LASER PROCESSING HEAD AND LASER PROCESSING SYSTEM

Abstract

A collaborative robot capable of performing a task in partnership with an operator is now ubiquitous. In this context, there is a need for a laser processing head suitable for both manual operation, where an operator performs a laser emission operation manually, and automatic operation, where a laser processing system performs a laser emission operation automatically. A laser processing head 14 is provided, enabling laser emission operations to be performed in a manual operating mode, in which a control device 18 executes the laser emission operation according to a manual laser emission command, and in an automatic operating mode, in which the control device 18 automatically executes the laser emission operation according to a processing program. The laser processing head comprises: a first input device 58, which receives an input operation to send the manual laser emission command to the controller 18; and a distance measuring sensor 62, which measures a distance between the laser processing head 14 and a workpiece W when the controller 18 executes the laser emission operation in the automatic drive mode.

Description

Technical area

[0001] The present disclosure relates to a laser processing head and a laser processing system. General state of the art

[0002] A laser processing head mounted on a laser processing system that automatically performs laser emission operations according to a processing program is known (Patent Literature 1). On the other hand, a laser processing head that is manually operated by an operator is also known (Patent Literature 2). Citation listPatent literature PTL 1: JP 2000-52076 A PTL 2: JP 2000-24787 A Brief description of the inventionTechnical problem

[0003] A collaborative robot capable of performing work in collaboration with an operator is widely used. Accordingly, there is a need for a laser processing head capable of both manual drive mode, where an operator manually performs a laser emission operation, and automatic drive mode, where a laser processing system automatically performs a laser emission operation. Solution to the problem

[0004] In one aspect of the present disclosure, a laser processing head capable of performing a laser emission operation in a manual drive mode in which a controller performs a laser emission operation according to a manual laser emission command, and an automatic drive mode in which the controller automatically performs a laser emission operation according to a machining program, comprises: a first input device that receives an input operation to send the manual laser emission command to the controller; and a distance measuring sensor that measures a distance between the laser processing head and a workpiece when the controller performs the laser emission operation in the automatic drive mode. Short description of the drawings [ Fig. 1] Fig. 1 is a diagram of a laser processing system according to an embodiment. [ Fig. 2] Fig. 2 is a block diagram of the Fig. 1 illustrated laser processing system. [ Fig. 3] Fig. 3 is an enlarged view of a Fig. 1 illustrated mode selection switch. [ Fig. 4] Fig. 4 is an enlarged view of a Fig. 1 illustrated laser processing head. [ Fig. 5] Fig. 5 illustrates a first input device according to another embodiment. [ Fig. 6] Fig. 6 is an enlarged view of a laser processing head according to another embodiment. [ Fig. 7] Fig. 7 is a block diagram of the Fig. 6 illustrated laser processing head. [ Fig. 8] Fig. 8 is a diagram to explain the function of a Fig. 6 illustrated contact detection device. [ Fig. 9] Fig. 9 is a diagram for explaining a function of a Fig. 6 and illustrates a state in which the command inhibition unit inhibits a manual laser emission command. [ Fig. 10] Fig. 10 is a diagram for explaining a function of a Fig. 6 and illustrates a state in which the command inhibit unit allows the transmission of a manual laser emission command. [ Fig. 11] Fig. 11 is a flowchart showing an example of an operation flow of the Fig. 6 shows the laser processing head. [ Fig. 12] Fig. 12 is a flowchart showing an example of a flow of step S2 in Fig. 11 shows. [ Fig. 13] Fig. 13 is a flowchart showing an example of a flow of step S3 in Fig. 11 shows. [ Fig. 14] Fig. 14 is a block diagram of a laser processing head according to another embodiment. [ Fig. 15] Fig. 15 is a flowchart showing an example of the flow of step S2 executed by the Fig. 14 illustrated laser processing head. Description of embodiments

[0005] Embodiments of the present disclosure will be described in detail below with reference to the drawings. It should be noted that in various embodiments described below, the same elements are denoted by the same reference numerals, and overlapping descriptions will be omitted. First, a laser processing system 10 according to an embodiment will be described with reference to Fig. 1 and Fig. 2. The laser processing system 10 is a system that can perform a laser process (laser welding, laser cutting, and the like) on a workpiece W in cooperation with an operator.

[0006] More specifically, the laser processing system 10 includes a robot 12, a laser processing head 14, a laser oscillator 16, and a controller 18. The robot 12 moves the laser processing head 14 relative to the workpiece W. In the present embodiment, the robot 12 is a vertical articulated robot and includes a base frame 20, a swing body 22, a lower arm 24, an upper arm 26, and a wrist 28.

[0007] The base frame 20 is mounted on a floor of a work cell. The pivot body 22 is provided on the base frame 20 so as to be capable of pivoting about a vertical axis. The lower arm 24 is provided on the pivot body 22 so as to be rotatable about a horizontal axis. The upper arm 26 is rotatably provided at a tip end portion of the lower arm 24. The wrist 28 includes a wrist base 28a provided at a tip end portion of the upper arm 26 so as to be rotatable about two mutually orthogonal axes, and a wrist flange 28b provided rotatably on the wrist base 28a.

[0008] The components of the robot 12 (the base frame 20, the swivel body 22, the lower arm 24, the upper arm 26 and the wrist 28) are each provided with several servo motors 30 ( Fig. 2). These servomotors 30 cause each of the movable components (i.e., the swivel body 22, the lower arm 24, the upper arm 26, the wrist 28, and the wrist flange 28b) of the robot 12 to rotate about a drive axis in response to a command from the controller 18. As a result, the robot 12 moves along the laser processing head 14.

[0009] The robot 12 is provided with a force sensor 32. The force sensor 32 detects an external force F acting on the robot 12. As an example, the force sensor 32 includes a torque sensor provided in each of the servomotors 30 of the robot 12 and detects a torque acting on an output shaft of the servomotor 30.

[0010] As another example, the force sensor 32 is provided in a component (e.g., the base frame 20 or the wrist 28) of the robot 12 and comprises a six-axis force sensor capable of detecting forces in the six axis directions. Based on the detection data of the force sensor 32, the controller 18 can specify the magnitude and direction of the external force F acting on the robot and the part (e.g., the wrist 28) of the robot 12 on which the external force F acts.

[0011] The laser oscillator 16 internally performs laser oscillation in response to a command (such as a laser power command) from the controller 18 to generate a laser beam LB. The laser oscillator 16 can be any type, such as a fiber laser oscillator, a pulsed laser oscillator, a CO2 laser oscillator, or a solid-state laser (YAG laser) oscillator. The laser oscillator 16 sends the generated laser beam LB to the laser processing head 14 via a light guide path 34. The light guide path 34 can be configured by an optical fiber, a cavity, a light guide material such as a crystal, a reflective mirror, an optical lens, or the like.

