Ignition component of a LE-EFI ignition module

Description

[0001] The invention relates to an EFI ignition component (EFI: exploding foil initiator) of an EFI ignition module.

[0002] EP 2 549 220 A1 discloses an EFI ignition module comprising an ignition circuit with a capacitor, a switching element, and an EFI ignition component. The capacitor is discharged to ignite the EFI component by closing the switching element, the switching element being a SiC field-effect transistor. The central component is an EFI ignition component comprising a conductive element designed as an ignition bridge. A capacitor located in the ignition circuit is discharged via this conductive element for ignition, resulting in the bridge, which has a width of a few micrometers, for example, in the range between 100 and 300 micrometers, suddenly evaporating, resulting in the formation of plasma. A foil, for example, made of Kapton, is located above the bridge, from which a part, the so-called "flyer," is blown out as a result of the bridge evaporation.The flyer is extremely accelerated by the conversion of electrical energy into kinetic energy, moving at a speed in the range of km / s. The flyer is ejected by a barrel, a spacer with a hole, downstream of the foil. Downstream of the barrel is an explosive pellet, which is detonated by the shock wave when the extremely fast flyer hits. The structure and basic function of such an EFI ignition component are well known.

[0003] An integrated circuit initiator device is known from US 2018 / 0 172 410 A1. This device comprises a circuit substrate provided with an electrically insulating layer; an electrically conductive bridge circuit deposited on the insulating layer; the bridge circuit being structured as contact regions and a bridge structure connecting the contact regions, the bridge structure being configured to form a plasma when the bridge structure is melted by an initiator circuit contacting the contact regions; and a polymer layer applied to the bridge structure by spin coating to form a flyer that is ejected from the substrate.

[0004] US Pat. No. 6,752,083 B1 discloses a detonator for use with explosive devices. This detonator comprises a support structure, a foil detonator attached to the support structure, and a cylinder attached to the support structure and adjacent to the foil detonator. The support structure may include a flexible cable. An explosive is placed near the foil detonator.

[0005] The object of the present invention is to propose improvements with respect to such an EFI ignition component.

[0006] The object is achieved by an EFI ignition component according to patent claim 1. Preferred or advantageous embodiments of the invention as well as other categories of invention emerge from the further claims, the following description and the attached figures.

[0007] The EFI ignition component contains a solid, hard, and relatively mechanically stable substrate. Materials such as glass (float glass), silicon, or ceramic can be used. A suitable hardness is that of ceramic. Typical hardness values ​​for ceramics are 20 GPa (Vickers hardness HV10). The substrate has a surface. The substrate is designed to be electrically highly impedant, at least with regard to its surface. The substrate material thickness is preferably at least 100 µm, particularly preferably at least 200 µm, to avoid interference from pressure waves during implementation in the bridge structure. Particularly reliable implementations of the design variants are achieved starting at 500 µm.

[0008] The EFI ignition component contains a metal layer applied directly to the surface without any gaps or cavities. During production, the corresponding metal layer is applied to the surface without any gaps or cavities. There are therefore no cavities or less dense areas (gaps, cavities, hollows, etc.) either within the metal layer or between the substrate and the metal layer. Thus, there are no air / vacuum spaces that would absorb pressure during evaporation of the ignition bridge, which would then be lost as energy for accelerating the flyer. The energy available from the evaporation is thus fully transferred to the flyer and its mechanical acceleration. The thickness of the metal layer is preferably 3 µm to 10 µm.

[0009] The metal layer is formed as a bridge structure: the bridge structure contains two electrical connection areas. Each of the connection areas has a respective contact surface. Each of the contact surfaces serves to electrically contact the electrical connection area and thus to apply a voltage difference or to cause a current flow between the two connection areas via the ignition bridge as follows: The bridge structure also contains an ignition bridge located between the connection areas. By energizing the ignition bridge via the contact surfaces and connection areas, the ignition bridge can be vaporized by converting the electrical power supplied via the contact surfaces / connection areas within the ignition bridge. The side lengths of the ignition bridge (18) are preferably between 100 µm and 350 µm.

[0010] The metal layer can either be applied to the surface in the form of the final bridge structure or the metal layer can be applied over a larger area and then brought to the final shape of the bridge structure by removing parts of the metal layer.

