Adapter and semiconductor cooling device

Abstract

A technique disclosed in the specification of the present application is a technique that can be easily applied to an existing cooling structure to improve a cooling effect. An adapter relating to a technique disclosed in the specification of the present application is an adapter provided on a flow path of a cooling medium for cooling a semiconductor element, wherein the semiconductor element is connected to a pin fin projecting towards the flow path, the adapter has a recess corresponding to a shape of the pin fin, and the adapter is attached to the pin fin such that at least a portion of the pin fin is fitted into the recess in a side surface of the flow path.

Description

Technical field

[0001] A technique disclosed in the specification of the present application relates to a technique for cooling a semiconductor element. Background State of the art

[0002] In a semiconductor module, a semiconductor element, acting as a heat source, is bonded to a pin lamination, for example by soldering using an insulating material. The semiconductor module is then fixed to the encapsulation by a screw that passes through a screw hole in the semiconductor module and is screwed into a screw hole in the encapsulation.

[0003] A cooling medium inlet and outlet are provided on the encapsulation to allow a cooling medium to flow within it. In a flow path of the cooling medium formed by the cooling medium inlet and outlet, an opening in an upper surface is sealed by a lower surface (a surface in which the fin is formed) of the semiconductor module fixed to the encapsulation.

[0004] In a state where the semiconductor module and the encapsulation are connected, the semiconductor element in the semiconductor module overlaps the pin fin in a top view. The cooling medium enters the encapsulation from the cooling medium inlet and flows out through the cooling medium outlet.

[0005] Heat generated by the semiconductor element is conducted to the cooling medium via the pin fin. The semiconductor element is thus cooled.

[0006] In this scenario, because one side wall (side surface) of the coolant flow path is smooth and has low flow resistance, the coolant flow becomes concentrated and its velocity increases, even though the semiconductor element is not positioned in a location that overlaps this area in a top view. Consequently, the coolant flow rate decreases directly beneath the semiconductor element, resulting in a reduction in the heat dissipation efficiency of the semiconductor element.

[0007] In contrast, a technique for providing a convex shape on a side wall of a flow path is disclosed (see, for example, patent document 1). Furthermore, measures are described such that, for example, a pin blade is positioned close to a side wall of the flow path in order to sufficiently reduce the gap with the side wall (see, for example, patent document 2). State of the art documents Patent document(s) Patent document 1: International Publication No. 2022 / 163418 Patent document 2: Published Japanese patent application no. 2013-120897 Summary Problem to be solved by the invention

[0008] However, according to conventional techniques, a structure of a pin fin or cooler must be manufactured. Therefore, in some cases, such a technique cannot simply be applied to an existing pin fin or cooler.

[0009] A technique disclosed in the specification of the present application has therefore been developed taking into account the above problems and is a technique which can be easily applied to an existing cooling structure to improve a cooling effect. Means to solve the problem

[0010] An adapter according to a first aspect of a technique disclosed in the specification of the present application is an adapter provided on a flow path of a cooling medium for cooling a semiconductor element, wherein the semiconductor element is connected to a pin lamella projecting towards the flow path, the adapter has a recess corresponding to a shape of the pin lamella, and the adapter is attached to the pin lamella such that at least a part of the pin lamella is fitted into the recess in a side surface of the flow path. Effects of the invention

[0011] According to at least the first aspect of the technology disclosed in the specification of the present application, the adapter can be easily attached to an existing cooling structure and can improve a cooling effect.

[0012] These and other tasks, features, aspects and advantages of the technology disclosed in the specification of the present application will become more apparent from the detailed description below when considered in conjunction with the accompanying diagrams. Brief description of the drawings [ Fig. Figure 1] is a diagram that shows an example of a semiconductor module structure, which includes a pin fin and an enclosure structure as a cooler. [ Fig. 2] is a top view showing the encapsulation and the semiconductor module in Fig. 1 represents those that are connected to each other. [ Fig. Figure 3] is a diagram that presents an example of the structure of an adapter provided on a semiconductor cooling device, relating to one embodiment. [ Fig. Figure 4] is a diagram that shows an example of the structure of a semiconductor module to which the adapter is attached. [ Fig. Figure 5] is a top view showing an example of the structure of the semiconductor module to which the adapter is attached. Description of the embodiment(s)

[0013] Embodiments are described below with reference to the attached diagrams. Detailed features are also described below to explain a technique in its embodiment; however, these are merely illustrative examples, and therefore it is not always necessary that they are suitable for implementing the embodiment.

