An end cap structure for an LED encapsulation module and an LED encapsulation module with such an end cap structure

Abstract

End cap structure for an LED encapsulation module, characterized in that the end cap structure is attached to a housing of the LED encapsulation module and has a hollow interior for receiving components of the LED encapsulation module, wherein the end cap structure comprises: a base plate; and a projection arranged on the base plate and extending outwards from the base plate in a direction away from the components of the LED encapsulation module, the projection forming the interior; wherein there is an opening on the top of the projection through which a conductor connected to the LED encapsulation module is passed; and wherein the diameter of the opening is larger than the diameter of the conductor.

Description

Technical field: The present invention relates to an end cap structure for an LED encapsulation module and to an LED encapsulation module with such an end cap structure. State of the art: LED light sources have found widespread application in recent years. With the increasing use of LED technology, the application scenarios are becoming ever more diverse, and the requirements for the water and dust resistance of LED driver modules are rising. To meet these requirements and increase safety and lifespan, LED driver modules are typically encapsulated during production. Creating an effective seal for LED driver modules represents one of the challenges that must be addressed in the current state of the art. Common LED encapsulation modules include those with low protection ratings, such as IP20, which can be used in most standard applications and meet typical requirements. However, the demand for LED encapsulation modules with high protection ratings, such as IP67, is increasing. Higher protection requirements necessitate stricter encapsulation standards, such as the need to use more potting compound to achieve a better seal. This makes the potting process more complex and time-consuming, while also increasing the required amount of potting compound. Therefore, one of the current challenges is how to achieve higher protection ratings for LED encapsulation modules under simplified process conditions with minimal use of potting compound. At the same time, there is a need to easily and conveniently convert existing modules with low dust and water resistance into modules with a higher protection class in order to adapt flexibly to different application scenarios - for example, to convert an LED encapsulation module of protection class IP20 into a module of protection class IP67. To solve at least one of the above-mentioned problems, the technical solution of the present invention is proposed. Summary of the invention In view of the above background, an objective of the present invention is to provide an LED end cap structure and an LED encapsulation module that uses this end cap structure. According to one aspect of the invention, an end cap structure for an LED encapsulation module is provided, which is attached to the housing of the LED encapsulation module and has a hollow interior for receiving components of the LED encapsulation module. The end cap structure comprises a base plate and a projection arranged on the base plate, which extends outwards from the base plate in the direction away from the LED component and forms the interior, wherein an opening is provided at the top of the projection through which a conductor connected to the LED component is passed, and wherein the diameter of the opening is larger than the diameter of the conductor. Preferably, the diameter of the opening is 3 to 4 times the diameter of the conduit. Preferably, the end cap structure further comprises a lateral connecting structure designed to engage with the housing of the LED encapsulation module and arranged at the edge of the base plate, protruding above the base plate. Preferably the base plate has a flat surface, and the lateral connecting structure has a circumferential section that surrounds the edge of the flat surface of the base plate and is substantially U-shaped in cross-section, with the edge of the flat surface being enclosed in the central cutout of the U-shape. Preferably, the lateral connection structure comprises several recesses in which the flat surface is not surrounded by the circumferential section, but extends uninterrupted to the edge of the flat surface. Preferably, the projection comprises two or more separate elevations, which are separated from each other by intervening depressions. Preferably, the components of the LED encapsulation module included in the interior of the end cap structure are terminal blocks, with each terminal block being located in the interior of one of the protrusions. Preferably, the end cap structure comprises a sealing element inserted into the opening, which has an internally hollow plug structure, wherein the conduit is guided through the interior of the sealing element to the opening. Preferably, the sealing element has a first projection and a second projection arranged below the first projection, wherein the first projection is arranged above the opening and the second projection is arranged below the opening. Preferably, the first projection is located on the outer circumferential surface of the upper section of the sealing element and