DEVICE FOR PRODUCEING A COMPOSITE IMAGE OF FOREIGN BODY, METHOD FOR PRODUCEING A COMPOSITE IMAGE OF FOREIGN BODY AND DATA STRUCTURE

Abstract

Device for generating a foreign body composition image, in order to produce a foreign body composition image obtained by composing an image of the foreign body onto an image of a printed circuit board, in order to adjust an inspection parameter of an inspection program applied to inspect for the presence or absence of the foreign body on the printed circuit board, based on the image of the printed circuit board, comprising a basic information acquisition unit configured to acquire a printed circuit board image, which is the image of the printed circuit board, a foreign body image, which is the image of the foreign body, and foreign body-related information, which is information related to the foreign body image; and a compositing unit configured to superimpose the foreign body image onto a compositing position of the printed circuit board image, which is determined according to a predetermined rule, in order to generate the foreign body composition image.

Description

TECHNICAL AREA

[0001] The present invention relates to a device for generating a composite image of foreign bodies, a method for generating a composite image of foreign bodies and a data structure. STATE OF THE ART

[0002] In the case of a printed circuit board test device, which is used, for example, to check whether the soldering condition of components mounted on a printed circuit board (hereinafter simply referred to as "circuit board") is OK or not, there is an increasing need for full-surface foreign body testing to ensure the quality of the entire circuit board.

[0003] Therefore, a technology has been proposed in which defect features are transferred to a defect-free image to create a pseudo-defect image (see, for example, patent literature 1).

[0004] When inspecting the entire printed circuit board surface, the entire surface of the circuit board is the inspection area, and since it is not known where and what type of defect will occur, determining where and which defect should be transmitted to create a pseudo-defect image is important for improving inspection quality.

[0005] Since the technology described in patent literature 1 requires a user to explicitly define the coordinates for defect transfer, several attempts are necessary to generate a pseudo-defect image that improves inspection quality. Furthermore, even if a user manually generates a pseudo-defect image, there is a possibility that this pseudo-defect image will not result in one that improves inspection quality. That is, even if the inspection parameters are adjusted using such a generated pseudo-defect image, there is a possibility of over- or under-detection. BIBLIOGRAPHY PATENT LITERATURE

[0006] Patent literature 1: published Japanese patent application no. 2022-108855 SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] The present invention was developed taking into account the problems described above and aims to provide a technology with which a fault pattern can be more easily generated for which the inspection parameters can be efficiently set. MEANS TO SOLVENT THE PROBLEMS

[0008] To solve the problem described above, the present invention is a device for generating a composite foreign body image (instead of foreign body, sometimes also: foreign substance), which generates a composite foreign body image obtained by superimposing an image of a foreign body onto an image of a printed circuit board in order to adjust an inspection parameter of an inspection program used to inspect for the presence or absence of the foreign body on the printed circuit board, based on the image of the printed circuit board, wherein the device for generating a composite foreign body image comprises: a basic data acquisition unit configured to acquire a printed circuit board image representing the image of the printed circuit board, a foreign body image representing the image of the foreign body on the printed circuit board, and foreign body-related information representing information relating to the foreign body image; and an assembly unit that is set up to assemble the foreign body image onto an assembly position of the printed circuit board image, which has been determined according to a predetermined rule to produce the assembled foreign body image.

[0009] According to this configuration, it is possible to generate the composite foreign body image representing the defect image by assembling the foreign body image onto a composite position of the printed circuit board image, which has been determined according to a predetermined rule suitable for adjusting the inspection parameters, thus making it easier to generate the defect image for which the inspection parameters can be efficiently set.

[0010] Furthermore, in the present invention, the rule can be based on an index value that includes the presence or absence of a failed detection during inspection.

[0011] According to this configuration, it is possible to generate the composite foreign body image, in which the foreign body image has been assembled at a composite position on the circuit board where a failed detection is likely, thus making it easier to generate the defect image for which the inspection parameters can be efficiently set.

[0012] Furthermore, in the present invention, the rule can be based on an index value that comprises a difference between a measured value of the foreign body and the inspection parameter.

[0013] According to this configuration, it is possible to generate the composite foreign body image by assembling the foreign body image into a composite position that takes into account the detectability of the foreign body, thus making it easier to generate the defect image for which the inspection parameters can be efficiently set.

[0014] Furthermore, in the present invention, the rule can be based on an index value that contains a difference between an average color of the foreign body and a color at a position of the printed circuit board image onto which the foreign body image is to be composed, and the composition unit can determine the composition position in ascending order of the difference.

[0015] According to this configuration, it is possible to generate the composite foreign body image, in which the image of the foreign body was assembled at a compositing position where the foreign body is difficult to detect, thus making it easier to generate the defect image for which the inspection parameters can be efficiently set.

[0016] Furthermore, in the present invention, either the land edge area of ​​the printed circuit board, a resist or an automatic setting can be selected as the assembly position.

[0017] According to this configuration, it is possible to reduce the processing load if the assembly position is determined in advance by restricting the assembly position to a position with a high need for detection, such as a land edge area of ​​the printed circuit board or a resist, depending on the selection, in addition to an automatic setting for automatic determination of the assembly position.

[0018] Furthermore, in the present invention, the device for generating a composite image of foreign bodies can comprise a display unit configured to display a test screen comprising: a foreign body image display area for displaying the foreign body image in conjunction with the foreign body-related information; and a composition content display area to show, for each of the foreign body images displayed in the foreign body image display area, the position of the composite representation and the number of foreign body images to be combined.

[0019] According to this configuration, a user can visually identify the foreign body images used to generate the composite foreign body image by viewing the associated foreign body information on the inspection screen and also check the composition content, including the composition position for each foreign body image and the number of foreign body images to be combined.

[0020] Furthermore, in the present invention, the basic data acquisition unit can acquire the foreign body image and the foreign body-related information from a foreign body library in which the foreign body image and the foreign body-related information are stored in a linked manner.

[0021] According to this configuration, it is possible to capture the foreign body image and the foreign body-related information to be used to generate the composite foreign body image from the pre-created foreign material library, making it easier to generate the defect image for which the inspection parameters can be efficiently set.

[0022] Furthermore, in the present invention, the device for generating the composite foreign body image can comprise the foreign body library.

[0023] Furthermore, the present invention is a method for generating a composite foreign body image obtained by combining an image of a foreign body with an image of a printed circuit board in order to adapt an inspection parameter of an inspection program used to inspect for the presence or absence of the foreign body on the printed circuit board, based on the image of the printed circuit board, wherein the method for generating a foreign body composite image comprises: Capturing a printed circuit board image that represents the image of the printed circuit board; Capturing a foreign body image that represents the image of the foreign body; Gathering information regarding the foreign body, which includes information regarding the foreign body image; and Generating the composite foreign body image by assembling the foreign body image at a Assembly position of the printed circuit board image, which is determined according to a predetermined rule.

