Ceramic component and method for manufacturing the ceramic component

Abstract

Ceramic component comprising a ceramic base body (1) and at least one metallization (2) applied to an outer surface (1') of the ceramic base body (1), wherein the metallization (2) is lithium vanadium phosphate with the general formula Li x V y (PO4) z , contains copper and glass, where a is the amount of copper, b is the amount of lithium vanadium phosphate and c is the amount of glass contained in the metallization and the following applies to the amounts: 40 wt % ≤ a ≤ 99 wt % , 1 wt % ≤ b ≤ 30 wt % , 0 wt % ≤ c ≤ 20 wt % , where x is the fraction of lithium, y is the fraction of vanadium and z is the fraction of phosphate in the lithium vanadium phosphate and the following holds: 0 < x 0 < y 0 < z .

Description

[0001] The present invention relates to a ceramic component comprising a ceramic base body and at least one metallization applied to an outer surface of the ceramic base body. The invention further relates to a method for manufacturing the ceramic component.

[0002] US 9 660 252 B2 discloses a method for manufacturing a solid-state battery. US 2012 / 0 154 977 A1 discloses a multilayer ceramic capacitor and specifies a composition for external termination.

[0003] Ceramic components are widely used in industrial manufacturing. These components typically feature metallization, for example, for electrical contact. However, the composition of this metallization can negatively affect the ceramic substrate of the component.

[0004] The object of the present invention is therefore to provide a ceramic component with improved metallization. Furthermore, it is an object of the invention to provide methods for manufacturing the ceramic component.

[0005] These problems are solved by a ceramic component according to claim 1. Further embodiments of the ceramic component and methods for manufacturing the ceramic component are described in the further claims.

[0006] A ceramic component comprising a ceramic base body and at least one metallization applied to an outer surface of the ceramic base body is provided. The metallization contains lithium vanadium phosphate with the general formula Li x V y (PO4) zand copper. Optionally, glass may also be included in the metallization. Here, a is the proportion of copper, b is the proportion of lithium vanadium phosphate, and c is the proportion of glass contained in the metallization, and the following applies: 40 wt%≤a≤99 wt%, 1 wt%≤b≤30 wt%, 0 wt%≤c≤20 wt%, where x is the fraction of lithium, y is the fraction of vanadium and z is the fraction of phosphate in the lithium vanadium phosphate and the following holds: 0 <x 0 <y 0 <z.

[0007] In another embodiment of the metallization, lithium vanadium phosphate with the general formula Li was used to produce the metallization. x V y (PO4) z and copper and glass or lithium vanadium phosphate with the general formula Li x V y (PO4) zand copper as starting materials, where in the general formula of lithium vanadium phosphate x is the amount of lithium, y is the amount of vanadium and z is the amount of phosphate and the following applies: 0.5 <x<4,5 1.8 <y<2,2, 2.8 <z<3,2.

[0008] In a preferred embodiment of the metallization, lithium vanadium phosphate with the molecular formula Li3V2(PO4)3 and copper and glass or lithium vanadium phosphate with the molecular formula Li3V2(PO4)3 and copper were used as starting materials for the production of the metallization.

[0009] Metallization can be achieved by applying and firing a metal-containing paste, which contains copper and lithium vanadium phosphate. Optionally, glass can also be included in the metal-containing paste.

[0010] The ceramic component can be a ceramic battery. Furthermore, the metallization can serve as a contact surface for the electrical connection of the ceramic component.

[0011] The composition of the metallization is optimally matched to the composition of the ceramic substrate of the ceramic component. The copper content in the metallization ensures electrical conductivity, enabling the ceramic component to be integrated into electronic devices. Furthermore, the lithium vanadium phosphate content in the metallization ensures sufficient adhesion to the ceramic substrate. "Sufficient" here refers to adhesion that prevents the metallization from detaching from the ceramic substrate under typical industrial manufacturing conditions. Additionally, the lithium vanadium phosphate does not interact negatively with the ceramic substrate, thus preventing any adverse effects on the ceramic substrate.

