Power combiner with symmetrically arranged heat sink and power combiner arrangement

Description

[0001] The invention relates to a power combiner for coupling and / or splitting high-frequency signals with a frequency of more than 1 MHz to an output power of more than 100 W. The invention further relates to a power combiner arrangement comprising such a power combiner.

[0002] It is known to use power combiners with electrical conductors to combine several high-frequency signal sources and / or to split a high-frequency signal.

[0003] EP 1 699 107 A1 discloses a power combiner comprising a second electrical conductor spaced apart from a first electrical conductor. The first electrical conductor is capacitively and inductively coupled to the second electrical conductor. According to EP 1 699 107 A1, both the first electrical conductor and the second electrical conductor can have multiple windings to increase the inductive coupling between the two conductors.

[0004] Other power combiners are known, for example, from the following documents: US 8 044 749 B1, DE 103 42 611 A1, US2014 / 0085019 A1, US 3 506 932 A, US 5 521 563 A, US 2001 / 028283 A1, US 4 091 343 A.

[0005] A power combiner must be adequately cooled. Effective cooling can be achieved with a heat sink. The heat sink should be positioned close to the electrical conductors to ensure good heat dissipation.

[0006] However, due to the proximity of the electrical conductors to the heat sink, a parasitic capacitance develops between the heat sink and the electrical conductors: The closer the electrical conductors are to the heat sink, the more effective the cooling, but the greater the parasitic capacitance. As a result of this parasitic capacitance, the behavior of the power combiner is adversely affected.

[0007] The object of the present invention is therefore to provide a power combiner and a power combiner arrangement which have both effective cooling by a heat sink and a minimal adverse electrical influence of the heat sink on the performance characteristics of the power combiner.

[0008] This object is achieved according to the invention by a power combiner having the features of patent claims 1-3 and a power combiner arrangement having the features of patent claim 13. The subclaims specify expedient developments.

[0009] The object of the invention is thus achieved by a symmetrical arrangement of the electrical conductors with respect to the heat sink. This distributes parasitic capacitances symmetrically between the two conductors, resulting in a significantly more favorable overall effect on the performance characteristics of the power combiner.

[0010] The following paragraph is to be understood as a disclosure which may be suitable for further restricting the scope of protection, but should not be used to interpret the applicable scope of protection: The total area of ​​the first electrical conductor is preferably more than 75%, in particular more than 80%, particularly preferably more than 90%, equidistant from the heat sink as the total area of ​​the second electrical conductor.

[0011] The power combiner according to the invention is preferably designed as a 90° hybrid coupler. More preferably, the power combiner can be operated as a power splitter. Particularly preferably, the power combiner is designed as a power splitter for outputting power levels of more than 100 W.

[0012] The power combiner is preferably designed for coupling high-frequency signals between 1 MHz and 200 MHz.

[0013] Particularly preferably, the power combiner is designed to output powers above 2 kW.

[0014] In a particularly preferred embodiment of the power combiner, the power combiner is designed to have a transmission loss of less than 0.5 dB, in particular less than 0.3 dB, more preferably less than 0.1 dB when operating at a frequency of ±10% of the fundamental frequency.

[0015] A load, particularly in the form of a plasma system, can preferably be connected to the output of the power combiner. The compensating connection can preferably be connected to a ground, particularly via a terminating resistor. The terminating resistor preferably has a reference impedance, which can be 25 Ω or 50 Ω. The reference impedance is the impedance for which the power combiner is designed at its inputs or outputs.

[0016] The heat sink is preferably designed in the form of a cooling plate. The cooling plate can have fluid-flow lines, in particular water lines.

[0017] For effective inductive coupling of the first conductor to the second conductor, the first electrical conductor and the second electrical conductor preferably each have a number of turns n > 1.

[0018] The number of turns of the first electrical conductor and the second electrical conductor is preferably n > 2, in particular n = 3, more preferably n > 3.

[0019] An inner turn of the first electrical conductor and / or the second electrical conductor may have a path piece that is not parallel to an outer turn in order to create a phase balance between the inner turn and the outer turn.