[0024] According to this configuration, it is possible to generate the composite foreign body image representing the defect image by superimposing the foreign body image onto a composite position of the printed circuit board image, which has been determined according to a predetermined rule suitable for adjusting the inspection parameters, thus making it easier to generate the defect image for which the inspection parameters can be efficiently set.

[0025] The rule can be based on an index value that includes the presence or absence of a failed detection during inspection.

[0026] According to this configuration, it is possible to generate the composite foreign body image, in which the foreign body image has been assembled at a composite position on the circuit board where a failed detection is likely, thus making it easier to generate the defect image for which the inspection parameters can be efficiently set.

[0027] Furthermore, in the present invention, the rule can be based on an index value that comprises a difference between a measured value of the foreign body and the inspection parameter.

[0028] According to this configuration, it is possible to generate the composite foreign body image by superimposing the foreign body image onto a composite position that takes into account the detectability of the foreign body, thus making it easier to generate the defect image for which the inspection parameters can be efficiently set.

[0029] Furthermore, in the present invention, the rule can be based on an index value comprising a difference between an average color of the foreign body and a color at a position of the printed circuit board image onto which the foreign body image is to be assembled, and the assembly position is determined in ascending order of the difference.

[0030] According to this configuration, it is possible to generate the composite foreign body image by assembling the foreign body image at a compositing position where the foreign body is difficult to detect, thus making it easier to generate the defect image for which the inspection parameters can be efficiently set.

[0031] Furthermore, in the present invention, either the land edge area of ​​the printed circuit board, a resist or an automatic setting can be selected as the assembly position.

[0032] According to this configuration, it is possible to reduce the processing load if the assembly position is determined in advance by restricting the assembly position to a position with a high need for detection, such as a land edge area of ​​the printed circuit board or a resist, depending on the selection, in addition to an automatic setting for automatic determination of the assembly position.

[0033] Furthermore, in the present invention, the foreign body image and the foreign body-related information can be acquired from a foreign body library in which the foreign body image and the foreign body-related information are stored in a linked manner.

[0034] According to this configuration, it is possible to generate the defect image more easily, for which the inspection parameters can be efficiently set, since the foreign body image and the foreign body-related information to be used to generate the composite foreign body image can be retrieved from the pre-created foreign body library.

[0035] Furthermore, the present invention relates to a data structure in which a foreign body image, representing an image of a foreign body present on a printed circuit board, is linked with information about the foreign body, including information relating to the foreign body image, which is used to determine a composition position at which the foreign body image is assembled when a foreign body composition image, which is used to adjust an inspection parameter of an inspection program applied to inspect for the presence or absence of the foreign body on the printed circuit board, is assembled by assembling the foreign body image onto the image of the printed circuit board, based on an image of the printed circuit board.

[0036] According to this configuration, when generating the foreign body composition image, the information regarding the foreign body, including the information regarding the foreign body image used to determine the assembly position where the foreign body image is assembled onto the printed circuit board image, is provided as a data structure associated with the foreign body image. This makes it easier to generate a foreign body composition image that represents a defect image for which the inspection parameters can be efficiently set. ADVANTAGEOUS EFFECT OF THE INVENTION

[0037] According to the present invention, it is possible to generate the fault pattern for which the inspection parameters can be efficiently set more easily. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a functional block diagram of an inspection system according to an example of the present invention. Fig. Figure 2 is an overall configuration diagram of a production line according to an example of the present invention. Fig. Figure 3 is a view illustrating a hardware configuration of inspection devices and the like according to an example of the present invention. Fig. Figure 4 is a flowchart illustrating a processing sequence for generating a composite image of foreign body defects according to an example of the present invention. Fig. Figure 5 is a view illustrating a display example of an image settings screen according to an example of the present invention. Fig. Figure 6 is a view illustrating a display example of a preparation screen for generating a composite error image according to an example of the present invention. Fig. Figure 7 is a view illustrating a display example of a preparation screen for generating a composite error image according to a modification example of the present invention. DESCRIPTION OF EXECUTION FORMS [Application example]

[0038] The following are examples of applications of the present invention with reference to the drawings. Fig. Figure 1 is a functional block diagram of an inspection system 1. Fig. Figure 2 is an overall configuration diagram of a production line 2, which includes the inspection system 1. Fig. Figure 3 is a hardware configuration diagram of an inspection device 10 and the like. Production line 2 is a surface mounting line for soldering electronic components onto the surface of a printed circuit board and includes a solder paste printing device X1, a pick-and-place machine X2, a reflow oven X3, a solder paste printing tester Y1, a component inspection device Y2, a visual inspection device (“appearance inspection device”) Y3, an X-ray inspection device Y4, an administration server 20, and a training terminal 30. Of these, the solder paste printing tester Y1, the component inspection device Y2, the visual inspection device Y3, the X-ray inspection device Y4, the administration server 20, and the training terminal 30 constitute inspection system 1. The in Fig. The inspection device 10 shown in Figure 1 collectively refers to the solder paste printing inspection device Y1, the component inspection device Y2, the visual inspection device Y3 and the X-ray inspection device Y4.

[0039] The inspection device 10 captures the printed circuit board using an imaging device 12, and an inspection unit 13 performs a pass / fail decision based on a captured image by using an inspection program containing a predetermined test logic or a trained AI model (hereinafter also referred to simply as the "AI model"). The captured image is stored in an image storage unit 14, and an inspection result (pass / fail) is stored in an inspection result storage unit 15 in conjunction with the captured image. The inspection device 10 includes a control unit 11 that controls each unit to perform a predetermined test operation.

[0040] The management server 20 comprises a workpiece information storage unit 21, an inspection parameter storage unit 22, a printed circuit board image storage unit 23, a test result storage unit 24, a foreign body image storage unit 25, a foreign body image metadata storage unit 26, and a foreign body library 27. The foreign body image storage unit 25 stores an image obtained by cropping an image of an area containing foreign bodies (foreign body image) from the image of the printed circuit board that was classified as non-compliant during inspection in the inspection device 10 and during visual inspection. The metadata stored in the foreign body image metadata storage unit 26 is information relating to the foreign body image and is metadata stored in conjunction with the foreign body image stored in the foreign body image image storage unit 25.The metadata of the foreign body image includes an inspection time, a type of foreign body (defect type), a location of the foreign body (defect position), a process in which the foreign body originated, a location (site) where a printed circuit board serving as an extraction target was manufactured, and the like. Examples of defect types include a solder ball, dirt / dust, chipping, and component displacement.

[0041] The workpiece information storage unit 21 is a predetermined area of ​​memory 20d in which information such as batch, product number, and supplier relating to a workpiece, for example, a printed circuit board (PCB), representing an inspection target, is stored. The inspection parameter storage unit 22 is a predetermined area of ​​memory 20d in which parameters such as threshold values ​​of the inspection logic to be used in each inspection device are stored. The PCB image storage unit 23 is a predetermined area of ​​memory 20d in which images of PCBs acquired by each inspection device are stored. The test result storage unit 24 is a predetermined area of ​​memory 20d in which test results from each inspection device are stored. The foreign body image storage unit 25 is a predetermined area of ​​memory 20d in which foreign body images are stored.The foreign body image metadata storage unit 26 is a predetermined area of ​​memory 20d in which foreign body image metadata, i.e., metadata relating to the foreign body image, is stored in conjunction with the foreign body image. The foreign body images and the associated foreign body image metadata constitute the foreign body library 27.

