Local coil for a magnetic resonance imaging system, as well as a magnetic resonance imaging system

Description

[0001] The invention relates to a local coil (LC) for a magnetic resonance imaging (MRI) system, which has a plate-like local coil body with a main extension plane and an electronic device within the local coil body, as well as an associated MRI system.

[0002] MRI systems are imaging devices that, to create images of a subject, align the nuclear spins of the subject with a strong external magnetic field and then excite them to precess around this alignment using an alternating magnetic field. The precession, or return, of the spins from this excited state to a lower-energy state, in turn generates an alternating magnetic field in response, also known as a magnetic resonance signal, which is received via antennas.

[0003] Using magnetic gradient fields, a spatial coding is imprinted on the signals, which subsequently allows the received signal to be assigned to a volume element. The received signal is then evaluated, and a three-dimensional imaging representation of the object under examination is provided. The generated representation indicates a spatial density distribution of the spins.

[0004] To improve the signal-to-noise ratio and accelerate image acquisition through parallel scanning, as many receiving antennas as possible are increasingly being arranged as close to the patient's body as possible in the form of a local coil matrix (LC). A cable connection is typically used to transmit the signals received in the LC or local coil matrix. However, the cables also act as antennas during the excitation pulse, so special safety measures such as standing wave barriers must be provided to avoid endangering the patient. The cables are also cumbersome to handle.

[0005] Therefore, wireless transmission of image and control signals between the MRI system and the LC is currently being considered. The electrical components used for this purpose in the LC require significantly more electrical power than those for wired LCs, resulting in significantly higher heat generation that must be dissipated. Document DE 10 2020 208232 A1 discloses that additional heating can occur during wireless generation of magnetic resonance signals.

[0006] For a future wireless LC, various digital processes are being considered, using digital components such as ADCs, FPGAs, and transceiver ICs. However, this creates a localized heat hotspot, as the digital components must be placed close together to prevent interference from longer digital signal / bus lines disrupting the LC's MR reception. However, the surface temperature of touchable surfaces in medical devices must not exceed 41°C. This is stipulated in the relevant standards. However, a suitable solution for a wireless LC that can meet the relevant standards does not exist.

[0007] The documents WO 2005 / 052621 A1 and US 2008 / 238424 A1 disclose local coils with a substrate and a printed circuit board on which electronic modules are arranged.

[0008] The invention is therefore based on the object of providing a local coil whose surface has a standard temperature during operation.

[0009] The problem is solved by the subject matter of the independent patent claims. Advantageous developments of the invention are described by the dependent patent claims, the following description, and the figures.

[0010] A first aspect of the invention provides a local coil for a magnetic resonance imaging system, comprising a plate-like local coil body with a main extension plane and an electronic device within the local coil body. According to the invention, the local coil comprises an electrically non-conductive heat-conducting body that is thermally conductively connected to the electronic device and configured in a plate-like manner within the local coil body to distribute heat from the electronic device in the main extension plane of the local coil body.

[0011] In particular, the local coil (LC) can be a wireless LC. This means that the LC can communicate wirelessly with an external device of the MRI system. For example, image signals and / or control signals can be transmitted via a bidirectional, wireless communication connection between the LC and the external device. In particular, this can be a digital communication connection.

[0012] The LC or a body of the LC, referred to here as the local coil former, is plate-shaped. In particular, this means that an extension perpendicular to the virtual main extension plane is significantly smaller than extensions parallel to the main extension plane. The plate-shaped body can have elevations, bulges, or the like, in which, for example, components of the LC can be accommodated. The local coil former, and thus also the main extension plane, can be curved, as well as have curves, waves, or the like. In particular, the LC can be adapted to the shape of the limbs, torso, or head of a human or animal.

[0013] The electronic device is arranged inside the local coil former. It can preferably be concentrated locally within the local coil former. The local concentration of the electronic device can generate heat during operation, which can lead to high temperatures.