extends downwards from the sealing element, and the second projection is located on the outer circumferential surface of the lower section of the sealing element and projects upwards from the sealing element; furthermore, the first projection is arranged above the opening and rests against the surface surrounding the opening from above, while the second projection is arranged below the opening and rests against the surface surrounding the opening from above. Preferably, the maximum outer diameter of the second projection is larger than the diameter of the opening, and the maximum outer diameter of the first projection is larger than that of the second projection. Preferably, the maximum outer diameter of the second projection is 1.2 to 1.5 times the opening diameter, and the maximum outer diameter of the first projection is 1.3 to 1.8 times the opening diameter. Preferably, a rear connection structure is also provided, which is arranged near the edge of the back of the projection and is designed to engage with the extension part of the housing. Preferably, the rear connection structure comprises several projections that engage with corresponding elements of the extension part to connect the extension part to the end cap structure. Preferably, the multiple projections of the rear connecting structure consist of several first projections and several second projections that differ from the first projections. Preferably, the end cap structure further comprises a fastening element that is arranged inside the end cap structure and serves to position and fix a component located therein. Furthermore, in another aspect, an LED encapsulation module is described, comprising a housing and an end cap structure as described in one of the preceding embodiments. Preferably the outer outline of the housing is rectangular, and inside the housing an interior space is formed with an opening at one end, in which components of the LED encapsulation module are arranged. Preferably the housing comprises a main body and an extension part, wherein the underside of the main body extends outwards beyond the side wall of the housing adjacent to the underside, thus forming the extension part. Preferably, the extension part has a flat surface and has several engagement structures near its outer end area that engage with the end cap structure. Preferably, one or more positioning structures are provided on opposite inner walls of the housing. Preferably, the pair of tabs is designed as a guide channel with a funnel-shaped opening at one end, into which a component of the LED encapsulation module to be mounted is inserted and is movable therein, wherein at one end of the pair of tabs the two tabs diverge and the distance between them gradually decreases towards the rear wall of the main body, thereby forming the funnel-shaped inlet, and behind this inlet the two tabs run parallel to each other and have a distance from each other, so that a guide channel is formed. Preferably, the LED encapsulation module also comprises several positioning structures, including a first positioning structure and a second positioning structure with different dimensions. Preferably, the positioning structure is formed integrally with the main body. Preferably, the housing has several pairs of tabs on its rear wall, each pair having an upper and a lower tab arranged opposite each other, and a space is formed between the upper and lower tabs for receiving a component to be mounted, the upper and lower tabs working together to clamp the component. Description of the drawings The aforementioned and further features of the invention will become clearer from the following description and the accompanying exemplary embodiments with reference to the accompanying drawings. Fig. 1 is a schematic representation of the overall construction of an LED encapsulation module with a low protection class. Fig. 2 shows an exemplary representation of the overall construction of an LED encapsulation module with a high protection class according to the present invention. Figs. 3A to 3C show exemplary representations of the housing of an LED encapsulation module according to the present invention. Figs. 4A to 4C show exemplary representations of the end cap structure (closure cap) according to the present invention. Figs. 5A to 5F show an example of the assembly and potting arrangement according to some embodiments of the present invention. Examples of implementation In the following description, the terms “comprise” or its variations (e.g. “have” or “contain”) – unless expressly stated otherwise in the context – mean the presence of the aforementioned features, but do not preclude the possibility that additional features are present or may be added in the various embodiments of the present invention. For example, the terms “horizontal”, “vertical”, “left”, “right”, “transverse”, “longitudinal”, “above”, “below” and similar terms used in this description serve only to explain the relative position of components of the invention and are not intended to define the invention in a specific orientation. Fig. 1 shows an example of a low-protection LED encapsulation module, for example, one with IP20 protection. The LED encapsulation module comprises a housing 1, terminal blocks 5, and an upper encapsulation 6. Fig. 2 shows an example of a high-protection LED encapsulation module, for example