[0042] The training terminal 30 is a device that allows a user to set parameters such as thresholds of a predetermined inspection logic used for testing (inspection) in the inspection device 10, as well as feature sizes of the AI ​​model. The training terminal 30 comprises an inspection parameter setting unit 31, which sets the parameters described above, a transmission unit 32, and an image readout unit 33. Furthermore, the training terminal 30 includes an inspection unit 34, which performs an inspection (test) of a model image using the currently set logic and thresholds.

[0043] Fig. Figure 4 is a flowchart illustrating the processing sequence for generating a composite defect image. First, a foreign body transmission setting is performed for each PCB ID and viewport number (step S1). The PCB ID is an identification identifier used to specify a PCB; an image obtained by scanning a PCB is divided into multiple viewports, and each viewport is assigned a viewport number for specification. The foreign body image is stored in the foreign body image storage unit 25, which forms the foreign body library 27 of the management server 20, and is specified by a foreign body ID.

[0044] The transfer is started according to a user instruction (step S2). For the transfer of the foreign body images, processing steps S6 to S10 are executed for each printed circuit board ID (steps S3 to S13), for each viewing area number (steps S4 to S12), and for each foreign body ID (steps S5 to S11).

[0045] In step S6, the transmission unit 32 determines whether a fault transmission point is a land margin, an automatic area, or a resist, and the processing branches accordingly. If the fault transmission point is the land margin, the presence or absence of a missing detection and a deviation rate are calculated at each coordinate within a portion of the land margin (step S7). The deviation rate is a difference between a measurement of the foreign body registered in the foreign body library 27 and the inspection parameter.

[0046] If the fault transmission location is “automatic”, the presence or absence of a missing detection and the degree of deviation are calculated at each coordinate within an area of ​​the entire surface of the printed circuit board (step S8).

[0047] If the location of the error transmission is the resist, the presence or absence of the missing detection and the degree of deviation are calculated at each coordinate within a resist area (step S9).

[0048] The transfer positions are determined in descending order of missing (faulty) detection or in ascending order of the degree of deviation, and a fixed number of foreign body images are transferred (step S10).

[0049] If the processing described above from step S6 to step S10 is carried out for each printed circuit board ID (steps S3 to S13) for each viewing area number (steps S4 to S12) and for each foreign body ID (steps S5 to S11), the generated result image is displayed on the output unit 30f of the teaching terminal 30 so that the user can check the result image (step S14).

[0050] The user decides whether the quality of the resulting image is acceptable (step S15). If the quality of the resulting image is found to be problematic (unacceptable), the process returns to step S1; if it is found to be acceptable, the process continues with step S15.

[0051] In step S16, the user adjusts the inspection parameters using the inspection parameter setting device 31. The parameter setting can be performed, for example, by actuating the input device 30e to enter values ​​in an inspection parameter field 140 of a Fig. 5 basic image settings screen to change 100.

[0052] The user performs a simulation test for the result image using the adjusted inspection parameters (step S17).

[0053] The user determines whether the inspection parameters are optimal based on the result of the simulation test (step S18).

[0054] If the user determines that the inspection parameters are not optimal, the process returns to step S16 and the user adjusts the inspection parameters again; if the user determines that the inspection parameters are optimal, the user applies the inspection parameters during serial testing (step S19).

[0055] The serial inspection is carried out using the optimized inspection parameters (step S20). Accordingly, an image of a foreign body defect, for which the inspection parameters can be efficiently set, can be easily generated. Example 1

[0056] An inspection system 1 according to Example 1 of the present invention is described in more detail below with reference to the drawing figures. However, the configurations of devices and systems described in this example should be modified accordingly depending on the various conditions. That is to say, the scope of the present invention is not limited to the following example.

[0057] Fig. Figure 1 is a functional block diagram of inspection system 1. Fig. Figure 2 is a complete configuration diagram of production line 2, including inspection system 1. Production line 2 is a surface assembly line for soldering electronic components onto the surface of a printed circuit board and essentially comprises three processes: solder paste printing, component placement, and reflow (solder fusion). Production line 2 includes the solder paste printing device X1, the placement machine X2, and the reflow oven X3, which are production devices; the solder paste printing inspection device Y1, the component inspection device Y2, the visual inspection device Y3, and the X-ray inspection device Y4, which are inspection and management devices; the management server 20; and the training terminal 30.Of these, the solder paste printing inspection device Y1, the component inspection device Y2, the visual inspection device Y3, the X-ray inspection device Y4, the administration server 20, and the training terminal 30 constitute inspection system 1. The in . Fig. The inspection device 10 shown in Figure 1 refers collectively to the solder paste printing inspection device Y1, the component inspection device Y2, the visual inspection device Y3 and the X-ray inspection device Y4 and actually corresponds to individual inspection devices such as the visual inspection device Y3 or combinations thereof.

[0058] In production line 2, the solder paste printer X1, the pick-and-place machine X2, and the reflow oven X3 are arranged in this order from the upstream side. The solder paste printer X1 is a device that applies a pasty solder compound by screen printing onto an electrode section (referred to as a "land") on a printed circuit board (PCB). The pick-and-place machine X2 is a device that picks up an electronic component to be mounted on the PCB and places the component onto the solder paste at a corresponding location; it is also known as a chip pick-and-place machine. The reflow oven X3 is a heating device for heating and melting the solder paste and then cooling it to solder electronic components onto the PCB. If the number and types of electronic components to be mounted on the PCB are large, several pick-and-place machines X2 can be used in the surface mount assembly line.

[0059] Furthermore, inspection system 1 is installed in production line 2. This system includes an inspection device that checks the condition of the printed circuit board at the outputs of the respective processes, including solder paste printing, component placement, and the reflow process, and automatically detects defects or the risk of defects. Inspection system 1 has a function to provide feedback to the operation of the production equipment, such as the solder paste printing device X1, which forms production line 2, based on inspection results or their analysis results (e.g., changes to a placement program), in addition to automatically sorting defective and faulty products.

[0060] In inspection system 1, the solder paste printing inspection device Y1, the component inspection device Y2, the visual inspection device Y3, and the X-ray inspection device Y4 are arranged in this order from the upstream side. The in Fig. The inspection device 10 shown in Figure 1 collectively refers to the solder paste printing inspection device Y1, the component inspection device Y2, the visual inspection device Y3, and the X-ray inspection device Y4, and actually corresponds to individual inspection devices such as the visual inspection device Y3 or combinations thereof. Furthermore, the inspection device 10 is not limited to one shown in Figure 1. Fig. The production line 2 shown in Figure 2 is limited. Furthermore, the inspection system 1 is additionally equipped with the management server 20 and the training terminal 30, which will be described later.

