Mounting device for electrical components and dispensers

Abstract

Mounting device (1) for electronic components, comprising: a mounting head (9) configured to receive an electronic component (21) from a feeding device (5) and to transport the electronic component (21) and mount it on a printed circuit board (3); a dispenser (6) configured to apply a paste (P) to a bottom surface of the electronic component (21) which is received by the mounting head (9), wherein the paste (P) is ejected against gravity from an ejection opening (42) of the dispenser (6), the ejection opening (42) being directed upwards; a shielding element (17A) arranged between the electronic component (21) and the dispenser (6) and having an opening above the ejection opening (42), wherein the dispenser (6) has a shielding element mounting part (45) which holds the shielding element (17A), and the shielding element mounting part (45) holds the shielding element (17A), wherein the shielding element (17A) is arranged in a position facing upwards away from the ejection opening (42), characterized in that the shielding element (17A) is detachably mounted on the shielding element mounting part (45).

Description

Technical field

[0001] The present application relates to an assembly device for electronic components which receives an electronic component from a feeding device through an assembly head and transports and mounts the electronic component on a printed circuit board, and a dispenser which is used in the assembly device for electronic components. State of the art

[0002] In recent times, ensuring the strength of connections has become increasingly important for large components, such as a ball-and-socket assembly (BGA), including a temporary fixing function after component assembly to improve product quality. For this purpose, an electronic component mounting device is used that has the function of applying an adhesive to a lower surface of an electronic component while the component is being held against a mounting head after being picked up (see, for example, PTL 1). A known embodiment disclosed in this patent relates to an electronic component mounting device (automatic mounting device) for mounting an electronic component (module) onto a printed circuit board.The mounting device for electronic components is configured such that an adhesive is additionally applied to an underside of the electronic component, which is held by a mounting head (placement head), by a dispenser system which has a function to eject an adhesive (dispenser medium) against gravity. List of quotations Patent literature

[0003] PTL 1: JP 2012 - 28 780 A

[0004] JP 2012 - 28 780 A relates to a dispensing system. JP H06 - 198 231 A relates to an adhesive application mechanism. JP H07 - 15 123 A relates to a method for assembling electronic components. JP 2009 - 175 708 A relates to a liquid crystal dropper device. JP 2015 - 15 377 A relates to a component fastening system. Summary of the invention

[0005] According to the present invention, an assembly device for electronic components according to claims 1 and 6 is provided. According to the present invention, a dispenser according to claim 12 is provided. Brief description of the drawings Fig. Figure 1 is a top view of a mounting device for electronic components according to an embodiment of the present publication. Fig. Figure 2 is a partial cross-sectional view of the assembly device for electronic components according to the embodiment of the present publication. Fig. Figure 3 is an illustrative diagram of a dispenser that is mounted in the assembly device for electronic components according to the embodiment of the present publication. Fig. Figure 4A is an illustrative diagram of a temporary application element and a feeder of a temporary application element used in the assembly device for electronic components according to the embodiment of the present patent application. Fig. Figure 4B is an illustrative diagram of the temporary application element and the feed part of a temporary application element used in the assembly device for electronic components according to the embodiment of the present patent application. Fig. Figure 5 is an explanatory assembly diagram of a mounting part of a temporary application element (shielding element) of the mounting device for electronic components according to the embodiment of the present publication. Fig. Figure 6 is an explanatory process description of an assembly process of a temporary usage element (shielding element) in the assembly device for electronic components according to the embodiment of the present publication. Fig. Figure 7 is an illustrative representation of an assembly state of the temporary usage element (shielding element) of the assembly device for electronic components according to the embodiment of the present publication. Fig. Figure 8A is an explanatory representation of the process when the temporary usage element is used as the shielding element in the mounting device for electronic components according to the embodiment of the present patent application. Fig. Figure 8B is an explanatory description of the process when the temporary application element is used as the shielding element in the assembly device for electronic components according to the embodiment of the present patent application. Fig. Figure 9A is an explanatory description of the process when the temporary usage element is used as a measuring element in the assembly device for electronic components according to the embodiment of the present publication. Fig. 9B is an explanatory description of the process when the temporary usage element is used as the measuring element in the assembly device for electronic components according to the embodiment of the present publication. Fig. Figure 10A is an explanatory description of the process when the temporary usage element is used as a cleaning element in the assembly device for electronic components according to the embodiment of the present publication. Fig. Figure 10B is an explanatory description of the process when the temporary usage element is used as the cleaning element in the assembly device for electronic components according to the embodiment of the present publication. Fig. Figure 11 is a block diagram showing a configuration of a control system of the assembly device for electronic components according to the embodiment of the present publication. Fig. Figure 12 is an illustrative representation of the feed part of the temporary application element which is arranged in the dispenser of the assembly device for electronic components according to the embodiment of the present patent application. Description of the exemplary embodiment

[0006] Problems of conventional devices are briefly described before the description of an embodiment of this publication.

[0007] In the aforementioned coating process with an adhesive, it is essential to apply the adhesive accurately to a predetermined position on the electronic component, which will be the object to be coated. However, if the dispensing orifice or the area surrounding the dispensing orifice of the dispenser system becomes contaminated with the adhesive, the direction of the adhesive's flight or the shape of the liquid droplet will be disrupted. This results in the adhesive adhering to an undesired location. For example, if an insulating adhesive adheres to an electrode of an electronic component, a conduction fault occurs, impeding the connection between the electrode of the electronic component and an electrode of a printed circuit board, thus degrading the product's quality.Furthermore, a situation may arise where an adhesive adheres to a mounting head of the electronic component assembly device. If this condition is left untreated, a defect in the electronic component assembly device may occur. Consequently, there is a disadvantage in that an additional step is required to remove the adhesive through a cleaning process, thus increasing the workload for the operator. (Example of implementation)

[0008] An embodiment of the present publication is described below with reference to the drawings. First, a configuration of the mounting device for electronic components 1 for mounting an electronic component on a printed circuit board is described with reference to Fig. 1 and Fig. 2 described. The assembly device for electronic components 1 has a function to remove an electronic component from a feeder which supplies the electronic component, and to transport the electronic component and mount it on the circuit board. Fig. Figure 2 shows a partial cross-sectional view along line AA. Fig. 1.

[0009] In Fig. 1 A printed circuit board transport mechanism 2 is arranged in the center of the base 1a in an X-direction (PCB transport direction). The PCB transport mechanism 2 transports the printed circuit board 3, which is fed in from an upstream side, and positions and holds the PCB 3 on a mounting plate set up for performing a component assembly operation. The component feeders 4A, 4B are arranged on both sides of the PCB transport mechanism 2, and the feeder base 18a has a plurality of slots in which feeders are mounted (see Fig. 2) is arranged on each of the component feed parts 4A, 4B. Belt feed devices 5, which form at least one feed device, are mounted parallel to each other in the slots of the feed device base 18a.