[0011] The EFI ignition component also contains a plastic layer applied directly to the metal layer and, if applicable, directly to the surface. During production, the plastic layer is applied to the metal layer or surface. The plastic layer serves to form the flyer (during operation or upon triggering, i.e., upon evaporation of the ignition bridge), and is therefore designed to form the flyer. In other words, the flyer is blasted out of the plastic layer as part of the ignition bridge by the explosive evaporation of the latter. The plastic layer is solid, just like the substrate (see the explanations below). The plastic layer is mechanically comparatively unstable, relative to and in contrast to the substrate (see the explanations below). The plastic layer covers at least the ignition bridge and an area surrounding the ignition bridge.

[0012] After its application, the plastic layer is post-treated with a tempering treatment, whereby the tempering treatment / tempering represents a bonding process. During the production of the ignition component, the plastic layer or the entire ignition component is tempered in its respective manufacturing state. This post-treatment not only gives the plastic layer the aforementioned strength but also, if necessary, increases its adhesion to the metal layer / bridge structure as well as to the substrate or its surface.

[0013] The thickness of the plastic layer is preferably 5 µm to 30 µm.

[0014] The terms "solid" or "hard" in this case are to be understood in relation to the properties of a foil of a conventional EFI ignition component known from practice or the state of the art (as explained above). The corresponding foil is flexible and mechanically comparatively less stable and therefore offers comparatively less mechanical resistance to the resulting "explosion pressure" when the ignition bridge evaporates than the substrate. Due to the substrate, which is more rigid and therefore more stable than a foil, and the plastic layer, improved insulation is achieved between the substrate and the plastic layer when the ignition bridge evaporates ("explodes") compared to the aforementioned state of the art. The resulting plasma pressure reaches higher values ​​before the flyer is blasted out of the plastic layer. This leads to increased kinetic energy of the flyer after it is blasted off. In other words, fewer orVirtually no energy losses; almost all of the kinetic energy generated during the vaporization of the ignition bridge is transferred to the flyer. Therefore, to achieve the same flyer speed as the current state of the art, the current proposal requires the supply of less electrical energy to the ignition bridge. The ignition bridge can be vaporized with a lower voltage / current.

[0015] The terms "relatively stable" (substrate) and "relatively unstable" (plastic layer) refer to their relationship to each other. The substrate is therefore mechanically significantly more stable or stronger than the plastic layer. This is achieved, for example, by making the substrate at least 5, 10, or 20 times thicker than the plastic layer. Furthermore, this is achieved by the substrate material significantly exceeding the strength and / or hardness of plastic in terms of its strength and / or hardness. The hardness of the ceramic is on the order of 20 GPa (Vickers hardness VH10, DIN EN 843-4) compared to the significantly softer hardness of plastic in the order of 200 MPa (ball indentation hardness ISO 2039-1). This difference in stability serves to ensure that the structure enclosing the ignition bridge (substrate and plastic layer) cannot break in one direction only, namely at the plastic layer.The substrate, in contrast, represents a comparative "anvil," serving as a mechanically solid or stable base for the ignition bridge and the plastic layer. As a result, energy input from the evaporation of the ignition bridge occurs practically exclusively in the flyer. The ignition energy (the electrical energy supplied to the ignition bridge) is thus transferred to the kinetic energy of the flyer with virtually no loss.

[0016] "Surface" is understood as follows: only that part of the outer surface of the substrate on which the bridge structure and plastic layer are arranged is considered. The substrate is typically designed as a plate or block. In this case, the surface refers to a flat side on which the metal layer and the plastic layer are applied.

[0017] The term "high-resistance, at least with respect to the surface" is to be understood as follows: the metal layer or bridge structure is electrically insulated from the substrate, at least in the area of ​​the surface. This can be achieved, for example, by an insulating layer on the substrate's surface. Alternatively or additionally, the substrate itself can also be designed to be high-resistance throughout, in particular entirely. In this case, its surface is automatically high-resistance for the metal layer lying on it. "High-resistance" is to be understood in particular as a specific electrical resistance of the material in question greater than 10,000 ohm cm.

