COMPUTER-IMPLEMENTED METHOD FOR PROVIDING A DATA SET OF A TIP FOR A PROBE DEVICE FOR RATING PROBE MICROSCOPY

Description

[0001] The present invention relates to a computer-implemented method for providing a data set of a tip for a probe device for scanning probe microscopy, in particular for atomic force microscopy, wherein a scanning probe microscope is used with the aid of a tip having a tip geometry arranged on an arm of the probe device for measuring a sample.

[0002] Scanning probe microscopy, or atomic force microscopy, can be used, for example, to scan semiconductor devices and their internal structures for quality assurance purposes. These structures can include, for instance, grooves and / or holes within the semiconductor device, which may have a width or diameter of a few tens of nanometers and a depth of a few hundred nanometers. To measure, for example, the straightness and / or parallelism of the groove walls and / or the depth of the grooves and / or holes, the probe tip is inserted into the grooves or holes. Naturally, this tip must be correspondingly thin. Furthermore, the tip must have a certain length to also scan the bottom of the grooves or holes. However, interactions between the tip and the groove walls can distort the measurement result.This can be caused, in particular, by the tip deflecting while scanning the walls. For example, the tip can be pulled towards the walls by van der Waals forces. The tip can bend in the direction of the wall. This, of course, makes reliable measurements difficult. To minimize tip deflection, a relatively thick tip can be used. Alternatively, the tip length can be kept as short as possible to reduce deflection. However, using thicker tips can decrease the measurement resolution. Generally, the stiffness of the tip should be maximized to minimize bending and / or deflection.

[0003] A method for manufacturing a probe device is disclosed in BERNARD HA-OCHIH LIU ET AL: "Simulation-aided design and fabrication of nanoprobes for scanning probe microscopy", ULTRAMICROSCOPY, ELSEVIER, AMSTERDAM, NL, Vol. 111, No. 5, pages 337-341.

[0004] A tip of a probe device made of diamond is disclosed in SANSOZ F ET AL: "A force-matching method for quantitative hardness measurements by atomic force microscopy with diamond-tipped sapphire cantilevers", ULTRAMICROSCOPY, ELSEVIER, AMSTERDAM, NL, Vol. 111, No. 1, pages 11-19.

[0005] From DE 10 2006 008 858 A1, a probe device for scanning probe microscopy is known, comprising a boom and a tip formed on the boom and manufactured using additive processes in the nanometer range, with which samples to be measured can be scanned. A disadvantage of this is that the geometry of the tip is predetermined, so that scanning the sample with such tips is not optimal.

[0006] The object of the present invention is therefore to eliminate this disadvantage.

[0007] The problem is solved by the subject matter of the independent patent claims.

[0008] A computer-implemented method is proposed for providing a data set for a probe tip used in scanning probe microscopy. Scanning probe microscopy can be atomic force microscopy. A scanning probe microscope can measure a sample using a tip with a specific geometry mounted on an arm of the probe assembly. The tip is thus the measuring element with which the sample and / or its structure can be measured. The tip can, for example, be an atomic force microscope tip or a tip for an atomic force microscope.

[0009] The tip can have a thickness of a few nanometers and a length of a few hundred nanometers for measuring the sample. Alternatively, it can have a length of several thousand nanometers. The ratio of tip length to tip thickness can be up to 100. The tip can also be cylindrical. Additionally or alternatively, it can have an elliptical cross-section. The exact dimensions and shape naturally depend on customer requirements. The length, for example, can be only a few tens of nanometers. The length, thickness, and shape of the tip can be described by a tip geometry.

[0010] The computer-implemented provision of the data set according to the invention can simply comprise the provision of a data set that at least partially describes the tip. The data set can, for example, include CAD data that defines the geometry of the tip. This allows the data set to be sent to the customer, for example, via the internet, who can then manufacture the tip himself or have it manufactured according to the data set. Following the computer-implemented provision of a data set for a tip for the probe assembly according to the invention, the manufacturing process of the tip on the boom can be initiated in order to send the probe assembly produced in this way, with the tip on the boom, to a customer.