[0061] The solder paste printing device X1, the pick-and-place machine X2, the reflow oven X3, the solder paste printing inspection device Y1, the component inspection device Y2, the visual inspection device Y3, the X-ray inspection device Y4, the management server 20 and the teaching terminal 30 are connected to each other via a network NW.

[0062] The solder paste printing inspection device Y1 is a device for checking the printing condition of the solder paste on a printed circuit board, as applied by the solder paste printing device X1. The following description refers to the information in Fig. The functional blocks of the inspection device 10 are shown in Figure 1. In the solder paste printing inspection device Y1, the solder paste printed on the printed circuit board is imaged by the imaging unit 12, for example, an image sensor (camera), and the inspection unit 13 makes a pass / fail decision regarding the solder paste based on the captured image, using a test program that contains a predetermined test logic or a trained AI model. The captured image is stored in an image storage unit 14, and a test result (pass / fail) is stored in a test result storage unit 15 in conjunction with the captured image. The solder paste printing inspection device Y1 includes a control unit 11 that controls each unit of the inspection device 10 to perform a predetermined test operation.

[0063] The component inspection device Y2 is a device for checking the arrangement of electronic components on a printed circuit board fed by the pick-and-place machine X2. Since the configurations of the functional units in the component inspection device Y2 are identical to those of the solder paste printing inspection device Y1, a detailed description is omitted.

[0064] The visual inspection device Y3 is a device for checking the solder quality of a printed circuit board coming out of the reflow oven X3. Since the configurations of the functional units in the visual inspection device Y3 are identical to those of the solder paste printing inspection device Y1, a detailed description is omitted.

[0065] The X-ray inspection device Y4 is a device for inspecting the soldering condition of printed circuit boards using an X-ray image. Since the configurations of the functional units in the X-ray inspection device Y4 are identical to those of the solder paste printing inspection device Y1, except that X-rays are used for imaging, a detailed description is omitted.

[0066] Fig. Figure 3 is a hardware configuration diagram of the inspection device 10. The inspection device 10 has a configuration similar to a general-purpose computer (information processing device) and comprises a central processing unit (CPU) 10a, a read-only memory (ROM) 10b, a working memory (RAM) 10c, a storage device 10d, an input device 10e, an output device 10f, and a communication interface 10g. The respective components are communicatively connected to each other via a bus 10h. Since the management server 20 and the teaching terminal 30 also have a hardware configuration similar to that of the inspection device 10, the corresponding components of the respective devices are shown in parentheses, and a detailed description of each component is omitted here.

[0067] The CPU 10a is a central processing unit and implements the respective functional units described above by executing various programs and controlling the individual components. Specifically, the CPU 10a reads a program from the ROM 10b or memory 10d and executes the program using the RAM 10c as its working area. The CPU 10a controls the individual components and performs various arithmetic operations according to the program stored in the ROM 10b or memory 10d. Here, the CPU 10a and the RAM 10c together form the control unit 11. The ROM 10b stores various programs and different types of data. The RAM 10c temporarily stores programs or data as its working area. The memory 10d consists of a hard disk drive (HDD), a solid-state drive (SSD), or flash memory and stores various programs, including an operating system, as well as different types of data.The input unit 10e is, for example, a keyboard and / or a mouse and is used to perform various inputs. The output unit 10f is, for example, a screen and displays a user interface. The output unit 10f can use a touchscreen system and function as an input unit 10e. The communication interface 10g is an interface for communicating with other devices, using, for example, a standard such as Ethernet (brand name), FDDI, or Wi-Fi (brand name).

[0068] Management Server 20 is a computer device that manages Production Line 2, including Inspection System 1. Management Server 20 can consist of a single computer or be configured with multiple computers. Alternatively, it is also possible to implement all or some of the functions of Management Server 20 in a computer integrated into one of the solder paste printing devices X1 or similar, and the solder paste printing inspection device Y1 or similar. Alternatively, some of the functions of Management Server 20 can be implemented by a server on a network (such as a cloud server).

[0069] The management server 20 comprises the workpiece information storage unit 21, the inspection parameter storage unit 22, the printed circuit board image storage unit 23, the test result storage unit 24, the foreign body image storage unit 25, the foreign body image metadata storage unit 26, and the foreign body library 27. Each of these storage units consists of the memory 20d.

[0070] The workpiece information storage unit 21 is a predetermined area of ​​memory 20d in which information such as batch, product number, and supplier relating to a workpiece, for example, a printed circuit board, that is the subject of inspection is stored. The inspection parameter storage unit 22 is a predetermined area of ​​memory 20d in which parameters such as threshold values ​​of the inspection logic to be used in each inspection device are stored. The printed circuit board image storage unit 23 is a predetermined area of ​​memory 20d in which images of printed circuit boards taken by each inspection device are stored. The inspection result storage unit 24 is a predetermined area of ​​memory 20d in which the inspection results of each inspection device are stored. The foreign body image storage unit 25 is a predetermined area of ​​memory 20d in which foreign body images are stored.The foreign body image can be an image generated from the image acquired by each inspection device, or it can be pre-prepared. The foreign body image metadata storage unit 26 is a predefined area of ​​memory 20d in which foreign body image metadata, i.e., metadata relating to the foreign body image, is stored in conjunction with the foreign body image. The foreign body images and the associated foreign body image metadata constitute the foreign body library 27. The foreign body image storage unit 25 stores an image obtained by cropping an image of an area containing foreign bodies (foreign body image) from the image of the printed circuit board that was deemed unacceptable (not acceptable) during inspection by the inspection device 10 and during visual inspection.The foreign body image metadata stored in foreign body image metadata storage unit 26 is information relating to the foreign body image and is stored in conjunction with the foreign body image stored in foreign body image storage unit 25. The foreign body image metadata includes, but is not limited to, an inspection time, a type of foreign body (defect type), a location of the foreign body (defect position), a process in which the foreign body originated, a location (site) where a printed circuit board under inspection was manufactured. Examples of defect types include, but are not limited to, solder balls, dirt / dust, chipping, and component displacement.Furthermore, the metadata of the foreign body image can specify the state of the manufacturing device in which the foreign body originated, batch information of the printed circuit board under inspection, and the like, based on the inspection time, whereby such information can also be included in addition to the time. Here, the metadata of the foreign body image corresponds to the foreign body-related information of the present invention. Furthermore, the foreign body library 27 corresponds to a data structure of the present invention.

[0071] The teaching terminal 30 is a device that allows a user to set parameters such as the thresholds of the predetermined test logic used for testing in the inspection device 10, as well as feature sizes of the AI ​​model. The teaching terminal 30 comprises the inspection parameter setting device 31, which sets the parameters described above, the transmission device 32, and the image readout device 33. Furthermore, the teaching terminal 30 includes an inspection unit 34, which performs a test on a model image using the currently set logic and thresholds. The teaching terminal 30 can include a training unit that pre-trains an AI model using training data so that the inspection device 10 can make a pass / fail decision for a printed circuit board. Here, the image readout unit 33 corresponds to a basic information acquisition unit of the present invention.Furthermore, the transmission unit 32 corresponds to an assembly unit of the present invention. The foreign body library 27 is provided in the administration server 20, but can also be provided in the teaching terminal 30.