[0018] In particular, the connection areas (seen in the direction of the surface extension) have a comparatively large area compared to the area of ​​the ignition bridge. The area is, in particular, the largest transverse area of ​​the structure in question in a specific direction or an average area in various directions parallel to the surface. The area of ​​the ignition bridge is, for example, 100-300 µm, while the area of ​​the connection areas is, for example, 1000-5000 µm. The contact area, in particular, occupies an area of ​​at least 50% or at least 75% of the surface.

[0019] From a circuit technology perspective, this results in a direct electrical series connection of the first contact surface or first connection area, ignition bridge, and the second connection area with its second contact surface without the need for any other elements in between.

[0020] The term "plastic layer optionally on the substrate" is to be understood as meaning that this applies to the case where the surrounding area of ​​the ignition bridge does not extend completely over the metal layer. The plastic layer then covers both parts of the metal layer and parts of the substrate surface. In particular, the plastic layer is actually partially applied both directly to the metal layer and, with regard to its remaining part, also directly to the substrate surface. The "direct" coating means that there are no further intermediate layers between the surface, the metal layer, and the plastic layer.

[0021] "Covering" means that the plastic layer extends beyond the ignition bridge on all sides, parallel to the surface, so that the relevant surrounding area extends beyond it by a projection of at least 20%, 50%, or 100% of the ignition bridge's extent, for example. The plastic layer thus adheres to the respective substrate (metal layer or surface) in the area surrounding the ignition bridge. This achieves good insulation of the ignition bridge, i.e., the plastic layer is sufficiently firmly attached to the metal layer / surface to build up sufficient pressure when the ignition bridge evaporates, in turn blasting the flyer with high kinetic energy. In particular, the entire surface of the substrate (including the metal layer) is or will be coated with the plastic layer. Only the contact surfaces of the connection areas remain exposed or are subsequently exposed again by removing the plastic layer.

[0022] During the production of the ignition component, the plastic is either applied without gaps or voids, or, if necessary, is made free of gaps and voids by tempering the metal layer / surface. In either case, tempering solidifies, hardens, and mechanically stabilizes the plastic layer, and may also bond it more firmly to the metal layer.

[0023] The invention thus results in an LE-EFI ignition bridge (LE: low energy) or a corresponding LE-EFI ignition component. The LE-EFI ignition component represents a further development of the EFI ignition component, which can be ignited with significantly lower voltage and energy than a conventional EFI ignition component. The invention enables an in-line ignition device (EFI) to be ignited with less energy while maintaining the same safety, reliability, and timing precision. The problem with the conventional EFI, known from practice and the state of the art, with its ignition bridge is the high voltage and the associated ignition stage. (E=1 / 2*C*U 2< ) (E=energy, C=capacitance, U=voltage).

[0024] The so-called classic EFI is familiar from practical experience and the state of the art cited above. The ignition component used is a bridge incorporated into a plastic-copper flex, which, by applying sufficient energy, explosively accelerates a flyer. This flyer strikes a secondary explosive and detonates it.

[0025] The proposed LE-EFI ignition bridge / component uses a hard (solid and mechanically comparatively stable) carrier-base material (substrate) (the comparative hardness is particularly crucial; possible materials include (ceramic) glass, ceramic, etc.), on which the bridge structure is made of metal, particularly aluminum or copper. A plastic layer (particularly a polyimide layer) is applied over this, which (together with the substrate) serves to contain the resulting plasma and forms the flyer. Through an annealing process (essentially a "baking" of the plastic layer to the substrate), the structure (substrate, metal layer, plastic layer) is sufficiently firmly bonded together, thus further improving the insulation for the flyer formation. The proposed layer structures contrast with the classic EFI – the LE-EFI ignition component uses, in particular, an adhesive-free layer structure.

[0026] The proposed improved design allows the ignition component to be ignited at lower voltages and lower energy levels while maintaining at least the same level of safety. This allows the ignition electronics to be designed smaller and more cost-effectively.

