METHOD FOR PRODUCING AN ADHESIVE JOINT AND CARRIER PLATE FOR PRODUCING AN ADHESIVE JOINT

Description

Technical field

[0001] The invention relates to a method for producing an adhesive connection between at least a first and a second, at least partially transparent, plate-shaped component, in which the first component is placed on a carrier plate, in which adhesive is applied to the first component at predetermined locations on the side of the first component facing away from the carrier plate, in which a second component is placed on the first component and held parallel to the first component at a predetermined distance, in such a way that the second component comes into contact with the adhesive on the first component, and in which the adhesive is cured. Furthermore, the invention relates to a carrier plate for producing an adhesive connection between at least a first and a second, at least partially transparent, plate-shaped component according to the method according to the preceding description. State of the art

[0002] Methods for producing an adhesive bond between two plate-shaped components are well known in the art. One method that enables particularly high precision in positioning the components is described, for example, in WO 2004 / 112100 A1, where the bonding device comprises a detection station with which at least two sides of a component are detected with regard to their position and / or dimensions. For this purpose, the detection station preferably contains at least two camera systems, each for detecting one side of the component. Once the components are precisely positioned, they are preferably joined together by laser soldering.

[0003] Furthermore, JP 2012-152677 A discloses a device and a corresponding method for applying an ultraviolet-curable adhesive to a workpiece. The adhesive is applied to the workpiece along a narrow line width and then cured at least at the edges by exposure to UV light.

[0004] DE 10 2006 001 885 A1 relates to the use of a hot melt adhesive for fixing at least one microcomponent on a carrier for constructing a detector module with a manufacturing method for fixing at least one microcomponent on a carrier.

[0005] For this purpose, the hot melt adhesive is applied to a carrier, the microcomponent is positioned there at a predetermined distance from the carrier and fixed via the hot melt adhesive, and a firm adhesive bond is created between the at least one microcomponent and the carrier by cooling the hot melt adhesive.

[0006] US5433810A1 discloses a carrier plate for producing an adhesive bond between a first and second lens, which has a region that is transparent and non-transparent to UV light. JP2004086010A discloses a method and a device for producing an adhesive bond between at least one first and one second transparent component.

[0007] However, the existing methods are not very suitable for joining two components that are to be parallel to each other and at a predetermined distance from each other. In this case, care must be taken, for example, to ensure that only very little or, ideally, no stress is introduced into the components so that they retain their flat structure. The high temperatures encountered during laser soldering make the aforementioned method unsuitable for this purpose. Description of the invention

[0008] The object of the present invention is to provide a method for producing an adhesive bond between two plate-shaped components that enables high precision in the positioning of the components while introducing little or no stress into the components during bonding. Furthermore, the object of the present invention is to provide a carrier plate with which such a method can be carried out.

[0009] This object is achieved by a method for producing an adhesive connection according to patent claim 1 and a carrier plate for producing an adhesive connection according to patent claim 10.

[0010] A method is proposed for producing an adhesive bond between at least one first and second, at least partially transparent, plate-shaped component. The partially transparent plate-shaped components can be, for example, glass plates. If these are bonded together parallel to one another and at a predetermined distance from one another, they can be used, for example, in holographic glasses.

[0011] In the process, the first component is first placed on a carrier plate. Then, adhesive is applied to the first component at predetermined locations on the side of the first component facing away from the carrier plate. If the first component is placed on top of the carrier plate, the adhesive is applied to the top of the first component. In a next step, the second component is placed on top of the first component and held parallel to the first component at a predetermined distance. The exact positioning of the first component in relation to the second component is determined by the intended application of the components being bonded together. In the event that both components are the same size, it is often specified that the second component is positioned exactly above the first component. The exact distance between the two components is also determined by the intended application.In order to create an adhesive bond between the first component and the second component, the second component, when held parallel to the first component at a predetermined distance from it, must come into contact with the adhesive on the first component. This requires that the adhesive applied to the first component be sufficiently thick.

