System consisting of a motion error detection device for an assembly head and a component assembly device

Abstract

System comprising a motion error detection device of an assembly head and a component assembly device (1) equipped with a substrate conveying device (4A) comprising a fixed conveyor (10) extending in a first direction and a movable conveyor (11) movable in a second direction orthogonal to the first direction with respect to the fixed conveyor (10), and equipped with an assembly head (20A) that mounts a component onto a substrate (P) conveyed by the substrate conveying device (4A) to a predetermined working position (Wp), wherein the motion error detection device of an assembly head comprises: a marker (M5) within a movable region comprising a projected image or a reflected image formed in a movable region of the movable conveyor (11); a pair of markings (M1, M3) outside the moving region, each provided on both sides of the marking (M5) inside the moving region in the second direction and attached outside the moving region of the moving conveyor (11) and outside the substrate (P) at the working position (Wp); an imaging device (26A) which moves together with the mounting head (20A); a control device (42) which selects from the marker (M5) inside the moving region and the pair of markers (M1, M3) outside the moving region two markers which are positioned on both outer sides of the substrate (P) in the second direction and are closest to the substrate (P), and causes the imaging device (26A) to image the markers; and a calculation device (42) which receives a movement error of the assembly head (20A) based on two marking images taken by the imaging device (26A).

Description

Technical area

[0001] The present invention relates to a system comprising a movement error detection device of a mounting head and a component mounting device, wherein the movement error detection device is incorporated in the component mounting device for correcting a movement error of a mounting head caused by thermal deformation of a drive system. General state of the art

[0002] A conventional component mounter includes a drive system that causes a mounting head to move horizontally. During successive mounting operations, the drive system experiences thermal distortion due to heating. Such thermal distortion causes a misalignment between a mounting head and a component, a component feed section, or a substrate, which is a factor in reducing mounting precision.Under these circumstances, in order to solve the problem, a camera is used for detecting a substrate, the camera moving together with a mounting head to image and detect a plurality of marks provided in a movable region of the mounting head, detect a change in a distance between the marks as a movement error of the mounting head due to thermal deformation of a drive system, and correct a target loading position of a component based on the movement error.

[0003] For example, JP 3 253 218 B2 discloses a technique for correcting a target loading position of a component based on an imaging result obtained by imaging each mark, wherein the marks are provided near a pair of conveyors for conveying a substrate, the pair consisting of a fixed conveyor and a movable conveyor, and wherein the marks include a pair of marks aligned in an X direction along the fixed conveyor and a pair of marks aligned in a Y direction. In this technique, in order to avoid interference with the movable conveyor, the pair of marks are provided in the Y direction outside a movable region of the movable conveyor.Therefore, it is expected that a substrate with a small size will cause a mark position and an actual substrate position to be far apart (cause a correction area larger than a substrate size) to make it difficult to ensure correction precision.

[0004] On the other hand, JP 5 495 260 B2 discloses a technique for correcting a target loading position of a component based on an imaging result obtained by imaging a pair of marks provided on a pair of conveyors for conveying a substrate, the pair of conveyors including a fixed conveyor and a movable conveyor, and the paired marks deviating from each other in a direction along the conveyor (an X direction). According to the technique, because the marks move along with the movable conveyor, such problems as those described in JP 3 253 218 B2 are solved. Since a position of each of the marks itself involves a movement error, it is difficult to ensure correction precision.

[0005] The patent literature documents JP 4 343 710 B2, DE 11 2010 004 036 T5, JP H04- 144 300 A and JP 2009- 10 176 A disclose further mounting devices. Brief description of the invention

[0006] It is an object of the present invention to correct a movement error of a mounting head caused by thermal deformation of a drive system with higher precision according to a size and a position of a substrate.

[0007] This object is achieved by a system comprising a movement error detection device of a mounting head and a component mounting device, which is equipped with a substrate conveying device comprising a fixed conveyor extending in a first direction and a movable conveyor movable in a second direction orthogonal to the first direction with respect to the fixed conveyor, and is equipped with a mounting head that mounts a component on a substrate conveyed by the substrate conveying device to a predetermined working position, wherein the movement error detection device of a mounting head comprises a mark within a movable region comprising a projected image or a reflected image formed in a movable region of the movable conveyor;a pair of marks outside a movable region, each provided on both sides of the mark inside the movable region in the second direction and mounted outside the movable region of the movable conveyor and outside the substrate at the work position; an imaging device that moves together with the mounting head; a control device that selects two marks, positioned on both outer sides of the substrate in the second direction and closest to the substrate, from the mark inside the movable region and the pair of marks outside the movable region, and causes the imaging device to image the marks; and a calculation device that obtains a movement error of the mounting head based on two mark images acquired by the imaging device. Brief description of the drawings Fig. 1 is a schematic plan view of a component mounting apparatus (a component mounting apparatus to which a movement error detection apparatus of a mounting head of the present invention is applied) of the present invention. Fig. 2 is a side view of the component mounting device (a view seen from an arrow in a II direction in Fig. 1). Fig. 3 is a block diagram showing a control system of the component mounting device. Fig. 4 is a flowchart showing an example of arithmetic correction value processing control by a control unit. Fig. 5A is a schematic plan view of first and second substrate conveying devices, showing a movable region of a movable conveyor. Fig. 5B is a schematic plan view of the first and second substrate conveying devices, showing one form of attachment of the movable conveyor. Fig. 6 is a plan view of a marker. Fig. 7A is a schematic plan view of the first and second substrate conveying devices, showing one form of mounting the movable conveyor in a parallel mounting mode. Fig. 7B is a schematic plan view of the first and second substrate conveying devices, showing another form of mounting the movable conveyor in the parallel mounting mode. Fig. 8 is a schematic plan view of the first and second substrate conveying devices in which a fifth mark is obscured by the movable conveyor. Fig. 9A is a schematic plan view of a modified example of the component mounting apparatus. Fig. 9B is a schematic plan view of the first and second substrate conveying devices in the parallel mounting mode of the component mounting apparatus shown in Fig. 9B is shown. Fig. 10A is a schematic plan view of another modification example of the component mounting apparatus. Fig. 10B is a schematic plan view of the first and second substrate conveying devices in the parallel mounting mode of the component mounting apparatus shown in Fig. 10A is shown. Fig. 11A is a schematic plan view of a single-track component mounting apparatus showing a positional relationship between a conveyor and a marker. Fig. Fig. 11B is a schematic plan view showing a state of the conveyor when a small-sized substrate is conveyed in the component mounting apparatus shown in Fig. 11A is shown. Description of embodiments

[0008] Hereinafter, embodiments of the present invention will be described with reference to accompanying drawings. [Design of a component assembly facility]

[0009] A component assembly device 1, which is Fig. 1, applies a two-track system and comprises first and second mounting units UA and UB. The first and second mounting units UA and UB are for two tracks L1 and L2 (first track L1, second track L2), which are formed on a base 2 and each have a rectangular structure (see Fig. 2), of substrate conveying devices 4A and 4B, which will be described later. In the following description, a horizontal direction parallel to the tracks L1 and L2 is set to be an X direction, a horizontal direction orthogonal to the X direction is set to be a Y direction, and a vertical direction is set to be a Z direction. One end side in the Y direction (bottom side of Fig. 1) is set to be a front side. When simply referred to as the upstream side and the downstream side, a conveying direction of a substrate P is taken as a reference, which will be described later. In this example, the X direction corresponds to a first direction of the present invention, and the Y direction corresponds to a second direction of the present invention.

[0010] As in Fig. As shown in Figure 1, the component mounting device 1 includes the first mounting unit UA on a front side thereof and the second mounting unit UB on a rear side thereof. The first and second mounting units UA and UB are not only schematically symmetrical in a front-to-rear direction but also have the same basic configuration.

