SUPPORT DEVICE WITH PULSING HEAT TUBE, POWER MODULE AND COMPUTER PROGRAM PRODUCT

Description

[0001] The invention relates to a support device for an electrically conductive connecting element and to a power module having such a support device. The invention also relates to a computer program product for simulating the operating behavior of such a support device.

[0002] German patent application DE102017005568 discloses a support device for mechanically supporting an electrically conductive connecting element to be cooled on a heat sink, which electrically insulates the connecting element from the heat sink. International application PCT / EP2022 / 075791, published as WO 2023 / 052151 A1, discloses a thermally conductive holder in which channels are formed that can serve as heat pipes. The channels extend essentially along a cylindrical surface in a plastic body and are closed by metal elements on the end faces of the holder.

[0003] European patent application EP 3 336 471 A1 discloses an electronic substrate to be cooled. The electronic substrate is traversed by channels located in a substrate plane. The channels form a loop and serve as a pulsating heat pipe.

[0004] US Patent No. 6,672,373 B2 describes a pulsating heat pipe with sections of different diameters and curvature radii. The pulsating heat pipe is also equipped with expansion tanks for its fluid.

[0005] Power circuits with increasing electrical power are used in a wide variety of applications. Accordingly, increased demands are placed on the cooling of such circuits. At the same time, the objective is to achieve cost-effective and reliable cooling of power circuits. Low-wear operation is also a goal. This applies in particular to the cooling of electrically conductive connecting elements of such power circuits, for example, their busbars. The invention is based on the object of providing a method for cooling a power circuit that offers an improvement in at least one of the aspects outlined above.

[0006] The problem is solved by a support device according to the invention which is suitable for mechanically supporting an electrically conductive connecting element from which heat is to be dissipated. The mechanical support can be point-by-point support. The electrically conductive connecting element can be designed, for example, as a busbar. The electrically conductive connecting element, hereinafter also referred to simply as the connecting element, belongs to a power electrical circuit, for example a power module, and is mechanically supported by the support device on a heat sink into which heat from the connecting element is to be dissipated. The connecting element is electrically insulated from the heat sink by the support device. For this purpose, the support device can, for example, be made at least partially from a plastic.According to the invention, at least one pulsating heat pipe is formed in the support device, through which heat can be transported from the connecting element to the heat sink. Such pulsating heat pipes are also referred to in the English technical term as pulsating heat pipes. In the present application, the pulsating heat pipes are also referred to as heat pipes for short. The at least one pulsating heat pipe can be designed as a closed circuit or as a pulsating heat pipe with two ends. In this case, the pulsating heat pipe can form a loop. The at least one pulsating heat pipe is designed to transport heat from the connecting element-side end to the heat sink-side end of the support device. Consequently, the pulsating heat pipe in the support device serves to dissipate heat from the connecting element into the heat sink.The heat sink can be designed as a heat sink, as a housing component or as a component of another power electrical circuit.

[0007] The pulsating heat pipe provides efficient heat dissipation that operates automatically, i.e., uncontrolled, and is miniaturizable. The pulsating heat pipe is further geometrically adaptable and can thus be integrated into a variety of different types of support devices. Furthermore, the support device can be made at least partially from electrically insulating plastic with reduced thermal conductivity. The use of cost-intensive materials that are electrically insulating and simultaneously have increased thermal conductivity is minimized with the support device according to the invention. The support device can be made at least partially from a plastic that is easy to process, which in turn allows for quick, simple, and precise production of the at least one pulsating heat pipe.

[0008] In the support device according to the invention, the at least one pulsating heat pipe is at least partially provided with a diffusion-inhibiting coating. The diffusion-inhibiting coating can be a metallic coating or a ceramic or glass-like coating. The diffusion-inhibiting coating is designed to prevent the ingress of liquids, such as water vapor, or gases from the ambient air into the pulsating heat pipe. This reduces or prevents contamination of the fluid in the pulsating heat pipe. A negative pressure can be present in the at least one pulsating heat pipe compared to the ambient air, which can be altered by contamination. Such pulsating heat pipes can be operated reliably over the long term with an appropriate coating. This ensures an overall increased service life of the claimed support device.