with protection class IP67. This LED encapsulation module can comprise a housing 1, a cover 2, leads 3 and a sealing element, such as a sealing ring 4. The following description refers to the construction of the housing with reference to Figs. 1 to 3C. The housing 1, for example, has a substantially rectangular outer outline, and components of the LED encapsulation module are arranged inside, such as electronic components like electrodes, control circuits, etc. Fig. 5A schematically shows an example of components of an LED driver circuit, which comprises various electronic components on a printed circuit board (PCB). The PCB is connected at one end to a terminal block 5, which can be connected to a conductor 3 to establish the electrical connection of the LED encapsulation module to external components. Figures 3A to 3C show the specific structure of the housing 1. The housing 1 can comprise a main body 11, an extension part 12, positioning structures 13 arranged inside the housing 1, tabs 14, and engagement teeth 15. The main body 11 forms an interior space with an opening at one end through which a component to be mounted, such as a printed circuit board, can be inserted into the interior space. Figure 1 shows, by way of example, an upper encapsulation 6 attached to the opening to seal the interior space. Alternatively, as shown by way of example in Figure 2, the end cap structure according to the invention, for example, the closure cover 2, can be installed at the opening to close the interior space. As shown in Fig. 3A, the underside of the main body 11 projects outwards beyond the adjacent side wall of the housing 1, forming the extension part 12. The extension part 12 may have a flat surface against which the terminal block 5 can be mounted. Several through-holes may be provided near the outer end section of the extension part 12, and several recesses may be formed at the edge of this outer end section. The openings and recesses may serve to connect the outer extension part 12 to the end cap 2 and / or, for example, to assist in the positioning and fastening of other components such as the terminal block 5. Fig. 3A further shows an example of the interior of the main body 11. One or more positioning structures 13 can be provided on opposite inner walls of the main body 11. Each positioning structure 13 comprises a pair of tabs that project from the inner wall of the main body 11 into its interior and form a rail structure into which a component of the LED encapsulation module (for example, a printed circuit board) can be inserted and moved. In the longitudinal direction of the main body 11 (i.e., along the axis from the rear wall to the opening of the main body), the ends of the two tabs are spaced apart in the region of the opening, and towards the rear wall of the main body 11, the distance between the two tabs gradually decreases, thus forming a funnel-shaped inlet of the rail structure.Behind this inlet, the two tabs run parallel to each other and are spaced a certain distance apart, forming a guide rail that extends to the rear wall of the main body 11. A component, such as a printed circuit board, can be inserted into the rail via the funnel-shaped inlet, moved along the rail, and positioned and fixed inside the main body 11. The number of positioning structures 13 can be two, each arranged on two opposite inner walls of the main body 11. Alternatively, several positioning structures 13 with different dimensions can be used. In the arrangement shown in Fig. 3A, four positioning structures 13 are provided. A first positioning structure is provided on the inner walls of the main body 11 near the opening. Its pair of tabs forms a relatively small inlet, and its parallel section has a small gap, creating a guide rail with a small gap. A second positioning structure is provided on the inner walls near the rear of the main body 11. Its pair of tabs forms a comparatively larger inlet, and its parallel section has a larger gap, creating a guide rail with a larger gap.The positioning structures described above of the present invention can be formed integrally with the main body 11, for example by thermoplastic molding, or can be designed separately from the main body 11. The positioning structure according to the present invention allows components of different sizes and types to be flexibly mounted and installed, while at the same time the components to be installed can be stably fastened, thereby increasing the reliability of the entire module. Fig. 3C shows an example of the rear inner wall region of the main body 11. Several pairs of vertically opposing tabs 14 are provided on the rear wall of the main body 11, each pair comprising an upper tab and a lower tab. A space for receiving a component to be mounted is formed between the upper and lower tabs, and the two tabs interact to clamp the component. The tabs of the present invention can be formed integrally with the main body 11, for example by thermoplastic molding, or they can be formed separately from the main body 11. The rear panel of housing 11 may also contain information about the housing material and markings for the internal components. A common engineering plastic such as PBT (polybutylene terephthalate) can be used as the housing material to achieve good mechanical properties, heat resistance, and chemical resistance. However, ABS (acrylonitrile butadiene styrene copolymer) or PC (polycarbonate) can also be used. As shown in Figs. 3A and 3B, several connecting elements, for example, engagement teeth 15, are provided at the edge of the opening section of the main body 11 on the side opposite the extension part. The engagement teeth 15 can interact with other components, for example, corresponding counterparts (such as groove strips) at the edge of the upper encapsulation 6, to tightly connect the housing 1 and the upper encapsulation 6. Fig. 1 shows an example of a terminal block 5 which is electrically connected to the components inside the main body 11, such as the circuit board, in order to establish the electrical connection of the LED's internal components with external components. The upper encapsulation 6 can be connected to the housing 1 to form a sealed unit in which the components of the LED encapsulation module are enclosed in the interior formed by housing 1 and upper encapsulation 6. The upper encapsulation 6 comprises a cover plate 61 with a flat surface that can cover the opening area of ​​the main body 11 to protect the components arranged therein (see Fig. 1). Several recesses are provided at the edge of the cover plate 61, which interact with the engagement teeth 15 to complete the encapsulation of the LED encapsulation module. The upper encapsulation 6 also has an opening 63 through which the terminal block 5 protrudes from the cover plate 61. The upper encapsulation 6 also includes an enclosing structure 62 with a roof-like design consisting of interconnected side walls and a top wall. The top wall is arranged essentially parallel to the top plate 61, and the side walls extend laterally forward from above the top plate 61 until they connect to the top wall. The enclosing structure 62 contributes to providing additional protection for the terminal block 5 and the components located in the main body 11. Fig. 2 shows an example of a high-protection LED encapsulation module, for example, with protection class IP67. The structure of the housing and other components is similar to that of the corresponding components in Fig. 1, and therefore the same reference numerals are used. The LED encapsulation module comprises a housing 1, terminal blocks 5 (not shown), and an end cap structure, for example, a cover 2. The basic structure of the housing 1 can be similar to that shown in Fig. 1 and may, for example, include the main body 11, the extension part 12, the positioning structures 13, the tabs 14, and the engagement teeth 15. A detailed description of these parts is omitted here. The sealing cover 2 can be used in place of the upper encapsulation 6 shown in Fig. 1 to convert a low-protection-class LED encapsulation into a high-protection-class LED encapsulation. The sealing cover 2 is mounted on the housing 1 and tightly connected to it via connecting elements to ensure good water and dust protection. This replacement allows a low-protection-class LED encapsulation module to be converted into a high-protection-class LED encapsulation module. Figures 4A to 4C show an example of the construction of the closure cover 2. The closure cover 2 can be designed so that it engages with the housing 1 and together with it forms the overall encapsulation of the LED encapsulation module. The cover 2 can be a hollow housing with an opening inside which components of the LED encapsulation module, for example the terminal block 5, can be installed. The closure cover 2 can comprise a lateral connecting structure 21, a rear connecting structure 22, and a base plate 25. The base plate 25 has a flat surface with a lateral connecting structure 21 projecting beyond its edge. The lateral connecting structure 21 has a circumferential section that surrounds the edge of the flat surface and is essentially U-shaped in cross-section, with the edge of the flat surface enclosed in the central cutout of the U-shape. A downwardly projecting step is formed on the underside of the circumferential section. The circumferential section has several recesses where the flat surface of the base plate 25 is not surrounded but extends uninterrupted to the edge. The number of recesses corresponds to the number of engagement teeth 15 of the main body 11.These recesses allow the lateral connecting structure 21 to engage with the engagement teeth 15 in order to firmly and tightly connect the closure cover 2 and the housing 1. The base plate 25 has a projection 24 that extends outwards from the base plate 25. The height of the projection 24 is dimensioned to be higher than the terminal block 5, and the interior of the projection 24 is designed to accommodate the terminal block 5. The projection 24 can comprise two or more separate protrusions; Fig. 4A shows an embodiment with two protrusions. A recess is formed between adjacent protrusions to accommodate a terminal block. The protrusions are arranged separately from each other so that two terminal blocks are isolated from one another. The number of protrusions can also be selected differently and depends, for example, on the number of electronic components (e.g., terminal blocks) that are to be accommodated by the projection 24 or isolated from one another. An opening 23 is provided in the center of the upper surface of the projection 24. A conductor 3 can be inserted through this opening 23 into the interior of the closure