COMPOSITION OF HEAT SINKER AND ELECTRICAL AND / OR ELECTRONIC COMPONENT

Description

[0001] The invention relates to electrical and / or electronic components such as circuit breakers and motors with a novel cooling system.

[0002] Despite years of optimization, electrical and electronic components such as circuit breakers and motors generate waste heat in the range of 1 to 5% of their power consumption. If this heat is not dissipated, their efficiency, life expectancy, and / or reliability decrease.

[0003] Cooling systems for heat dissipation are currently mounted as prefabricated heat sinks onto the areas to be cooled using various mounting methods. For example, heat sinks are glued on, whereby the adhesives are ideally optimized for their thermal conductivity—for example, by incorporating thermally conductive particles. Thermal pastes are also used for assembly, but there is a risk that the thermal pastes will need to be replaced regularly. DE102015007791A1 discloses the production of a composite consisting of a heat sink and the surface of an electrical component to be cooled using additive manufacturing processes (3D printing).

[0004] The best heat dissipation is achieved by thermal connections produced using sintering processes. However, the disadvantage is that process temperatures of around 250°C and above are required to form the thermal contact. Only a few electrical and / or electronic components can withstand these stresses, especially since the heat sink connected to the surface to be cooled typically retains this high temperature for a certain period of time. Nevertheless, ceramic cooling elements are now being installed on power electronic circuits because they promise reduced thermal resistance in combination with a modified overall system design. However, these heat sinks result in increased manufacturing costs, for example, total costs of €30 to €40 per heat sink in electronic circuit breakers.

[0005] With increasing integration density and component miniaturization, the demands on heat dissipation of cooling systems are also increasing. These are only inadequately met by larger dimensions of the cooling elements and / or improved thermal coupling by reducing the number of material transitions in the overall system.

[0006] In addition, the heat dissipation requirements also depend on the ambient conditions. For example, if a converter is operated in the desert, more complex cooling measures are required than for the same electrical and / or electronic component in Central Europe.

[0007] There is therefore a need for a mass-production-capable cooling system for a composite heat sink and electrical and / or electronic component that is also easily modified and / or adaptable despite mass production. This object is achieved by the subject matter of the present application, as disclosed in the claims and the description.

[0008] Accordingly, the present invention relates to a composite comprising a cooling system and a surface of an electrical and / or electronic component to be cooled, obtainable by the formation of chemical bonds by means of 3D printing, wherein the surface of the electrical and / or electronic component or a layer already produced on this surface by 3D printing is used as the printing bed, and an organometallic compound comprising at least one reactive group selected from the following groups: halogen / halide such as fluorine, chlorine, bromine, or iodine atoms; pseudohalogen / pseudohalide such as CN or SCN groups; amino, amide, aldehyde, keto, carboxy, thiol, hydroxy, acryloxy, methacryloxy, epoxy, isocyanate, ester, sulfonic acid, phosphoric acid, vinyl group, and / or a "water glass" group is used as the printing material used to construct the cooling system.

[0009] According to an advantageous embodiment, chemical bonds in the composite are present in the form of van der Waals bonds, ionogenic bonds and / or covalent bonds.

[0010] According to an advantageous embodiment, the chemical bonds in the composite are present as polar bonds, which are constructed via polarizing halogen, sulfur, oxygen and / or nitrogen-containing functional groups.

[0011] According to an advantageous embodiment, the composite is available by means of 3D printing.

[0012] It can be provided that the print bed is the surface of the electrical and / or electronic component and the cooling system is built on it by means of 3D printing.

[0013] In particular, it is a composite comprising a cooling system arranged on a surface of an electrical and / or electronic component to be cooled, wherein the composite is obtainable by means of 3D printing, wherein the print bed is the surface of the electrical and / or electronic component and the cooling system is constructed thereon by means of 3D printing.

[0014] The material to be printed for constructing the cooling system comprises, either in the form of an organometallic compound, at least one reactive group selected from the following groups: halogen / halide such as fluorine, chlorine, bromine, or iodine atoms; pseudohalogen / pseudohalide such as CN or SCN groups; amino, amide, aldehyde, keto, carboxy, thiol, hydroxy, acryloxy, methacryloxy, epoxy, isocyanate, ester, sulfonic acid, phosphoric acid, or vinyl groups. These groups can be printed, for example, in the form of complex compounds with one or more ligands comprising one or more of the above-mentioned groups.

[0015] Alternatively or additionally, the material to be printed to construct the cooling system includes a water glass.

[0016] Examples of suitable central atoms of a complex organometallic compound are silicon, aluminum, zirconium and / or titanium.

[0017] Alternatively or in addition to the compounds mentioned above, so-called "water glasses" can be printed, i.e. basically liquid sodium / potassium silicates that solidify through silicification.