[0014] For example, the electronic device may comprise a circuit board on which a plurality of electronic components may be mounted and electrically connected. For example, the electronic device may comprise an electronic communication device for wireless and digital communication with the external device. Furthermore, the electronic device may comprise an analog-digital converter (ADC), integrated circuits (IC), for example, an FPGA (Field Programmable Gate Array) or a transceiver IC, or the like. The electronic device may further comprise a control unit, a computing unit, an energy storage device, or the like.

[0015] The heat-conducting body is an electrical non-conductor or an electrical insulator. In particular, it can be provided that the heat-conducting body is completely non-magnetic and non-magnetizable. The heat-conducting body can preferably be made of a thermally conductive plastic, with the material or particles incorporated into the plastic being electrically non-conductive and non-magnetic. The heat-conducting body can be rigid or deformable.

[0016] The heat-conducting body is connected to the electronic device in a heat-conducting manner, in particular by contact, so that heat can preferably be dissipated from the electronic device via the heat-conducting body by means of thermal conduction. This ensures that a temperature on the surface of the local coil in a region of the electronic device does not exceed a predetermined limit.

[0017] The heat-conducting body is formed in a plate-like manner within the plate-like local coil former, preferably in the main extension plane of the local coil former. In particular, this means that an extension of the heat-conducting body perpendicular to the virtual main extension plane is significantly smaller than extensions parallel to the main extension plane. This ensures that the heat of the electronic device is distributed substantially in the main extension plane of the local coil former. As a result, the temperature of the surface of the local coil, in particular a top and bottom side of the local coil, in the region of the electronic device can be kept below a predetermined limit.

[0018] For example, the heat conducting body can be formed within a portion of the local coil body or substantially within the entire local coil body.

[0019] The invention provides the advantage that the temperature on the surface, especially in the area of ​​the electronic device, does not exceed the limit temperature, for example, 41 °C, during operation. Advantageously, the invention, particularly the optimized shape of the heat-conducting body, allows the heat to be distributed in the main plane of extension such that the temperature distribution on the surface of the local coil is uniform.

[0020] The invention also includes embodiments which provide additional advantages.

[0021] One embodiment provides for the electronic device to be enclosed by the heat-conducting body. The heat-conducting body can completely enclose the electronic device. Enclosed can be understood as the heat-conducting body surrounding the electronic device in contact. This has the advantage that the heat from the electronic device can be conducted exclusively into the heat-conducting body. Thus, the heat can be distributed more effectively and cannot otherwise penetrate to the surface.

[0022] One embodiment provides that the electronic device is arranged in a center of the heat-conducting body, viewed in the main extension plane. The center can, in particular, be a surface or a space around a geometric center point of the heat-conducting body in the main extension plane.

[0023] An arrangement of the electronic device in the extension perpendicular to the main extension plane is not limited by the arrangement in the center. Preferably, the electronic device can be arranged in a center of the heat-conducting body, viewed perpendicular to the main extension plane. The center can in particular be a surface or a space around a geometric center of the heat-conducting body perpendicular to the main extension plane. Alternatively, the heat-conducting body can be arranged offset from the center.

[0024] The central arrangement has the advantage of allowing even heat distribution. In particular, the heat is distributed evenly in opposite directions along the main plane of extension.

[0025] One embodiment provides for the heat-conducting body to be disc-shaped in the main extension plane. Preferably, the height of the heat-conducting body decreases perpendicular to the main extension plane, away from the center.

[0026] In particular, the height of the heat-conducting body can initially be constant in the area of ​​the electronic device and only then decrease towards the outside. The heat-conducting body is essentially tapered towards the outside.

[0027] The shape of the heat sink is ideal for optimal heat flow in the main plane of the LC. This allows the heat to be evenly distributed throughout the plane. In particular, a descending temperature gradient can be formed perpendicular to the main plane of the LC, allowing heat to radiate evenly across the entire surface of the LC.

[0028] One embodiment provides that the local coil has a thermal insulation layer that at least partially encloses the heat-conducting body.

