Current directional device

Abstract

Current directional device (100), containing: a power semiconductor module (300U, 300V, 300W) containing a power semiconductor element designed to convert direct current into alternating current; a first flow path forming body (110) which forms a first flow path (112a) to allow a cooling refrigerant to flow through it; a second flow path forming body (401) which forms a housing space (402) to allow a cooling refrigerant to flow through it; a first base plate (400) for attaching the second flow path forming body (401) to it; a driver circuit board (200) on which a driver circuit is mounted to output a control signal for controlling the power semiconductor element; and a housing (101) for accommodating the power semiconductor module (300U, 300V, 300W), the first flow path forming body (110), the second flow path forming body (401), the first base plate (400) and the driver circuit board (200), wherein the driver circuit board (200) is arranged such that the mounting surface of the driver circuit is opposite a side wall (401A) of the second flow path forming body (401), wherein the second flow path forming body (401) forms the accommodation space (402) for the accommodation of the power semiconductor module (300U, 300V, 300W), wherein the second flow path forming body (401) also forms an insertion opening (403) leading to the accommodation space (402) in the side wall (401A) opposite the mounting surface of the driver circuit, wherein the power semiconductor module (300U, 300V, 300W) has a control terminal (325) which passes through the insertion opening (403) and is connected to the driver circuit board (200), wherein the first flow path forming body (110) is attached to the housing (101), wherein the first flow path forming body (110) also forms an opening section leading to the first flow path (112a), wherein the first base plate (400) is designed to close the opening section and is connected to the first flow path forming body (110), and wherein the first base plate (400) also forms a first through-hole (406) connecting the first flow path (112a) and the accommodation space (402).

Description

Technical field

[0001] The present invention relates to a current straightening device used for converting direct current to alternating current or for converting alternating current to direct current, and in particular to a current straightening device used for hybrid electric vehicles and electric vehicles. State of the art

[0002] As hybrid electric vehicles and electric vehicles become smaller, there is a need to reduce the size of the current straightening device used in such vehicles. Furthermore, it is necessary to achieve both a smaller current straightening device and improved ease of assembly. In other words, requirements such as ensuring space within the current straightening device to insert tools or other equipment for its installation contradict the goal of miniaturizing the device.

[0003] Patent document 1 describes a method for connecting a terminal of a power semiconductor module and a terminal of a capacitor module by welding, as well as a method for connecting a driver circuit board and a power semiconductor module by solder after the power semiconductor module and the capacitor module have been placed in the current straightening device. Furthermore, patent document 2 discloses a power conversion device comprising two power modules and a capacitor module, configured to cool the power modules and the capacitor module, and designed to reduce the dimensions of the power conversion device.

[0004] However, further improvements to the ease of assembly of the current directional device are needed. List of printed materials and patent literature Patent literature 1: Japanese unexamined patent application publication no. 2011-217550 Patent literature 2: US 8 240 411 B2 Brief description of the invention: Technical problem

[0005] Accordingly, it is an object of the present invention to further improve the ease of assembly of a current directional device. Problem solving

[0006] A current straightening device according to the present invention comprises: a power semiconductor module containing a power semiconductor element for converting a direct current into an alternating current; a first flow path forming body, which forms a first flow path for allowing a cooling refrigerant to flow through it; a second flow path forming body, which forms a second flow path for allowing the cooling refrigerant to flow through it; a first base plate for mounting the second flow path forming body thereon; a driver circuit board on which a driver circuit is mounted for outputting a control signal for controlling the power semiconductor element; and a housing for accommodating the power semiconductor module, the first flow path forming body, the second flow path forming body, the first base plate, and the driver circuit board.The driver circuit board is positioned such that the mounting surface of the driver circuit faces a side wall of the second flow path body. The second flow path body provides a housing for the power semiconductor module. Furthermore, the second flow path body features an access opening in the side wall opposite the mounting surface of the driver circuit, leading to this housing. The power semiconductor module has a control terminal that passes through the access opening and is connected to the driver circuit board. The first flow path body is attached to the housing. Simultaneously, the first flow path body forms an opening leading to the first flow path. The first base plate is designed to close this opening and is connected to the first flow path body.Furthermore, the first base plate forms a first through-hole for connecting the first flow path and the second flow path. Advantageous effects of the invention