[0010] In this embodiment, a component feeder 4a (on a lower side in Fig. 1) Belt feeders 5 and a dispenser 6 for feeding electronic components to the electronic component assembly device 1 are mounted in the slots of the shared feeder base 18a. The belt feeder 5 transports a carrier belt carrying electronic components in a belt feeder by stepwise feeding, so that the electronic components are guided to a receiving position where the electronic component is picked up by a mounting head of the component assembly mechanism, which is described below.

[0011] The dispenser 6 has a function for applying the paste P, such as an adhesive for bonding a component, which is caused to fly out from an upwardly open ejection opening 42 against gravity to a bottom side of the electronic component 21, which is picked up by the mounting head (see Fig. 8A, Fig. 8B). This embodiment shows an example in which the dispenser 6 is arranged only on one side of the component feeder 4A. However, the component feeder 4B on the other side can have essentially the same configuration.

[0012] A table 7, movable in the Y-axis and equipped with a linear drive mechanism, is arranged in a Y-direction (a direction orthogonal to an X-direction) at an end section of the top of the base 1A on one side in the X-direction. Two tables 8, movable in the X-axis and each having a linear drive mechanism of the same type, are connected to the table 7 in a manner movable in the Y-direction. The mounting head 9 is mounted on each of the two tables 8 in a manner movable in the X-direction.

[0013] The mounting head 9 is a multi-type head with a variety of holding heads and, as shown in Fig. Figure 2 shows a component suction nozzle 1, which draws in and holds a component and can be raised individually, mounted on a lower end section of each holding head. The mounting head 9 includes a Z-axis lifting and lowering mechanism that raises or lowers the component suction nozzle 10, and a θ-axis rotation mechanism that rotates the component suction nozzle 10 about a nozzle axis.

[0014] The assembly head 9 moves in the X-direction and in the Y-direction by driving the table 7, which is movable in the Y-axis, and the table 8, which is movable in the X-axis. Through this actuation, the two assembly heads 9 each pick up electronic components through the component suction nozzle 10 from the receiving positions of the table feeders 5 from the component feeders 4A, 4B corresponding to the assembly heads 9. In this embodiment, the assembly head 9 has a function for holding a temporary user element 17, which is described below, for carrying out a predefined operating process, such as transport, alongside the electronic components 21 supplied by the belt feeders 5.

[0015] The component detection camera 13, the disposal container 15, and the feeder 16 for temporary use elements are arranged between the component feeder 4A on a lower side and the printed circuit board transport mechanism 2, and the part detection camera 13 and the nozzle holder 14 are arranged between the component feeder 4B on an upper side and the printed circuit board transport mechanism 2. The feeder 16 for temporary use elements has a function for stacking a plurality of plate-like or sheet-like temporary use elements 17 and for feeding the temporary use elements 17.

[0016] In this embodiment, the temporary application element 17 is an element that is used temporarily in an actuation process of the dispenser 6. The assembly device for electronic components 1 according to this embodiment includes a dispenser processing actuation part that performs a predetermined processing operation on the dispenser 6 using the temporary application element 17, which is supplied by the feeder 16 for temporary application elements, and the dispenser process actuation part performs a processing operation described below.

[0017] First, the temporary usage element 17 is positioned above the dispenser 6, so that the opening section 17c (see Fig. 4A, Fig. 4B) above the ejection opening 42 (see Fig. 5) of the dispenser 6. The temporary application element 17 serves to reduce the scattering of the paste P ejected by the dispenser 6. That is, in this application, the temporary application element 17 is arranged between the electronic component 21 and the dispenser 6 and serves as a shielding element 17a, wherein a section arranged above the ejection opening 42 is enclosed by the opening section 17c (see Fig. 8A, Fig. 8B) is open.

[0018] In this case, the dispenser process actuation part performs an actuation to change the temporary usage element 17, which is used as a shielding element 17A. That is, the dispenser process actuation part performs an actuation to remove an unused temporary usage element 17 from the feeder 16 for temporary usage elements, causing the dispenser 6 to hold the temporary usage element 17 as a shielding element 17A, with the used shielding element 17A being ejected into the disposal container 15 and reused.

[0019] Subsequently, the temporary usage element 17 is used in an application as a measuring element 17B, which receives the paste P that is experimentally ejected from the dispenser 6. In this case, the dispenser process actuation part performs a process in which the paste P, which is caused to be experimentally ejected from the dispenser 6 for the purpose of a trial coating, is collected by the temporary usage element 17, which functions as a measuring element 17B (see Fig. 9A, Fig. 9B). In such a process, a process is carried out to hold the measuring element 17B by the mounting head 9 and to move the measuring element 17B over the dispenser 6.

[0020] Furthermore, the temporary usage element 17 is used in an application as a cleaning element 17C, which wipes away the paste P adhering to the ejection opening 42 or the area surrounding the ejection opening 42 of the dispenser 6. In this case, the dispenser process actuation part performs an operation in which the paste P adhering to the ejection opening 42 (see Fig. 5) or the area around the ejection opening 42 of the dispenser 6, is wiped by the temporary usage element 17, which acts as a cleaning element 17C. In this process, a wiping action is performed in which the cleaning element 17C is held by the mounting head 9, positioned above the dispenser 6, and caused to slide relative to the ejection opening 42.

[0021] In the predefined processing described above, which is carried out using the dispenser 6 as a single object, a retaining element for temporary use elements, which holds a temporary use element 17, is provided on the mounting head 9, and the mounting head 9 with this configuration functions as the dispenser process actuation element. As a specific example of the retaining element for temporary use elements, the element holding nozzle 10A is used in this embodiment. It is mounted on the mounting head 9 interchangeably with the component suction nozzle 10 and is capable of drawing in and holding the temporary use element 17. A specific holding head among the holding heads that the mounting head 9 has, which consists of a multi-head design, can be used as the retaining element for temporary use elements, provided for holding the temporary use element 17.

[0022] As described above, the temporary application element 17 is used in three applications in this embodiment, which are described below. In one application, the temporary application element 17 is used as a shielding element 17A, positioned above the dispenser 6 and between the electronic component 21 and the dispenser 6. Part of the shielding element 17A is open only above the ejection opening 42 of the dispenser 6, thus reducing the scattering of the paste P ejected by the dispenser 6. In another application, the temporary application element 17 is used as a measuring element 17B, which receives the paste P experimentally ejected by the dispenser 6.Furthermore, the temporary application element 17 is used in the application as a cleaning element 17C, which wipes away the paste P that adheres to the ejection opening 42 or the area surrounding the ejection opening 42 of the dispenser 6. In this embodiment, the temporary application element 17 is used in at least two of these three applications.

[0023] The nozzle holder 14 stores a variety of suction nozzles mounted on the assembly head 9. These suction nozzles include the component suction nozzle 10, which is mounted for suctioning and holding the electronic component 21, and the element holding nozzle 10A, which is mounted for suctioning and holding the temporary user element 17. By accessing the nozzle holder 14 and performing a predefined nozzle exchange operation, the assembly head 9 mounts either the component suction nozzle 10 or the element holding nozzle 10A on the assembly head 9 in response to the object to be held.

