METHOD FOR PRODUCING A COMPONENT USING AN ADDITIVE MANUFACTURING METHOD

Description

[0001] The present invention relates to a method for producing a component using an additive manufacturing process. The present invention relates to a method by which a component can be produced that is constructed from at least a first material and a second material that is different from the first material.

[0002] In many areas, it is advantageous to produce components using additive manufacturing processes, such as 3D printing. Such processes are used, for example, in the manufacturing industry, model making, and research for the rapid and cost-effective production of models, samples, prototypes, tools, and final products. There are also exemplary applications in the home and entertainment sector, the construction industry, as well as in art and medicine.

[0003] Additive manufacturing processes, such as 3D printing, are a term used to describe manufacturing processes in which the material used to construct the component is applied layer by layer to create three-dimensional components. This layer-by-layer construction is preferably computer-controlled, using one or more liquid or solid materials according to predefined dimensions or geometries.

[0004] Physical or chemical curing or melting processes often take place during the construction of the component. Typical materials for additive manufacturing include plastics, synthetic resins, ceramics, and metals.

[0005] Two-stage processes are known, particularly for the production of components made from different materials, such as electrically conductive and electrically insulating materials. In these processes, the component is first produced as a non-conductive carrier structure and then, in an additional process, partially or completely provided with a thin, electrically conductive structure. The electrically conductive structure is applied, for example, by spray painting, for example with masking, by inkjet processes, or by special galvanic processes, over the entire surface or over a large area. This is usually done using an electrically conductive ink. According to the state of the art, the latter must be sintered in a further step after application in order to fuse the electrically conductive particles in the ink together.Due to the sintering process, which takes place at high temperatures, there is usually a risk of thermal deformation of the carrier.

[0006] DE 10 2014 007 562 B4 relates to a device and a method for producing three-dimensional molded parts with an integrated conductive pattern structure using additive manufacturing processes from an electrically conductive and a non-conductive material. The molded part is composed of the non-electrically conductive material and the integrated conductive pattern structure is composed of the electrically conductive material, and the electrically conductive material consists of a TCO ink. First, the molded part is produced from the non-electrically conductive material, and then the conductive structure is created using the TCO ink.

[0007] DE 10 2015 002 967 A1 describes a 3D printing tool designed to process 3D printing material that melts upon heating, thereby forming the workpiece. It includes a supply unit for feeding the 3D printing material for 3D printing, and a radiant heater for selectively heating the printing material sufficiently to melt the 3D printing material while the heated 3D printing material is guided through the supply unit onto the workpiece to be formed. Certain radiation-absorbing and / or reflective properties can be achieved by incorporating electrically conductive fibers.

[0008] DE 10 2015 110 342 A1 relates to a conductive element, such as an antenna, for use in electronic devices, such as mobile devices, and to methods and devices for forming the conductive element. According to an exemplary aspect, this document relates to a conductive antenna formed by applying conductive fluids, as well as to a method and device for its production. In one embodiment, a complex (3D) conductive track is formed using two or more different printing techniques by creating different regions within the conductive track pattern on a previously formed component.

[0009] US 2016 / 297104 A1 relates to 3D printer input materials containing filaments with separate layers or sections. These inputs, in particular filaments, can be produced by coextrusion, microlayer coextrusion, or multi-component / fractal coextrusion. These input materials, and in particular filaments, enable the simultaneous application or combination of different materials through one or more nozzles during the so-called 3D printing process. These techniques enable smaller layer sizes (in the milli-, micro-, and nanoscale), different layer configurations, and the use of materials not used in conventional 3D printing processes.

[0010] DE 10 2016 225 837 A1 relates to a method for producing a body-supporting upholstery part with a heating element, as well as to a motor vehicle. A method for producing a body-supporting upholstery part with a heating element is provided. This method comprises the steps of providing a 3D printing device, in particular a device for carrying out a fused deposition modeling process, providing a first printing material, wherein the first printing material is a plastic or a plastic-containing mixture, and providing a second printing material, wherein the second printing material comprises an electrically conductive material. A padding body is produced by 3D printing the first printing material, and a heating element is produced by 3D printing the second printing material. The padding body and / or the heating element are produced in such a way that the padding body rests against the heating element.