[0014] The diagrams are presented schematically; therefore, for the sake of clarity, some configurations are omitted or simplified. The relationships between the sizes and positions of configurations shown in the various diagrams are not necessarily exact but may be appropriately modified. For example, hatching may be shown in both planar and cross-sectional views to facilitate understanding of the embodiment.

[0015] In the following description, the same reference symbols are assigned to similar inventory elements in the diagrams, and the inventory elements that bear the same reference symbol have the same names and functions. Accordingly, the detailed description for them can be omitted in some cases to avoid repetition.

[0016] If the description in the specification of the present application contains a description of a particular component as "having", "containing" or "bearing", such a description does not indicate an exclusive expression that excludes the other component unless otherwise stated.

[0017] Even if the description in the specification of the present application mentions ordinal numbers such as "first" or "second", the terms are used to enable an understanding of embodiments, and therefore the embodiments are not restricted to a sequence caused by the ordinal numbers.

[0018] Even if the description in the specification of the present application uses terms indicating a specific position and direction, such as "top", "bottom", "left", "right", "side", "underside", "front" or "back", the terms are used to facilitate an understanding of the contents of embodiments for the sake of simplicity and are therefore not irrelevant to positions or directions in a practical embodiment.

[0019] For example, when the description in the specification of this application refers to an “upper surface of” or a “lower surface of”, these terms do not only encompass the upper surface or lower surface itself of a target component, but also specify where the other component is formed on an upper surface or lower surface of a target component. That is to say, for example, “B provided on an upper surface A” does not preclude a configuration in which the other component “C” is interposed between A and B. <Ausführungsform>

[0020] An adapter relating to the present embodiment is described below. For the sake of simplicity, a technique relating to a configuration of a semiconductor device known to the inventor is described first. <Konfiguration eines Adapters>

[0021] Fig. Figure 1 is a diagram illustrating an example of the structure of a semiconductor module featuring a pin fin and an enclosure structure acting as a cooler. The semiconductor module and the enclosure together are also referred to as a semiconductor cooling device. As shown in Fig. As shown in Figure 1, a semiconductor element 12, acting as a heat source, is bonded to a pin lamination 14 in a semiconductor module 10, for example by soldering using an insulating material. The pin lamination 14 is positioned so that it overlaps with the semiconductor element 12 in a top view and protrudes from a lower surface of the semiconductor module 10. The semiconductor element is, for example, a metal-oxide-semiconductor field-effect transistor (i.e., a MOSFET) or an insulated-gate bipolar transistor (i.e., an IGBT).

[0022] The semiconductor module 10 is fixed to the enclosure 20 by a screw 18 which passes through a screw hole 16 of the semiconductor module 10 and is screwed into a screw hole 26 of an enclosure 20.

[0023] An O-ring insert groove 22 is provided on a surface of the casing 20, which is connected to the semiconductor module 10. An opening 1002, surrounded by the O-ring insert groove 22, is also provided such that a flow path of a cooling medium is exposed from the opening 1002 and the flow path can be accessed. The casing 20 and the semiconductor module 10 are then connected, and an O-ring 24 is inserted into the O-ring insert groove 22.

[0024] A cooling medium inlet 28 and a cooling medium outlet 30, allowing the cooling medium to flow within the enclosure 20, are provided on the enclosure 20. In a flow path 1000 of the cooling medium formed by the cooling medium inlet 28 and the cooling medium outlet 30, the opening 1002 in an upper surface is sealed by a lower surface (a surface in which the fin is formed) of the semiconductor module 10 fixed to the enclosure 20.

[0025] Fig. Figure 2 is a top view showing the enclosure 20 and the semiconductor module 10 in Fig. 1, which are connected to each other. An arrow indicates the direction in which the cooling medium flows.