[0027] The proposed solution enables the ignition bridge to be triggered with a low high voltage, specifically by applying only 1000V between the contact surfaces instead of 2.4kV. The proposed solution has low resistance and low inductance (reduced parasitic effects). This results in a higher current input into the bridge. The current input into the bridge occurs with almost no losses. The difference from the conventional EFI is that there are no manufacturing-related compressible and flexible layers; instead, the metal bridge structure is applied directly to a hard and incompressible substrate, e.g., glass, ceramic, etc. This carrier material (substrate) also serves as a kind of "anvil." In this context, an anvil is an object that is practically stationary relative to the converting mass (ignition bridge) and cannot move, either due to its installation, its relative mass, and / or its rigid structure.In practice, the "evaporation" of the bridge material represents a sudden change in the physical state, comparable to the decomposition of explosives. In explosive decomposition, the insulation is a crucial parameter and determines the amount of energy required. In a classic EFI, the energy flows in both directions (the structure of a classic EFI usually consists of a layer of foil, metal layer, foil, possibly with adhesive layers in between), because the insulation is missing due to the structure or, in this case, is improved.

[0028] Furthermore, the layers are bonded without gaps or cavities (particularly through a vacuum process during production), thus eliminating any voids that could lead to significant power losses during explosive processes. In addition, the bonding process of the plastic (particularly polyimide) ensures a rigid and hard material (plastic layer). This provides additional insulation for the ignition bridge and a clean breakout of the flyer.

[0029] The proposed LE-EFI ignition component is particularly suitable for use in, or results in, an LE-EFI ignition device and is the core of the ignition device. These ignition devices can be used in a variety of current and future electronic ignition and safety devices.

[0030] The invention is based, among other things, on the idea of ​​reducing the energy required to sufficiently accelerate the flyer, and achieving this by improving the insulation of the ignition bridge within the remaining structure of the ignition component. The corresponding energy is not the safety factor, but rather the specific signal that, and only that, enables ignition.

[0031] In a preferred embodiment, the substrate has an insulating layer forming the surface. The insulating layer at least contributes to the above-mentioned high resistance of the substrate (with regard to its surface) or actually brings about its corresponding high resistance. Such an insulating layer is particularly advantageous for substrates that are not inherently high-resistance. The insulating layer is, for example, silicon dioxide, which is present on silicon or is produced, for example, by targeted oxidation. For substrates in the form of ceramic, glass, etc., an insulating layer is generally not necessary, since these substrates already represent sufficient insulators in terms of volume to enable the metal layer to be implemented on them with sufficient electrical insulation.

[0032] In a preferred embodiment, the substrate is a semiconductor, glass, or ceramic. In principle, however, any material that is sufficiently electrically insulating for the current supply in the bridge structure and sufficiently hard and incompressible to provide adequate insulation in combination with the plastic layer is suitable.

[0033] Using ceramic instead of a semiconductor or glass further reduces the energy requirement, as it is assumed that ceramic is harder than a semiconductor or glass and thus the energy released when the ignition bridge evaporates is better focused on the flyer.

[0034] The invention is based, among other things, on the discovery of using metal as the bridge material instead of, for example, doped silicon, which is known from practice. Metal exhibits a significantly lower electrical resistivity than highly doped silicon, which increases the energy efficiency of the ignition component. A correspondingly high doping of silicon also requires a long doping period, for example, in the range of several months, e.g., nine months. Experiments or tests with various changes to the shape of the bridge structure may therefore require development cycles of several months, since appropriately shaped silicon must first be doped again for months. This disadvantage is avoided when using metal as the bridge material.

[0035] In a preferred embodiment, the metal of the metal layer is aluminum or copper, or the metal layer contains such components as metal. However, other suitable metals, such as gold or silver, are also conceivable here.

[0036] In a preferred embodiment, the plastic of the plastic layer is polyimide or parylene, or the plastic layer contains a corresponding component as a plastic. The layer thickness of the plastic layer can be between 3 µm and 30 µm.

[0037] The materials mentioned for substrate, metal and plastic have proven to be particularly suitable in practice.

[0038] In a preferred embodiment, the EFI ignition component is constructed or manufactured without adhesive. Adhesive is typically used in ignition components known from practice. Gaps / bubbles, comparable to cavities, in the adhesive or between the adhesive and the material to be bonded are often unavoidable and reduce the proportion of energy generated by the evaporation of the ignition bridge that is transferred to the flyer. Therefore, a process is used in the manufacture of the ignition component that does not require the use of adhesive. In other words, the metal layer and plastic layer are applied and affixed to the corresponding substrates without the use of adhesive.

