Method and device for controlling copper embedding quality of printed circuit board, computer equipment and storage medium

Abstract

The invention relates to the technical field of printed circuit board copper embedding, and discloses a method and device for controlling the copper embedding quality of a printed circuit board, computer equipment and a storage medium. The method comprises the following steps: acquiring a projection image of a copper nail grabbed by a mechanical arm and a hole site on a printed circuit board; converting the projection image into a three-dimensional image; extracting information in the three-dimensional image to obtain the diameter of the copper nail and the diameter of the hole site; calculating a difference value between the diameter of the copper nail and the diameter of the hole site to obtain an interference value; judging whether the interference value exceeds a preset threshold value or not; and if the interference value does not exceed the preset threshold value, controlling the mechanical arm to embed the copper nail into the hole site of the printed circuit board so as to complete the copper embedding operation. According to the method, high-precision quantitative detection of the diameter of the copper nail and the diameter of the hole site is achieved, the difference value of the two diameters is calculated in real time, whether the interference magnitude of copper embedding operation is within the design range or not can be accurately judged, the copper embedding yield is increased, and the rework and scrap cost caused by copper embedding defects is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of copper embedding of printed circuit boards, and more particularly to a method, device, computer equipment and storage medium for controlling the quality of copper embedding of printed circuit boards. Background Art

[0002] With the rapid development of fast-charging technology for new energy vehicles, power electronics systems are placing higher demands on the power density and heat dissipation performance of onboard printed circuit boards (PCBs). As the core carrier of power electronics systems, automotive PCBs must operate stably in high-current, high-voltage environments. Their heat dissipation efficiency directly impacts system reliability and service life. However, traditional PCB materials and structural designs are no longer able to meet the thermal management requirements of high-power density conditions, significantly increasing the risk of performance degradation and even failure due to localized overheating.

[0003] To address this technical challenge, the industry has widely adopted an innovative structural design that embeds copper blocks within the PCB. This solution leverages the high thermal conductivity of metal inserts (such as copper nails and copper blocks) to quickly transfer heat to the heat dissipation layer or external heat sink through physical contact, significantly improving the PCB's heat dissipation capabilities. However, the quality of the copper embedding process directly determines the effectiveness of thermal management and product reliability.

[0004] Currently, the PCB copper embedding process mainly relies on a copper embedding machine to press copper nails into the pre-set PCB holes. Its quality control methods have the following limitations:

[0005] Existing technical solutions only test the basic geometric parameters of the copper nail itself (such as diameter and length), lacking a systematic assessment of the fit accuracy between the copper nail and the hole in the board. The interference fit (i.e., the dimensional difference) between the copper nail and the hole is a key parameter affecting the quality of copper inlay. If the interference fit is insufficient, the copper nail can easily loosen due to vibration or thermal stress, resulting in increased contact resistance and reduced heat dissipation efficiency. If the interference fit is too large, it can cause stress concentration on the PCB surface, resulting in microcracks or even structural damage, ultimately leading to product failure.

[0006] To address the above issues, there is an urgent need to develop a copper embedding process quality control method that can accurately control the interference between copper nails and holes to ensure that the interference of the copper embedding operation is within the design range, thereby improving the heat dissipation performance and structural reliability of the PCB, and meeting the technical requirements of new energy vehicle power electronic systems for high power density and long life. Summary of the Invention

[0007] The object of the present invention is to overcome the deficiencies of the prior art and to provide a method, device, equipment and medium for controlling the quality of copper embedded in a printed circuit board.

[0008] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0009] In a first aspect, a method for controlling the quality of copper embedded in a printed circuit board is provided, comprising:

[0010] Obtain projection images of the copper nails and holes on the printed circuit board grasped by the robotic arm;

[0011] converting the projected image into a three-dimensional image;

[0012] Extract information from the 3D image to obtain the diameter of the copper nail and the hole;

[0013] Calculate the difference between the diameter of the copper nail and the diameter of the hole to get the interference value;

[0014] Determine whether the interference value exceeds a preset threshold;

[0015] If the interference value does not exceed the preset threshold, the robot arm is controlled to embed the copper nail into the hole of the printed circuit board to complete the copper embedding operation.

[0016] In a second aspect, a device for controlling the quality of copper embedded in a printed circuit board is provided, comprising:

[0017] An acquisition unit, used to acquire projection images of the copper nails grasped by the robotic arm and the holes on the printed circuit board;

[0018] a conversion unit, configured to convert the projected image into a three-dimensional image;

[0019] An extraction unit, used to extract information from the three-dimensional image to obtain the diameter of the copper nail and the diameter of the hole;

[0020] A calculation unit, used for calculating the difference between the diameter of the copper nail and the diameter of the hole to obtain an interference value;

[0021] A judgment unit, used to judge whether the interference value exceeds a preset threshold;

[0022] The embedding unit is used to control the robotic arm to embed the copper nail into the hole of the printed circuit board if the interference value does not exceed the preset threshold value to complete the copper embedding operation.