[0007] According to the present invention, it is possible to improve the ease of assembly of a current directional device. Brief description of the drawings Fig. Figure 1 is a perspective external view of a current directing device 100 according to the present embodiment. Fig. Figure 2 is an expanded perspective view of the current directing device 100 according to the present embodiment. Fig. Figure 3 is an enlarged perspective view of electrical components located between a first flow-path forming body 110 and a cover 107, which is in Fig. 2 are shown, arranged. Fig. Figure 4 is an enlarged perspective view of a first base plate 400 and a second flow path forming body 401, which are in Fig. 2 are shown. Fig. Figure 5 is a perspective exterior view of the first base plate 400, seen in the direction of arrow A in Fig. 4. Fig. Figure 6 is a perspective view of the exterior of a housing 101 and the first flow path forming body 110. Fig. Figure 7 is a perspective view of the exterior, showing the process of inserting the first base plate 400 and the like into the housing 101. Fig. 8 is a sectional view of the Fig. 1 current directing device 100 shown along the B-plane, seen in the direction of the arrow, with the cover 107 and the cover 108 removed. Fig. 9 is a sectional view of the Fig. 1 current directing device 100 shown along the C-plane, seen in the direction of the arrow, with the cover 107 and the cover 108 removed. Description of embodiments

[0008] An embodiment of a current straightening device according to the present invention is described below with reference to the accompanying drawings. It should be noted that identical elements in the individual figures are designated by the same reference numerals, and redundant descriptions are omitted.

[0009] Fig. Figure 1 is a perspective external view of a current directing device 100 according to the present embodiment.

[0010] A power semiconductor module 300U and the like, as described below, are housed in a casing 101. An outlet pipe 103 discharges a cooling refrigerant outside the current directional device 100. The outlet pipe 103 is arranged around a central section in the vertical direction of a casing side surface 101A. An inlet pipe 102 (see Fig. 2) is arranged around a central section in the vertical direction of a housing side surface 101B, which is formed on the side opposite the housing side surface 101A. The inlet pipe 102 directs the cooling refrigerant into the flow directional device 100.

[0011] The housing 101 forms an opening section 105 on a housing side surface 101C. An AC busbar 104U, an AC busbar 104V, and an AC busbar 104W project out of the housing 101 through the opening section 105. The AC busbar 104U is a conductive element for transmitting the AC current of the U phase, the AC busbar 104V is a conductive element for transmitting the AC current of the V phase, and the AC busbar 104W is a conductive element for transmitting the AC current of the W phase.

[0012] Furthermore, the housing 101 forms an opening section 106 on the housing side surface 101A. The opening section 106 is located opposite the connection part of the AC bus rail 104U and the other conductors, the connection part of the AC bus rail 104V and the other conductors, and the connection part of the AC bus rail 104W and the other conductors. In this way, an operator and a robot can connect the AC bus rails to each of the other conductors through the opening section 106.

[0013] A cover 107 closes a first insertion opening 109 (see Fig. 2), which is formed in the upper section of the housing 101. The first insertion opening 109 is designed to accommodate the power semiconductor module 300U and the like, as described below.

[0014] A cover 108 closes a second insertion opening (not shown) formed in the lower section of the housing 101. The second insertion opening is designed to accommodate a DC / DC converter 900 described below.

[0015] The current straightening device 100 according to the present embodiment is primarily used in hybrid electric vehicles and electric vehicles. An example of a vehicle system is described in Japanese unexamined patent application publication no. 2011-217550. It should be noted that the current straightening device 100 according to the present embodiment can also be used in other applications to achieve the desired effect. For example, it can be used to improve productivity and cooling performance in an inverter for household appliances such as refrigerators and air conditioners. Furthermore, the current straightening device 100 can also be used in industrial inverters whose operating environment is similar to that of the vehicle inverter.

