HEAT STORAGE DEVICE

Description

State of the art

[0001] The invention relates to a heat storage device with a metallic phase change material as the storage material.

[0002] The use of thermal energy storage systems based on metallic phase-change materials is known from the literature. These are predominantly used in solar thermal power plants. Further applications include storage heaters for building heating, conventional steam power plants (coal-fired power plants, nuclear power plants), catalytic converters for internal combustion engine vehicles, thermoelectric generators in internal combustion engine vehicles, and heat recovery in steel production. Typically, the concepts presented in the literature involve experimental setups on a laboratory scale. Applications in vehicles, particularly battery-electric buses and cars, have also been described.

[0003] From EP 3 002 528 A1, a heat storage device and a method for operating a heat storage device are known, which has the features of the preamble of claim 1. The heat storage device comprises an enclosure containing a metallic heat storage medium, a heat exchanger, and an electric heating element. During operation, the electric heating element heats the heat storage medium. Receiving tubes are arranged within the enclosure and surrounded by the heat storage medium. The electric heating element is located inside these receiving tubes. The heat exchanger comprises tubes through which a heat transfer fluid flows, absorbing heat from the heat storage medium. The heat exchanger is arranged on the underside of the enclosure. Additionally, the heat exchanger can be arranged laterally on the enclosure.

[0004] From WO 2011 031 894 A2, a thermal storage device with a metallic storage medium is known. The thermal storage device comprises an enclosure in which a metallic thermal storage medium is arranged. First end sections of metal rods project into the enclosure. The second end sections of the metal rods project out of the enclosure. The end section projecting out of the enclosure extends into a channel in which a fluid flows, so that the fluid is thermally coupled to the storage medium in the enclosure via the metal rods. First metal rods project into a channel containing a heated fluid. Second metal rods project into a channel containing a cool fluid. Thus, the first metal rods transfer thermal energy into the storage medium, and the second metal rods transfer thermal energy out of the storage medium.

[0005] From WO 2012 123853 A1, a thermal storage device for storing thermal energy at elevated temperatures is known. The device comprises an enclosure for holding a thermal metallic storage medium; primary heat transfer surfaces for transferring heat from a circulating heat transfer fluid; and secondary heat transfer surfaces for transferring heat from the thermal storage medium to steam pipes. The thermal storage medium is arranged between the primary and secondary heat transfer surfaces.

[0006] From US Patent 2011 / 083436 A1, a device is known which comprises a safety container, a heat absorption area, and a heat transfer area. Heat can be introduced into the safety container via the base of the container through the heat transfer areas. Heat can be dissipated from the safety container via the heat absorption areas located inside the container. Alternatively, the heat transfer and heat absorption areas can be arranged inside the safety container. Disclosure of the invention

[0007] The object of the invention is to provide a heat storage device with a metallic phase change material as storage material, which enables effective heat storage with effective heat input and effective heat output.

[0008] The problem is solved by the features of the independent claim. Favorable embodiments and advantages of the invention become apparent from the further claims, the description, and the drawing.

[0009] A heat storage device with a metallic phase change material as storage material is proposed, comprising at least one receiving chamber with a receiving space for the storage material and an enclosure for the receiving space, at least one heat input device for inputting heat into the at least one receiving chamber, and at least one heat discharge device for discharged heat from the at least one receiving chamber.

[0010] According to the invention, a coupling area of ​​the heat input device provided for thermal coupling with the storage material and / or a coupling area of ​​the heat discharge device provided for thermal coupling with the storage material is arranged at least partially spaced apart from the storage material.

[0011] Furthermore, the coupling area of ​​the heat input device and the coupling area of ​​the heat output device are arranged outside the receiving space on a floor of the enclosure, wherein the coupling area of ​​the heat input device and / or the heat output device is thermally coupled to the storage material via at least one thermal bridge element, wherein the enclosure has the at least one thermal bridge element.

[0012] Alternatively, the coupling area of ​​the heat input device and the heat output device are arranged in a housing, wherein the housing is arranged at least partially within the receiving chamber and / or the receiving space.

[0013] The heat storage device according to the invention enables high-temperature heat storage. In particular, heat storage with the metallic phase change material, also known as mPCM, occurs via latent heat and sensible heat. During the phase transition, the metallic phase change material can absorb thermal energy in the solid phase without a temperature change until it is completely melted, or release thermal energy in the liquid phase until it is completely solidified.

[0014] The metallic phase change material allows heat, and in particular latent and sensible heat, to be stored for extended periods. Specifically, heat can be stored at a high temperature level, for example, at least 100°C, preferably at least 500°C, and particularly at approximately 600°C to 650°C. Depending on the type of metallic phase change material (mPCM), heat can be stored at temperatures up to 1500°C. For example, pure silicon with a phase change temperature of 1414°C or SiB3 with a phase change temperature of 1385°C can be used.

[0015] Depending on the thermal loading state, the metallic phase change material exists in either a liquid or solid state. A suitable phase change material is, for example, AlSi 12 .

[0016] For example, if AlSi 12 is used as a metallic phase change material in the temperature range of 25°C to 600°C, it has an energy density of approximately 300 Wh / kg or approximately 795 Wh / I.

[0017] Typical metallic phase change materials mentioned in the literature have high mass fractions of the elements aluminum, magnesium, or zinc. A typical characteristic of phase change materials in general, and thus also of metallic phase change materials, is the change in volume during the phase change. Furthermore, metallic phase change materials with high proportions of aluminum, magnesium, or zinc have relatively high coefficients of thermal expansion on the order of approximately 20 to 30 × 10⁻⁶ < 1 / K, especially compared to other materials typically used in the construction of heat storage devices, for example, for enclosures or electric heaters, such as stainless steels, graphite, or ceramics.

[0018] During the charging of a thermal storage system based on metallic phase-change materials, the temperature of the storage material initially rises, and then, upon reaching its melting point, the storage material melts. During heating, the storage material, which is in its solid phase, expands; during the melting process, it expands across the phase change. During discharge, these processes occur in reverse order: volume decreases during the phase change, and contraction occurs during the cooling process.

[0019] Due to the volume change during the phase transition, voids (material defects with negative pressure or vacuum) can form, particularly in the areas of the thermal storage material that solidify last. Pores (material defects with gas inclusions) can also preferentially occur in these areas.

[0020] During cooling, the storage material typically shrinks more than other components such as electric heaters or the enclosure. This is due to the high coefficient of thermal expansion of the storage materials.

[0021] Both effects can lead to a detrimental change in the thermal contact between the storage material and the heat input or heat output device. Besides impacting performance, this can also negatively affect the service life of components, particularly when using electric resistance heaters. These effects can occur if the physical principles underlying the formation of material defects are not considered in the component arrangement.

[0022] In a favorable design, the arrangement of the heat input and heat output devices can be chosen to ensure thermal contact between the heat input device and the storage material, as well as between the heat output device and the storage material, such that, during normal use of the heat storage device, the formation of voids and / or pores occurs away from the heat input and heat output devices in the areas of the storage material that solidify last. This can make adverse changes to the thermal contact between the storage material and the heat input or heat output devices more difficult or even impossible. This can positively influence the service life of the components.

[0023] Compared to the prior art, the heat storage device according to the invention has a favorable arrangement of the heat input device and the heat output device, so that voids do not form on the heat input device, in particular not on the coupling area, and on the heat output device, in particular not on the coupling area.

[0024] Advantageously, the arrangement of the heat input device and heat output device can be chosen in such a way that gravity has a positive influence on the formation of cavities and pores.

[0025] In a favorable design, ensuring thermal contact between the heat input device or heat output device and the storage material can be advantageously achieved through a clever arrangement of these components relative to each other within the storage system, particularly within the storage material itself. This takes into account the solidification of the storage material caused by the heat output device, in conjunction with the associated reduction in volume, as well as the resulting effects due to the different coefficients of thermal expansion of the components used. Furthermore, the influence of internal components within the storage material on the effective thermal conductivity within the heat storage device and the associated impact on the solidification of the storage material is considered.

