Device for detecting abnormal signals using a dual sound wave sensor

Abstract

The present application relates to an abnormal signal detection device using a dual acoustic wave sensor. The abnormal signal detection device using a dual acoustic wave sensor comprises: a housing including a first acoustic wave transmission section and a second acoustic wave transmission section; a base substrate located within the housing and including a first side and a second side; a first acoustic wave sensor mounted on the first side and converting a sound wave in a first band into a first electrical signal;a second acoustic wave sensor mounted on the second side and converting a acoustic wave in a second band into a second electrical signal, the second band including an overlapping band that at least partially overlaps with the first band and has an intermediate frequency band corresponding to a frequency band lower than an intermediate frequency band of the first band; a signal combining unit that generates a combined signal in which the first electrical signal and the second electrical signal are combined; and a determining unit that determines whether an abnormality exists.

Description

[Technical field of the invention]

[0001] The present invention relates to an abnormal signal detection apparatus using a dual acoustic wave sensor, and more particularly to an abnormal signal detection apparatus using two acoustic wave sensors having different frequency bands to be detected. [Technical background of the invention]

[0002] Recently, predictive maintenance devices have been introduced that analyze information such as ultrasonic waves, vibrations, etc., to predict or detect equipment failures in advance. Devices that analyze sound wave signals, such as ultrasonic waves generated by equipment, typically use a method of converting sound wave signals into electrical signals using devices such as MEMS microphones or condenser microphones.

[0003] However, to achieve higher accuracy, it is sometimes necessary to detect sound wave signals in a wider frequency band. In such cases, the problem is that when using a single sound wave sensor, the frequency band that can ensure high sensitivity is limited. Therefore, the sensitivity in some low-frequency or high-frequency bands may be relatively low, and low-strength signals may not be received normally.

[0004] Therefore, there is an increasing demand for devices that can receive sound waves in a wider frequency band, but are simple in design and can easily process signals. [State of the art literature]

[0005] (Patent Document 1) Korean Patent Publication No. 10-2392951 (April 27, 2022) [Content of the invention][Object of the invention]

[0006] The object of the present invention is to provide an abnormal signal detection device that can receive sound waves in a wider frequency band, but is simple in structure and can easily process signals.

[0007] The other object of the present invention is to provide an abnormal signal detecting apparatus that can generate and analyze a single combined signal to determine whether there is an abnormality even when sound waves are received using a dual sound wave sensor. [Technical solution]

[0008] An abnormal signal detection device using a dual acoustic wave sensor according to a feature of the present invention comprises a housing including a first acoustic wave transmission section and a second acoustic wave transmission section, forming an internal space; a base substrate located within the housing and including a first side and a second side, the second side being arranged to oppose the first and second acoustic wave transmission sections; a first acoustic wave sensor mounted on the first side and converting a sound wave in a first band, introduced into the internal space through the first acoustic wave transmission section, into a first electrical signal;a second sound wave sensor mounted on the second side and facing the second sound wave transmission section, thereby converting a sound wave in a second band introduced into the interior space through the second sound wave transmission section into a second electrical signal. The second band includes an overlapping band that at least partially overlaps the first band, and the intermediate frequency band of the second band corresponds to a frequency band lower than the intermediate frequency band of the first band; a signal combining unit coupled to the base substrate and generating a combination signal that combines the first electrical signal and the second electrical signal. The information of the overlapping band of the combination signal corresponds to a signal in which the first electrical signal and the second electrical signal overlap.and a determination unit that compares the combination signal with learning data stored in a database and thereby determines whether there is an abnormality - the learning data includes abnormal signal data and normal signal data - wherein the information of the overlapping band of the learning data corresponds to a signal in which the first learning signal of the first band and the second learning signal of the second band are overlapped.;

[0009] The abnormal signal detection apparatus using a dual acoustic wave sensor according to the feature may further comprise a shield case coupled to the base substrate and covering the first acoustic wave sensor.

[0010] The shielding housing can be arranged at a distance from the housing.

[0011] The shielding housing may have a plurality of openings formed on the top.

[0012] The first sound wave sensor can be a MEMS microphone.

[0013] The MEMS microphone may include a microphone substrate coupled to the base substrate and having an acoustic hole formed therein, a transducer mounted on the microphone, and a cover member coupled to the microphone substrate and accommodating the transducer therein, wherein the base substrate may have an acoustic inlet hole formed corresponding to the acoustic hole.

[0014] The second sound wave sensor may be a piezoelectric element.