[0012] The controller 18 controls a laser emission operation LO for operating the laser oscillator 16 to emit the laser beam LB from the laser processing head 14, and a movement operation MO for operating the robot 12 so that the laser processing head 14 attached to the robot 12 is caused to move with respect to the workpiece W. More specifically, as shown in Fig. 2, the controller 18 is a computer having a processor 36, a memory 38, and an I / O interface 40.

[0013] The processor 36 comprises a CPU or GPU, is communicatively connected to the memory 38 and the I / O interface 40 via a bus 42, and performs various arithmetic processing to execute the laser process described later while communicating with these components. The memory 38 comprises a RAM or ROM and temporarily or permanently stores various data used in the arithmetic processing performed by the processor 36 and various data generated during the arithmetic processing.

[0014] The I / O interface 40 includes, for example, an Ethernet™ port, a USB port, a fiber optic connector, or an HDMI™ port, and communicates data wired or wirelessly with an external device according to a command from the processor 36. The robot 12 (more specifically, the servo motor 30 and the force sensor 32), the laser processing head 14, and the laser oscillator 16 are communicatively connected to the I / O interface 40.

[0015] The controller 18 is further provided with an input device 44 and a display device 46. The input device 44 comprises a keyboard, a mouse, or a touchscreen and receives data input from an operator. The display device 46 comprises a liquid crystal display or an organic EL display and displays various data.

[0016] The input device 44 and the display device 46 are communicatively connected to the I / O interface 40 by wiring or wirelessly. It should be noted that the input device 44 and the display device 46 may be integrated into the housing of the controller 18 or may be provided as, for example, a single computer (PC or the like) separate from the housing of the controller 18.

[0017] In the present embodiment, the controller 18 is provided with a mode selection switch 48. The mode selection switch 48 serves to select a drive mode DM for the laser process performed by the controller 18. As shown in Fig. 3, the mode selection switch 48 in the present embodiment is configured to switch the drive mode DM between a manual drive mode DM1, which is represented as “MANUAL,” and an automatic drive mode DM2, which is represented as “AUTO.”

[0018] The operator can switch the DM drive mode between the manual drive mode DM1 and the automatic drive mode DM2 by operating the mode selection switch 48. The DM manual drive mode is the DM drive mode in which the operator grasps and carries the laser processing head 14 by hand, causes the controller 18 to manually execute the laser emission operation LO, and manually performs the laser process on the workpiece W with the laser beam LB emitted from the laser processing head 14. In this DM manual drive mode, the operator manually issues a manual laser emission command CM1 (described later) to the controller 18, and the processor 36 of the controller 18 executes the laser emission operation LO in response to the manual laser emission command CM1.

[0019] On the other hand, the automatic drive mode DM2 is a drive mode DM in which the processor 36 of the controller 18 automatically executes the laser emission operation LO and the movement operation MO according to the machining program PG1 created in advance. Specifically, the processor 36 sequentially generates commands to the laser oscillator 16 according to the machining program PG1, operates the laser oscillator 16 according to the commands, and automatically executes the laser emission operation LO to emit the laser beam LB from the laser machining head 14.

[0020] The processor 36 sequentially generates commands (position command, speed command, torque command, and the like) to the robot 12 (more specifically, each servo motor 30) according to the machining program PG1, operates the robot 12 according to the commands, and automatically executes the movement operation MO to move the laser machining head 14 with respect to the workpiece W. This machining program PG1 is created in advance by the operator and stored in the memory 38. Fig. 3 illustrates a state in which the automatic drive mode DM2 (“AUTO”) is selected by the mode selection switch 48.

[0021] The laser processing head 14 is detachably mounted on the wrist flange 28b of the robot 12. More specifically, as shown in Fig. 4, the laser processing head 14 includes a head body 50, a nozzle 52, an attachment tool 54, a handle 56, a first input device 58, a second input device 60, and a distance measurement sensor 62. The head body 50 is hollow and houses therein optical components such as an optical lens (collimator lens, focus lens, and the like) and a lens drive unit (e.g., a servo motor) that moves the optical lens in response to a command from the controller 18.

[0022] The nozzle 52 is hollow and is provided at the tip end portion of the head body 50. In the present embodiment, the nozzle 52 has an external shape of a truncated cone in which the cross-sectional area decreases from the base end portion to the tip end portion, and an emission port 52a is formed at the tip end portion. A hollow chamber is formed inside the nozzle 52 and the head body 50, and an auxiliary gas AG is introduced into the chamber from an externally provided auxiliary gas supply device (not illustrated). The laser beam LB generated by the laser oscillator 16 propagates in the chamber and is emitted from the emission port 52a along an optical axis A, together with the auxiliary gas AG.

[0023] The attachment tool 54 is provided on the head body 50 and is detachably attached to the wrist flange 28b of the robot 12. As one example, the attachment tool 54 may include a fastener, such as a screw, and may be fastened to the wrist flange 28b by the fastener. As another example, the attachment tool 54 may include an engagement part that detachably engages with an engageable part formed on the wrist flange 28b and can be attached to or detached from the wrist flange 28b through engagement between the engageable part and the engagement part. As another example, the attachment tool 54 may include an electromagnet and may be attracted to and held on the wrist flange 28b by an electromagnetic force generated by the electromagnet.The laser processing head 14 is removably attached to the wrist flange 28b of the robot 12 via the attachment tool 54.

[0024] The handle 56 is provided at a base end portion of the head body 50 so that it can be grasped by the operator with one hand. The handle 56 may have a rough portion corresponding to a finger of one hand so that the operator can easily grasp it with one hand. By grasping the handle 56 and removing the laser processing head 14 from the wrist flange 28b, the operator can carry the laser processing head 14.

[0025] The first input device 58 receives an input operation to send the manual laser emission command CM1 to the controller 18. In the present embodiment, the first input device 58 includes a push button, a switch, or a touch screen that allows an operator to perform an input operation by hand, and is provided on the laser processing head 14 (for example, the head body 50 or the handle 56).

[0026] Upon receiving an input operation (e.g., manually pressing the push button, operating the switch, or a touch operation on the touch screen) from the operator, the first input device 58 issues the manual laser emission command CM1 to the controller 18. The manual laser emission command CM1 may be an ON signal (or "1" signal).