[0026] Furthermore, the arrangement of the heat input device and heat output device can be chosen in such a way that, due to the thermal expansion coefficients between the storage material and the heat input device or heat output device, the thermal contact between them is further improved.

[0027] Advantageously, the phase change material can have a larger coefficient of thermal expansion than the material of the enclosure.

[0028] In a favorable design, the housing for the storage material can be made of fiber-reinforced ceramic material. In particular, the housing can be made of a fiber-reinforced non-oxide ceramic material. This fiber-reinforced non-oxide ceramic material can be made, in particular, of carbon fiber-reinforced carbon and / or carbon fiber-reinforced silicon carbide and / or silicon carbide fiber-reinforced carbon and / or silicon carbide fiber-reinforced silicon carbide (SiC). Such a material exhibits a very low coefficient of thermal expansion. Thin walls can be achieved through fiber reinforcement.

[0029] Other possible housing materials are ceramics, for example aluminum oxide, zirconium oxide, boron nitride, silicon oxide, aluminum nitride, silicon carbide, boron carbide, and the like, and / or such a ceramic as a functional layer on, for example, a metallic substrate, and / or graphite or graphite as a functional layer, and / or surface-treated metals such as boronized stainless steel, and / or temperature-treated stainless steel, and / or composite materials such as fiber-reinforced ceramic with a ceramic fiber such as C or Al 2 O 3, and / or particle-reinforced ceramic, such as WC.

[0030] This allows for a simple reduction in the coefficient of thermal expansion compared to the metallic phase change material. The enclosure can advantageously be constructed using lightweight materials. Fiber reinforcement enables the creation of particularly thin enclosure walls.

[0031] A suitable enclosure can thus be used advantageously for the storage of materials if repeated heating of the stored material at high heating rates and cooling at high cooling rates are required.

[0032] Suitable enclosure materials offer high thermal shock resistance, high oxidation resistance, high mechanical stability, and especially high corrosion resistance. This allows for long-term stable enclosure of phase-change materials, which are at least temporarily molten metals.

[0033] By enclosing the molten metal with a suitable wall material, it is possible to keep it stable over the long term.

[0034] This results in high corrosion resistance. Therefore, the enclosure can be used in conjunction with molten metals whose temperature can be in the range of, for example, up to approximately 600°C or 650°C or even up to 1500°C.

[0035] In principle, the molten metal contained within the enclosure can remain in a liquid state continuously, or it can remain in a liquid state only temporarily. For example, the enclosure might contain a metallic phase-change material that is in a liquid state during thermal charging and in a solid state after thermal discharge. It can then, for example, store both latent and sensible heat.

[0036] It is advantageous if the wall thickness of a wall section made of fiber-reinforced SiC material in the housing is at least 1 mm, particularly at least 2 mm, and especially at least 2.5 mm, and is, for example, approximately 3 mm. Preferably, the wall thickness is at most 5 mm. This allows for a mechanically stable wall with high thermal shock resistance. Furthermore, the wall thickness can be kept relatively small, enabling the container to be designed with a low weight.

[0037] The enclosure can be encased in suitable thermal insulation. This insulation can, for example, consist of pyrogenic silicon dioxide. Other materials, such as mineral wool, calcium silicate, ceramic fiber (e.g., calcium magnesium silicates), mica, or vacuum insulation, can also be used to advantage. Other materials that have higher thermal conductivity but are less expensive can also be used as an option.

[0038] In a favorable embodiment, the coupling area of ​​the heat input device and / or the heat output device can be arranged at least partially outside the receiving space. In particular, the coupling area of ​​the heat input device and / or the heat output device can be arranged at least partially outside the receiving chamber.

[0039] In a favorable embodiment, the coupling area of ​​the heat input device and the coupling area of ​​the heat output device can be arranged outside the receiving space on a floor of the enclosure. The coupling area of ​​the heat input device and / or the heat output device can be thermally coupled to the storage material via at least one thermal bridge element, wherein the enclosure incorporates the at least one thermal bridge element, in particular wherein the at least one thermal bridge element is arranged on or integrated into a floor slab of the enclosure, or the floor slab itself constitutes the thermal bridge element.

[0040] In this embodiment, both the heat input device, in particular its coupling area, and the heat output device, in particular its coupling area, can be located in the base surface of the heat storage device, in particular the receiving chamber of the heat storage device.

[0041] In this way, the heat input and heat output systems can be integrated directly into structural elements of the enclosure, such as the base plate. The components are thus not placed directly into the storage chamber. Because the heat output system is mounted on the floor, the solidification process during cooling begins at the floor surface. Gravity also promotes solidification towards the floor surface. Since the heat input system is also mounted on the floor surface, it is in good thermal contact with the storage material.

[0042] This allows the heat input device, particularly its coupling area, and the heat output device, particularly its coupling area, to be indirectly connected. The two components are not in direct material contact, but only in indirect thermal contact with the storage material via the thermal bridge element. This prevents undesirable chemical reactions, such as corrosion, from occurring between the heat input device and / or the heat output device and the storage material.

[0043] In a favorable embodiment, the coupling area of ​​the heat input device and / or the heat output device can be arranged at least partially within the receiving space. In particular, the coupling area of ​​the heat input device and / or the heat output device can be arranged at least partially within the receiving chamber.

[0044] In an alternative embodiment not included here, the coupling area of ​​the heat input device can be arranged outside the receiving space on the floor of the enclosure, and the coupling area of ​​the heat output device can be arranged at least partially within the receiving space, in particular at least partially within the receiving chamber. Alternatively, the coupling area of ​​the heat output device can be arranged outside the receiving space on the floor of the enclosure, and the coupling area of ​​the heat input device can be arranged at least partially within the receiving space, in particular at least partially within the receiving chamber. In this case, the coupling area of ​​the heat input device and / or the heat output device can be thermally coupled to the storage material via at least one thermal bridge element.

[0045] For example, the heat input device can be located within the storage material, and the heat output device at the base of the heat storage device, particularly the receiving chamber. By placing the heat output device at the base, the solidification process during cooling begins at the base. Furthermore, gravity also promotes solidification towards the base. Advantageously, the heat input device can be positioned within the storage material largely perpendicular to the heat output device.

[0046] This allows it to be advantageously arranged parallel to the direction of heat dissipation and thus parallel to the solidification direction. The direction of solidification is particularly crucial, as it in turn depends on the heat dissipation direction and therefore also on the heat dissipation device. This prevents the formation of material defects on the side of the heat input device facing away from the heat dissipation device.

[0047] In another alternative embodiment not shown here, the heat input and heat output devices can also be arranged in reverse order. This also achieves favorable effects on the solidification of the storage material. By placing the heat output device within the storage material, the solidification process begins from within it. The direction of gravity promotes contact with the base surface.

[0048] In a favorable embodiment, the coupling area of ​​the heat input device and / or heat output device can be thermally coupled to the storage material via at least one thermal bridge element. In this embodiment, the heat input device and the heat output device can be indirectly connected. The two components are not in direct material contact, but only in indirect thermal contact with the storage material via the thermal bridge element. This prevents undesirable chemical reactions between the heat input device and / or heat output device and the storage material, such as corrosion.

[0049] In a favorable design, the enclosure can incorporate at least one thermal bridge element. In particular, this thermal bridge element can be located on an outer shell of the enclosure, especially on a base plate, or integrated into the base plate. In this way, the heat input and heat output devices can be directly integrated into structural elements of the enclosure, such as the base plate.