[0015] The second sound wave transmission portion may be in contact with the detection surface of the piezoelectric element and formed separately from the portion of the housing surrounding the second sound wave transmission portion.

[0016] The signal combination unit can be mounted on the first side.

[0017] The first sound wave sensor may include a plurality of MEMS microphones spaced apart from each other.

[0018] The abnormal signal detection apparatus using a dual acoustic wave sensor according to the feature may further comprise a shield case coupled to the base substrate and covering the first acoustic wave sensor, and wherein the plurality of MEMS microphones may be covered by the shield case. [Effects of the invention]

[0019] According to the abnormal signal detection device using the dual acoustic wave sensor of the present invention, there is an advantage that an abnormal signal detection device can be provided that receives acoustic waves of a wider frequency band while having a simple structure and simple signal processing.

[0020] Furthermore, according to the abnormal signal detection device using the dual sound wave sensor of the present invention, there is an advantage in that even when sound waves are received using the dual sound wave sensor, an abnormal signal detection device can be provided that can generate a single combined signal and analyze it to determine whether there is an abnormality. [Brief description of the drawings] Fig. 1 is a block diagram of an abnormal signal detection apparatus according to an embodiment of the present invention. Fig. 2 is a cross-sectional drawing of the abnormal signal detecting apparatus according to an embodiment of the present invention. Fig. 3 is a drawing illustrating a cross section of a first acoustic wave sensor according to an embodiment of the present invention. Fig. 4 is a drawing illustrating one side of the abnormal signal detecting apparatus according to an embodiment of the present invention. Fig. 5 is a drawing illustrating another side of the abnormal signal detecting apparatus according to an embodiment of the present invention. Fig. 6 is a diagram illustrating first and second electrical signals and a combined signal generated by the abnormal signal detecting apparatus according to an embodiment of the present invention. [Embodiments of the invention]

[0021] The embodiments disclosed in this specification will be described in detail below with reference to the accompanying figures. Regardless of the figure symbols, identical or similar components are given the same reference numerals, and repetitive descriptions thereof are omitted. Furthermore, in describing the embodiments disclosed in this specification, detailed descriptions are omitted when it is determined that a detailed description of a related known technology might obscure the essence of the embodiments disclosed in this specification.

[0022] Terms containing ordinal numbers such as first, second, etc., may be used to describe different components, but the components mentioned above are not limited by the above conditions. The above terms serve solely to distinguish the individual components from one another.

[0023] Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0024] In this application, each step described may be performed independently of the order listed, except in cases where it must be performed in the order listed due to a particular causal relationship.

[0025] Throughout this application, terms such as "comprises" or "comprising" are intended to indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0026] Specific embodiments of the present invention will now be described with reference to the accompanying drawings.

[0027] Fig. 1 is a block diagram of an abnormal signal detection apparatus according to an embodiment of the present invention. Fig. 2 is a cross-sectional drawing of the abnormal signal detecting apparatus according to an embodiment of the present invention.

[0028] The abnormal signal detection device using the dual acoustic wave sensor of the present invention includes a housing 600, a base substrate 300, a first acoustic wave sensor 100, a second acoustic wave sensor 200, a signal combining unit 400, and a determining unit 500.

[0029] The housing 600 is a structure that forms an interior space. The housing 600 may include a first side and a second side. For example, if the housing 600 is shaped as a hexahedron, the first side and the second side may be two facing each other.

[0030] The housing 600 includes a first sound wave transmission section 610 and a second sound wave transmission section 620. The first and second sound wave transmission sections 620 are structures configured to transmit sound waves generated outside the housing 600 into the interior of the housing 600. The sound wave transmission section can be formed, for example, by a diaphragm or a vibration transmission plate.

[0031] The housing 600 may include a first side and a second side. For simplicity, based on Fig. 2, the upper side of the housing 600 is referred to as the first side and the lower side as the second side.

[0032] The first sound wave transmission section 610 may be formed on the second side of the housing 600. The first sound wave transmission section 610 may be formed as an opening. Therefore, the first sound wave transmission section 610 may transmit sound waves introduced from the second side into the interior space through the opening. Of course, the first sound wave transmission section 610 may transmit not only sound waves introduced from the second side but also sound waves introduced from other directions into the interior space, but it may transmit more sound waves introduced from the second side.