[0011] The first mounting unit UA includes the first substrate conveying device 4A forming the first track L1 as a conveying path of the substrate P such as a printed circuit board, a first component supply section 5A, a first head unit 6A for mounting a component, a head unit driving mechanism that drives the first head unit 6A, and a first component recognition camera 7A.

[0012] The substrate conveying device 4A includes a pair of belt conveyors 10 and 11 each extending parallel to each other in the X direction (the first direction), and a conveyor drive mechanism that synchronously drives these conveyors 10 and 11 using a servo motor as a drive source. The substrate conveying device 4A receives the substrate P from the right side in the figure to convey the substrate P to a predetermined work position (referred to as a position of the substrate P / a first work position WpA shown in the figure) and holds the substrate P by means of a substrate holding device (not shown) having a swage pin or the like. Then, after the mounting work, the substrate P is carried out to the left side in the figure.

[0013] Of the pair of conveyors 10 and 11, the conveyor 10 on the front side is a fixed conveyor fixed to the base 2 (hereinafter properly referred to as the fixed conveyor 10), and the conveyor 11 on the rear side is a movable conveyor movable in the Y direction (the second direction) with respect to the fixed conveyor 10 (hereinafter properly referred to as the movable conveyor 11). The substrate conveying device 4A further includes a rail fixed to the base 2 and extending in the Y direction, and a conveying width varying mechanism that moves the movable conveyor 11 along the rail with a servo motor 13 (hereinafter properly referred to as a C-axis servo motor 13, see Fig. 3) as the drive source. This configuration allows the substrate conveying device 4A to change an interval between the conveyors 10 and 11 according to a size of the substrate P.

[0014] The conveyors 10 and 11 each include conveyor main bodies 10a and 11a extending in the X direction, and a pair of leg portions (not shown) extending below and at different positions in a longitudinal direction of the conveyor main bodies 10a and 11a. The leg portions of the fixed conveyor 10 are fixed to the base 2, and the leg portions of the movable conveyor 11 are movably supported on the rail.

[0015] The component feeding section 5A is mounted forward of the substrate conveying device 4A. In the component feeding section 5A, a plurality of tape feeders 12 for feeding components with a tape as a carrier are mounted parallel to each other along the substrate conveying device 4A. These tape feeders 12 include a drum around which a tape case holding a small chip component such as an IC, a transistor, and a capacitor is wound, and which feeds a component to a predetermined removal position while intermittently feeding the tape from the drum.

[0016] The first head unit 6A takes out a component from the component supply section 5A to feed the component onto the substrate P and load (mount) the component onto the substrate P.

[0017] The first head unit 6A is movable in the X-direction and the Y-direction in a fixed region by the head unit drive mechanism. The head unit drive mechanism includes a pair of fixed rails 15, each fixed to a pair of raised frames 14 provided at both ends in the X-direction on the base 2 and extending parallel to each other in the Y-direction, a support member 16 supported by these fixed rails 15 to extend in the X-direction, and a screw feed mechanism that causes the support member 16 to move in the Y-direction with a Y-axis servo motor 17 (see Fig. 3) as a drive source. In addition, the head unit drive mechanism includes a fixed rail fixed by the support member 16 to movably support the first head unit 6A in the X-direction, and a screw feed mechanism that causes the first head unit 6A to move with an X-axis servo motor 18 (see Fig. 3) as a drive source. In other words, the head unit drive mechanism causes the first head unit 6A to move in the X direction by driving the X-axis servo motor 18, and causes the support member 16 to move in the Y direction by driving the Y-axis servo motor 17. Consequently, the first head unit 6A moves in the X and Y directions within a fixed region.

[0018] The first head unit 6A includes a plurality of first mounting heads 20A each equipped with a nozzle for sucking a component, a head lifting mechanism that causes the first mounting heads 20A to go up and down (move in the Z direction), and a Z-axis servo motor 22 (see Fig. 3) as a drive source, and a head rotation mechanism that causes the first mounting heads 20A to rotate around a central axis thereof with an R-axis servo motor 24 (see Fig. 3) as a drive source. Each nozzle of the first mounting heads 20A, connected to a negative pressure generating device, sucks a component using a negative pressure supplied from the negative pressure generating device. The first head unit 6A is mounted with a first substrate detection camera 26A. The first substrate detection camera 26A moves together with the first head unit 6A to image a reference mark (not shown) attached to the substrate P, as well as imaging marks M1 to M5, described later, for detecting movement errors of the head units 6A and 6B. The first substrate detection camera 26A includes a camera main body including an area sensor such as a CCD and an optical system mounted below, and an illumination device.The component mounter 1 detects a position of the substrate P based on an image of a reference mark imaged by the first substrate detection camera 26A, and corrects a target position of a component mounted by the first head unit 6A (the first mounting head 20A) based on images of the marks M1 to M5, which will be described in detail later.

[0019] On the other hand, the first component detection camera 7A, which images a component sucked by the first mounting heads 20A before mounting, is fixed on the base 2. The first component detection camera 7A includes a camera main body including a tracking sensor such as a CCD and an optical system, which is mounted upwardly on the base 2, and an illumination device. The component mounter 1 detects a suction state of a component by the first mounting head 20A based on an image of the component captured by the first component detection camera 7A.

[0020] The above is the configuration of the first mounting unit UA. The second mounting unit UB includes the second substrate conveying device 4B forming the second track L2 as a conveying path of the substrate P, a second component supply section 5B, the second head unit 6B for mounting a component, a head unit drive mechanism that drives the second head unit 6B, and a second component recognition camera 7B.

[0021] The second substrate conveying device 4B and the like of the second mounting unit UB have a structure that is schematically symmetrical in the front-rear direction with respect to the first substrate conveying device 4A and the like of the first mounting unit UA.

[0022] Specifically, the second substrate conveying device 4B, similar to the first substrate conveying device 4A, includes the fixed conveyor 10 and the movable conveyor 11, with the fixed conveyor 10 positioned at the rear and the movable conveyor 11 positioned at the front. The movable conveyors 11 of the substrate conveying devices 4A and 4B are each supported by the above common rail extending in the Y direction and are movable in a region defined by the oblique lines in Fig. 4A, that is, are movable within a region between both fixed conveyors 10 as a movable region. This allows the movable conveyors 11 of the substrate conveying devices 4A and 4B to be switched from a state in which the movable conveyor 11 of the second substrate conveying device 4B is mounted in a position closest to the fixed conveyor 10, and the movable conveyor 11 of the first substrate conveying device 4A is mounted in a position closest to the movable conveyor 11 of the second substrate conveying device 4B, as shown in, for example, Fig. 4B, are movable to a state in which the movable conveyor 11 of the first substrate conveying device 4A is mounted in a position closest to the fixed conveyor 10, and the movable conveyor 11 of the second substrate conveying device 4B is mounted in a position closest to the movable conveyor 11 of the first substrate conveying device 4A.

[0023] The second head unit 6B has in common with the first head unit 6A that it is supported by the support member 16. However, while the first head unit 6A is mounted on the rear side of the support member 16, the second head unit 6B is mounted on the front side of the support member 16. In this way, the first head unit 6A and the second head unit 6B are designed to face each other in the front-to-rear direction. A configuration of the head unit drive mechanism that drives the second head unit 6B is essentially common to a configuration of the head unit drive mechanism that drives the first head unit 6A. Each support member 16 of the head units 6A and 6B is supported by the common fixed rails 15, as shown in Fig. 1. This allows the first head unit 6A to move on the substrate P of the second track L2, or conversely, allows the second head unit 6B to move on the substrate P of the first track L1.

[0024] In addition, while the first component recognition camera 7A is mounted between the first substrate conveying device 4A and the first component supplying section 5A, the second component recognition camera 7B is mounted between the second substrate conveying device 4B and the second component supplying section 5B.