[0020] The capacitive and inductive coupling of the power combiner is improved and the arrangement is designed symmetrically in that the total area of ​​the first electrical conductor is more than 60% congruent, and in particular coplanar, with the total area of ​​the second electrical conductor.

[0021] The following paragraph is to be understood as a disclosure which may be suitable for further restricting the scope of protection, but should not be used to interpret the applicable scope of protection: The total area of ​​the first electrical conductor is preferably more than 70%, in particular more than 80%, particularly preferably more than 90% congruent, and in particular coplanar, with the total area of ​​the second electrical conductor.

[0022] The reference impedance can be reduced to values ​​below 50 Ω. This reduces the inductance of the first and second electrical conductors, allowing the assembly to be carried out on a smaller surface area.

[0023] Preferably, the reference impedance at a frequency of more than 1 MHz is 25 Ω at the first and second inputs.

[0024] More preferably, the reference impedance at a frequency of more than 3 MHz, 10 MHz, 40 MHz, 100 MHz or 200 MHz at the first and second inputs is less than 50 Ω in each case, in particular less than 25 Ω in each case.

[0025] The following four paragraphs are to be understood as a disclosure that may be suitable for further restricting the scope of protection, but should not be used to interpret the applicable scope of protection: In a preferred embodiment according to claim 1, the first electrical conductor can have a first primary conductor piece and a second primary conductor piece, and the second electrical conductor can have a first secondary conductor piece and a second secondary conductor piece. In such an embodiment or in an embodiment according to claim 2 or 3, the second secondary conductor piece is more than 70% coplanar and congruently offset from the first primary conductor piece, and the second primary conductor piece is more than 70% coplanar and congruent with the first secondary conductor piece.

[0026] In such embodiments, the second secondary conductor piece preferably runs at least partially below the first primary conductor piece and the second primary conductor piece preferably runs at least partially below the first secondary conductor piece.

[0027] The second second conductor piece preferably runs more than 80%, in particular more than 90%, coplanar and congruently offset to the first first conductor piece and the second first conductor piece preferably runs more than 80%, in particular more than 90%, coplanar and congruent to the first second conductor piece.

[0028] In such embodiments, the first primary conductor piece runs parallel to the first secondary conductor piece to more than 70%, in particular to more than 80%, particularly preferably to more than 90%, and the second secondary conductor piece runs parallel to the second primary conductor piece to more than 70%, in particular to more than 80%, particularly preferably to more than 90%.

[0029] The heat sink can be arranged between the first secondary conductor section and the second primary conductor section. This achieves a particularly symmetrical design of the power combiner.

[0030] The power combiner can have an air gap between the first and second electrical conductors. Preferably, however, the power combiner has a dielectric, in particular an electrically insulating substrate, between the planar surface electrode of the first electrical conductor and the planar surface electrode of the second electrical conductor. This allows the power combiner to be manufactured particularly compactly and cost-effectively. Furthermore, the dielectric, in particular the electrically insulating substrate, protects against arcing between the electrical conductors.

[0031] The planar surface electrode of the first electrical conductor and the planar surface electrode of the second electrical conductor can be arranged directly on a dielectric, in particular an electrically insulating substrate.

[0032] The planar surface electrode of the first electrical conductor can be arranged at least partially, in particular completely, on a first dielectric, in particular an electrically insulating substrate, and the planar surface electrode of the second electrical conductor can be arranged at least partially, in particular completely, on a second dielectric, in particular an electrically insulating substrate, of the power combiner.

[0033] In a further embodiment of one of these embodiments, a first first conductor piece of a first surface electrode can be arranged on the first main side of a first dielectric, in particular an insulating substrate, and a second first conductor piece of the first surface electrode can be arranged on the first main side of a second dielectric, in particular an insulating substrate, wherein a first second conductor piece of a second surface electrode is arranged on the second main side of the first dielectric, in particular an electrically insulating substrate, and a second second conductor piece of the second surface electrode is arranged on the second main side of the second dielectric, in particular an insulating substrate.