[0072] Fig. Figure 4 is a flowchart illustrating the processing sequence for generating a composite fault pattern. First, a foreign body transmission setting is configured for each PCB ID and each visible area number (step S1). This process is then described with reference to the... Fig. 5 and Fig. 6 described.

[0073] Fig. Figure 5 shows screen 100 for the basic settings of the image displayed on output unit 30f of the teaching terminal 30. Screen 100 for the basic image settings displays an image 110 of a printed circuit board (PCB), which is the target to which the foreign object is to be transferred. A PCB ID list 120 is displayed in the upper center of the basic image settings screen 100. The PCB ID list 120 includes a PCB ID field 120a and a storage date and time field 120b. Each line in PCB ID field 120a displays a PCB ID, such as 9001 and 9002. In the date and time of storage field 120b, a date and time is displayed in each line at which an image of the circuit board specified by the board ID was saved, such as 11.11.2022 11:22:33 and 11.11.2022 11:23:34.Here, line 120c with PCB ID 9001 is displayed in a different display mode than the other lines, such that a background color is applied and the characters appear in white, indicating that PCB ID 9001 is selected. Furthermore, the PCBs with PCB IDs 9001 to 9007 are previously manufactured PCBs, which is why a storage date and storage time are displayed. Here, the teaching terminal 30 corresponds to the device for generating a composite image of foreign bodies of the present invention, and the output unit 30f corresponds to the display unit of the present invention.

[0074] Furthermore, a list of simulation results 130 is displayed in the upper right area of ​​the image basic settings screen 100. The list of simulation results 130 displays simulation results for each viewport number of the printed circuit board (PCB), which is specified by the selected PCB ID. The list of simulation test results 130 includes a field for the viewport number 130a, a field for the number of over-detections 130b, a field for the number of detections 130c, and a field for the number of failed detections 130d. In the viewport number field 130a, the viewport number, for example, 1 and 2, is displayed in each row.In fields 130b (number of over-detections), 130c (number of detections), and 130d (number of failed detections), the number of over-detections, the number of detections, and the number of failed detections of the simulation test results for an image with the field number displayed at the left end in field 130a (field number) are shown. Here, an over-detection count of 2, a detection count of 0, and a failed detection count of 0 are displayed as simulation test results for an image with field number 1; an over-detection count of 3, a detection count of 0, and a failed detection count of 0 are displayed as simulation test results for an image with field number 2; and simulation results in rows with field numbers 3 to 7 are also displayed. Here, row 130e with field number...Line 1 is displayed in a different display mode than the other lines by using a background color and displaying the characters in white, thus indicating that viewport No. 1 is selected.

[0075] The field for inspection parameters 140 is displayed in the lower center of the basic image settings screen 100. An inspection criterion is displayed at the top of the field for inspection parameters 140, and below the inspection criterion, the checkbox 140a for foreign object inspection across the entire surface is activated, indicating that the inspection for foreign objects across the entire surface is enabled. Further down, the individual inspection parameters 140b are displayed. Here, it is shown that the inspection parameter "Color and Height" is set to "Color or Height", and an area (mm) is also displayed. 2) to 0.1, an area ratio (%) and a ratio of main to secondary axis (%) to 60, a height reference (mm) to 0.01 and a color range to 3. Of these, the area, the area ratio, the ratio of main to secondary axis and the height are physical quantities, while the color range is a color-related inspection parameter.

[0076] A button for the simulation test 150 and a button for generating a composite defect image 160 are displayed on the lower right side of the screen 100 for the basic image settings. When the user presses the input unit 30e to activate the simulation test button 150, the simulation test is executed in the inspection unit 34. When the user presses the input unit 30e to activate the button 160 for generating a composite defect image, the image readout unit 33 reads the foreign body image from the foreign body library 27, and the transfer unit 32 transfers the foreign body image to the selected image with the viewport number, as described later. Here, the PCB ID and the viewport number to be used for transferring the foreign body image are selected manually, but can also be selected automatically.

[0077] If the user presses button 160 to generate a composite error image, the display of output unit 30f of the teaching terminal 30 changes to a preparation screen 200 for generating a composite error image, as shown in Fig. 6 shown.

[0078] A field for the foreign body image 210 is displayed in the upper area of ​​the preparation screen 200 for generating a composite defect image. An element row 211, labeled "Defect Type," is displayed at the top of the foreign body image field 210. At the bottom of element row 211, the field is divided into several columns, and a solder ball field 212, a dirt / dust field 213, a chipping field 214, and a component displacement field 215 are arranged in that order from left to right. The solder ball, dirt / dust, chipping, and component displacement are components of the defect type. In the solder ball field 212, solder ball images 212a, 212b, and 212c, each assigned the identification numbers ID:1, ID:5, and ID:9 respectively, are displayed sequentially from the top. Similarly, in the field “Foreign body / Dust” 213, the foreign body / dust images 213a, 213b and 213c, which are assigned the identification numbers ID:2, ID:6 and 213c respectively, are shown.Images assigned ID:10 are displayed sequentially, starting from the top. Similarly, in the "Chipping" area 214, chipping images 214a, 214b, and 214c, assigned identification numbers ID:3, ID:7, and ID:11 respectively, are displayed sequentially from the top. Likewise, in the "Component Displacements" field 215, images 215a, 215b, and 215c of component displacements assigned identification numbers ID:4, ID:8, and ID:12 are displayed sequentially from the top. The solder ball images 212a to 212c, the dirt / dust images 213a to 213c, the chipping images 214a to 214c, and the component displacement images 215a to 215c displayed in the foreign body image field 210 are examples of foreign body images registered in the foreign body image storage unit 25. Here, the preparation screen 200 for generating a composite defect image corresponds to a test screen of the present invention.The foreign body image field 210 corresponds to a foreign body image display area of ​​the present invention.

[0079] A PCB ID list 220 is displayed on the lower left side of the preparation screen 200 for generating a composite fault image. In PCB ID list 220, each line contains a PCB ID, such as 9001 and 9002. Here, line 221, containing PCB ID 9001, is displayed in a different mode than the other lines, with a background color applied and the characters displayed in white, indicating that PCB ID 9001 is selected. A viewport number list 230 is displayed to the right of PCB ID list 220. In viewport number list 230, each line displays viewport numbers such as 1 and 2.Here, line 231 with viewport number 1 is displayed in a different display mode than the other lines, so that a background color is applied and the characters appear white, indicating that viewport number 1 is selected.

