components, such as “10”, “20”, which are the integers greater than “1” and are set depending on the level of importance.

[0036] Specifically, the worker enters the importance factors “15”, “10”, and “5” according to the component names PD1, PD2, and PD3, as shown in Fig. 6. For important components other than PD1, PD2, and PD3, the worker inputs the number "1" for components PD4 (component J), PD5 (components M and N), and PD6 (component O) as the respective importance factors. Thus, the importance factor is set according to a predetermined classification of the components (component group).

[0037] Fig. 5 shows a different example in which the LED component W is mounted on the circuit board 20 as an electronic component. The LED component Q (Q1, Q2, Q3...) is used with the combination of the resistance component R (R1, R2, R3...), which adjusts the brightness of the LED component. Accordingly, if an assembly error occurs in one of the LED component and the resistance component R (for example, the LED component Q), the other (resistance component R) must be replaced along with the defective LED component Q.

[0038] Accordingly, the LED component Q and the associated resistance component R are also the important components to consistently manufacture a circuit board 20 with high quality in a stable manner, and they are taken care of on a priority basis to distinguish them from the other components.

[0039] The importance factor for these LED and resistor components Q and R is set high (for example, set to “20”).

[0040] Next, the flowchart in Fig. 7 explains the error display process for displaying a list of error information by detecting errors that occurred during component mounting. The electronic components picked up in the component feeders 11 and 12 of the component mounting machine 10 are sequentially sucked by the suction nozzle provided on the installation head 25, and then transferred over the circuit board 20, which is positioned and clamped at the predetermined location of the board holding device 14, and mounted on the board 20 at the predetermined position thereof. The suction state or the mounting state of the components mounted on the circuit board 20 is monitored by the component image pickup device 27 and the detection means (not shown), and if errors such as mounting errors or mistakes should occur, an error signal is sent to the control device 40, and at the same time, such an error is notified to the worker.

[0041] In Fig. 7, if a fault has occurred in a component, such a fault is detected in step 100, and the fault data is obtained in step 102. The obtained fault data consists, as in Fig. 8, mainly consisting of the name of the electronic component that had the fault and the date and time of the fault occurrence.

[0042] Next, in step 104, the defect data is stored in the storage device (RAM 43) of the control device 40. In step 106, the defect data is classified according to the predetermined classification (P1 to P5) and counted for each class. The defect ratio X3 is calculated by dividing the defect number X2 by the usage number X1. In step 108, the importance factor X4 is determined for each classification of the component. Next, in step 110, the defect index X5 is obtained by multiplying the defect ratio X3 by the importance factor X4. In step 112, as in Fig. 9, the counted error information, which is the error information counted for each classification of the component, is sorted and listed in order by high error index X5. The list is displayed on the display means 48 connected to the control device 40.

[0043] Since the defect information is sorted and displayed in order by the high defect index X5, even if the important components (PD1, PD2, PD3) have a high importance factor X4 determined for each predetermined classification, such a component will be ranked high on the defect information list, and accordingly, the worker will take necessary measures to prevent the recurrence of the defect for the important components ranked high on the list. It should be noted here that even the other components (PD4 to PD6) with the low importance factor X4 may be ranked high on the list, higher than the important components, if their defect ratio is extremely high.In this case of the components whose importance factor X4 is low but whose defect ratio X3 is high, the worker will take necessary action to prevent the defect from occurring again for the components with high defect ratio.

[0044] The worker performs the necessary actions for the components listed on the list based on a priority with respect to the error information thereof displayed on the error information list displayed on the display means 48 (see Fig. 9) are highly ranked. For example, the content of the error displayed on the highest level list can be clarified with reference to the Fig. 8, and if the content of the error relates to a suction error in which a component cannot be sucked through the suction nozzle, then the suction speed can be set to a lower speed, or the suction nozzle can be replaced with a different one to reduce the number of such error occurrences. Furthermore, if the error relates to an incorrect mounting position in which a component cannot be mounted on the board with acceptable accuracy, in this case, the acceptable accuracy value for positioning the component for the predetermined mounting position is set to a value smaller than the current value, or the shape of the component can be set to a value smaller than the specification to increase the mounting accuracy.