[0034] Alternatively or additionally, in one of the aforementioned embodiments, a first planar surface electrode and a second planar surface electrode can have sections that alternately extend on a first planar main side of a dielectric, in particular an electrically insulating substrate, and on a second planar main side of a dielectric, in particular an electrically insulating substrate, opposite the first planar main side. The aforementioned first main side and the aforementioned second main side are preferably main sides of a single dielectric, in particular an electrically insulating substrate.

[0035] The power combiner may comprise a multilayer circuit board, wherein the multilayer circuit board comprises the planar surface electrode of the first electrical conductor and the planar surface electrode of the second electrical conductor.

[0036] At least one dielectric, particularly an electrically insulating substrate, of the multilayer printed circuit board can comprise printed circuit board material made of epoxy resin fabric. A further layer of the multilayer printed circuit board can comprise polytetrafluoroethylene or a polyimide-containing conductor carrier material. This significantly increases the electrical breakdown strength while simultaneously reducing manufacturing costs.

[0037] The multilayer printed circuit board preferably has lateral dimensions in the main plane of the multilayer printed circuit board, in which the surface electrodes of the first and second conductors extend, of less than λ / 100, in particular of less than λ / 200, wherein λ refers to a frequency at the first and second input of more than 1 MHz, in particular of more than 3 MHz, 10 MHz, 40 MHz, 100 MHz or 200 MHz.

[0038] The power combiner can be designed as a 90° hybrid.

[0039] If the 90° hybrid is used to couple high-frequency signals, the signals at the two inputs are coupled together to one output if the signals at the inputs are 90° out of phase.

[0040] If the 90° hybrid is used to split high-frequency signals, a signal applied to one input is split equally between two outputs, with the two split signals being phase-shifted by 90°.

[0041] The first and second electrical conductors can each have the same inductance LK. A capacitance CK can develop between the first and second electrical conductors due to the dimensions of the coupler.

[0042] For a 90° hybrid, the inductance LK and the capacitance CK can be designed as follows: L K = Z 0 / 1 π f C K = 1 / 2 π f Z 0

[0043] Where Z 0 is the reference impedance and f is the frequency for which the 90° hybrid is designed.

[0044] The object of the invention is further achieved by a power combiner arrangement with a previously described power combiner, wherein the power combiner arrangement has a first high-frequency signal source connected to the first input and a second high-frequency signal source connected to the second input, and in particular a consumer connected to the output.

[0045] The first high-frequency signal source and the second high-frequency signal source are preferably designed as RF transistor amplifiers, in particular as frequency-agile RF transistor amplifiers. Particularly preferably, the two high-frequency signal sources are designed identically.

[0046] The consumer is preferably designed in the form of a plasma system.

[0047] In a further preferred embodiment of the invention, the heat sink is connected to the compensating terminal and / or an earthing, in particular via a compensating resistor.

[0048] Further features and advantages of the invention will become apparent from the following detailed description of several embodiments of the invention, from the patent claims and from the figures of the drawing, which show details essential to the invention.

[0049] The features shown in the drawing are presented in such a way that the special features of the invention can be clearly seen. The various features can be implemented individually or in combinations in variants of the invention.

[0050] They show: Fig. 1 is a plan view of a first power combiner; Fig. 2 is a perspective view of another power combiner; Fig. 3a is a plan view of a power combiner arrangement with another power combiner; and Fig. 3b is a partial sectional view of the power combiner of Fig. 3a .

[0051] Fig. 1 shows a power combiner 10. The power combiner 10 has a first input 12a for a first high-frequency signal and a second input 32 for a second high-frequency signal. The first input 12a is connected to a first electrical conductor 14. The second input 32 is connected to a second electrical conductor 16. The electrical conductors 14, 16 are inductively and capacitively coupled to each other. A dielectric, in particular an electrically insulating substrate 18, is arranged between the electrical conductors 14, 16.