[0050] According to an alternative embodiment, the coupling area of ​​the heat input device and the coupling area of ​​the heat output device can be arranged at least partially within the receiving space, in particular at least partially within the receiving chamber. The coupling area of ​​the heat input device and / or the heat output device can be thermally coupled to the storage material via at least one thermal bridge element, wherein the at least one thermal bridge element can be arranged in the receiving space.

[0051] In one embodiment, the heat input device and the heat output device can be indirectly connected. The two components are not in direct material contact, but only in indirect thermal contact with the storage material via the thermal bridge element. This prevents undesirable chemical reactions, such as corrosion, from occurring between the heat input device and / or the heat output device and the storage material.

[0052] In a favorable embodiment, at least one thermal bridge element can be arranged in the receiving space. The thermal bridge element can advantageously facilitate the supply of heat to or the release of heat from the metallic phase change material, thus ensuring stable thermal conditions. The thermal bridge element can, for example, have thermally conductive fins that project into the phase change material.

[0053] In this embodiment, the heat input and heat output devices are not directly integrated into the storage material, but rather into a housing acting as a thermal bridge element, which in turn is integrated into the storage material. Therefore, the heat input and heat output devices themselves do not need to be material-compatible with the storage material. Only the housing needs to be compatible with the storage material.

[0054] By integrating the heat input and heat output devices into the same housing, the storage material around the housing always solidifies. This ensures good thermal contact between the heat input and heat output devices and the storage material.

[0055] According to a favorable embodiment, the storage material can comprise a metallic alloy with one or more of the components aluminium, silicon, copper, magnesium, zinc, germanium, in particular an AISi alloy, preferably AlSi12.

[0056] Advantageously, the phase change material can comprise a metallic or semi-metallic alloy with one or more of the constituents aluminum, silicon, copper, magnesium, boron, zinc, in particular an AlSi alloy, preferably AlSi 12. Favorable alloys are eutectic alloys and intermetallic compounds, for example various silicides, in which the phase change takes place with the absorption or release of latent heat.

[0057] Binary alloys or ternary alloys and alloy systems with more than three components, with a eutectic composition or an intermetallic composition with at least one of the above-mentioned components Al, Si, Cu, Mg, B, Zn are particularly advantageous.

[0058] In a favorable design, the heat input device can include at least one heating element. In particular, the heating element can be an electric resistance heater or an inductive heater. Alternatively, the heat input device can be coupled to a heating element. This allows for simple thermal charging. For example, no heat transfer medium needs to flow through the receiving chamber for heat input. Thermal charging can be achieved, for instance, by electrically supplying power to the heating element. The heat from the heat storage device can then be used directly in an application, for example, for heating purposes.

[0059] In a favorable design, the heat dissipation device can be permeated by a heat transfer medium. In particular, the heat dissipation device can comprise or be connected to at least one pipe through which a heat transfer medium flows. The pipe's cross-section can be round, rectangular, or square. A circular cross-section results in a high degree of symmetry, while a rectangular cross-section provides a large surface area. The pipe can also be designed as a hollow, flat element. The heat transfer medium can thus be transported to a heat exchanger, where it can release the transported heat in a suitable manner. The heat storage device can then be discharged. This heat can then be used at a location spaced apart from the receiving chamber.

[0060] In a favorable design, the coupling area of ​​the heat input device can be located on the side of the coupling area of ​​the heat output device facing away from the enclosure. Alternatively, the coupling area of ​​the heat output device can also be located on the side of the coupling area of ​​the heat input device facing away from the enclosure. For example, the heat input device can be located directly on the base plate of the enclosure, while the heat output device is located on the heat input device. During discharge, the heat is then transported from the heat input device to the heat output device.

[0061] In favorable embodiments, the heat input device can have at least one element with the coupling area, with at least one of the following embodiments: The coupling area can substantially comprise the entire length of the element within the receiving space and / or the entire circumference of the element within the receiving space; the coupling area can extend over at least 50%, and in particular at least 60%, of the total height of the receiving space; the element or the coupling area of ​​the element can be spaced apart from the enclosure. In particular, one end of the element can be spaced apart from a lid and / or bottom of the enclosure; the element or the coupling area of ​​the element can be aligned parallel to an element of the heat dissipation device; the element or the coupling area of ​​the element can be aligned parallel to a vertical axis or axis of symmetry of the receiving space; the element or the coupling area of ​​the element can be arranged centrally within the receiving space and in particular be located on an axis of symmetry of the receiving space.

[0062] The heat input device can thus be formed from individual elements which introduce heat into the storage material in a favorable manner.

[0063] The at least one element allows heat to be directly coupled into the storage material. For example, a phase transition from solid to liquid can be achieved. Latent and sensible heat can then be stored in the storage material.

[0064] By extending over essentially the entire length / circumference and / or surface area, effective heat input into the storage material is achieved. Electric heaters often have dead zones at the beginning and / or end. Due to such design-related dead zones, it is not possible to heat the entire length, but only a significant portion of it.

[0065] In particular, the at least one element is arranged so that it is surrounded by storage material and, for example, also located between one end and a lid and / or base (primarily liquid) storage material. This allows heat to be effectively coupled into the storage material, resulting in effective thermal charging of the heat storage device. Solid storage material occupies a smaller volume than liquid storage material. The spacing from the lid and / or base ensures that the at least one element does not protrude beyond the storage material, even in its solid state. This reduces the risk of the at least one element overheating.

[0066] In a favorable embodiment, the at least one element can be arranged obliquely, in particular perpendicularly, to an orientation of the at least one heat discharge device, and / or parallel to a direction of gravity in the intended operating state. Furthermore, the at least one element can be arranged parallel to an orientation of the at least one heat discharge device. In this way, favorable melting processes of the storage material as well as advantageous solidification processes during heat discharge can be achieved. In addition, gravity promotes solidification towards the bottom surface. The heat input device can advantageously be installed within the storage material largely perpendicular to the heat discharge device. This prevents the formation of material defects on the side of the heat input device facing away from the heat discharge device.

[0067] According to a favorable design, the heat discharge device can have at least one element with the coupling area, with at least one of the following configurations: The coupling area can substantially comprise the entire length of the element within the receiving space and / or the entire circumference of the element within the receiving space; the coupling area can extend over at least 50%, and in particular at least 60%, of the total height of the receiving space; the element or the coupling area of ​​the element can be spaced apart from the enclosure. In particular, one end of the element can be spaced apart from a lid and / or bottom of the enclosure; the element or the coupling area of ​​the element can be aligned parallel to an element of the heat input device; the element or the coupling area of ​​the element can be aligned parallel to a vertical axis or axis of symmetry of the receiving space; the element or the coupling area of ​​the element can be arranged centrally within the receiving space and in particular be located on an axis of symmetry of the receiving space.

[0068] The heat dissipation device can thus be formed from individual elements which can efficiently remove heat from the storage material.

[0069] With a favorable design, at least one element can be designed as a tube.

[0070] In this embodiment, the heat dissipation device can be located within the storage material and the heat input device on the base surface of the heat storage device, in particular the receiving chamber of the heat storage device. By placing the heat dissipation device within the storage material, the solidification process proceeds from this material into the surrounding storage material. The direction of gravity favors contact with the base surface.

[0071] In a favorable embodiment, at least one element can be arranged centrally in the receiving space and, in particular, along an axis of symmetry of the receiving space. In this way, favorable melting processes of the storage material as well as advantageous solidification processes during heat dissipation can be achieved.

[0072] In a favorable embodiment, the heat input device in the receiving space can surround the heat output device with at least one section, in particular concentrically and / or completely. Specifically, the heat input device can be in thermal and / or mechanical contact with the heat output device in the receiving space. This prevents the formation of material defects on the side of the heat input device facing away from the heat output device. The heat output device can then also be heated directly via the heat input device.