[0024] The disposal container 15 recycles the electronic component 21, which is identified as defective based on the detection of an image captured by the component recognition camera 13 and is used as a temporary usage element 17. That is, by moving the assembly head 9, which holds the electronic component 21 or the temporary usage element 17 (the object to be recycled), to the disposal container 15, the object to be recycled is disposed of and recycled within the disposal container 15. Consequently, the disposal container 15 functions as a recycling component for the used temporary usage elements 17 by the assembly head 9.

[0025] When the assembly head 9, which picks up an electronic component 21 from the component feeder 4A, 4B, moves over the component recognition camera 13, the component recognition camera 13 images the electronic component 21 in a state in which the electronic component 21 is held by the assembly head 9. By applying the recognition processing to a result of this image by the image recognition 52A of the assembly processing part 52 (see Fig. 11) The identification and position determination of the electronic component 21 are performed. Meanwhile, the mounting head 9, which holds the measuring element 17B after the trial coating, is moved above the component recognition camera 13, and the measuring element 17B is imaged. By applying recognition processing to an image result using a recognition processing function that includes a coating quantity measurement 53c of the dispenser maintenance processing part 53, the coating quantity and coating position of the paste P applied to the measuring element 17B by the trial coating can be measured. Consequently, the component recognition camera 13 and the coating quantity measurement 53c form a measuring part that measures the paste P applied to the temporary use element 17, which forms the measuring element 17B.

[0026] The printed circuit board (PCB) recognition camera 12 is mounted on each of the assembly heads 9. Each PCB recognition camera 12 is mounted on a bottom surface of the table 8, which is movable in the X-axis, and moves integrally with the assembly head 9. As the assembly head 9 moves, the PCB recognition camera 12 moves to a position above the PCB 3, which is positioned by a PCB transport mechanism 2, and images the PCB 3. By applying recognition processing to a result of this imaging by the image recognition 52a of the assembly processing part 52 in the same way (see Fig. 11), the position determination of the circuit board 3 is carried out.

[0027] As in Fig. As shown in Figure 2, the feeder base 18a, with a plurality of slots (not shown in the drawing) in which feeders are mounted, is provided at each component feeder 4A, 4B. A slide 18 is positioned at each component feeder 4A, 4B in a state in which a plurality of belt feeders 5, which are removable feeders pre-mounted in the slots of the feeder base 18a, are provided. In each of the component feeders 4A, 4B, the position of the slide 18 is fixed on a fixed base 1b provided on the base 1a by clamping the feeder base 18a. Feed rollers 19, which hold the carrier belts 20, which hold the electronic components 21, in a wound state, are held in the slide 18.The carrier belts 20 unwound from the feed rollers 19 are transported by belt feed devices 5 in a stepwise feed to component receiving positions for the component suction nozzle 10.

[0028] The following describes a configuration and function of the dispenser 6, which is used in the assembly device 1 for electronic components with the configuration described above, with reference to Fig. 3 described. In Fig. 3. A body section 6a, which forms a body of the dispenser, has a mounting interchangeability with the belt feed device 5 and can be detachably mounted in a slot provided by the feed device base 18a mounted on the carriage 18. In the present application, the detachable mounting of the dispenser 6 on the feed device base 18a is not an essential condition. The dispenser 6 can also be arranged separately and independently of the belt feed device 5, outside the reach of the feed device base 18a.

[0029] An ejection mechanism 30, which ejects a paste with which a coating object is coated, is arranged at a front end section of a body section 6a in a state in which an ejection head part 30a, which is provided with the ejection nozzle 41 which has the ejection opening 42 (see Fig. 5), is directed towards a top. The paste P is ejected from the ejection opening 42 of the ejection head part 30a, so that the paste P flies upwards towards a bottom side of the electronic component 21, which is picked up by the mounting head 9 (see Fig. 8A, Fig. 8B).

[0030] In a position arranged upwards away from the ejection opening 42, the temporary use element 17 has a section that opens above the ejection opening 42 (see the opening section 17c in Fig. 5) as a shielding element 17A. When the paste P is applied by the dispenser 6 to a bottom side of the electronic component 21, which is received by the mounting head 9, the shielding element 17A is positioned between the electronic component 21 and the dispenser 6 with the section that opens above the ejection opening 42.

[0031] Behind the ejection mechanism 30, the syringe 32, which ejects stored paste P by means of air pressure, is arranged in an inclined position. The ejection tube 31 and the pressure tube 33 are connected to an ejection side and a pressure side of the syringe 32, respectively. The float element 32a for pressurizing the stored paste P is inserted into the syringe 32, and a residual quantity sensor 32b for determining that the paste P has been reduced to a predetermined level is mounted on an outer circumferential surface of the syringe 32.

[0032] The discharge tube 31 is connected to the discharge nozzle 41 of the discharge head 30a, and the pressure tube 33 is connected to a valve unit 34. The valve unit 34 is further connected to an air supply source 36 by means of a regulator 35. Air supplied by the air supply source 36 is regulated by the regulator 35 to a predetermined air pressure. By switching the valve unit 34 on or off, the air is directed through the pressure tube 33 to the syringe 32 for a predetermined valve opening time. In this process, the air pressure and the valve opening time serve as regulating parameters for controlling the discharge quantity of paste P in a single load by the discharge mechanism 30.

[0033] The dispenser 6 has a controller 37 for controlling a paste dispensing process. The controller 37 is connected to the dispensing mechanism 30, the residual quantity sensor 32b, the control panel 38, the carriage 18, and the control device 50. The controller 37 performs a control operation in response to a control command from the control device 50 and the energy supply from the carriage 18, so that the controller 37 controls a coating actuation with paste P through the dispensing mechanism 30. In a process in which the paste is consumed during such a coating operation, the controller 37 determines the amount of paste P removed from the syringe 32 based on a reading from the residual quantity sensor 32b. Furthermore, the controller 37 can execute a predefined control operation in response to a manual actuation command input via the control panel 38.

[0034] The temporary usage element 17 and the feeder part 16 for temporary usage elements, which supplies the temporary usage element 17, are described below with reference to Fig. 4A and Fig. 4B described. As in Fig. As shown in Figure 4A, the temporary usage element 17 is a rectangular, plate-like element. The temporary usage element 17 has at least two layers. That is, the temporary usage element has: a first layer 17a, which is a layer on a top side, that is, on a side on which the temporary usage element 17 is held by the component intake nozzle 10 of the assembly head 9; and a second layer 17b, which is a layer on a bottom side, that is, on a side on which the temporary usage element 17 is used in a specified processing operation and is oriented towards the dispenser 6 in a state in which the temporary usage element 17 is mounted on the dispenser 6.