[0012] Furthermore, the metallization can have at least one top layer containing at least copper and / or nickel and / or tin. This top layer makes the ceramic component solderable as a surface-mounted device. This allows the ceramic component to be integrated into conventional production processes for electronic components, thereby keeping manufacturing costs low.

[0013] A process for manufacturing the ceramic component can include the following steps: - Providing a green area, - Rounding off the edges of the green body, - Applying a metal-containing paste containing copper and lithium vanadium phosphate to at least one outer surface of the green body, - Sintering of the green body to obtain a ceramic base body that has a metallization on an outer surface.

[0014] Another method for manufacturing the ceramic component may include the following steps: - Providing a green area, - Sintering of the green body to obtain a ceramic base body, - Rounding the edges of the ceramic base body, - Applying a metal-containing paste containing copper and lithium vanadium phosphate to at least one outer surface of the ceramic substrate, - Firing the metal-containing paste into the ceramic base to achieve metallization.

[0015] The first method has the advantage that the metal-containing paste is applied directly to the green body and sintered together with it. Sintering transforms the green body into a ceramic substrate and the metal-containing paste into the metallized material. This eliminates the need for an additional firing step to cure the metal-containing paste, thus reducing the manufacturing costs of the ceramic component.

[0016] A metal-containing paste containing copper, lithium vanadium phosphate, binder, and solvent can be applied to the ceramic substrate. Optionally, the paste can also contain glass. If a is the fraction of copper, b is the fraction of lithium vanadium phosphate, c is the fraction of glass, and d is the fraction of binder and solvent in the metal-containing paste, then the following applies: 40 wt%≤a≤90 wt%, 1 wt%≤b≤30 wt%, 0 wt%≤c≤20 wt%, 9 wt%≤d≤60 wt%.

[0017] In an advantageous embodiment of the paste, the weight fraction of copper is 56 wt% and the weight fraction of lithium vanadium phosphate is 12.5 wt%, with no glass being contained in the paste. Furthermore, the proportion of binder and solvents is 31.5 wt%. The sum of all weight fractions is 100 wt%.

[0018] Furthermore, in the process for manufacturing the ceramic component, at least one of the thermal processes selected from a group including sintering and firing can be carried out in a reducing atmosphere. A reducing atmosphere, as used here and in the following, is understood to be an atmosphere that largely prevents oxidation of the ceramic component by atmospheric oxygen. This, in particular, prevents the copper contained in the metallization from oxidizing, thereby ensuring the electrical conductivity of the metallization.

[0019] Furthermore, at least one top layer containing copper and / or nickel and / or tin can be applied to the metallization. The top layer can be applied by electroplating, chemical, or physical processes, such as sputtering.

[0020] The invention will now be described in more detail using an exemplary embodiment and the accompanying figure.

[0021] Fig. Figure 1 shows a ceramic component comprising a ceramic base body and metallizations on the outer surfaces of the ceramic base body.

[0022] The figure and the proportions within the figure are not to scale.

[0023] Fig.Figure 1 shows a ceramic component comprising a ceramic base body 1 and two metallizations 2 applied to two opposing outer surfaces 1' of the ceramic base body 1. The ceramic component is a ceramic battery. To manufacture the ceramic component, a green body (not shown) is provided with rounded edges. A metal-containing paste, comprising 56 wt% copper, 12.5 wt% lithium vanadium phosphate, and 31.5 wt% binder and solvent, is then applied to two opposing outer surfaces (not shown) of the green body (not shown). The green body (not shown), to which the metal-containing paste has been applied, is then sintered. Sintering produces the ceramic base body 1 of the ceramic component and the two metallizations 2, each containing copper and lithium vanadium phosphate.The copper ensures the electrical conductivity of the metallization. The lithium vanadium phosphate ensures sufficient adhesion of the metallization to the ceramic substrate, without having any negative effects on the ceramic substrate 1.