[0073] In a favorable embodiment, the heat input device can be at least partially spaced apart from the heat output device within the receiving chamber, with storage material arranged between the heat input device and the heat output device. In this way, favorable melting processes of the storage material as well as advantageous solidification processes during heat discharge can be achieved. Effective thermal charging can thus be achieved; in particular, thermal resistance can be relatively low.

[0074] In a favorable embodiment, the coupling area of ​​the heat input device and / or heat output device can be arranged in a housing. In particular, the housing can be located at least partially within the receiving chamber and / or the receiving space.

[0075] In this embodiment, the heat input device and / or heat output device are not directly integrated into the storage material, but rather into a housing that is itself integrated into the storage material. This eliminates the need for the heat input device and / or heat output device themselves to be made of a material compatible with the storage material.

[0076] Only the housing needs to be compatible with the storage material. By integrating the heat input and / or heat output devices into the same housing, the storage material can solidify around the housing. This ensures good thermal contact between the heat input and heat output devices and the storage material.

[0077] In a favorable embodiment, a central element, in particular a central tube, of the heat dissipation device can be arranged in the housing, and elements of the heat input device can be arranged at a distance from this element. In particular, the elements of the heat input device can be arranged in a mirror-symmetrical or rotationally symmetrical manner with respect to the element.

[0078] In this way, favorable melting processes of the storage material as well as advantageous solidification processes during heat dissipation can be achieved.

[0079] In a favorable embodiment, a heat input element can be centrally arranged within the housing, and a plurality of heat output elements, particularly pipes, can be positioned at a distance from this element. In particular, the heat output elements can be arranged in a mirror-symmetrical or rotationally symmetrical manner relative to the heat input element. This also allows for favorable influence on the melting processes of the storage material as well as the solidification processes during heat dissipation. drawing

[0080] Further advantages become apparent from the following description of the drawings. The drawings illustrate exemplary embodiments of the invention. The drawings, the description, and the claims contain numerous features in combination. A person skilled in the art will expediently consider the features individually and combine them into meaningful further combinations. They show, for example:

[0081] Fig. 1 in an isometric view of a heat storage device with a planar heat input device and a planar heat discharge device according to an embodiment of the invention; Fig. 2 in an isometric view of a heat storage device with a planar heat input device and a planar heat discharge device according to a further embodiment of the invention; Fig. 3 in an isometric view of a heat storage device with a planar heat input device and a planar heat discharge device according to a further embodiment of the invention; Fig. 4 in a detailed sectional view of a heat storage device according to an embodiment of the invention; Fig.Fig. 5 in an isometric view, a heat storage device with a cylindrical heat input device and a planar heat discharge device according to a further embodiment of the invention; Fig. 6 in a sectional view, a heat storage device with a cylindrical heat input device and a planar heat discharge device according to a further embodiment of the invention; Fig. 7 in a sectional view, a heat storage device with a cylindrical heat input device and a planar heat discharge device according to a further embodiment of the invention; Fig. 8 in an isometric view, a heat storage device with a cylindrical heat input device and a cylindrical heat discharge device according to a further embodiment of the invention; Fig.Fig. 9 in a sectional view of a heat storage device with a cylindrical heat input device and a cylindrical heat output device according to a further embodiment of the invention; Fig. 10 in a sectional view of a heat storage device with a cylindrical heat input device and a cylindrical heat output device according to a further embodiment of the invention; Fig. 11 in an isometric view of a heat storage device with a planar heat input device and a planar heat output device according to a further embodiment of the invention; Fig. 12 in a sectional view of the heat storage device according to . Figure 11; Fig. 13 in an isometric view of an unincluded heat storage device with a planar heat discharge device in the base plate and a planar heat input device in the receiving chamber; Fig. 14 in a sectional view of the unincluded heat storage device according to Figure 13 Fig. 15 in an isometric view of an unincluded heat storage device with a heat discharge device extending over a surface in the base plate and a heat input device extending over a surface in the receiving chamber; Fig. 16 in a sectional view of the unincluded heat storage device according to Figure 15 ; Fig. 17 in an isometric view of an unincluded heat storage device with a planar heat dissipation device in the base plate and a cylindrical heat input device in the receiving chamber; Fig. 18 in a sectional view of the unincluded heat storage device according to Figure 17Fig. 19 in an isometric view of an unincluded heat storage device with a cylindrical heat discharge device in the base plate and a planar heat input device in the receiving space; Fig. 20 in a sectional view of the unincluded heat storage device according to Figure 19 Fig. 21 in an isometric view of an unincluded heat storage device with a cylindrical heat discharge device in the base plate and a planar heat input device in the receiving space; Fig. 22 in a sectional view of the unincluded heat storage device according to Figure 21 Fig. 23 in an isometric view of an unincluded heat storage device with a cylindrical heat discharge device in the base plate and a planar heat input device in the receiving space; Fig. 24 in a sectional view of the unincluded heat storage device according to Figure 23; Fig. 25 in an isometric view of an unincluded heat storage device with a planar heat input device in the base plate and a cylindrical heat discharge device in the receiving chamber; Fig. 26 in a sectional view of the unincluded heat storage device according to Figure 25 ; Fig. 27 in an isometric view of an unincluded heat storage device with a planar heat input device in the base plate and a cuboid heat discharge device in the receiving chamber; Fig. 28 in a sectional view of the unincluded heat storage device according to Figure 27 ; Fig. 29 in an isometric view of an unincluded heat storage device with a planar heat input device in the base plate and a cylindrical heat discharge device in the receiving chamber; Fig. 30 in a sectional view of the unincluded heat storage device according to Figure 29; Fig. 31 in an isometric view of an unincluded heat storage device with a planar heat input device in the base plate and a cuboid heat discharge device in the receiving chamber; Fig. 32 in a sectional view of the unincluded heat storage device according to Figure 31Fig. 33 in an isometric view of a heat storage device with a cylindrical heat input device and a cylindrical heat output device in a housing in the receiving space according to a further embodiment of the invention; Fig. 34 in a top view of a heat storage device with a linearly arranged heat input device and a heat output device in a housing according to a further embodiment of the invention; Fig. 35 in a top view of a heat storage device with a cross-shaped heat input device and a heat output device in a housing according to a further embodiment of the invention; Fig. 36 in a top view of a heat storage device with a coaxially arranged heat input device and a heat output device in a housing according to a further embodiment of the invention; Fig.Fig. 37 shows a heat storage device with a linearly arranged heat input device and heat output device in a housing according to a further embodiment of the invention; Fig. 38 shows a heat storage device with a linearly arranged heat input device and heat output device in a housing according to a further embodiment of the invention; Fig. 39 shows a heat storage device with a linearly arranged heat input device and heat output device in a housing according to a further embodiment of the invention. Embodiments of the invention

[0082] In the figures, similar or equivalent components are numbered with the same reference symbols. The figures merely show examples and are not to be understood as limiting.

[0083] The directional terminology used below, including terms like "left," "right," "above," "below," "in front," "behind," "after," and the like, serves only to improve the understanding of the figures and is in no way intended to limit their generality. The components and elements depicted, their interpretation, and their use may vary according to the considerations of a person skilled in the art and be adapted to the specific applications.

[0084] The phase-change material used as storage material 10 in the various embodiments described in the figures has a phase-change temperature of at least 100°C, preferably at least 500°C. The storage material 10 can, for example, be an aluminum-silicon alloy, in particular AlSi 12. This material has a phase-change temperature of approximately 577°C, at which the material melts at a constant temperature when energy is supplied and solidifies when energy is removed.

[0085] In one embodiment, the housing 16 can be formed from a ceramic material, particularly a fiber-reinforced one, such as silicon carbide, or also aluminum oxide or graphite. However, other suitable materials are also conceivable. The wall thickness can be very thin, for example 1 mm, in particular at least 2 mm, and in particular at least 2.5 mm, and for example approximately 3 mm. Preferably, the wall thickness is at most 5 mm.