cover 2 to establish an electrical connection with the terminal block. The diameter of the opening 23 is larger than the diameter of the conductor 3, so that the cross-sectional area of ​​the opening 23 not filled by the conductor 3 can serve as a filling opening for potting compound. The diameter of the opening is designed to be 3 to 4 times the conductor diameter, preferably about 3.5 to 4 times. The conductor diameter is, for example, 3 to 10 mm, or 5 mm. The diameter of the opening can be selected, for example, between 9 and 40 mm, or 16.5 mm. The opening 23 allows the conductor to be passed through to establish the electrical connection and simultaneously serves as a filling opening for the potting compound during the potting process.The described design of the opening 23 makes it possible to carry out the potting after mounting the closure cover 2, whereby the required potting quantity is reduced, the potting time is shortened and yet a good seal is achieved. The rear connecting structure 22 is located near the edge of the rear side of the projection 24 and can engage with the extension part 12 of the housing 1 to connect the housing 1 to the closure cover 2. The rear connecting structure 22 can comprise multiple projections; Figures 4A to 4C show, by way of example, multiple first projections 221 and multiple spaced-apart second projections 222, which engage with openings and recesses provided on the extension part 12 of the housing 1 to connect the extension part and the closure cover. A step 26 is formed on the base plate 25, which adjoins a side surface of the projections of the protrusion 24. A vertical surface 27 is arranged above the step 26. Fig. 4C shows an example of the internal structure of the closure cover 2. Inside the closure cover 2, below the opening 23, several fixing elements 28 are provided on the rear side of the plane in which the first projections 221 and the second projections 222 are located. These fixing elements can include internal projections that serve to assist the positioning and assembly of the components enclosed in the housing 1 and the closure cover 2, for example, a printed circuit board. The LED encapsulation module can also include a sealing element, for example, a sealing ring 4. The sealing ring 4 is positioned above the opening 23 to seal the opening 23 and maintain the seal of the LED encapsulation module. The sealing ring 4 has a stepped structure and is clipped into the opening 23 to seal it. One end of the conductor 3 passes through the sealing ring 4 and the opening 23 and is connected to the terminal block enclosed in the housing. The conductor 3 can be a flexible cable and has a length of, for example, approximately 1 m, within a range of 0.5 to 10 m. An example of the sealing element of the present invention is described. This example of the sealing element is the sealing ring 4. Fig. 5D illustrates the relative size relationship between the tube 3 and the opening 23; in this example, the sealing ring 4 has not yet been inserted. When the tube 3 is inserted into the opening 23, a gap exists between the tube and the opening, through which the potting material is introduced between the tube 3 and the opening 23 during the potting process to complete the potting. Fig. 5D shows the state during / after the potting process, shortly before the sealing ring 4 is inserted. The sealing ring 4 consists of a deformable material, for example an elastomer material such as silicone rubber, EPDM (ethylene propylene diene monomer rubber), fluororubber or a thermoplastic elastomer (TPE). The sealing ring 4 has a hollow plug structure with a cable inlet at its upper center. The cable inlet is formed by two or more elastic membranes. When no cable is inserted, the elastic membranes lie against each other and close the cable inlet. When the cable 3 is inserted into the cable inlet, the elastic membranes are forced apart by the cable, thus opening the cable inlet. The sealing ring 4 has a first projection and a second projection. The first projection is located above the second projection, with the first and second projections positioned opposite each other. A gap is formed between the first and second projections. The second projection is located on the outer circumferential surface of the lower section of the sealing ring and extends upwards from the sealing ring. The maximum outer diameter of the second projection is larger than the diameter of the opening 23; for example, it is 1.2 to 1.5 times the opening diameter. The first projection is located on the outer circumferential surface of the upper section of the sealing ring and extends downwards from the sealing ring. The maximum outer diameter of the first projection is larger than that of the second projection; for example, it is 1.3 to 1.8 times the opening diameter. When the sealing ring is pressed downwards into the opening 23 until it contacts the surface of the closure cap 2 surrounding the opening 23, the second projection deforms elastically and is forced downwards through the opening 23.Once the second projection reaches below the opening 23, it rests against the underside of the surface surrounding the opening 23 and presses the lower part of the sealing ring against the underside of this surface. Simultaneously, the first projection deforms elastically; it is now located above the opening 23 and rests