[0027] Upon receiving the manual laser emission command CM1 during execution of the manual drive mode DM1, the controller 18 executes the laser emission operation LO in response to the manual laser emission command CM1. Thus, as the manual drive mode DM1, the operator can manually perform the laser process on the workpiece W by the laser beam LB emitted from the emission port 52a of the laser processing head 14 along the optical axis A while carrying the laser processing head 14 by hand. In the present embodiment, the first input device 58 is provided next to the handle 56 so that the operator can perform the input operation with one hand grasping the handle 56.

[0028] The second input device 60 receives an input operation to send a manual gas emission command CM2 to emit the auxiliary gas AG. Specifically, the second input device 60 includes a push button, a switch, or a touch screen that allows the operator to perform an input operation with one hand. Upon receiving an input operation from the operator, the second input device 60 sends the manual gas emission command CM2 to the controller 18. The manual gas emission command CM1 may be an ON signal (or "1" signal).

[0029] Upon receiving the manual gas emission command CM2 during the execution of the manual drive mode DM1, the controller 18 operates the auxiliary gas supply device to cause the auxiliary gas supply device to supply the auxiliary gas AG to the laser processing head 14. As a result, the auxiliary gas AG is emitted together with the laser beam LB from the emission port 52a of the laser processing head 14, which is grasped by the operator with one hand.

[0030] The second input device 60 can be configured to send the manual gas emission command CM1 directly to the auxiliary gas supply device. In the present embodiment, the second input device 60, similar to the first input device 58 described above, is also provided adjacent to the handle 56 and the first input device 58 so that the operator can perform the input operation with one hand grasping the handle 56.

[0031] The distance measuring sensor 62 measures a distance d between the laser processing head 14 (e.g., emission port 52a) and the workpiece W when the controller 18 executes the laser emission operation LO in the automatic drive mode DM2. Specifically, the distance measuring sensor 62 is, for example, a capacitive type, infrared type, laser type, or sound wave type (e.g., an ultrasonic type) distance measuring sensor.

[0032] For example, in the case of the capacitive type, the distance measuring sensor 62 is provided in the head body 50 (or the nozzle 52) to measure a distance to an object located at a position closest to the laser processing head 14. On the other hand, in the case of the infrared type, laser type, or acoustic wave type, the distance measuring sensor 62 is attached to the head body 50 (or the nozzle 52) such that a measuring direction D (in other words, the radiation direction of the infrared beam, laser, or acoustic wave) in which the distance to the object is measured is parallel to the optical axis A. That is, in this case, the distance measuring sensor 62 measures the distance d between the laser processing head 14 (emission port 52a) and the workpiece W in the direction of the optical axis A.

[0033] The distance measurement sensor 62 continuously (e.g., periodically) measures the distance d when the controller 18 executes the laser emission operation LO in the automatic drive mode DM2. In the automatic drive mode DM2, the processor 36 of the controller 18 executes the laser emission operation LO when the distance d measured by the distance measurement sensor 62 is within a predetermined allowable range RG, and does not execute the laser emission operation LO when the distance d is outside the allowable range RG.

[0034] The processor 36 stops the operation of the robot 12 when the external force F detected by the force sensor 32 exceeds a predetermined threshold F when executing the movement operation MO in the automatic drive mode DM2. th This can cause the robot 12 to stop in an emergency if the robot 12 collides with a surrounding object (for example, the operator) during the movement operation MO.

[0035] As described above, in the present embodiment, the laser processing head 14 is configured to be capable of performing a laser emission operation in the manual drive mode DM1 in which the controller 18 executes the laser emission operation LO according to the manual laser emission command CM1, and in the automatic drive mode DM2 in which the controller 18 automatically executes the laser emission operation LO according to the processing program PG1.

[0036] In order to be used in both the manual drive mode DM1 and the automatic drive mode DM2 as described above, the laser processing head 14 includes the first input device 58 that receives an input operation to send the manual laser emission command CM1 to the controller 18, and the distance measurement sensor 62 that measures the distance d between the laser processing head 14 and the workpiece W when the controller 18 performs the laser emission operation LO in the automatic drive mode DM2.

[0037] According to this configuration, the operator can perform the laser process while freely switching between the manual drive mode DM1 and the automatic drive mode DM2 in response to the progress of the laser process. This allows different laser processes to be performed. In the manual drive mode DM1, the operator can manually control the laser emission operation LO by operating the first input device 58. On the other hand, in the automatic drive mode DM2, the controller 18 can automatically control the laser emission operation LO based on the distance d measured by the distance measurement sensor 62. Therefore, the safety of the laser process can be ensured.

[0038] In the present embodiment, the first input device 58 includes a push button, a switch, or a touch screen that allows an operator to perform a manual input operation. According to this configuration, the operator can send the manual laser emission command CM1 to the controller 18 with a simple operation in the manual drive mode DM1.

[0039] In the present embodiment, the laser processing head 14 further includes the second input device 60, which receives an input operation for sending a manual gas emission command CM2 to emit the auxiliary gas AG. According to this configuration, the operator can also manually control the emission of the auxiliary gas AG in the manual drive mode DM1.

[0040] In the present embodiment, the laser processing head 14 further includes the attachment tool 54 (specifically, the wrist flange 28b) detachably attached to the robot 12, which moves along the laser processing head 14, and the handle 56 that can be grasped by the operator with one hand. Furthermore, the first input device 58 is provided next to the handle 56 so that the one hand grasping the handle 56 can perform the input operation.

[0041] According to this configuration, the operator can easily perform the laser emission operation LO in the manual drive mode DM1 by operating the attachment tool 54 to remove the laser processing head 14 from the robot 12 while grasping the handle 56 with one hand and operating the first input device 58 with one hand.

[0042] On the other hand, the operator can easily perform the laser emission operation LO in the automatic drive mode DM2 by attaching the laser processing head 14 to the robot 12 via the attachment tool 54. This allows the operator to switch more smoothly and easily between the manual drive mode DM1 and the automatic drive mode DM2.

[0043] It should be noted that the first input device 58 is not limited to a push button, a switch, or a touch screen, but may also include a foot pedal or a foot switch that allows an operator to perform an input operation with a foot. Such a configuration is shown in Fig. 5. In a Fig. 5, a first input device 58' comprises a foot pedal or foot switch and is provided separately from the head body 50.

[0044] The first input device 58' is electrically connected to an electronic component (e.g., a processor, as described below) housed inside the head body 50. Upon receiving an input operation (e.g., stepping on a foot pedal or switching on the foot switch) by the operator, the first input device 58' sends the manual laser emission command CM1 to the controller 18 via the electronic component in the head body 50.