[0033] The second sound wave transmission section 620 may be formed on the second side of the housing 600. The second sound wave transmission section 620 may be formed as a vibration transmission plate. Therefore, the second sound wave transmission section 610 may transmit vibrations generated by sound waves introduced from the second side direction to the sound wave sensor. Of course, the second sound wave transmission section 620 may transmit not only sound waves introduced from the second side direction but also sound waves introduced from other directions to the sound wave sensor, but it may also transmit more sound waves introduced from the second side direction.

[0034] The second acoustic wave transmission portion 620 may be in contact with the detection surface of the second acoustic wave sensor 200 and may be formed separately from the portion of the housing 600 surrounding the second acoustic wave transmission portion 620. In some cases, a connecting contact element 621 may additionally be disposed between the second acoustic wave transmission portion 620 and the detection surface of the second acoustic wave sensor 200.

[0035] Because the second sound wave transmission section 620 is separated from the surrounding portion of the housing 600, it can more effectively vibrate itself and transmit the vibration to the second sound wave sensor 200. In some cases, the second sound wave transmission section 620 may maintain a predetermined distance from the surrounding part of the housing 600.

[0036] The first sound wave transmission section 610 and the second sound wave transmission section 620 may be arranged at a predetermined distance from each other on the same side of the housing 600.

[0037] The base substrate 300 is a circuit board located within the housing 600. The first acoustic wave sensor 100, the second acoustic wave sensor 200, the signal combining unit 400, the determination unit 500, and the shielding housing 150 can be coupled to the base substrate 300.

[0038] The base substrate 300 is formed as a printed circuit board in the shape of a flat plate and includes a first side 301 and a second side 302, which correspond to opposite sides. The second side 302 faces the first sound wave transmission section 610 and the second sound wave transmission section 620.

[0039] An acoustic inlet hole 305 corresponding to an acoustic hole 111 formed in a microphone substrate 110 of a first acoustic wave sensor 100 to be described later may be formed in the base substrate 300.

[0040] The first acoustic wave sensor 100 is mounted on the first side 301 of the base substrate 300. The first acoustic wave sensor 100 is arranged opposite the first acoustic wave transmission section 610 and can convert acoustic waves of the first band, which are introduced into the interior of the housing 600 through the first acoustic wave transmission section 610, into a first electrical signal.

[0041] The first sound wave sensor 100 may be a sound wave sensor suitable for receiving sound waves in a relatively high frequency band compared to the second sound wave sensor 200 described later. The first sound wave sensor 100 may be embodied as a MEMS microphone.

[0042] The first sound wave sensor 100 may include a plurality of MEMS microphones. Multiple MEMS microphones may be arranged to point in different directions, allowing them to pick up sound wave signals transmitted from multiple directions. Directional patterns can be achieved by using multiple MEMS microphones.

[0043] The second acoustic wave sensor 200 is mounted on the second side 302 of the base substrate 300. The second acoustic wave sensor 200 is arranged opposite the second acoustic wave transmission section 620 and can convert acoustic waves of the second band, which are introduced into the interior of the housing 600 through the second acoustic wave transmission section 620, into a second electrical signal.

[0044] The second acoustic wave sensor 200 may be an acoustic wave sensor suitable for receiving acoustic waves in a relatively low frequency band compared to the first acoustic wave sensor 100 described above. A piezoelectric element may be used as the second acoustic wave sensor 200 instead of a sensor designed exclusively for receiving acoustic waves. The piezoelectric element sensor offers the advantage of having greater sensitivity to low frequency bands compared to sensors designed exclusively for receiving acoustic waves, such as MEMS microphones. However, since the piezoelectric element sensor requires a larger mounting area than the MEMS microphone, it may be desirable to mount only one piezoelectric element sensor on the base substrate 300.

[0045] The second band may comprise an overlapping band that at least partially overlaps with the first band. And the intermediate frequency band of the first band may correspond to a higher frequency band than the intermediate frequency band of the second band.

[0046] The signal combining unit 400 is coupled to the base substrate 300 and generates a combined signal that combines the first electrical signal and the second electrical signal. Information of the overlapping band of the combined signal may correspond to a signal in which the first electrical signal and the second electrical signal overlap. If the overlapping band corresponds to both the first electrical signal and the second electrical signal but overlaps them without scaling, the absolute signal intensity may be relatively larger than that of the non-overlapping band. However, in the present invention, the purpose of the combined signal is not to analyze the absolute signal intensity in a specific band, but to determine whether an abnormality exists by analyzing the abnormal signal and the normal signal.Therefore, if the abnormal signal and the normal signal of the learning data to be compared have the same properties or types as the unscaled combined signal described above, they can be compared relatively to determine whether they are abnormal.

