Temperature control device for the manufacture of lutein vapor eye masks

Abstract

Temperature control device for the manufacture of lutein vapor eye masks, comprising an upper housing (1), a lower housing (2) and a second temperature sensor (11), wherein the upper housing (1) is attached above the lower housing (2), an air outlet opening (101) is provided on one side of the upper housing (1), a fan (7) is attached to the side of the upper housing (1) opposite the air outlet opening (101), a mounting component (8) is attached to the outer side wall of the lower housing (2), and a liquid storage chamber (21) and a mechanical chamber (22) are provided inside the lower housing (2), wherein the liquid storage chamber (21) is filled with a heatable or coolable liquid medium, and a heater (4) is attached in the liquid storage chamber (21), and wherein a semiconductor cooling element (5) with a liquid medium for cooling is provided inside the mechanical chamber (22).a snake (3) is attached inside the upper housing (1), and a pump (6) for conveying the medium from the liquid storage chamber (21) into the snake (3) is attached in the mechanical chamber (22), and a control unit (9) is permanently attached inside the mechanical chamber (22).

Description

[0001] The present invention relates to the technical field of the manufacture of lutein vapor eye masks, in particular a temperature control device for the manufacture of lutein vapor eye masks.

[0002] In the manufacturing process of precision healthcare products such as lutein vapor eye masks, the temperature and humidity of the production environment are key parameters that influence product quality, stability, and production efficiency. Different production stages have varying temperature and humidity requirements. For example, the raw material storage area, the mixing and filling area, the heat-sealing and packaging area, and the finished product testing area must each be kept strictly within specific temperature and humidity ranges to ensure material activity, seal quality, and the accuracy of test results. Therefore, within a workshop with overall temperature and humidity control, it is particularly important to implement finely tuned local environmental control at critical processing points.

[0003] Currently, production workshops typically use a central air conditioning system or a zone-based ventilation system with fan-assisted cooling units (FCUs) for temperature control. Such systems distribute air evenly throughout the room via ceiling-mounted air outlets and aim to maintain an average temperature and humidity level for the entire workshop or larger areas. Their operating mode is based on setting a target temperature and adjusting the supply of heating or cooling agent to bring the overall room temperature up to this target value. This therefore represents a globally oriented, coarse regulation.

[0004] However, significant disadvantages arise when such large-scale and uniform temperature control approaches are used in precision production environments with multiple, differing temperature requirements: Because the systems can only provide a single or a very limited number of setpoint temperatures, they distribute the heating or cooling air uniformly across the entire controlled area. This means that, within the same physical space, both the demanding processing points with high accuracy requirements (e.g., a test chamber at 21–25 °C) and the normal areas (e.g., a warehouse at 0–35 °C) are forced to accept the same supply air temperature. To meet the most stringent requirements of each point, overall efficiency often has to be sacrificed, or the temperature in the normal areas must also be kept within a narrow range.More importantly, existing systems for locally heat-generating equipment (such as heat-sealing machines) or particularly demanding workstations lack targeted compensation capabilities. This can easily result in the actual temperature at these critical points deviating from the process window, creating regulatory blind spots and compromising product quality. Therefore, there is an urgent need for a control device that integrates with the central air conditioning system and enables precise local temperature compensation at the relevant points.

[0005] The object of the present invention is to overcome the disadvantages of the prior art and to provide a temperature control device for the manufacture of lutein vapor eye masks.

[0006] To solve the aforementioned problem, the present invention is implemented by the following technical solution: a temperature control device for the manufacture of lutein vapor eye masks, comprising an upper housing, a lower housing, and a second temperature sensor, wherein the upper housing is mounted above the lower housing, an air outlet opening is provided on one side of the upper housing, a fan is mounted on the side of the upper housing opposite the air outlet opening, a mounting component is mounted on the outer side wall of the lower housing, and a liquid storage chamber and a mechanical chamber are provided inside the lower housing, wherein the liquid storage chamber is filled with a heatable or coolable liquid medium, and a heating device is mounted in the liquid storage chamber, and wherein a semiconductor cooling element with a liquid medium for cooling is located inside the mechanical chamber.a snake is attached inside the upper housing, and a pump for conveying the medium from the liquid storage space into the snake is attached in the mechanical chamber, and a control unit is permanently attached inside the mechanical chamber.