[0023] In a third aspect, the present invention provides a computer device, comprising a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the above method when executing the computer program.

[0024] In a fourth aspect, the present invention provides a storage medium storing a computer program, wherein the computer program implements the above method when executed by a processor.

[0025] The beneficial effects of the present invention compared with the prior art are: by introducing three-dimensional image analysis and dynamic control technology of interference, high-precision quantitative detection of copper nail diameter and hole diameter is achieved, and the difference between the two (interference value) is calculated in real time. Compared with the traditional process that only relies on appearance and size detection, it can accurately judge whether the interference of the copper embedding operation is within the design range, avoiding the problems of loose copper nails or increased contact resistance due to insufficient interference, and the risk of stress damage to the board surface or structural microcracks caused by excessive interference. Through quality prediction and dynamic adjustment before copper embedding, the copper embedding yield is improved, and the rework and scrap costs caused by copper embedding defects are significantly reduced.

[0026] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 A schematic flow chart of a method for controlling the quality of copper embedded in a printed circuit board provided by an embodiment of the present invention;

[0029] Figure 2 A schematic block diagram of an apparatus for controlling the quality of copper embedded in a printed circuit board provided by an embodiment of the present invention;

[0030] Figure 3 Schematic diagram of the structure of a computer device in an embodiment of the present invention. DETAILED DESCRIPTION

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0032] It will be understood that when used in this specification and the appended claims, the terms “comprises” and “comprising” indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0033] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the present invention. As used in the specification and appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

[0034] It should be further understood that the term "and / or" used in the present description and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0035] See also Figure 1 In the specific embodiment shown, the present invention discloses a method for controlling the quality of copper embedded in a printed circuit board, comprising the following steps:

[0036] S110, obtaining projection images of the copper nails grasped by the robotic arm and the holes on the printed circuit board;

[0037] Specifically, a high-resolution industrial camera (such as an area array camera or line scan camera) is mounted at the end of a robotic arm or on a workbench. Combined with a coaxial or ring-shaped light source, this ensures that the copper nails and holes appear clearly outlined and have high contrast in the projected image. After the robotic arm grasps the copper nail, it moves to a preset position above the printed circuit board, where the camera is triggered to capture the image. Multi-angle photography (such as rotating the copper nail or PCB) or structured light projection technology is used to capture multiple frames of projection images containing depth information to create the projected image.

[0038] In other words, the projected image provides the foundational data for subsequent 3D reconstruction, ensuring that the geometric features of the copper nails and holes (such as diameter and position) are fully captured. Furthermore, the coaxial light source design reduces reflections and shadows, improving image quality stability in complex environments (such as high-brightness workshops).

[0039] In one embodiment, obtaining projection images of the copper nails grasped by the robotic arm and the holes on the printed circuit board includes:

[0040] Fix the printed circuit board to be inlaid with copper on the carrier of the copper inlay machine, and use the robotic arm to grab a copper nail from the copper nail hopper;

[0041] Specifically, vacuum suction or mechanical clamps are used to secure the PCB to the copper inlay machine's stage, ensuring it doesn't shift during the process. A flexible gripper (such as a pneumatic gripper or vacuum suction cup) is installed at the end of the robotic arm. It grabs a copper nail from the hopper and uses a visual guidance system (such as a 2D camera) to ensure the nail's correct orientation (e.g., its axis is perpendicular to the stage).

[0042] In other words, the coordinated operation of the carrier fixation and the robotic arm grasping ensures that the initial relative position error between the copper nail and the hole is less than ±0.02mm, providing a basic guarantee for subsequent 3D reconstruction and copper inlay quality. In addition, the rapid grasping of the robotic arm and the carrier fixation enable continuous production of the copper inlay process, which can shorten the copper inlay cycle.

[0043] Conduct surface defect inspection and size inspection on copper nails;

[0044] Specifically, a high-resolution industrial camera (such as a 5-megapixel area array camera) is combined with a ring light source to capture images of the copper nail surface. Surface defects (such as burrs, oxidation, and cracks) are then identified through deep learning algorithms (such as convolutional neural networks (CNNs)), with a high degree of defect detection accuracy. In addition, a laser rangefinder or machine vision system is used to measure key dimensions such as the diameter and length of the copper nail, with a measurement accuracy of ±0.005mm. The measurement results are compared with the preset tolerance range (such as diameter ±0.01mm). If the tolerance is exceeded, the robotic arm is controlled to remove the copper nail and automatically grab the next one.

[0045] This means defective copper nails can be removed before copper is embedded, preventing poor copper embedding or PCB scrapping due to nail quality issues. Furthermore, dimension and defect detection data can be stored in a database, supporting quality traceability and process optimization throughout the production process.