[0029] In particular, the thermal insulation layer can be formed on the top and / or bottom of the LC. For example, the heat-conducting body can be formed entirely within the thermal insulation layer, with the thermal insulation layer completely enveloping the heat-conducting body. This advantageously ensures that the temperature at the surface does not rise above the specified temperature limit. In particular, the thermal insulation layer can be of uniform thickness. Preferably, the thermal insulation layer can be just thick enough to ensure that the temperature is evenly distributed across the surface and remains below the temperature limit.

[0030] In particular, the thermal insulation layer is electrically non-conductive and non-magnetic. Advantageously, the thermal insulation layer has no influence on the MRI. For example, the thermal insulation layer comprises an insulating material.

[0031] One embodiment provides that a thickness of the thermal insulation layer decreases perpendicular to the main extension plane away from the center of the heat conducting body.

[0032] The thickness is therefore defined in a direction perpendicular to the main plane of extension. Particularly in the center of the heat-conducting body, where the electronic device can preferably be located, the thickness of the thermal insulation layer can be comparatively thicker. This has the advantage that, in the area where heat is generated, the surface of the LC perpendicular to the main plane of extension is most shielded. As a result, the heat flow is essentially directed along the main plane of extension and evenly distributed within it. This allows a particularly advantageous uniform temperature distribution on the surface of the LC below the temperature limit.

[0033] One embodiment provides that the heat-conducting body is thicker below the electronic device than above the electronic device. In particular, a portion of the heat-conducting body directed toward the bottom is thicker than a portion directed toward the top.

[0034] Preferably, the underside can be designed to contact the human body, while the upper side can be surrounded by air. The asymmetrical distribution of the heat-conducting body, viewed perpendicular to the main plane of extension, allows heat to be directed specifically to the upper side, allowing the heat to radiate through the upper surface and / or convectively transfer into the air. This also has the advantage that heat does not accumulate on the underside, preventing excessive temperatures from developing on the underside surface that may contact the human body.

[0035] Preferably, the insulation layer can be thicker on the underside, so that heat flow through the surface on the underside is reduced compared to the top. This can prevent overheating of the underside.

[0036] One embodiment provides that the heat conducting body has a hinge which is designed to adjust an angle in the heat conducting body.

[0037] The LC should preferably be designed to adapt to or conform to a human body shape, such as a torso, an arm, a head, or the like. To achieve this, the local coil body must be flexible to allow for its shape adjustment. Especially with a rigid heat-conducting body, this flexibility can be reduced as the heat-conducting body increases in size. To ensure the flexibility of the LC, the heat-conducting body has a hinge, or at least one hinge, or several hinges.

[0038] Using the hinge, the angle in the main extension plane of the heat-conducting body, and thus in the LC, can be adjusted. This allows the LC to be optimally adapted to the human body.

[0039] One embodiment provides that the hinge has a locking device which is designed to fix the angle.

[0040] In particular, the locking device allows the hinge to be locked or secured in steps or continuously. This advantageously ensures that a shape of the flexible LC can be permanently adjusted and thus does not change during operation.

[0041] One embodiment provides that the heat-conducting body is deformable. In particular, a material of the heat-conducting body can be deformable. In particular, the heat-conducting body can be deformable under normal conditions, ie, at room temperature.

[0042] Deformable means that the heat-conducting body is flexible, like a rubber. In particular, the heat-conducting body can be elastically deformable up to a certain limit. Furthermore, the heat-conducting body can be plastically deformable. In particular, the heat-conducting body can comprise a deformable plastic, for example, a compound made of thermoplastic elastomers (TPE).

[0043] One embodiment provides that the local coil former has at least two sections movably connected to one another. In particular, a plurality of sections of the local coil former can be movably connected to one another and formed substantially adjacent to one another in the main extension plane. For example, an electronic device and / or a heat-conducting body can be formed in each of the sections, so that the LC can comprise at least two electronic devices and / or at least two heat-conducting bodies.

[0044] The heat-conducting body is preferably formed over several sections. For example, the heat-conducting body has hinges and / or is deformable, ensuring mobility between the sections. In particular, a heat-conducting body can absorb the heat from several electronic devices, one per section, and distribute it in the main extension plane.