[0039] The object of the invention is also achieved by a method according to claim 7. The method serves to produce the EFI ignition component proposed above. In the method, the substrate having the surface is provided. The metal layer is applied directly to the surface, at least over the circumference of the bridge structure, without gaps or cavities. In other words, only the bridge structure is applied, or additional metal is applied and later removed (before, during, or after the further process steps explained below), so that only after removal does the bridge structure remain in its final form.

[0040] The plastic layer is then applied to at least the ignition bridge and its surrounding area, directly on top of the metal layer. If necessary (as explained above), a portion of the plastic layer is also applied to the surface. Here, too, either the plastic layer is applied in its intended final shape, or more plastic is first applied, which is subsequently removed until the intended final shape of the plastic layer is achieved.

[0041] After its application, the plastic layer is post-treated with a tempering treatment, i.e. annealed or baked.

[0042] The method and at least some of its possible embodiments as well as the respective advantages have already been explained in connection with the EFI ignition component according to the invention.

[0043] The plastic layer is applied to its final thickness. Therefore, no further height reduction of the plastic layer occurs. At most, only the contour of the plastic layer is corrected by removing plastic from the sides.

[0044] In a preferred embodiment, the metal layer is applied to the substrate or its surface in an oversized manner relative to the bridge structure and subsequently removed toward the bridge structure. The oversized metal layer is subsequently structured, particularly chemically, by laser ablation, etching, etc., to achieve its final form as a bridge structure.

[0045] In a preferred embodiment, the plastic layer is applied in an oversized manner to the metal or metal layer and, if appropriate, to the substrate or its surface, with respect to a desired final shape (reference is the finished ignition component). It is subsequently removed to the desired shape (final shape in the finished EFI ignition component). In particular, at least a portion of the contact surfaces is coated with a plastic layer, which is later removed again to free the entire contact surfaces of plastic and make them accessible for electrical contact.

[0046] In a preferred variant of this embodiment, the plastic layer is applied in an oversized layer to the entire metal layer and the entire remaining surface of the substrate. The entire surface of the substrate is thus covered with plastic. "Surface" here refers, in particular, to a component side of the substrate on which the ignition bridge is located, in particular a flat side of the substrate. In particular, the entire surface (entire substrate surface and applied metal layer) is coated with the plastic layer; in particular, only the contact surfaces are subsequently freed of plastic.

[0047] According to the invention, the metal layer is applied to the surface by vapor deposition, free of gaps and cavities. Vapor deposition can achieve a particularly good level of freedom from gaps and cavities.

[0048] In a preferred embodiment, the plastic layer is applied to the metal layer and, if applicable, to the surface by spin coating, without gaps or cavities. Spin coating involves dripping plastic, the material of the plastic layer, onto a rotating substrate. Spin coating is particularly effective at achieving a gap- and cavity-free finish. Alternatively, spray coating, dip coating, or CVD (chemical vapor deposition) can be used.

[0049] In a preferred embodiment, at least the application of the metal layer and the plastic layer and the tempering process take place under vacuum. Such a vacuum process promotes, achieves, and ensures the absence of gaps and cavities particularly well. In particular, the vacuum is maintained uninterrupted between the individual sub-steps of metallization, plastic application, and tempering. In particular, the entire production of the EFI ignition component takes place under vacuum.

[0050] In a preferred embodiment, at least the metal layer and the plastic layer are applied without the use of adhesive, as already mentioned above. In particular, the entire production of the EFI ignition component takes place without the use of adhesive.

[0051] Further features, effects, and advantages of the invention will become apparent from the following description of a preferred embodiment of the invention and the accompanying figures. A schematic diagram shows: Figure 1 shows an EFI ignition component according to the invention in a perspective view.

[0052] Figure 1 shows an EFI ignition component 2. This contains a solid and mechanically comparatively stable substrate 4. The substrate 4 has a flat cuboid or plate shape. Figure 1The upper flat side of the substrate 4 has a surface 6. The substrate 4 contains an insulating layer 8 forming its surface 6. The substrate 4 has a specific electrical resistance of more than 10,000 ohm cm. The insulating layer 8 has an even higher specific electrical resistance than the substrate 4. With respect to the surface 6, the substrate 4 is therefore designed to be electrically highly resistive.