[0025] The second head unit 6B comprises a second mounting head 20B and a second substrate detection camera 26B, as shown in Fig. 1. Furthermore, a working position (a position of the substrate P shown in the figure) of the substrate conveying device 4A is referred to as a second working position WpB. In this example, the first substrate detection camera 26A of the first head unit 6A corresponds to a first imaging device of the present invention, and the second substrate detection camera 26B of the second head unit 6B corresponds to a second imaging device of the present invention.

[0026] The first to fifth marks M1 to M5 for correcting a movement error of each of the head units 6A and 6B caused by the thermal deformation of the head unit drive mechanism are provided on the periphery of the first substrate conveying device 4A and the second substrate conveying device 4B. In other words, when the head units 6A and 6B are driven for a long period of time, a screw shaft of the screw feed mechanism and the raised frames 14 thermally deform (expand thermally) in a longitudinal direction to generate an error in a movement amount of the head units 6A and 6B (i.e., the mounting heads 20A and 20B). Therefore, the component mounter 1 is provided with the rectangular marks M1 to M5 with spaces, as shown in FIG. Fig. 6, and the marks M1 to M5 are imaged by the above substrate detection cameras 26A and 26B of the head units 6A and 6B to detect movement errors of the head units 6A and 6B based on the images.

[0027] A specific placement of each of the marks M1 to M5 is as follows. First, the first and second marks M1 and M2 are provided in order from the upstream side along the fixed conveyor 10 of the first substrate conveying device 4A, and the third and fourth marks M3 and M4 are provided in order from the upstream side along the fixed conveyor 10 of the second substrate conveying device 4B. As shown in Fig. 1 and Fig. 2, the first and second marks M1 and M2 are provided on an upper end surface of a support 30 fixed on the base 2 along a front surface of the fixed conveyor 10, and the third and fourth marks M3 and M4 are provided on the upper end surface of the support 30 fixed on the base 2 along a rear surface of the fixed conveyor 10. The first and third marks M1 and M3 are aligned in the Y direction at positions upstream of the working position Wp, and the second and fourth marks M2 and M4 are aligned in the Y direction at a position downstream of the working position Wp.

[0028] The first to fourth marks M1 to M4 consist, for example, of engraved plates, labels, or the like, which are fixed to the support 30, and are then provided at positions of heights that are identical to each other. Specifically, the marks are provided at the heights that are identical to those of the substrate P held at the working position Wp by the substrate holding device, that is, the marks are provided so as to be positioned within a reference plane IP, which is a virtual horizontal plane including an upper surface of the substrate P, as shown in FIG. Fig. 2. These first to fourth marks M1 to M4 are positioned outside the fixed conveyors 10 of the tracks L1 and L2 (ie, outside the movable region of the movable conveyor 11).

[0029] The fifth mark M5 is provided at a midpoint between the first mark M1 and the third mark M3 in the Y direction. The fifth mark M5 is formed from an insignificantly projected image formed on the reference plane IP. Specifically, a projection device 32 is provided at a position of the fifth mark M5 on the base 2. The projection device 32 includes a resin film 34 on which an image of the fifth mark is drawn, an illumination portion 34a, and an optical system 34b. The illumination portion 34a is configured to irradiate illumination light onto a film 33 from the back (bottom) thereof, and the optical system 34b is configured to form a projected image (focused image) on the above reference plane IP.In other words, the substrate recognition cameras 26A and 26B of the head units 6A and 6B have a focal length adjusted to be able to image a reference mark on the substrate P attached to the work position Wp, and as shown in FIG. Fig. 2, the substrate detection cameras 26A and 26B are mounted above the projection device 32 so as to be able to capture the projected image of the figure of the fifth mark (ie, the fifth mark M5) formed by the projection device 32.

[0030] The projection device 32 is mounted at a position lower than the conveyor main body 11a of the movable conveyor 11 and located outside, in the X direction, a moving distance (a position of the rail) of the leg portion of the movable conveyor 11. Thus, the projection device 32 absorbs a height difference from the reference plane IP to enable the substrate recognition cameras 26A and 26B to capture a focused image of the fifth mark M5 on the reference plane IP. In this way, the component mounter 1 is configured to substantially have the fifth mark M5 provided in the movable region of the movable conveyor 11 while avoiding interference with the movable conveyor 11.In this example, the fifth mark M5 corresponds to a mark within the movable region of the present invention, and the first mark M1 and the third mark M3 correspond to a pair of marks outside the movable region of the present invention.

[0031] Next, control systems of the component mounting device 1, which control the first and second mounting units UA and UB, will be described. The component mounting device 1 includes a control unit 40, which generally controls the operation of the first and second mounting units UA and UB.

[0032] As in Fig. 3, the control unit 40 includes a main control section 42 that generally controls the operation of the component mounter 1, a storage section 44 that stores a program and various data, a motor control section 46 that controls the driving of the servo motors 13, 17, 18, 22, and 24 on the X, Y, Z, R, and C axes, an image processing section 48 that processes data of an image taken by the substrate recognition cameras 26A and 26B and the component recognition cameras 7A and 7B for predetermined processing, and an external input / output section 50. The main control section 42, which is a computer composed of a CPU and a memory, is connected to the storage section 44, the motor control section 46, and the substrate recognition cameras 26A and 26B.Motor control section 46, image processing section 48, and external input / output section 50 are connected via a bus 41. The main control section 42 executes a mounting program necessary for mounting a component on the substrate P, as well as for performing various arithmetic processing for the mounting. Specifically, during the component mounting operation, the main control section 42 performs the operation of selecting a mark to be imaged from the first to fifth marks M1 to M5 according to a mounting mode or a position of the movable conveyor 11 of each of the tracks L1 and L2, imaging the selected mark by means of the substrate recognition cameras 26A and 26B at predetermined timing, a movement error of each of the head units 6A and 6B (i.e.of the first and second mounting heads 20A and 20B) based on the imaging data, and further calculates a correction value thereof (arithmetic processing of the correction value). In other words, in this example, the main control section 42 corresponds to a control device and a calculation device of the present invention.

[0033] The storage section 44 stores an assembly program to be executed by the main control section 42 and various data necessary for executing an assembly program. Specifically, when the main control section 42 calculates the above correction value for correcting a movement error of each of the head units 6A and 6B, the correction value is updated and stored.

[0034] The motor control section 46 controls the motors 13, 17, 18, 22, and 24 based on a signal from an encoder included in each of the motors 13, 17, 18, 22, and 24 and information applied by the main control section 42. The image processing section 48 is connected to the first component detection camera 7A, the second component detection camera 7B, and the first substrate detection camera 26A and the second substrate detection camera 26B, and receives a signal indicative of an image from these cameras 7A, 7B and 26A, 26B, subjects the signal to predetermined image processing, and sends the image data to the main control section 42.

[0035] To the external input / output section 50, various sensors provided in the mounting units UA and UB are connected as input elements, and the projection device 32 and the like are connected as output elements.