[0009] In one embodiment of the claimed support device, a central region thereof is made from a first material having a first thermal conductivity. Furthermore, the support device is made from a second material having a second thermal conductivity at a connecting element-side end and / or a heat sink-side end. The central region is understood to be a section of the support device between the connecting element-side end and the heat sink-side end. In the central region, thermal edge effects present at the connecting element-side end and / or the heat sink-side end can be minimized. Furthermore, the second thermal conductivity can be higher than the first thermal conductivity. This results in improved thermal coupling of the support device to the connecting element and / or the heat sink.The first and second materials can each be formed as plastic in which a predeterminable concentration of heat-conducting particles and / or fibers is present. The heat-conducting particles can be added to the plastic, for example, using an additive manufacturing process. The particles or fibers can be made at least partially from glass, ceramic, a metallic material, or carbon. Furthermore, the particles and / or fibers can be accommodated in the corresponding component of the support device in such a way that they electrically conductively contact at most the heat sink-side end or the connecting element-side end. The central region and the connecting element-side or heat sink-side end made of the first or second material can be formed as separate components of the support device or can be formed integrally.Furthermore, the central region, the connecting element-side end, and / or the heat sink-side end can be produced by injection molding. There can be an essentially discrete boundary or a predeterminable transition between the first and second materials. Both the discrete boundary and the predeterminable transition can be produced, for example, by an additive manufacturing process. Alternatively or additionally, an adhesive bond or a welded bond can also be present at the predeterminable transition. Furthermore, a sealing element can also be arranged at the predeterminable transition. If the central region and the connecting element-side end or the heat sink-side end are designed as separate components, i.e. the support device is designed in a differential construction, these can each be made entirely from the first or second material.

[0010] Furthermore, a mounting foot can be formed on the connecting element-side end and / or the heat sink-side end of the claimed support device. The mounting foot can be integrally formed on the connecting element-side end or the heat sink-side end and can be substantially flat. The at least one pulsating heat pipe extends at least partially through the mounting foot. The mounting foot provides an enlarged surface area on the connecting element and / or the heat sink for thermal coupling of the support element.

[0011] In a further embodiment of the claimed support device, at least one pulsating heat pipe is at least partially filled with an electrically conductive fluid. The electrically conductive fluid can be, for example, water or an aqueous solution. The claimed support device electrically insulates the connecting element from the heat sink, so that the use of an electrically conductive fluid eliminates the risk of the heat sink becoming electrically charged. The use of electrically insulating fluids or those with negligible electrical conductivity < 100 µS / cm, in particular < 10 µS / cm, is unnecessary in the claimed support device. Accordingly, a broader spectrum of fluids is available, allowing the heat transport properties of the pulsating heat pipe to be specified more precisely.In particular, water, ethanol, a coolant, a ferrofluid, an electrofluid, or a dielectric fluid, such as perfluoro(2-methyl-3-pantatone), can be used as the fluid. The fluid can be mixed with metal particles, through which the existing heat dissipation performance of the at least one pulsating heat pipe can be measured. The claimed support device can be manufactured cost-effectively overall and adapted to meet requirements for a wide range of applications.

[0012] Furthermore, the claimed support device can be formed in one piece. For this purpose, the support device can be manufactured essentially entirely by additive manufacturing, for example, 3D printing. Additive manufacturing allows a larger number of pulsating heat pipes and reduced internal diameters and / or reduced curvature radii of the at least one pulsating heat pipe to be produced within the same installation space. This makes the at least one pulsating heat pipe suitable for dissipating heat even in delicate sections of the support device. As a result, increased heat dissipation performance can be achieved. Alternatively, the claimed support device can comprise a core section and a bell section. The bell section can be slipped over the core section during assembly.The at least one pulsating heat pipe can be formed from a recess or a combination of recesses in the core section and / or the bell section. The recess or the combination of recesses can each be produced by producing the core section and / or the bell section by injection molding, bulk forming, or machining. The core section and the bell section can each be manufactured quickly and easily, which in turn allows the claimed support device to be manufactured cost-effectively. The bell section can also form the connecting element-side end or the heat sink-side end of the support device. If contact surfaces at the connecting element-side end and the heat sink-side end are not parallel, the bell section can comprise both the heat sink-side and the connecting element-side ends of the support device.In particular, the core section can be made from the first material with the first thermal conductivity, and the bell section from the second material with the second thermal conductivity. Alternatively, the core section and / or the bell section can also be made in sections from the first or second material, respectively. The heat transport behavior of the at least one pulsating heat pipe can therefore be further adjusted by the design of the core section and the bell section. Furthermore, the bell section and the core section can also be conical, in particular have a draft angle, thereby improving mutual fit. In particular, gaps between several adjacent pulsating heat pipes can thus be easily avoided.The bell section and / or the core section can have different optical transmission properties, allowing them to be joined together, for example, by laser beam welding. Likewise, the bell section can be made of a transparent material, allowing easy visual inspection of the support device.

[0013] Furthermore, in the claimed support device, a plurality of pulsating heat pipes can be formed in the region of a circumferential wall located between the connecting element-side end and the heat sink-side end. The circumferential wall can extend from the connecting element-side end to the heat sink-side end and connect them. A surface of the support device in the central region is defined by the circumferential wall. The circumferential wall can be designed essentially as a cylindrical surface. Alternatively, the circumferential wall can be designed as any circumferential surface. The pulsating heat pipes can be located within the support device in the region of its surface, thereby facilitating heat dissipation to the ambient air. The pulsating heat pipes can, in particular, extend up to 5 mm below a surface of the circumferential wall in the central region of the support device.Accordingly, an enlarged surface area can be used for pulsating heat pipes, further supporting the heat dissipation of the connecting element. By providing an enlarged surface area, the recesses for the pulsating heat pipes can be manufactured with increased manufacturing tolerances, which in turn allows for simplified production. Furthermore, in a support device comprising a bell section and a core section, the bell section can be thin-walled, which also allows for simplified production, for example, by injection molding.