[0007] Furthermore, the assembly component comprises a U-shaped plate which is attached to the outer side wall of the lower housing, wherein a threaded spindle is continuous and screwed into the side wall of the U-shaped plate, wherein one end of the threaded spindle which is arranged inside the U-shaped plate is rotatably connected to a pressure plate via a bearing, and wherein a rotary knob is attached to the other end of the threaded spindle.

[0008] Furthermore, several fins are attached to the cold side of the semiconductor cooling element, extending into the liquid storage chamber, and several cooling fins are attached to the hot side of the semiconductor cooling element, with a cooling opening provided in the side wall of the lower housing near the cooling fins.

[0009] Furthermore, the liquid inlet opening of the pump is connected to the interior of the liquid storage chamber via a pipe, and a liquid pipe is firmly connected between the liquid outlet opening of the pump and the coil, with the other end of the coil being connected to the top wall of the liquid storage chamber.

[0010] Furthermore, a first temperature sensor is attached inside the liquid storage chamber, and the first temperature sensor is electrically connected to the control unit.

[0011] Furthermore, the second temperature sensor is firmly attached to the processing point by means of a screw, and the second temperature sensor is electrically connected to the control unit.

[0012] The invention has the following advantageous effects: The present invention achieves precise local temperature compensation at specific processing points within the workshop area through a liquid-based, circulating temperature control structure. The device can be flexibly positioned above key equipment or areas using its mounting component. Its central operating principle is to rapidly heat or cool the heat exchange medium in the closed liquid storage chamber using a heating element or a semiconductor cooling element. Subsequently, the pump circulates the hot or cold medium through the heat dissipation coil. The temperature change at the coil's surface is dissipated by the fan's airflow, thus forming a directed airflow with adjustable temperature that is precisely directed onto the target processing point.This allows the entire workshop space to maintain a base temperature background, while the device makes precise fine adjustments in the key areas, thus effectively solving the problem that large-scale air conditioning systems cannot meet local varying temperature requirements.

[0013] In the present invention, a second temperature sensor is provided at the target processing point to directly and in real time measure the actual temperature at that point. The measured data is continuously fed back to the device's control unit, which compares this value with the preset target temperature. As soon as a deviation is detected, the control unit automatically and intelligently adjusts the power output of the heating element and the semiconductor cooling element inversely, while simultaneously coordinating the pump flow rate and the fan speed, thus forming a dynamic control loop. This significantly improves the response speed and the final accuracy of the temperature control, ensuring that the ambient conditions at the processing point are always maintained within the optimal range. Fig. Figure 1 shows a perspective overall view of the present invention. Fig. Figure 2 shows an overall cross-section of the present invention. Fig. Figure 3 shows a perspective view of the assembly component of the present invention. Fig. Figure 4 shows a structural block diagram of the present invention.

[0014] As in Fig.As shown in Figures 1 to 4, the present invention relates to a temperature control device for the manufacture of lutein vapor eye masks, comprising an upper housing 1, a lower housing 2 and a second temperature sensor 11, wherein the upper housing 1 is attached above the lower housing 2, an air outlet opening 101 is provided on one side of the upper housing 1, a fan 7 is attached to the side of the upper housing 1 opposite the air outlet opening 101, a mounting component 8 is attached to the outer side wall of the lower housing 2, and a liquid storage chamber 21 and a mechanical chamber 22 are provided inside the lower housing 2, wherein the liquid storage chamber 21 is filled with a heatable or coolable liquid medium, and a heating device 4 is attached in the liquid storage chamber 21, and wherein a semiconductor cooling element 5 with a liquid medium for cooling is provided inside the mechanical chamber 22.a snake 3 is attached inside the upper housing 1, and a pump 6 for conveying the medium from the liquid storage chamber 21 into the snake 3 is attached in the mechanical chamber 22, and a control unit 9 is permanently attached inside the mechanical chamber 22.