[0045] One embodiment provides that the electronic device has a housing, wherein within the housing the electronic device has a circuit board with an electronic component.

[0046] In particular, the electronic components on the circuit board are concentrated in the housing, reducing magnetic interaction with the MRI system. The electronic components, which include, for example, the ADC, ICs, the control unit, the computing unit, an energy storage device, or the like, can be enclosed within the housing, which distributes heat evenly throughout the housing.

[0047] The housing can preferably be made of a thermally conductive, electrically non-conductive material, thereby particularly advantageously transferring the heat from the electronic device to the heat-conducting body. Preferably, the housing can be at least partially or completely surrounded by the heat-conducting body. The heat can thus be advantageously transferred to the heat-conducting body via the housing.

[0048] One embodiment provides for the housing to be glued to the heat-conducting body. For example, the housing can be glued to the heat-conducting body using an adhesive layer between the housing and the heat-conducting body. Such a connection between the housing and a rigid heat-conducting body can be particularly advantageous. The adhesive layer can be particularly thermally conductive, such as a thermal paste. This can advantageously ensure that the heat flow from the housing to the heat-conducting body is particularly effective.

[0049] One embodiment provides that the housing is connected to the heat-conducting body by means of a clamp connection.

[0050] In particular, the housing may be rigid and the heat-conducting element may be rubber-like and flexible, so that an adhesive connection would not provide a permanent hold. A mechanical connection in the form of a clamp connection may be particularly advantageous for this purpose. The clamp connection comprises, in particular, electrically non-conductive components.

[0051] For example, the clamping connection can comprise a first plate and a second plate. The movable, plate-like heat-conducting element can be located between the first and second plates. The plates essentially sandwich the heat-conducting element on both sides.

[0052] The first plate can be firmly connected to the housing, for example, by screwing, or be part of the housing. The second plate can be firmly connected to the first plate, for example, by screwing, via one or more spacers. The spacers can, in particular, form a gap perpendicular to the main extension plane, wherein the heat-conducting body can be clamped or pressed into the gap. Such a connection has the advantage that a firm and permanent connection can be ensured even with a movable heat-conducting body.

[0053] A second aspect of the invention provides a magnetic resonance imaging (MRI) system. The MRI system comprises at least the local coil according to the invention.

[0054] The figures show: FIG 1 shows a schematic representation of a section of a local coil according to the invention in accordance with a preferred embodiment; FIG 2 shows a schematic representation of a section of a heat-conducting body with a hinge; FIG 3 shows a schematic representation of a section of a local coil according to the invention in a straight-angled state; FIG 4 shows a schematic representation of a section of a local coil according to the invention in an angled state; FIG 5 shows a schematic representation of a section of a local coil according to the invention in accordance with a further preferred embodiment; FIG 6 shows a schematic representation of a section of a local coil according to the invention on a human body; FIG 7 shows a schematic representation of a magnetic resonance imaging system according to the invention in accordance with an exemplary embodiment.

[0055] The exemplary embodiment explained below is a preferred embodiment of the invention. In the exemplary embodiment, the described components of the embodiment each represent individual, independently considered features of the invention, which also further develop the invention independently of one another and are thus also to be considered as components of the invention, either individually or in a combination other than that shown.

[0056] Furthermore, the described embodiment can also be supplemented by further features of the invention already described. In the figures, identical reference numerals designate functionally identical elements.

[0057] In FIG 1 A schematic representation of a section of a local coil (LC) 1 according to the invention is shown according to a preferred embodiment. The LC 1 has a plate-like local coil former 10 with a main extension plane E, as well as an electronic device 4 within the local coil former 10. According to the invention, the LC 1 has an electrically non-conductive heat-conducting body 3, which is thermally conductively connected to the electronic device 4 and formed in a plate-like manner within the local coil former 10 in order to distribute heat from the electronic device 4 in the main extension plane E of the local coil former 10.