[0080] A foreign body transfer list 240 is displayed in the lower center area of ​​the preparation screen 200 for generating a composite defect image. The foreign body transfer list 240 comprises a foreign body ID field 241, a field 242 for the defect transfer position, and a field 243 for the number of transfers. The foreign body ID field 241 displays the foreign body ID, such as 1 and 2, in each line. The foreign body ID is an ID assigned to each foreign body image in the foreign body image field 210. The defect transfer location field 242 displays a transfer position of the selected image (here: view field no. 1 of PCB ID 9001) of the foreign body, which is shown at the left end in the foreign body ID field 241. Here, for the example "Land Randbereich" ("Land-Peripherie"), the "Resist" and the "automatic" option are displayed in the respective lines.Detailed settings for the transfer position are described later. The "Error Transfer Location" field 242 is displayed as "automatic" by default, and if a previous occurrence location is registered in the foreign body library 27, this location is displayed by default. Thus, the transfer is performed to the location of the occurrence of the foreign body image registered in the foreign body library 27, making it possible to perform a transfer to an area similar to a past occurrence and to generate a realistic error image. The user can be allowed to operate the input unit 30e to select a suitable location from a drop-down list. Furthermore, the transfer positions can be set in units of error modes (error types) of the foreign body library 27. This allows the transfer positions to be set simultaneously.The "Transfer Count" field 243 displays the number of transfers of the foreign object shown in the "Foreign Body ID" field 241 at the left end to a position selected in the "Error Transfer Location" field 242 in the center of the selected image. Numerical values, such as 10, are displayed in each line. The display of the "Transfer Count" field 243 can be set by the user operating the input unit 30e by selecting a suitable numerical value from a drop-down list, or it can be set automatically by storing a value for the transfer count internally. Furthermore, when the selected foreign object is transferred, it can be transferred after undergoing a transformation, such as a change in size or rotation.Here, the foreign body transfer list 240 corresponds to a display area for the composition content of the present invention. Up to this point, the following is referred to: Fig. 5 and Fig. The processing described in step S1 was carried out.

[0081] A generation button 250 is displayed on the lower right side of the preparation screen 200 for generating a composite defect image. When the user presses the input unit 30e to activate the generation button 250, a PCB defect image is generated in which the foreign object image is transferred to the image displayed in the PCB ID list 220 and the viewport number list 230 at the location specified by the selected number, using the foreign object ID selected in the foreign object transfer list 240. Once the transfer is complete, a new PCB ID is assigned and added to the PCB ID list 120. Here is a PCB image in which the PCB ID 9008 from the PCB ID list 120 has been transferred. Fig. 5 was added in this way.

[0082] The description returns to the flowchart of Fig. 4. Back. When the Generate button 250 is pressed, the transfer is started (step S2). Here, for the transfer of the foreign body images, the processing of steps S6 to S10 is carried out for each board ID (steps S3 to S13), for each field of view number (steps S4 to S12) and for each foreign body ID (steps S5 to S11).

[0083] In step S6, the transmission unit 32 determines whether the defect transmission location is the land edge area, the automatic detection area, or the resistive area, and the processing branches accordingly. If the defect transmission location is the land edge area, the presence or absence of the missing detection and the degree of deviation are calculated at each coordinate within a region of the land edge area (step S7). This involves comprehensive processing in which the foreign object is transferred to the circuit board in the land edge area, a simulation test with the current inspection parameters is performed on the generated image in the inspection unit 34, the presence or absence of the missing detection and the degree of deviation are calculated, and the processing proceeds to the next coordinates.The degree of deviation is the difference between the foreign body measurement recorded in foreign body library 27 and the inspection parameter. The foreign body measurement refers, for example, to an area or height reference defined in inspection parameter field 140. Fig. 5 is displayed. Thus, the position of the error transmission is limited to the area of ​​the land periphery, making it possible to shorten the processing time for searching for the transmission position and to generate a realistic error image by transferring the foreign object to a possible position. Here, the presence or absence of the missing detection and the degree of deviation correspond to the index values ​​of the present invention, and the procedure based thereon corresponds to the predetermined rule of the present invention.

[0084] If the defect transfer position is automatic, the presence or absence of the missing detection and the degree of deviation are calculated at each coordinate within the area of ​​the entire surface of the printed circuit board (step S8). Here, comprehensive processing is performed in which the foreign object is transferred to the entire surface of the printed circuit board, a simulation test is carried out on the generated image with the current inspection parameters in inspection unit 34, the presence or absence of the missing detection and the degree of deviation are calculated, and the processing proceeds to the next coordinates. A case in which the location of the defect transfer is automatic corresponds to the automatic setting of the assembly position according to the present invention.

[0085] If the location of the defect transfer is the resist, the presence or absence of the missing detection and the degree of deviation are calculated at each coordinate within the resist area (step S9). Here, comprehensive processing is performed in which the foreign body is transferred to the resist, a simulation test is carried out on the generated image with the current inspection parameters in inspection unit 34, the presence or absence of a missing detection and the degree of deviation are calculated, and the processing proceeds to the next coordinates. Thus, the position of the defect transfer is limited to the resist area, making it possible to reduce the search processing time for the transfer position and to generate a realistic defect image by transferring the foreign body to the possible location.

[0086] The transfer positions are determined in descending order of false detection or in ascending order of the degree of deviation, and a defined number of foreign body images are transferred to generate a composite defect image (step S10). This makes it possible to transfer the foreign body image to locations with a high risk of false detection. The composite defect image corresponds to a composite foreign body image of the present invention. Furthermore, the transfer position corresponds to a compositing position of the present invention.

[0087] The determination of the transfer positions is not limited to the procedures described above in steps S7 to S10. A difference between an average color of the foreign body and a color at a transfer candidate position can be calculated, and the transfer positions can be determined in ascending order of this difference. Here, the transfer candidate position corresponds to a position onto which the foreign body image of the present invention is to be composited. Furthermore, the difference between the average color of the foreign body and the color of the transfer candidate position corresponds to the index value of the present invention and, based on this, corresponds to a predetermined rule of the present invention.

[0088] In this case, the average color of a plurality of printed circuit boards (PCBs) can be used as the color of the candidate transfer positions. That is, a difference is calculated between the average color of the foreign material and the average color of the plurality of PCBs, and the transfer positions are determined in ascending order of this difference. Thus, the transfer positions can be determined even with color variations between the PCBs, taking into account the actual color exhibited by the PCB of that type. In this case, a difference between the average color of the foreign material and an average color at the candidate transfer positions of the multiple PCBs corresponds to an index value of the present invention, and the determination based thereon corresponds to the predetermined rule of the present invention.

[0089] Furthermore, a position where the color deviation between multiple printed circuit boards is large can be defined as the transfer position. Areas where components, resist colors, and resist pattern positions differ during manufacturing are difficult to detect; therefore, when determining the transfer position as described above, it is possible to generate a composite image of the foreign matter that is useful for adjusting the inspection parameters. In this case, the color deviation between multiple printed circuit boards corresponds to the index value of the present invention, and on this basis, it corresponds to the predetermined rule of the present invention.