[0012] To cure the adhesive, it is exposed to light from the side of the carrier plate facing away from the components, through the at least partially transparent carrier plate and through the first component. This means that when the first component is on top of the carrier plate and the second component is held above the first component, the light is applied from below. The intensity and duration of the light exposure required to cure the adhesive depend on many factors, including the type and thickness of the adhesive, the temperature, and the spectrum of the light.

[0013] Because the light is applied from the side of the carrier plate facing away from the components, the components can be held in the specified position and at a predetermined distance from one another from the side of the carrier plate facing the components, without being affected by the light-generating devices. Furthermore, the light exposure allows the adhesive to cure without introducing stress into the components.

[0014] Preferably, the carrier plate is held in a plate holding frame. This allows for precise positioning of the carrier plate. Unlike a permanently installed carrier plate, this also allows carrier plates to be exchanged, for example, when an adhesive bond is to be created between other components, whereby different components to be bonded usually require different carrier plates.

[0015] According to the invention, the first component is placed on raised structures of the carrier plate. If the raised structures are small compared to the component, at least three raised structures are required to ensure stable hold of the first component on the carrier plate. By placing the first component on the raised structures of the carrier plate instead of on a flat surface, it is easier to achieve a flat alignment because even the smallest contamination between two flat surfaces is sufficient to cause the first component to tilt relative to the flat alignment. Furthermore, a component placed on raised structures of the carrier plate can be lifted off the carrier plate more easily after the adhesive bond has been created because better points of attack are available and adhesion of the first component to the carrier plate is at least largely avoided.

[0016] Advantageously, the adhesive is applied to the first component using a dosing valve. This allows the amount of adhesive applied to the first component to be precisely controlled. Too little adhesive could mean that the second component, when held at a predetermined distance from the first component, does not come into contact with the adhesive at all, and the adhesive bond could also become too weak. Too much adhesive, on the other hand, would take longer to cure and would increase the number of parts of the component that come into contact with the adhesive. The dosing valve is preferably movable so that adhesive can be applied to any desired location on the side of the first component facing away from the carrier plate.

[0017] It is advantageous if the specified locations where the adhesive is applied to the first component are located at the edge of the first component. The locations where adhesive has been applied often cannot be used for the intended purpose of the joined components. Applying the adhesive to the edge of the first component creates a large central area of ​​the first component where no adhesive has been applied, which can be used for the desired purpose.

[0018] It is also advantageous if the adhesive is applied to the first component in the area of ​​the raised structures of the carrier plate. The raised structures of the carrier plate are then naturally positioned where the adhesive is to be applied. Thus, the areas where no adhesive is applied are also free from the holding forces exerted by the raised structures of the carrier plate and thus also free from the local stresses caused by these holding forces.

[0019] Advantageously, at least the second component is held by a handling unit in a component holding frame. The handling unit can thus position the second component at the specified position and at a predetermined distance from the first component and hold it until the adhesive cures.

[0020] It is advantageous if, after the first component has been placed on the carrier plate, the position of the first component is measured using a camera device. The camera device has at least one camera, but can also have multiple cameras to achieve even greater accuracy. The photos taken by the cameras are preferably evaluated using image processing software to precisely measure the position of the first component. Before the second component comes into contact with the adhesive, the position of the second component is measured using the camera device. The cameras used by the camera device can be the same or different from those used to measure the first component. The photos taken of the second component are also evaluated using image processing software to precisely measure the position of the second component.Based on the positions measured in this way, the second component is adjusted with respect to the first component in such a way that the relative positions correspond to the specified relative positions.

[0021] To achieve even more precise positioning of the second component relative to the first component, a second measurement of the second component's position can be performed after the first adjustment of the second component, again using a camera device and image processing software. This newly determined position is then compared with the specified position, and any remaining deviations are eliminated by adjusting the second component again. These steps can be repeated several times if necessary.

[0022] It is also advantageous if the handling unit holding the component holding frame is aligned parallel to the carrier plate, with the alignment being carried out manually, optically, and / or by means of sensors. This alignment aligns the second component at least approximately parallel to the first component. Furthermore, this predetermines a plane parallel to the carrier plate for the handling unit, in which plane the second component is moved for alignment with the first component. Finally, the plane also predetermines a direction perpendicular to this plane, in which direction the second component is moved toward the first component after it has been aligned.