[0026] As in Fig. Figure 2 shows that, in the state in which the semiconductor module 10 and the enclosure 20 are connected, the semiconductor element 12 in the semiconductor module 10 overlaps with the pin lamella 14 in a top view. The cooling medium enters the enclosure 20 from the cooling medium inlet 28 and flows in such a way that it exits from the cooling medium outlet 30.

[0027] Heat generated by the semiconductor element 12 is conducted to the cooling medium via the pin lamella 14, which is inserted into the flux path. The semiconductor element 12 is thus cooled.

[0028] Here, since there is a region a and a region b in Fig. 2, which correspond to a side wall (side surface) of the flow path 1000 of the cooling medium, have no irregularity and exhibit low flow resistance, concentrate the flow of the cooling medium, and the flow velocity increases, even though the semiconductor element 12 is not positioned in a location that overlaps in this area in a top view. Then, the flow rate of the cooling medium immediately below the semiconductor element 12 decreases, and such a condition causes a reduction in the heat dissipation efficiency of the semiconductor element 12.

[0029] Fig. Figure 3 is a diagram illustrating an example of the structure of an adapter provided on a semiconductor cooling device relating to the present embodiment.

[0030] As in Fig. As shown by way of example in Figure 3, an adapter 32 is a rectangular parallelepiped having a height T, a thickness D, and a length L, and the height T is essentially equal to one pin length of the pin blade 14. Accordingly, the adapter 32 is simply positioned in one vertical direction. However, the shape of the adapter 32 is not limited to the rectangular parallelepiped. A depression 34 is formed in one side surface of the adapter 32. As shown in Fig. As shown in Figure 3, the depression can have an internal surface shape (a shape into which the pin blade 14 can be fitted) that corresponds to a shape of the pin blade 14.

[0031] The thickness D of the adapter 32 is essentially equal to a distance from the side wall of the flow path 1000 of the cooling medium to the pin fin 14 in the state in which the semiconductor module 10 and the casing 20 are connected.

[0032] The length L of the adapter 32 is set such that it covers an area where the semiconductor element 12 is arranged in the state in which the semiconductor module 10 and the casing 20 are connected.

[0033] Fig. Figure 4 is a diagram illustrating an example of the structure of the semiconductor module to which the adapter is attached. An arrow indicates the direction in which the cooling medium flows. As shown in Fig. As shown in Figure 4, the adapter 32 is attached to the pin fin 14 on both sides of the cooling medium flow path. The adapter 32 is attached in such a way that the recess 34 of the adapter 32 is in contact with a side surface of the pin fin 14 (part of the pin fin 14 is fitted to the inner surface of the recess 34 such that, for example, half of the circumference of the pin fin 14 is covered).

[0034] Fig. Figure 5 is a top view showing an example of the structure of the semiconductor module to which the adapter is attached. An arrow indicates the direction in which the cooling medium flows. As shown in Fig. As shown in Figure 5, the adapter 32 is attached to both side walls of the coolant flow path. The length L of the adapter 32 is set such that it covers the area where the semiconductor element 12 is located, that is, the adapter 32 is positioned on one side wall of the flow path 1000 at the same location as the semiconductor element 12.

[0035] In Fig. 4 and Fig. 5. The adapter 32 is provided on both sides of the side wall, but can also be provided on only one side wall.

[0036] Since the adapter is 32, as in Fig. 4 and Fig. As shown in Figure 5, the concentration of the cooling medium on the side wall of the flow path 1000, where the pin fin is not provided, can be prevented. Since the length L of the adapter 32 is set such that it covers the entire area where the semiconductor element 12 is located, a pressure drop of the cooling medium caused by a sharp reduction in the width of the cooling medium flow path 1000 can be reduced. This is effectively achieved by dividing and arranging the adapter 32 for each phase, for example, in a large inverter module that has UVW phases.

[0037] As in Fig. As shown in Figure 3, the adapter 32 has a recess 34 with a diameter equal to or smaller than the diameter of the pin fin 14, which has a columnar shape and a corresponding shape to the pin fin 14 along the side wall of the cooling medium flow path. However, if the pin fin 14 does not have the columnar shape, the recess 34 may have a shape conforming to an outer shape of the pin 14. The recess 34 may be deep enough to embed half the circumference of the pin fin 14.