[0045] After the necessary action has been taken for the highest-ranked component, the necessary action is then taken for the component that is next ranked based on the failure information from above.

[0046] It is noted that, respectively, step 102 represents the feature of the error data obtaining means in the claims appended hereto, and similarly, the error data storing means in the claims corresponds to step 104, the error amount calculating means (error ratio calculating means) in the claims corresponds to step 106, the importance factor setting means corresponds to step 108, the error index calculating means corresponds to step 110, and the error information displaying means corresponds to step 114.

[0047] Fig. 10 shows another embodiment of the invention. According to the embodiment, the importance factors of the important components, such as the important components PD1 (A to F) and PD2 (G to I) mounted below the shield component J, the important component PD3 (K and L) mounted adjacent to the shield component J, and the important components LED component Q and resistance component R, are predetermined in advance by automatically confirming the important components as a group of components.

[0048] According to the above embodiment, as shown in the flowchart of Fig. 10, first, in step 200, it is judged whether or not the production involves a circuit board 20 on which the LED components are mounted, and if the judgment result is "YES," the process proceeds to step 202. In step 202, it is automatically confirmed that the subject data is data of a combined LED component and resistance component obtained from the component data stored in the storage device of the controller 40, and that the combined component is a component group associated with the LED among the important components. Next, in step 204, the predetermined importance factor X4 of the components is input into the column of importance factors provided for the component groups in the list in Fig. 11; for example, the importance factor “20” is entered therein for the component associated with the LED.

[0049] When the judgment result at step 200 is "NO", or in other words, when the circuit board 20 on which components other than the LED components and the components associated therewith are to be mounted is manufactured, the program goes to step 206, and in step 206, the size S1 of each component is obtained from the component data, and then the mounting coordinate data S2 of each component is obtained from the component data.Then, in step 208, based on the obtained size and the coordinate data S2, it is judged by calculation for each component whether the component is a multi-layer assembly component (component mounted under the shield component) or not, and if the judgment result is Yes (the component is a multi-layer assembly component), it is judged by calculation whether the multi-layer assembly component is an adjacent component mounted adjacent to the multi-layer assembly component. If it is judged at step 212 that the component is the component group mounted under the shield component (multi-layer assembly component group), the importance factor X4 for such a component group is set to "10", as shown in FIG. Fig.11, and when it is judged to be the component group adjacent to the shield component (component group mounted adjacent to the multi-layer mounting component group), the importance factor X4 for such a component group is set to, for example, “5”, and the importance factor for the other component groups is set to “1”.

[0050] Thus, the predetermined importance factors ("10" and "5") of the component group under the shield component and the component group adjacent to the shield component can be set through automatic calculation based on the component data and the mounting coordinate data for each component. Similarly, the importance factor for the component group associated with the LED is set to "20" through automatic calculation based on the component data. Thus, the important components that need to be addressed based on priority can be automatically designated, and their importance factors can be easily set taking into account the importance of the components, thus facilitating the work for the worker.

[0051] According to the embodiment of the invention, the component failure display device comprises: failure data obtaining means (step 102) for obtaining failure data concerning a failure occurrence state of a component, failure data storing means (step 104) for storing the obtained failure data, failure ratio calculating means (step 106) for calculating the failure ratio of each component to be mounted on the circuit board 20, importance factor setting means (step 108) for setting an importance factor depending on each predetermined group of the component to be mounted on the circuit board 20, failure index calculating means (step 110) for calculating the failure index for each predetermined group of the component by calculating (multiplying) the importance factor and the failure ratio, and failure information accumulation displaying means (step 114) for displaying in a list the accumulated failure information,which have been accumulated depending on the predetermined group, by sorting from the error information with high error index.,

[0052] According to the thus structured embodiment of the invention, the failure information of the component that has a failure can be displayed in order of high failure index calculated based on the importance factor and failure ratio of the components, which are set depending on the predetermined group. Thus, not only the components with the high-ranked importance factor but also the components with a high-ranked failure ratio can be displayed at the high-ranked position of the list, depending on how the importance factors are determined. Thus, necessary action can be taken without delay for each component, and a high-quality circuit board 20 can be consistently manufactured stably.