[0090] Furthermore, a position where the height deviation between the multiple printed circuit boards is large can be defined as the transfer position. Since areas where a height measurement error or a deviation in the position of components and resist patterns occurs during manufacturing are difficult to detect, it is possible to generate the composite image of foreign bodies useful for adjusting the inspection parameters when the transfer position is determined in this way. In this case, the height deviation between the multiple printed circuit boards corresponds to the index value of the present invention, and on this basis, it corresponds to the predetermined rule of the present invention.

[0091] Furthermore, the transfer positions can be determined by combining at least two or more of the index values ​​described above. For example, it is possible to determine the transfer positions by comprehensively identifying locations where inspection is difficult, by combining a color-related index value and a height-related index value.

[0092] When the processing described above from steps S6 to S10 is carried out for each printed circuit board ID (steps S3 to S13), for each viewing area number (steps S4 to S12) and for each foreign body ID (steps S5 to S11), the generated result image is displayed on the output unit 30f of the teaching terminal 30 in such a way that the user checks the result image (step S14).

[0093] The user determines whether the quality of the output image is acceptable (step S15). If the quality of the output image is found to be problematic (unacceptable), the process returns to step S1; if it is found to be acceptable, the process continues with step S15. Here, for example, an Accept button and a Reject button are displayed on an output image display screen of output unit 30f of teaching terminal 30, and the user's decision is accepted.

[0094] In step S16, the user adjusts the inspection parameters using the inspection parameter setting unit 31. The parameter setting can be performed, for example, by pressing the input unit 30e to enter values ​​in field 140 for the inspection parameters of the [unclear text]. Fig. 5 shown in the basic settings screen to change 100.

[0095] The user performs a simulation test on the resulting image using the adjusted inspection parameters (step S17). Since the image (result image) of the printed circuit board, generated by processing steps S1 to S13 and displayed as PCB ID 9008 in the bottom line of the Fig. If a new PCB ID is assigned to the PCB ID list 120 shown in the basic image settings screen 100, the user can perform the simulation test using the adapted inspection parameters by selecting PCB ID 9008 and pressing the simulation test button 150.

[0096] The results of the simulation test are listed in the field of view number list 230 of the [document / document]. Fig. The basic settings screen 100 is displayed in image 5. The user determines whether the inspection parameters are optimal based on the results of the simulation test (step S18). Here, for example, an Accept button and a Reject button are displayed on a screen of output unit 30f of the teaching terminal 30, and the user's decision is accepted.

[0097] If the user determines that the inspection parameters are not optimal, the process returns to step S16 and the user adjusts the inspection parameters again; if the user determines that the inspection parameters are optimal, the user applies the inspection parameters to the serial inspection (step S19). Here, the adjusted inspection parameters are stored in the inspection parameter storage unit 22 of the management server 20 and are also incorporated into the test logic and the like in the inspection unit 13 of the inspection device 10.

[0098] Mass production inspection (series production inspection) is carried out using the optimized inspection parameters (step S20). Accordingly, the image of a foreign body defect, for which the inspection parameters can be efficiently set, can be easily generated. [Modification examples]

[0099] Fig. Figure 7 shows a display example of a preparation screen 201 for generating a composite error image according to a modification example of Example 1. Configurations common to Example 1 are indicated by common reference symbols, and a detailed description of them is omitted here.

[0100] In Example 1, as with reference to the in Fig. The flowchart shown in Figure 4 describes how, depending on whether the defect transfer location is the land edge area, the automatic area, or the resist (step S6), the presence or absence of missing detection and the degree of deviation are calculated at each coordinate (steps S7 to S9), and the transfer positions are determined in descending order of missing detection or in ascending order of the degree of deviation (step S10). The procedure for determining the transfer positions is not limited to this, and in the present modification example, the foreign body images can be transferred to random positions at the respective locations, depending on whether the defect transfer location is the land edge area, the automatic area, or the resist.

[0101] In the Fig.In the preparation screen 201 shown in Figure 7 for generating a composite fault image, the configurations of field 210 for foreign body images, list 220 for PCB IDs, and list 230 for visible area numbers correspond to those of preparation screen 200 for generating a composite fault image according to Example 1. In contrast to preparation screen 200 for generating a composite fault image, the foreign body transmission list 240 of preparation screen 201 for generating a composite fault image contains, in addition to the foreign body ID field 241, field 242 for the fault transmission location, and field 243 for the transmission count, a condition field 244.

[0102] Condition field 244 displays a condition under which a transfer position is determined for foreign objects displayed in foreign object ID field 241. As described in Example 1, foreign object IDs 1 to 10 are shown as being transferred to a location with high detection difficulty, such as a location with frequent detection errors or a low deviation rate, while foreign object IDs 11 and 12 are shown as being transferred at random. Condition field 244 can be displayed by default as "Transfer to a location with high detection difficulty," and the user can be allowed to use input unit 30e to select "Random transfer."Furthermore, the conditions that can be selected as criteria for determining the transmission positions are not limited to this, and the user may be permitted to select a suitable condition from a drop-down list to display the condition in condition field 244. Moreover, the location with high detection difficulty is not limited to the location where detection errors frequently occur or where the degree of deviation is low, as described above.

[0103] Here, the "descending order of failed detection" or the "ascending order of the degree of deviation" corresponds to the predetermined rule of the present invention, and the "location of high detection difficulty" also corresponds to the predetermined rule of the present invention. Furthermore, "random" also corresponds to a predetermined rule of the present invention.

[0104] The constitutive requirements of the present invention are described below with reference to reference numerals in order to allow comparison with the configurations of the examples below. <Ergänzung 1>

[0105] Device (30) for generating a composite foreign body image obtained by combining an image of foreign bodies onto an image of a printed circuit board in order to adjust an inspection parameter of an inspection program applied to inspect for the presence or absence of the foreign body on the printed circuit board based on the image of the printed circuit board, wherein the device (30) for generating a foreign body composite image comprises: a basic data acquisition unit (33) configured to acquire a printed circuit board image representing the image of the printed circuit board, a foreign body image representing the image of the foreign body, and foreign body-related information representing information relating to the foreign body image; and an assembly unit (32) which is configured to assemble the foreign body image onto an assembly position of the printed circuit board image which has been determined according to a predetermined rule to produce the foreign body assembly image. <Ergänzung 2>

[0106] Device (30) for generating a composite foreign body image according to Supplement 1, wherein the rule is based on an index value that includes the presence or absence of a failed detection during inspection. <Ergänzung 3>

[0107] Device (30) for generating a composite foreign body image according to Supplement 1 or 2, wherein the rule is based on an index value comprising a difference between a measurement of the foreign body and the inspection parameter. <Ergänzung 4>

[0108] Device (30) for producing a composite foreign body image according to one of the Supplements 1 to 3, wherein the rule is based on an index value comprising a difference between an average color of the foreign body and a color at a position of the printed circuit board image onto which the foreign body image is to be composited, and wherein the assembling unit determines the assembling position in ascending order of the difference. <Ergänzung 5>

[0109] Device (30) for generating a composite foreign body image according to one of the amendments 1 to 4, wherein the land edge area of ​​the printed circuit board, a resist or an automatic setting can be selected as the assembly position. <Ergänzung 6>