[0035] To facilitate reliable suction of the temporary application element 10 by the element-holding nozzle 10a, the first layer 17a consists of a plate-like element formed using a synthetic resin material that possesses stiffness or the like and has a flat, smooth surface. To enable the use of the temporary application element 17 during trial coating or wiping of the paste P, the second layer 17B consists of an arc-like element made of a material such as a non-woven fabric or paper, which allows for easy adhesion or impregnation of paste to or into the second layer 17B.

[0036] The temporary use element 17 comprises the following: the opening section 17c, which is positioned above the ejection opening 42 in a state in which the temporary use element 17 is held by a dispenser 6 as a shielding element 17A; and a pair of positioning openings 17d and 17e, which are designed to position the opening section 17c relative to the dispenser 6. With respect to the pair of positioning openings 17d and 17e, the positioning opening 17d is a reference opening into which a reference pin consisting of two positioning pins 44, forming the shielding element mounting part 45, is inserted with a dimensional tolerance of a predetermined accuracy; and the positioning opening 17e is a tracking opening with an elongated slot shape, which accommodates a positional error between two positioning pins 44.

[0037] Fig. Figure 4B shows the configuration of the feeder 16 for temporary use elements, which feeds the aforementioned temporary use element 17. The feeder 16 for temporary use elements is configured such that positioning posts 16b are mounted perpendicularly on a surface of a flat, plate-like base 16a at a plurality of positions that follow an outer profile of the temporary use element 17. A space enclosed by these positioning posts 16b forms a storage space that stores temporary use elements 17 in a stacked state, with the side faces of the temporary use elements 17 bounded by the positioning posts 16b. That is, the feeder 16 for temporary use elements delivers the plate-like temporary use element 17, which is an object to be delivered, in a state in which the plurality of temporary use elements 17 are stacked.

[0038] By storing the large number of temporary usage elements 17 in a stacked manner, a required number of temporary usage elements 17 can be supplied to an operation for a long time with high storage efficiency, thereby saving space.

[0039] A description of the mounting of the temporary usage element 17 on the dispenser 6 will now follow, when the temporary usage element 17 is used as a shielding element 17A, and a function of the temporary usage element 17 as a shielding element 17A with reference to Fig. 5 to Fig. 8B. In the assembly device 1 for electronic components, which is equipped with the dispenser 6 with the aforementioned configuration, the shielding element 17A is used in a state in which the shielding element 17A is arranged between the electronic component 21, which is held by the assembly head 9, and the dispenser 6.

[0040] In Fig. 5 is an ejection mechanism 30, which forms part of the dispenser, arranged at a distal end section of the body section 6a of the dispenser 6. The ejection head part 30a, which is arranged on a top side of the ejection mechanism 30, is configured for mounting the ejection nozzle 41, which has the ejection orifice 42. Retaining blocks 43, each having a top side on which a positioning pin 44 is mounted perpendicularly, are arranged on both sides of the ejection head part 30a. The pair of retaining blocks 43 and the pair of positioning pins 44 form the shielding element mounting part 45, which holds the shielding element 17A. By positioning the shielding element 17A above the ejection head part 30a and by aligning the positioning openings 17d, 17e to the positioning pins 44, the opening section 17c of the shielding element 17A is positioned exactly above the ejection opening 42, which is formed in the ejection nozzle 41.

[0041] By lowering the shielding element 17A and inserting the positioning pins 44 into the positioning opening 17d, positioning opening 17e in this state, as in Fig. Figure 7 shows a state in which the shielding element 17A is held by the shielding element mounting part 45, which is mounted on the dispenser 6. In this state, the shielding element mounting part 45 holds the shielding element 17A in a position pointing upwards away from the discharge opening 42 of the discharge nozzle 41.

[0042] That is, in the assembly device 1 for electronic components, the dispenser 6 is mounted in the slot of the feed device base 18a (see Fig. 2) configured to have a shielding element 17A, wherein a section of the shielding element 17A corresponding to the ejection opening 42 is open in a restricted manner at a position facing upwards away from the ejection opening 42. With such a configuration, the shielding element 17A and the ejection opening 42 can be arranged at a distance from each other, thus preventing the ejection opening 42 and its edge from becoming smeared with paste P adhering to the shielding element 17A.

[0043] The mounting of the shielding element 17A on the dispenser 6 is carried out according to the operational steps described in Fig. 6 are shown. First, as in part (a) from Fig. Figure 6 shows the element holding nozzle 10A, which is specifically designed to hold the temporary usage element 17, mounted on the mounting head 9. That is, the mounting head 9 is moved to the nozzle holder 14, the mounting head 9 is lowered towards the element holding nozzle 10A, and a nozzle exchange operation is carried out.

[0044] The assembly head 9 is then moved to the feed part 16 for temporary usage elements, as shown in part (b) of Fig. As shown in Figure 6, the element holding nozzle 10A is lowered towards the temporary usage elements 17, which are stored in a stacked state in the feed section 16 for temporary usage elements, and a suction operation is carried out. By such steps, as shown in part (c) of Fig. 6 shows the temporary usage element 17 held by suction through the element holding nozzle 10A, which is mounted on the mounting head 9.

[0045] The mounting head 9, which holds the temporary usage element 17 through the element-holding nozzle 10A, is then moved to a position above the dispenser 6. Next, as described in part (d) of Fig. As shown in Figure 6, the element holding nozzle 10A is lowered towards the dispenser 6, and the positioning pins 44 are inserted into the positioning opening 17d and 17e of the shielding element 17A, so that the shielding element mounting part 45 of the dispenser can hold the temporary use element 17 as a shielding element 17A. That is, as shown in Fig. Figure 7 shows that the positioning pins 44 of the shielding element mounting part 45 are inserted into the positioning opening 17d and positioning opening 17e of the shielding element 17A. These steps position the opening section 17c of the shielding element 17A above the ejection opening 42, which is formed in the ejection nozzle 41.

[0046] The dispenser 6 includes the shielding element mounting part 45 for holding the temporary usage element 17, which forms the shielding element 17A, and the shielding element 17A is detachably mounted on the shielding element mounting part 45. Consequently, the shielding element 17A, which may become smeared during use, can be separated from the ejection opening 42, thus preventing the ejection opening 42 and its edge from becoming smeared with paste P that adheres to the shielding element 17A after use.In the configuration described above, the mounting head 9, which is movable in a state where the element holding nozzle 10A is mounted on the mounting head 9 and the temporary usage element 17 is held by suction, forms a shielding element exchange part. In this exchange part, the shielding element 17A, to which paste P adheres, is removed from the shielding element mounting part 45, and an unused shielding element 17A is picked up from the feeder part 16 for temporary usage elements and mounted on the shielding element mounting part 45. Consequently, an automatic exchange of a shielding element 17A that has become contaminated during use is possible, thus reducing the workload.