[0046] If both the surface defect detection and the size detection are passed, the copper nail is moved to the top of the preset hole position on the printed circuit board;

[0047] Specifically, based on the hole coordinates in the 3D PCB model, the robotic arm generates a motion trajectory (e.g., linear or circular interpolation) from the gripping point to the hole above. Using force sensors or visual feedback at the end of the robotic arm, the axial direction of the copper nail is aligned with the hole centerline in real time to ensure copper embedding accuracy.

[0048] Start the X-ray emitter built into the copper-embedded machine platform and use a microfocus X-ray tube to emit an X-ray beam. Then, a flat-panel detector receives the transmission signal of the X-ray beam after it penetrates the copper nails and holes, and generates a projection image.

[0049] Specifically, a microfocus X-ray tube (focal spot size ≤ 5μm) is used to emit a high-resolution X-ray beam, which penetrates copper nails and PCB holes. The X-ray dose and imaging contrast are optimized by adjusting the voltage and current (e.g., 50kV, 0.5mA). Furthermore, a CMOS or amorphous silicon flat-panel detector receives the X-ray signal after penetration and converts it into a digital image (resolution ≥ 1024×1024). Image enhancement algorithms (such as histogram equalization) are then used to enhance the clarity of the projected image to generate the projection image.

[0050] X-ray imaging technology can capture the internal structural information of copper nails and holes without physical contact, avoiding potential damage to the PCB caused by traditional inspection methods. Furthermore, the projected images provide high signal-to-noise ratio data for subsequent 3D reconstruction, reducing the diameter measurement error of copper nails and holes to ±0.003mm.

[0051] In addition, an integrated rotating stage or multi-axis motion platform allows the PCB to rotate around its axis to capture multi-angle projection images. Each rotation of the rotating stage captures a projection image, achieving 360° coverage. In other words, these projection images are captured at different angles and combined to form a projected image.

[0052] S120, converting the projected image into a three-dimensional image;

[0053] Specifically, 3D reconstruction techniques based on stereo vision or structured light are used to match feature points and calculate depth on the projected image. The reconstructed point cloud data is then optimized through filtering (such as voxel grid filtering) and denoising (such as statistical outlier removal) to generate a high-precision 3D model, or 3D image.

[0054] In other words, the 3D image accurately reproduces the actual size and spatial position of the copper nails and holes, with an error within ±0.01mm, meeting the micron-level precision required for copper inlay processes. Furthermore, the algorithm can adapt to the surface reflectivity characteristics of different materials (such as copper and FR-4), making it compatible with various PCB designs (such as multi-layer boards and special-shaped holes).

[0055] In one embodiment, converting the projected image into a three-dimensional image includes:

[0056] Performing dark field correction and gain correction on the projected image to obtain a corrected image;

[0057] Specifically, with the X-ray emitter turned off, a dark field image (Dark Field Image) without X-ray signals is collected to record the detector's inherent noise and dark current distribution. The dark field image is subtracted pixel by pixel from the original projection image to eliminate detector background noise.

[0058] Use a reference object of uniform thickness (e.g., an aluminum plate) to capture a gain-corrected image (Flat Field Image) to determine the uniformity of the detector's response across all pixels. Divide the dark-field-corrected image by the gain-corrected image to correct for grayscale deviations caused by non-uniform detector response.

[0059] In other words, dark field and gain correction significantly reduce detector noise and response non-uniformity, improving the signal-to-noise ratio (SNR) of the projected image by over 30%, providing high-quality data for subsequent 3D reconstruction. It also effectively eliminates ring and streak artifacts caused by detector defects, improving the geometric accuracy of 3D reconstruction.

[0060] Using a filtering algorithm on the corrected image to enhance edge information in the image to obtain a preprocessed image;

[0061] Specifically, a Laplacian of Gaussian (LoG) filter or the Canny edge detection algorithm is used to extract edge features of the copper nails and holes in the corrected image. Adaptive thresholding is then used to enhance edge contrast while suppressing noise in non-edge areas. Histogram equalization and gamma correction are then combined to optimize overall image contrast, making edge features more distinguishable in the grayscale histogram. The resulting preprocessed image is then obtained.

[0062] In other words, edge enhancement filtering makes the outlines of the copper nails and holes clearer in the projected image, achieving an edge positioning accuracy of ±0.005mm, providing precise geometric constraints for 3D reconstruction. Furthermore, the nonlinear enhancement algorithm enhances contrast while preserving low-frequency information in the image, avoiding edge information loss caused by excessive filtering.

[0063] The preprocessed image is processed using a filtered back-projection algorithm to obtain three-dimensional volume data;

[0064] Specifically, the preprocessed image is filtered in the frequency domain (e.g., using a Ram-Lak filter) to enhance high-frequency components and compensate for truncation effects in the projection data. The filtered projection image is then back-projected at different angles (e.g., 0-180 degrees, with intervals of 1 degree) to generate 3D volume data through weighted superposition. The initial FBP results are then iteratively optimized using algebraic reconstruction techniques (ART) or simultaneous iterative reconstruction techniques (SIRT) to further enhance the spatial resolution of the 3D data.