[0023] Advantageously, the second component is held at a predetermined distance from the first component by means of spacers attached to and / or placed on the first component. The spacers have a thickness that corresponds to the predetermined distance to be maintained between the first and second components. When the second component is pressed onto the spacers, the predetermined distance between the first and second components is established. Spacers attached directly to the first component must already be attached to the first component in a previous manufacturing step and can usually no longer be removed once the adhesive bond has been created. However, spacers attached directly to the first component simplify the creation of the adhesive bond because they do not have to be handled separately.Spacers placed on the first component, however, must be placed on the first component by a separate handling unit before or after the first component is placed on the carrier plate. However, if the spacers extend beyond the edge of the first component, they can be removed from the components after the adhesive bond has been established.

[0024] Alternatively, it is advantageous if the second component is held at a predetermined distance from the first component by means of sensors, in particular optical sensors. In this case, only the handling unit holds the second component via the component holding frame. The sensors are directed, for example, at one or preferably several points on the edges of the first and second components and measure the distance between the components, e.g. using image processing software. Based on the measured distance, the handling unit holding the second component is controlled such that the predetermined distance is achieved. Differences between the distances measured at different points on the edges show that the second component is not yet held parallel to the first component and preferably lead to a correction by the handling unit.

[0025] It is also advantageous if the light irradiating the adhesive is provided by a UV light source and / or a laser. UV light is defined as light with wavelengths in the range of 100 nm to 380 nm. The exact wavelength of the required UV light depends on the adhesive used. It is also conceivable to irradiate the adhesive with light from two light sources simultaneously or sequentially. Using a laser to irradiate the adhesive with light, it is possible to achieve particularly high light intensities and, thus, achieve particularly rapid curing of the adhesive.

[0026] Advantageously, the light is blocked by non-transparent, i.e. opaque, sections of the carrier plate in such a way that only the areas of the first and second components to which the adhesive is applied are exposed to light. The non-transparent sections of the carrier plate can be formed, for example, by an opaque layer, in particular a chrome layer, which is applied to a base body of the carrier plate. Alternatively, a mask connected to the base body, in particular a metal mask, can represent the non-transparent sections of the carrier plate. In order to cure the adhesive, only those areas of the first and second components to which adhesive is applied need to be exposed to light. However, the light leads to heating of the components at the points where they are exposed to light. This heating can cause stresses to arise in the components.Furthermore, light, especially UV light, can also cause damage to components. Limiting the light to the areas where adhesive is applied reduces potential stress and damage.

[0027] It is also advantageous if, in a similar way to the adhesive bond between the first component and the second component, an adhesive bond is created between the second component and a further component. Once the adhesive bond between the first and second components has been created, adhesive is applied to the second component at predetermined locations. The further component is then placed on the second component and held parallel to the second component at a predetermined distance. Finally, the adhesive is exposed to light from the side of the carrier plate facing away from the components through the carrier plate, the first and the second component to cure it. Depending on the specified number of plate-shaped components to be bonded, this process step can be repeated for additional components if necessary.

[0028] Furthermore, a carrier plate is proposed for creating an adhesive bond between at least one first and second, at least partially transparent, plate-shaped component. The partially transparent plate-shaped components can be, for example, glass plates, whereby the bonded glass plates can be used, for example, in holographic glasses.

[0029] The adhesive bond is produced using the method described above. Specifically, the first component is placed on the carrier plate, and adhesive is applied to the first component at predetermined locations on the side of the first component facing away from the carrier plate. The second component is then placed on the first component and held parallel to the first component at a predetermined distance such that the second component comes into contact with the adhesive on the first component. Finally, to cure the adhesive, it is exposed to light from the side of the carrier plate facing away from the components, through the carrier plate and the first component.