[0053] A metal layer 10 is applied directly to surface 6, i.e., without any other materials in between. The metal in this case is aluminum. The metal layer 10 was applied by vapor deposition without any gaps or cavities. Therefore, there are no air bubbles, cavities, or cavities between surface 6 and metal layer 10, nor within the metal layer 10.

[0054] The metal layer 10 is formed as a bridge structure 12 (indicated by hatching) in an approximately H-shape. The bridge structure 12 consists of two, here rectangular, electrical connection regions 14, each having a contact surface 16 (indicated here only by dashed lines), also rectangular, and a likewise rectangular ignition bridge 18. The contact surfaces 16 are merely specific surface sections of the connection regions 14, but do not differ from the latter or are formed integrally with them. The ignition bridge 18, which is also formed integrally with them, connects the two connection regions 14 to one another in the form of a series circuit. The connection regions 14 have a transverse extent 20 (indicated by a double arrow) of 5 mm in this case - measured in the diagonal direction as an example - and the ignition bridge has a transverse extent 20 of 0.2 mm. The transverse extent 20 is viewed parallel to the surface 6.

[0055] By applying a voltage of 1000V here or by passing a current that occurs in the aluminum between the two contact surfaces 16, the ignition bridge 18 can be vaporized during operation of the EFI ignition component 2.

[0056] The ignition bridge 18 has a surrounding area 22 which is Figure 1 is indicated by dashed lines. This area extends on all sides by approximately 100% of the transverse dimension 20 of the ignition bridge 18. In this sense, the surrounding area 22 has approximately three times the transverse dimension 20 of the ignition bridge 18 (in Figure 1 not further shown). The surrounding area 22 thus encloses or covers parts of the connection areas 14 as well as parts of the surface 6 of the substrate 4.

[0057] Both the ignition bridge 18 and its surrounding area 22 are free of gaps and cavities and are completely covered by a plastic layer 24. Here, too, no other material is present between the plastic layer 24 and the substrate (surface 6 / metal layer 10). The plastic layer 24 is in Figure 1 shown transparently for clarity only. During operation or when the EFI ignition component 2 is triggered, the plastic layer 24 forms a flyer 26, which Figure 1 is indicated by dashed lines. The flyer 26 consists of that surface portion of the plastic layer 24 which—in a top view of the surface 6—is congruent with the ignition bridge 18. The plastic layer 24, and thus also the flyer 26, is made of polyimide.

[0058] Like the substrate 4, the plastic layer 24 is solid and, in this respect, also inherently stable, but comparatively less stable than the substrate 4. This means that when the ignition component 2 is triggered, i.e., when the ignition bridge 18 evaporates, the substrate 4 remains undamaged and undeformed, but the flyer 26 is broken or punched out of the remaining plastic layer 24 and accelerated away from the substrate 4 or surface 6 in the direction of arrow 28.

[0059] The strength of the plastic layer 24 is achieved or increased, among other things, by tempering the plastic layer 24 after it has been applied to the metal layer 10 or surface 6, i.e. by post-treating it with the aid of a tempering treatment.

[0060] The ignition component 2 does not contain any adhesive; no adhesive is used in its manufacture.

[0061] The production process begins by preparing the substrate 4. The substrate 4 forms the carrier material for the EFI ignition component 2 and is subjected to an oxidation treatment to form the insulating layer 8 or insulation layer on the surface 6. Subsequently, the metal layer 10 is applied in an oversized manner to the surface 6, here by vapor deposition. This means that more metal is applied than in Figure 1 Excess metal is then removed until only the Figure 1 The bridge structure 12 shown is present. The metal layer 10 thus forms the bridge material, i.e. the material of the ignition bridge 18.