[0052] More precisely, in the present case, the power combiner 10 is formed from a printed circuit board which has the dielectric, in particular insulating substrate 18, wherein a first electrically conductive layer 20 is arranged on a first planar main side of the dielectric, in particular electrically insulating substrate, and a second electrically conductive layer 22 is arranged on a second planar main side of the dielectric, in particular electrically insulating substrate 18, which second electrically conductive layer runs parallel to the first electrically conductive layer.

[0053] The first electrical conductor 14 and the second electrical conductor 16 are each formed in sections and alternately in the first electrically conductive layer 20 and the second electrically conductive layer 22. In Fig. 1 Only the sections of the electrical conductors 14, 16 are visible, which are formed in the first electrically conductive layer 20. The second electrically conductive layer 22 is in Fig. 1 by the dielectric, in particular electrically insulating substrate 18 and the first electrically conductive layer 22.

[0054] The first electrical conductor 14 and the second electrical conductor 16 are each largely designed in the form of surface electrodes. The surface electrodes each have sections that run alternately above and below the dielectric, in particular the electrically insulating substrate 18. Sections 24a, 24c of the first electrical conductor 14 run in the Fig. 1 visible first electrically conductive layer 20. Sections 24b, 24d of the first electrical conductor 14 run in the second electrically conductive layer 22. Furthermore, sections 26a, 26c run in the second electrically conductive layer 22 and sections 26b, 26d run in the first electrically conductive layer 20. The surface electrodes of the sections 24a-d of the first electrical conductor 14 each run congruently and coplanarly with the sections 26a-d of the second electrical conductor 16.

[0055] The transition from the first electrically conductive layer 20 to the second electrically conductive layer 22 is effected by bridges 28a-f. The bridges 28a-c carry the first electrical conductor 14, and bridges 28d-f carry the second electrical conductor 16, between the electrically conductive layers 20, 22.

[0056] The first electrical conductor 14 terminates at its end opposite the first input 12a at an output 30. The second electrical conductor 16 terminates at its end opposite the second input 32 at a compensating terminal 12b.

[0057] The Fig. 1 The circuit board shown, comprising the electrically conductive layers 20, 22 and the dielectric, in particular the electrically insulating substrate 18, is arranged on a heat sink (not shown) of the power combiner 10. Due to the first and second electrical conductors 14, 16 running symmetrically to the dielectric, in particular the electrically insulating substrate 18, a very symmetrical parasitic capacitance is formed between the first electrical conductor 14 and the heat sink, or between the second electrical conductor 16 and the heat sink. The electrical transmission properties of the power combiner 10 are thereby only minimally affected.

[0058] Fig. 2 shows another power combiner 10. The power combiner 10 has a multilayer circuit board 34 composed of several circuit boards 36a-d. A first circuit board 36a has a first dielectric, in particular an electrically insulating substrate 38a, a second circuit board 36b has a second dielectric, in particular an electrically insulating substrate 38b, a third circuit board 36c has a third dielectric, in particular an electrically insulating substrate 38c, and a fourth circuit board 36d has a fourth dielectric, in particular an electrically insulating substrate 38d.

[0059] The power combiner 10 has a first input 12a and a second input 32. The first input 12a is connected to an output 30 via a first electrical conductor 14. The second input 32 is connected to a compensating terminal 12b via a second electrical conductor 16.

[0060] In the present embodiment, both the first electrical conductor 14 and the second electrical conductor 16 are each split into two lines: the first electrical conductor 14 has a first first conductor piece 14a and a second first conductor piece 14b, the second electrical conductor 16 has a first second conductor piece 16a and a second second conductor piece 16b.

[0061] The power combiner 10 has a heat sink 40 that is symmetrically spaced from the electrical conductors 14, 16. In the present case, the second first conductor section 14b is close to the heat sink 40 and the first first conductor section 14a is farther away from the heat sink 40, while the first second conductor section 16a is close to the heat sink 40 and the second second conductor section 16b is farther away from the heat sink 40. The heat sink 40 is connected to a ground 42.