[0018] In particular, for the purposes of the present invention, other liquid compounds capable of silicification, structured exactly like the above-mentioned water glasses, are also included under the term "water glass." These are compounds that contain, for example, silicon, zirconium, and / or aluminum-oxygen bonds such as -Si-O-Si-, -Al-O-Al-, -Si-O-Al-, -Zr-O-Zr-, -Si-O-Zr-, -Zr-O-Al-O-Si-, -Si-O-Al-O-Zr-, as well as any other combinations thereof.

[0019] The material to be printed is available, for example, as a paste and / or in the form of a dispersion.

[0020] The material to be printed is, for example, in pure form or mixed with a solvent.

[0021] The printable materials include thermally conductive particles, such as those based on metal and / or ceramic. Suitable thermally conductive particles include, in addition to the well-known metallic or ceramic particles, for example, those based on metal oxides, as well as nitrides, such as boron nitride.

[0022] The fillers may be present in one or more fractions, comprising platelet-, rod- and / or spherical particles.

[0023] In this case, the term "filler fraction" refers, for example, to a type of filler, whether in terms of size, shape of the material and / or structure.

[0024] The fillers can be coated and uncoated, in the form of core-shell particles, solid particles and / or hollow particles, as well as in any mixtures thereof.

[0025] According to an advantageous embodiment, the materials are printed in the form of alumino-silicate hybrid materials and / or water glasses.

[0026] The use of 1-component or 2-component systems has proven particularly advantageous for printing. Printing 2-component systems using the processes listed below is familiar to those skilled in the art. During printing, the printable materials solidify and / or cure, with post-curing being possible, either thermally or UV-initiated.

[0027] When printing using common 3D processes such as Fused Deposition Molding (FDM), Fused Filament Fabrication (FFF), Multi Jet Fusion, the material then forms a chemical bond either with the print bed or with a lower, already printed layer, in particular either an ionogenic bond, a van der Walls bond and / or a single or multiple covalent bond.

[0028] According to an advantageous embodiment, the printing bed, i.e. the surface of the electrical and / or electronic component, is pretreated to form the chemical bond before printing, for example cleaned, roughened and / or coated with an adhesion-promoting layer.

[0029] The invention creates, for the first time, a composite consisting of a cooling system and an electrical and / or electronic component in which heat transfer is optimized by reducing material transitions, such that the composite is connected by the formation of chemical bonds, particularly covalent bonds. 3D printing processes can be used to produce the composite, with the surface to be cooled being used directly or indirectly as a print bed.

Claims

1. Composite composed of a cooling system and a surface to be cooled that is part of an electrical and / or electronic component, obtainable by the forming of chemical bonds by means of 3D printing, wherein the print bed utilized is the surface of the electrical and / or electronic component or a layer already produced on this surface by 3D printing, and the material used for printing, which serves to construct the cooling system, is an organometallic compound comprising at least one reactive group selected from the following groups: halogen / halide such as fluorine atom, chlorine atom, bromine atom, iodine atom; pseudohalogen / pseudohalide such as CN group, SCN group; amino group, amide group, aldehyde group, keto group, carboxyl group, thiol group, hydroxyl group, acryloyloxy group, methacryloyloxy group, epoxy group, isocyanate group, ester group, sulfo group, phosphoric acid group, vinyl group and / or a "waterglass".

2. Composite according to Claim 1, obtainable by use of a fused deposition moulding method.

3. Composite according to either of Claims 1 or 2, obtainable by use of a fused filament fabrication method.

4. Composite according to any of the preceding claims, obtainable by use of a multijet fusion method.

5. Composite according to any of the preceding claims, wherein at least one organometallic compound is in the form of a complex-type compound with one or more ligands.

6. Composite according to Claim 5, wherein the complex-type compound comprises a central atom selected from the group of the following possible central atoms: silicon, aluminium, zirconium and / or titanium.

7. Composite according to any of the preceding claims, wherein the composite is formed using waterglasses comprising silicon-oxygen bonds.

8. Composite according to any of the preceding claims, wherein the composite is formed using waterglasses comprising zirconium-oxygen bonds.

9. Composite according to any of the preceding claims, wherein the composite is formed using waterglasses comprising aluminium-oxygen bonds.

10. Composite according to any of the preceding claims, wherein the composite is formed using waterglasses comprising any combinations of zirconium-, silicon- and / or aluminium-oxygen bonds.

11. Composite according to any of the preceding claims, wherein the material for printing is in paste form and / or in the form of a dispersion.

12. Composite according to any of the preceding claims, wherein the material for printing is in pure form or in a mixture with a solvent.

13. Composite according to any of the preceding claims, wherein the material for printing comprises thermally conductive particles, for example those that are based on metals and / or ceramics.

14. Composite according to Claim 13, wherein the filler is in the form of one or more size fraction(s), material fraction(s) and / or shape fraction(s).

15. Composite according to either of Claims 13 or 14, wherein the filler comprises particles in platelet form, rod form and / or bead form.

16. Composite according to any of Claims 13 to 15, wherein the filler is present in an amount of 20% to 70% by volume, based on the material to be printed.