[0011] US 2017 / 106447 A1 describes manufacturing methods for a three-dimensional shaped object for manufacturing the three-dimensional shaped object by stacking layers, comprising supplying a first supply object containing a first material to a support body and sintering the first material to thereby solidify the first material to form a first layer, and supplying a second supply object containing a second material having a melting point or sintering temperature lower than a sintering temperature of the first material to be laid on the first layer, and sintering or melting the second material to thereby solidify the second material to form a second layer.

[0012] FR 3 069 800 A1 describes a method for producing a light decoration, comprising the following steps: securing an extruder to a moving means, hot-extruding a strand of thermoplastic material through the extruder, moving the extruder along a path so as to form a decorative structure with at least one curved contour, embedding a string of lights in at least one target portion of the strand, wherein the embedding takes place during the movement of the extruder when the strand is in a pasty state.

[0013] However, such solutions known from the prior art may still have potential for improvement, particularly with regard to a simple and / or gentle production of components made of different materials, which may be particularly stable.

[0014] It is therefore the object of the present invention to provide a measure by which at least one disadvantage of the prior art is at least partially overcome. In particular, it is an object of the present invention to design a component constructed from multiple materials, wherein the component can exhibit high stability and / or wherein the method can be carried out simply and / or gently.

[0015] The object is achieved according to the invention by a method having the features of claim 1. The object is further achieved according to the invention by a use according to claim 10. Preferred embodiments of the invention are disclosed in the subclaims, in the description, the example and in the figures, wherein further features described or shown in the subclaims or in the description or the figures or the example can represent an object of the invention individually or in any combination, unless the context clearly indicates the opposite.

[0016] The present invention relates to a method for producing a component by means of an additive manufacturing method, wherein the component is constructed from at least a first material and a second material different from the first material, wherein the method comprises the following steps: a) Layer-by-layer construction of the component by locally applying the first material and the second material to a support surface;wherein b) the layered construction of the component takes place by locally applying the first material and the second material to a support surface in accordance with the geometry of the component to be produced, wherein c) the first material and the second material are at least partially applied to the support surface in such a way that the second material is at least partially in contact with the first material when the first material has a temperature which is in a range of ≥ 100°C, preferably ≥ 150°C, for example ≥ 200°C, wherein the second material is a material to be sintered and that the first material and the second material are at least partially applied to the support surface in such a way that the second material is at least partially in contact with the first material when the first material still has a temperature which is above the sintering temperature of the material to be sintered.

[0017] Such a process makes it possible to create a component made of multiple materials that can also be particularly stable. Furthermore, the process can be particularly simple and gentle.

[0018] Thus, a method is described for manufacturing a component using an additive process. For the purposes of the present invention, an additive process is a manufacturing process in which the material used to construct the component is applied layer by layer to build or create three-dimensional components layer by layer. This layer-by-layer construction is preferably computer-controlled from one or more liquid, i.e., molten or partially molten, materials according to predefined dimensions or geometries.

[0019] Additive manufacturing processes utilize different materials and process techniques to build objects layer by layer. In Fused Deposition Modeling (FDM), for example, a thermoplastic wire is liquefied and deposited layer by layer onto a movable build platform using a nozzle. Upon solidification, a solid object is created. The nozzle and build platform are controlled based on a CAD drawing of the object. For example, the present invention is based on an FDM process, but is not limited to it.

[0020] In principle, but not limited to, typical materials for 3D printing include plastics, such as synthetic resins, ceramics, metals, or even carbon and graphite materials. Furthermore, additive manufacturing can also involve other processes besides FDM, in which, in particular, the molten or partially molten, and thus moldable, material is extruded from a nozzle to build the component.

[0021] The component produced using the method described here is further characterized in that it consists not only of one material, but of two, and thus two or more than two, different materials. These materials may, if appropriate, each be composed of several materials or a mixture of materials, and may also contain individual solid particles. By forming the component from at least two different materials, it may be possible for the component not to have homogeneous properties throughout its entirety, but rather to have locally differing, for example, physical, properties.For example, but not limited to, the different properties can include friction coefficients, mechanical stability, electrical conductivity, thermal conductivity, magnetic properties, density, hardness, wear resistance, temperature resistance, or even color. Thus, the component can, for example, have local structures in which the material is heterogeneous to a limited extent with regard to the aforementioned properties, but is not limited to these.