against the top surface of the surface surrounding the opening 23. The first projection is engaged on the outside of the closure cover 2 near the edge of the opening 23, and the second projection is located on the inside of the closure cover 2 near the edge of the opening 23. The downward pressure of the first projection and the upward pressure of the second projection firmly fix the sealing ring 4 to the closure cover 2 and seal the housing 1. The process of attaching the closure cover 2 to the housing is explained below with reference to Figs. 5A to 5F. Fig. 5A shows the state in which a printed circuit board (PCB) populated with electronic circuitry and wires is about to be inserted into the housing 1. The PCB is inserted into the guide slot formed by the positioning structure 13 inside the housing 1, pushed into the housing, positioned there, and finally secured by the tabs on the bottom of the housing. Fig. 5B shows the state after the PCB has been secured in the housing 1. After the circuit board is fixed in the housing, the end cap 2 is placed onto the housing 1 via its connecting structures, so that both are tightly connected. Fig. 5C shows the state after the end cap 2 has been installed on the housing 1. The conductor 3 passes through the sealing ring 4. Subsequently, a sealing frame is attached to the outer upper edge of the housing. The inner diameter of this sealing frame corresponds to the outer contour of the housing 1, and its dimensions are approximately equal to or slightly smaller than the outer dimensions of the housing 1. In Fig. 5D, a potting material (e.g. epoxy resin potting, silicone potting or polyurethane potting or another potting material that meets the requirements for transparency, thermal conductivity, insulation, etc. of the LED encapsulation module) is introduced through the opening 23 using a potting device, for example an injection device or a glue gun, to pot the module. During the potting process, the de-vented potting compound can be slowly and evenly applied to the potting area of ​​the LED encapsulation module using a glue gun. This can be done in several stages, with a waiting period after each stage to allow the material to set or spread evenly before the next stage to achieve optimal potting results. After the casting process is complete, a hardening process is carried out, which can be done by normal cooling or by heat treatment, to solidify the cast material. After curing, the sealing ring 4 is inserted into the opening 23 to seal the LED encapsulation module (see Fig. 5E). The sealing frame used during potting can then be removed. This completes the encapsulation of the LED encapsulation module. The above design allows the LED encapsulation module to be encapsulated with the cover 2, and the potting step is only carried out after the cover 2 has been fitted. This makes it possible to encapsulate with a comparatively small amount of potting compound, reduces the time required for potting, and lowers potting costs. The following is an example of the previously mentioned process steps for encapsulating the LED encapsulation module. Step 1: A circuit board equipped with LED electronics is inserted into the housing. Preferably, the housing corresponds to the housing described above and comprises a main body, an extension part, an internal positioning structure and / or a tab structure. The positioning structure of the housing can be used to insert the circuit board along the rail and position it in the housing. Step 2: The circuit board is fixed in the housing so that the terminal block protrudes from the housing opening. Step 3: The terminal block is covered with the end cap structure, and the end cap structure is connected to the housing to form a sealed LED encapsulation module. The end cap structure is the end cap structure described above, which includes a projection, a lateral connecting structure, a sealing element, a rear connecting structure and / or other parts. A sealing frame is attached to the side edge of the housing opening where the housing and end cap structure are joined. The shape of this sealing frame is adapted to the edge contour of the closure cover 2, and its size is slightly smaller than the edge of the closure cover 2. Step 4: Potting compound is introduced into the LED encapsulation module through the opening on the top of the end cap structure. Step 5: After completion of the potting process, the sealing ring of the end cap structure is inserted into the upper opening of the end cap structure to seal this opening. Step 6: The sealing frame is removed. The invention has been described and explained in detail above with reference to the accompanying drawings; however, this is to be understood as illustrative and not limiting. It should be understood that the described embodiments are merely exemplary and not exhaustive, and that the invention is in no way limited to them. It should also be understood that each feature described herein can be used in any embodiment of the invention. The described embodiments are not mutually exclusive and do not exclude other embodiments not expressly mentioned herein. The invention therefore also includes combinations of one or more of the exemplary embodiments mentioned above. Modifications and alterations may be made to the present invention without departing from the spirit and scope of the invention.