[0065] In other words, the filtered back projection algorithm combined with iterative optimization can achieve a spatial resolution of 0.02mm for 3D volume data. 3 The diameter measurement error of the copper nail and hole is reduced to ±0.003mm. Furthermore, the FBP algorithm has the advantage of real-time performance, with a single 3D reconstruction taking less than 0.5 seconds, meeting the online inspection requirements of the copper inlay process.

[0066] Use volume rendering technology to convert 3D volume data into visual 3D images.

[0067] Specifically, a ray casting algorithm is used to project light from a virtual viewpoint through the 3D volume data, generating a 3D image through sampling and synthesis. Combined with a transfer function design, the grayscale values ​​of the volume data are mapped to color and transparency, highlighting the structural features of the copper nails and holes.

[0068] In other words, 3D visualization makes copper inlay quality defects (such as copper nail tilt and hole offset) clear at a glance, allowing operators to quickly determine the feasibility of the copper inlay process. Through interactive visualization, operators can analyze the interference distribution in 3D data and reversely optimize copper nail processing tolerances or copper inlay process parameters to improve production yield.

[0069] S130, extracting information from the three-dimensional image to obtain the diameter of the copper nail and the diameter of the hole;

[0070] Specifically, the Canny edge detection algorithm is used to extract the outlines of the copper nail and hole. The least squares method is then used to fit the circular outlines and calculate the diameter parameters. The diameters of different cross sections in the 3D model are then sampled and averaged to eliminate local measurement errors, ultimately determining the copper nail and hole diameters.

[0071] In other words, 3D measurement avoids the perspective distortion seen in 2D projection, improving diameter measurement accuracy by over 50% compared to traditional methods. Furthermore, it can simultaneously detect surface defects (such as burrs and oxidation) on copper nails or the roughness of the inner wall of the hole, providing a more comprehensive assessment of copper inlay quality.

[0072] In one embodiment, extracting information from the three-dimensional image to obtain the diameter of the copper nail and the diameter of the hole includes:

[0073] Segment the three-dimensional image to obtain the copper nail area and the hole area;

[0074] Specifically, the grayscale distribution of the 3D volume data is analyzed to determine the grayscale threshold range for the copper nails and holes. A global thresholding method (such as the Otsu algorithm) or an adaptive thresholding method (such as the local mean method) is used to perform binary segmentation on the 3D image, separating the copper nail area from the hole area. A seed point (such as the center of the copper nail or the edge of the hole) is selected in the 3D image, and the region is expanded by grayscale similarity and spatial proximity until the entire target area is covered. Morphological operations (such as opening and closing operations) are then combined to optimize the segmentation results, eliminating isolated noise or filling small holes.

[0075] In other words, 3D segmentation technology accurately extracts copper nails and holes from a complex background, with a regional boundary positioning error of less than ±0.01mm, providing clean target data for subsequent diameter measurement. Segmentation methods based on grayscale and spatial information can effectively address interference factors such as multi-layer PCB structures and copper nail surface oxidation, improving segmentation robustness.

[0076] The copper nail area and the hole area are processed using an edge detection algorithm to obtain the copper nail edge contour and the hole edge contour;

[0077] Specifically, within the 3D segmented region, edges are extracted by calculating the grayscale gradient amplitude and direction, combining non-maximum suppression (NMS) with hysteresis thresholding. Surface fitting (such as quadratic surface fitting) is then performed on the segmented region, and edge contours are extracted through fitting error analysis. This is combined with normal vector calculation to remove noise or outliers from edge points, improving edge quality.

[0078] In other words, the edge contours of the copper nails and holes generated by the three-dimensional edge detection algorithm are continuous and smooth, avoiding the edge breakage problem in traditional two-dimensional methods.

[0079] The edge contours of the copper nail and the hole are fitted to obtain the copper nail diameter and the hole diameter.

[0080] Specifically, the edge contour point cloud of the copper nail and hole is projected onto a cross-section perpendicular to the axial direction, and the circular contour is fitted using the least squares method. The fitting accuracy is improved through iterative optimization (such as the Levenberg-Marquardt algorithm), and the fitting error (such as the root mean square error (RMSE)) is calculated to evaluate the fitting quality. Cross-sectional profiles are extracted at different heights between the copper nail and the hole (e.g., every 0.1 mm), and the diameters are fitted and averaged to eliminate the influence of local deformation or measurement errors.

[0081] In other words, through multi-section fitting and statistical optimization, the diameter measurement error of copper nails and holes is reduced to ±0.003mm, meeting the micron-level precision requirements of the copper inlay process. The fitting algorithm can adapt to different shapes of copper nails (such as cylindrical and conical) and holes (such as circular and irregular shapes), and has strong compatibility.