[0022] The described method for producing such a component comprises the following steps.

[0023] According to process step a), the component is built up layer by layer by locally applying the first material and the second material to a support surface. Essentially, an additive process is to be carried out, and thus, for example, based on digital data, the component is built up with the different materials according to a predefined geometry. Accordingly, according to process step b), the layer by layer construction of the component is carried out by locally applying the first material and the second material to a support surface according to the geometry of the component to be manufactured, and thus according to the shape and size of the component to be manufactured.

[0024] Furthermore, according to method step c), it is provided that the first material and the second material are at least partially applied to a support surface in such a way that the second material is at least partially in contact with the first material when the first material has a temperature in a range of ≥ 100°C. A support surface can be understood to mean, for example, a substrate on which the component is to be formed, or an already built-up layer of the first and / or the second material.

[0025] In particular, as explained above, the first material and the second material are at least partially applied to a support surface in such a way that the second material is at least partially in contact with the first material when the first material has a temperature in a range of ≥ 100°C, preferably ≥ 150°C, approximately ≥ 200°C, significant advantages can be achieved compared to the solutions from the prior art.

[0026] The process described here allows the different materials to be present, depending on the materials used, rather than being adjacent to each other due to the heat effect. Instead, the second material can be at least partially incorporated into the first material, for example, in a boundary layer. This allows for particularly high stability, as it has been shown that the described process allows the second material to adhere particularly firmly to the boundary layer(s) in the first material after hardening, thus generating high adhesion forces.This is made possible, in particular, by the second material at least partially penetrating the first material when the first material is moldable due to the high temperature, and not, as is known in the prior art, the second material being arranged next to the first material or on top of the first material when the first material has already hardened. Thus, the produced component can have high mechanical strength even when two or more than two materials are provided, whereby the risk of reduced strength at the interface between the first and second materials is at least significantly reduced.

[0027] Furthermore, the component can be easily manufactured using the process described here. By adjusting the process parameters, good stability can be achieved without additional process steps. In particular, post-treatment to stabilize the components can be omitted, which can prevent negative effects on the materials caused by the post-treatment. Thus, the process described here can be particularly gentle, especially for the first and second materials.

[0028] Furthermore, it is possible that the temperature of the first material has a beneficial effect on the second material. This can, for example, be used in the formation of electrically conductive structures, as described below, but is not limited thereto.

[0029] When forming components, it is often advantageous for materials to be subjected to thermal post-treatment. This can be done, for example, to create desired properties of the respective material. For example, the thermal post-treatment of the material can be hardening or sintering. Because in the method described here the second material is in contact with the first material when the first material has a temperature in a range of ≥ 100°C, for example ≥ 150°C, particularly preferably ≥ 200°C, this thermal post-treatment, such as hardening and / or sintering, can take place directly during the production of the component.

[0030] The process described here thus makes it possible to dispense with a separate thermal treatment as a further process step. This allows the described process to be carried out with a reduced time expenditure and at a particularly low cost. Furthermore, the peripherals and equipment required for the process described here can be very simple.

[0031] It is provided that the second material is a material to be sintered, and that the first material and the second material are at least partially applied to the support surface in such a way that the second material is at least partially in contact with the first material when the first material still has a temperature above the sintering temperature of the material to be sintered. A material to be sintered can be understood, in particular, as a material that can and should be subjected to a sintering step.

[0032] The temperature influence of the first material on the second material can already initiate a sintering step. For the non-limiting example of a conductive ink, for example, this can enable the formation of a coherent electrically conductive structure. However, the sintering step is by no means limited to conductive inks.

[0033] By influencing the temperature of the first material instead of a further sintering step, the temperature treatment can be reduced, thus enabling a particularly gentle process without the need for an additional process step. Thus, a combination such as this is particularly advantageous, where sintering of the second material can take place at a temperature at which the first material is still below the decomposition temperature of the first material.