[0047] By performing the aforementioned exchange of the shielding element 17A, the following shielding element exchange process is carried out. That is, the used shielding element 17A is removed from the shielding element mounting part 45 of the dispenser 6 by the mounting head 9 and transported to the disposal container 15 by the mounting head 9, and the shielding element 17A is disposed of in the disposal container 15, thus recycling the shielding element 17A. Subsequently, an unused shielding element 17A is picked up from the feed part 16 for temporary use elements by the mounting head 9, and the shielding element 17A is held by the shielding element mounting part 45 of the dispenser 6.

[0048] This means that the shielding element exchange part mentioned above includes: the disposal container 15, in which the shielding element 17A, removed from the shielding element mounting part 45 of the dispenser 6, is disposed of; the shielding element feeder (feeder part 16 for temporary use elements), which feeds the unused shielding element 17A; and the mounting head 9, which forms a shielding element transport part for transporting the shielding element 17A. The mounting head 9, which forms the shielding element transport part, is configured to include the shielding element retainer, which has a function for holding the shielding element 17A on the mounting head 9.

[0049] The shielding element retainer can be configured so that the component suction nozzle 10, which holds the electronic component 21, and the element retainer nozzle 10A, which can hold the shielding element 17A by suction, are interchangeable. By performing a shielding element exchange with such a configuration, an automatic exchange of the shielding element 17A can be enabled through a simple and cost-effective configuration by using the existing mechanism that includes the mounting device 1 for electronic components.

[0050] The following describes a function of the shielding element 17A, which is held by the dispenser 6, with reference to Fig. 8A and Fig. 8B described. Fig. 8A and Fig. Figure 8B shows a paste coating process carried out in the operational steps of the assembly device 1 for electronic components, wherein the electronic component 21 is picked up and transported by the tape feed device 5 through the assembly head 9 and mounted on a printed circuit board. In the paste coating process, paste P for bonding a component is applied to a bottom side of the electronic component 21, which is picked up by the assembly head 9, using the dispenser 6. This paste coating is carried out according to the paste coating process 52b under the control process functions which the assembly processing part 52 of the control unit 50 has (see Figure 8B). Fig. 11).

[0051] In this embodiment, the paste coating is carried out by the dispenser 6 in a state in which the temporary application element 17, which forms the shielding element 17A, is held above the ejection head part 30a of the dispenser 6 by the shielding element mounting part 45. That is, as in Fig. As shown in Figure 8A, the mounting head 9, on which the electronic component 21 is held by suction at each of the plurality of component suction nozzles 10, is moved to a position above the shielding element 17A, which is held by the dispenser 6, and the mounting head 9 is moved (arrow a) such that the electronic components 21 pass sequentially over the opening section 17c, that is, exactly over the ejection opening 42, which ejects the paste P in the dispenser 6.

[0052] As in Fig. As shown in Figure 8B, during the movement of the assembly head 9, the paste P flies upwards through the opening section 17c from the upwardly open ejection port 42 against gravity (arrow c), and the paste P is applied to a bottom side of the electronic component 21, which is moving over the ejection port 42 in a direction indicated by arrow b. During this paste application process, the paste P ejected from the ejection port 42 of the dispenser 6 does not always fly to the desired target position in the desired liquid droplet shape. For example, if the ejection port 42 is smeared due to adhesion of the paste P or the like, the paste P may fly off in a direction directly above what would be the original target position.

[0053] Since, in this case as well, the shielding element 17A is located above the ejection head 30a of the dispenser 6 with respect to the paste P that is ejected from the ejection opening 42 and flies off, only the paste P that flies through the opening section 17c, which opens in the direction directly above the target direction, is applied to the electronic component 21. Consequently, disadvantages related to paste P flying around, which occur when the shielding element 17A is not present, can be effectively prevented. These disadvantages include, for example, a conduction fault caused by coating with flying paste P on a position away from a section of the electronic component 21 originally to be coated, and an actuation fault due to paste P adhering to a section where adhesion of the paste P is not desired, such as on mechanism parts of the mounting head 9 and the like.

[0054] In this embodiment, the shielding element mounting part 45 is mounted on the top of the ejection head part 30a. However, the positioning pins 44, which form the shielding element mounting part 45, can also be integrally formed with the ejection nozzle 41. In such a configuration, the alignment of the opening section 17c of the shielding element 17A, which is mounted on the shielding element mounting part 45, and the ejection opening 42 can be achieved with even greater accuracy.

[0055] The following describes a trial coating process carried out using the temporary application element 17 as the measuring element 17B, with reference to Fig. 9A and Fig. 9B described. In this embodiment, the trial coating for applying the paste P to the measuring element 17B is carried out according to predefined trial coating conditions. Such trial coating conditions include a case in which either the amount or position of the paste P applied to the electronic component 21 does not fall within a predetermined range, or neither of these factors falls within the predetermined range; a case in which the paste P is freshly filled into the dispenser 6; and a case in which a predetermined interval time or more elapses from the time the paste is finally applied. The control of such a trial coating process is carried out according to trial coating 53a under the control process functions that the dispenser maintenance processing section 53 of the control unit 50 possesses (see Fig. 11).

[0056] In this embodiment, the test coating is carried out by the dispenser 6 in a state in which the temporary application element 17, which forms the shielding element 17A, is held above the ejection head part 30a of the dispenser 6 by the shielding element mounting part 45. That is, as in Fig. As shown in Figure 9A, the mounting head 9, which holds the temporary application element 17, forming the measuring element 17B, by the element holding nozzle 10A, is moved to a position above the shielding element 17A, which is held by the dispenser 6. The mounting head 9 is then moved (arrow d) so that the test coating points defined on the temporary application element 17 run sequentially exactly over the opening section 17c, that is, exactly over the ejection opening 42, which ejects the paste in the dispenser 6.

[0057] As in Fig. As shown in Figure 9B, during the movement of the mounting head 9, paste P flies upwards from the upwardly open ejection port 42 against gravity through the opening section 17c (arrow f). The paste P is then sequentially applied to the plurality of test coating points defined on the underside 17f of the temporary application element 17, which forms the measuring element 17B, by a movement over the shielding element 17A in a direction indicated by arrow e. The mounting head 9, holding the measuring element 17B to which the test coating has already been applied, is then moved to a position above the component detection camera 13, and the measuring element 17B, coated with paste P, is imaged by the component detection camera 13.Then, a coating quantity of paste P is applied by performing a recognition process of a result of the image according to a function which has the coating quantity measurement 53c of the dispenser maintenance processing part 53.

[0058] The following describes a wiping process carried out using the temporary application element 17 as a cleaning element 17C, with reference to Fig. 10A and Fig. 10B described. This wiping process is performed when a defect attributable to an imbalance in the paste dispensing from the ejection mechanism 30, such as irregularities in the coating quantity or coating position, is detected by the image recognition 52a as a result of the detection of the coating condition of the paste P applied to the electronic component 21 or of the measuring element 17B. This wiping is performed according to a control process function for wiping 53b under functions that the dispenser maintenance processing part 53 of the control unit 50 possesses (see Fig. 11).