[0086] Preferably, the coefficient of thermal expansion of the metallic phase change material 10 is greater than that of the housing material 16.

[0087] In principle, the heat input device 30 and the heat output device 40 can each have one or more components for heat input or heat output.

[0088] A phase change of the storage material 10 resulting from heat input or heat output originates from at least one corresponding contact area 11 of the storage material 10. The contact area 11 is in contact with the coupling area 32 of the at least one heat input device 30 and / or the coupling area 42 of the at least one heat output device 40. Depending on the arrangement of the coupling areas 32 and 42, the contact areas 11, or the at least one contact area 11, can adjoin a base of the receiving chamber 12. In particular, the contact areas 11 of the storage material 10 are not located in a region of the storage material 10 that, according to its intended purpose, solidifies last during a phase change resulting from heat output. Therefore, the contact area 11 can be free of material defects.

[0089] In the Figures 1 to 3In an isometric representation, a heat storage device 100 with a planar heat input device 30 and a planar heat discharge device 40 are shown according to various embodiments of the invention.

[0090] The heat storage device 100 with a metallic phase-change material as storage material 10 comprises a receiving chamber 12 with a receiving space 14 for the storage material 10 and an enclosure 16 for the receiving space 14. The storage material 50 comprises a metallic alloy, for example with one or more of the components aluminium, silicon, copper, magnesium, zinc, germanium, in particular an AlSi alloy, preferably AlSi12.

[0091] The heat storage device 100 further comprises a heat input device 30 for inputting heat into the at least one receiving chamber 12, and a heat discharge device 40 for discharging heat from the one receiving chamber 12. A coupling area 32 of the heat input device 30 and a coupling area 42 of the heat discharge device 40, both provided for thermal coupling with the storage material 10, are arranged at least partially spaced away from the storage material 10.

[0092] The heat input device 30 has at least one heating device 34. In particular, the heating device 34 can have a resistance heater or inductive heater, or be coupled to one.

[0093] The heat dissipation device 40 can, for example, be permeated by a heat transfer medium. In particular, the heat dissipation device 40 can comprise or be connected to at least one pipe 52, through which a heat transfer medium 58 flows. The cross-section of the pipe 52 can, for example, be round, rectangular, or square. The pipe 52 can also be designed as a hollow flat element.

[0094] The coupling areas 32, 42 of the heat input device 30 and the heat output device 40 are arranged at least partially outside the receiving space 14, in particular at least partially outside the receiving chamber 12. This is achieved by thermally coupling the coupling areas 32, 42 of the heat input device 30 and the heat output device 40 to the storage material 10 via at least one thermal bridge element 70. Thus, the coupling areas 32, 42 are indirectly connected to the storage material 10, and not in direct material contact, but only indirectly in thermal contact with the metallic phase-change material. In these embodiments, the housing 16 has the at least one thermal bridge element 70. The thermal bridge element 70 can advantageously be arranged on an outer shell 18 of the housing 16. In the embodiments described in the Figures 1 to 3In the illustrated embodiments, the thermal bridge element 70 is integrated into, or is realized by, the base plate 20. The heat input device 30 and the heat output device 40 themselves are arranged at least partially outside the storage material 10.

[0095] In Figure 1 The individual elements 36 of the heat input device 30 and the individual elements 46 of the heat output device 40 are arranged next to each other in a strip shape with their longitudinal sides and point with their coupling areas 32, 42 to the storage material 10 in the receiving chamber 12.

[0096] In Figure 2 Two strip-shaped elements 36 of the heat input device 30 are arranged on the two longitudinal sides of a single element 46 of the heat discharge device 40.

[0097] In Figure 3is an element 46 of a heat discharge device 40 surrounded by elements 36 of the heat input device 30.

[0098] Figure 4 Figure 1 shows a detailed sectional view of a heat storage device 100 according to an embodiment of the invention, comprising a cylindrically designed heat input device 30 and a planar heat discharge device 40. Both components 30, 40 are arranged in the base plate 20, which acts as a thermal bridge element 70 to the storage material 10.

[0099] The coupling areas 32, 42 of heat input device 30 and heat output device 40 point towards the storage material 10 and the receiving chamber 12 respectively, but are separated from it by the material of the base plate 20.

[0100] The storage material 10 is arranged in the receiving chamber 14 of the receiving chamber 12. The receiving chamber 12 is surrounded by an enclosure 16. On one outer side, the enclosure 16 has thermal insulation 24 in order to keep the temperature of the storage material 10 constant for as long as possible.

[0101] The heat input device 30, which is integrated into the base plate 20 of the receiving chamber 12, has individual cylindrical elements 36 arranged parallel to one another and inserted into receiving bores in the base plate 20. The elements 36 can thus be configured as heating elements 34. For example, the heating elements 34 can be electric heating cartridges or be configured as such. Alternatively, the elements 36 can also be thermally coupled to heating elements.

[0102] The heat transfer device 40 is designed as an evaporator 54, in which the heat transfer medium 58 is evaporated and, as vapor, is conveyed through the pipe 52 to the condenser 56. The condenser 56 has coolant connections 60, 62 for a cooling medium, by means of which the vapor can be condensed again and then conveyed back to the evaporator as a liquid heat transfer medium 58.

[0103] In the Figures 5 to 7 Various embodiments of a heat storage device 100 with a cylindrical heat input device 30 and a planar heat discharge device 40 are shown. The heat input device 30 and the heat discharge device 40 are each integrated into the base plate 20, which acts as a thermal bridge element 70 for transferring heat to and from the storage material 10 in the receiving chamber 12.

[0104] In the exemplary embodiment in Figure 5Figure 100, which is shown in an isometric representation, depicts a heat storage device 100 with a cylindrical heat input device 30 and a planar heat discharge device 40. The heat discharge device 40 is arranged as a single element 46 in the base plate 20. Two cylindrical elements 36 of the heat input device 30 are spaced apart on both longitudinal sides of element 46 in the base plate 20. These elements 36 can be designed, for example, as heating elements 34, such as heating cartridges as described above.

[0105] In the exemplary embodiment in Figure 6 , which in a sectional view shows a heat storage device 100 with cylindrical heat input device 30 and planar heat discharge device 40, the heat input device 30 has two cylindrically formed elements 36 of the heat input device 30 on both sides of the heat discharge device 40.

[0106] In the exemplary embodiment in Figure 7 Figure 100, which also shows a heat storage device 100 with a cylindrical heat input device 30 and a planar heat discharge device 40, shows the heat discharge device 40 with three elements 46 arranged in the base plate 20. A cylindrical element 36 of the heat input device 30 is arranged between and on the outer surface of each of the planar elements 46 of the heat discharge device 40.

[0107] The cylindrically shaped elements 36 of the heat input device 30 can be inserted into bores in the base plate 20.

[0108] In the Figures 8 to 10Various embodiments of a heat storage device 100 with a cylindrical heat input device 30 and a cylindrical heat output device 40 are shown. The heat input device 30 and the heat output device 40 are each integrated into the base plate 20, which acts as a thermal bridge element 70 for transferring heat to and from the storage material 10 in the receiving chamber 12.

[0109] In the exemplary embodiment in Figure 8Figure 100, which is shown in an isometric representation, depicts a heat storage device 100 with a cylindrical heat input device 30 and a cylindrical heat output device 40. The heat input device 30 is arranged in the base plate 20 with three cylindrically shaped elements 36, which can, for example, be configured as heating elements 34. Between the elements 36, a cylindrically shaped element 46 of the heat output device 40 is arranged in the base plate 20.

[0110] In the exemplary embodiment in Figure 9 Figure 100, which shows a heat storage device 100 with cylindrical heat input device 30 and cylindrical heat output device 40 in a sectional view, has four cylindrically designed elements 36, between each of which a cylindrically designed element 46 of the heat output device 40 is arranged.