[0014] In a further embodiment of the claimed support device, the diffusion-inhibiting coating can be produced by vapor deposition, physical vapor deposition, a sol-gel process, thermal spraying, vapor deposition, autocatalytic coating or by an electroplating process.

[0015] Furthermore, in the claimed support device, the peripheral wall, the connecting element-side end, and / or the heat sink-side end can be provided with a diffusion-inhibiting coating. The diffusion-inhibiting coating can be a metallic, ceramic, or glass-like coating. A negative pressure can be present in the at least one pulsating heat pipe compared to the ambient air. The diffusion-inhibiting coating reduces or prevents the penetration of liquid, such as water vapor, or gases from the ambient air into the support device. The coating of the peripheral wall, the connecting element-side end, and / or the heat sink-side end can be formed on the surface or arranged in the interior. A coating on the surface can be produced in a particularly simple manner.A coating located inside the peripheral wall, the end facing the connecting element, and / or the end facing the heat sink, is in turn protected by the respective component itself. As a result, the coating can be made of a material that is chemically unstable to permanent contact with the ambient air. By avoiding mechanical stress, the coating can have a reduced layer thickness. Such coatings can also be produced using additive manufacturing. Furthermore, the claimed support device has increased insulation strength due to such a coating.

[0016] In the claimed support device, the at least one pulsating heat pipe can also be closed by the heat sink and / or the connecting element to be cooled. The at least one pulsating heat pipe can be designed as a through-bore that extends in the region of the peripheral wall through the central region of the support device. On end faces of the support device, the at least one pulsating heat pipe can be continued as a recess, i.e., essentially as an open channel that is closed by the connecting element or heat sink in the assembled state. In such a support device, an electrically insulating fluid is used in the pulsating heat pipe. A corresponding support device has a reduced number of components and can therefore be manufactured particularly easily. Furthermore, a more direct heat-conducting contact with the connecting element or heat sink can be established in this way.

[0017] Furthermore, the claimed support device can have a sensor that is designed to detect at least one physical variable of the pulsating heat pipe and / or a component of the support device. For example, the sensor can be designed as a pressure sensor or temperature sensor, by which the pressure or temperature of the fluid in the pulsating heat pipe can be detected. The pressure or temperature of the fluid allows conclusions to be drawn about the extent to which a heat transport capacity of the pulsating heat pipe is being utilized at a given measurement time. The sensor can also be designed to detect vibrations. Furthermore, the sensor can be designed to perform so-called energy harvesting. For this purpose, the sensor can have, for example, a thermogenerator or a piezo membrane and / or generate electrical energy for its operation through induction. The sensor can therefore be operated reliably over the long term.Furthermore, the sensor can have a communication unit, particularly a wireless communication unit. This allows the condition of the support device to be easily monitored. Based on the data obtained via the sensor, an application in which the support device is used, for example, a power module, can be operated with optimized thermal stress. Likewise, faults can be detected and the remaining technically usable service life of the support device can be estimated.

[0018] Furthermore, the claimed support device can have a recess at the connecting element end and / or at the heat sink end, through which an inverted surface is formed. The recess can be formed, for example, on an end face of the support device. The inverted surface serves to thermally couple the connection element or heat sink to be cooled. The recess forms an enlarged surface in the region of the connecting element or heat sink end, at which a thermally conductive contact with the connection element or heat sink can be established. This allows for improved thermal coupling while saving installation space. The claimed support device is thus adaptable to applications with increased miniaturization, in particular power modules. The at least one heat pipe can extend in the region of the recess, in particular a wall that delimits the recess.The pulsating heat pipe can be substantially U-shaped in the region of the recess. The recess also provides centering for mounting the support device. In particular, the recess can be formed in an end face of a core section of the support device. The corresponding bell section of the support device is centered by the recess in the core section. Furthermore, a coupling element made of a metallic material can be accommodated in the recess, which forms the inverted surface for heat coupling. The coupling element is designed to provide a thermal connection between the connecting element or heat sink and the support device via the inverted surface. Furthermore, the inverted surface and / or the coupling element can be conical, ensuring simple and precise manufacturing.Furthermore, the inverted surface and / or the coupling element can be designed to be pressed together, or can be undercut, whereby a positive connection can be formed. Furthermore, the inverted surface and the coupling element can be connected to one another by adhesive bonding. The coupling element can be designed as a bushing and / or designed to create a detachable connection with the connecting element or the heat sink. The coupling element can be provided with a threaded bore for this purpose, for example. In the assembled state, the coupling element is exposed to minimized tensile and peeling stresses. Instead, the coupling element is predominantly subjected to shear stresses. As a result, the coupling element is subjected to mechanical stress appropriate to the component.