[0030] The carrier plate is characterized by the fact that it has a base body with raised structures onto which the first component can be placed. If the raised structures are small compared to the component, at least three raised structures are required to ensure that the first component is securely held on the carrier plate. By placing the first component on the raised structures of the carrier plate instead of on a flat surface, it is easier to achieve a flat alignment, since even the smallest contamination between two flat surfaces is sufficient to cause the first component to tilt relative to the flat alignment. Furthermore, a component placed on raised structures of the carrier plate can be more easily removed from the carrier plate after the adhesive bond has been created, since there are better points of attack and adhesion of the first component to the carrier plate is at least largely avoided.

[0031] Furthermore, the carrier plate has at least one transparent section and at least one non-transparent, i.e., opaque, section. The transparent section(s) are located at least at the locations where adhesive is applied to the first component, so that the adhesive can be exposed to light for curing from the side of the carrier plate facing away from the components through the transparent sections of the carrier plate and through the first component.

[0032] The opaque sections of the carrier plate protect the areas of the components behind them in the direction of the light from the light and the associated heat generation and / or damage to the material. Therefore, transparent sections of the carrier plate are preferably arranged only at the predetermined locations where adhesive is applied to the first component, while the locations where no adhesive is applied to the first component coincide with opaque sections of the carrier plate.

[0033] Advantageously, the transparent sections are arranged in the area of ​​the raised structures. The adhesive is then preferably also applied to the first component in the area of ​​the raised structures. Thus, the areas where no adhesive is applied are also free from the holding forces exerted by the raised structures of the carrier plate and thus also free from the local stresses caused by these holding forces.

[0034] It is advantageous if the raised structures are created by etching the non-raised areas. To do this, the areas that are not to be etched—i.e., the areas that will later become the raised structures—are first protected with a layer, such as a chrome layer. The unprotected area is then removed using an etching process, and the protective layer is subsequently removed. The protective layer can be applied with high precision, resulting in very precise raised structures.

[0035] It is also advantageous if the non-transparent sections are formed by an opaque layer, particularly a chrome layer, applied to the base body. Because the opaque layer is applied to the base body of the carrier plate and therefore does not require any stability itself, it is possible to limit the thickness of the opaque layer to that necessary to block the light, thereby minimizing the raw material requirements for the carrier plate.

[0036] Alternatively, it may be advantageous if the non-transparent sections are formed by a mask, in particular a metal mask, which is connected to the base body. The mask is first produced in a separate manufacturing process, for example also in an etching process or by laser cutting. The mask is then connected to the base body of the carrier plate, with positive, non-positive and / or material-locking connections being conceivable. Because the mask is produced separately, the base body of the carrier plate is not influenced, for example with regard to its flatness, during the production of the mask. Furthermore, materials, in particular metals, which cannot be applied directly as a layer to the base body of the carrier plate or can only be applied with difficulty can also be used for a separately produced mask.

[0037] Preferably, the transparency and opacity refer to UV light. UV light refers to light with wavelengths in the range of 100 nm to 380 nm. Many adhesives cure using UV light. The exact wavelength of the required UV light depends on the adhesive used, with the transparent and opaque sections of the carrier plate being transparent and opaque, respectively, to the spectral range of the UV light used.

[0038] Furthermore, an adhesive device for producing an adhesive bond between at least one first and second, at least partially transparent, plate-shaped component is proposed. The partially transparent plate-shaped components can be, for example, glass plates, and the glass plates bonded together can be used, for example, in holographic glasses.

[0039] The adhesive bond is created using the process described above. For this purpose, the bonding device comprises a worktop extending along a working plane and a base supporting this worktop. The worktop and base can be designed in a variety of ways, but should be stable and low-vibration to enable precise bonding of the first and second components.

[0040] Furthermore, the bonding device comprises a carrier plate, which is arranged on the worktop or can be arranged on the worktop and is designed according to the above description. The carrier plate is preferably held in a plate holding frame. The first component can be placed on the carrier plate. This is done by means of a handling unit designed to pick up, move, hold, and place the components. For this purpose, the component is preferably held by the handling unit in a component holding frame.