[0111] In the exemplary embodiment in Figure 10 Figure 100, which also shows a heat storage device 100 with a cylindrical heat input device 30 and a cylindrical heat output device 40 in a sectional view, shows the heat output device 40 as a cylindrical element 46 arranged in the base plate 20. Three cylindrical elements 36 of the heat input device 30 are arranged on each side of the heat output device 40.

[0112] The cylindrical elements 36 of the heat input device 30 and the cylindrical elements 46 of the heat discharge device 40 can be inserted into bores in the base plate 20.

[0113] Figure 11 Figure 1 shows an isometric representation of a heat storage device 100 with a planar heat input device 30 and a planar heat discharge device 40 according to a further embodiment of the invention. Figure 12The heat storage device 100 is shown in a sectional view.

[0114] In this embodiment, the coupling area 42 of the heat discharge device 40 is arranged on a side 22 of the coupling area 32 of the heat input device 30 facing away from the housing 16. The heat input device 30 is arranged directly on the base plate 20 at a distance from the storage material 10, while the heat discharge device 40 is applied to the outer surface of the heat input device 30 facing away from the receiving chamber 12.

[0115] Alternatively, the coupling area 32 of the heat input device 30 could also be arranged on a side 22 of the coupling area 42 of the heat discharge device 40 facing away from the housing 16, so that the heat input device 30 and the heat discharge device 40 would be swapped.

[0116] In the Figures 13 to 24Figure 1 shows an embodiment of the heat storage device 100 not included in the figure, in which the heat input device 30 is arranged in the receiving chamber 12, while the heat output device 40 is integrated into the base plate 20 of the enclosure 16, and partially integrated into the base plate 20 of the enclosure 16. Due to the placement of the heat output device 40 on the base plate 20, the solidification process during cooling begins at the base plate 20 of the enclosure 16. Gravity also promotes solidification towards the base plate 20. Advantageously, the heat input device 30 can be positioned within the storage material 10 largely perpendicular to the heat output device 40. This prevents the formation of material defects on the side of the heat input device 30 facing away from the heat output device 40.

[0117] In the Figures 13 to 24In the illustrated embodiments, the heat input device 30 can have at least one element 36 with the coupling area 32, in which the coupling area 32 essentially comprises an entire length of the element 36 in the receiving space 14 and / or an entire circumference of the element 36 and / or an entire circumference of the element 36 in the receiving space 14.

[0118] The coupling area 32 can extend over at least 50%, in particular over at least 60% of the total height of the recording space 14.

[0119] An element 36 or the coupling area 32 of the element 36 can be spaced apart from the enclosure 16, and in particular, one end of the element 36 can be spaced apart from a cover 28 and / or the base of the enclosure 16. Alternatively, the element 36 can also be arranged directly on the base plate 20 of the enclosure.

[0120] An element 36 or the coupling area 32 of the element 36 can be aligned parallel to an element 46 of the heat discharge device 40.

[0121] An element 36 or the coupling area 32 of the element 36 can be aligned parallel to a height axis L or axis of symmetry of the recording space 14.

[0122] An element 36 or the coupling area 32 of the element 36 can be arranged centrally in the receiving space 14 and in particular can be located on an axis of symmetry of the receiving space 14.

[0123] An element 36 can be arranged obliquely, in particular perpendicularly, to an orientation of the heat discharge device 40, and / or parallel to a direction of gravity S in the intended operating state. Furthermore, the element 36 can be arranged parallel to an orientation of the at least one heat discharge device 40.

[0124] Figure 13Figure 1 shows an isometric representation of an unenclosed heat storage device 100 with a surface-extended heat discharge device 40 in the base plate 20 and a surface-extended heat input device 30 in the receiving chamber 14. Figure 14 A heat storage device 100, not enclosed, is shown in a sectional view. The sectional view includes more elements 36 than the isometric view.

[0125] The heat discharge device 40 comprises a single element which is integrated into the base plate 20 of the enclosure 16, while the heat input device 30 comprises several elements 36 which are inserted into the storage material 10 perpendicular to the base plate 20 in the direction of gravity S and thus perpendicular to the discharge direction.

[0126] This means that the coupling area 32 of the heat input device 30 is arranged at least partially within the receiving space 14, in particular at least partially within the receiving chamber 12.

[0127] Figure 15 Figure 1 shows an isometric representation of an unenclosed heat storage device 100 with a surface-extended heat discharge device 40 in the base plate 20 and a surface-extended heat input device 30 in the receiving chamber 14. Figure 16 Such an unenclosed heat storage device is shown in a sectional view. The sectional view includes more elements 36 than the isometric view.

[0128] The arrangement of the heat discharge device 40 is the same as in the embodiment shown in the Figures 13 and 14. However, the arrangement of the individual elements 36 of the heat input device 30 is horizontal, i.e. parallel to the base plate 20 in the receiving chamber 12 and thus perpendicular to the discharge direction of the storage material 10.

[0129] Figure 17 Figure 1 shows an isometric representation of an unenclosed heat storage device 100 with a planar heat discharge device 40 in the base plate 20 and a cylindrical heat input device 30 in the receiving chamber 14. Figure 18 A heat storage device 100, not enclosed, is shown in a sectional view. The sectional view includes more elements 36 than the isometric view.

[0130] The arrangement of the heat discharge device 40 is the same as in the embodiment shown in the Figures 13 and 14The heat input device 30 comprises several elements 36, which are cylindrical and are inserted into the storage material 10 perpendicular to the base plate 20 in the direction of gravity S and thus perpendicular to the discharge direction.

[0131] Figure 19 Figure 1 shows an isometric representation of an unenclosed heat storage device 100 with a cylindrical heat discharge device 40 in the base plate 20 and a planar heat input device 30 in the receiving chamber 14. Figure 20 A heat storage device 100 is shown in a sectional view. The sectional view includes more elements 36 than the isometric view.

[0132] The individual elements 46 of the heat discharge device 40 are cylindrical and are inserted lying flat in bores in the base plate 20. The heat input device 30 comprises several elements 36, which are inserted into the storage material 10 perpendicular to the base plate 20 in the direction of gravity S and thus perpendicular to the discharge direction.

[0133] Figure 21 Figure 1 shows an isometric representation of an unenclosed heat storage device 100 with a cylindrical heat discharge device 40 in the base plate 20 and a planar heat input device 30 in the receiving chamber 14. Figure 22 A heat storage device 100 is shown in a sectional view. The sectional view includes more elements 36 than the isometric view.

[0134] The arrangement of the heat discharge device 40 is the same as in the embodiment shown in the Figures 19 and 20. However, the arrangement of the individual elements 36 of the heat input device 30 is horizontal, i.e. parallel to the base plate 20 in the receiving chamber 12 and thus perpendicular to the discharge direction of the storage material 10.

[0135] Figure 23 Figure 1 shows an isometric representation of an unenclosed heat storage device 100 with a cylindrical heat discharge device 40 in the base plate 20 and a planar heat input device 30 in the receiving chamber 14. Figure 24 A heat storage device 100 is shown in a sectional view. The sectional view includes more elements 36 than the isometric view.

[0136] The arrangement of the heat discharge device 40 is the same as in the embodiment shown in the Figures 19 and 20The heat input device 30 comprises several elements 36, which are cylindrical and are inserted into the storage material 10 perpendicular to the base plate 20 in the direction of gravity S and thus perpendicular to the discharge direction.

[0137] In the Figures 25 to 32 An embodiment of the heat storage device 100, not included, is shown in which the heat discharge device 40 is arranged in the receiving chamber 12, while the heat input device 30 is integrated on the base plate 20 of the enclosure 16, and partially in the base plate 20 of the enclosure 16.

[0138] By installing the heat dissipation device 40 in the storage material 10, the solidification process begins from this material. The direction of gravity favors contact with the base plate 20.

