Semiconductor component, method for manufacturing it and power converter

Abstract

Semiconductor device (1) comprising: a heat sink (3) with a first main surface (3a) and a second main surface (3b) facing each other, the heat sink (3) being made of copper or aluminium; a circuit pattern (7) arranged on the first main surface (3a) of the heat sink (3) with an intermediate insulating layer (5); a conductor part (7a, 25) electrically connected to the circuit pattern (7); a semiconductor element (9) mounted on the circuit pattern (7) and electrically connected to the circuit pattern (7);and a sealing element (13) formed on the first main surface (3a) of the heat sink (3) for sealing the semiconductor element (9) and the circuit pattern (7), wherein the conductor portion (7a, 25) is exposed from a surface located on a side opposite a side on which the heat sink (3) is arranged in the sealing element (13), wherein the sealing element (13) is configured to cover an inner region located within an outer peripheral region (4a) extending around a full circumference along an outer perimeter of the first main surface (3a) of the heat sink (3), and wherein the outer peripheral region (4a) in the first main surface (3a) of the heat sink (3) has a first recess (15) outside the sealing element (13) and near the perimeter of the sealing element (13), wherein the outer peripheral region (4a) is not covered by the sealing element (13).

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