[0045] It should be noted that the first input devices 58 and 58' are not limited to a push button, a switch, a touch screen, a foot pedal, or a foot switch, but may be any type of input device. For example, the first input devices 58 and 58' may include a microphone that detects the operator's voice and a voice analysis unit that analyzes the voice. In this case, the first input devices 58 and 58' receive a voice input operation from the operator and send the manual laser emission command CM1 to the controller 18.

[0046] The second input device 60 may be omitted from the laser processing head 14 or 14'. In this case, the second input device 60 may be provided on the controller 18. Alternatively, the above-described input device 44 may also function as the second input device 60. In this case, by operating the input device 44, the operator can operate the auxiliary gas supply device to supply the auxiliary gas AG to the laser processing head 14 or 14'.

[0047] The handle 56 described above may be omitted, and the operator may, for example, grasp the head body 50 and carry the laser processing head 14 or 14'. The first input device 58 may be provided at any position of the laser processing head 14 or 14', and the handle 56 and the first input device 58 may be arranged so that the operator can grasp the handle 56 (or the head body 50) with one hand and operate the first input device 58 with the other hand.

[0048] Next, a laser processing head 64 according to another embodiment will be described with reference to Fig. 6 and Fig. 7. The laser processing head 64 can be used instead of the above-described laser processing head 14 in the laser processing system 10 and can be removably attached to the wrist flange 28b of the robot 12. The laser processing head 64 differs from the above-described laser processing head 14 in the following configuration.

[0049] More specifically, the laser processing head 64 further includes the mode selection switch 48, a contact detection device 66, and a processor 68. In the present embodiment, the mode selection switch 48 is provided integrally with the head body 50 and can be switched between the manual operation mode DM1 and the automatic operation mode DM2, similar to the above-described embodiment.

[0050] The contact detection device 66 detects whether the laser processing head 64 and the workpiece W are in contact or not in contact. More specifically, the contact detection device 66 includes a conductive cable 66a and a resistance sensor 66b ( Fig. 7). The conductive cable 66a is electrically connected at one end to the head body 50 of the laser processing head 64 and is electrically connected at the other end to the workpiece W, thereby electrically connecting the laser processing head 64 and the workpiece W.

[0051] In the present embodiment, at least a portion of the head body 50 and the nozzle 52 of the laser processing head 64 is made of a conductive material (e.g., metal). The workpiece W is made of metal (e.g., iron or copper). Therefore, the workpiece W, the head body 50 and the nozzle 52 of the laser processing head 64, and the conductive cable 66a form a closed circuit 70 when the tip end of the nozzle 52 of the laser processing head 64 comes into contact with the workpiece W, as shown in Fig. 8 illustrates.

[0052] The resistance sensor 66b measures a resistance R of the closed circuit 70 by applying a voltage to the closed circuit 70. As in Fig. As illustrated in Fig. 8, the resistance R measured by the resistance sensor 66b is an extremely small value R0 (R0 ≈ 0) when the laser processing head 64 and the workpiece W are in contact with each other. On the other hand, the resistance R measured by the resistance sensor 66b is an extremely large value R1 (R1 ≈ ∞ >> R0) when the laser processing head 64 and the workpiece W are not in contact with each other (that is, when the tip end of the nozzle 52 is separated from the workpiece W).

[0053] The contact detection device 66 can detect whether the laser processing head 64 and the workpiece W are in contact or not in contact based on the resistance R measured by the resistance sensor 66b. The resistance sensor 66b transmits to the processor 68, as detection data DD, measurement data of the measured resistance R or contact determination data indicating contact or non-contact between the laser processing head 64 and the workpiece W. The processor 68 can determine whether the laser processing head 64 and the workpiece W are in contact or not in contact based on the detection data DD of the resistance sensor 66b. The resistance sensor 66b can be integrated into the head body 50.

[0054] With reference to Fig. 7, the processor 68 comprises a CPU or a GPU and is integrated into the head body 50. The processor 68 is communicatively connected to the mode selection switch 48, the first input device 58, the second input device 60, the distance measurement sensor 62, and the resistance sensor 66b via a bus (or communication line) 72.

[0055] In this embodiment, the processor 68 functions as a command inhibit unit 74 and inhibits the manual laser emission command CM1 sent from the first input device 58 to the controller 18 when a condition CD for executing the laser emission operation LO in the manual drive mode DM1 is not satisfied. The function of the command inhibit unit 74 will be described with reference to Fig. 9 and Fig. 10 described.

[0056] Fig. 9 schematically illustrates a state in which the command inhibit unit 74 inhibits the manual laser emission command CM1. Specifically, the manual laser emission command CM1 sent by the first input device 58 is transmitted to the controller 18 via a communication line 76, and the communication line 76 is provided with an inhibit circuit 78.

[0057] The inhibit circuit 78 includes, for example, an electronically controllable switch 78a (relay or the like) integrated into the head body 50 of the laser processing head 64. The command inhibit unit 74 inhibits the manual laser emission command CM1 or allows transmission of the manual laser emission command CM1 by opening / closing the switch 78a of the inhibit circuit 78 according to the predetermined condition CD.

[0058] For example, the condition CD for performing the laser emission operation LO in the manual drive mode DM1 includes a first condition CD1 that the manual drive mode DM1 has been selected by the mode selection switch 48 and a second condition CD2 that the laser processing head 64 is in contact with the workpiece W.

[0059] If the first condition CD1 or the second condition CD2 is not met, the command locking unit 74 opens the switch 78a of the locking circuit 78, as shown in Fig. 9, thereby blocking the CM1 manual laser emission command. However, if the first condition CD1 and the second condition CD2 are met, as shown in Fig. 10, the command inhibit unit 74 closes the switch 78a of the inhibit circuit 78, thereby allowing the transmission of the manual laser emission command CM1.

[0060] In this way, the processor 68 functions as the command disabling unit 74 and actuates the disabling circuit 78 to disable the manual laser emission command CM1 or to allow the transmission of the manual laser emission command CM1 in response to the condition CD. It should be noted that the disabling circuit 78 (switch 78a) may be configured by an analog circuit or by a digital circuit implemented by signal processing performed by the processor 68. The Fig. 9 and Fig. The blocking circuit 78 illustrated in Figure 10 is an example and can be configured by any circuit.

[0061] Next, the function of the laser processing head 64 will be explained with reference to Fig. 11. After receiving an operation start command from the controller 18, the processor 68 of the laser processing head 64 starts the Fig. 11. In step S1, the processor 68 determines whether or not the manual drive mode DM1 is selected by the mode selection switch 48. If the manual drive mode DM1 is selected by the mode selection switch 48, the processor 68 determines YES and proceeds to step S2, and if it determines NO, the processor proceeds to step S3.