[0041] A movable dosing valve of the bonding device is designed to apply adhesive to the first component. The dosing valve should be movable at least in the working plane, preferably also perpendicular to the working plane, so that adhesive can be applied to predetermined locations on the first component. After the adhesive has been applied, the second component, picked up by the handling unit or another handling unit, is placed on the first component and held parallel to the first component at a predetermined distance.

[0042] The bonding device also has a light source for exposing the adhesive applied to the first component to light. The bonding device is characterized in that the light reaches the adhesive from the side of the carrier plate facing away from the components, through the carrier plate, and through the first component. This means that the light is introduced from below the carrier plate. Exposure to light cures the adhesive and creates an adhesive bond between the first and second components, with the first and second components being arranged parallel to one another and at a predetermined distance from one another.

[0043] Because the light is applied from the side of the carrier plate facing away from the components, the components can be held in the specified position and at a predetermined distance from one another from the side of the carrier plate facing the components, without being affected by the light source. Furthermore, the light exposure allows the adhesive to cure without introducing stress into the components.

[0044] Advantageously, the bonding device comprises a camera device for measuring the positions of the components. Using this camera device and preferably image processing software, the position of the first component and then the position of the second component are determined. Based on these positions, the second component is then adjusted with respect to the first component such that the relative positions correspond to the specified relative positions.

[0045] It is also advantageous if the bonding device has sensors, in particular optical sensors, for measuring the distance between the first component and the second component. In this case, the handling unit holds the second component via the component holding frame. The sensors are directed, for example, at one or preferably several points on the edges of the first and second components and measure the distance between the components, e.g. using image processing software. Based on the measured distance, the handling unit holding the second component is controlled such that the predetermined distance is achieved. Differences between the distances measured at different points on the edges show that the second component is not yet held parallel to the first component and preferably lead to a correction by the handling unit.

[0046] Finally, it is advantageous if the light source is a UV light source and / or a laser. UV light refers to light with wavelengths in the range of 100 nm to 380 nm. The exact wavelength of the required UV light depends on the adhesive used. Using a laser to expose the adhesive to light makes it possible to achieve particularly high light intensities and, thus, achieve particularly rapid curing of the adhesive.

[0047] Further developments, advantages, and possible applications of the invention will become apparent from the following description of exemplary embodiments and from the figures. All described and / or illustrated features, individually or in any combination, are fundamentally the subject of the invention, regardless of their summary in the claims or their reference back to them. The content of the claims is also incorporated into the description. Short description of the drawings

[0048] The invention will be explained in more detail below using exemplary embodiments in conjunction with the drawings. Fig. 1a - 1d schematic cross sections through a carrier plate, a first and a second component at different steps of producing an adhesive connection, Fig. 2 a schematic exploded view of some parts used for producing an adhesive connection and Fig. 3 a schematic side view of an adhesive device. Ways to implement the invention

[0049] Identical reference numerals are used in the figures for identical or equivalently functioning elements of the invention. Furthermore, for the sake of clarity, only those reference numerals are shown in the individual figures that are necessary for the description of the respective figure.

[0050] Figure 1ashows a schematic cross-section through a carrier plate 2 held in a plate holding frame 1 for establishing an adhesive bond between at least a first and a second, at least partially transparent plate-shaped component. The position and orientation of the carrier plate 2 can be adjusted, for example, via the plate holding frame 1.

[0051] The carrier plate 2 has a transparent, i.e., translucent, base body 3. The base body 3 is plate-shaped, i.e., it is a cuboid whose height is much smaller than its length and width.

[0052] Raised structures 4 are arranged on the upper side of the base body 3 of the carrier plate 2, onto which the first component is placed. The raised structures 4 are produced, for example, using an etching process. For this purpose, a protective layer, such as a chrome layer, is applied to the locations where the raised structures 4 are to be located. Then, sufficient material is etched away from the unprotected areas until the height of the raised structures 4 above the base body 3 reaches a predetermined value. The protective layer is then removed again.