[0019] In a further embodiment, the claimed support device is at least partially manufactured by an additive manufacturing process. For this purpose, the support device can be formed in one piece and manufactured sectionally by an additive manufacturing process, or component by component. Additive manufacturing processes allow the support device to be manufactured with locally adjustable properties, in particular thermal conduction properties, using a predefined mixture of additives, for example, heat-conducting particles. Furthermore, delicate or geometrically complex heat pipes, e.g., nested pulsating heat pipes, can be manufactured simply and cost-effectively using additive manufacturing processes. This allows the technical properties of the materials used to be further exploited. This, in turn, allows greater miniaturization of the claimed support device.The additive manufacturing process can be, for example, 3D printing, powder bedless printing, in particular fused deposition modeling, stereolithography or a jetting process.

[0020] The described problem is also solved by a power module according to the invention. The power module can, for example, belong to a so-called power module or a converter. The power module comprises a substrate provided with at least one electrically conductive connecting element, for example a busbar, which is to be cooled when the power module is in an active operating state. The connecting element is supported in the power module by a support device on a heat sink into which the connecting element is to be cooled. According to the invention, the support device is designed according to at least one of the embodiments outlined above. The features of the claimed support device can therefore be transferred analogously to the power module according to the invention. The claimed power module, together with a higher-level control unit, can belong to a system by which the above-described problem is also solved.The system is designed to monitor the operating state of the power module. For this purpose, at least one support device in the power module has a sensor that is communicatively coupled directly or indirectly to the higher-level control unit. The higher-level control unit is designed to evaluate data received from the sensor and issue a warning. The higher-level control unit can be integrated into the power module.

[0021] Furthermore, the underlying problem is solved by a computer program product according to the invention, which is designed to simulate the operating behavior of a support device. The operating behavior to be simulated can occur during active operation of a power module in which the support device is arranged. The computer program product comprises instructions that, when the computer executes the computer program product, cause the computer to simulate the operating behavior of the support device. According to the invention, the support device is designed according to one of the embodiments presented above. The features outlined above are thus also transferable analogously to the computer program product according to the invention.

[0022] The computer program product can have a physics module for simulation purposes, in which the support device is at least partially mapped. For this purpose, the support device's structure and functionality can be simulated, for example, as a digital image that is part of the computer program product. Alternatively or additionally, the support device can also be embodied as a computer model in the physics module. The physics module is designed to simulate, among other things, the thermal behavior of the support device, the flow behavior, the evaporation behavior, and / or the condensation behavior of the fluid used therein under adjustable operating conditions.The adjustable operating conditions include, for example, an ambient temperature, a pressure of the fluid, its temperature, a thermal conductivity of the fluid and / or the individual components of the support device, a temperature of the connecting element to be cooled, and / or a temperature of the heat sink. The computer program product can have a data interface via which corresponding data can be specified via a user input, a data connection to a higher-level control unit of a real system with a power module with a corresponding support device, and / or other simulation-oriented computer programs. Likewise, the computer program product can have a data interface for outputting simulation results to a user and / or other simulation-oriented computer program products.Using the computer program product, for example, a defective support device, a faulty connection between the support device and the heat sink or the connecting element, and / or a leak in at least one pulsating heat pipe can be detected. In particular, the operating behavior of the real support device, expressed, for example, by measured values ​​from a sensor incorporated therein or sensors in the power module, can be checked for plausibility by comparing it with the simulated support device. For example, the operating behavior of a pulsating heat pipe can be realistically simulated. The at least one pulsating heat pipe can be reproduced as a two-dimensional model in the claimed computer program product. Pulsating heat pipes can be simulated with a high degree of realism and minimized computational effort.The support device can therefore be modeled in a simple manner, i.e. its operating behavior can be recalculated with a minimum of so-called CFD calculations. In particular, the heat transport behavior in the pulsating heat pipe can be approximated with sufficient precision by algebraic calculation. The computer program product according to the invention thus allows modeling of the underlying support device with a reduced requirement for computing power. This also makes it possible to simulate a large number of such support devices, for example in a power module. Overall, a particularly realistic process image of the operation of a corresponding application can thus be provided in a simple manner. Likewise, real-time capability can be easily achieved by the claimed computer program product due to the reduced computing effort, which in turn enables efficient monitoring of a corresponding support device orof a corresponding power module. The computer program product can be designed as a so-called digital twin, as described, for example, in the document US 2017 / 286572 A1. Accordingly, the digital twin is designed to correspond to the support device according to one of the embodiments outlined above. The computer program product can be monolithic, i.e., executable entirely on a hardware platform. Alternatively, the computer program product can be modular and comprise a plurality of subprograms that are executable on separate hardware platforms and interact via a communicative data connection. Such a communicative data connection can be a network connection, an internet connection, and / or a mobile radio connection. Furthermore, the computer program product according to the invention can be used to test and / or optimize a support device by simulation.