[0062] Subsequently, the entire substrate 4 or the entire surface 6 including the bridge structure 12 is coated with the plastic layer 24, also in an oversized manner. This is carried out using the spin-coating process, i.e. the substrate 4 with the metal layer 10 is rotated and plastic is dripped onto it. The distributed plastic forms the plastic layer 24 and thus also represents the material of the flyer 26. The excess plastic is also subsequently removed until only the Figure 1 shown surrounding area 22 and the ignition bridge 18 are still covered with the plastic layer 24. In particular, the contact surfaces 16 of the connection areas 14 are or will be exposed again in order to connect there an electrical power supply (not shown) for energizing the ignition bridge 18.

[0063] The plastic layer 24 is finally mechanically stabilized by means of a tempering treatment and bonded even better to the substrate (metal layer 10 and surface 6 or substrate 4).

[0064] The entire process is carried out under vacuum after the substrate 4 has been prepared. No adhesive is used in the entire process. List of reference symbols

[0065] 2EFI ignition component 4Substrate 6Surface 8Insulating layer 10Metal layer 12Bridge structure 14Connection area 16Contact surface 18Ignition bridge 20Transverse extension 22Surrounding area 24Plastic layer 26Flyer 28Arrow (Flyer)

Claims

1. EFI detonation component (2) - comprising a substrate (4) which has a surface (6) and has a high electrical impedance at least with respect to its surface (6), - comprising a metal layer (10) applied directly to the surface (6) without gaps or cavities, - wherein the metal layer (10) is formed as a bridge structure (12), which has two electrical connection regions (14) with respective contact areas (16) for electrical contact-connection and a detonation bridge (18) which lies between the connection regions (14) and can be vaporized by applying current via the contact areas (16) and connection regions (14), - comprising a plastics layer (24) which is applied directly to the metal layer (10) and possibly directly to the surface (6), forms a flyer (26), and covers at least the detonation bridge (18) and possibly a surrounding area (22) thereof, - wherein the plastics layer (24) is after-treated after being applied by a heat treatment, - wherein the metal layer (10) is applied to the surface (6) by evaporation, without gaps and without cavities.

2. EFI detonation component (2) according to Claim 1, characterized in that the substrate (4) has an insulating layer (8) which forms the surface (6) and is at least a contributory factor for the high impedance of the substrate (4).

3. EFI detonation component (2) according to either of the preceding claims, characterized in that the substrate (4) is a semiconductor or a glass or a ceramic.

4. EFI detonation component (2) according to any of the preceding claims, characterized in that the metal contained in the metal layer (10) or of which the metal layer consists is aluminium or copper.

5. EFI detonation component (2) according to any of the preceding claims, characterized in that the plastic contained in the plastics layer (24) or of which the plastics layer consists is polyimide or parylene.

6. EFI detonation component (2) according to any of the preceding claims, characterized in that the EFI detonation component (2) is constructed free from adhesive.

7. Method for producing an EFI detonation component (2) according to one of the preceding claims, the method involving: - providing the substrate (4) with the surface (6), - applying the metal layer (10) directly to the surface (6) at least in the periphery of the bridge structure (12), without gaps and without cavities, - applying the plastics layer (24) directly to the metal layer (10) and possibly to the surface (6), at least on the detonation bridge (18) and its surrounding area (22), - the plastics layer (24) being after-treated after being applied by a heat treatment, - the metal layer (10) being applied to the surface (6) by evaporation, without gaps and without cavities.

8. Method according to Claim 7, characterized in that the metal layer (10) is applied to the surface (6) in an oversize with respect to the bridge structure (12) and subsequently ablated to the bridge structure (12).

9. Method according to any of Claims 7 to 8, characterized in that the plastics layer (24) is applied to the metal layer (10) and possibly to the surface (6) in an oversize with respect to a desired shape and subsequently ablated to the desired shape.

10. Method according to Claim 9, characterized in that the plastics layer (24) is applied to the entire metal layer (10) and to all of the rest of the surface (6) of the substrate (4) in an oversize.

11. Method according to any of Claims 7 to 10, characterized in that the plastics layer is applied to the metal layer and possibly to the surface by spin coating without gaps and without cavities.

12. Method according to any of Claims 7 to 11, characterized in that the metal layer (10) and the plastics layer (24) are at least applied and heat-treated under vacuum.

13. Method according to any of Claims 7 to 12, characterized in that the metal layer (10) and the plastics layer (24) are at least applied without using adhesive.