[0016] Fig. Figure 2 is an expanded perspective view of the flow-directing device 100 according to the present embodiment. The first flow-path-forming body 110 is arranged around a central section in the vertical direction of the housing 101. The first flow-path-forming body 110 is connected to the inlet pipe 102 and the outlet pipe 103.

[0017] The first base plate 400, the second flow path forming body 401, the power semiconductor modules 300U to 300W, the capacitor module 500, the driver circuit board 200, the control circuit board 600 and the like are arranged between the first flow path forming body 110 and the cover 107.

[0018] The power semiconductor modules 300U to 300W described below are designed to convert direct current (DC) to alternating current (AC). The capacitor module 500 described below is designed to smooth the DC voltage. The driver circuitry is located on the driver board 200 to output a control signal for driving the power semiconductor modules 300U to 300W. The control circuitry is located on the control board 600 to output a control signal to the driver board 200 to control the power semiconductor modules 300U to 300W. An example of these circuit systems is described in Japanese unexamined patent application publication 2011-217550.

[0019] The DC / DC converter 900 is arranged between the first flow-path forming body 110 and the cover 108. The DC / DC converter 900 is designed to convert the DC voltage. An example of the circuit system of the DC / DC converter 900 is described in Japanese Patent No. 4643695. Fig. The opening section 106 described above is closed by a cover 111.

[0020] Fig. Figure 3 is an enlarged perspective view of the electrical components located between the first flow-path forming body 110 and the cover 107, which is in Fig. 2 are shown, arranged. Fig. Figure 4 is an enlarged perspective view of the first base plate 400 and the second flow path forming body 401, which is shown in Fig. 2 are shown.

[0021] The second flow-path forming body 401 is attached to the first base plate 400. The second flow-path forming body 401' and the first base plate 400 can be formed as one piece to improve productivity and thermal conductivity. As shown in Fig. As shown in Figure 4, the second flow-path-forming body 401 forms a housing space 402 for accommodating the power semiconductor modules 300U to 300W. Furthermore, the second flow-path-forming body 401 forms an inlet opening 403 in a side wall 401A, which leads to the housing space 402. In the present embodiment, the housing space 402 functions as a flow path for allowing the cooling refrigerant to flow through it. The inlet opening 403 according to the present embodiment is a single inlet opening designed for the insertion of the three power semiconductor modules 300U to 300W. However, the inlet opening can be provided for each of the multiple power semiconductor modules.

[0022] The first base plate 400 contains several retaining elements 404 for attaching the capacitor module 500. The capacitor module 500 is thermally connected to the first base plate 400 by means of the several retaining elements 404. In this way, the heat generated in the capacitor module 500 is transferred to the first base plate 400 so that the capacitor module 500 can be cooled.

[0023] As in Fig. As shown in Figure 3, the control circuit board 600 is mounted on a second base plate 601. The second base plate 601 contains a mounting element 601A, which is connected to a retaining element 405A extending from the first base plate 400. In this way, the control circuit board 600 and other components are cooled by the first base plate 400 via the mounting element 601A and the retaining element 405A.

[0024] Furthermore, the second base plate 601 supports a third base plate 602. The third base plate 602 projects in the direction of arrangement of the first base plate 400, which is the direction perpendicular to the mounting surface of the control circuit board 600 on the second base plate 601.

[0025] The driver circuit board 200 is mounted on the surface of the third base plate 602 on the side where the power semiconductor modules 300U to 300W are arranged. In this way, the driver circuit board 200 is cooled by the third base plate 602 and the second base plate 601.

[0026] Furthermore, the second base plate 601 includes a mounting element 601B, which is connected to the retaining element 405 extending from the second flow-path-forming body 401. In this way, the second base plate 601 is thermally connected to the second flow-path-forming body 401 via the mounting element 601B. This makes it possible to improve the cooling performance of the control circuit board 600 or the driver circuit board 200.