[0062] Fig. 3a shows a power combiner arrangement 44 with another power combiner 10. A first high-frequency signal source 46a is connected to a first input 12a of the power combiner 10, and a second high-frequency signal source 46b is connected to a second input 32 of the power combiner 10. The first input 12a is connected via a first electrical conductor 14 to an output 30, to which a load 48 is connected. The second input 32 is connected via a second electrical conductor 16 to a compensating terminal 12b, which is connected to ground potential via the terminating resistor 31.

[0063] The power combiner 10 has a dielectric, in particular an electrically insulating substrate 18. The first electrical conductor 14 is branched into a first primary conductor section 14a and a second primary conductor section 14b. The second electrical conductor 16 is branched into a first secondary conductor section 16a and a second secondary conductor section 16b. The first primary conductor section 14a and the first secondary conductor section 16a are routed on a first main side of the dielectric, in particular an insulating substrate 18. The second primary conductor section 14b and the second secondary conductor section 16b are routed on a second main side of the dielectric, in particular an electrically insulating substrate 18.

[0064] The first electrical conductor 14 and the second electrical conductor 16 form inner and outer windings, respectively. The inner winding has a path section 50 that is not parallel to the outer winding, thus creating phase balance between the inner and outer windings.

[0065] The joining of the first first conductor piece 14a with the second first conductor piece 14b and the joining of the first second conductor piece 16a with the second second conductor piece 16b in the area of ​​the output 30 or the compensation connection 12b is analogous to the previous separation in the area of ​​the reference numerals 14b, 16b and is in Fig. 3a not shown.

[0066] Fig. 3b shows a schematic partial section of the power combiner arrangement 44 according to Fig. 3a . Out of Fig. 3b It can be seen that the second primary conductor section 14b extends largely congruently with the first secondary conductor section 16a, and the second secondary conductor section 16b extends largely congruently with the first primary conductor section 14a. The dielectric, in particular the electrically insulating substrate 18, is arranged between the conductor sections 14a, 16a and the conductor sections 14b, 16b.

[0067] The second first conductor piece 14b and the second second conductor piece 16b are in contact with a dielectric, which can be designed in particular as a thermally conductive plate 52. The thermally conductive plate 52 is placed on a heat sink 40. Fig. 3b the overall equidistant spacing of the electrical conductors 14, 16 to the heat sink 40 is evident.

[0068] Such a dielectric, which can be designed in particular as a thermally conductive plate 52, can generally, thus also in the arrangement according to Fig. 1 oder Fig. 2, be arranged between a heat sink 40 and the conductor tracks or conductor track sections facing the heat sink. It can fulfill several functions. First, it serves to electrically insulate the conductor tracks or conductor track sections from the potential of the heat sink 40, which is usually connected to earth (mass). Furthermore, a defined capacitance between the conductor tracks or conductor track sections can be set using the thickness and dielectric properties of the dielectric. This can be used to combat unwanted high-frequency oscillations. Furthermore, the material properties, in particular the loss factors of the dielectric, can be used to adjust the electrical losses of the power combiner 10. In principle, the first assumption could be that the lowest possible losses should be optimal.In fact, in the present arrangements, particularly for loads in the form of a plasma system, it is advantageous if the power combiner 10 has predetermined losses to prevent oscillations due to high-frequency reflections. These predetermined losses should be less than 10% of the power coupled or split by the power combiner 10. Furthermore, the dielectric has the advantage that the power combiner 10 can be sufficiently cooled without forced airflow, solely through thermal contact with the heat sink 40.

[0069] The power combiner 10 can be integrated with other amplifier components on a common circuit board. This can significantly reduce the cost of such amplifier-power combiner assemblies and, at the same time, significantly reduce interference coupling from external noise fields.

[0070] The power combiner 10 can be housed alone or together with other amplifier components in a metallic enclosure. This can further reduce interference coupling from external interference fields.

