HEAT MANAGEMENT FOR IMPLANTABLE WIRELESS POWER TRANSMISSION SYSTEMS
DE602013087449T2Active Publication Date: 2026-04-15TC1 LLC
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Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- TC1 LLC
- Filing Date
- 2013-07-29
- Publication Date
- 2026-04-15
AI Technical Summary
Technical Problem
Implantable medical devices experience significant temperature rises during wireless power transfer, exceeding safe limits due to heat generation from both external power transfer and internal electrical components, posing a risk of tissue damage.
Method used
Implementing thermal management systems within the implantable housing, including thermal layers and channels to dissipate heat, and utilizing thermal media to transport heat away from the central regions towards the edges, along with vapor rejection into the body's blood stream or other devices.
Benefits of technology
Effectively reduces temperature rise to safe levels, minimizing tissue damage by distributing heat efficiently and maintaining device performance.
✦ Generated by Eureka AI based on patent content.
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