[0036] In this example, the first, third, and fifth markers M1, M3, and M5 correspond to the substrate recognition cameras 26A and 26B of the first and second mounting units UA and UB, and the main control section 42 corresponds to a movement error detection device of a mounting head of the present invention. [Operation of the component assembly facility]

[0037] Mounting modes executed by the component mounter 1 are roughly divided into a parallel mounting mode (parallel mounting operation) in which the first mounting unit UA and the second mounting unit UB individually mount components on the substrates P of the tracks L1 and L2 thereof, and an entry mounting mode in which the first mounting unit UA and the second mounting unit UB mount a component on a substrate P in cooperation with each other. Then, the entry mounting mode is further divided into a single-track entry mounting mode (single-track entry mounting operation) in which only one of the two tracks L1 and L2 is used, and a double-track entry mode (bidirectional entry mounting operation) in which the two tracks L1 and L2 are used. The contents of each mounting mode are as follows. 1) Parallel assembly mode

[0038] The parallel mounting mode is a mode in which only the first head unit 6A mounts a component on the substrate P mounted at the first work position WpA of the first track L1, and only the second head unit 6B mounts a component on the substrate P mounted at the second work position WpB of the second track L2, as shown in Fig. 1. In other words, while the first head unit 6A sucks a component from the tape feeder 12 of the first component supply section 5A to mount the component on the substrate P of the first track L1, the second head unit 6B sucks a component from the tape feeder 12 of the second component supply section 5B to mount the component on the substrate P of the second track L2. In this case, after the component sucking, the first head unit 6A passes over the first component detection camera 7A, and the second head unit 6B passes over the second component detection camera 7B, resulting in imaging of the targeted component to detect a state of the component sucked by the mounting heads 20A and 20B.Then, a target loading position of the component is corrected based on the state of the component sucked by the mounting heads 20A and 20B and the correction value for correcting movement errors of the head units 6A and 6B, thereby controlling the head units 6A and 6B based on the target loading position. 2) Single-track entry mounting mode

[0039] The single-track entry mounting mode is a mode in which, while the substrate P is conveyed from only one of the tracks L1 and L2 (see Fig. 7A and Fig. 7B), both the first and second head units 6A and 6B mount a component on the substrate P mounted at a work position of the track. The operation, such as detecting a state of a component sucked by the component detection units 7A and 7B, is similar to that of the parallel mounting mode. 3) Double-track entry mounting mode

[0040] The double-track entry mounting mode is a mode in which, while the substrate P is sequentially mounted on the work positions WpA and WpB of any one of the first and second tracks L1 and L2 in a predetermined order or arbitrarily, both the first and second head units 6A and 6B mount a component on the substrate P. The operation such as detecting a state of a component sucked by the component detecting units 7A and 7B is similar to that in the parallel mounting mode. [Control or regulation of arithmetic correction value processing]

[0041] Fig. 4 is a flowchart showing an example of the above arithmetic correction value processing control by the main control section 42. The arithmetic correction value processing is processing for obtaining a correction value for correcting a movement error of each of the head units 6A and 6B (i.e., the mounting heads 20A and 20B) caused by thermal deformation of the head unit drive mechanism, as described above.

[0042] At the start of the flowchart, the main control section 42 first determines whether a mounting mode of the component mounter 1 has been changed or not (step S1). If determined to be YES, the main control section 42 determines whether the fifth mark M5 is obscured by the movable conveyor 11 or not (step S3). Specifically, the main control section 42 obtains a position of the movable conveyor 11 of each of the substrate conveying devices 4A and 4B based on a signal from the encoder included in the C-axis servo motor 13 of the conveying width varying mechanism, and determines whether the position of the movable conveyor 11 is within a predetermined range of a position of the fifth mark M5 or not.

[0043] If NO is determined, the main control section 42 determines whether the mounting mode is the parallel mounting mode or not (step S5), and if YES is determined, the main control section 42 performs the operation of mapping the marks into minimum correction areas of the tracks L1 and L2 assigned to the head units 6A and 6B, respectively, by the substrate recognition cameras 26A and 26B (step S7), calculates a correction value of a movement error of each of the head units 6A and 6B with respect to each of the areas assigned to the head units 6A and 6B based on an image of the mark, and updates and stores the correction value (step S9).

[0044] The above correction value is obtained for each of the head units 6A and 6B based on images of three marks from the marks M1 to M5, the three marks being aligned at right angles when connected by a straight line, and imaged by the substrate detection cameras 26A and 26B. A specific method for calculating such a correction value is a conventionally known technique (e.g., Japanese Patent Publication No. 3253218 listed in the related art, etc.), and therefore, a detailed description thereof is not given here.

[0045] Regarding the selection of a mark to be imaged, if a mark is selected at a position remote from the position of the substrate P, an exact movement error at the position (responsible area) of the substrate P may not be reflected in a correction value, and if a mark is selected at a position that does not fall within the entire region of the substrate P, a movement error is insufficiently corrected, so that in either case, the reliability of a correction value is reduced. Thus, the main control section 42 selects a mark in a minimum correction area of each of the tracks L1 and L2 assigned to the head units 6A and 6B, respectively, so that such a problem is avoided as much as possible.

[0046] A minimum correction area mark represents a mark at a position where an area (correction area) in which a target loading position to be corrected becomes minimum. Specifically, the minimum correction area mark is a mark closest to the substrate P (hereinafter referred to as a nearest mark), which is a nearest mark in the X direction located on an outer side of the substrate P in the X direction, and which is a nearest mark in the Y direction located on an outer side of the substrate P in the Y direction. Since, in this example, marks aligned in the X direction are only the first and second marks M1 and M2 and the third and fourth marks M3 and M4, at any time, the minimum correction area marks in the X direction are the first and second marks M1 and M2 or the third and fourth marks M3 and M4, as described above.

[0047] Assuming that Fig. 1 shows the parallel mounting mode, for example, a responsible surface of the first head unit 6A is the substrate P mounted at the first work position WpA of the first track L1. Accordingly, minimum correction surface marks for the first head unit 6A are the first and second marks M1 and M2 in the X direction, and the first and fifth marks M1 and M5 in the Y direction. On the other hand, a responsible surface of the second head unit 6B is the substrate P mounted at the second work position WpB of the second track L2. Accordingly, minimum correction surface marks for the second head unit 6B are the third and fourth marks M3 and M4 in the X direction, and the third and fifth marks M3 and M5 in the Y direction. Accordingly, in step S7, the main control unit 6A forms the substrate P.Main control section 42 sequentially images the first, second, and fifth marks M1, M2, and M5 by means of the first substrate recognition camera 26A of the first head unit 6A by controlling the head units 6A and 6B (corresponding to a first imaging operation in the present invention), and sequentially images the third, fourth, and fifth marks M3, M4, and M5 by means of the second substrate recognition camera 26B of the second head unit 6B (corresponding to a second imaging operation in the present invention).

[0048] Then, in step S8, the main control section 42 calculates movement errors in the X and Y directions of the first head unit 6A based on the positions of images of the first, second, and fifth marks M1, M2, and M5, and calculates correction values for the movement errors, while calculating movement errors in the X and Y directions of the second head unit 6B based on the positions of images of the third, fourth, and fifth marks M3, M4, and M5, and calculates correction values for the movement errors. Then, the main control section 42 updates and stores the correction values for the head units 6A and 6B, respectively, in the storage section 44.

[0049] With further reference to Fig. 4, if NO is determined in step S5, that is, if it is determined that the mounting mode is not the parallel mounting mode, the main control section 42 further determines whether the mounting mode is the single-track entry mode or not (step S15). If YES is determined, the main control section 42 shifts the processing to step S7, where, similarly to a case of the parallel mounting mode, minimum correction area marks of the tracks L1 and L2 assigned to the head units 6A and 6B are selected, and the marks are imaged by the substrate recognition cameras 26A and 26B. Then, in step S8, correction values for movement errors of the head units 6A and 6B are calculated based on the mark images to update and store the correction values in the storage section 44.

[0050] Fig. 7A and Fig. 7B each show an example of a configuration of the single-track assembly mode. Fig. Fig. 7A shows a case where the fabrication of a substrate P is carried out only in the first track L1 in the track configuration similar to that in the parallel mounting shown in Fig. 1 is shown, and Fig. 7B shows a case where the manufacturing of a large-sized substrate P is carried out in the first track L1, wherein the first track L1 is set at a maximum interval.