[0071] Taking a summary of all the figures of the drawing, the invention relates to a power combiner 10 with a heat sink 40. The power combiner 10 has at least a first electrical conductor 14 and a second electrical conductor 16. The first electrical conductor 14 and the second electrical conductor 16 are largely equidistant from the heat sink 40. For this purpose, the first electrical conductor 14 and the second electrical conductor 16 can be arranged alternately close to or far from the heat sink 40. Alternatively or additionally, the heat sink 40 can be arranged between the first electrical conductor 14 and the second electrical conductor 16.Alternatively or additionally, the first electrical conductor 14 and the second electrical conductor 16 can be divided largely into parallel conductor pieces 14a, 14b, 16a, 16b, wherein the conductor pieces 14a, 14b, 16a, 16b are spaced from the heat sink 40 such that the first electrical conductor 14 and the second electrical conductor 16 are, as a whole, largely equidistant from the heat sink 40.

Claims

1. A power combiner (10) for coupling and / or splitting high-frequency signals having a frequency greater than 1 MHz to an output power greater than 100W, wherein the power combiner (10) has: a) a first input (12a) for a first high-frequency signal; b) a second input (32) for a second high-frequency signal; c) an output (30); d) a balancing connection (12b); e) a first electrical conductor (14) between the first input (12a) and the output (30), wherein the first electrical conductor (14) is designed largely in the form of a planar surface electrode; f) a second electrical conductor (16) between the second input (32) and the balancing connection (12b), wherein the second electrical conductor (16) is designed largely in the form of a planar surface electrode and wherein the second electrical conductor (16) is capacitively and inductively coupled to the first electrical conductor (14), and - a dielectric, in particular in the form of a printed circuit board, is arranged between the electrical conductors (14, 16), - wherein a first electrically conductive layer (20) is arranged on a first planar main side of the dielectric and a second electrically conductive layer (22) is arranged on a second planar main side of the dielectric, which runs parallel to the first electrically conductive layer (20), - wherein the first electrical conductor (14) and the second electrical conductor (16) are each designed in sections and alternately in the first electrically conductive layer (20) and the second electrically conductive layer (22), - wherein the first electrical conductor (14) and the second electrical conductor (16) are each designed in the form of surface electrodes, which each have sections (24a-d, 26a-d) that run alternately above and below the dielectric, - wherein the surface electrodes of the sections (24a-d) of the first electrical conductor (14) each run congruently and coplanar with the sections (26a-d) of the second electrical conductor (16), g) a heat sink (40), - wherein the heat sink (40) is connected to a ground (42) of the power combiner (10), - so that a symmetrical parasitic capacitance is formed between the first electrical conductor (14) and the heat sink (40) and between the second electrical conductor (16) and the heat sink (40) due to the first and second electrical conductors (14, 16) running symmetrically to the dielectric.

2. A power combiner (10) for coupling and / or splitting high-frequency signals having a frequency greater than 1 MHz to an output power greater than 100W, wherein the power combiner (10) has: a) a first input (12a) for a first high-frequency signal; b) a second input (32) for a second high-frequency signal; c) an output (30); d) a balancing connection (12b); e) a first electrical conductor (14) between the first input (12a) and the output (30), wherein the first electrical conductor (14) is designed largely in the form of a planar surface electrode, wherein - the first electrical conductor (14) has a first first conductor piece (14a) and a second first conductor piece (14b); f) a second electrical conductor (16) between the second input (32) and the balancing connection (12b), wherein the second electrical conductor (16) is designed largely in the form of a planar surface electrode and wherein the second electrical conductor (16) is capacitively and inductively coupled to the first electrical conductor (14), wherein - the second electrical conductor (16) has a first second conductor piece (16a) and a second second conductor piece (16b), g) a heat sink (40), - wherein the heat sink (40) is connected to a ground (42) of the power combiner (10), and wherein - the first first conductor piece (14a) is arranged further away from the heat sink (40) than the second first conductor piece (14b), and the first second conductor piece (16a) is arranged closer to the heat sink (40) than the second second conductor piece (16b), so that the heat sink (40) is spaced apart symmetrically from the electrical conductors (14, 16) and a symmetrical parasitic capacitance is formed between the first electrical conductor (14) and the heat sink (40) and between the second electrical conductor (16) and the heat sink (40).