[0027] Furthermore, the second base plate 601 and the third base plate 602 are made of a material with high electrical conductivity, such as aluminum. Then this is in Fig. The housing 101 described above is made of a material with high electrical conductivity, such as aluminum. The second base plate 601 contains a mounting element 601C, which is directly connected to the housing 101. Furthermore, the control circuit board 600 is arranged on the side opposite the power semiconductor modules 300U to 300W, with the second base plate 601 positioned between them. In this way, the electromagnetic interference emitted by the power semiconductor modules 300U to 300W and the driver circuit board 200 is allowed to dissipate to ground via the mounting element 601C and the like. Thus, it is possible to protect the control circuit board 600 from the electromagnetic interference.

[0028] In the present embodiment, the driver circuit board 200 is arranged such that the mounting surface of the driver circuit faces the side wall 401A of the second flow-path forming body 401. The power semiconductor modules 300U to 300W include a control terminal 325, which extends through the insertion opening and is connected to the driver circuit board 200. In the present embodiment, the control terminal 325 and the driver circuit board 200 are connected before the power semiconductor modules 300U to 300W and the driver circuit board 200 are mounted in the housing 101.

[0029] It should be noted that the third base plate 602 forms the opening section 603, which is located opposite the connecting part 201 of the control terminal 325 and the driver circuit board 200. In this way, it is possible to eliminate the electromagnetic interference of the third base plate 602 and to improve the manufacturability of the connection.

[0030] A current sensor 202 is arranged such that the AC bus rails 104U to 104W pass through the through-hole formed in the current sensor 202. As shown in Fig. As shown in Figure 2, the capacitor module 500 contains a resin sealant 503 for sealing part of a DC positive electrode terminal 501 and part of a DC negative electrode terminal 502. As shown in Fig. As shown in Figure 3, a surface of the resin sealant 503 comes into contact with a surface of the second flow-path forming body 401. Thanks to this setup, not only is the resin sealant 503 cooled, but also the DC positive electrode terminal 501 and the DC negative electrode terminal 502.

[0031] Fig. Figure 5 is a perspective exterior view of the first base plate 400, seen in the direction of arrow A in Fig. 4. The first base plate 400 forms a first through-hole 406, which leads to the accommodation space 402. Furthermore, the first base plate 400 forms a second through-hole 407, which leads to the accommodation space 402.

[0032] Fig. Figure 6 is a perspective view of the exterior of the housing 101 and the first flow path forming body 110. In the present embodiment, the first flow path forming body 110 is formed as a single piece with the housing 101. For example, the housing 101 and the first flow path forming body 110 are formed by casting. This eliminates the need for fasteners (screws and the like) and also reduces weight. Furthermore, the heat transfer between the housing 101 and the first flow path forming body 110 is improved. As a result, the cooling performance of the entire flow straightening device 100 is enhanced.

[0033] The first flow-path-forming body 110 forms a flow path 112a, which leads to the inlet pipe 102. The flow path 112a is formed such that it leads to the Fig. The first through-hole 406 shown in Figure 5 leads to the first through-hole 406. Simultaneously, the first flow-path-forming body 110 forms a flow path 112b at a lateral section of the flow path 112a, with a partition 113 in between. The flow path 112b is formed such that it leads to the Fig. The second through-hole 407 shown in Figure 5 leads to the first flow-path-forming body 110. Simultaneously, the first flow-path-forming body 110 forms a flow path 112c, which leads to the flow path 112b and to the outlet pipe 103. The flow path 112c is configured such that the flow direction of the refrigerant flowing through the flow path 112c is opposite to the flow direction of the refrigerant flowing through the flow path 112b.

[0034] Flow path 112a, flow path 112b and flow path 112c lead to the opening section, which is closed by the first base plate 400 as described below.

[0035] Fig. Figure 7 is a perspective view of the exterior, showing the process of inserting the first base plate 400 and the like into the housing 101. Fig. 8 is a sectional view of the Fig. 1 current directing device 100 shown along the B-plane, seen in the direction of the arrow, with the cover 107 and the cover 108 removed. Fig. 9 is a sectional view of the Fig. 1 current directing device 100 shown along the C-plane, seen in the direction of the arrow, with the cover 107 and the cover 108 removed.

[0036] As in Fig. As shown in Figure 7, the first base plate 400, on which the power semiconductor module 300U and the like are attached, is arranged in the first flow path forming body 110 and is connected to the first flow path forming body 110.