[0034] It may be preferred for the second material to come into contact with the first material, which is at a temperature of ≥ 100°C, before the first material is applied to the support surface, so that the first material and the second material are applied to the support surface together in one step. In this embodiment, the first material and the second material are therefore applied to the support surface together in one step, which can save a further process step. In detail, by applying the first material and the second material together in one process step, for example, the application of the second material as a separate process step can be avoided, which can increase the efficiency of the process. In addition, the temperature influence of the first material on the second material can take place over a long period of time, which enables a particularly intensive temperature treatment.

[0035] Alternatively or additionally, it can be provided that the second material comes into contact with the first material present at a temperature of ≥ 100°C after the first material has been applied to the support surface or when the first material is applied to the support surface. In principle, the first material can be applied to the support surface first and then the second material, or first the second material and then the first material. In this embodiment, the second material can therefore be applied, for example, immediately after the first material or vice versa. Highly defined structures can be created because the positioning of the second material can be controlled in a particularly defined manner when the first material is already present on the support surface.

[0036] It can further be provided that at least one surface structure of the component is created using the second material. This embodiment thus enables a defined application of the second material to the surface of the component, which can be extremely advantageous depending on the application, for example, for the formation of electrically conductive structures on the surface of the component, but also for other heterogeneous properties of the component.

[0037] Alternatively or additionally, it can be provided that an internal structure of the component is created using the second material. This embodiment, namely the defined arrangement of the second material in the internal volume of the component, can also achieve application-specific advantages and improve the application versatility of a component produced using the method according to the invention.

[0038] Thus, it can be provided that only an internal structure of the component is produced with the second material, that only a surface structure of the component is produced with the second material, or that an internal structure of the component is produced with the second material and that a surface structure of the component is produced with the second material.

[0039] It can further be provided that the first material is not electrically conductive and that the second material is electrically conductive. This embodiment thus makes it possible to provide a substrate made of non-electrically conductive material with electrically conductive structures. Such structures are highly advantageous for many applications. Purely examples include printed circuit boards, metamaterial absorbers, and antennas, for example, for high-frequency applications, but are not limited to these.

[0040] For the purposes of the invention, an electrically conductive structure can be understood as meaning, in particular, a structure which has a material conductivity of ≥10 3< S / m, for example ≥ 10 4< S / m.

[0041] With regard to an electrically conductive material, it can be provided that the second material is a conductive ink. This embodiment in particular makes it possible to produce a particularly stable structure using a simple method. This is because it is known from the prior art that, in particular, the use of conductive inks with particles having larger particle diameters, for example in the range of 30 µm, requires a subsequent sintering step in order to sinter the electrically conductive particles present in the conductive inks and thus form a coherent electrically conductive structure. However, according to the prior art, such a sintering step or an associated temperature treatment is, on the one hand, an additional process step and, on the other hand, can damage or negatively influence the first material, in particular deform it. According to the invention, this additional step can be prevented.

[0042] Thus, the conductive inks containing nanoparticles used in the prior art are significantly more expensive and complex to produce than using corresponding conductive inks with the method according to the invention. According to the invention, these disadvantages can be overcome, as described in detail above with reference to a sintering step.

[0043] In principle, known conductive inks, such as TCO inks (TCO, transparent conductive oxide), can be used.

[0044] However, the second material as an electrically conductive material is by no means limited to conductive inks. Other possibilities include electrically conductive particles, conductive pastes such as solder pastes, or other conductive materials. In principle, metals or electrically conductive plastics can be particularly advantageous for electrically conductive second materials.

[0045] It can also be provided in principle that the first material and the second material differ in at least one property which is selected from the group consisting of electrical conductivity; thermal conductivity; magnetic properties; mechanical properties such as e.g. Young's modulus, stiffness, compliance; surface-modifying properties such as e.g. hardness, roughness, haptics, wetting behavior, corrosion properties; tribological properties such as e.g. friction values, wear properties; aesthetic properties such as e.g. color; particle-containing properties such as e.g. different particle diameters; optical properties such as e.g. absorption coefficient, reflection behavior. In particular in this embodiment, components with heterogeneous properties can be formed which have a wide range of applications and for which the invention can be used very effectively.

[0046] Particularly preferably, the first material and the second material differ by ≥ 10%, preferably by ≥ 20%, approximately by ≥ 50%, based on the smaller value of the different parameters, in the respective property or in the respective parameter.