[0024] Although the present invention has been described only with reference to one embodiment, the invention is not limited to that embodiment. Rather, the composition of the paste used to produce the metallization can vary, and the method for producing the ceramic component can also vary. Reference symbol list 1 ceramic base body 1' Outer surface of the ceramic base body 3 Metallization

Claims

[1] Ceramic component comprising a ceramic base body (1) and at least one metallization (2) applied to an outer surface (1') of the ceramic base body (1), wherein the metallization (2) is lithium vanadium phosphate with the general formula Li x V y (PO4) z , contains copper and glass, where a is the amount of copper, b is the amount of lithium vanadium phosphate and c is the amount of glass contained in the metallization and the following applies to the amounts: 40 wt%≤a≤99 wt%, 1 wt%≤b≤30 wt%, 0 wt%≤c≤20 wt%, where x is the fraction of lithium, y is the fraction of vanadium and z is the fraction of phosphate in the lithium vanadium phosphate and the following holds: 0 <x 0 <y 0 <z. [2] Ceramic component according to claim 1, wherein lithium vanadium phosphate with the general formula Li for the production of the metallizationx V y (PO4) z and copper and glass or lithium vanadium phosphate with the general formula Li x V y (PO4) z and copper were used as starting materials, where in the general formula of lithium vanadium phosphate x is the amount of lithium, y is the amount of vanadium and z is the amount of phosphate, and the following applies to the amounts: 0.5 <x<4,5, 1,8 <y<2,2, 2,8 <z<3,2.[3] Ceramic component according to claim 1 or 2, wherein the metallization (2) was produced by means of a metal-containing paste containing copper and lithium vanadium phosphate and glass or copper and lithium vanadium phosphate. [4] Ceramic component according to any one of claims 1 to 3, wherein the ceramic component is a ceramic battery. [5] Ceramic component according to one of claims 1 to 4, wherein the metallization (2) is a contact surface for electrical contacting of the ceramic component. [6] Ceramic component according to any one of claims 1 to 5, wherein the metallization (2) has at least one cover layer containing at least copper and / or nickel and / or tin. [7] Ceramic component according to claim 6, wherein the ceramic component is a solderable surface mounted device. [8] Method for manufacturing a ceramic component according to any one of claims 1 to 7, wherein the method comprises the following steps: - Providing a green area, - Rounding off the edges of the green body, - Applying a metal-containing paste containing copper and lithium vanadium phosphate to at least one outer surface of the green body, - Sintering of the green body to obtain a ceramic base body (1) which has a metallization (2) on an outer surface (1'). [9] Method for manufacturing a ceramic component according to any one of claims 1 to 7, wherein the method comprises the following steps: - Providing a green area, - Sintering of the green body to obtain a ceramic base body (1), - Rounding the edges of the ceramic base body (1), - Applying a metal-containing paste containing copper and lithium vanadium phosphate to at least one outer surface (1') of the ceramic base body (1), - Firing the metal-containing paste into the ceramic base body (1) to obtain a metallization (2). [10] Method according to claim 8 or 9, wherein the metal-containing paste is a paste containing copper, lithium vanadium phosphate, glass, binder and solvent, wherein a is the amount of copper, b is the amount of lithium vanadium phosphate, c is the amount of glass, d is the amount of binder and solvent, and the following applies to the amounts: 40 wt%≤a≤90 wt%, 1 wt%≤b≤30 wt%, 0 wt%≤c≤20 wt%, 9 wt%≤d≤60 wt%. [11] Method according to any one of claims 8 to 10, wherein at least one of the thermal processes selected from sintering and firing is carried out in a reducing atmosphere. [12] Method according to any one of claims 8 to 11, wherein at least one top layer containing copper and / or tin and / or nickel is applied to the metallization (2). < / y<2,2, < / x<4,5,

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