[0011] According to the invention, in a step preceding the actual manufacturing process producing the tip, the tip geometry is optimized from a selected tip basic shape with regard to defined, required measurement properties by simulating and evaluating the tip geometry with respect to these measurement properties using a computer and changing the tip geometry depending on the evaluation.

[0012] The measurement characteristics can be specified by the customer, who, for example, wants to use the tip to measure a specific structure, such as grooves and / or holes, of a semiconductor device in production or a finished product, in order to make statements about the quality of the semiconductor device. The customer might, for instance, specify that the tip must be able to measure the structure of a semiconductor device with sufficient accuracy, i.e., with a correspondingly high measurement resolution. The customer may also require the tip to measure the depth, width, and / or shape of the grooves and / or holes in a sample. For example, the walls and / or bottom of the grooves may also be measured, or the corners of the grooves may be scanned.Parallelism of the walls or an angle of the corners of the trenches can also be a prerequisite for the semiconductor component to have a high quality, so the customer may want to measure the walls or corners accordingly.

[0013] For example, a customer might specify that the probe tip should be able to scan a trench 200 nm deep. In response, a tip with a basic shape that is, for instance, 10% to 50% longer could be selected. This would allow for scanning a trench at least 200 nm deep. Furthermore, a basic shape could be chosen that permits the aforementioned measurement resolution. Additionally, the basic shape could be suitable for measuring the corners of the trenches. The basic shape can be used to pre-select from various existing tip geometries. This selection can be based on experience and thus serve as a starting point for subsequent optimization of the tip geometry.

[0014] Optimization can be achieved, for example, by making the tip as thin as possible while maintaining sufficient stiffness to minimize bending and / or deflection of the tip towards a wall, thus avoiding excessive impact on measurement resolution. Additionally or alternatively, optimization can also involve making the tip as long as possible to allow for the measurement of deeper structures if needed. Here, too, the stiffness of the tip must be carefully considered.

[0015] To optimize the tip geometry, it is simulated and evaluated according to the invention with respect to the desired or required measurement properties. Using the simulation, for example, given a specific tip geometry, such as thickness, tip length, and / or cross-sectional shape, the deflection of the tip during trench measurement can be calculated. Subsequently, an evaluation can be performed to determine whether the simulated tip deflection is still within the range of the measurement properties required by the customer.

[0016] The assessment might conclude, for example, that the measurement characteristics required by the customer are not met. For instance, the tip might be too short to measure the trench and / or hole in the semiconductor device down to the bottom. Of course, the assessment could also conclude that the customer's measurement characteristics are met. Depending on the assessment, the tip geometry can be modified. If, for example, the measurement characteristics are not met, the tip geometry can be modified, such as by making the tip longer.

[0017] Stiffness is considered when evaluating the measurement properties. Stiffness can describe resistance to bending. Furthermore, stiffness can depend on the tip's modulus of elasticity. For example, the customer may require the tip to have a specific stiffness. Additionally, the tip's measurement resolution is also considered in the evaluation. To measure the sample's structure, the measurement resolution must be within the range of the structure's size. Therefore, measurement resolution is a particularly important evaluation parameter for the tip. The tip's dimensions can also be taken into account. For example, the tip must be long enough to measure the base of a structure.

[0018] It is advantageous to assign a rating value when evaluating the stiffness of the tip. For example, if the tip exhibits a simulated stiffness that corresponds to 50% of the stiffness required by the customer, it can be assigned a stiffness rating of 50%. If the tip exhibits a simulated stiffness that corresponds to the stiffness required by the customer, it can be assigned a stiffness rating of 100%. Conversely, if the tip exhibits a simulated stiffness that is twice that required by the customer, it can be assigned a stiffness rating of 200%. This allows for a quantitative evaluation of stiffness by simulating the tip geometry.The rating value can, for example, have such properties that a higher rating value describes better measurement properties of the tip.