[0047] In this configuration, the component can be tailored to a wide range of properties and heterogeneous structures can be arranged, making the application diversity particularly broad. All applications can share the commonality of simple manufacturing and a stable design of the resulting component.

[0048] With regard to the first material, it can be provided that the first material is selected from the group consisting of metals, such as in the form of filaments and / or for the production of stainless steel parts, ceramics, such as zirconia ceramics, or, in particular, thermoplastics, such as polylactide (PLA), polycarbonates (PC), acrylonitrile-butadiene-styrene copolymers (ABS), or even carbon or graphite materials. Such materials can form stable components for a variety of applications and are also easily processable using a method described here. In particular, such materials can be easily processed using additive processes and combined with other materials.

[0049] For further advantages and technical features of the method, reference is made to the description of the device, the use of the figures and the description of the figures.

[0050] Also described is a device for producing a component by means of an additive manufacturing process, wherein the component is constructed from at least a first material and a second material different from the first material, wherein the device comprises a carrier for constructing the component and has a first discharge device for discharging the first material and for arranging the first material on the carrier, wherein the device further comprises means for discharging the second material to carry out a method as described in detail above.

[0051] Such a device thus makes it possible to easily form a component that is made of at least two different materials and has a high mechanical stability.

[0052] The device is thus used, in particular, to produce a component using an additive manufacturing process. In particular, the device is used to implement an FDM process and, in principle, comprises corresponding means known to those skilled in the art.

[0053] The device comprises a carrier for forming the component and correspondingly for supporting the manufactured component. The component can thus be built up on this carrier by applying the first material and the second material to this carrier and additively building up the component layer by layer. The carrier can thus serve as a support surface. The layer-by-layer construction of the component can be controlled by a control unit according to predefined data. The data represents the component to be built up and can, for example, be stored in a memory of the control unit. It may also be possible for the data to be retrieved via a wireless data connection, for example from a cloud. Accordingly, communication means for a wireless data connection can be part of the device.

[0054] For the layered construction of the component, the device comprises a first dispensing device for dispensing the first material and for arranging the first material on the carrier. The dispensing device can, for example, be a nozzle connected to a container for the first material. The dispensing device, for example comprising the nozzle, can be three-dimensionally controllable, so that the first material can always be dispensed at the position suitable for forming the component.

[0055] It is further provided that the device comprises means for dispensing the second material for carrying out a method as described above. Thus, these means ensure that the second material is in contact with the first material when the first material has a temperature in a range of ≥ 100°C. Accordingly, the advantages described above with reference to the method can be achieved.

[0056] In principle, there are various possibilities for designing the device, or in particular the means(s) for dispensing the second material. However, it may be preferred that the means(s) for dispensing the second material be provided with a cooling device or be capable of being cooled. This ensures that the second material is not heated to such an extent that hardening and / or sintering occurs, for example, due to proximity to the nozzle for the first material before it is dispensed from the means(s).

[0057] For example, the device may be provided with a mixing connection through which the second material can be discharged together with the first material by the first discharge device. This mixing connection is particularly designed such that the second material can be discharged together with the first material by the first discharge device, for example, by introducing the second material into the first discharge device so that the second material comes into contact with the first material in the first discharge device. This design thus ensures that the second material is discharged together with the first material.

[0058] In this regard, it can be provided that the mixing connection is provided on the first discharge device. This allows for particularly simple control of the device, since the mixing connection can be moved together with the first discharge device, so that no separate control for moving a second discharge device is necessary. Furthermore, the device in this embodiment can be particularly simple to design. For example, the mixing connection can be part of a nozzle for discharging the first material, or the mixing connection can be arranged upstream of the nozzle.

[0059] Furthermore, it can be provided that the device has a second discharge device for discharging the second material. In this embodiment, two different discharge devices, such as two nozzles, can basically be provided, or the second discharge device can be designed together with the first discharge device as a continuous component. In this embodiment, it is thus made possible for the second material to also be discharged onto the application surface, i.e. in particular onto already discharged first material or the carrier, or for the first material to be discharged onto already discharged second material. Accordingly, it is provided that the second discharge device is arranged adjacent to the first discharge device.