[0082] S140, calculating the difference between the diameter of the copper nail and the diameter of the hole to obtain an interference value;

[0083] Specifically, substitute the copper nail diameter (D1) and the hole diameter (D2) into the formula: Interference value (ΔD) = D1 - D2. Based on the PCB material (e.g., rigid board, flexible board) and the copper embedding process requirements, a preset interference threshold range (e.g., 0.05mm ≤ ΔD ≤ 0.15mm) is established.

[0084] In other words, accurate calculation of interference values ​​provides a quantifiable control indicator for copper inlay quality, eliminating the subjective "rule of thumb" approach used in traditional processes. Furthermore, by statistically analyzing the distribution of interference values ​​across batches of products, it is possible to optimize copper nail processing tolerances or hole design, reducing manufacturing costs.

[0085] In one embodiment, calculating the difference between the diameter of the copper nail and the diameter of the hole to obtain the interference value includes:

[0086] The interference value is defined as the difference between the diameter of the copper nail and the diameter of the hole, that is, the diameter of the copper nail minus the diameter of the hole.

[0087] Specifically, direct calculation of the interference value provides a quantitative indicator for the copper inlay process, clarifying the fit between the copper nail and the hole (such as interference, transition, or clearance fit). By analyzing the correlation between the interference value and the copper inlay resistance and bonding strength, the copper nail processing tolerance (such as narrowing the diameter tolerance from ±0.01mm to ±0.005mm) or the hole design size can be reversely optimized to improve the stability of copper inlay quality. In addition, the real-time calculation results of the interference value can be embedded in the closed-loop control system of the copper inlay machine to achieve dynamic adjustment of the copper inlay process (such as adjusting the copper inlay pressure or speed), avoiding efficiency losses caused by manual intervention. In addition, combined with the axial position information in the three-dimensional image, the interference value distribution of cross-sections at different heights can be calculated to identify defects such as insufficient or excessive interference. For example, in the conical structure of the copper nail, the copper inlay depth can be optimized through axial interference curve analysis to avoid poor contact caused by insufficient interference at the end. In addition, by comparing the current interference value with historical batch data and combining it with statistical process control (SPC) methods, process drift or equipment aging problems can be identified. Machine learning models (such as time series prediction) can provide early warning of abnormal interference values, supporting preventive maintenance and process optimization.

[0088] S150, determining whether the interference value exceeds a preset threshold;

[0089] Specifically, the calculated interference value is logically compared with a preset threshold range. If the ΔD exceeds the preset threshold, an alarm is triggered or automatic adjustment is made. If the interference is insufficient, the system can prompt the user to replace the copper nail with a larger diameter; if the interference is too large, the robot arm's copper embedding force is adjusted or the hole position is selected to adapt.

[0090] This means identifying potential defects before copper inlaying, preventing loosening of copper nails or stress damage to the board surface caused by uncontrolled interference, and reducing the copper inlay defect rate. Furthermore, automated judgment and dynamic adjustment can shorten the copper inlay cycle while reducing manual intervention and quality fluctuations.

[0091] In one embodiment, determining whether the interference value exceeds a preset threshold includes:

[0092] Determine the preset threshold of interference between the copper nail and the hole according to product design requirements;

[0093] Specifically, the interference fit range is determined through simulation or experimentation, taking into account the mechanical properties of the copper nail and the hole material (such as elastic modulus and yield strength), the bonding strength requirements after copper embedding (such as pull-off force ≥ 50N), and long-term reliability requirements (such as stability under thermal cycling and vibration environments). The achievable interference fit threshold is set by considering the copper nail machining tolerance (such as diameter ±0.005mm), the hole forming accuracy (such as drilling / milling accuracy ±0.01mm), and the positioning error of the copper embedding equipment (such as ±0.02mm).

[0094] In other words, the preset thresholds comprehensively consider product design requirements and process capabilities, avoiding yield loss due to overly strict thresholds or insufficient bonding strength due to overly loose thresholds. Furthermore, threshold settings are based on industry or corporate standards, ensuring traceability and reproducibility of the copper inlay process and supporting consistent quality control across factories and batches.

[0095] The calculated interference value is compared with a preset threshold to determine whether the interference value exceeds the preset threshold.

[0096] Specifically, in the copper inlay machine control system or host computer software, conditional statements are used to compare the interference value with a threshold in real time. The comparison results trigger different processing flows: if the interference value is within the threshold, it is considered acceptable; if it is outside the range, it is considered unacceptable and an alarm or sorting mechanism is activated.

[0097] In other words, the real-time comparison of the interference value with the threshold value realizes the online detection and closed-loop control of the copper embedding process, avoiding subsequent quality problems (such as poor contact and thermal stress cracking) caused by insufficient or excessive interference.

[0098] S160: If the interference value does not exceed the preset threshold, the robot arm is controlled to embed the copper nail into the hole of the printed circuit board to complete the copper embedding operation.