[0019] Additionally or alternatively, a rating can also be assigned to the tip's measurement resolution. For example, if the simulation reveals that the tip only has a measurement resolution that corresponds to 50% of the customer's required resolution, a rating of 50% can be assigned. This also allows the simulated measurement resolution to be quantified. Here, too, a higher rating can describe better measurement characteristics, in this case, the measurement resolution.

[0020] Additionally or alternatively, a rating value can also be assigned to the tip dimensions. These dimensions can include the tip's thickness and length. For example, to measure the bottom of a trench and / or hole in a semiconductor device, the tip must have a thickness that is less than the width of the trench to allow insertion. Furthermore, the tip must also be longer than the trench's depth to reach it. The tip dimensions must be suitable for measuring the structure and / or the sample. A Boolean rating value, such as "yes" or "no," can be assigned to the dimensions. For example, the thickness can be assigned a value of "0" or "1." A rating value of "1," for instance, indicates that the sample can be measured using the simulated tip geometry.Conversely, the value "0" can indicate that the sample cannot be measured with the tip, for example, because the tip cannot be inserted into the structure due to its thickness.

[0021] Advantageously, the evaluation values ​​from the stiffness, measurement resolution, and / or tip dimensions can be combined. At least two evaluation values ​​can be combined into an overall evaluation value. This allows the tip to be described with a single value. The overall evaluation value can be calculated such that a higher overall value indicates better measurement characteristics.

[0022] The tip geometry is successively optimized by repeating the steps of computer-aided simulation, evaluation, and modification. This allows for continuous improvement of the tip. For example, if the tip was lengthened in a previous modification step based on the evaluation, the extended tip geometry can now be simulated again to verify whether the tip is suitable for scanning the structure of the customer's sample and / or whether the tip meets the required measurement characteristics. It is possible that the extended tip deflects so much that the measurement can no longer be performed with the required resolution. Therefore, the evaluation is preferably carried out again after the simulation. This allows a decision to be made as to whether the tip still meets the required measurement characteristics or whether the changes incorporated into the simulation must be reversed.Additionally or alternatively, other changes can be made to the tip geometry.

[0023] Additionally or alternatively, it is advantageous to perform the simulation, evaluation, and modification of the tip geometry several times in succession. This allows for the optimization of the tip geometry in an iterative process. For example, the tip can be successively lengthened. After each extension, the tip geometry can be simulated and evaluated. If, for instance, the tip no longer meets the required measurement characteristics after a single modification, the change can be reversed, and the tip can preferably be modified in another way.

[0024] It is also advantageous if the computer-aided optimization of the tip geometry is performed semi-automatically. For example, the simulation and / or evaluation can be carried out semi-automatically. An interval from a minimum to a maximum tip length can be defined, and various tips with different tip lengths can be simulated according to this interval. The interval can be simulated in several tens of steps. For example, a tip with a length of 200 nm can be simulated, with the length being increased stepwise by 5 nm up to 300 nm. Each individual tip is simulated and can be evaluated separately. Additionally or alternatively, the tip thickness can also be simulated stepwise according to an interval. For example, the tip thickness can be simulated stepwise for each individual tip length according to an interval.These intervals and / or interval steps can be entered manually. The interval limits and / or interval steps can also be changed manually. Additionally or alternatively, other tip parameters can be simulated stepwise according to an interval. For example, an angle in transition areas, each with a different tip thickness, can be changed according to an interval and simulated and evaluated accordingly. Furthermore, the tip geometry can be changed manually. A tip manufacturer may already have some experience with the behavior of the tip geometry, so they may know how much the tip can be extended or whether, for example, the tip needs to be made thicker.

[0025] It is advantageous if, when a defined threshold is exceeded, the tip thickness is reduced in at least one region as part of the tip geometry. Additionally or alternatively, if a defined overall threshold is exceeded, the tip thickness can also be reduced in at least one region during the simulation. The tip can thus be stiffer than required by the customer. The tip thickness can then be reduced in at least one region during the simulation, allowing the tip to be inserted deeper into a trench and / or hole in the semiconductor device while still maintaining sufficient stiffness. Preferably, the tip can be thinned in a leading region so that the leading edge of the tip can scan finer structures.