[0060] For further advantages and technical features of the device, reference is made to the description of the method, the use, the figures and the description of the figures.

[0061] The use of a method or a device as described above for producing an electrically non-conductive component with an electrically conductive structure is also described.

[0062] As described in more detail above, the method and device described above enable the simple production of a component from at least two different materials, with the component being particularly stable. Particularly advantageously, electrically conductive structures can be made possible on electrically non-conductive base bodies.

[0063] In the field of high-frequency technology, for example, special applications for additive manufacturing processes have recently been found, including for antennas for microwave components. The workpiece is first manufactured as a non-conductive support structure made of plastic and then, in an additional process, partially or completely coated with a thin, conductive layer. The layer is applied, for example, by spray painting, using masking, inkjet processes, or even special electroplating processes. Such conductive layers can also be referred to as metallization.

[0064] Conductive ink is also ink that is printed in a structure, for example, onto a non-conductive object so that the structure conducts electricity. Typical applications include printed circuit boards. Conductive ink is typically created by incorporating graphite or other conductive materials, such as silver particles, into the ink. After the ink has been applied, the conductive particles can be welded together in a sintering process at temperatures below the corresponding bulk metal melting point. This sintering process does not involve a phase change between solid and liquid, but rather a phenomenon of surface diffusion. For conductive ink (e.g. graphite) with nanoparticles, sintering may not be necessary. For larger particles, for example silver particles with a particle diameter of around 30 µm, sintering is necessary.

[0065] The conventional approach to sintering conductive ink involves heating the ink-containing object either on a hot plate or in a furnace. Other options include laser sintering, plasma sintering, or microwave sintering. Damage to the substrate material is possible due to the heat applied.

[0066] In addition to the production of printed circuit boards, possible applications in radio-frequency technology include the production of printed antennas or printed assemblies for microwave technology. Planar printed antennas, for example, on foil or paper, are used in RFID (radio frequency identification) applications.

[0067] Further very interesting applications are possible if the metallization can be applied not only planar but also three-dimensionally. Likewise, if the conductive structure can be incorporated into the carrier structure made of non-conductive material, especially plastic, directly during the printing process. This allows complex workpieces to be manufactured in a comparatively simple manner.

[0068] The method and device described advantageously make it possible for the additive process and the metallization process to take place simultaneously, virtually without delay. This allows conductive structures to be easily incorporated into the carrier structure, something that would be impossible or difficult to achieve with a separate process.

[0069] For further advantages and technical features of the use, reference is made to the description of the method, the device, the figures and the description of the figures.

[0070] The invention is explained below by way of example with reference to the attached drawings and examples, wherein the features presented below can represent an aspect of the invention both individually and in combination, and wherein the invention is not limited to the following drawing, the following description and the following embodiment.

[0071] They show: Fig. 1 a schematic representation of a first embodiment of an apparatus for carrying out a method according to a first embodiment of the invention; Fig. 2a schematic representation of a further embodiment of a device for carrying out a method according to a further embodiment of the invention; Fig. 3 a schematic representation of a further embodiment of a device for carrying out a method according to a further embodiment of the invention; Fig. 4 a schematic representation of a further embodiment of an apparatus for carrying out a method according to a further embodiment of the invention; and Fig. 5 a schematic representation of a further embodiment of a device for carrying out a method according to a further embodiment of the invention.

[0072] In the Figure 1A device 10 for carrying out a method according to the invention is shown. In particular, the device 10 serves to produce a component by means of an additive manufacturing process, wherein the component is constructed from at least a first material 12 and a second material 14 that is different from the first material 12.

[0073] For this purpose, the device 10 comprises a carrier 16 for building up the component and a first discharge device 18 for discharging the first material 12 and for arranging the first material 12 on the carrier 16.

[0074] The device 10 further comprises means for discharging the second material 14.

[0075] In the design according to Figure 1 It is provided that the device 10 has a second discharge device 20 for discharging the second material 14 onto the discharged first material 12. The second discharge device 20 is according to Figure 1arranged directly on the first discharge device 18, so that the first discharge device 18 and the second discharge device 20 can form a common component. Depending on the materials 12, 14 used and the process parameters, it may be possible for the second material 14 to be introduced into the first material 12, at least partially displacing it. However, it is equally possible for the first material 12 to retain its shape and dimension, and for the second material 14 to be applied completely to the first material 12.