[0110] Device (30) for generating a composite foreign body image according to one of the supplements 1 to 5, further comprising a display unit (30f) which is configured to display a test screen (200) which a foreign body image display area (210) for displaying the foreign body image in conjunction with the foreign body-related information; and a composition content display area (240) to display a composition position and the number of composing foreign body images for each of the foreign body images displayed in the foreign body image display area. <Ergänzung 7>

[0111] Device (30) for generating a composite foreign body image according to one of the amendments 1 to 6, wherein the basic data acquisition unit (33) acquires the foreign body image and the foreign body-related information from a foreign body library (27) in which the foreign body image and the foreign body-related information are stored in a linked manner. <Ergänzung 8>

[0112] Device (30) for generating a composite foreign body image according to Supplement 7, further comprising the foreign body library (27). <Ergänzung 9>

[0113] Method for generating a composite foreign body image obtained by combining an image of a foreign body with an image of a printed circuit board in order to adjust an inspection parameter of an inspection program applied to inspect for the presence or absence of the foreign body on the printed circuit board, based on the image of the printed circuit board, wherein the method for generating the composite foreign body image comprises: capturing a printed circuit board image representing the image of the printed circuit board;

[0114] Capturing a foreign body image that represents the image of the foreign body; capturing information regarding the foreign body that is information regarding the foreign body image; and generating the composite foreign body image by assembling the foreign body image at an assembly position of the printed circuit board image that has been determined according to a predetermined rule. <Ergänzung 10>

[0115] Method for generating a composite image of foreign bodies according to Supplement 9, wherein the rule is based on an index value that includes the presence or absence of a failed detection during inspection. <Ergänzung 11>

[0116] Method for generating a composite image of foreign bodies according to Supplement 9 or 10, wherein the rule is based on an index value comprising a difference between a measurement of the foreign body and the inspection parameter. <Ergänzung 12>

[0117] Method for generating a composite foreign body image according to one of Supplements 9 to 11, wherein the rule is based on an index value comprising a difference between an average color of the foreign body and a color at a position of the plate image onto which the foreign body image is to be composited, and the composite position is determined in ascending order of the difference. <Ergänzung 13>

[0118] Method for generating a composite foreign body image according to one of the amendments 9 to 12, wherein the assembly position can be selected as either the land edge area of ​​the printed circuit board, a resist or an automatic setting. <Ergänzung 14>

[0119] Method for generating a composite foreign body image according to one of the amendments 9 to 13, wherein the foreign body image and the foreign body-related information are obtained from a foreign body library (27) in which the foreign body image and the foreign body-related information are stored in a linked manner. <Ergänzung 15>

[0120] A data structure (27) in which a foreign body image representing an image of a foreign body present on a printed circuit board is linked with foreign body-related information, including information relating to the foreign body image used to determine a composition position at which the foreign body image is assembled when a foreign body composition image, which is used to adjust an inspection parameter of an inspection program applied to the inspection for the presence or absence of the foreign body on the printed circuit board, is generated by assembling the foreign body image onto the image of the printed circuit board based on an image of the printed circuit board. REFERENCE MARK LIST 30 teaching terminals 32 transmission unit 33 Image output unit QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 2022-108855

[0006]

Claims

Device for generating a composite foreign body image, in order to produce a composite foreign body image obtained by combining an image of a foreign body with an image of a printed circuit board, in order to adjust an inspection parameter of an inspection program applied to inspect for the presence or absence of the foreign body on the printed circuit board, based on the image of the printed circuit board, wherein the device for generating the composite foreign body image comprises: a basic data acquisition unit configured to acquire a printed circuit board image representing the image of the printed circuit board, a foreign body image representing the image of the foreign body, and foreign body-related information representing information relating to the foreign body image;and an assembly unit configured to assemble the foreign body image at an assembly position of the printed circuit board image, which is determined according to a predetermined rule to produce the assembled foreign body image. Device for generating a composite foreign body image according to claim 1, wherein the rule is based on an index value that includes the presence or absence of a failed detection during inspection. Device for generating a composite foreign body image according to claim 1, wherein the rule is based on an index value comprising a difference between a measured value of the foreign body and the inspection parameter. Device for generating a composite foreign body image according to claim 1, wherein the rule is based on an index value comprising a difference between an average color of the foreign body and a color at a position of the printed circuit board image onto which the foreign body image is to be composited, and the assembling unit determines the assembling position in ascending order of the difference. Device for generating a composite foreign body image according to claim 1, wherein the assembly position can be selected as either the land edge area of ​​the circuit board, a resist or an automatic setting. Device for generating a composite foreign body image according to claim 1, further comprising a display unit configured to display a test screen comprising: a foreign body image display area for displaying the foreign body image in conjunction with the foreign body-related information; and a composition content display area for displaying, for each of the foreign body images displayed in the foreign body image display area, a composition position and the number of foreign body images to be combined. Device for generating a composite foreign body image according to claim 1, wherein the basic data acquisition unit acquires the foreign body image and the foreign body-related information from a foreign body library in which the foreign body image and the foreign body-related information are stored in a linked manner. Device for generating a composite foreign body image according to claim 7, further comprising the foreign body library. A method for generating a composite foreign body image obtained by combining an image of a foreign body with an image of a printed circuit board (PCB) to adjust an inspection parameter of an inspection program used to inspect for the presence or absence of the foreign body on the PCB, based on the PCB image, wherein the method for generating a foreign body composite image comprises: capturing a PCB image representing the PCB; capturing a foreign body image representing the foreign body; capturing information regarding the foreign body, which is information regarding the foreign body image; and generating the composite foreign body image by combining the foreign body image at a combination position of the PCB image determined according to a predetermined rule. Method for generating a composite foreign body image according to claim 9, wherein the rule is based on an index value that includes the presence or absence of a failed detection during inspection. Method for generating a composite foreign body image according to claim 9, wherein the rule is based on an index value comprising a difference between a measurement of the foreign body and the inspection parameter. Method for generating a composite foreign body image according to claim 9, wherein the rule is based on an index value comprising a difference between an average color of the foreign body and a color at a position of the printed circuit board image onto which the foreign body image is to be composited, and wherein the composite position is determined in ascending order of the difference. Method for generating a composite foreign body image according to claim 9, wherein the assembly position can be either the land edge area of ​​the printed circuit board, a resist or an automatic setting. Method for generating a composite foreign body image according to claim 9, wherein the foreign body image and the information associated with the foreign body are retrieved from a foreign body library in which the foreign body image and the information associated with the foreign body are stored in a linked manner. A data structure in which a foreign body image, representing an image of a foreign body present on a printed circuit board, is linked with foreign body-related information, including information relating to the foreign body image and used to determine a composition position at which the foreign body image is assembled, when a composite foreign body image, used to adjust an inspection parameter of an inspection program used to inspect for the presence or absence of the foreign body on the printed circuit board, is created by assembling the foreign body image with an image of the printed circuit board, based on the image of the printed circuit board.

Images