[0026] Additionally or alternatively, if a specified evaluation value and / or overall evaluation value falls below the defined limit, the tip thickness can be increased in at least one area. For example, the stiffness may be insufficient, so the tip is simulated as thicker in at least one area to increase stiffness. Care can be taken to ensure that the tip can still be inserted into the groove and / or hole of the semiconductor device.

[0027] It is also advantageous if, when a defined threshold value and / or overall score is exceeded, the tip length is increased as part of the tip geometry during the simulation. For example, if the tip stiffness exceeds the stiffness required by the customer, the tip length can be increased in the simulation to allow for the measurement of even deeper structures.

[0028] Additionally or alternatively, if a specified rating value and / or overall rating value falls below the defined limit, the peak length can be reduced during the simulation, for example, if the calculated and rated stiffness is insufficient to achieve the stiffness required by the customer. To increase stiffness, the peak length can be reduced.

[0029] It is advantageous to repeat the steps of simulating, evaluating, and / or simulating tip extension until at least one evaluation value of the tip geometry exceeds a predefined limit. Additionally or alternatively, the steps of simulating, evaluating, and / or simulating tip extension can be repeated until the overall evaluation value of the tip geometry exceeds the predefined limit. This shortens the computer-aided optimization process, as it terminates when the measurement characteristics required by the customer are exceeded.

[0030] To obtain a tip with good measurement characteristics, the simulation, evaluation, and / or modification steps can be repeated until at least one evaluation value no longer improves with further changes to the tip geometry. Additionally or alternatively, the simulation, evaluation, and / or modification steps can be repeated until the overall evaluation value no longer improves. This allows the tip to be optimized until one with optimal measurement characteristics is achieved.

[0031] Furthermore, it is advantageous to simulate, evaluate, and modify the tip geometry until a further change in the tip geometry worsens the rating. As described above, a numerical value can be assigned to the rating. This numerical value could, for example, represent a percentage of the stiffness required by the customer. It could also represent a percentage of the measurement resolution required by the customer. If this numerical value worsens with a further change, this may indicate that the tip geometry with these parameters (e.g., tip length and / or thickness) is optimal. This allows a decision to be made that further optimizations are no longer necessary or at least no longer commensurate with the effort involved.

[0032] Advantageously, the simulation of the tip geometry can be performed using finite element methods. Additionally or alternatively, the evaluation can also be carried out using finite element methods. Finite element methods are proven techniques for simulating, for example, the bending of components.

[0033] Furthermore, it is advantageous if the tip is manufactured according to the optimized tip geometry using additive and, optionally, additional subtractive manufacturing processes. The additive process can, for example, include electron beam induced deposition, which allows for the targeted and defined build-up of the tip.

[0034] Furthermore, it is advantageous if at least part of a surface section of the tip is removed by a subtractive process after at least one step of the additive manufacturing process. The subtractive process can, for example, include reactive ion etching. This allows, for instance, excessively thick areas of the tip to be thinned.

[0035] In an advantageous embodiment of the invention, the tip is at least partially made of amorphous carbon. Additionally or alternatively, the tip can also be made of crystalline diamond. These materials exhibit high moduli of elasticity, resulting in high tip stiffness. This reduces tip bending.

[0036] Further advantages of the invention are described in the following exemplary embodiments. These show: Figure 1a schematic side view of a probe device with a tip on a boom, Figure 2 an exemplary selection of basic lace shapes and Figure 3 A flowchart of the tip preparation process for scanning probe microscopy.