[0023] The invention is explained in more detail below using individual embodiments in the figures. The figures are to be read as complementary to one another insofar as identical reference numerals in different figures have the same technical meaning. The features of the individual embodiments can also be combined with one another. Furthermore, the embodiments shown in the figures can be combined with the features outlined above. They show in detail: FIG 1 shows a power module with an embodiment of the claimed support device in an oblique view; FIG 2 shows a first embodiment of the claimed support device in a longitudinal section; FIG 3 shows a second embodiment of the claimed support device in an oblique view; FIG 4 shows a third embodiment of the claimed support device in the unassembled state in an oblique view; FIG 5 shows the third embodiment of the claimed support device in the assembled state in an oblique view; FIG 6 shows the third embodiment of the claimed support device in the assembled state, viewed obliquely from below.

[0024] In FIG 1 1 shows an oblique view of an embodiment of a power module 50 in which at least one support device 10 according to the invention is used. The power module 50 comprises a plurality of electrically conductive connecting elements 12, each of which is designed as busbars 17. The electrically conductive connecting elements 12 are also referred to below simply as connecting elements 12. The connecting elements 12 are heated in an active operating state of the power module 50 and must be cooled accordingly. The connecting elements 12 are each mechanically supported via a support device 10 on a housing component 18, which serves as a heat sink 14. Alternatively or additionally, a heat sink (not shown) can also serve as a heat sink 14. The connecting elements 12 are each to be understood as a heat source 13.During normal operation of the power module 50, a heat flow 15 is present from the connecting elements 12, i.e., a heat source 13, to the heat sink 14. The heat flows 15 flow through the associated support devices 10. At least one of the support devices 10 is designed according to one of the embodiments outlined above or below. The operating behavior of the at least one support device 10, which is designed according to one of the embodiments outlined above or below, is simulated by a computer program product 60 (not shown in detail). The computer program product 60 can be designed as a so-called digital twin of the corresponding support device.

[0025] A first embodiment of the claimed support device 10 is shown in FIG 2 shown schematically in a longitudinal section. The support device 10 is arranged between an electrically conductive connecting element 12, which forms a heat source 13, and a heat sink 14, which can be designed as a housing component 18 or as a heat sink 16. The support device 10 is formed in one piece and comprises a central region 20, which lies between an end section 25 at a connecting element-side end 22 and a heat sink-side end 24. In the central region 20, the support device 10 is made of a first material 21, which has a first thermal conductivity. In the region of the connecting element-side end 22, as well as at the corresponding end section 25, the support device 10 is made of a second material 23, which has a second thermal conductivity.Likewise, the support device 10 is made of the second material with the second thermal conductivity in the region of its heat sink-side end 24, i.e., in the corresponding end section 25. The second thermal conductivity is higher than the first thermal conductivity. The first and second materials are each a plastic suitable for additive manufacturing, to which thermally conductive particles are admixed in an adjustable form, i.e., essentially in a selectable concentration. The different thermal conductivities in the first and second materials 21, 23 are adjusted by a predeterminable setting of a respective concentration of thermally conductive particles during additive manufacturing of the support device. A heat flow 15 from the heat source 13 flows through a thermally conductive paste layer 27 at the connecting element-side end 22 and enters the end section 25 at the connecting element-side end 22 of the support device 10.

[0026] The heat flow 15 entering at the connecting element-side end 22 partially evaporates a fluid 32 accommodated in a plurality of pulsating heat pipes 30. The pulsating heat pipes 30 are each formed as recesses within the support device 10 and are arranged in an interior of the support device 10. Accordingly, the pulsating heat pipes 30 are closed off by the support device 10 itself. The fact that the second thermal conductivity in the end section 25 at the connecting element-side end 22 is higher than the first thermal conductivity in the central section 20 assists the evaporation of the fluid 32. Vapor phases 33 form in the pulsating heat pipes 30 and move as bubbles along the pulsating heat pipe 30. During normal operation, the vapor phases 33 oscillate 35 so that heat is transported to the heat sink end 24.Overall, heat dissipation 19 occurs from the connecting element 12 into the heat sink 14. Corresponding to the incoming heat flow 15 at the connecting element-side end 22, the heat flow 15 exits the pulsating heat pipes 30 at the heat sink-side end 24. The end section 25 at the heat sink-side end 24 is made of the second material 23, which supports heat dissipation from the pulsating heat pipes 30 into the corresponding end section 25. The heat flow 15, which enters the heat sink 14 from the support device 10, flows through a thermal paste layer 27 arranged between the support device 10 and the heat sink 14.