[0053] Furthermore, an opaque layer 5 is applied to the upper side of the base body 3 of the carrier plate 2, specifically at all points on the upper side that do not have raised structures. The opaque layer 5 thus defines non-transparent sections 6 of the carrier plate 2, while the raised structures 4 coincide with transparent sections 6 of the carrier plate 2.

[0054] Instead of the opaque layer 5, the non-transparent sections 6 can also be formed by a mask, in particular a metal mask, connected to the base body 3. The mask is manufactured in a separate manufacturing process and subsequently connected to the base body 3 of the carrier plate 2 in a form-fitting, force-fitting, and / or material-fitting manner.

[0055] A light source 8 is arranged below the carrier plate 2, i.e., on the side of the carrier plate 2 facing away from the raised structures 4. Alternatively, the light source 8 can also be arranged at a different location, and optical elements such as mirrors or optical waveguides can be provided to direct the light from the light source 8 to the underside of the carrier plate 2.

[0056] Since the light from light source 8 serves to cure an adhesive applied between the first and second components, light source 8 is designed as a UV light source. UV light refers to light with wavelengths in the range from 100 nm to 380 nm. The exact spectrum of light source 8 depends on the adhesive used, since different wavelengths of light are required to cure the adhesive, depending on the adhesive.

[0057] Figure 1bshows a cross-section through the carrier plate 2 after the first at least partially transparent plate-shaped component 9 has been placed by a handling unit onto the raised structures 4 of the carrier plate 2. The first component 9 can in particular be a glass plate. The fact that the first component 9 rests only on the raised structures 4 of the carrier plate 2 ensures a stable, largely wobble-free position of the first component 9. Forces acting on the first component 9 also only occur in the area of ​​the raised structures 4, so that the first component 9 is largely free of stress at all other points.

[0058] In the area of ​​the transparent sections 7 of the carrier plate 2, adhesive 10 is applied to the side of the first component 9 facing away from the carrier plate 2 using a dosing valve. The carrier plate 2 with the first component 9 and the applied adhesive 10 is in Figure 1c shown.

[0059] Then, as in Figure 1d As shown, the second at least partially transparent plate-shaped component 12 held in a component holding frame 11 is placed onto the first component 9 by a handling unit and held parallel to the first component 9 at a predetermined distance D. In this case, the second component 12 also comes into contact with the adhesive 10.

[0060] The light source 8 is then switched on and exposes the adhesive 10 to light 13. The path of the light 13 runs from the light source 8 through the transparent sections 7 of the carrier plate 2 and through the first component 9 to the adhesive 10. The duration of the exposure of the adhesive 10 to light 13 depends on various factors, including the type of adhesive 10, the intensity of the light 13, the thickness of the adhesive 10 and the temperature.

[0061] Since the light 13 is blocked by the non-transparent sections 6 of the carrier plate 2, the areas of the first component 9 and second component 12 where no adhesive 10 is applied are not exposed to light 13. Consequently, at the areas where no adhesive 10 is applied, the components 9 and 12 are not heated or damaged by the light 13. This also reduces stresses in the components 9 and 12 to a necessary minimum, so that the first component 9 and the second component 12 have a high degree of parallelism to one another. This is of great importance, for example, when the first and second components 9 and 12 are glass plates that are glued together parallel to one another at a predetermined distance D for use in holographic glasses.

[0062] Figure 2shows a schematic exploded view of some of the parts used to create the adhesive bond. From bottom to top, this is the plate holding frame 1, in which the carrier plate 2 is held and by means of which the carrier plate 2 can be adjusted.

[0063] The carrier plate 2 has raised structures 4, wherein raised structures 4 are provided for holding four first components 9, so that four adhesive bonds can be established simultaneously. The raised structures 4 are arranged such that they each come into contact with the first component 9 in an edge region of the first component 9.

[0064] A mask 14, in particular a metal mask, is placed on the base body 3 of the carrier plate 2 and connected to the base body 3. The mask 14 is opaque and has recesses that coincide with the raised structures 4 of the carrier plate 2. Through these recesses, the adhesive 11 can be exposed to light 13 from below through the carrier plate 2 and the first component 9.