[0059] As in Fig. As shown in Figure 10A, this wiping takes place in a state where the top of the ejection nozzle 41 is exposed by removing the shielding element 17A from the shielding element mounting part 45, which is mounted on the ejection head part 30a of the dispenser 6. That is, the mounting head 9, on which the element holding nozzle 10A is mounted, is moved to the feed part 16 for temporary use elements (see Figure 10A). Fig. 1, Fig. 4A and Fig. 4B), and the temporary usage element 17, which forms the cleaning element 17c, is held by the element holding nozzle 10A.

[0060] The mounting head 9, on which the cleaning element 17C is held by the element-holding nozzle 10A, is then moved to a position above the ejection nozzle 41 of the dispenser 6, and the mounting head 9 is moved back and forth in a horizontal direction (arrow g) in a state in which a lower side of the cleaning element 17C is brought into contact with the ejection opening 42. During such a process, as in Fig. As shown in Figure 10B, the second layer 17b of the temporary application element 17, which is used as a cleaning element 17C, is brought into contact with an upper surface of the ejection nozzle 42, and smeared material, such as the paste P adhering to the upper surface of the ejection nozzle 42, is wiped away by the second layer 17b through the reciprocating motion (arrow h) of the mounting head 9. This actuation of the mounting head 9 during wiping can be an operation achieved by a suitable combination of different types of operations, such as reciprocating movements in two directions or a rotational operation in addition to the reciprocating movement in one direction, as shown in Figure 10B. Fig. 10A and Fig. 10B is shown.

[0061] The following describes a configuration of a control system for the assembly device 1 for electronic components with reference to Fig. 11 described. In Fig. 11 is the control device 50, which performs operational control of the assembly device 1 for electronic components, connected to a printed circuit board transport mechanism 2, a table 7 movable in the Y-axis, a table 8 movable in the X-axis, a component assembly mechanism 11 consisting of assembly heads 9, belt feed devices 5 arranged in component feed parts 4A, 4B, dispensers 6, printed circuit board recognition cameras 12 and component recognition cameras 13.

[0062] The processing part 51, which is a control process function and includes the control device 50, comprises the assembly processing part 52 and the dispenser maintenance processing part 53. The assembly processing part 52 is a control process function that performs the actuation processing for mounting the electronic component 21 onto the printed circuit board 3 by controlling the transport and assembly operations of the aforementioned individual parts, including the printed circuit board transport mechanism 2 in the assembly device 1 for electronic components. That is, the assembly processing part 52 includes control programs for performing the respective processing operations of image recognition 52a, paste coating 52b, component feeding 52c, and replacement of the temporary user element 52d.Furthermore, the dispenser maintenance processing section 53 is a control process function for carrying out a predefined processing operation, such as maintenance, required for the dispenser 6. That is, the dispenser maintenance processing section 53 includes control programs for carrying out the respective processes for the trial coating 53a, the wiping 53b, the coating quantity measurement 53c, and the coating quantity correction 53d.

[0063] Image recognition 52a is a control process for applying recognition processing to an image captured by the printed circuit board recognition camera 12 and the component recognition camera 13. Paste coating 52b is a control process for coating a subside of the electronic component 21 by ejecting paste P from the dispenser 6. Component feeding 52c is a control process for feeding the electronic component 21 to the component assembly mechanism 11 by means of belt feeders 5. Temporary component exchange 52d is a control process for performing processing in which temporary components 17, mounted on the dispenser 6 and used in a state where the temporary components 17 are held by the assembly head 9 as shielding element 17A, measuring element 17B, and cleaning element 17C, are exchanged.In such processing, an unused temporary usage element 17 is picked up from the feed part 16 for temporary usage elements using the assembly head 9, and a used temporary usage element is disposed of and recycled in the disposal container 15.

[0064] The trial coating 53a is a control process for performing a processing operation in which the temporary usage element 17 is held by the assembly head 9 as a measuring element 17B and moved to a position above the dispenser 6, and the paste P, which is ejected from the ejection opening 42, is applied as a trial coating to the measuring element 17B. The wiping operation 53b is a control process for performing a processing operation in which the temporary usage element 17 is held by the assembly head 9 as a cleaning element 17C and moved to the dispenser 6 in order to wipe off paste P, which adheres to the ejection opening 42 and an edge of the ejection opening 42, through the first layer 17a of the cleaning element 17C.

[0065] The coating quantity measurement 53c is a control process for performing a processing operation in which the measuring element 17B, onto which the paste P in the experimental coating according to the experimental coating 53a is applied—that is, the temporary application element 17, which receives the paste P experimentally dispensed from the dispenser 6—is imaged by the component recognition camera 13, and the recognition processing is applied to an image result obtained from this image, so that an amount of paste P applied to the temporary application element 17 is measured. The coating quantity correction 53b is a control process for regulating an amount of coating in a single charge of paste P by the ejection mechanism 30 of the dispenser 6, based on a measurement result of the amount of paste P applied by the coating quantity measurement 53c.In this embodiment, the coating quantity is regulated by regulating a parameter relating to a coating quantity of the paste in a single load (for example, the air pressure for pressurizing the syringe 32, a valve opening time at the time of pressurization, or the like).

[0066] In the above-mentioned control process functions, the respective processes, which consist of the replacement 52d of the temporary use element of the assembly processing part 52, the trial coating 53a and the wiping 53b of the dispenser maintenance processing part 53, correspond to control processes by means of which the previously mentioned dispenser processing actuation part, which the assembly device 1 for electronic components contains, carries out the respective predetermined processes.

[0067] In the configuration in Fig. Figure 1 shows an example in which the feeder 16 for temporary usage elements, which feeds the temporary usage element 17, is arranged between the printed circuit board transport mechanism 2 and the component feeder 4A. However, it is also possible, as in Fig. Figure 12 shows a configuration in which the dispenser 6 includes the feeder 16 for temporary usage elements, which supplies the temporary usage element 17, forming the unused shielding element 17A. That is, in this example, the feeder 16 for temporary usage elements, which has essentially the same configuration as shown in Figure 12, can be used in a configuration where the dispenser 6 includes the feeder 16 for temporary usage elements, which supplies the temporary usage element 17, which forms the unused shielding element 17A. Fig.As shown in Figure 4B, the shielding element 17A is arranged on the upper surface of the body section 6A in a position adjacent to the ejection mechanism 30, which is located at a distal end section of the body section 6A. In such a configuration, the space required for arranging the feeder 16 for temporary usage elements can be eliminated, and a large number of temporary usage elements 17 can be stored stacked adjacent to the position where the shielding element 17A is used. Consequently, the shielding element 17A can be replaced efficiently. (Summary)

[0068] The assembly device 1 for electronic components according to the present patent application comprises: the assembly head 9, which picks up an electronic component 21 from the feeder (belt feeder 5), transports the electronic component 21 and mounts it on the printed circuit board 3; the dispenser 6, which applies the paste P, which is caused to fly out against gravity from an upwardly open ejection opening 42, to a bottom side of the electronic component that is picked up by the assembly head 9; and the shielding element 17A, which is arranged between the electronic component 21 and the dispenser 6 and has a section that opens above the ejection opening 42.