[0027] The fluid 32 is under negative pressure compared to the ambient air 48 in which the support device 10 is used. A diffusion-inhibiting coating 26 is formed in the support device 10, which minimizes the penetration of gases or liquids from the ambient air 48 into the pulsating heat pipes 30. The diffusion-inhibiting coating 26 can be formed as a metallic or ceramic coating. The diffusion-inhibiting coating 26 can also be produced by additive manufacturing. The pulsating heat pipes 30 ensure efficient and self-regulating heat dissipation 19 from the connecting element 12 into the heat sink 14. Furthermore, a sensor 28 is arranged in the support device 10 and is coupled to one of the pulsating heat pipes 30.The sensor 28 is designed to detect a physical variable of the pulsating heat pipe 30, for example, a temperature or a pressure of the fluid 32 in the corresponding pulsating heat pipe 30. The sensor 28 is connected to a communication unit 29. The communication unit 29, in turn, is connected to a higher-level control unit 40 via a communicative data connection 41, for example, a wireless connection. The higher-level control unit 40 is designed to monitor the heat dissipation 19 and can belong to the power module 50 in which the support device 10 is inserted. Furthermore, a computer program product 60 (not shown in detail) is present, which is designed as a so-called digital twin of the support device 10.The computer program product 60 can comprise an image, in particular a digital image, of the support device 10 and can be configured to simulate a current operating state of the support device 10. The computer program product 60 can be used to verify, in particular, the plausibility of, physical variables detected by the sensor 28. The computer program product 60 can, for example, be stored in an executable manner on the higher-level control unit 40.

[0028] A second embodiment of the claimed support device 10 is shown in FIG 3 shown schematically in a longitudinal section. The support device 10 is arranged between an electrically conductive connecting element 12, which forms a heat source 13, and a heat sink 14, which can be designed as a housing component 18 or as a heat sink 16. The support device 10 is made from a plurality of components that are connected to one another. These are connected to one another via materially integral connections 31. The support device 10 comprises a central region 20, which lies between an end section 25 at a connecting element-side end 22 and a heat sink-side end 24. In the central region 20, the support device 10 is made from a first material 21 that has a first thermal conductivity. The end section 25 at the connecting element-side end 22 is made from a second material 23 that has a second thermal conductivity.Likewise, the support device 10 is made from the second material with the second thermal conductivity in the region of its heat sink-side end 24, i.e., in the corresponding end section 25. The second thermal conductivity is higher than the first thermal conductivity. The first and second materials are each a plastic suitable for additive manufacturing, to which thermally conductive particles are admixed in an adjustable form, i.e., essentially in a selectable concentration. The different thermal conductivities in the first and second materials 21, 23 are adjusted by a predeterminable setting of a respective concentration of thermally conductive particles during additive manufacturing of the support device. A heat flow 15 from the heat source 13 flows through a thermally conductive paste layer 27 at the connecting element-side end 22 and enters the end section 25 at the connecting element-side end 22 of the support device 10.

[0029] The heat flow 15 entering at the connecting element-side end 22 causes a partial evaporation of a fluid 32 accommodated in a plurality of pulsating heat pipes 30. The pulsating heat pipes 30 are each formed as recesses within the support device 10 and are arranged in an interior of the support device 10. Accordingly, the pulsating heat pipes 30 are closed off by the end sections 25 of the support device 10. The fact that the second thermal conductivity in the end section 25 at the connecting element-side end 22 is higher than the first thermal conductivity in the central section 20 assists the evaporation of the fluid 32. Vapor phases 33 form in the pulsating heat pipes 30 and move as bubbles along the pulsating heat pipe 30. During normal operation, the vapor phases 33 oscillate 35 so that heat is transported to the heat sink end 24.Overall, heat dissipation 19 occurs from the connecting element 12 into the heat sink 14. Corresponding to the incoming heat flow 15 at the connecting element-side end 22, the heat flow 15 exits the pulsating heat pipes 30 at the heat sink-side end 24. The end section 25 at the heat sink-side end 24 is made of the second material 23, which supports heat dissipation from the pulsating heat pipes 30 into the corresponding end section 25. The heat flow 15, which enters the heat sink 14 from the support device 10, flows through a thermal paste layer 27 arranged between the support device 10 and the heat sink 14.

[0030] The fluid 32 is under negative pressure compared to the ambient air 48 in which the support device 10 is used. A diffusion-inhibiting coating 26 is formed in the support device 10, which minimizes the penetration of gases or liquids from the ambient air 48 into the pulsating heat pipes 30. The diffusion-inhibiting coating 26 can be formed as a metallic or ceramic coating. The diffusion-inhibiting coating 26 can also be produced by additive manufacturing. The pulsating heat pipes 30 ensure efficient and self-regulating heat dissipation 19 from the connecting element 12 into the heat sink 14. The diffusion-inhibiting coating 26 is applied in the recesses, i.e., on the inner surfaces of the pulsating heat pipes 30.As a result, the central region 20 can be used as a protective absorption section that absorbs fluids, for example gases, from the ambient air 48 and thus minimizes or prevents their penetration into the pulsating heat pipes 30. Likewise, diffusion-inhibiting coatings 26 are applied in the region of a boundary between the central region 20 and the end sections 35. These are designed to minimize the penetration of fluid from the ambient air 48 via the end sections 25 at the connecting element-side end 22 or at the heat sink-side end 24. Furthermore, a computer program product 60 (not shown in detail) is present, which is designed as a so-called digital twin of the support device 10. The computer program product 60 can comprise an image, in particular a digital image, of the support device 10 and can be designed to simulate a current operating state of the support device 10.