[0139] In the Figures 25 to 32In the illustrated embodiments, the heat discharge device 40 can have at least one element 46 with the coupling area 42, in which the coupling area 42 essentially comprises an entire length of the element 46 in the receiving space 14 and / or an entire circumference of the element 46 and / or an entire circumference of the element 46 in the receiving space 14.

[0140] The coupling area 42 can extend over at least 50%, in particular over at least 60% of the total height of the recording space 14.

[0141] An element 46 or the coupling area 42 of the element 46 can be spaced apart from the housing 16. In particular, an end of the element 46 can be spaced apart from a cover 28 and / or the bottom of the housing 16.

[0142] An element 46 or the coupling area 42 of the element 46 can be aligned parallel to an element 36 of the heat input device 30.

[0143] An element 46 or the coupling area 42 of the element 46 can be aligned parallel to a height axis L or axis of symmetry of the recording space 14.

[0144] An element 46 or the coupling area 42 of the element 46 can be arranged centrally in the receiving space 14 and in particular can be located on an axis of symmetry of the receiving space 14.

[0145] The at least one element 46 can be cylindrical and in particular can be designed as a tube 52.

[0146] The at least one element 46 can be arranged centrally in the recording space 14 and in particular along an axis of symmetry of the recording space 14.

[0147] Figure 25 Figure 1 shows an isometric representation of an unenclosed heat storage device 100 with a planar heat input device 30 in the base plate 20 and a cylindrical heat discharge device 40 in the receiving chamber 14. Figure 26Such a heat storage device is shown in a sectional view.

[0148] The heat input device 30, which extends over a large area, is implemented with two elements 36. The heat discharge device 40, implemented cylindrically as a pipe 52, is arranged vertically in the direction of gravity S with at least one section 48 in the storage material 10. Sections 38 of the heat input device 30 are arranged on both sides of the heat discharge device 40. The heat discharge device 40 can, for example, be inserted into the housing 16 from below through the base plate 20.

[0149] The coupling area 42 of the heat discharge device 40 is arranged at least partially within the receiving space 14, in particular at least partially within the receiving chamber 12.

[0150] Figure 27Figure 1 shows an isometric representation of an unenclosed heat storage device 100 with a planar heat input device 30 in the base plate 20 and a cuboid heat discharge device 40 in the receiving chamber 14. Figure 28 One such heat storage device 100 is shown in a sectional view.

[0151] The arrangement of the heat input device 30 is the same as in the embodiment shown in the Figures 25 and 26 The cuboid-shaped heat discharge device 40 is arranged vertically in the direction of gravity S with at least one section 48 in the storage material 10. Sections 38 of the heat input device 30 are arranged on both sides of the heat discharge device 40. The heat discharge device 40 can, for example, be inserted from below through the base plate 20 into the enclosure 16 and thus into the storage material 10.

[0152] In the Figures 25 to 28In the illustrated embodiments not shown, the heat input device 30 in the receiving chamber 14 can surround the heat discharge device 34 with at least one section 38, in particular concentrically and / or completely.

[0153] Furthermore, the heat input device 30 can be in thermal and / or mechanical contact with the heat discharge device 40 in the receiving chamber 14, which can also be the case in the embodiments shown in the other figures.

[0154] Figure 29 Figure 1 shows an isometric representation of an unenclosed heat storage device 100 with a planar heat input device 30 in the base plate 20 and a cylindrical heat discharge device 40 in the receiving chamber 14. Figure 30 One such heat storage device 100 is shown in a sectional view.

[0155] The heat input device 30 comprises a single element, which is integrated into the base plate 20 of the enclosure 16. The heat output device 40 is cylindrical and implemented as a single pipe 52. The heat output device 40 is, for example, inserted into the enclosure 16 from above and thus into the storage material 10.

[0156] Figure 31 Figure 1 shows an isometric representation of an unenclosed heat storage device 100 with a planar heat input device 30 in the base plate 20 and a cuboid heat discharge device 40 in the receiving chamber 14. Figure 32 One such heat storage device 100 is shown in a sectional view.

[0157] The arrangement of the heat input device 30 is the same as in the embodiment shown in the Figures 29 and 30The heat discharge device 40 is cuboid in shape and implemented as a single element. The heat discharge device 40 is, for example, inserted from above into the housing 16 and thus into the storage material 10.

[0158] In the Figures 13 to 32 In the illustrated embodiments not included, the heat input device 30 is at least partially spaced apart from the heat discharge device 40 in the receiving space 14, with storage material 10 arranged between the heat input device 30 and the heat discharge device 40.

[0159] Alternatively, the heat input device 30 or the heat output device 40 can each be designed adjacent to the base plate 20.

[0160] Figure 33Figure 1 shows an isometric representation of a heat storage device 100 with cylindrical heat input device 30 and cylindrical heat discharge device 40 in a housing 26 in the receiving space 14. Figure 34 Figure 1 shows a top view of the heat storage device 100 with linearly arranged heat input device 30 and heat output device 40 in the housing 26.

[0161] In the Figures 35 to 39 Further examples of such an arrangement are shown.

[0162] In the Figures 33 to 39 In the illustrated embodiment, the heat input device 30 and the heat discharge device 40 are not directly inserted into the storage material 10, but into a housing 26 as a thermal bridge element 70, which in turn is inserted into the storage material 10.

[0163] This means that the heat input device 30 and the heat output device 40 themselves do not need to be made of a material compatible with the storage material 10. Only the housing 26 needs to be compatible with the storage material 10. By housing the heat input device 30 and the heat output device 40 in the same housing 26, the storage material 10 preferably solidifies around the housing 26. This ensures good thermal contact between the heat input device 30 and the heat output device 40 and the storage material 10.

[0164] In these embodiments, the coupling area 32, 42 of the heat input device 30 and the heat output device 40 is arranged in the housing 26. The housing 26, which serves as a thermal bridge element 70, is in turn arranged at least partially within the receiving chamber 12 and the receiving space 14.

[0165] In the housing 26, for example, a heat input element 36 of the heat input device 30 can be arranged centrally, and a plurality of elements 46, in particular tubes 52, of the heat output device 40 can be positioned at a distance from this element 36. In particular, the elements 46 of the heat output device 40 can be arranged in a mirror-symmetrical or rotationally symmetrical manner with respect to the element 36 of the heat input device 30. Alternatively, an element 46 of the heat output device 40 can also be arranged centrally, which can be surrounded at a distance by elements 36 of the heat input device 30.

[0166] In the Figures 33 and 34In the illustrated embodiment, a central element 46, in particular a central tube 52, of the heat dissipation device 40 is arranged in the housing 26. Two cylindrical elements 36 of the heat input device 30 are arranged at a distance from the element 46. The elements 36 of the heat input device 30 are arranged in a row, mirror-symmetrical to the element 46. The elements 36 and 46 are all aligned parallel to each other.

[0167] Figure 35 Figure 1 shows a top view of the heat storage device 100 with a cross-shaped heat input device 30 and a central heat output device 40 in a housing 26. Two cylindrical elements 36 of the heat input device 30 are arranged as arms of a cross with the single cylindrical element 46 of the heat output device 40 at the intersection point. The elements 36 and 46 are all aligned parallel to each other.

[0168] Figure 36 Figure 1 shows a heat storage device 100 in a top view, comprising a coaxially arranged heat input device 30 and a heat output device 40 in a housing 26. The heat input device 30 has a centrally arranged cylindrical element 36, which is surrounded in a circle by cylindrical elements 46 of the heat output device 40. The elements 36 and 46 are all aligned parallel to each other.

[0169] Figure 37 Figure 1 shows a heat storage device 100 with a linearly arranged heat input device 30 and heat output device 40 in a housing 26.