[0047] The determination unit 500 may be a component coupled to the base substrate 300 or a component that exists outside the housing 600 of the present invention and is connected to the signal combining unit 400 via a cable or network. The determination unit 500 compares the combined signal with the learning data stored in the database 510 to determine whether an abnormality exists. The learning data includes abnormal signal data and normal signal data. The overlapping band information of the learning data may correspond to a signal in which the first learning signal of the first band and the second learning signal of the second band overlap. This means that since the combined signal and the learning data signal have the same characteristics or types, it is possible to determine whether an abnormality exists through comparative analysis.

[0048] In relation to Fig. 2, the abnormal signal detecting apparatus of the present invention may further comprise a shielding case 150.

[0049] The shielding case 150 is a structure coupled to the base substrate 300 and covering the first acoustic wave sensor 100. The shielding case 150 is connected to the grounding portion of the base substrate 300 to shield an external magnetic field, allowing the first acoustic wave sensor 100 to generate a first electrical signal without magnetic field noise. The shielding case 150 may be spaced apart from the first side of the housing 600. The shielding case 150 may have a plurality of openings 151 formed on the top surface.

[0050] When the first acoustic wave sensor 100 includes a plurality of MEMS microphones, the plurality of MEMS microphones spaced apart from each other may all be housed so as to be covered by a shield case 150.

[0051] The structure of the first sound wave sensor 100 is described below using Fig. 3 described.

[0052] In particular, the first acoustic wave sensor 100 may be configured as a rear-mounted MEMS microphone. A rear-mounted MEMS microphone is a MEMS microphone with an acoustic hole facing downward relative to the mounting surface.

[0053] The rear-type MEMS microphone includes a microphone substrate 110, a transducer 120, and a cover member 110.

[0054] The microphone substrate 110 is a circuit board coupled to the base substrate 300. A signal transmission port is formed on the underside of the microphone substrate 110 so that an electrical signal generated by the transducer 120 can be transmitted to the base substrate 300.

[0055] An acoustic hole 111 may be formed in the microphone substrate 110, into which an acoustic signal detected by the transducer 120 is introduced. Furthermore, an acoustic inlet hole 305 may be formed in the base substrate 300, corresponding to an acoustic hole 111 formed in a microphone substrate 110 of a first acoustic wave sensor 100 to be described later. The acoustic signal introduced into the housing 600 through the first acoustic wave transmission section 610 passes through the acoustic inlet hole 305 and the acoustic hole 111 and is then detected by the transducer 120.

[0056] The cover part 130 is coupled to the microphone substrate 110 and houses a transducer 120 inside. The cover part 130 is designed as a metal can and is thereby coupled to the microphone substrate 110.

[0057] The mounting form of the base substrate is shown below using the Fig. 4 and Fig. 5 described.

[0058] As described above, the first acoustic wave sensor 100 and the signal combining unit 400 can be mounted on the first side 301 of the base substrate 300. Since the first acoustic wave sensor 100 occupies a relatively small mounting area compared to the second acoustic wave sensor 200, the signal combining unit 400 can be arranged on the first side 301.

[0059] The second acoustic wave sensor 200 can be mounted on the second side 302 of the base substrate 300. Since the second acoustic wave sensor 200 occupies a relatively large mounting area compared to the first acoustic wave sensor 100, the signal combining unit 400 can be arranged on the second side 302. And the second electrical signal generated by the second acoustic wave sensor 200 can be transmitted through the through-hole to the signal combining unit 400 on the first side 301.

[0060] The acoustic inlet hole 305 may be located in a corner portion of the second side 302 of the base substrate 300 where the second acoustic wave sensor 200 is not located. Specifically, the second acoustic wave sensor 200 may be circular, and the acoustic inlet hole 305 may be located in a space between the second acoustic wave sensor 200 and the corner of the base substrate 300.

[0061] Hereinafter, the first and second electrical signals and the combined signal generated by the abnormal signal detection device will be described with reference to Fig. 7 described.

[0062] The first electrical signal is a signal generated by receiving an acoustic signal of the first band. For example, the first band could be a frequency band of approximately 200 Hz or more.

[0063] The second electrical signal is a signal generated by receiving an acoustic signal of the second band. The second band could, for example, be a low-frequency band of approximately 300 Hz or less.