[0038] As in Fig. As shown in Figure 3, the depression 34 can be formed along a direction of the length L of the adapter 34 such that the number and distance of it are the same as those of the pin lamellae 14.

[0039] As in Fig. As shown in Figure 4, when the pin lamella 14 is inserted into the recess 34 of the adapter 32, the adapter 32 is positioned in a flow direction of the cooling medium. Furthermore, when the semiconductor module 10, to which the adapter 32 is attached, is inserted into the enclosure 20, the pin lamella 14 and the adapter 32 are positioned and fixed in a top-to-bottom direction of the cooling medium flow path.

[0040] Accordingly, the structure for attaching adapter 32 does not need to be modified (for example, by providing an additional mounting bracket). Fig. 4 There are a total of two adapters 32 individually attached to wall surface sides on both sides parallel to the flow direction of the cooling medium.

[0041] The pin fin 14, located on the side wall side of the flow path, is positioned adjacent to the adapter 32 instead of the side wall because the adapter 32 is fixed in the flow path of the cooling medium. This increases the flow resistance in the adapter 32 and prevents a concentration of the flow on the side wall side of the flow path; consequently, the flow rate of the cooling medium directly under the semiconductor element increases. Thus, the cooling capacity can be improved without significantly altering the existing cooling structure.

[0042] For example, the material of adapter 32 is resin, metal or ceramic and is selected according to a temperature during use or a required resistance. <Wirkungen, die durch die vorstehend beschriebenen Ausführungsformen erzeugt werden>

[0043] Examples of effects produced by the foregoing embodiments are described below. It should be noted that the following description describes the effects based on the specific configurations exemplified in the foregoing embodiments; however, other specific configurations may be used instead of those shown in the specification of the present application, within the scope of producing similar effects. That is to say, in some cases, the following description describes only one of the related specific configurations as a representation, but the configuration described as the representation may be replaced by the other related specific configuration.

[0044] According to the embodiment described above, the adapter is the adapter 32, which is provided on the flow path 1000 of the cooling medium for cooling the semiconductor element 12. The semiconductor element 12 is connected to the pin lamella 14, which projects onto the flow path 1000. The adapter 32 has the recess 34, which corresponds to the shape of the pin lamella 14. The adapter 32 is attached to the pin lamella 14 such that at least a portion of the pin lamella 14 is fitted into the recess 34 in the side surface of the flow path 1000.

[0045] According to this configuration, the adapter can be easily attached to an existing cooling structure (the pin fin 14), and the cooling effect can be improved. Since the sink 34 is included, the adapter 32 can be easily positioned with respect to the pin fin 14 and further along the flow path of the cooling medium.

[0046] Even in a case where configurations other than those shown in the specification of the present application are suitably added to the configuration described above, that is to say, where configurations other than those shown in the specification of the present application, which are not referred to as configurations described above, are suitably added, similar effects can be produced.

[0047] According to the embodiment described above, the adapter has the same height as the pin blade 14 while attached to the pin blade 14. In such a configuration, the adapter 32 can be easily positioned vertically based on the pin blade 14.

[0048] According to the embodiment described above, the adapter is arranged such that it covers the side wall of the flow path 1000 at the position where the semiconductor element 12 is located, while attached to the pin lamella 14. According to such a configuration, a pressure drop of the cooling medium caused by a sharp reduction in the width of the cooling medium flow path 1000 can be reduced.

[0049] According to the embodiment described above, the semiconductor cooling device comprises the semiconductor module 10, to which the semiconductor element 12 is attached, and the enclosure 20 for cooling the semiconductor element 12. The semiconductor module 10 includes the pin fin 14, which, in a top view, overlaps the lower surface of the semiconductor element 12, and the adapter 32, which can be attached to the pin fin 14. The enclosure 20 includes the flow path 1000 for the cooling medium for cooling the semiconductor element 12 and the opening 1002, which provides access to the flow path 1000. The semiconductor module 10 guides the pin fin 14 into the flow path 1000 via the opening 1002. The adapter 32 has the recess 34, which corresponds to the shape of the pin fin 14.The adapter 32 is attached to the pin lamella 14 in such a way that at least part of the pin lamella 14 is fitted into the depression 34 in the side surface of the river track 1000, thereby fixing it to the river track 1000.