[0037] Figure 1Figure 1 shows a schematic side view of a probe assembly 2 with a tip 1 on a boom 3. The probe assembly 2 can be used for scanning probe microscopy. It can also be used for atomic force microscopy. According to the present embodiment, the tip 1 is at an angle α to a perpendicular to the boom 3. Alternatively, the tip 1 can also be arranged perpendicularly on the boom 3. Furthermore, the tip 1 can be arranged on a tip base 4 on the boom 3. The tip base 4 can, for example, be pyramid-shaped. The tip base 4 provides a more stable position for the tip 1 on the boom 3.

[0038] Tip 1 also has a length L. Additionally, tip 1 has a thickness D. For example, the length L can be in the range of a few hundred nanometers and the thickness D in the range of a few tens of nanometers, for example, between 3 nm and 20 nm. However, the length L of tip 1 can also be several micrometers, for example, 10 micrometers. The cross-section of tip 1 can be, for example, round, elliptical, or angular.

[0039] Tip 1 allows a scanning probe microscope or atomic force microscope to scan a sample (not shown here). The sample could be, for example, a semiconductor device under construction or a finished product, which has a surface structure that can be scanned by Tip 1 for quality assurance purposes. This structure might include, for example, grooves and / or holes with a depth and width. Tip 1 can be used to scan the depth and thus verify whether the semiconductor device meets the customer's specified measurement characteristics. Tip 1 can also be used to scan the straightness and / or parallelism of the groove walls. For some applications of the semiconductor device, the shape of corners, particularly between the walls and the bottom of the grooves, may also be important, so Tip 1 can also be used to scan the corners of the grooves.

[0040] However, if tip 1 is inserted into such a trench, it may be attracted to the wall due to van der Waals interactions, and tip 1 may bend as a result of these interactions. This can distort a measurement, making it difficult or impossible to determine the quality of the semiconductor device's structure.

[0041] It is therefore advantageous if the tip 1 has a high stiffness. This results in a higher section modulus against bending, and the measurement can be performed more accurately. The stiffness can depend not only on the material of the tip, but also on its geometry, in particular its length L and thickness D.

[0042] The stiffness of tip 1 can be increased, for example, by providing a tip 1 with a greater thickness D. However, this is only possible within certain limits, as this can reduce the measurement resolution of tip 1. Furthermore, the thickness D of tip 1 cannot be chosen arbitrarily large, since the tip 1 must be inserted into a trench of a specific width.

[0043] Additionally or alternatively, the tip 1 can also be made shorter, which also reduces bending of the tip 1. However, care must be taken here as well to ensure that the tip 1 can still be used to probe, for example, the bottom of the trench.

[0044] An optimal tip 1 would, for example, be several times longer than the depth of the structure to be measured and would be as thin as possible to enable high-resolution measurement of even small structures. Since this is not possible in reality due to the bending of the tip 1, a compromise between length and thickness must always be made. L, Thickness D and measurement resolution can be determined. According to the inventive method, a tip geometry of the tip 1 can be optimized. For this purpose, a basic tip shape can be selected in a step preceding the manufacturing process. Based on this, the tip geometry can be optimized with regard to defined, required measurement properties.

[0045] Figure 2This shows an exemplary selection of different tip shapes 1a-1c. Tip shapes 1a-1c may already exist as a computational data set and serve as a template for a new tip 1. The tip shape can be selected, for example, according to customer requirements. The tip shape 1a-1c that best fits the new customer requirements can be chosen. The tip shape can thus serve as a starting point for optimizing the tip shape.

[0046] According to the present embodiment, the tip shape 1a has a front section 5a that tapers to a point. This allows, for example, the scanning of a semiconductor device structure that has fine grooves and / or holes. The tip shape 1a can be described as follows: Figure 2several areas 13, 14, 15. For the sake of simplicity, areas 13, 14, 15 are only provided with a reference numeral at the tip base 1a. According to the present embodiment of the Figure 2 The tip shape 1a has three regions 13, 14, 15 that are adjacent to each other along length L1. The tip shapes 1a - 1c can also have more than three regions 13, 14, 15. Alternatively, the tip shapes 1a - 1c can also have fewer than three, for example, two or only a single region(s) 13, 14, 15. According to the present embodiment, the thickness D decreases in the direction of the front section 5a. Additionally or alternatively, a thickness D in a region along length L1 can also be constant.