[0069] In an even more advantageous manner, the dispenser 6 has a shielding element mounting part 45 which holds the shielding element 17A, and the shielding element mounting part 45 holds the shielding element 17A in a position pointing upwards away from the ejection opening 42.

[0070] The shielding element 17A is preferably detachably mounted on the shielding element mounting part 45.

[0071] Even better, the mounting device 1 for electronic components according to the present application of patent application features the mounting head 9, which functions as a shielding element exchange part. The shielding element exchange part (mounting head 9) removes the shielding element 17A, to which paste P adheres, from the shielding element mounting part 45 and mounts an unused shielding element 17A onto the shielding element mounting part 45.The shielding element assembly part 45 comprises the following: the recycling part (disposal container 15), which recycles the used shielding element 17A (used temporary use element 17) removed from the shielding element assembly part 45; the shielding element feed part (feed part 16 for temporary use elements), which conveys an unused shielding element 17A (unused temporary use element 17) to the assembly device 1 for electronic components; and the shielding element transport part, which transports the used shielding element 17A (the used temporary use element 17) and an unused shielding element 17A (unused temporary use element 17) (the shielding element transport part being configured to include the shielding element holding part, which has a function for holding the shielding element 17A on the assembly head 9).

[0072] The shielding element 17A has a plate shape. The shielding element feeder (feeder 16 for temporary use elements) stacks shielding elements 17A and delivers the shielding elements 17A to the assembly device 1 for electronic components.

[0073] In the assembly device 1 for electronic components of the present patent application, the shielding element holding part (for example, the component suction nozzle 10), which can hold one of the plurality of shielding elements 17A, is mounted on the assembly head 9, and the assembly head 9 forms part of the shielding element transport part.

[0074] The assembly device 1 for electronic components according to the present patent application comprises the following: the assembly head 9, which picks up the electronic component 21 from the feeder (tape feeder 5) and transports the electronic component 21 and mounts it on the printed circuit board 3; the feeder base 18a, which has the slot in which the feeder (tape feeder 5) is mounted; the feeder (tape feeder 5), which is mounted in the slot of the feeder base 18a; and the dispenser 6, which applies the paste P, which is caused to fly out against gravity from an upwardly open ejection opening 42, to the underside of the electronic component 21 that is picked up by the assembly head 9.The dispenser 6 has a shielding element 17A, wherein a section of the shielding element 17A corresponding to the ejection opening 42 is opened in a restricted manner at a position upwards away from the ejection opening 42.

[0075] The dispenser 6 preferably includes the shielding element mounting part 45 for holding the shielding element 17, and the shielding element 17A is detachably mounted on the shielding element mounting part 45.

[0076] Even better, the mounting device 1 for electronic components according to the present disclosure specification features the mounting head 9, which functions as the shielding element exchange part. The shielding element exchange part (mounting head 9) removes the shielding element 17A, to which paste P adheres, from the shielding element mounting part 45 and mounts an unused shielding element 17A (unused temporary use element 17) onto the shielding element mounting part 45.

[0077] The shielding element assembly part 45 comprises the following: the recycling part (disposal container 15) which recycles the shielding element 17A (used temporary usage element 17) removed from the shielding element assembly part 45; the shielding element feed part which conveys an unused shielding element 17A (unused temporary usage element 17) to the assembly device 1 for electronic components; and the shielding element transport part which transports the used shielding element 17A and an unused shielding element 17A (the shielding element transport part being configured to include the shielding element retainer which has a function for holding the shielding element 17A on the assembly head 9).

[0078] The dispenser 6 according to the present patent application is a dispenser 6 that is mounted on the mounting device 1 for electronic components 6, wherein the mounting head 9 receives an electronic component 21 from the feeder (belt feeder 5) which is mounted in the slot of the feeder base 18a, and transports the electronic component 21 and mounts it on the printed circuit board 3, wherein the dispenser 6 comprises: the body section 6a which can be mounted in the slot; the ejection opening 42 which causes the paste to fly out upwards towards the underside of the electronic component 21 which is received by the mounting head 9; and the shielding element 17A which has a section which opens upwards away from the ejection opening 42 in a position above the ejection opening 42.

[0079] As described above, the assembly device 1 for electronic components of this embodiment is an assembly device 1 for electronic components in which the assembly head 9 picks up the electronic component 21 from the tape feed device 5, which forms the feeder, and transports the electronic component 21 and mounts it on the printed circuit board 3. The assembly device 1 for electronic components further includes a dispenser 6, which applies paste, which is caused to fly out against gravity from an upwardly open ejection opening 42, onto the underside of the electronic component 21, which is picked up by the assembly head 9.The assembly device 1 for electronic components further includes the following: the feeder 16 for temporary use elements, which stacks and supplies plate-shaped or arc-shaped temporary use elements 17; and the dispenser processing actuation part, which performs a predetermined processing operation on the dispenser 6 using the temporary use element 17 supplied by the feeder 16 for temporary use elements 17.

[0080] As a process carried out by the dispenser processing actuator, the temporary application element 17, which is arranged above the dispenser 6 and between the dispenser 6 and the electronic component 21 by the mounting head 9, is alternately used as a shielding element 17A. This shielding element has a section that opens above the ejection opening 42 of the dispenser 6 and serves to reduce the scattering of paste P caused to fly out of the dispenser 6. Consequently, it is possible to prevent the paste P from adhering to positions other than the desired position of the electronic component 21, where adhesion of paste P is desired, and from undesired positions, such as the mounting head 9.This prevents disadvantages such as line faults due to the adhesion of paste or similar substances, thus reducing the occurrence of defective products.

[0081] As a process carried out by the dispenser processing actuator, the temporary usage element 17, held by the mounting head 9, is used as a measuring element 17B, which receives paste P that is experimentally dispensed from the dispenser 6. With such a configuration, a disadvantage in the prior art can be avoided in a case where an actual electronic component is used in the experimental coating; that is, the waste from using an electronic component that is disposed of after use can be eliminated.