[0051] In these cases, the responsible surfaces of the head units 6A and 6B are both substrates P in the first track L1. In one case of the example shown in Fig. 7A, since the fifth mark M5 is positioned on the outside of the first track L1 in the Y direction, minimum correction area marks for both head units 6A and 6B are the first and second marks M1 and M2 and the fifth mark M5. On the other hand, in a case of the example shown in Fig. 7B, since the fifth mark M5 is positioned on the inside of the first track L1 in the Y direction, minimum correction area marks for both head units 6A and 6A are the first and second marks M1 and M2 and the third mark M3.

[0052] Accordingly, in one case of the example shown in Fig. 7A, in step S7, the main control section 42 sequentially images the first, second, and fifth marks M1, M2, and M5 by means of the first substrate recognition camera 26A of the first head unit 6A by controlling the head units 6A and 6B (corresponding to the first imaging operation in the present invention), and sequentially images the first, second, and fifth marks M1, M2, and M5 by means of the second substrate recognition camera 26B of the second head unit 6B (corresponding to a fourth imaging operation in the present invention). Then, in step S8, the main control section 42 calculates movement errors in the X and Y directions of the head units 6A and 6B based on positions of images of the first, second, and fifth marks M1, M2, and M5, and calculates correction values for the movement errors. Then, the main control section 42 updates and stores the correction values for the head units 6A and 6B, respectively.6B in the memory section 44.

[0053] On the other hand, in one case of the example given in Fig. 7B, in step S7, the main control section 42 sequentially images the first, second, and third marks M1, M2, and M3 by means of the first substrate recognition camera 26A of the first head unit 6A by controlling the head units 6A and 6B (corresponding to the first imaging operation in the present invention), and sequentially images the first, second, and third marks M1, M2, and M3 by means of the second substrate recognition camera 26B of the second head unit 6B (corresponding to the fourth imaging operation in the present invention). Then, in step S8, the main control section 42 calculates.Main control section 42 calculates movement errors in the X and Y directions of the first head unit 6A based on the positions of images of the first, second, and third marks M1, M2, and M3 captured by the first substrate detection camera 26A, and calculates movement errors in the X and Y directions of the second head unit 6B based on the positions of images of the first, second, and third marks M1, M2, and M3 captured by the second substrate detection camera 26B. Then, the main control section 42 updates and stores the correction values for the head units 6A and 6B, respectively, in the storage section 44.

[0054] Although not shown, when the production of the substrate P is performed only in the second track L2, the responsible area for both the head units 6A and 6B is the substrate P in the second track L2. In this case, a mark closest to the substrate P mounted at the second work position WpB is imaged by the second substrate recognition camera 26B (corresponding to the second imaging operation of the present invention), while the nearest mark is imaged by the first substrate recognition camera 26A (corresponding to the third mounting operation of the present invention). Then, the main controller 26A calculatesMain control section 42 calculates movement errors in the X and Y directions of the second head unit 6B based on the mark image captured by the second substrate detection camera 26B, and calculates movement errors in the X and Y directions of the first head unit 6A based on the mark image captured by the first substrate detection camera 26A. Then, the main control section 42 updates and stores the correction values for the head units 6A and 6B, respectively, in the storage section 44.

[0055] With further reference to Fig. 4, if NO is determined in step S15, that is, if it is determined that the mounting mode is the both-track entry mounting mode, the main control section 42 proceeds to the processing in step S17. The main control section 42 performs, in addition to minimum correction area marks of the tracks L1 and L2 assigned to the head units 6A and 6B, an operation of imaging a minimum correction area mark in the partner track, that is, a minimum correction area mark when each of the head units 6A and 6B enters the partner track, by means of the substrate recognition cameras 26A and 26B. Based on the mark images, the main control section 42 then calculatesMain control section 42 calculates a correction value for a movement error of the first head unit 6A with respect to each area assigned to the first head unit 6A, while calculating a correction value for a movement error of the second head unit 6B with respect to each area assigned to the second head unit 6B, and updates and stores these correction values in the storage section 44 (step S19).

[0056] Assuming that Fig. 1 shows the double-track entry mounting mode, since responsible surfaces of the first head unit 6A are the substrates P attached to the work positions WpA and WpB in both tracks L1 and L2, minimum correction surface marks for the first head unit 6A are a mark group including the first, second, and fifth marks M1, M2, and M5 as a set, and a mark group including the third, fourth, and fifth marks M3, M4, and M5 as a set. On the other hand, since responsible surfaces of the second head unit 6B are also the substrates P attached to the work positions WpA and WpB in both tracks L1 and L2, minimum correction surface marks for the second head unit 6B are the same as the above two mark groups.

[0057] Accordingly, in step S17, the main control section 42 sequentially images all the marks M1 to M5 by means of the first substrate recognition camera 26A of the first head unit 6A (corresponding to the first and third imaging operations in the present invention), and sequentially images all the marks M1 to M5 by means of the second substrate recognition camera 26B of the second head unit 6B (corresponding to the second and fourth imaging operations in the present invention).

[0058] Then, in step S19, the main control section 42 calculates movement errors in the X and Y directions of the first head unit 6A in the first track L1 based on images of the first, second, and fifth marks M1, M2, and M5, and calculates correction values for the movement errors (referred to as a first unit correction value), and calculates movement errors in the X and Y directions of the first head unit 6A in the second track L2 based on images of the third, fourth, and fifth marks M3, M4, and M5, and calculates correction values for the movement errors (referred to as a second unit correction value). In addition, the main control section 42 calculatesMain control section 42 calculates movement errors in the X and Y directions of the second head unit 6B in the first track L1 based on the images of the first, second, and fifth marks M1, M2, and M5, and calculates correction values for the movement errors (referred to as a first second unit correction value), and calculates movement errors in the X and Y directions of the second head unit 6B in the second track L2 based on the images of the third, fourth, and fifth marks M3, M4, and M5, and calculates correction values for the movement errors (referred to as a second second unit correction value). Then, the correction values for the head units 6A and 6B are updated and stored in the storage section 44.

[0059] With further reference to Fig. 4, when YES is determined in step S3, that is, when it is determined that the fifth mark M5 is hidden, the main control section 42 performs the operation of imaging the maximum correction area marks by means of the substrate recognition cameras 26A and 26B regardless of the mounting mode (step S21), and further calculates a correction value for a movement error of each of the head units 6A and 6B based on an image of the mark, and updates and stores the correction value in the storage section 44.

[0060] The maximum correction area marks are marks positioned at both ends in the X direction of each of the head units 6A and 6B regardless of a responsible area, and are marks positioned at both ends in the Y direction. For example, as shown in Fig. 8, when the fifth mark M5 is hidden by the movable conveyor 11 of the first track L1, the maximum correction area marks for the first head unit 6A are the first, second, and third marks M1, M2, and M3. On the other hand, the maximum correction area marks for the second head unit 6B are the first, third, and fourth marks M1, M3, and M4. Accordingly, in step S21, the main control section 42 sequentially images the first, second, and third marks M1, M2, and M3 by means of the first substrate detection camera 26A of the first head unit 6A by controlling the head units 6A and 6B, and also sequentially images the first, third, and fourth marks M1, M3, and M4 by means of the second substrate detection camera 26B of the second head unit 6B.

[0061] Then, in step S23, the main control section 42 calculates movement errors in the X and Y directions of the first head unit 6A based on images of the first, second, and third marks M1, M2, and M3, and calculates correction values for the movement errors. It also similarly calculates movement errors in the X and Y directions of the second head unit 6B based on images of the first, third, and fourth marks M1, M3, and M4, and calculates correction values for the movement errors. The main control section 42 then updates and stores the correction values for the head units 6A and 6B, respectively, in the storage section 44.