[0062] In step S2, the processor 68 executes the flow of the manual drive mode DM1. This step S2 is described with reference to Fig. 12. At the start time of step S2, the processor 68 may open the switch 78a of the blocking circuit 78, as shown in Fig. 9, or may close the switch 78a, as shown in Fig. 10 illustrates.

[0063] After starting step S2, the processor 68 sends a command CM3 to switch to the manual drive mode to the controller 18 in step S11. After receiving the command CM3 to switch to the manual drive mode, the processor 36 ( Fig. 2) of the controller 18 changes the drive mode DM to the manual drive mode DM1.

[0064] After switching to manual drive mode DM1, the processor 36 of the controller 18 is placed in a state capable of receiving the manual laser emission command CM1 and rejects an automatic drive start command CM4 to start the laser emission operation LO and the movement operation MO in the automatic drive mode DM2. In step S11, the mode selection switch 48 may transmit the command CM3 to switch to manual drive mode to the controller 18. The manual gas emission command CM3 may be an ON signal (or "1" signal).

[0065] In step S12, the processor 68 starts an operation for detecting contact or non-contact between the laser processing head 64 and the workpiece W by the contact detection device 66. More specifically, the processor 68 causes the resistance sensor 66b to measure the resistance R and starts an operation for continuously (for example, periodically) acquiring the detection data DD from the resistance sensor 66b.

[0066] In step S13, the processor 68 determines whether the first input device 58 has received an input operation for transmitting the manual laser emission command CM1. The processor 68 determines YES if the first input device 58 has received the operator's input operation and proceeds to step S14, and proceeds to step S20 if it determines NO.

[0067] In step S14, the processor 68 determines whether the manual drive mode DM1 is selected by the mode selection switch 48 (that is, whether the condition CD1 is satisfied), similarly to the above-described step S1. If it determines YES, the processor 68 proceeds to step S15; conversely, if it determines NO (that is, the mode selection switch 48 is switched to the automatic drive mode DM2 and the condition CD1 is not satisfied), the processor 68 proceeds to step S18.

[0068] In step S15, the processor 68 determines whether the laser processing head 64 is in contact with the workpiece W (that is, whether the condition CD2 is satisfied). Specifically, the processor 68 determines whether contact between the laser processing head 64 and the workpiece W has been detected by the contact detection device 66 based on the most recent detection data DD acquired by the resistance sensor 66b.

[0069] If contact between the laser processing head 64 and the workpiece W has been detected, the processor 68 determines YES and proceeds to step S16. Conversely, if no contact between the laser processing head 64 and the workpiece W has been detected (that is, if condition CD2 is not met), the processor determines NO and proceeds to step S19.

[0070] In step S16, the processor 68 allows the sending of the manual laser emission command CM1 to the controller 18 through the first input device 58. More specifically, the processor 68 functions as the command inhibit unit 74 and actuates the inhibit circuit 78 to close the switch 78a, as shown in Fig. 10 illustrates.

[0071] This allows the first input device 58 to send the manual laser emission command CM1 to the controller 18 via the communication line 76 in response to the operator's input operation received in step S13. The processor 36 of the controller 18 executes the laser emission operation LO in response to the manual laser emission command CM1 from the first input device 58, and as a result, the laser beam LB is emitted from the emission port 52a of the laser processing head 64. Thus, the operator can manually perform a laser process on the workpiece W.

[0072] In step S17, the processor 68 determines whether or not an operation termination command is received from the controller 18. If the operation termination command is received, the processor 68 determines YES and ends the flow of step S2, thereby Fig. 11 is terminated. If, however, NO is determined, the processor 68 returns to step S13. If YES is determined in step S17, the processor 68 may function as the command inhibit unit 74 and actuate the inhibit circuit 78 to open the switch 78a.

[0073] On the other hand, if NO is determined in step S14, the processor 68 disables the manual laser emission command CM1 sent from the first input device 58 to the controller 18 in step S18. More specifically, the processor 68 functions as the command disabling unit 74 and actuates the disabling circuit 78 to open the switch 78a, as shown in Fig. 9 illustrates.

[0074] As a result, the manual laser emission command CM1 sent from the first input device 58 to the controller 18 is disabled, and the processor 36 of the controller 18 does not execute the laser emission operation LO. After step S18, the processor 68 of the laser processing head 64 proceeds to step S3 in Fig. 11 over.

[0075] On the other hand, if NO is determined in step S15, the processor 68 functions as the command disabling unit 74 in step S19, similarly to the above-described step S18, and disables the manual laser emission command CM1 sent from the first input device 58 to the controller 18. Then, the processor 68 returns to step S13.

[0076] If NO is determined in step S13, the processor 68 determines in step S20 whether the manual drive mode DM1 has been selected by the mode selection switch 48 or not, similarly to the above-described step S14. The processor 68 proceeds to step S17 if it determines YES, and proceeds to step S3 in Fig. 11 if he decides NO.

[0077] Therefore, since the processor 68 determines YES in steps S13 to S15 and NO in step S17, it allows the manual laser emission command CM1 to be continuously sent in step S16. This allows the operator to continue the manual laser process while performing an input operation on the first input device 58.

[0078] If, however, YES is determined in step S13 and NO is then determined in step S14 or S15, the processor 68 disables the manual laser emission command CM1 in step S18 or S19. As a result, the laser emission operation LO is prohibited in the manual drive mode DM1.

[0079] With reference again to Fig. 11, the processor 68, if it has determined NO in step S1 (alternatively after determining NO in step S20 in Fig. 12 or after the execution of step S18), the flow of the automatic drive mode DM2 in step S3. This step S3 is described with reference to Fig. 13. At the start time of step S3, the processor 68 may open the switch 78a of the blocking circuit 78, as shown in Fig. 9 illustrates.

[0080] After starting step S3, the processor 68 sends a command CM5 to switch to the automatic drive mode to the controller 18 in step S21. After receiving the command CM5 to switch to the automatic drive mode, the processor 36 ( Fig. 2) of the controller 18 switches the drive mode DM to the automatic drive mode DM2. In step S21, the mode selection switch 48 may transmit the command CM5 to switch to the automatic drive mode to the controller 18. The command CM5 to switch to the automatic drive mode may be an OFF signal (or "0" signal).

[0081] After switching to the automatic drive mode DM2, the processor 36 of the controller 18 is placed in a state capable of receiving the automatic drive start command CM4 and rejects the manual laser emission command CM1 from the laser processing head 64. For example, after receiving the automatic drive start command CM4 from the operator via the input device 44, the processor 36 automatically executes the laser emission operation LO and the movement operation MO in the automatic drive mode DM2 according to the processing program PG1.