[0015] In the present embodiment, a Siemens SIMATIC KP1200 series controller with screen (combination of HMI and PLC) is used as the controller 9. The controller 9 is connected via electrical lines to the heater 4, the semiconductor cooling element 5, the pump 6, and the fan 7 to control their operation. The associated control principles and electrical connection types are part of the prior art for PLC controllers and are therefore not described further.

[0016] The assembly component 8 comprises a U-shaped plate 81 attached to the outside of the lower housing 2. A threaded spindle 82 is continuously and screwed into the side wall of the U-shaped plate 81. The end of the threaded spindle 82 located inside the U-shaped plate 81 is rotatably connected to a pressure plate 83 via a bearing, and a knob is fixedly attached to the other end of the threaded spindle 82.

[0017] During assembly, the U-shaped plate 81 is placed onto the device corresponding to the processing point (any flange area that accommodates the U-shaped plate 81 can be used). The threaded spindle 82 is then turned using the knob, which moves the pressure plate 83. This causes the pressure plate 83 to exert a pressing force on the mounting area of ​​the device, thus assembling the main part of the assembly. The helix angle of the thread between the threaded spindle 82 and the U-shaped plate 81 is smaller than the equivalent friction angle to ensure self-locking.

[0018] The second temperature sensor 11 is attached to the processing point by means of a screw and electrically connected to the control unit 9. Alternatively, the second temperature sensor 11 can also be attached in another way, for example, by magnetic force. The temperature at the respective processing point can be measured in real time via the second temperature sensor 11 and reported back to the control unit 9, so that the control unit 9 can control the operation of the heater 4, the semiconductor cooling element 5, the pump 6, and the fan 7 accordingly.

[0019] Several fins are attached to the cold side of the semiconductor cooling element 5, extending into the liquid storage chamber 21, and several cooling fins are attached to the hot side of the semiconductor cooling element 5, with a cooling opening provided in the side wall of the lower housing 2 near the cooling fins.

[0020] By activating the semiconductor cooling element 5, the liquid within the liquid storage chamber 21 can be cooled via the cooling fins. The arrangement of the cooling fins and the cooling openings ensures smooth operation of the semiconductor cooling element 5.

[0021] The heating device 4 is used to heat the liquid within the liquid storage chamber 21.

[0022] The liquid inlet of pump 6 is connected via a line to the interior of the liquid storage chamber 21, and a liquid line 61 is permanently connected between the liquid outlet of pump 6 and the coil 3, with the other end of the coil 3 connected to the top wall of the liquid storage chamber 21. By activating pump 6, the liquid can be pumped from the liquid storage chamber 21 into the coil 3. Subsequently, the fan 7 cools the surface temperature of the coil 3 to the predetermined processing point, thus achieving temperature control. The liquid then flows from the coil 3 back into the liquid storage chamber 21, thus completing a cycle.

[0023] Inside the liquid storage chamber 21, a first temperature sensor 10 is mounted and electrically connected to the control unit 9. The first temperature sensor 10 serves to monitor the temperature of the liquid within the liquid storage chamber 21 in real time. After receiving the temperature information back, the control unit 9 controls the heater 4 or the semiconductor cooling element 5 to maintain the liquid at a specific temperature. Once temperature control is initiated, the operation of the fan 7 and the pump 6 is determined by the temperature returned by the second temperature sensor 11, while the operation of the heater 4 and the semiconductor cooling element 5 is controlled by the temperature returned by the first temperature sensor 10.

[0024] Operating principle: During assembly, the U-shaped plate 81 of the mounting component 8 is attached to the device flange at the target processing point. Tightening the threaded spindle 82 presses the pressure plate 83 against the mounting point, thus completing the assembly. Simultaneously, the second temperature sensor 11 is attached to the processing point to monitor the temperature there.

[0025] After system startup, the control unit 9 compares the set target temperature with the actual temperature at the processing point, as reported by the second temperature sensor 11. If a temperature increase is required, the heater 4 is activated to heat the liquid medium in the liquid storage chamber 21. If a temperature decrease is required, the semiconductor cooling element 5 is activated to cool the liquid via the cooling fins on its cold side. Simultaneously, depending on the control requirements, the control unit 9 activates the pump 6 to pump the medium, heated or cooled in the liquid storage chamber 21, through the liquid line 61 into the coil 3 and circulate it there.