[0099] Specifically, the robot arm generates a copper embedding trajectory (e.g., spiral pressing or vertical insertion) based on the relative positions of the copper nails and holes in the 3D model. Using force sensors or servo motor torque feedback, the embedding force is adjusted in real time to ensure a tight fit between the copper nails and holes without damaging the PCB.

[0100] In other words, the robotic arm's precise motion control and force control technology ensures consistent copper embedding depth and angle, reducing contact resistance fluctuations to within ±5%. Furthermore, the interference fit copper embedding operation significantly improves heat transfer efficiency between the copper pin and the hole, reducing localized PCB temperature rise by 20% and extending the service life of the power electronics system.

[0101] In one embodiment, after determining whether the interference value exceeds a preset threshold, the method further includes:

[0102] S170: If the interference value exceeds the preset threshold, the robot arm is controlled to move the copper nail out and automatically grab the next copper nail, and the process returns to S110.

[0103] Specifically, the robotic arm uses the end effector to remove the current copper nail from the copper inlay station according to a preset path and place it in a defective product collection area (such as a waste box or sorting trough). The robotic arm then automatically moves to the copper nail feeding device (such as a vibrating plate or silo), grabs the next copper nail through visual positioning or sensor feedback (such as force sensor detection of grasping in place), and returns to the copper inlay station to prepare for the next copper inlay operation.

[0104] In other words, the robotic arm's automated removal and grasping action reduces the isolation time for unqualified copper nails to less than 0.5 seconds, preventing unqualified products from entering subsequent processes and reducing rework costs. Furthermore, by seamlessly grasping the next copper nail, the continuity of the copper embedding process is ensured, improving the production efficiency of a single device.

[0105] By introducing three-dimensional image analysis and dynamic interference control technology, this invention achieves high-precision quantitative detection of the copper nail diameter and the hole diameter, and calculates the difference between the two (interference value) in real time. Compared with traditional processes that rely solely on appearance and dimensional inspection, it can accurately determine whether the interference of the copper embedding operation is within the design range. This avoids the problems of loose copper nails or increased contact resistance caused by insufficient interference, and the risk of board surface stress damage or structural microcracks caused by excessive interference. Through quality prediction and dynamic adjustment before copper embedding, the copper embedding yield is improved, and the rework and scrap costs caused by copper embedding defects are significantly reduced. In addition, by precisely controlling the interference, a reliable physical contact and heat conduction path are ensured between the copper nail and the hole, effectively reducing the contact thermal resistance of the copper embedding area and improving the local heat dissipation capacity of the PCB.

[0106] Figure 2 FIG. 3 is a schematic block diagram of an apparatus 300 for controlling the quality of copper embedded in a printed circuit board provided by an embodiment of the present invention. Figure 2 As shown, corresponding to the above method for controlling the quality of copper embedded in printed circuit boards, the present invention further provides a device 300 for controlling the quality of copper embedded in printed circuit boards. The device 300 for controlling the quality of copper embedded in printed circuit boards includes a unit for executing the above method for controlling the quality of copper embedded in printed circuit boards, and the device can be configured in a server. Specifically, please refer to Figure 2 The device 300 for controlling the quality of copper embedded in a printed circuit board comprises:

[0107] An acquisition unit 301 is used to acquire projection images of the copper nails and holes on the printed circuit board grasped by the robotic arm;

[0108] A conversion unit 302, configured to convert the projected image into a three-dimensional image;

[0109] The extraction unit 303 is used to extract information from the three-dimensional image to obtain the diameter of the copper nail and the diameter of the hole;

[0110] The calculation unit 304 is used to calculate the difference between the diameter of the copper nail and the diameter of the hole to obtain the interference value;

[0111] The judging unit 305 is used to judge whether the interference value exceeds a preset threshold;

[0112] The embedding unit 306 is used to control the robot arm to embed the copper nail into the hole of the printed circuit board to complete the copper embedding operation if the interference value does not exceed the preset threshold.

[0113] In one embodiment, the acquiring unit 301 includes:

[0114] The fixed grabbing module is used to fix the printed circuit board to be copper-inlaid on the carrier of the copper-inlaid machine and use the robotic arm to grab a copper nail from the copper nail hopper;

[0115] Inspection module, used for surface defect detection and size detection of copper nails;

[0116] A moving module is used to move the copper nail to the top of the preset hole position on the printed circuit board if both the surface defect detection and the size detection are passed;

[0117] The transmitting and receiving generation module is used to start the X-ray transmitter built into the copper-embedded machine platform and use the microfocus X-ray tube to emit the X-ray beam. The flat-panel detector then receives the X-ray beam transmission signal after penetrating the copper nails and holes and generates a projection image.

[0118] In one embodiment, the conversion unit 302 includes:

[0119] A correction module, used for performing dark field correction and gain correction on the projected image to obtain a corrected image;

[0120] An enhancement module, configured to enhance edge information in the corrected image using a filtering algorithm to obtain a preprocessed image;

[0121] A back-projection processing module is used to process the pre-processed image using a filtered back-projection algorithm to obtain three-dimensional volume data;

[0122] The conversion module is used to convert the three-dimensional volume data into a visual three-dimensional image using volume rendering technology.