[0031] A third embodiment of the claimed support device 10 is shown in FIG 4 shown in an oblique view in an unassembled state. The support device 10 comprises a core section 38, which is essentially cylindrical and on its peripheral wall 39, which is designed as a cylindrical jacket surface, on which a plurality of recesses 34 are formed. In an assembled state, the recesses 34 form the pulsating heat pipes 30, in which a fluid 32 is accommodated, through which the desired heat dissipation 19 takes place. The recesses 34 extend in a central region 20 from a heat sink-side end 24 to a connecting element-side end 22. In the unassembled state, the recesses 34 form essentially open channels. The core section 38 is made of a first material 21, which is designed as a plastic. At the connecting element-side end 22, the core section 38 has an end face 37, at which the recesses 34 continue.The recesses 34 are essentially star-shaped on the end face 37. A substantially central recess is formed on the end face 37, through which an inverted surface 42 is formed. The recesses 34, which form the pulsating heat pipes 30 in the assembled state, also extend along the inverted surface 42. The inverted surface 42 is circumferential and, in the assembled state, serves to heat-couple 43 the core section 38, i.e., in the region of the connecting-element-side end 22 of the support device 10. The inverted surface 42 provides an enlarged surface for a heat flow 15, which is to be transported from a connecting element 12 (not shown in detail) to a heat sink 14 (not shown in detail), i.e., the heat sink 16 or the housing component 18, via the pulsating heat pipes 30.The core section 38 can also be designed as a hollow body, which simplifies production by injection molding.

[0032] At the heat sink-side end 24, the support device 10 is provided with a mounting base 36, via which the support device 10 can be coupled to the heat sink 14. Coupling to the heat sink 14 comprises a mechanical coupling and a thermal coupling. Furthermore, a computer program product 60 (not shown in detail) is provided, which is designed as a so-called digital twin of the support device 10. The computer program product 60 can comprise an image, in particular a digital image, of the support device 10 and can be designed to simulate a current operating state of the support device 10.

[0033] The third embodiment of the claimed support device 10, as shown in FIG 4 shown is in FIG 5 shown in an assembled state in an oblique view. The descriptions of FIG 4 apply analogously to FIG 5 continued. In FIG 5 The core section 38 is connected to a bell section 44, which is essentially placed over the core section 38. For a better overview, the bell section 44 is shown in FIG 5 shown transparently. The bell section 44 is essentially designed as a hollow cylinder that is closed on one side and open on one side. The recesses 34 on the core section 38, which form grooves in the unassembled state, are closed by the bell section 44 at least in the central region 20 and are thus suitable for receiving the fluid 32 through which the functionality of the pulsating heat pipes 30 is achieved. A mounting foot 36 is also formed on the bell section 44, the shape of which corresponds to the mounting foot 36 of the core section 38. Alternatively, the mounting foot 36 can also be designed as a separate component that is connected to the core section 38 during the manufacture of the support device 10. Recesses 34 that extend through the mounting foot 36 are formed in the mounting foot 36 of the bell section 44.The recesses 34 in the mounting foot 36 of the bell section 44 are connected to recesses 34 in the core section 38, so that these are also partially filled with fluid 32. Accordingly, pulsating heat pipes 30 are also formed through the recesses 34 in the mounting foot 36 of the bell section 44. The enlarged surface of the mounting foot 36 on the core section 38 or on the bell section 44 results in improved thermal coupling of the support device 10 to the heat sink 14 (not shown in detail). The core section 38 and / or the bell section 44 can be manufactured by additive manufacturing, so that an increased proportion of their mounting feet 36 can be used for pulsating heat pipes 30, and thus for the desired heat dissipation 19. As a result, the claimed support device 10 can be better utilized thermally.Because the fluid 32 is electrically insulated from the connecting element 12 via the mounting base 36, the fluid 32 itself can be electrically conductive.

[0034] The core section 38 is also covered in the area of ​​its end face 37, thus closing off the recesses 34, which form open grooves in the unassembled state. At the connecting element-side end 22, a coupling element 46 made of a metallic material is arranged on the bell section 44. The coupling element 46 is designed to contact the connecting element 12 (not shown in detail) and thus introduce a heat flow 15 into the support device 10. The bell section 44 has, in the area of ​​the inverted surface 42, as shown in FIG 4 shown, provided with a recess in which the coupling element 46 is received. Since the coupling element 46 is made of a metallic material, it has increased thermal conductivity compared to the first material 21, on which the central region 20 of the core section 38 is made. Due to the enlarged surface area present on the inverted surface 42, an increased heat flow 15 can thus be introduced into the pulsating heat pipes 15. The core section 38 and the bell section 44 can be manufactured in a simple manner, for example by additive manufacturing or injection molding, and offer increased capacity for heat dissipation 19 of the connecting element 12. Accordingly, the functional integration of mechanical support and heat dissipation is realized in a particularly cost-effective manner.Furthermore, a computer program product 60 (not shown in detail) is provided, which is designed as a so-called digital twin of the support device 10. The computer program product 60 can comprise an image, in particular a digital image, of the support device 10 and can be designed to simulate a current operating state of the support device 10.

