SENSOR HOUSING
DE602024004144T2Active Publication Date: 2026-04-22HONEYWELL INTERNATIONAL INC
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Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- HONEYWELL INTERNATIONAL INC
- Filing Date
- 2024-08-12
- Publication Date
- 2026-04-22
AI Technical Summary
Technical Problem
Existing sensor packages face challenges in underwater applications due to water and moisture ingress, which can cause malfunction and affect electrical connections, leading to performance degradation.
Method used
The sensor package includes a mounting adaptor with a housing, a sensor assembly, potting material, a locking mechanism, and a hydrophobic filter to encapsulate and seal the sensor assembly, preventing moisture ingress and enhancing protection.
Benefits of technology
The solution effectively reduces water ingress, improving sensor performance and reliability in underwater environments by encapsulating the sensor assembly and securing electrical connections, achieving IP68 and IP69 protection for submersible applications.
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