[0047] The first region 13 is located at the end of the tip shape 1a opposite the front section 5a, with the second region 14 adjacent to it. The third region 15 is located at the end of the tip 1a of the front section 5a. The thickness D of the various regions 13, 14, 15 can be optimized individually and / or independently. For this purpose, the thickness D of regions 13, 14, 15 can be changed, simulated, and evaluated individually. Of course, the tip geometry can also be simulated and evaluated if the thickness D has only been changed in one region 13, 14, 15. Additionally or alternatively, the lengths of the individual regions 13, 14, 15 can also be changed, simulated, and evaluated individually and independently. Furthermore, the tips 1 can also be more or less than the three regions 13, 14, 15 of the... Figure 2 exhibit the illustrated embodiment.

[0048] In the present embodiment, angles β1 and β2 are formed between the three regions 13, 14, and 15. For the sake of simplicity, these angles are again only indicated with a reference symbol at the tip geometry 1a. The angle(s) β1 and β2 between regions 13, 14, and 15 along the length L1 can also be changed to optimize the tip 1. After each change 11 of the angle β1 and β2, the tip 1 can be simulated and evaluated. The optimization of the angles β1 and β2 can also be performed semi-automatically, for example, by changing the angles β1 and β2 stepwise in an interval and simulating and evaluating the tip 1 after each step.

[0049] In contrast, the pointed basic shape 1b has a blunt front section 5b. This pointed basic shape 1b can be used, for example, to simply measure the depth of the trench. The exact structure is not important in this case. The pointed basic shape 1c, on the other hand, can be used when a wall of the trench needs to be scanned. Additionally or alternatively, the corners of the trench can also be scanned with the pointed basic shape 1c. For this purpose, the pointed basic shape 1c has a disc-shaped section 6 in its front section 5c. The disc-shaped section 6 projects beyond the lateral surface of the pointed basic shape 1c, so that a side wall can be scanned with it. In particular, the disc-shaped section 6 has a width that is greater than the thickness D3 of the pointed basic shape 1c.

[0050] Figure 3Figure 1 shows a flowchart of the inventive process for providing a data set for a tip 1 for scanning probe microscopy. The input data consists of defined measurement properties 7 of the tip 1, as required by the customer. For example, the customer requires measurement properties 7 such that the tip 1 can measure the depth of a trench and / or a hole in a semiconductor device with a depth of 200 nm. The trench may, for example, have a width of 25 nm. A structure at the bottom of the trench is to be measured with a resolution of 5 nm. The tip 1 may only deflect by a specific angle or offset to ensure measurement quality.

[0051] Based on these required measurement properties 7, a basic tip shape 1a - 1c can already be selected in a selection step 8, as is the case, for example, in Figure 2The basic tip shape 1a - 1c can thus serve as a blank for further optimization of the tip geometry. For example, tip 1a of the Figure 2 The depth of the trench and the structure at the bottom of the trench are crucial for the customer.

[0052] After selecting the tip shape 1a-1c (8), a simulation (9) of the tip geometry corresponding to that tip shape (1a-1c) can be performed. Simulation (9) can be carried out, for example, using finite element methods. Based on simulation (9), deflection, bending, and / or stress on the tip (1) caused by forces acting on it in the trench, such as van der Waals forces, can be determined. The stress can then be used to determine, for example, whether the tip (1) will break under these loads, allowing for the selection of a new tip shape (1a-1c).

[0053] Following simulation 9, an evaluation 10 of peak 1 can be performed based on the simulation results. The simulation results might, for example, show that a stiffness specified by the customer is only 50% achieved. In evaluation 10, a rating value, in this example a rating value of 0.5, can be assigned to the stiffness of peak 1.