[0062] With further reference to Fig. 4, when any of the processing in steps S9, S19, and S23 is completed, the main control section 42 proceeds to the processing in step S11. In step S11, the main control section 42 waits for the substrate P to be mounted at the work positions WpA and WpB, and when the substrate P is mounted at the work positions WpA and WpB, it controls the head units 6A and 6B to mount a component on the substrate P. On this occasion, the main control section 42 reads data of the correction value corresponding to the mounting mode currently stored in the storage section 44 based on a current mounting mode, corrects a target loading position of the component based on the correction value, and mounts the component on the substrate P based on the corrected target loading position.

[0063] In this case, specifically, when the mounting mode is the double-track entry mounting mode, a target loading position of the component is corrected in the following manner. First, when the substrate P is mounted at the first work position WpA of the first track L1, with respect to a loading position of the substrate P assigned to the first head unit 6A, a target loading position is corrected based on the first correction value for the first unit, and with respect to a loading position assigned to the second head unit 6B, a target loading position is corrected based on the first correction value for the second unit.Then, when the substrate P is mounted at the second work position WpB of the second track L2 with respect to a loading position of the substrate P assigned to the first head unit 6A, a target loading position is corrected based on the second correction value for the first unit, and with respect to a loading position assigned to the second head unit 6B, a target loading position is corrected based on the second correction value for the second unit.

[0064] When the processing in step S11 is completed, the main control section 42 determines whether or not the production of the substrate P in the current mounting mode is completed, and in the case where NO is determined, the processing returns to step S1 to continue the production of the substrate P, and when YES is finally determined in step S13, the main control section 42 completes the flowchart. [Functions, effects, etc. of the component assembly device]

[0065] According to the above component mounting apparatus 1, from the five markers M1 to M5, an appropriate marker is selected according to a size and position (a position of each movable conveyor 11) of the substrate P and a mounting mode, and the correction value of each of the head units 6A and 6B is obtained based on the markers. Therefore, especially in such a case, since essentially the minimum correction area markers of the tracks L1 and L2 are assigned to the head units 6A and 6B, that is, markers closest to the substrates P mounted at the work positions WpA and WpB are selected, the reliability of a correction value is increased compared to a conventional apparatus (Patent Literature 1 in the general prior art) in which a mark is constantly imaged at a certain position to obtain a correction value regardless of the size and position of the substrate P.In particular, the component mounting apparatus 1, in which the provision of a mark (the fifth mark M5) in a movable region of the movable conveyor 11 increases the flexibility in selecting a mark in the Y direction, and all the marks M1 to M5, including the fifth mark M5, are all fixedly attached, does not involve the problem of a mark having a movement error, the problem of a conventional apparatus (Patent Literature 2 in the general prior art) in which a mark is fixed to a movable conveyor. Accordingly, the component mounting apparatus 1 achieves higher reliability in obtaining a correction value and therefore has an advantage of increasing the precision of component mounting by means of the head units 6A and 6B, compared to a conventional apparatus.

[0066] In addition, in the component mounter 1, minimum correction area marks of the tracks L1 and L2 assigned to the head units 6A and 6B are generally selected and imaged as described above. This provides the further advantage that, while increasing the reliability of a correction value, the time required to image a mark by each of the substrate detection cameras 26A and 26B can be reduced.

[0067] In addition, according to the component mounter 1, particularly in the double-track entry mounting mode, not only a correction value in a case where the substrates P are mounted in the tracks L1 and L2 to which the head units 6A and 6B belong, but also a correction value in a case where the substrates P are mounted in the partner tracks L1 and L2 to which the head units 6A and 6B enter are obtained. Since the correction values are selectively used according to a track (the work positions WpA and WpB) in which the substrate P is to be carried, there is another advantage in that the production of the substrate P can be efficiently carried out. In other words, the double-track entry mode in which of the two tracks L1 and L2 the substrate P is to be carried depends on the progress of the work in a preceding step.In this case, if the two marks M1 to M5 are imaged to obtain a correction value after actually carrying substrates P into the tracks L1 and L2 and determining a track to be used, manufacturing is not economical. In this regard, according to the above component mounter 1, in which correction values for the head units 6A and 6B are obtained in advance for a case where the substrate P is mounted in each of the tracks L1 and L2, it is possible to promptly proceed with the manufacturing of the substrate P in each case where the substrate P is brought into the tracks L1 or L2. Accordingly, the manufacturing of the substrate P can be efficiently carried out in the two-track entry mounting mode.

[0068] In addition, since the fifth mark M5 is provided within the same reference plane IP as those of the other marks M1 to M4, by forming a projected image of the fifth mark M5 in a moving region of the moving conveyor 11, the component mounting apparatus 1 has the advantage that the fifth mark M5 can be provided in a moving region of the moving conveyor 11 without obstructing movement of the moving conveyor 11. [Another variation example]

[0069] The above-described component mounting apparatus 1 illustrates a preferred embodiment of the component mounting apparatus according to the present invention, and a specific configuration thereof may be changed accordingly without departing from the gist of the present invention.

[0070] For example, although in the above component mounting device 1, the fifth mark M5 is provided between the first mark M1 and the third mark M3, more marks may be provided. For example, a sixth mark M6 may be provided between the first mark M1 and the fifth mark M5 in a similar manner to that of the fifth mark M5, and a seventh mark M7 may be provided between the third mark M3 and the fifth mark M5 in a similar manner to that of the fifth mark M5, as shown in Fig. 9A. In this embodiment, when large and small substrates P having different sizes are manufactured in parallel mounting mode, as shown in Fig. 9B, a correction value of a movement error of the first head unit 6A can be obtained based on the first, second, and sixth marks M1, M2, and M6, and a correction value of a movement error of the second head unit 6B can be obtained based on the third, fourth, and sixth marks M3, M4, and M6, thereby making it possible to obtain a correction value using marks more in accordance with the size of the substrate P. Therefore, it is effective to further increase the precision of mounting a component by means of the head units 6A and 6B.

[0071] In addition, as in Fig. 10A, the sixth mark M6 may be provided between the first mark M1 and the second mark M2 in a similar manner to the first and second marks M1 and M2, and the seventh mark M7 may be provided between the third mark M3 and the fourth mark M4 in a similar manner to the third and fourth marks M3 and M5. In this embodiment, when a substrate P having a small size in the X-direction is manufactured in the parallel mounting mode, as in Fig. As shown in FIG. 10B, obtaining a correction value for the first head unit 6A based on the first, fifth, and sixth marks M1, M5, and M6 and obtaining a correction value for the second head unit 6B based on the third, fifth, and seventh marks M3, M5, and M7 results in obtaining a correction value that more closely matches the size of the substrate P in the X direction and has high reliability. Therefore, it is effective in increasing the precision of mounting a component by means of the head units 6A and 6B.

[0072] Furthermore, the component mounting device 1 of each embodiment is a two-track system component mounting device. However, the component mounting device 1 may be a single-track system component mounting device.

[0073] In this case, as in Fig. 11A, it is only necessary that, in a state where the conveyors 10 and 11 of a substrate conveying device 4 are fixed at a maximum interval, the first and second marks M1 and M2 are provided along the fixed conveyor 10 and at a front side thereof, the third and fourth marks M3 and M4 are provided along the movable conveyor 11 and at a rear side thereof, and the fifth mark M5 is provided at a middle position in the Y direction between the first mark M1 and the third mark M4. According to this embodiment, at the time of manufacturing a large-sized substrate P, a correction value in the Y direction can be obtained based on the first mark M1 and the third mark M3, as shown in Fig. 11A, and at the time of manufacturing a small-sized substrate P, a correction value in the Y direction can be obtained based on the first mark M1 and the fifth mark M5, as shown in Fig. 11B. It is therefore possible to obtain a correction value that more closely corresponds to the size of the substrate P and has high reliability in the single-track component mounter 1.