[0035] Furthermore, the third embodiment of the claimed support device 10 is shown in FIG 6shown in the assembled state in an oblique view from below. For better clarity, the mounting foot 36 of the core section 38 is shown transparent. In the area of ​​the mounting foot 36, recesses 34 are formed in the core section 38, which connect the recesses 34 on the peripheral wall 39 of the core section 38. Furthermore, in the area of ​​the mounting foot 36 of the bell section 44, recesses 34 are formed, which loop-shaped connect the recesses 34 on the peripheral wall 39 of the core section 38. As a result, pulsating heat pipes 30 are formed in the mounting foot 36, through which the surface of the mounting foot 36 of the core section 38 is utilized for heat dissipation 19. Furthermore, a computer program product 60, not shown in detail, is present, which is designed as a so-called digital twin of the support device 10.The computer program product 60 may comprise an image, in particular a digital image, of the support device 10 and may be designed to simulate a present operating state of the support device 10.

Claims

1. Supporting device (10), which serves for mechanically supporting on a heat sink (14) an electrically conductive connection element (12) from which heat is to be dissipated and which electrically insulates the connection element (12) from the heat sink (14), wherein at least one pulsating heat pipe (30) is formed in the supporting device (10) for the purpose of dissipating heat from the connection element (12) into the heat sink (14), characterized in that the at least one pulsating heat pipe (30) is at least partially provided with a diffusion-inhibiting coating (26).

2. Supporting device (10) according to Claim 1, characterized in that the supporting device (10) is formed in the middle region (20) from a first material (21) with a first thermal conductivity and is formed at an end (22) on the connection element side and / or an end (24) on the heat sink side from a second material (23) with a second thermal conductivity.

3. Supporting device (10) according to Claim 1 or 2, characterized in that a mounting foot (36), through which the at least one pulsating heat pipe (30) extends, is formed at the end (22) on the connection element side.

4. Supporting device (10) according to one of Claims 1 to 3, characterized in that the at least one pulsating heat pipe (30) is at least partially filled with an electrically conductive fluid (32).

5. Supporting device (10) according to one of Claims 1 to 4, characterized in that the supporting device (10) is formed in one piece or has a core portion (38) on which a bell portion (44) is fastened.

6. Supporting device (10) according to one of Claims 1 to 5, characterized in that a plurality of pulsating heat pipes (30) are formed in the region of a circumferential wall (39), lying between the end (22) on the connection element side and the end (24) on the heat sink side.

7. Supporting device (10) according to one of Claims 1 to 6, characterized in that the diffusion-inhibiting coating (26) is produced by vapour phase deposition, physical vapour deposition, a sol-gel process, thermal spraying, vapour coating, autocatalytic coating or by an electroplating process.

8. Supporting device (10) according to either of Claims 6 and 7, characterized in that the circumferential wall (39), the end (22) on the connection element side and / or the end (24) on the heat sink side of the supporting device (10) is provided on its surface or inside with a diffusion-inhibiting coating (26).

9. Supporting device (10) according to one of Claims 1 to 8, characterized in that the at least one pulsating heat pipe (30) is closed by the heat sink (14) and / or the connection element (12).

10. Supporting device (10) according to one of Claims 1 to 9, characterized in that the supporting device (10) has a sensor (28) for sensing a physical variable of the at least one pulsating heat pipe (30) and / or of a component of the supporting device (10).

11. Supporting device (10) according to one of Claims 1 to 10, characterized in that the supporting device (10) has at the end (22) on the connection element side and / or at the end (24) on the heat sink side a recess by which an invaginated surface (42) provides a thermal coupling (43) to the connection element (12) from which heat is to be dissipated or to the heat sink (14).

12. Supporting device (10) according to Claim 11, characterized in that a coupling-in element (46) of a metal material is held in the recess which forms the invaginated surface (42) for the thermal coupling (43).

13. Supporting device (10) according to one of Claims 1 to 12, characterized in that the supporting device (10) is at least partially produced by an additive manufacturing process.

14. Power module (50), comprising a substrate with at least one electrically conductive connection element (12) from which heat is to be dissipated, wherein the connection element (12) is mounted such that it is supported on a heat sink (14) by a supporting device (10), characterized in that the supporting device (10) is formed according to one of Claims 1 to 13.

15. Computer program product (60), comprising commands which, when the computer program product (60) is executed by a computer, cause the computer to simulate operating behaviour of a supporting device (10) according to one of Claims 1 to 13.