Claims

End cap structure for an LED encapsulation module, characterized in that the end cap structure is attached to a housing of the LED encapsulation module and has a hollow interior for receiving components of the LED encapsulation module, wherein the end cap structure comprises: a base plate; and a projection arranged on the base plate and extending outwards from the base plate in a direction away from the components of the LED encapsulation module, the projection forming the interior; wherein there is an opening on the top of the projection through which a conductor connected to the LED encapsulation module is passed; and wherein the diameter of the opening is larger than the diameter of the conductor. End cap structure according to claim 1, characterized in that the diameter of the opening is 3 to 4 times the diameter of the conduit. End cap structure according to one of the preceding claims, characterized in that the end cap structure additionally comprises a lateral connecting structure which is designed to engage with the housing of the LED encapsulation module and is arranged at the edge of the base plate, protruding beyond the base plate. End cap structure according to claim 3, characterized in that the base plate has a flat surface; and the lateral connecting structure has a circumferential section that surrounds the edge of the flat surface of the base plate, wherein the cross-section of the circumferential section is U-shaped and the edge of the flat surface is enclosed in the central cutout of the U-shape. End cap structure according to claim 4, characterized in that the lateral connection structure comprises several recesses in which the flat surface is not surrounded by the circumferential section, but extends uninterrupted to the edge of the flat surface. End cap structure according to one of the preceding claims, characterized in that the projection comprises two or more separate protrusions, wherein adjacent protrusions are separated from each other by a depression. End cap structure according to claim 6, characterized in that the components of the LED encapsulation module included in the interior of the end cap structure include terminal blocks and each terminal block is located in an interior of one of the protrusions. End cap structure according to one of the preceding claims, characterized in that the end cap structure comprises a sealing element which is arranged in the opening and has an internally hollow plug structure, wherein the conduit is guided through the interior of the sealing element to the opening. End cap structure according to claim 8, characterized in that the sealing element comprises a first projection and a second projection which is arranged below the first projection, wherein the first projection is arranged above the opening and the second projection is arranged below the opening. End cap structure according to claim 9, characterized in that the first projection is located on the outer circumference of the upper section of the sealing element and projects downwards from the sealing element, the second projection is located on the outer circumference of the lower section of the sealing element and projects upwards from the sealing element; and the first projection is arranged above the opening and rests downwards against the surface surrounding the opening, while the second projection is arranged below the opening and rests upwards against the surface surrounding the opening. End cap structure according to claim 9 or 10, characterized in that the maximum outer diameter of the second projection is larger than the diameter of the opening and the maximum outer diameter of the first projection is larger than the maximum outer diameter of the second projection. End cap structure according to claim 11, characterized in that the maximum outer diameter of the second projection is 1.2 to 1.5 times the opening diameter and the maximum outer diameter of the first projection is 1.3 to 1.8 times the opening diameter. End cap structure according to one of the preceding claims, characterized in that the end cap structure further comprises a rear connecting structure which is arranged near the edge of the rear side of the projection and is designed to engage with an extension part of the housing. End cap structure according to claim 13, characterized in that the rear connection structure comprises several projections, wherein the projections engage with corresponding elements of the extension part to connect the extension part to the end cap structure. End cap structure according to claim 14, characterized in that the multiple projections of the rear connection structure consist of multiple first projections and multiple second projections, wherein the second projections differ from the first projections. End cap structure according to one of the preceding claims, characterized in that the end cap structure further comprises a fastening element which is arranged inside the end cap structure and serves to position and fix a component located therein. LED encapsulation module, characterized in that the LED encapsulation module comprises a housing and an end cap structure according to one of claims 1 to 16. LED encapsulation module according to claim 17, characterized in that the outer outline of the housing is rectangular and the interior of the housing forms an interior space with an opening open at one end, in which components of the LED encapsulation module are arranged. LED encapsulation module according to claim 18, characterized in that the housing comprises a main body and an extension part, wherein the underside of the main body projects outwards beyond the side wall of the housing adjacent to the underside and thus forms the extension part. LED encapsulation module according to claim 19, characterized in that the extension part has a flat surface and the extension part has several engagement structures near its outer end section which engage with the end cap structure. LED encapsulation module according to one of claims 17 to 20, characterized in that one or more positioning structures are provided on opposite inner walls of the housing, each positioning structure comprising a pair of tabs that project from the inner wall of the main body of the housing into its interior. LED encapsulation module according to claim 21, characterized in that the pair of tabs is designed as a guide channel with a funnel-shaped opening at one end, into which a component of the LED encapsulation module to be mounted is inserted and is movable therein, wherein at one end of the pair of tabs the two tabs diverge and the distance between the two tabs gradually decreases towards the rear wall of the main body, thereby forming the funnel-shaped inlet, and behind the inlet the two tabs run parallel to each other and have a distance from each other, thereby forming the guide channel. LED encapsulation module according to claim 21 or 22, characterized in that the LED encapsulation module comprises several positioning structures, wherein these positioning structures comprise a first positioning structure and a second positioning structure with different dimensions. LED encapsulation module according to one of claims 21 to 23, characterized in that the positioning structure is formed integrally with the main body. LED encapsulation module according to one of claims 17 to 24, characterized in that the housing has several pairs of tabs on its rear wall, each pair comprising an upper and a lower tab arranged opposite each other, and a space for receiving a component to be mounted is formed between the upper and the lower tab, wherein the upper and the lower tabs cooperate to clamp the component.

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