[0082] In step S22, the processor 68 starts an operation to detect the distance d measured by the distance measuring sensor 62. More specifically, the processor 68 operates the distance measuring sensor 62 to continuously (e.g., periodically) measure the distance d between the laser processing head 64 and the workpiece W. The processor 68 continuously (e.g., periodically) detects the distance d measured by the distance measuring sensor 62.

[0083] In step S23, the processor 68 determines whether the most recent distance d detected by the distance measuring sensor 62 is within the previously set allowable range RG or not. For example, the allowable range RG may be defined as a range of d ≤ d th (for example d th = 3 [mm]), or can be defined as a range of [d th1 , d th2 ] (for example d th1 = 0.1 [mm], dt h2 = 3 [mm]) (that is, d th1 ≤ d ≤ d th2). If the distance d is within the allowable range RG, the processor 68 determines YES and proceeds to step S25. If, however, the distance d is outside the allowable range RG, the processor 68 determines NO and proceeds to step S24.

[0084] In step S24, the processor 68 sends a laser emission prohibition command CM6 to the controller 18. The laser emission prohibition command CM6 is a command to prohibit the processor 36 of the controller 18 from performing the laser emission operation LO in the automatic drive mode DM2. After receiving the laser emission prohibition command CM6, the processor 36 of the controller 18 stops (or does not start) the laser emission operation LO in the automatic drive mode DM1.

[0085] As described above, in the present embodiment, the processor 68 of the laser processing head 64 functions as the command transmission unit 80 ( Fig. 7), which sends the laser emission prohibition command CM6 to the controller 18. The laser emission prohibition command CM6 can be an OFF signal (or "0" signal).

[0086] After step S24, the processor 68 returns to step S23. Therefore, if the processor 68 determines NO in step S23, it sends the laser emission prohibition command CM6 in step S24, thereby prohibiting the controller 18 from executing the laser emission operation LO in the automatic drive mode DM2.

[0087] On the other hand, if the processor 68 determines YES in step S23, it functions as the command sending unit 80 in step S25 and sends a laser emission permission command CM7 to the controller 18. The laser emission permission command CM7 is a command that allows the processor 36 of the controller 18 to execute the laser emission operation LO in the automatic drive mode DM2.

[0088] After receiving the laser emission permission command CM7, the processor 36 of the controller 18 can execute the laser emission operation LO in the automatic drive mode DM1 in response to the automatic drive start command CM4. The laser emission permission command CM7 can be an ON signal (or a "1" signal).

[0089] In step S26, the processor 68 determines whether the manual drive mode DM1 has been selected by the mode selection switch 48, similar to step S14 described above. The processor 68 proceeds to step S28 if it determines YES, and proceeds to step S27 if it determines NO.

[0090] In step S27, the processor 68 determines whether an operation termination command has been received or not, similarly to step S17 described above. If YES, the processor 68 ends the flow of step S3 and thus ends the Fig. 11. If NO is determined, the processor 68 returns to step S23.

[0091] If, however, YES is determined in step S26, the processor 68 sends the laser emission prohibition command CM6 to the controller 18 in step S28, similar to the above-described step S24. Then, the processor 68 goes to step S2 in Fig. 11 over.

[0092] As described above, in the present embodiment, the laser processing head 64 further includes the command inhibition unit 74 that inhibits the manual laser emission command CM1 sent from the first input device 58 to the controller 18 when the condition CD (CD1 or CD2) for executing the laser emission operation LO in the manual drive mode DM1 is not satisfied (that is, when NO is determined in step S14 or S15).

[0093] According to this configuration, when the condition CD for ensuring operator safety in manual drive mode DM1 is not met, it is possible to prohibit the laser beam LB from being emitted from the laser processing head 64 by disabling the manual laser emission command CM1. This can reliably ensure operator safety in manual drive mode DM1.

[0094] In the present embodiment, the laser processing head 64 further includes the mode selection switch 48 capable of selecting the manual drive mode DM1 or the automatic drive mode DM2. The condition CD includes the first condition CD1 that the manual drive mode DM1 is selected by the mode selection switch 48.

[0095] If the manual operation mode DM1 is not selected by the mode selection switch 48 (NO is determined in step S14), the command inhibit unit 74 inhibits the manual laser emission command CM1 (step S18). According to this configuration, in order to perform a laser process in the manual operation mode DM, the operator is required to manually switch the mode selection switch 48 to the manual operation mode DM1. Therefore, inadvertent execution of the laser emission operation LO in the manual drive mode DM can be avoided.

[0096] In the present embodiment, the laser processing head 64 further includes the contact detection device 66 that detects contact or non-contact between the laser processing head 64 and the workpiece W. The condition CD includes the second condition CD2 that the laser processing head 64 is in contact with the workpiece W. On the other hand, if non-contact is detected by the contact detection device 66 (when determined to be NO in step S15), the command inhibition unit 74 inhibits the manual laser emission command CM1 (step S19).

[0097] According to this configuration, when the laser emission operation LO is performed in the manual drive mode DM, the laser processing head 64 is separated from the workpiece W, and the laser beam LB can be prevented from being emitted from the laser processing head 64 in an unintended direction (for example, toward the operator). This can more reliably ensure the safety of the operator in the manual drive mode DM1.

[0098] In the present embodiment, the contact detection device 66 includes the conductive cable 66a that electrically connects the laser processing head 64 and the workpiece W, and the resistance sensor 66b that measures the resistance R of the workpiece W, the laser processing head 64 in contact with the workpiece W, and the closed circuit 70 formed by the conductive cable 66a.

[0099] Thus, the contact detection device 66 is configured to detect the contact or non-contact between the laser processing head 64 and the workpiece W based on the resistance R measured by the resistance sensor 66b. According to this configuration, the contact or non-contact between the laser processing head 64 and the workpiece W can be detected quickly and reliably with a relatively simple configuration.

[0100] In the present embodiment, the laser processing head 64 further includes the command transmission unit 80 that transmits the laser emission prohibition command CM6 to the controller 18 to cause the controller 18 to prohibit the laser emission operation LO in the automatic drive mode DM2 when the distance d measured by the distance measuring sensor 62 is outside the previously set allowable range RG (that is, when NO is determined in step S23).

[0101] According to this configuration, if the workpiece W is not in a suitable position relative to the laser processing head 64 at the time of executing the laser emission operation LO in the automatic drive mode DM2, the laser emission operation LO can be prohibited. This can increase the safety of the laser processing work performed in the automatic drive mode DM2.