[0053] According to the embodiment explained above, the error index X5 is calculated based on the error ratio X3 and the importance factor X4. However, the error index X5 may be calculated based on the absolute value of the error number X2 and the importance factor X4. The claims of the invention define the error amount used for both the error ratio X3 and the error number X2.

[0054] According to the embodiment, the important component includes the components A to I mounted under the shield component J, the important components K and L mounted adjacent to the shield component J, or the important component LED component Q which is a combined component together with the resistance component R. However, the important component whose importance factor is high is not limited to the components explained above, and any other components may be included, as the importance of the same component may be changed depending on where the component is mounted, for example.

[0055] The invention has been explained so far according to the above embodiments, however, the invention is not limited to those in the embodiments, but various modifications or changes of the embodiments may be included as far as such modifications or changes fall within the scope of the claims defined in the claims. INDUSTRIAL APPLICABILITY

[0056] The component error display device associated with the invention is applicable to a component mounting machine provided with an error display function in component mounting. EXPLANATION OF REFERENCE SYMBOLS

[0057] In the drawings: 10 component assembly machines, 11 Component feeding device, 12 component feeding device, 13 Component installation facility, 14 board holding device, 15 board transfer device, 20 circuit board, 21 base, 22 conveyor belt, 23 X-axis sliders, 24 Y-axis sliders, 25 installation head, 26 board image recording device, 27 Component image recording device, 31 subjects, 32 sleds, 33 feeding device, 34 sleds, 40 control device, 41 CPUs, 42 ROM, 43 RAM, 44 buses, 45 Input / output interface, 46 input device, 47 Dispensing device, 48 display devices, 49, 50 driver circuit, 51 image processing device, 100 error detection, 102 error data acquisition tools, 104 error data storage means, 106 Error quantity calculation means (error ratio calculation means), 108 importance factor setting means, 110 error index calculation tools, 112 Error information sorting, 114 error data display means, A to F components mounted under the shielding component, G to I components mounted under the shielding component, J Shielding component K, L component adjacent to the shielding component, M, N, O component mounted on the board, Q LED component, R resistance component, X1 usage number / usage number, X2 number of errors, X3 error ratio, X4 Importance factor, X5 error index.

Claims

[1] A component fault indicator comprising: error data obtaining means (102) for obtaining error data relating to a board mounting work for each component to be mounted on a board (20); a fault data storage means (104) for storing the fault data obtained by the fault data obtaining means (102); an error amount calculating means (106) for calculating an accumulated amount of errors (X2, X3) accumulated for each predetermined group of the error data; an importance factor setting means (108) for setting an importance factor (X4) for each predetermined group of the error data; an error index calculating means (110) for calculating an error index (X5) for each predetermined group of the error data by performing an operation on the importance factor (X4) set by the importance factor setting means (108) with the error amount (X2, X3) calculated by the error amount calculating means (106); and error information accumulation display means (114) for displaying a list of accumulated error information accumulated for each predetermined group sorted in descending order of the error index (X5) calculated by the error index calculating means (110). [2] The component failure display device according to claim 1, wherein in the component failure display device according to claim 1, a high importance factor (X4) is set for at least one of a component (A to L) associated with a shield component (J) and difficult to repair, an LED component (Q), and a resistance component (R) associated with the LED component (Q). [3] The component fault indicator according to claim 1 or 2, characterized by that the error quantity calculating means (106) calculates an error ratio (X3) of each component. [4] The component fault indicator according to claim 1 or 2, characterized by that the error quantity calculating means (106) calculates an error number (X2) in each component.

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