[0058] The electronic device 4 can have a housing 9, which compactly encloses a circuit board 11 and electronic components 12. Preferably, the electronic device 4 or the electronic components 12 are compactly installed in a single unit so that the magnetic resonance (MR) reception of the LC 1 is not disrupted by interference signals from longer digital signal / bus lines between the components 12 or on the circuit board 11.

[0059] In particular, the electronic device 4 can have electronic components 12 for wireless connection to an MRI system 2, such as an ADC, FPGAs, and transceiver ICs. Such components 12 require much higher power compared to wired LCs, in particular by a factor of approximately 10, for example, an increased power from 0.5 watts to 5 watts. This increased power is largely converted into heat, so that the temperature of the electronic device 4 increases during active operation. The circuit board 11 can be connected, in particular for signal transmission, to a coil section 14 of the LC 1, by means of which MR signals can be received. The received MR signal can be processed accordingly by the electronic device 4 and transmitted wirelessly to the MRI system 2. In particular, the LC 1 can have a plurality of coil sections 14 that extend substantially parallel to the main extension plane E.

[0060] In the example shown, the electronic device 4, in particular the housing 9, is completely enclosed by the heat-conducting body 3, so that the housing 9 is located inside the heat-conducting body 3. The housing 9 is, in particular, non-magnetic or non-magnetizable, but made of a thermally conductive material. The housing 9 is preferably connected to the heat-conducting body 3 in a thermally conductive manner, so that a heat flow 16 of the heat generated by the electronic device can be dissipated particularly effectively. The housing 9 can, for example, be glued to the heat-conducting body 3.

[0061] The heat-conducting body 3 is, in particular, non-magnetic or non-magnetizable to avoid interfering with the MR signal. For example, the heat-conducting body 3 comprises a thermally conductive plastic, preferably without metallic particles. The heat-conducting body 3 can be rigid or deformable.

[0062] The heat-conducting body 3 can be formed in a first, plate-like section 7 of the LC 1. A further heat-conducting body 3 can be formed in a second, plate-like section 8, within which a further electronic device can be enclosed. The first section 7 and the second section 8 can be movably connected to one another, in particular via a flexible connection 15, so that the LC 1 can be flexibly adapted to a human body.

[0063] In particular, the electronic device 4 can be arranged at a center M of the heat-conducting body. The center M can be understood, in particular, as a central region in the main extension plane E. Thus, the heat flow 16 can spread optimally in all directions in the main extension plane E.

[0064] The heat-conducting body 3 has, in particular, a height H that extends perpendicular to the main extension plane E. The height H is designed to be substantially smaller than the dimensions of the heat-conducting body 3 in the main extension plane E. The height H can be variable, in particular, along the main extension plane E. Preferably, the height H decreases away from the center M, so that the heat-conducting body 3 can be designed in a disc-like manner. In the center M, in which the electronic device 4 can be formed, the height H can be substantially constant.

[0065] Due to the special shape of the heat conducting body 3 according to this exemplary embodiment, the heat flow 16 can be distributed particularly favorably in the main extension plane E. The arrows showing the heat flow 16 are merely shown schematically. The heat can be distributed over the entire heat conducting body 3. In particular, the heat conducting body 3 can be higher in the center M to enable a greater heat flow 16. Away from the center M, the height H becomes increasingly smaller, since the heat flow 16 is also reduced by heat dissipation via a surface 17 of the LC 1. In particular, the heat can be radiated via the surface 17 and / or dissipated to the environment.

[0066] Due to the favored, uniform distribution of heat in the heat-conducting body 3, a temperature can be evenly distributed on the surface 17. In particular, the LC 1 according to the invention can ensure that the temperature on the surface 17, particularly concentrated at a temperature hot spot in the center M, does not exceed a predetermined temperature limit.

[0067] The effect of even heat distribution can be supported in particular by a thermal insulation layer 5 of the LC 1, which at least partially surrounds the heat-conducting body 3, in particular on the bottom and / or top. The thermal insulation layer 5 can, for example, comprise a heat-insulating foam.