[0102] The mode selection switch 48 may be omitted from the laser processing head 64, and the mode selection switch 48 may be - as shown in Fig. 1 illustrated embodiment - be provided on the controller 18. The contact detection device 66 may be omitted from the laser processing head 64. In this case, steps S15 and S19 may be omitted from the Fig. 12 may be omitted. Note that the contact detection device 66 is not limited to the form including the conductive cable 66a and the resistance sensor 66b, but may include any sensor, such as a proximity sensor, capable of detecting contact between the laser processing head 64 and the workpiece W.

[0103] The command transmission unit 80 may be omitted from the laser processing head 64. In this case, the processor 68 (alternatively, the distance measurement sensor 62) of the laser processing head 64 may transmit measurement data of the distance d measured by the distance measurement sensor 62 to the controller 18. Then, based on the measurement data, the processor 36 of the controller 18 may determine whether or not the laser emission operation LO can be performed in the automatic drive mode DM2.

[0104] The processor 36 of the controller 18 can continuously (for example, periodically) acquire the measurement data of the distance d from the distance measurement sensor 62 while executing the laser emission operation LO and the movement operation MO in the automatic drive mode DM2. Then, based on the acquired measurement data, the processor 36 can execute gap control to control the distance d between the laser processing head 14 and the workpiece W to a predetermined target distance d0. The target distance d0 can be determined in advance as a value within the above-described allowable range RG.

[0105] Next, a laser processing head 84 according to another embodiment will be described with reference to Fig. 14. The laser processing head 84 can be used instead of the above-described laser processing head 64 in the laser processing system 10. The laser processing head 84 differs in that it also includes the above-described laser processing head 64 and a timing unit 86. The timing unit 86 is integrated into the head body 50 together with, for example, the processor 68 and the resistance sensor 66b and measures the elapsed time t from a certain point in time.

[0106] Next, the step S2 executed by the laser processing head 84 will be described with reference to Fig. 15. The processor 68 of the laser processing head 84 executes the Fig. 15 shown flow as step S2 in Fig. 11. It should be noted that in the Fig. 15 shown flow processes that are similar to those in the Fig. 12 are designated by the same step numbers, and redundant description is omitted.

[0107] Here, in the present embodiment, the processor 68 sets in advance a standby time t th from a time t0 at which non-contact between the laser processing head 84 and the workpiece W is detected by the contact detection device 66 (that is, NO is determined in step S15) to the time at which the manual laser emission command CM1 is inhibited in step S19.

[0108] For example, the operator actuates the input device 44 of the controller 18 to set the standby time t th to enter (for example t th = 0.4 [s]). The processor 68 receives the standby time t th from the controller 18 and registers setting information of the standby time t thin a register that is integrated, for example, in the processor 68.

[0109] It should be noted that the laser processing head 84 may also include a memory (ROM, RAM or the like) and that the processor 68 may store setting information of the standby time t th in the memory. In this way, the processor 68 sets the standby time t th in advance. Therefore, the processor 68 functions as a standby time setting unit 82 ( Fig. 14), which determines the standby time t th sets.

[0110] In the Fig. In step S2 shown in FIG. 15, if the processor 68 determines NO in step S15, it starts measuring the elapsed time t in step S31. More specifically, the processor 68 activates the time measuring unit 86 to start measuring the elapsed time t from a time t0 at which NO is determined in step S15.

[0111] In step S32, the processor 68 determines whether the elapsed time t measured by the time measuring unit 86 is a preset standby time t th has been reached or not (that is, t ≥ t th ). If t ≥ t th , the processor determines YES and proceeds to step S19. However, if t < t th the processor 68 determines NO and proceeds to step S33.

[0112] In step S33, the processor 68 determines whether contact between the laser processing head 84 and the workpiece W has been detected by the contact detection device 66, similar to the above-described step S15. The processor 68 returns to step S13 if it determines YES, and on the other hand, returns to step S32 if it determines NO (that is, if the laser processing head 84 and the workpiece W still do not make contact with each other).

[0113] The technical meaning of steps S31 to S33 is described below. Once the processor 68 permits the transmission of the manual laser emission command CM1 in step S16, the processor 36 of the controller 18 executes the laser emission operation LO in the manual drive mode DM1. If NO is determined in step S15 during the execution of the laser emission operation LO (i.e., while the determination of YES in step S13 continues), the processor 68 executes step S19 only when the standby time t th has elapsed from the time t0 at which NO was determined in step S15 (that is, until YES is determined in step S32) (in other words, the laser emission operation LO is continued).

[0114] Then, if NO is continuously determined in step S33 before the standby time t th has elapsed (that is, if over the period t thcontinuously no contact between the laser processing head 84 and the workpiece W is detected), the processor 68 as the command inhibition unit 74 executes step S19 and consequently prohibits the laser emission operation LO.

[0115] As described above, in the present embodiment, the laser processing head 84 further includes the standby time setting unit 82 which sets the standby time t th from the time t0 at which the non-contact is detected by the contact detection device 66 when the controller 18 executes the laser emission operation LO in the manual drive mode DM1 (determined as NO in step S15) to the time at which the command inhibition unit 74 inhibits the manual laser emission command CM1 (that is, step S19 is executed).

[0116] Then, when the standby time t set by the standby time setting unit 82 thhas elapsed from time t0 (determined as YES in step S32), the command inhibition unit 74 inhibits the manual laser emission command CM1 (step S19). Here, in the manual drive mode DM1, the operator can perform the laser process with the laser beam LB emitted from the laser processing head 84 while moving the laser processing head 84 toward the workpiece W, thus bringing the tip end of the laser processing head 84 into contact with the workpiece W.

[0117] In this case, the laser processing head 84 may be separated from the workpiece W for a moment (for example, only 0.3 [s]), for example, by an uneven part on the surface of the workpiece W. Even if the laser processing head 84 is separated from the workpiece W for a moment in this way, the possibility of the laser beam LB being emitted from the laser processing head 84 toward the operator is low, so that the safety of the operator can be ensured.

[0118] According to the present embodiment, by setting the standby time t th Until the time when the manual laser emission command CM1 is disabled in step S19, the laser emission operation LO can be continued even if the above-described momentary separation of the laser processing head 84 from the workpiece W occurs. On the other hand, if even after the elapse of the standby time t thIf no contact is determined between the laser processing head 84 and the workpiece W, the laser emission operation LO can be prohibited by immediately executing step S19. Therefore, according to the present embodiment, laser processing can be performed efficiently, and operator safety can be reliably ensured.