[0050] According to this configuration, since the adapter 32 is attached to the pin-type fin 14, an increase in the flow rate of the cooling medium on the side wall side of the flow path 1000 is prevented, and the cooling effect can be improved. Since the sink 34 is included, the adapter 32 can be easily positioned relative to the pin-type fin 14 and further along the flow path of the cooling medium.

[0051] According to the embodiment described above, the semiconductor module 10 guides the pin blade through the opening 1002 into the flow path 1000, while the adapter 32 is attached to the pin blade 14. In this configuration, the semiconductor module 10 and the enclosure 20 are combined, and the adapter 32 can be positioned relative to the pin blade 14. <Modifikationsbeispiel der vorstehend beschriebenen Ausführungsform>

[0052] In the embodiments described above, material properties, materials, dimensions, shapes, relative arrangements, conditions for implementation, and so on, may be described for the respective components; however, these represent only an example in all aspects and are not limited to the description thereof.

[0053] Accordingly, it is understood that numerous modifications, variations, and equivalents, not shown as examples, can be designed within the scope of protection of the technology disclosed in the specification of the present application. For example, a case in which at least one component element is shaped differently includes a case in which the component element is added or omitted.

[0054] In at least one embodiment described above, where names of materials are mentioned, unless otherwise specified, for example, other additives such as alloys are included in the materials, as long as they are consistent with the embodiments.

[0055] If it is described that “one” component is included in the embodiment described above, “one or more” components may be included, as long as it is consistent with the embodiments.

[0056] Furthermore, individual components are conceptual units. Thus, within the scope of the technology disclosed in the specification of the present application, a component can comprise several structures, a component can correspond to a part of a structure, and several components can be contained in a structure.

[0057] Each component element comprises a structure that has a different configuration or a different shape, as long as the structure of the different configuration or shape achieves the same function.

[0058] What has been described in the specification of the present application is referenced for all purposes with regard to the present technology. It is therefore not an acknowledgment that any of the descriptions provided herein is a conventional technology. Explanation of reference symbols

[0059] 10 Semiconductor module, 12 Semiconductor element, 14 Pin lamella, 16 Screw through hole, 18 Screw, 20 Envelope, 22 O-ring insert groove, 24 O-ring, 26 Screw hole, 28 Cooling medium inlet, 30 Cooling medium outlet, 32 Adapter, 34 Sink, 1000 Flow path, 1002 Opening, D Thickness, T Height. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 2013-120897

[0007]

Claims

[1] Adapter provided on a flow path of a cooling medium for cooling a semiconductor element, wherein the semiconductor element is connected to a pin lamella that protrudes towards the flux path, the adapter has a depression that corresponds to a shape of the pin lamella, and the adapter is attached to the pin blade in such a way that at least part of the pin blade is fitted to the depression in a side surface of the river channel. [2] Adapter according to claim 1, wherein the adapter has a height equal to the height of the pin blade in a state in which it is attached to the pin blade. [3] Adapter according to claim 1 or 2, wherein the adapter is arranged to cover a side wall of the flow path at a position where the semiconductor element is arranged in a state in which it is attached to the pin lamella. [4] Semiconductor cooling device comprising: a semiconductor module to which a semiconductor element is attached; and a casing for cooling the semiconductor element, wherein the semiconductor module features: a pin lamella provided on a lower surface that overlaps with the semiconductor element in a top view; and an adapter that can be attached to the pin blade, the covering has: a flow path of a cooling medium for cooling the semiconductor element; and an opening designed to allow access to the river railway, the semiconductor module introduces the pin lamella into the flow path via the opening, the adapter has a depression that corresponds to a shape of the pin lamella, and the adapter is attached to the pin blade in such a way that at least part of the pin blade fits into the depression in a side surface of the flow path, thereby fixing it to the flow path. [5] Semiconductor cooling device according to claim 4, wherein the semiconductor module introduces the pin fin through the opening into the flow path, while the adapter is attached to the pin fin.

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