[0074] In addition, although in each embodiment, a motion error for each of the head units 6A and 6B is obtained based on images of three marks, the three marks being aligned at right angles when connected by a straight line and imaged by the substrate detection cameras 26A and 26B, the three marks may not necessarily be aligned at right angles. In addition, the number of marks to be detected to obtain motion errors for the head units 6A and 6B is not limited to three, but may be four or more.

[0075] Although in each embodiment, the projection device 32 is provided which projects a projected image on the reference plane IP as the fifth mark M5, the device may also form a reflected image of the reference plane IP as the fifth mark M5.

[0076] The present invention described above is summarized as follows.

[0077] In other words, the present invention is a system comprising a movement error detection device of a mounting head and a component mounting device equipped with a substrate conveying device including a fixed conveyor extending in a first direction and a movable conveyor movable in a second direction orthogonal to the first direction with respect to the fixed conveyor, and equipped with a mounting head that mounts a component on a substrate conveyed by the substrate conveying device to a predetermined working position, wherein the movement error detection device of a mounting head includes a mark within a movable region consisting of a projected image or a reflected image formed in a movable region of the movable conveyor;a pair of marks outside a movable region, each provided on both sides of the mark inside the movable region in the second direction and mounted outside the movable region of the movable conveyor and outside the substrate at the work position; an imaging device that moves together with the mounting head; a control device that selects two marks, positioned on both outer sides of the substrate in the second direction and closest to the substrate, from the mark inside the movable region and the pair of marks outside the movable region, and causes the imaging device to image the marks; and a calculation device that obtains a movement error of the mounting head based on two mark images acquired by the imaging device.

[0078] With the configuration of the movement error detection device, a suitable mark is selected from the mark inside the movable region and the pair of marks outside the movable region according to a size and position of the substrate, that is, a mark closest to the substrate P is selected, and a movement error of the mounting head is obtained based on an image of the mark. Therefore, a movement error of a mounting head caused by thermal deformation of a drive system can be corrected with higher precision according to a size and position of a substrate. Moreover, the mark inside the movable region consists of a projected image or a reflected image formed in a movable region of the movable conveyor and is mounted in the movable region without obstructing the movement of the movable conveyor.Therefore, the movement error detection device does not involve the problem that a marker has a movement error, the problem of a conventional device (Patent Literature 2 in the general prior art) in which a marker is fixed to a movable conveyor, and also in this respect, the movement error detection device enables correction of a movement error in the second direction of the mounting head with high precision.

[0079] In the movement error detection device, it is appropriate that the mark inside the movable region includes a plurality of marks inside the movable region aligned in the second direction, and the pair of marks outside the movable region is provided on both sides of the plurality of marks inside the movable region in the second direction.

[0080] Since the configuration increases the flexibility in that one mark is selected when two marks closest to the substrate are selected, it is advantageous to obtain a movement error of the mounting head with high precision.

[0081] The above system comprises a first assembling unit including the substrate conveying device, the assembling head, and the imaging device, and a second assembling unit including another substrate conveying device, another assembling head, and another imaging device, in which a movable conveyor of the other substrate conveying device and a movable conveyor of the substrate conveying device of the first assembling unit are mounted so as to be adjacent to each other in the second direction, in which the pair of markers outside the movable region are mounted outside fixed conveyors of the first assembling unit and the second assembling unit, and the marker is mounted within the movable region in movable regions of the movable conveyors of the first assembling unit and the second assembling unit, and in which,when the mounting head and the imaging device of the first mounting unit are defined as a first mounting head and a first imaging device, respectively, and the mounting head and the imaging device of the second mounting unit are defined as a second mounting head and a second imaging device, respectively, a working position of a substrate in the first mounting unit is defined as a first working position, a working position of a substrate in the second mounting unit is defined as a second working position, and of the pair of marks outside the movable region, a mark outside a movable region on one side of the first mounting unit is defined as a first mark outside the movable region, and a mark outside the movable region on one side of the second mounting unit is defined as a second mark outside the movable region,the control device can perform at least one imaging operation from a first imaging operation of selecting two marks positioned on both outer sides of a substrate mounted at the first working position and closest to the substrate, and including at least the first mark outside the movable region, and causing the first imaging device to image the selected marks; a second imaging operation of selecting two marks positioned on both outer sides of a substrate mounted at the second working position and closest to the substrate, and including at least the second mark outside the movable region, and causing the second imaging device to image the selected marks; a third imaging operation of selecting two marks positioned on both outer sides of a substrate,mounted at the second working position and closest to the substrate, and include at least the second mark outside the movable region, and cause the first imaging device to image the selected marks; and a fourth imaging operation of selecting two marks positioned on both outer sides of a substrate mounted at the first working position and closest to the substrate, and include at least the first mark outside the movable region, and cause the second imaging device to image the selected marks, and in which the calculation device can obtain a movement error of at least one of the first mounting head and the second mounting head based on a mark image acquired in the imaging operation performed by the control device.

[0082] In the design of the motion error detection device, the parallel mounting of the first mounting unit and the second mounting unit enables a variety of mounting forms (mounting modes). In this highly versatile mounting form, motion errors of the first mounting head and the second mounting head can then be detected with high precision according to a mounting form thereof.

[0083] In this case, it is appropriate that the component mounter performs a parallel mounting operation of mounting a component on a substrate mounted at the first work position only by the first mounting head and mounting a component on a substrate mounted at the second work position only by the second mounting head, wherein the control device performs the first imaging operation and the second imaging operation, the calculating means obtains a movement error of the first mounting head based on a mark image acquired in the first imaging operation, and obtains a movement error of the second mounting head based on a mark image acquired in the second mounting operation.

[0084] The configuration enables the movement errors of the first mounting head and the second mounting head to be adequately maintained within a necessary and sufficient range in the parallel mounting operation. Furthermore, in a case where the component mounter performs a one-side entry mounting operation of mounting a component on the substrate using both the first mounting head and the second mounting head while sequentially bringing in a substrate to either the first working position or the second working position, the control device preferably performs the first imaging operation and the fourth imaging operation when the substrate is brought in only to the first working position in the one-side entry mounting operation, while preferably performs the second imaging operation and the third imaging operation when the substrate is brought in only to the second working position.and when the substrate is only brought into the first working position, the calculation means preferably obtains a movement error of the first mounting head based on a mark image taken in the first imaging operation, as well as a movement error of the second mounting head based on a mark image taken in the fourth imaging operation, and when the substrate is only brought into the second working position, it preferably obtains a movement error of the second mounting head based on a mark image taken in the second imaging operation, as well as a movement error of the first mounting head based on a mark image taken in the third imaging operation.

[0085] The configuration enables movement errors of the first mounting head and the second mounting head to be appropriately maintained within a necessary and sufficient range in the one-side entry mounting operation.

[0086] Furthermore, in a case where the component mounter performs a bidirectional entry mounting operation of mounting a component on the substrate by means of both the first mounting head and the second mounting head while selectively carrying in a substrate to any one of the first work position and the second work position, the control device appropriately performs the first imaging operation to the fourth imaging operation, and the calculating means appropriately obtains a movement error of the first mounting head based on each mark image acquired in the first imaging operation and the third imaging operation, and obtains a movement error of the second mounting head based on each mark image acquired in the second imaging operation and the fourth imaging operation.

[0087] The configuration enables movement errors of the first mounting head and the second mounting head to be appropriately maintained within a necessary and sufficient range in the bidirectional entry mounting operation.

[0088] In the above system, the controller appropriately performs the imaging operation before substrates are mounted at the first working position and the second working position.