[0037] As in Fig. As shown in Figure 8, the first base plate 400 is attached to the first flow path-forming body 110 in such a way that it closes the opening leading to flow path 112a, the opening leading to flow path 112b, and the opening leading to flow path 112c. In this way, the first base plate 400 comes into direct contact with the cooling refrigerant.

[0038] As in Fig. As shown in Figure 8, the cooling refrigerant flows to the housing space 402 of the second flow-path forming body 401, as shown by a flow path 114 of the cooling refrigerant, by flowing through the flow path 112a. The cooling refrigerant cools the power semiconductor modules 300U to 300W. The cooling refrigerant then flows from the housing space 402 to the flow path 112b, as shown by a flow path 115 of the cooling refrigerant. The power semiconductor modules 300U to 300W are configured by a cooling element located in the housing space 402 and by an electrical connection element projecting from the housing space 402. Due to the configuration of the power semiconductor modules 300U to 300W, the direction in which the electrical connection element projects is the essential factor in determining the dimensions of the power semiconductor modules 300U to 300W.For this reason, in order to reduce the dimensions in the vertical direction of the current straightening device 100, it is necessary to fully consider the orientation of the power semiconductor modules. Furthermore, when assembling the current straightening device 100, the power semiconductor modules and other components are installed from the opening section of the housing 101 of the current straightening device 100, and then work such as screwing, welding, and soldering is carried out. It is difficult to perform such work at a location low to the ground (near the bottom of the housing 101) from the opening section.

[0039] Thus, the first flow-path forming body 110 and the second flow-path forming body 401 are formed separately. The second flow-path forming body 401 is then connected to the first base plate 400. Furthermore, the essential electrical components, such as the power semiconductor modules 300U to 300W, are mounted on the first base plate 400. This connection is made outside the housing 101 instead of inside it. The first base plate 400, to which the essential electrical components are mounted, is then attached to the second flow-path forming body 401. In this way, the outer wall of the current-directing device 100, namely the wall of the housing 101, is not present during assembly. This eliminates the directional dependency of the work process and increases flexibility in design and assembly.Furthermore, the flexibility in the direction of the electrical connection of the 300U to 300W power semiconductor modules also increases. This makes it possible to arrange the 300U to 300W power semiconductor modules so that the direction in which the electrical connection part of the 300U to 300W power semiconductor modules protrudes points towards the inner wall of the housing 101. In this way, it is possible to reduce the dimension in the vertical direction of the current direction device 100.

[0040] Furthermore, the capacitor module 500 is attached. Then the installation process takes place, including screwing, welding, and soldering the electrical components, as well as attaching the capacitor module 500 itself. However, it was difficult to carry out the work at a low point in the housing 101, relative to the opening section.

[0041] Thus, the capacitor module 500 in the present embodiment, as described in the Fig. 8 and Fig. As shown in Figure 9, the capacitor module is arranged on the first base plate 400. During assembly, the capacitor module 500 is attached to the first base plate 400 in such a way that the housing 101 has no wall, thus eliminating the directional dependency of the operation. As a result, the flexibility of assembly, such as screwing and welding, increases.

[0042] Furthermore, this can be in Fig. The capacitor element 505 shown in Figure 9 is attacked by the heat from the high-power power semiconductor module, resulting in a decrease or failure of the performance of the capacitor element 505.

[0043] Thus, the second flow-path-forming body 110 is formed at the position where flow paths 12a and 112c are opposite the capacitor module 500. This makes it possible to cool the capacitor module 500. Consequently, the performance and service life of the capacitor element 505 can be increased to a desired level.

[0044] Furthermore, in the present embodiment, the capacitor module 500 includes a capacitor housing 506 for accommodating part of the capacitor-side terminal 504 and the capacitor element 505. The capacitor housing 506 is formed with a capacitor-side opening section 507 with an outwardly projecting capacitor-side terminal 505. The capacitor housing 506 is also arranged on the first base plate 400 such that the capacitor-side opening section 507 faces the first flow-path-forming body 110, in which the power semiconductor module is housed.