[0054] Additionally or alternatively, the simulation results may show that tip 1 only achieves 50% of the customer-required measurement resolution. A rating value can also be assigned to the measurement resolution, which in this example could be 0.5. This can result in a rating of 10, which in this case indicates that the customer-required measurement characteristics are not met. The two aforementioned rating values ​​can be combined into an overall rating value to determine, using a single value, whether the required measurement characteristics have been achieved.

[0055] The evaluation values ​​can also exceed the measurement characteristics required by the customer; that is, tip 1 meets the customer's measurement requirements, so that production of tip 12 can begin immediately. This saves time and therefore costs.

[0056] Alternatively, if the rating 9 is poor, i.e., if the required measurement properties are not achieved, one can revert to selection 8 of the tip basic shape 1a - 1c. A different tip basic shape 1a - 1c can then be chosen that is better suited as a starting point for optimizing the tip geometry.

[0057] Following evaluation 10, the tip geometry can be modified during a subsequent simulation using the finite element method, depending on the results of evaluation 10. Modification 11 can, for example, include a change in thickness D and / or a change in length L. In this case, if the required measurement properties are not achieved, the thickness D of tip 1 can be increased in at least one area to achieve the necessary stiffness. Additionally or alternatively, the length L of tip 1 can be reduced. However, care must be taken to ensure that the measurement properties required by the customer are maintained. For example, tip 1 cannot be shortened to such an extent that it no longer reaches the bottom of the trench.As a result, the rating value of the dimensions drops, for example, from a rating value of "1", which corresponds to the suitability of tip 1 to measure the soil, to a rating value of "0", which means that tip 1 can no longer measure the soil of the trench and is therefore not suitable for measuring the soil.

[0058] Optimizing the tip geometry can be semi-automated. For example, the tip geometry can be modified manually before the simulation is repeated using the finite element method. Experience from a manufacturer can be used in this process.

[0059] The optimization of the tip geometry can also be semi-automated by specifying an interval of tip lengths L, where the lengths L within the interval are simulated and / or evaluated stepwise. For example, simulation can begin with a tip length L of 200 nm. After simulation (9) and / or evaluation (10), the tip length L can be increased stepwise, for example by 5 nm, up to 300 nm, with tip 1 being simulated and evaluated again after each step. The simulation according to the interval is performed automatically. The interval and / or steps can be defined manually. In particular, after each interval, different values ​​for the interval, such as lower limits, upper limits, and / or steps, can be manually set.

[0060] Following the simulation-based modification 11 of the tip geometry, and if the evaluation is positive, production 12 of tip 1 can begin. Alternatively, after modification 11, a data set describing the tip geometry can be sent to the customer. The customer can then produce the optimized tip 1 themselves or have it produced.

[0061] Alternatively, after modification 11, the new tip geometry can be simulated again in an additional simulation 9. After simulation 9 using the finite element method, a further evaluation 10 can be performed. After this evaluation 10, tip 1 can be released for production 12, or a new basic tip shape can be selected in a further selection step 8. Alternatively, after the additional evaluation 10, another modification 11 can be made to the tip geometry. Tip 1 can then also be released for production 12. Alternatively, the now further modified tip geometry can be simulated again using simulation 9.

[0062] Advantageously, the simulation (9), evaluation (10), and modification (11) of the tip geometry are performed several times. This allows the tip (1) to be improved to an optimum or at least close to one.

[0063] The change 11 of the peak 1 can also be such that a return to a peak geometry from a previous simulation, evaluation and modification step is made and from there it is modified in another way.