[0026] The first temperature sensor 10 continuously monitors the current temperature of the liquid in the liquid storage chamber 21 and transmits this information to the control unit 9. Based on this data, the control unit 9 dynamically adjusts the operating state of the heating device 4 or the semiconductor cooling element 5 so that the temperature of the liquid medium is kept stable within the set range.

[0027] When the liquid flows through the coil 3, the fan 7 is activated. The airflow generated by the fan 7 carries the cold or heat adhering to the surface of the coil 3 through the air outlet 101 to the target processing point, thus enabling directional temperature compensation. The second temperature sensor 11 continuously monitors the temperature change at this point and transmits this information back to the control unit 9. The control unit 9 then establishes a closed-loop control system, finely adjusting the power output of the heater 4 and the semiconductor cooling element 5 in real time and simultaneously coordinating the flow rate of the pump 6 and the air velocity of the fan 7 until the temperature at the processing point is precisely and stably set to the target value. This enables cooperation with the central air conditioning system to achieve highly accurate local temperature control at critical points. Reference symbol list 1 Upper housing 101 Air outlet opening 2 lower housings 21 Liquid storage space 22 Mechanics Chamber 3 Snake 4 Heating unit 5 Semiconductor cooling element 6 pump 61 Liquid line 7 fans 8 Assembly component 81 U-shaped plate 82 Threaded spindle 83 Printing plate 9 Control unit 10 first temperature sensor 11 second temperature sensor

Claims

[1] Temperature control device for the manufacture of lutein vapor eye masks, comprising an upper housing (1), a lower housing (2) and a second temperature sensor (11), wherein the upper housing (1) is attached above the lower housing (2), an air outlet opening (101) is provided on one side of the upper housing (1), a fan (7) is attached to the side of the upper housing (1) opposite the air outlet opening (101), a mounting component (8) is attached to the outer side wall of the lower housing (2), and a liquid storage chamber (21) and a mechanical chamber (22) are provided inside the lower housing (2), wherein the liquid storage chamber (21) is filled with a heatable or coolable liquid medium, and a heater (4) is attached inside the liquid storage chamber (21), and wherein a semiconductor cooling element (5) with a liquid medium for cooling is provided inside the mechanical chamber (22).a snake (3) is attached inside the upper housing (1), and a pump (6) for conveying the medium from the liquid storage chamber (21) into the snake (3) is attached in the mechanical chamber (22), and a control unit (9) is permanently attached inside the mechanical chamber (22). [2] Temperature control device according to claim 1, characterized by , that the assembly component (8) comprises a U-shaped plate (81) which is attached to the outer side wall of the lower housing (2), wherein a threaded spindle (82) is continuous and screwed into the side wall of the U-shaped plate (81), wherein one end of the threaded spindle (82) which is arranged inside the U-shaped plate (81) is rotatably connected to a pressure plate (83) via a bearing, and wherein a rotary knob is attached to the other end of the threaded spindle (82). [3] Temperature control device according to claim 1 or 2, characterized by, that several fins are attached to the cold side of the semiconductor cooling element (5) extending into the liquid storage chamber (21), and that several cooling fins are attached to the hot side of the semiconductor cooling element (5), with a cooling opening being provided in the side wall of the lower housing (2) near the cooling fins. [4] Temperature control device according to one of the preceding claims, characterized by , that the liquid inlet opening of the pump (6) is connected via a line to the interior of the liquid storage chamber (21), wherein a liquid line (61) is firmly connected between the liquid outlet opening of the pump (6) and the snake (3), and the other end of the snake (3) is connected to the top wall of the liquid storage chamber (21). [5] Temperature control device according to any one of the preceding claims, characterized by, that inside the liquid storage chamber (21) a first temperature sensor (10) is attached, wherein the first temperature sensor (10) is electrically connected to the control unit (9). [6] Temperature control device according to any one of the preceding claims, characterized by , that the second temperature sensor (11) is firmly attached to the processing point by means of a screw, wherein the second temperature sensor (11) is electrically connected to the control unit (9).

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