[0045] Thanks to this design, the wiring distance of the capacitor-side terminal 505 connected to the power semiconductor module can be reduced. As a result, it is possible to decrease the inductance and the heat generated by the capacitor-side terminal 505 itself.

[0046] Furthermore, in the present embodiment, the 300V power semiconductor module is arranged at a position opposite the first base plate 400, with the 300W power semiconductor module located between it. A flow path chamber 116a, through which the cooling refrigerant flows, is then formed between the 300V power semiconductor module and the second 300W power semiconductor module. Furthermore, the 300U power semiconductor module is arranged at a position opposite the first base plate 400, with the 300V power semiconductor module and the 300W power semiconductor module located between them. A flow path chamber 116b, through which the cooling refrigerant flows, is then formed between the 300U power semiconductor module and the second 300V power semiconductor module.

[0047] Thanks to this design, the 300U to 300W power semiconductor modules come into direct contact with the cooling refrigerant. Simultaneously, the cooling refrigerant flows through both surfaces of each power semiconductor module, thus improving the cooling performance of the 300U to 300W power semiconductor modules.

[0048] Furthermore, in the present embodiment, the housing 101 is divided by the first flow-path-forming body 110 into a first housing space 117 and a second housing space 118. The first base plate 400, on which the essential electrical components are mounted, is housed in the first housing space 117. The circuit components of the DC / DC converter 900 are housed in the second housing space 118 and are arranged on the first flow-path-forming body 110. In this way, the converter circuit is cooled by a surface of the first flow-path-forming body 110, and the DC / DC converter is also cooled by a surface of the first flow-path-forming body 110, so that the cooling surface of the first flow-path-forming body 110 can be used effectively. This can contribute to the miniaturization of the entire device.

[0049] Furthermore, in the present embodiment, the second metal base plate 601 is arranged in a position opposite the first base plate 400, with the power semiconductor modules 300U to 300W located between them. The second base plate 601 also has a mounting element 601C connected to the metal housing 101. The control circuit board 600 is also arranged in a position opposite the power semiconductor modules 300U to 300W, with the second base plate 601 located between them. In this way, the second base plate 601 inhibits the electromagnetic interference emitted by the power semiconductor modules 300U to 300W. Thus, it is possible to protect the control circuit board 600 from electromagnetic interference. Reference symbol list 100 Current directional device 101 cases 101A Housing side panel 101B Housing side panel 101C Case Side Panel 102 Inlet pipe 103 Outlet pipe 104U AC busbar 104V AC busbar 104W AC busbar 105 Opening section 106 Opening section 107 Coverage 108 Cover 109 first insertion opening 110 first flow path forming body 111 Coverage 112a Flow path 112b Flow path 112c flow path 113 Partition wall 114 Flow rate of the cooling refrigerant 115 Flow rate of the cooling refrigerant 116a Flow path space 116b Flowway Space 200 driver circuit boards 201 Connecting part 202 Current sensor 300U power semiconductor module 300V power semiconductor module 300W power semiconductor module 325 Control terminal 400 first base plate 401 second flow path forming body 401A Side wall 402 Accommodation room 403 Inlet opening 404 Holding element 405A Holding element 405B Holding element 406 first through hole 407 second through hole 500 capacitor module 501 DC positive electrode terminal 502 DC negative electrode terminal 503 Resin sealant 504 capacitor-side terminal 505 Capacitor element 506 Capacitor housing 507 capacitor-side opening section 600 control circuit board 601A Mounting part 601B Mounting part 601C Mounting part 601 second base plate 602 third base plate 603 Opening section 900 DC / DC converter