[0123] In one embodiment, the extraction unit 303 includes:

[0124] A segmentation module is used to segment the three-dimensional image to obtain the copper nail area and the hole area;

[0125] A detection processing module is used to process the copper nail area and the hole area using an edge detection algorithm to obtain the copper nail edge contour and the hole edge contour;

[0126] The fitting processing module is used to perform fitting processing on the edge contour of the copper nail and the edge contour of the hole to obtain the copper nail diameter and the hole diameter.

[0127] In one embodiment, the calculation unit 304 includes:

[0128] The interference value is defined as the difference between the diameter of the copper nail and the diameter of the hole, that is, the diameter of the copper nail minus the diameter of the hole.

[0129] In one embodiment, the determining unit 305 includes:

[0130] A determination module is used to determine a preset threshold value of interference between the copper nail and the hole according to product design requirements;

[0131] The comparison module is used to compare the calculated interference value with a preset threshold value to determine whether the interference value exceeds the preset threshold value.

[0132] In one embodiment, the apparatus further comprises:

[0133] The moving-out grabbing unit 307 is used to control the robotic arm to move the copper nail out and automatically grab the next copper nail if the interference value exceeds a preset threshold.

[0134] It should be noted that those skilled in the art can clearly understand that the specific implementation process of the above-mentioned device 300 for controlling the quality of copper embedded in a printed circuit board and each unit can refer to the corresponding description in the aforementioned method embodiment. For the convenience and brevity of description, they will not be repeated here.

[0135] The above-mentioned device 300 for controlling the quality of copper embedded in a printed circuit board can be implemented in the form of a computer program. The computer program can be used in a computer system such as Figure 3 Runs on the computer device shown.

[0136] See also Figure 3 , Figure 3 1 is a schematic block diagram of a computer device provided in an embodiment of the present application. The computer device 500 may be a server, wherein the server may be an independent server or a server cluster composed of multiple servers.

[0137] See Figure 3The computer device 500 includes a processor 502 , a memory, and a network interface 505 connected via a system bus 501 , wherein the memory may include a non-volatile storage medium 503 and an internal memory 504 .

[0138] The non-volatile storage medium 503 can store an operating system 5031 and a computer program 5032. The computer program 5032 includes program instructions, which, when executed, can enable the processor 502 to perform a method for dynamic short message shielding.

[0139] The processor 502 is used to provide computing and control capabilities to support the operation of the entire computer device 500.

[0140] The internal memory 504 provides an environment for the operation of the computer program 5032 in the non-volatile storage medium 503. When the computer program 5032 is executed by the processor 502, the processor 502 can execute a method for dynamic short message shielding.

[0141] The network interface 505 is used to communicate with other devices through the network. Figure 3 The structure shown in the figure is merely a block diagram of a portion of the structure related to the solution of the present application, and does not constitute a limitation on the computer device 500 to which the solution of the present application is applied. The specific computer device 500 may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0142] The processor 502 is configured to execute a computer program 5032 stored in the memory to implement the following steps:

[0143] Obtain projection images of the copper nail grasped by the robotic arm and the hole on the printed circuit board; convert the projection image into a three-dimensional image; extract information from the three-dimensional image to obtain the diameter of the copper nail and the hole diameter; calculate the difference between the diameter of the copper nail and the hole diameter to obtain an interference value; determine whether the interference value exceeds a preset threshold; if the interference value does not exceed the preset threshold, control the robotic arm to embed the copper nail into the hole of the printed circuit board to complete the copper embedding operation.

[0144] It should be understood that in the embodiment of the present application, the processor 502 may be a central processing unit (CPU), and the processor 502 may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among them, the general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0145] Those skilled in the art will appreciate that all or part of the steps in the method of the above-described embodiment can be implemented by instructing the relevant hardware through a computer program. The computer program includes program instructions, which can be stored in a storage medium that is computer-readable. The program instructions are executed by at least one processor in the computer system to implement the steps in the method of the above-described embodiment.

[0146] Therefore, the present invention also provides a storage medium. The storage medium may be a computer-readable storage medium. The storage medium stores a computer program, wherein when the computer program is executed by a processor, the processor performs the following steps:

[0147] Obtain projection images of the copper nail grasped by the robotic arm and the hole on the printed circuit board; convert the projection image into a three-dimensional image; extract information from the three-dimensional image to obtain the diameter of the copper nail and the hole diameter; calculate the difference between the diameter of the copper nail and the hole diameter to obtain an interference value; determine whether the interference value exceeds a preset threshold; if the interference value does not exceed the preset threshold, control the robotic arm to embed the copper nail into the hole of the printed circuit board to complete the copper embedding operation.