[0076] Figure 4 shows a Figure 1 corresponding embodiment of the device 10, in which, however, the first discharge device 18 and the second discharge device 20 are interchanged, so that the first material 12 is applied to the previously applied second material 14 or, under certain circumstances, is partially introduced into it.

[0077] In the design according to Figure 2 It is again provided that the device 10 has a second discharge device 20 for discharging the second material 14 into the discharged first material 12. The second discharge device 20 is according to Figure 2 however, formed separately from the first discharge device 18, but arranged adjacent thereto, so that the first material 12 and the second material 14 are at least partially applied to the support surface such that the second material 14 is at least partially in contact with the first material 12 when the first material 12 has a temperature which is in a range of ≥ 100°C.

[0078] In the design according to Figure 3It is provided that the device 10 has a mixing port 22 through which the second material 14 can be introduced into the first material 12 or positioned next to the first material 12 before the first material 12 is discharged onto the carrier 16 by the first discharge device 18. More specifically, it is provided that the mixing port 22 is provided on the first discharge device 18. This allows the first material 12 and the second material 14 to be applied together to the carrier 16.

[0079] In the Figure 5 A further embodiment of the device 10 is shown. In the embodiment of the Figure 5A contactless nozzle unit 24 is shown as the second discharge device 20, such as a jet valve or a droplet generator. The contactless nozzle unit 24 is surrounded by cooling elements 26 in order to cool the second material, for example, to prevent the second material from hardening before being applied to the carrier 16. It should be noted that cooling elements 26 or a cooling unit can in principle be provided on any second discharge device 20. By means of such a second discharge device 20 according to Figure 5The second material 14, for example in the form of droplets, such as ink droplets, can be introduced into the still-formable first material 12 or a boundary layer thereof, for example, into liquid filament as the first material 12, or applied to it. Because the first material 12 still has a high temperature, this heat is utilized to carry out the sintering process of the second material 14.

[0080] With such a device 10, a method with the following steps can be carried out. a) Layer-by-layer construction of the component by locally applying the first material 12 and the second material 14 to a support surface, in particular and at least partially to the carrier; wherein b) the layer-by-layer construction of the component is carried out by locally applying the first material 12 and the second material 14 to a support surface corresponding to the geometry of the component to be produced, wherein c) the first material 12 and the second material 14 are at least partially applied to the support surface in such a way that the second material is at least partially in contact with the first material 12 when the first material 12 has a temperature which is in a range of ≥ 100°C.

[0081] The process or device can in principle be controlled by a control unit based on data concerning the geometry of the component to be manufactured.

[0082] For example, the procedure can proceed as follows.

[0083] Filament or granulate as the first material 12 is heated and pressed through a filament nozzle as the first discharge device 18 and then the support surface or the carrier 16 is applied layer by layer in the hot state.

[0084] The second dispensing device 20 can be a needle for contact application or a nozzle for contactless application of the second material 14, such as a conductive ink or ink droplets, into the still-hot and thus malleable filament of the first material 12. In both cases, the nozzle or needle is located very close to the filament nozzle. During contactless application, the ink droplets are "shot" into the still-liquid filament. Because the filament is still very hot, this heat is utilized to carry out the sintering process in the ink.

[0085] The combined printing process can be either horizontal or three-dimensional. Due to the almost simultaneous process of filament printing and ink printing, the ink is sintered using the remaining heat from the heated 3D material. Example:

[0086] In the following, an embodiment in the design according to Figure 4 shown.

[0087] The setup for implementing the process includes a commercially available FDM printer as its main component. The FDM printer is equipped with a standardized 0.8 mm diameter nozzle as the first dispensing device for the first material 12.

[0088] Connected to this is the second dispensing device 20 for the second material 14, in the form of a straight dispensing needle with a needle diameter of 0.5 mm. The dispensing needle is positioned congruently with the nozzle at an offset of 3 mm in the printing direction, with an additional height difference of 0.3 mm. For alignment, the dispensing needle connection has two translational degrees of freedom and one rotational degree of freedom.