Claims

[1] Current directional device (100) comprising: a power semiconductor module (300U, 300V, 300W) containing a power semiconductor element designed to convert direct current into alternating current; a first flow path forming body (110) which forms a first flow path (112a) to allow a cooling refrigerant to flow through it; a second flow path forming body (401) which forms a housing space (402) to allow a cooling refrigerant to flow through it; a first base plate (400) for attaching the second flow path forming body (401) to it; a driver circuit board (200) on which a driver circuit is mounted to output a control signal for controlling the power semiconductor element; and a housing (101) for accommodating the power semiconductor module (300U, 300V, 300W), the first flow path forming body (110), the second flow path forming body (401), the first base plate (400) and the driver circuit board (200), wherein the driver circuit board (200) is arranged such that the mounting surface of the driver circuit is opposite a side wall (401A) of the second flow path forming body (401), wherein the second flow path forming body (401) forms the accommodation space (402) for the accommodation of the power semiconductor module (300U, 300V, 300W), wherein the second flow path forming body (401) also forms an insertion opening (403) leading to the accommodation space (402) in the side wall (401A) opposite the mounting surface of the driver circuit, wherein the power semiconductor module (300U, 300V, 300W) has a control terminal (325) which passes through the insertion opening (403) and is connected to the driver circuit board (200), wherein the first flow path forming body (110) is attached to the housing (101), wherein the first flow path forming body (110) also forms an opening section leading to the first flow path (112a), wherein the first base plate (400) is designed to close the opening section and is connected to the first flow path forming body (110), and wherein the first base plate (400) also forms a first through-hole (406) connecting the first flow path (112a) and the accommodation space (402). [2] Current straightening device (100) according to claim 1, comprising a capacitor module (500) for smoothing the DC voltage, wherein the capacitor module (500) is arranged on the first base plate (400). [3] Current directing device (100) according to claim 2, wherein the first flow path (112a) is formed at a position opposite the capacitor module (500). [4] Current directional device (100) according to claim 2 or 3, wherein the capacitor module (500) includes a capacitor element (505), a capacitor-side terminal (504) electrically connected to the capacitor element (505), and a capacitor housing (506) for accommodating the capacitor element (505) and the capacitor-side terminal (504), wherein the capacitor housing (506) forms a capacitor-side opening section (507), wherein the capacitor-side terminal (504) protrudes outwards, and wherein the capacitor housing (506) is also arranged on the first base plate (400) such that the capacitor-side opening section (507) is opposite the second flow path forming body (401). [5] Current directional device (100) according to one of claims 1 to 4, wherein the power semiconductor module (300U, 300V, 300W) is configured by a first power semiconductor module (300W) and a second power semiconductor module (300V), wherein the second power semiconductor module (300V) is arranged at a position opposite the first base plate (400), with the first power semiconductor module (300W) in between, and wherein a flow path space (116a) through which the cooling refrigerant flows is formed between the first power semiconductor module (300W) and the second power semiconductor module (300V). [6] Current directional device (100) according to any one of claims 1 to 5, wherein a second through-hole (407) for connecting the first flow path (112a) and the accommodation space (402) is formed in the first base plate (400), and wherein the first flow path forming body (110) has a partition (113) which is arranged between the first through hole (406) and the second through hole (407) in such a way that it comes into contact with the first base plate (400). [7] Current directional device (100) according to one of claims 1 to 4, wherein the current directional device (100) includes a DC / DC converter circuit (900) for converting a DC voltage, wherein the housing (101) is divided by the first flow path forming body (110) into a first accommodation space (117) and a second accommodation space (118), wherein the power semiconductor module (300U, 300V, 300W), the second flow path forming body (401) and the first base plate (400) are housed in the first accommodation space (117), and wherein the DC / DC converter circuit (900) is housed in the second accommodation space (118) and is arranged in the second flow path forming body (401). [8] Current directional device (100) according to one of claims 1 to 7, comprising: a second base plate (601) made of metal, which is arranged at a position opposite one of the first base plate (400), wherein the power semiconductor module (300U, 300V, 300W) is located between them, the second base plate (601) being attached to the housing (101); and a control circuit board (600) on which a control circuit is mounted to output a control signal to the driver circuit to control the power semiconductor element, wherein the control circuit board (600) is arranged in a position opposite the power semiconductor module (300U, 300V, 300W), with the second base plate (601) in between. [9] Current directing device (100) according to any one of claims 1 to 8, wherein the first flow path forming body (110) is formed as one piece with the housing (101).

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