[0064] The present invention is not limited to the embodiments shown and described. Modifications within the scope of the claims are possible, as is a combination of the features, even if these are shown and described in different embodiments. Reference symbol list

[0065] 1 Tip 2 Probe assembly 3 Boom 4 Tip base 5 Front section 6 Disc section 7 Required measuring characteristics 8 Selection of tip shape 9 Simulate 10 Evaluate 11 Modify 12 Produce 13 First area 14 Second area 15 Third area Tip length D Tip thickness α Angle β Angle

Claims

1. A computer-implemented method for providing a data set of a tip (1) for a probe device (2) for scanning probe microscopy, in particular for atomic force microscopy, wherein a scanning probe microscope with the aid of the tip (1) arranged on a cantilever (3) of the probe device (2) and having a tip geometry is used for the measurement of a sample, characterized in that in a step preceding the production process producing the tip (1), the tip geometry in the form of the data set which describes the tip (1), starting from a previously selected basic tip shape with regard to defined, required measurement properties, is optimized in that the tip geometry in the form of the data set, with regard to these measurement properties, is, in a computer-assisted manner, simulated (9), evaluated (10) and, as a function of the evaluation of the tip geometry in the form of the data set, modified (11), the tip geometry in the form of the data set is successively optimized by repeating the steps of simulating (9), evaluating (10) and modifying (11), and the stiffness of the tip (1) and the measurement resolution of the tip (1) are taken into account in the evaluation of the measurement properties.

2. The computer-implemented method according to claim 1, characterized in that the dimensions (L, D) of the tip (1) are also taken into account in the evaluation of the measurement properties.

3. The computer-implemented method according to claim 1 or 2, characterized in that an evaluation value is assigned in each case in the evaluation of the stiffness of the tip (1), the measurement resolution of the tip (1) and / or the dimensions (L, D) of the tip (1).

4. The computer-implemented method according to claim 3, characterized in that the evaluation values are combined to form an overall evaluation value.

5. The computer-implemented method according to at least one of the preceding claims, characterized in that the tip thickness (D) as part of the tip geometry in the form of the data set is reduced in at least one region when an evaluation value and / or an overall evaluation value lying above a defined threshold value is exceeded, and / or the tip thickness (D) is increased in at least one region when an evaluation value and / or an overall evaluation value lying below the defined threshold value is fallen below.

6. The computer-implemented method according to at least one of the preceding claims, characterized in that the tip length (L) as part of the tip geometry in the form of the data set is increased when an evaluation value and / or an overall evaluation value lying above a defined threshold value is exceeded, and / or said tip length (L) is reduced when an evaluation value and / or an overall evaluation value lying below the defined threshold value is fallen below.

7. The computer-implemented method according to at least one of the preceding claims, characterized in that the steps of simulating (9), evaluating (10) and / or modifying (11) are repeated until at least one evaluation value and / or the overall evaluation value (9) of the tip geometry in the form of the data set exceeds the previously defined threshold value.

8. The computer-implemented method according to at least one of the preceding claims, characterized in that the steps of simulating (9), evaluating (10) and / or modifying (11) are repeated until at least one evaluation value and / or the overall evaluation value (9) no longer improves in the case of a further computational modification (11) of the tip geometry in the form of the data set.

9. The computer-implemented method according to at least one of the preceding claims, characterized in that the simulation (9) of the tip geometry in the form of the data set and / or the evaluation (10) of the tip geometry in the form of the data set is carried out with the aid of finite element methods.

10. A computing unit for providing a data set of a tip (1), characterized in that the computing unit is configured to carry out a computer-implemented method according to one or more of the preceding claims.

11. A computer program which, when executed by a computing unit, causes the latter to carry out a computer-implemented method for providing a data set of a tip (1) according to one or more of the preceding claims 1-9.

12. A production method of a tip (1) for a probe device (2) for scanning probe microscopy, in particular for atomic force microscopy, wherein a scanning probe microscope with the aid of the tip (1) arranged on a cantilever (3) of the probe device (2) and having a tip geometry is used for the measurement of a sample, in which a data set describing the tip (1) is provided by means of a computer-implemented method according to one of the preceding claims 1-9, and in which the tip (1) is produced on the tip base (4) which is arranged on the cantilever (3) by means of an at least additive production method.

13. The production method according to claim 12, characterized in that at least a part of a surface section of the tip (1) is removed by means of a subtractive method, in particular reactive ion etching, at least after a step of the additive production method.