[0065] The component holding frame 11, in which first the first component 9 and then the second component 12 are received, has recesses for holding four first and second components 9 and 12, respectively, so that a handling unit moving the component holding frame 11 can position four components 9 or 12 simultaneously.

[0066] Finally, in Figure 2Four first plate-shaped components 9 are also shown, for which an adhesive connection can be established simultaneously. The four second plate-shaped components 12 are preferably identical or similar to the first components 9.

[0067] Figure 3 shows a schematic side view of a bonding device 15. The bonding device 15 has a worktop 16 and a base frame 17 supporting the worktop 16. The top side of the worktop 16 defines a working plane E.

[0068] A support plate 2 with raised structures 4 is located centrally on the worktop 16, and a light source 8 is arranged below the support plate 2 in a recess of the worktop 16. A control unit 18 of the gluing device 15, which controls the units of the gluing device 15, is only indicated.

[0069] A camera device 19 is arranged above the carrier plate 2, here for example with two cameras 20. A handling unit 21 and a dosing valve 22 for adhesive 10 are also movable above the work plate 16 in the work plane E and perpendicular to the work plane E.

[0070] To create an adhesive bond between two at least partially transparent plate-shaped components 9 and 12, the first component 9 held in the component holding frame 11 is first picked up by the handling unit 21 from a receiving station 23, moved to the carrier plate 2, and placed there. The exact position of the first component 9 is captured by the cameras 20 of the camera device 19 and evaluated by image processing software in the control unit 18.

[0071] Adhesive 10 is then applied to the first component 9 at predetermined locations using the dosing valve 22. The second component 12, also held in the component holding frame 11, is then picked up by the handling unit 21 from the pick-up station 23 and moved to the carrier plate 2. Before the second component 12 is placed on the first component 9, it is captured by the cameras 20 of the camera device 19 and evaluated using the image processing software in the control unit 18. The measured position of the second component 12 is compared with the measured position of the first component 9, and if necessary, the position of the second component 12 is corrected by the handling unit 21.

[0072] The second component 12 is then placed on the first component 9 and held parallel to the first component 9 at a distance D from the first component 9. This distance D is measured by a sensor 24, shown here as an optical sensor, arranged close to the carrier plate 2 and directed at the edges of the components 9 and 12. The handling unit 21 then moves the second component 12 such that the distance D between the first and second components 9 and 12 corresponds to a predetermined distance D.

[0073] As soon as the second component 12 is correctly aligned, the light source 8 is switched on and the adhesive 10 is exposed to light 13 from the underside of the carrier plate 2 through the carrier plate 2 and through the first component 9 to cure it.

[0074] After a predetermined period, the light source 8 is switched off again, and the bonded components 9 and 12 are transported to a delivery station 25 by means of the handling unit 21. The next components 9 and 12 can then be bonded together. List of reference symbols

[0075] 1Plate holding frame 2Carrier plate 3Base body 4Raised structures 5Opaque layer 6Intransparent section 7Transparent section 8Light source 9First component 10Adhesive 11Component holding frame 12Second component 13Light 14Mask 15Adhesive device 16Working plate 17Subframe 18Control unit 19Camera device 20Camera 21Handling unit 22Dosing valve 23Pick-up station 24Sensor 25Dispensing station DAdistance EWorking plane

Claims

1. Method for producing an adhesive bond between at least one first and second, at least partially transparent, plate-like component (9; 12), in which the first component (9) is placed onto a supporting plate (2), in which adhesive (10) is applied to the first component (9) at specified locations on the side of the first component (9) which faces away from the supporting plate (2), in which the second component (12) is placed onto the first component (9) and is held parallel to the first component (9) at a predetermined distance (D), namely in such a manner that the second component (12) comes into contact with the adhesive (10) located on the first component (9), wherein to cure the adhesive (10), this adhesive is exposed to light (13) from the side of the supporting plate (2) facing away from the components (9; 12) through the at least partially transparent supporting plate (2) and through the first component (9), characterized in that the first component (9) is placed onto raised structures (4) of the supporting plate (2).