[0089] To cool the dispensing needle, the setup also features a cooling unit, which is also connected to the FDM printer with two translational and one rotational degrees of freedom perpendicular to the dispensing needle. The cooling function of the cooling unit is based on the targeted addition of compressed air, which is again achieved through a flat jet nozzle.

[0090] To carry out the process, after starting in the printing direction, the second material 14 is first applied to the carrier 16 via the dispensing needle using a pressure feed of 1.5 bar. The travel speed in the printing direction is 0.5 mm / s. The second material 14 consists of a conductive silver adhesive with an average particle diameter of 0.05 mm and a sintering time of 2 s at 175 °C under ideal conditions.

[0091] Parallel to the application of the second material 14, the first material 12 is applied to the second material 14 via the nozzle at a height difference of 0.3 mm. The second material 12 consists of a commercially available filament (PLA) with a melting range between 160-190 °C. The nozzle has a temperature of 210 °C during the printing process, and the travel speed in the printing direction is also 0.5 mm / s.

[0092] As a result, the first material 12 is applied to the second material 14 and an investigation has shown that sintering of the second material 14 or the silver conductive adhesive has occurred during this process.

[0093] According to the manufacturer's specifications, the conductive silver adhesive has an electrical conductivity of 1xE6 S / m under ideal conditions and using an optimal sintering process. With the process described here, the electrical conductivity of the conductive silver adhesive is only a factor of > 2-3 lower than the manufacturer's specification, taking into account the challenging conditions of the sintering process, which nevertheless demonstrates the success of the sintering step. Reference symbol

[0094] 10Device 12First material 14Second material 16Carrier 18First discharge device 20Second discharge device 22Mixing connection 24Contactless dosing unit 26Cooling element

Claims

1. Method for producing a component by means of an additive manufacturing method, wherein the component is built up from at least a first material (12) and a second material (14) which differs from the first material (12), wherein the method comprises the following steps: a) building up the component layer by layer by applying the first material (12) and the second material (14) to a support surface in a locally confined manner; wherein b) the layer-by-layer build-up of the component is effected by applying the first material (12) and the second material (14) to a support surface in a locally confined manner according to the geometry of the component to be produced; wherein c) the first material (12) and the second material (14) are at least partly applied to the support surface in such a way that the second material (14) is at least partly in contact with the first material (12) when the first material (12) has a temperature which lies in a range of ≥ 100°C, wherein the second material (14) is a material to be sintered and in that the first material (12) and the second material (14) are at least partly applied to the support surface in such a way that the second material (14) is at least partly in contact with the first material (12) when the first material (12) still has a temperature which is above the sintering temperature of the material to be sintered.

2. Method according to Claim 1, characterized in that the second material (14) comes into contact with the first material (12), which is present at a temperature of ≥ 100°C, before the first material (12) is applied to the support surface, such that the first material (12) and the second material (14) are jointly applied to the support surface in one step.

3. Method according to either of Claims 1 and 2, characterized in that the second material (14) comes into contact with the first material (12), which is present at a temperature of ≥ 100°C, after the first material (12) has been applied to the support surface or when the first material is applied to the support surface.

4. Method according to one of Claims 1 to 3, characterized in that at least one surface structure of the component is generated with the second material (14).

5. Method according to one of Claims 1 to 4, characterized in that an inner structure of the component is generated with the second material (14).

6. Method according to one of Claims 1 to 5, characterized in that the first material (12) is not electrically conductive, and in that the second material (14) is electrically conductive.

7. Method according to Claim 6, characterized in that the second material (14) is a conductive ink.

8. Method according to one of Claims 1 to 7, characterized in that the first material (12) and the second material (14) differ in terms of at least one property selected from the group consisting of: electrical conductivity; thermal conductivity; magnetic properties; mechanical properties; surface-changing properties; tribological properties; aesthetic properties; particle-containing properties; optical properties.

9. Method according to one of Claims 1 to 8, characterized in that the first material (12) is selected from the group consisting of metals, plastics, ceramics, graphite or carbon materials.

10. Use of a method according to one of Claims 1 to 9 for producing an electrically non-conductive component having an electrically conductive structure.