[0082] As a process carried out by the dispenser processing actuator, the temporary usage element 17, held by the mounting head 9, is used as a cleaning element 17C, which wipes away the paste P adhering to the dispensing opening 42 of the dispenser or its edge. Consequently, the process of wiping away paste P that has adhered by smearing can be performed automatically. With such a configuration, the workload for an operator during a maintenance operation, such as cleaning, can be reduced, allowing the maintenance and cleaning process to be carried out efficiently and correctly. Commercial applicability

[0083] An assembly device for electronic components and a dispenser according to the present patent application offer the advantage that applying a paste to the underside of an electronic component reduces the occurrence of defective products and simultaneously reduces the strain on the operator during maintenance operations such as cleaning. Consequently, the assembly device for electronic components and the dispenser according to the present patent application are useful in the field of component assembly, where a paste is applied to an electronic component and the electronic component is transported to and mounted on a printed circuit board. Reference symbols in the drawings 1 Mounting device for electronic components 1a Basic 1b fixed base 3 circuit boards 4A, 4B Component feeder 5. Belt feed device 6 dispensers 6a Body section 7 table movable along one axis 8 table movable along one axis 9 Mounting head 10-component suction nozzle 10A Element Holding Nozzle 11 Component assembly mechanism 12 PCB detection camera 13 Component Recognition Camera 14 nozzle holders 15 disposal containers 16 feed parts for temporary usage elements 16a socket 16b Position holding post 17 temporary usage element 17A Shielding element 17B Measuring element 17C Cleaning element 17a, 17b shift 17c Opening section 17d, 17e Opening 17f Underside 18 sleds 18a Feed device base 19 Feed roller 20 carrier tape 21 electronic components 30 Ejection mechanism 30a Ejection head 31 Ejection pipe 32 syringes 32a Floating element 32b Residual quantity detection sensor 33 Pressure pipe 34 Valve unit 35 regulators 36 Air supply source 37 Control 38 Control panel 41 Ejection nozzle 42 Ejection port 43 Holding block 44 Positioning pin 45 Shielding element retaining part 50 Control device 51 Processing part 52 Assembly processing part 52a Image recognition 52b Paste coating 52c Component feed 52d Replacement of the temporary usage element 53 Dispenser maintenance processing part 53a Coating 53c Coating quantity measurement 53d Coating Quantity Correction P Paste

Claims

[1] Mounting device (1) for electronic components, comprising: a mounting head (9) configured to receive an electronic component (21) from a feeding device (5) and to transport the electronic component (21) and mount it on a printed circuit board (3); a dispenser (6) configured to apply a paste (P) to a bottom surface of the electronic component (21) which is received by the mounting head (9), wherein the paste (P) is ejected against gravity from an ejection opening (42) of the dispenser (6), the ejection opening (42) being directed upwards; a shielding element (17A) arranged between the electronic component (21) and the dispenser (6) and having an opening above the ejection opening (42), wherein the dispenser (6) has a shielding element mounting part (45) which holds the shielding element (17A), and the shielding element mounting part (45) holds the shielding element (17A), wherein the shielding element (17A) is arranged in a position facing upwards away from the ejection opening (42), characterized by , that the shielding element (17A) is detachably mounted on the shielding element mounting part (45). [2] Mounting device (1) for electronic components according to claim 1, further comprising a shielding element replacement part, wherein the shielding element replacement part is configured to remove the shielding element (17A) to which a paste (P) adheres from the shielding element mounting part (45) and to mount an unused shielding element (17A) on the shielding element mounting part (45). [3] Mounting device (1) for electronic components according to claim 2, wherein the shielding element replacement part comprises: a recycling part that is configured to recycle the shielding element (17A) removed from the shielding element mounting part (45); a shielding element feeder (16) configured to convey the unused shielding element (17A) to the mounting device (1) for electronic components; and a shielding element transport part that is configured to transport the shielding element (17A) and the unused shielding element (17A). [4] Mounting device (1) for electronic components according to claim 3, wherein the unused shielding element (17A) of one of a plurality of shielding elements (17A) is, Each of the multiple shielding elements (17A) has a plate shape, and The shielding element feeder (16) is configured to stack the multitude of shielding elements (17A) and to supply the multitude of shielding elements (17A) to the assembly device (1) for electronic components. [5] Mounting device (1) for electronic components according to claim 3, wherein a shielding element holding part, which is able to hold the shielding element (17A), is mounted on the mounting head (9), and the mounting head (9) is part of the shielding element transport part. [6] Mounting device (1) for an electronic component, comprising: a mounting head (9) configured to receive an electronic component (21) from a feeding device (5) and to transport the electronic component (21) and mount it on a printed circuit board (3); a feed device base (18a) with a slot in which the feed device (5) is mounted; a dispenser (6) configured to apply a paste (P) to a bottom surface of the electronic component (21) which is received by the mounting head (9), wherein the paste (P) is ejected against gravity from an ejection opening (42) of the dispenser (6), the ejection opening (42) opening upwards, wherein the dispenser (6) has a shielding element (17A) wherein a section of the shielding element (17A) corresponding to the ejection opening (42) is opened in a restricted manner at a position upwards away from the ejection opening (42), wherein the dispenser (6) has a shielding element mounting part (45) which holds the shielding element (17A), and the shielding element (17A) is detachably mounted on the shielding element mounting part (45). [7] Mounting device (1) for electronic components according to claim 6, further comprising a shielding element replacement part, wherein the shielding element replacement part is configured to remove the shielding element (17A) to which the paste (P) adheres from the shielding element mounting part (45) and to mount an unused shielding element (17A) on the shielding element mounting part (45). [8] Mounting device (1) for electronic components according to claim 7, wherein the shielding element replacement part comprises: a recycling part that is configured to recycle the shielding element (17A) removed from the shielding element mounting part (45); a shielding element feeder (16) configured to convey the unused shielding element (17A) to the mounting device (1) for electronic components; and a shielding element transport part that is configured to transport the shielding element (17A) and the unused shielding element (17A). [9] Mounting device (1) for electronic components according to claim 8, wherein the unused shielding element (17A) of one of a plurality of shielding elements (17A) is, Each of the multiple shielding elements (17A) has a plate shape, and The shielding element feeder (16) is configured to stack the multitude of shielding elements (17A) and to supply the multitude of shielding elements (17A) to the assembly device (1) for electronic components. [10] Mounting device (1) for electronic components according to claim 8, wherein the shielding element feeder (16) is mounted on the dispenser (6). [11] Mounting device (1) for electronic components according to claim 8, wherein the mounting head (9) forms part of the shielding element transport part. [12] Dispenser (6) configured to be mounted on an assembly device (1) for electronic components, wherein a mounting head (9) is configured to receive an electronic component (21) from a feeder (5) mounted in a slot of a feeder base (18a) and to transport the electronic component (21) and mount it on a printed circuit board (3), wherein the dispenser (6) includes: a body section (6a) that can be mounted in the slot; an ejection opening (42) which is configured to cause a paste (P) to fly upwards to a bottom side of the electronic component (21) which is received by the mounting head (9); and a shielding element (17A) having a section that opens upwards away from the ejection opening (42) above the ejection opening (42), further comprising a shielding element mounting part (45) for holding the shielding element (17A), wherein the shielding element (17A) is detachably mounted on the shielding element mounting part (45). [13] Dispenser (6) according to claim 12, further comprising a shielding element feeder (16) for feeding an unused shielding element (17A).

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