[0064] The first band and the second band may form an overlapping band. Because the first electrical signal and the second electrical signal corresponding to the overlapping band overlap to form a combined signal, the signal magnitude of the overlapping band may be larger than the signal magnitude of the surrounding bands.

[0065] However, comparing the learning data with the combined signal may not pose a problem in analyzing the combined signal and determining whether it is abnormal, because the signal of the overlapping band corresponds to the sum of the signals generated by the two sound wave sensors.

[0066] The technical features disclosed in each embodiment of the present invention are not limited to that embodiment, and unless incompatible with each other, the technical features disclosed in each embodiment can be combined and applied to various embodiments.

[0067] Therefore, the focus for each embodiment is on explaining the individual technical features. However, as long as the individual technical features are not incompatible with each other, they can be used in combination.

[0068] The present invention is not limited to the embodiments described above and the accompanying figures, and various modifications and variations are possible from the perspective of one skilled in the art to which the present invention relates. Therefore, the scope of the present invention should be defined not only by the claims of this specification, but also by equivalents of those claims. 100 First sound wave sensor 200 Second sound wave sensor 300 base substrate 400 signal combination unit 500 determination unit 600 housings QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] KR 10-2392951

[0005]

Claims

[1] An abnormal signal detection device using a dual sound wave sensor, comprising: A housing comprising a first sound wave transmission section and a second sound wave transmission section and forming an interior space; a base substrate located within the housing and including a first side and a second side, the second side being arranged to oppose the first and second sound wave transmitting portions; a first sound wave sensor mounted on the first side and converting a sound wave in a first band introduced into the interior space through the first sound wave transmission section into a first electrical signal; a second sound wave sensor mounted on the second side and facing the second sound wave transmission section, thereby converting a sound wave in a second band introduced into the interior space through the second sound wave transmission section into a second electrical signal - the second band includes an overlapping band at least partially overlapping with the first band, the intermediate frequency band of the second band corresponding to a frequency band lower than the intermediate frequency band of the first band -; a signal combining unit coupled to the base substrate and generating a combination signal combining the first electrical signal and the second electrical signal - the information of the overlapping band of the combination signal corresponds to a signal in which the first electrical signal and the second electrical signal are overlapped -; and a determination unit that compares the combination signal with learning data stored in a database and thereby determines whether an abnormality exists - the learning data includes abnormal signal data and normal signal data -, wherein the information of the overlapping band of the learning data corresponds to a signal in which the first learning signal of the first band and the second learning signal of the second band are overlapped. [2] The abnormal signal detection apparatus using a dual acoustic wave sensor according to claim 1, further comprising a shield case coupled to the base substrate and covering the first acoustic wave sensor. [3] An abnormal signal detecting apparatus using a dual acoustic wave sensor according to claim 2, wherein the shield case is arranged spaced apart from the housing. [4] An abnormal signal detecting apparatus using a dual acoustic wave sensor according to claim 2, wherein the shield case has a plurality of openings formed on the top surface. [5] An abnormal signal detection apparatus using a dual acoustic wave sensor according to claim 1, wherein the first acoustic wave sensor is a MEMS microphone. [6] An abnormal signal detection device using a dual acoustic wave sensor according to claim 5, wherein the MEMS microphone comprises: A microphone substrate coupled to the base substrate and having an acoustic hole formed therein; a transducer mounted on the microphone; and a cover part coupled to the microphone substrate and accommodating the transducer therein, wherein the base substrate has an acoustic inlet hole formed corresponding to the acoustic hole. [7] An abnormal signal detecting apparatus using a dual acoustic wave sensor according to claim 1, wherein the second acoustic wave sensor is a piezoelectric element. [8] An abnormal signal detecting apparatus using a dual acoustic wave sensor according to claim 7, wherein the second acoustic wave transmitting portion is in contact with the detection surface of the piezoelectric element and is formed separately from the portion of the casing surrounding the second acoustic wave transmitting portion. [9] An abnormal signal detecting apparatus using a dual acoustic wave sensor according to claim 1, wherein the signal combining unit is mounted on the first side. [10] An abnormal signal detection apparatus using a dual acoustic wave sensor according to claim 1, wherein the first acoustic wave sensor comprises a plurality of MEMS microphones spaced apart from each other. [11] An abnormal signal detection device using a dual acoustic wave sensor according to claim 10, further comprising a shielding housing coupled to the base substrate and covering the first sound wave sensor, and The multitude of MEMS microphones is covered by the shielding housing.

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