[0068] Preferably, the thermal insulation layer 5 can be formed at the center M, thus promoting heat flow along the main extension plane. This ensures that the temperature at the center M, i.e., where the heat is generated, remains below the temperature limit on the surface.

[0069] Preferably, the thermal insulation layer 5 can completely enclose the heat-conducting body 3. In particular, the thermal insulation layer 5 can have a thickness D that varies along the main extension plane E perpendicular to the main extension plane E. Preferably, the thickness D can decrease away from the center M of the heat-conducting body 3, so that the effect of heat distribution in the main extension plane E is further promoted.

[0070] For example, an underside 18 of the LC 1, in particular the surface 17 of the underside 18, can be intended to come into contact with the human body during operation. For example, an upper side 19 of the LC 1, in particular the surface 17 of the upper side 19, can be intended to be surrounded by air during operation. Consequently, it may be desirable for the heat conducting body to be higher on the upper side 19 than on the underside 18, so that the heat is preferentially directed to the upper side 19. Thus, the heat is directed away from the human body towards the ambient air, so that the heat does not build up on the human body but can be dissipated via the ambient air. This effect can be supported, for example, by the insulation layer 5 being thicker on the underside 18 than on the upper side 19.

[0071] FIG 2 shows a schematic representation of a section of the heat conducting body 3 with a hinge 6. By means of the hinge 6, for example, an angle α can be set in the main extension plane E. An adjustment axis of the hinge 6 accordingly preferably runs in the main extension plane E. The hinge 6 can in particular be formed from the same material as the heat conducting body 6 and thus conduct heat favorably.

[0072] In FIG 3 A schematic representation of a section of the LC 1 is shown, with the heat-conducting body 3 showing the hinge 6 in a straight-angled state. The angle α can be exactly or approximately 180°. For example, the angle α can be set using a locking device (not shown), in particular in steps or continuously.

[0073] In the example shown, the electronic device 4 can be arranged on the heat-conducting body 3. For example, the electronic device 4 can be enclosed by the thermal insulation layer 5, so that the heat is directed only on one side from the electronic device 4 into the heat-conducting body 3.

[0074] FIG 4 shows a schematic representation of a section of the LC 1, with the heat-conducting body 3 showing the hinge 6 in an angled state. For example, the angle α corresponds to an angle of approximately 140°, so that the LC 1 can be attached to a fuselage or the like, for example.

[0075] In FIG 5 A schematic representation of one of the LC 1 is shown, wherein a heat-conducting body 3 comprising a movable plastic 20 and a heat-conducting body 3 comprising a rigid plastic 21 are shown. The movable plastic 20 can be understood in particular as a rubber-like, flexible plastic and / or an elastically and / or plastically deformable plastic, for example a compound made of thermoplastic elastomers (TPE). In the example shown, the rigid plastic 21 encloses the housing 9 of the electronic device 4. A clamp connection 13 can be provided to connect the rigid plastic 21 to the movable plastic 20.

[0076] The clamping connection 13 can comprise a first plate 30 and a second plate 31. For example, the movable, plate-like heat-conducting body 3, 20 can be located between the first plate 30 and the second plate 31. The plates 30, 31 essentially sandwich the heat-conducting body 3, 20 on the top and bottom.

[0077] The first plate 30 can be firmly connected to the rigid plastic 21, for example, glued or screwed. The second plate 31 can be firmly connected to the first plate 30, for example, via one or more spacers 32, for example, screwed. The spacers 32 can, in particular, form a distance perpendicular to the main extension plane E, wherein the heat-conducting body 3, 20 can be clamped or pressed within the distance. Such a connection has the advantage that a firm and permanent connection can be ensured even with a movable heat-conducting body 3, 20.

[0078] In FIG 6 is a schematic representation of a section of the LC 1 on the body of a patient 22. For example, the LC 1 rests against a torso 23 and two arms 24 of the patient 22, with the patient 22 lying on a patient couch 25. The heat-conducting body 3 made of movable plastic 20 can extend along the main extension plane E and over several sections 7, 8 of the local coil body 10 of the LC 1. The local coil body 10 can, for example, be designed to conform to the patient 22 due to the movable heat-conducting body 3, 20.