3. A power combiner (10) for coupling and / or splitting high-frequency signals having a frequency greater than 1 MHz to an output power greater than 100W, wherein the power combiner (10) has: a) a first input (12a) for a first high-frequency signal; b) a second input (32) for a second high-frequency signal; c) an output (30); d) a balancing connection (12b); e) a first electrical conductor (14) between the first input (12a) and the output (30), wherein the first electrical conductor (14) is designed largely in the form of a planar surface electrode, wherein - the first electrical conductor (14) is branched into a first first conductor piece (14a) and a second first conductor piece (14b); f) a second electrical conductor (16) between the second input (32) and the balancing connection (12b), wherein the second electrical conductor (16) is designed largely in the form of a planar surface electrode and wherein the second electrical conductor (16) is capacitively and inductively coupled to the first electrical conductor (14), wherein - the second electrical conductor (16) is branched into a first second conductor piece (16a) and a second second conductor piece (16b), g) a dielectric disposed between the first conductor pieces (14a, 16a) and the second conductor pieces (14b, 16b), h) a heat sink (40), - wherein the heat sink (40) is connected to a ground (42) of the power combiner (10), and wherein - the first first conductor piece (14a) and the first second conductor piece (16a) are routed on a first main side of the dielectric, and - the second first conductor piece (14b) and the second second conductor piece (16b) are routed on a second main side of the dielectric, - wherein the second first conductor piece (14b) runs largely congruently with the first second conductor piece (16a) and the second second conductor piece (16b) runs largely congruently with the first first conductor piece (14a), - so that a symmetrical parasitic capacitance is formed between the first electrical conductor (14) and the heat sink (40) and between the second electrical conductor (16) and the heat sink (40) due to the first and second electrical conductors (14, 16) running symmetrically to the dielectric.

4. The power combiner according to one of the preceding claims, wherein an inner winding of the first electrical conductor (14) and / or of the second electrical conductor (16) has a portion (50) that does not run parallel to an outer winding, in order to provide phase equalization between the inner winding and the outer winding.

5. The power combiner according to one of the preceding claims, wherein the reference impedance at a frequency of more than 3 MHz at the first input (12a) and at the second input (32) is in each case less than 50 Ω, or at a frequency of more than 1 MHz at the first input (12a) and at the second input (32) is in each case 25 Ω.

6. The power combiner according to one of claims 3, 3 with 4, 3 with 5, in which the heat sink (40) is arranged between the first second conductor piece (16a) and the second first conductor piece (14b).

7. The power combiner according to one of the preceding claims, wherein the power combiner (10) has a multilayer printed circuit board (34) composed of a plurality of printed circuit boards (36a-d), wherein the multilayer printed circuit board (34) has the planar surface electrode of the first electrical conductor (14) and the planar surface electrode of the second electrical conductor (16).

8. The power combiner according to one of the preceding claims 1, 1 with 4, 1 with 5, 1 with 7, in which the first planar surface electrode and the second planar surface electrode have sections (24a-d, 26a-d) which run alternately on a first planar main side of the dielectric, in particular electrically insulating substrate (18), and on a second planar main side, opposite the first planar main side, of the dielectric, in particular electrically insulating substrate (18).

9. The power combiner according to one of the preceding claims, wherein the first electrical conductor (14) and the second electrical conductor (16) each have a number of windings n > 1.

10. The power combiner according to one of the preceding claims, which is designed to couple high-frequency signals between 1 MHz and 200 MHz.

11. The power combiner according to one of the preceding claims, which is designed to output powers above 2kW.

12. The power combiner according to one of the preceding claims, which is designed in the form of a 90° hybrid coupler.

13. A power combiner arrangement (44) comprising a power combiner (10) according to one of the preceding claims, wherein the power combiner arrangement (44) has a first high-frequency signal source (46a) connected to the first input (12a) and a second high-frequency signal source (46b) connected to the second input (32), and in particular a load (48) that is connected to the output (30).