2. Method according to claim 1, characterized in that the supporting plate (2) is held in a plate-holding frame (1).

3. Method according to claim 1 or 2, characterized in that the adhesive (10) is applied to the first component (9) by means of a metering valve (22).

4. Method according to one of claims 1 to 3, characterized in that the specified locations at which the adhesive (10) is applied to the first component (9) are located in an edge region of the first component (9) and / or in that the adhesive (10) is applied to the first component (9) in the region of the raised structures (4) of the supporting plate (2) and / or in that at least the second component (12) is held by a handling unit (21) in a component-holding frame (11).

5. Method according to one of claims 1 to 4, characterized in that after the placement of the first component (9) onto the supporting plate (2), the position of the first component (9) is measured by means of a camera device (19), before the second component (12) is brought into contact with the adhesive (10), the position of the second component (12) is measured by means of the camera device (19) and the second component (12) is adjusted in relation to the first component (9) on the basis of the measured positions.

6. Method according to claim 4 or 5, characterized in that the handling unit (21) holding the component-holding frame (11) is aligned parallel to the supporting plate (2), wherein the alignment is carried out manually optically and / or by means of sensors.

7. Method according to one of claims 1 to 6, characterized in that the holding of the second component (12) at a predetermined distance (D) from the first component (9) is carried out by means of spacers that are attached on the first component (9) and / or placed onto the first component (9) and / or in that the holding of the second component (12) a predetermined distance (D) from the first component (9) is carried out by means of sensors (24), particularly optical sensors.

8. Method according to one of claims 1 to 7, characterized in that the light (13) to which the adhesive (10) is exposed is provided by a UV light source and / or a laser and / or in that the light (13) is blocked by non-transparent sections (6) of the supporting plate (2) in such a manner that only the regions of the first and second component (9; 12) at which the adhesive (10) is applied are exposed to light (13).

9. Method according to one of claims 1 to 8, characterized in that, analogously to the production of the adhesive bond between the first component (9) and the second component (12), an adhesive bond is produced between the second component (12) and a further component and this method step is possibly repeated for yet further components.

10. Supporting plate for producing an adhesive bond between at least one first and second, at least partially transparent plate-like component (9; 12) according to the method of one of claims 1 to 9, comprising a base body (3) having raised structures (4), onto which the first component (9) can be placed, wherein the supporting plate (2) comprises at least one transparent section (7) and at least one non-transparent section (6), characterized in that the transparent sections (7) are arranged in the region of the raised structures (4).

11. Supporting plate according to claim 10, characterized in that the raised structures (4) are produced by etching the locations that are not raised.

12. Supporting plate according to claim 10 or 11, characterized in that the non-transparent sections (6) are formed by an opaque layer (5) that is applied on the base body (3), particularly a chrome layer, and / or in that the non-transparent sections (6) are formed by a mask (14), particularly a metal mask, that is attached to the base body (3) and / or in that the transparency and non-transparency relates to UV light.

13. Bonding device for producing an adhesive bond between at least one first and second, at least partially transparent, plate-like component (9; 12) according to the method of one of claims 1 to 9, comprising a worktop (16) that extends along a working plane and a base frame (17) supporting this worktop (16), a supporting plate (2) according to one of claims 15 to 20, which is arranged or can be arranged on the worktop (16) and onto which the first component (9) can be placed, a handling unit (21) for accommodating, moving, holding and placing the components (9; 12), a movable metering valve (22) for applying adhesive (10) to the first component (9) and a light source (8) for exposing the adhesive (10) applied on the first component (9) to light (13) from the side of the supporting plate (2) facing away from the components (9; 12) through the supporting plate (2) and through the first component (9).

14. Bonding device according to claim 13, characterized in that the bonding device (15) comprises a camera device (19) for measuring the positions of the components (9; 12) and / or in that the bonding device (15) comprises sensors (24) for measuring the distance (D) between the first component (9) and the second component (12).

15. Bonding device according to claim 13 to 14, characterized in that the light source (8) is a UV light source and / or a laser.