[0148] The storage medium may be any computer-readable storage medium that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a magnetic disk, or an optical disk.

[0149] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the composition and steps of each example according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0150] In the several embodiments provided herein, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the various units is merely a logical functional division, and actual implementation may employ other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be omitted or not implemented.

[0151] The steps in the methods of the embodiments of the present invention may be adjusted in order, combined, or deleted as needed. The units in the devices of the embodiments of the present invention may be combined, divided, or deleted as needed. Furthermore, the functional units in the various embodiments of the present invention may be integrated into a single processing unit, each unit may exist physically separately, or two or more units may be integrated into a single unit.

[0152] If this integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the existing technology, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes a number of instructions for causing a computer device (which can be a personal computer, terminal, or network device, etc.) to execute all or part of the steps of the method described in various embodiments of the present invention.

[0153] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. A method for controlling the quality of copper embedded in a printed circuit board, characterized in that: include: Obtain projection images of the copper nails and holes on the printed circuit board grasped by the robotic arm; converting the projected image into a three-dimensional image; Extract information from the 3D image to obtain the diameter of the copper nail and the hole; Calculate the difference between the diameter of the copper nail and the diameter of the hole to get the interference value; Determine whether the interference value exceeds a preset threshold; If the interference value does not exceed the preset threshold, the robot arm is controlled to embed the copper nail into the hole of the printed circuit board to complete the copper embedding operation.

2. The method for controlling the quality of copper embedded in a printed circuit board according to claim 1, wherein: The step of obtaining projection images of the copper nails grasped by the robotic arm and the holes on the printed circuit board includes: Fix the printed circuit board to be inlaid with copper on the carrier of the copper inlay machine, and use the robotic arm to grab a copper nail from the copper nail hopper; Conduct surface defect inspection and size inspection on copper nails; If both the surface defect detection and the size detection are passed, the copper nail is moved to the top of the preset hole position on the printed circuit board; Start the X-ray emitter built into the copper-embedded machine platform and use a microfocus X-ray tube to emit an X-ray beam. Then, a flat-panel detector receives the transmission signal of the X-ray beam after it penetrates the copper nails and holes, and generates a projection image.

3. The method for controlling the quality of copper embedded in a printed circuit board according to claim 1, wherein: The step of converting the projection image into a three-dimensional image comprises: Performing dark field correction and gain correction on the projected image to obtain a corrected image; Using a filtering algorithm on the corrected image to enhance edge information in the image to obtain a preprocessed image; The preprocessed image is processed using a filtered back-projection algorithm to obtain three-dimensional volume data; Use volume rendering technology to convert 3D volume data into visual 3D images.

4. The method for controlling the quality of copper embedded in a printed circuit board according to claim 1, wherein: The extracting of information from the three-dimensional image to obtain the diameter of the copper nail and the diameter of the hole includes: Segment the three-dimensional image to obtain the copper nail area and the hole area; The copper nail area and the hole area are processed using an edge detection algorithm to obtain the copper nail edge contour and the hole edge contour; The edge contours of the copper nail and the hole are fitted to obtain the copper nail diameter and the hole diameter.

5. The method for controlling the quality of copper embedded in a printed circuit board according to claim 1, wherein: The calculation of the difference between the diameter of the copper nail and the diameter of the hole to obtain the interference value includes: The interference value is defined as the difference between the diameter of the copper nail and the diameter of the hole, that is, the diameter of the copper nail minus the diameter of the hole.

6. The method for controlling the quality of copper embedded in a printed circuit board according to claim 1, wherein: The determining whether the interference value exceeds a preset threshold value includes: Determine the preset threshold of interference between the copper nail and the hole according to product design requirements; The calculated interference value is compared with a preset threshold to determine whether the interference value exceeds the preset threshold.

7. The method for controlling the quality of copper embedded in a printed circuit board according to claim 1, wherein: After determining whether the interference value exceeds the preset threshold, the method further includes: If the interference value exceeds the preset threshold, the robot arm is controlled to move the copper nail out and automatically grab the next copper nail.

8. A device for controlling the quality of copper embedded in a printed circuit board, characterized in that: include: An acquisition unit, used to acquire projection images of the copper nails grasped by the robotic arm and the holes on the printed circuit board; a conversion unit, configured to convert the projected image into a three-dimensional image; An extraction unit, used to extract information from the three-dimensional image to obtain the diameter of the copper nail and the diameter of the hole; A calculation unit, used for calculating the difference between the diameter of the copper nail and the diameter of the hole to obtain an interference value; A judgment unit, used to judge whether the interference value exceeds a preset threshold; The embedding unit is used to control the robotic arm to embed the copper nail into the hole of the printed circuit board if the interference value does not exceed the preset threshold value to complete the copper embedding operation.

9. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, the method according to any one of claims 1 to 7 is implemented.

10. A storage medium, wherein the computer-readable storage medium stores a computer program, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 7 is implemented.

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