[0079] For example, each of the sections 7, 8 has an electronic device 4 with a housing 9, which is connected to the heat-conducting body 3, 20, for example by means of the clamping device 13 (not shown).

[0080] FIG 7shows a schematic representation of an MRI system 2 according to the invention according to an exemplary embodiment. The MRI system 2 can comprise the LC 1 according to the invention. Furthermore, the MRI system 2 can comprise a magnet unit 26 and a control device 27 with a transmitting and receiving module 28.

[0081] In a patient tunnel 29 of the magnet unit 26, for example, the patient 22 lies on the patient couch 25, with the LC 1 lying on the torso of the patient 22. The LC 1 can, in particular, not have any connecting cables to devices external to the LC. The LC 1 can, in particular, be connected via a wireless connection to the control device 27, in particular to the transmitting and receiving module 28, via which image and / or control signals can be transmitted. A wireless LC 1 requires significantly higher power than a wired LC, so that the power converted into heat is distributed by the heat-conducting body 3 according to the invention.

[0082] Overall, the invention shows a possibility for heat dissipation for wireless MRI local coils.

Claims

1. Local coil (1) for a magnetic resonance tomography system (2), having a plate-shaped local coil body (10) with a main extension plane (E), and an electronic apparatus (4) within the local coil body (10), characterised by - an electrically non-conducting heat sink body (3), which is linked for conduction of heat to the electronic apparatus (4) and is embodied as a type of plate within the local coil body (10), in order to distribute heat of the electronic apparatus (4) in the main extension plane (E) of the local coil body (10).

2. Local coil (1) according to claim 1, characterised in that the electronic apparatus (4) is enclosed by the heat sink body (3).

3. Local coil (1) according to claim 1 or 2, characterised in that the electronic apparatus (4), viewed in the main extension plane (E), is arranged in the middle (M) of the heat sink body (3).

4. Local coil (1) according to claim 3, characterised in that a height (H) of the heat sink body (3) at right angles to the main extension plane (E) reduces from the middle (M) outwards, wherein in particular the heat sink body (3) is embodied in a disc shape in the main extension plane (E).

5. Local coil (1) according to one of the preceding claims, characterised by a heat insulation layer (5), which at least partly encloses the heat sink body (3).

6. Local coil (1) according to claim 3 or 4 and claim 5, characterised in that a thickness (D) of the heat insulation layer (5) at right angles to the main extension plane (E) reduces from the middle (M) of the heat sink body (3) outwards.

7. Local coil (1) according to one of the preceding claims, characterised in that the heat sink body (3) is thicker below the electronic apparatus (4) than it is above the electronic apparatus (4).

8. Local coil (1) according to one of the preceding claims, characterised in that the heat sink body (3) has a hinge (6), which is embodied to adjust an angle (α) in the heat sink body (3).

9. Local coil (1) according to claim 8, characterised in that the hinge (6) has a latching apparatus, which is embodied to fix the angle (α).

10. Local coil (1) according to one of claims 1 to 7, characterised in that the heat sink body (3) is deformable.

11. Local coil (1) according to one of claims 8 to 10, characterised in that the local coil body (10) has at least two sections (7, 8) connected movably to one another, wherein the heat sink body (3) is embodied extending over the at least two sections (7, 8).

12. Local coil (1) according to one of the preceding claims, characterised in that the electronic apparatus (4) has a housing (9), wherein within the housing (9) the electronic apparatus (4) has a circuit board (11) with an electronic component (12).

13. Local coil (1) according to claim 12, characterised in that the housing (9) is glued to the heat sink body (3).

14. Local coil (1) according to claim 12 or 13, characterised in that the housing (9) is connected to the heat sink body (3) by means of a clamp connection (13).

15. Magnetic resonance tomography system (2), comprising a local coil (1) according to one of the preceding claims.