[0170] An element 46 of the heat dissipation device 40 is arranged centrally in the housing 26 and is surrounded by two planar elements 36 of the heat input device 30, which are arranged in a row, perpendicular to the element 46.

[0171] Figure 38Figure 1 shows a heat storage device 100 with a linearly arranged heat input device 30 and heat output device 40 in a housing 26. The in Figure 38 The illustrated embodiment is designed similarly to the one in Figure 37 illustrated embodiment. In Figure 38 Only two elements 36 of the heat input device 30 are shown parallel to each other on both sides of the element 46 of the heat output device 40.

[0172] Figure 39 Figure 1 shows a heat storage device 100 with a linearly arranged heat input device 30 and heat output device 40 in a housing 26. In this embodiment, three rod-shaped elements 36 of the heat input device 30 are arranged in a row parallel to each other opposite a central cylindrical element 46 of the heat output device 40.

Claims

1. Heat-storage apparatus (100) which has a metallic phase-change material as a storage material (10), comprising at least one receiving chamber (12), which has a receiving space (14) for the storage material (10), and an enclosure (16) for the receiving space (14), at least one heat-input device (30) for introducing heat into the at least one receiving chamber (12), and at least one heat-output device (40) for discharging heat from the at least one receiving chamber (12), wherein a coupling region (32), intended for thermal coupling to the storage material (10), of the heat-input device (30) and / or a coupling region (42), intended for thermal coupling to the storage material (10), of the heat-output device (40) is arranged spaced apart at least regionally from the storage material (10), characterized in that the coupling region (32) of the heat-input device (30) and the coupling region (42) of the heat-output device (40) are arranged outside the receiving chamber (14) on a base of the enclosure (16), wherein the coupling region (32, 42) of the heat-input device (30) and / or of the heat-output device (40) is coupled thermally to the storage material (10) via at least one thermal-bridge element (70), wherein the enclosure (16) has the at least one thermal-bridge element (70), or in that the coupling region (32, 42) of the heat-input device (30) and of the heat-output device (40) is arranged in a housing (26), wherein the housing (26) is arranged at least regionally within the receiving chamber (12) and / or the receiving space (14).

2. Heat-storage apparatus according to Claim 1, characterized in that the at least one thermal-bridge element (70) is arranged on a base plate (20) of the enclosure (16) or is integrated into the base plate (20), or realizes the base plate (20).

3. Heat-storage apparatus according to Claim 1 or 2, characterized in that the coupling region (32) of the heat-input device (30) is arranged on a side (22) of the coupling region (42) of the heat-output device (40) that faces away from the enclosure (16), or in that the coupling region (42) of the heat-output device (40) is arranged on a side (22) of the coupling region (32) of the heat-input device (30) that faces away from the enclosure (16).

4. Heat-storage apparatus according to one of the preceding claims, characterized in that, if the coupling region (32, 42) of the heat-input device (30) and of the heat-output device (40) is arranged in a housing (26), wherein the housing (26) is arranged at least regionally within the receiving chamber (12) and / or the receiving space (14), in the housing (26), there is arranged a central element (46) of the heat-output device (40), in particular a central tube (52) thereof, and, spaced apart from the element (46), there are arranged elements (36) of the heat-input device (30), wherein in particular the elements (36) of the heat-input device (30) are arranged mirror-symmetrically or rotationally symmetrically with respect to the element (46).

5. Heat-storage apparatus according to one of the preceding claims, characterized in that, if the coupling region (32, 42) of the heat-input device (30) and of the heat-output device (40) is arranged in a housing (26), wherein the housing (26) is arranged at least regionally within the receiving chamber (12) and / or the receiving space (14), in the housing (26), there is arranged centrally an element (36) of the heat-input device (30) and, spaced from said element (36), there are positioned a plurality of elements (46) of the heat-output device (40), in particular tubes (52) thereof, wherein in particular the elements (46) of the heat-output device (40) are arranged mirror-symmetrically or rotationally symmetrically with respect to the element (36) of the heat-input device (30).

6. Heat-storage apparatus according to one of the preceding claims, characterized in that the heat-input device (30) has at least one element (36) with the coupling region (32) having at least one of the configurations: the coupling region (32) comprises substantially an entire length of the element (36) in the receiving space (14) and / or an entire periphery of the element (36) and / or an entire periphery of the element (36) in the receiving space (14); the coupling region (32) extends over at least 50%, in particular over at least 60%, of an entire height of the receiving space (14); the element (36) or the coupling region (32) of the element (36) is spaced apart from the enclosure (16) and, in particular, one end of the element (36) is spaced apart from a cover (28) and / or a base of the enclosure (16); the element (36) or the coupling region (32) of the element (36) is oriented parallel to an element (46) of the heat-output device (40); the element (36) or the coupling region (32) of the element (36) is oriented parallel to a vertical axis (L) or an axis of symmetry of the receiving space (14); the element (36) or the coupling region (32) of the element (36) is arranged centrally in the receiving space (14) and is situated in particular at an axis of symmetry of the receiving space (14).

7. Heat-storage apparatus according to Claim 6, characterized in that the at least one element (36) is arranged at an angle, in particular perpendicularly, to an orientation of the at least one heat-output device (40) and / or, in the intended working state, parallel to a direction of gravitational force (S), or in that the at least one element (36) is arranged parallel to an orientation of the at least one heat-output device (40).

8. Heat-storage apparatus according to one of the preceding claims, characterized in that the heat-output device (40) has at least one element (46) with the coupling region (42) having at least one of the configurations: the coupling region (42) comprises substantially an entire length of the element (46) in the receiving space (14) and / or an entire periphery of the element (46) and / or an entire periphery of the element (46) in the receiving space (14); the coupling region (42) extends over at least 50%, in particular over at least 60%, of an entire height of the receiving space (14); the element (46) or the coupling region (42) of the element (46) is spaced apart from the enclosure (16) and, in particular, one end of the element (46) is spaced apart from a cover (28) and / or a base of the enclosure (16) ; the element (46) or the coupling region (42) of the element (46) is oriented parallel to an element (36) of the heat-input device (30); the element (46) or the coupling region (42) of the element (46) is oriented parallel to a vertical axis (L) or an axis of symmetry of the receiving space (14); the element (46) or the coupling region (42) of the element (46) is arranged centrally in the receiving space (14) and is situated in particular at an axis of symmetry of the receiving space (14).

9. Heat-storage apparatus according to Claim 8, characterized in that the at least one element (46) is in the form of a tube (52).

10. Heat-storage apparatus according to Claim 8 or 9, characterized in that the at least one element (46) is arranged centrally in the receiving space (14) and is arranged in particular along an axis of symmetry of the receiving space (14).

11. Heat-storage apparatus according to one of the preceding claims, characterized in that the heat-input device (30), in the receiving space (14), at least by way of a portion (38), surrounds the heat-output device (34), in particular surrounds the latter concentrically and / or in a closed manner, in particular is in thermal contact and / or mechanical contact with the heat-output device (40) in the receiving space (14).

12. Heat-storage apparatus according to one of the preceding claims, characterized in that the heat-input device (30) is spaced apart from the heat-output device (40) at least partially in the receiving space (14), wherein storage material (10) is arranged between the heat-input device (30) and the heat-output device (40).

13. Heat-storage apparatus according to one of the preceding claims, characterized in that the storage material (50) comprises a metallic alloy with one or more of the constituents aluminium, silicon, copper, magnesium, zinc, germanium, in particular an AlSi alloy, preferably AlSi12.

14. Heat-storage apparatus according to one of the preceding claims, characterized in that the heat-input device (30) has at least one heating device (34), in particular wherein the heating device (34) has an electric resistance heater or inductive heater.

15. Heat-storage apparatus according to one of the preceding claims, characterized in that the heat-output device (40) comprises or is connected to at least one tube (52) through which a heat-transfer medium (58) flows.