[0119] It should be noted that the processor 68 Fig. 11 according to a computer program PG2. The computer program PG2 may be stored in a memory (ROM, RAM, and the like) integrated into the laser processing head 14, 64, or 84. The functions of the command inhibit unit 74, the command transmitting unit 80, and the standby time setting unit 82, which are executed by the processor 68, may be functional modules implemented by the computer program PG2.

[0120] It should be noted that the Fig. 5 illustrated first input device 58' may be attached to the laser processing head 64 or 84. The processor 68 may Fig. 11 and drive the lens drive unit described above. The timing unit 86 may be omitted from the laser processing head 84. In this case, the timing unit 86 may be provided on the controller 18, and the processor 68 may acquire the information about the elapsed time t from the timing unit 86 of the controller 18. The light guide path 34 may be omitted from the laser processing system 10. In this case, the laser oscillator 16 may be directly coupled to the laser processing head 14, 14', 64, or 84.

[0121] It should be noted that the laser processing head 14, 14', 64, or 84 can be any type of device, for example, a laser scanner (alternatively, a galvanometer scanner). The laser scanner includes a plurality of mirrors, each reflecting the laser beam LB supplied from the laser oscillator 16, a plurality of mirror drive units that individually drive the plurality of mirrors, and an optical lens that collects the laser beams reflected by the mirrors. By changing the directions of the plurality of mirrors through the mirror drive unit, the laser scanner can move an irradiation spot of the laser beam LB, with which the workpiece W is irradiated, at high speed on the surface of the workpiece W.

[0122] The robot 12 is not limited to the vertical articulated robot and may be, for example, a horizontal articulated robot or a parallel robot, and may be configured to have first and second ball screw mechanisms that move the workpiece W in a horizontal plane and a third ball screw mechanism that moves the laser processing head 14, 14', 64 or 84 in the vertical direction.

[0123] The controller 18 may include a first controller 18A that controls the movement operation MO of the robot 12 and a second controller 18B that controls the laser emission operation LO of the laser oscillator 16. Although the present disclosure has been described above with reference to the embodiments, the above-described embodiments do not limit the scope of the invention claimed in the claims. List of reference symbols 10 Laser processing system 12 robots 14, 14', 64, 84 laser processing head 16 laser oscillator 18 controllers 36, 68 processor 48 mode selection switch 54 Installation tool 56 handle 58, 58' First input device 60 Second input device 62 Distance measurement sensor 66 Contact detection device 70 Closed circuit 74 Command Blocking Unit 80 Command sending unit 82 Standby time setting unit QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP 2000-52076 A

[0002] JP 2000-24787 A

[0002]

Claims

[1] A laser processing head (14, 14', 64, 84) capable of performing a laser emission operation in a manual drive mode in which a controller (18) performs a laser emission operation according to a manual laser emission command, and an automatic drive mode in which the controller (18) automatically performs a laser emission operation according to a processing program, the laser processing head (14, 14', 64, 84) comprising: a first input device (58, 58') configured to receive an input operation to send the manual laser emission command to the controller (18); and a distance measuring sensor (62) configured to measure a distance between the laser processing head (14, 14', 64, 84) and a workpiece (W) when the controller (18) performs the laser emission operation in the automatic drive mode. [2] Laser processing head (14, 14', 64, 84) according to claim 1, wherein the first input device (58, 58') comprises: a push button (58), a switch (58) or a touch screen (58) on which an operator can perform an input operation with one hand, or a foot pedal (58') or a foot switch (58') on which an operator can perform an input operation with a foot. [3] The laser processing head (14, 14', 64, 84) according to claim 1 or 2, further comprising a second input device (60) configured to receive an input operation to send a manual gas emission command for emitting an auxiliary gas. [4] The laser processing head (64, 84) according to any one of claims 1 to 3, further comprising a command inhibiting unit (74) configured to inhibit the manual laser emission command sent from the first input device (58) to the controller (18) when a condition for performing the laser emission operation in the manual drive mode is not satisfied. [5] Laser processing head (64, 84) according to claim 4, further comprising a mode selection switch (48) with which the manual drive mode or the automatic drive mode can be selected, wherein the condition comprises a first condition that the manual drive mode is selected by the mode selection switch (48), and wherein the command inhibit unit (74) is configured to inhibit the manual laser emission command when the manual drive mode is not selected by the mode selection switch (48). [6] Laser processing head (64, 84) according to claim 4 or 5, further comprising a contact detection device (66) adapted to detect contact or non-contact between the laser processing head (64, 84) and the workpiece (W), wherein the condition comprises a second condition that the laser processing head (64, 84) is in contact with the workpiece (W), and wherein the command inhibit unit (74) is configured to inhibit the manual laser emission command when the non-contact is detected by the contact detection device (66). [7] Laser processing head (64, 84) according to claim 6, wherein the contact detection device (66) comprises: a conductive cable (66a) electrically connecting the laser processing head (64, 84) and the workpiece (W); and a resistance sensor (66b) configured to measure the resistance of a closed circuit formed by the workpiece (W), the laser processing head (64, 84) in contact with the workpiece (W) and the conductive cable (66a), wherein the contact detection device is configured to detect the contact or non-contact based on the resistance measured by the resistance sensor (66b). [8] The laser processing head (84) according to claim 6 or 7, further comprising a standby time setting unit (82) configured to set a standby time from a time point at which the non-contact is detected by the contact detection device (66) when the controller performs the laser emission operation in the manual drive mode to the time point at which the command inhibiting unit (74) is to inhibit the manual laser emission command, wherein the command inhibiting unit (74) is configured to inhibit the manual laser emission command when the standby time set by the standby time setting unit (82) has elapsed from the time point. [9] The laser processing head (64, 84) according to any one of claims 1 to 8, further comprising a command transmission unit (80) configured to transmit a laser emission prohibition command to the controller (18) to prohibit the controller (18) from performing the laser emission operation in the automatic drive mode when the distance measured by the distance measuring sensor (62) is outside a predetermined allowable range. [10] Laser processing head (14, 64, 84) according to one of claims 1 to 9, further comprising: an attachment tool (54) removably attached to a robot (12) configured to move the laser processing head (14, 64, 84); and a handle (56) which can be gripped by an operator with one hand, wherein the first input device (58) is provided adjacent to the handle (56) so that the one hand grasping the handle (56) can perform the input operation. [11] Laser processing system (10) comprising: a robot (12); the laser processing head (14, 14', 64, 84) according to any one of claims 1 to 10, wherein the laser processing head is removably attached to the robot (12); and the controller (18) configured to perform the laser emission operation in the manual drive mode and the laser emission operation in the automatic drive mode.

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