[0089] In the configuration, since movement errors of the first mounting head and the second mounting head can be obtained in advance without interrupting the component mounting work, the mounting work can be carried out more effectively. List of reference symbols 1 component assembly device 2 Base 4A first substrate conveying device 4B second substrate conveying device 5A first component feed section 5B second component feed section 6A first head unit 6B second head unit 7A first component recognition camera 7B second component recognition camera 10 fixed conveyor 10a, 11a Conveyor main body 11 movable conveyor 12 Belt feed device 13 C-axis servo motor 14 raised frame 15 fixed rail 16 Support element 17 Y-axis servo motor 18 X-axis servo motor 20A first mounting head 20B second mounting head 22 Z-axis servo motor 24 R-axis servo motor 26A first substrate detection camera 26B second substrate detection camera 30 support 32 Projection device 33 movies 34 resin film 34a Lighting section 34b Optical system 40 Control or regulation unit 41 buses 42 Main control or main regulation section 44 Storage section 46 Engine control section or engine regulation section 48 Image processing section 50 External input / output section L1 first lane L2 second lane M1 first mark M2 second mark M3 third mark M4 fourth mark M5 fifth mark P substrate UA first assembly unit UB second assembly unit

Claims

[1] A system comprising a movement error detection device of a mounting head and a component mounting device (1) equipped with a substrate conveying device (4A) comprising a fixed conveyor (10) extending in a first direction and a movable conveyor (11) movable in a second direction orthogonal to the first direction with respect to the fixed conveyor (10), and equipped with a mounting head (20A) that mounts a component on a substrate (P) conveyed by the substrate conveying device (4A) to a predetermined working position (Wp), the movement error detection device of a mounting head comprising: a mark (M5) within a movable region comprising a projected image or a reflected image formed in a movable region of the movable conveyor (11); a pair of outside-the-movable-region markers (M1, M3) respectively provided on both sides of the inside-the-movable-region marker (M5) in the second direction and disposed outside the moving region of the moving conveyor (11) and outside the substrate (P) at the working position (Wp); an imaging device (26A) moving together with the mounting head (20A); a control device (42) that selects two marks that are positioned on both outer sides of the substrate (P) in the second direction and are closest to the substrate (P) from the mark (M5) within the movable region and the pair of marks (M1, M3) outside the movable region, and causes the imaging device (26A) to image the marks; and a calculation device (42) that obtains a movement error of the mounting head (20A) based on two mark images taken by the imaging device (26A). [2] System according to claim 1, wherein the marking within the movable region comprises a plurality of markings (M5, M6, M7) within the movable region which are aligned in the second direction, and the pair of marks (M1, M3) outside the movable region are provided on both sides of the plurality of marks (M5, M6, M7) inside the movable region in the second direction. [3] System according to claim 1 or 2, comprising: a first mounting unit (UA) comprising the substrate conveying device (4A), the mounting head (20A) and the imaging device (26A), and a second mounting unit (UB) comprising another substrate conveying device (4B), another mounting head (20B) and another imaging device (26B), and in which a movable conveyor (11) of the other substrate conveying device (4B) and a movable conveyor (11) of the substrate conveying device (4A) of the first mounting unit (UA) are mounted so as to be adjacent to each other in the second direction, wherein the pair of markers (M1, M3) are provided outside the movable region outside fixed conveyors (10) of the first assembly unit (UA) and the second assembly unit (UB), and the marking (M5) is applied within the movable region in movable regions of the movable conveyors (11) of the first assembly unit (UA) and the second assembly unit (UB), and wherein, if the mounting head (20A) and the imaging device (26A) of the first mounting unit (UA) are defined as a first mounting head (20A) and a first imaging device (26A), and the mounting head (20B) and the imaging device (26B) of the second mounting unit (UB) are defined as a second mounting head (20B) and a second imaging device (26B), a working position (WpA) of a substrate (P) in the first assembly unit (UA) is defined as a first working position, and a working position (WpB) of a substrate (P) in the second assembly unit (UB) is defined as a second working position, and of the pair of marks (M1, M3) outside the movable region, a mark (M1) outside the movable region on one side of the first mounting unit (UA) is defined as a first mark outside the movable region, and a mark (M3) outside the movable region on one side of the second mounting unit (UB) is defined as a second mark outside the movable region, the control or regulating device (42) carries out at least one of the following imaging operations: a first imaging operation of selecting two marks (M1 to M5) positioned on both outer sides of a substrate (P) mounted at the first working position (WpA) and closest to the substrate (P), and including at least the first mark (M1) outside the movable region, and causing the first imaging device (26A) to image the marks (M1 to M5) that are selected; a second imaging operation of selecting two marks (M1 to M5) positioned on both outer sides of a substrate (P) mounted at the second work position (WpB) and closest to the substrate (P), and including at least the second mark (M3) outside the movable region, and causing the second imaging device (26B) to image the marks (M1 to M5) that are selected; a third imaging operation of selecting two marks (M1 to M5) positioned on both outer sides of a substrate (P) mounted at the second working position (WpB) and closest to the substrate (P), and including at least the second mark (M3) outside the movable region, and causing the first imaging device (26A) to image the marks (M1 to M5) that are selected; and a fourth imaging operation of selecting two marks (M1 to M5) positioned on both outer sides of a substrate (P) mounted at the first working position (WpA) and closest to the substrate (P), and including at least the first mark (M1) outside the movable region, and causing the second imaging device (26B) to image the marks (M1 to M5) that are selected, and the calculation device (42) obtains a movement error of at least one of the first mounting head (20A) and the second mounting head (20B) based on a marker image acquired in the imaging operation performed by the control device (42). [4] System according to claim 3, wherein the component mounting device (1) performs a parallel mounting operation of mounting a component on a substrate (P) mounted at the first working position (WpA) only by means of the first mounting head (20A) and of mounting a component on a substrate (P) mounted at the second working position (WpB) only by means of the second mounting head (20B), the control device (42) carries out the first imaging operation and the second imaging operation, and the calculation device (42) obtains a movement error of the first mounting head (20A) based on a mark image taken in the first imaging operation, and obtains a movement error of the second mounting head (20B) based on a mark image taken in the second imaging operation. [5] System according to claim 3, wherein the component mounting device (1) performs a one-side entry mounting operation of mounting a component on the substrate (P) by means of both the first mounting head (20A) and the second mounting head (20B) while sequentially carrying a substrate (P) to one of the first working position (WpA) and the second working position (WpB), when the substrate (P) is only carried to the first working position (WpA) in the single-side entry mounting operation, the control device (42) carries out the first imaging operation and the fourth imaging operation, while when the substrate (P) is only carried to the second working position (WpB), the control device (42) carries out the second imaging operation and the third imaging operation, and when the substrate (P) is only carried into the first work position (WpA), the calculation device (42) obtains a movement error of the first mounting head (20A) based on a mark image taken in the first imaging operation, and a movement error of the second mounting head (20B) based on a mark image taken in the fourth imaging operation, and when the substrate (P) is only carried into the second work position (WpB), the calculation device (42) obtains a movement error of the second mounting head (20B) based on a mark image taken in the second imaging operation, and a movement error of the first mounting head (20A) based on a mark image taken in the third imaging operation. [6] System according to claim 3, wherein the component mounting device (1) performs a bidirectional entry mounting operation of mounting a component on the substrate (P) by means of both the first mounting head (20A) and the second mounting head (20B) while selectively carrying a substrate (P) to any one of the first working position (WpA) and the second working position (WpB), the control device (42) carries out the first imaging operation to the fourth imaging operation, and the calculating device (42) obtains a movement error of the first mounting head (20A) based on each mark image acquired in the first imaging operation and the third imaging operation, and obtains a movement error of the second mounting head (20B) based on each mark image acquired in the second imaging operation and the fourth imaging operation. [7] The system according to any one of claims 1 to 6, wherein the control device (42) performs the imaging operation before substrates (P) are mounted at the first working position (WpA) and the second working position (WpB).

Images