Sound transducer unit for generating and / or detecting sound waves in the audible wavelength range and / or in the ultrasonic range

Abstract

The invention relates to a sound transducer unit (1), in particular for an in-ear headphone, for generating and / or detecting sound waves in the audible wavelength range and / or in the ultrasonic range, comprising a printed circuit board (2) and at least one MEMS sound transducer (3) arranged thereon, wherein at least one connecting element (4) of the printed circuit board (2) is electrically connected to at least one contact element (5) of the MEMS sound transducer (3). According to the invention, the MEMS sound transducer (3) is designed as a surface-mountable component, which is connected to the printed circuit board (2) by means of surface mounting. The invention further relates to a method for manufacturing a sound transducer unit (1) and a sound generation unit (41).

Description

[0001] The present invention relates to a sound transducer unit, in particular for an in-ear headphone, for generating and / or detecting sound waves in the audible wavelength range and / or in the ultrasound range, comprising a printed circuit board and at least one MEMS sound transducer arranged thereon, wherein at least one connecting element of the carrier element is electrically connected to at least one contact element of the MEMS sound transducer.

[0002] From DE 10 2014 016 753 A1, a sound transducer unit is known which is arranged in a guide plate. A disadvantage of this is that the manufacture of such a sound transducer unit is complex.

[0003] US patent 2013 / 0343564 A1 discloses an earphone with a microphone that is surface-mounted on a printed circuit board.

[0004] A microphone unit is known from EP 2 587 832 A1.

[0005] EP 3 209 027 A1 discloses a sound-permeable membrane.

[0006] From EP 2 566 183 A1 a MEMS microphone with a protective layer made of a textile material is known.

[0007] In US 2009 / 0092274 A1, a condenser microphone is disclosed.

[0008] A condenser microphone is known from US 2003 / 0063762 A1.

[0009] The object of the present invention is therefore to create a sound transducer unit whose manufacturing process is simplified.

[0010] The problem is solved by a sound transducer unit, its manufacturing process and a mobile device with the features of the independent patent claims.

[0011] A sound transducer unit is proposed for generating and / or detecting sound waves in the audible wavelength range and / or the ultrasonic range. The transducer unit can thus be operated as a loudspeaker and / or a microphone. In the ultrasonic range, the sound waves can be used, for example, as a distance or proximity sensor. The transducer unit can also be used, for example, in in-ear headphones that are at least partially positioned in the ear canal. The transducer unit can also be used in other sound-generating devices, such as smartphones, radios, televisions, PCs, etc.

[0012] The transducer unit comprises a printed circuit board and at least one MEMS transducer mounted on it. The printed circuit board may have electrical conductors or traces to carry electrical voltages, currents, and / or signals. The MEMS transducer also serves to generate and / or detect sound waves in the audible wavelength range and / or in the ultrasonic range. The printed circuit board acts as a substrate for the MEMS transducer.

[0013] Furthermore, the circuit board has at least one connection element and the MEMS transducer has at least one contact element. The at least one connection element is also electrically connected to the at least one contact element. Each connection element is connected to each contact element if there are multiple connections of both.

[0014] According to the invention, the MEMS transducer is designed as a surface-mountable component, which is connected to the printed circuit board by means of surface mounting. Since the MEMS transducer is designed as a surface-mountable component, it can be arranged on the printed circuit board by surface mounting. This is an assembly method that can be easily automated. The manufacturing of the transducer unit is thereby simplified and accelerated.

[0015] It is advantageous if the connection element and the contact element are electrically connected by means of a metallurgical bond. The connection element and the contact element can also be soldered together, forming a soldered joint. This creates a stable, electrically conductive connection. Furthermore, the metallurgical bond can hold the MEMS transducer independently or even on its own on the circuit board.

[0016] Furthermore, the MEMS transducer features a diaphragm unit coupled to a transducer element. This transducer element, which may include a piezoelectric actuator and / or a piezoelectric layer, can generate and / or detect displacements. These displacements are transmitted to the diaphragm unit via a coupling element. The diaphragm unit then generates sound. The diaphragm unit can also convert sound waves into displacements, which are transmitted to the transducer element. The transducer element can generate displacements from an electrical signal and / or generate electrical signals from displacements.

[0017] Furthermore, the membrane of the membrane unit is made of a heat-resistant membrane material. Polyimides, polyamides, or silicones are used as heat-resistant membrane materials. When the MEMS transducer is soldered onto the circuit board, the MEMS transducer, and therefore also the membrane or membrane unit, can heat up to or even exceed 300°C. The heat-resistant membrane material prevents damage.

[0018] Furthermore, the MEMS transducer comprises a transducer carrier, wherein the MEMS transducer is arranged on the printed circuit board by means of the transducer carrier. The transducer carrier can be a substrate. The transducer element, in particular the piezoelectric actuator and / or the piezoelectric layer, can also be arranged on the transducer carrier. Additionally or alternatively, the diaphragm unit can be arranged on the transducer carrier.

[0019] Additionally, the transducer carrier has a first through-channel. This first through-channel allows pressure to be equalized that arises when the diaphragm unit moves or is deflected.

[0020] It is advantageous if at least one contact element is designed as a contact surface. This simplifies the construction of the MEMS transducer.

[0021] Additionally or alternatively, it is advantageous if at least one contact element is arranged on the transducer carrier. This eliminates the need for further components, resulting in a compact MEMS transducer or transducer unit. For example, the transducer carrier can have at least one contact surface, preferably located on an outer or circumferential side of the transducer carrier.

[0022] Additionally or alternatively, it is advantageous if the transducer support has electrical conductors for the transducer element. These conductors allow electrical signals to be routed to or from the transducer element. The conductors can run along an outer surface and / or within the interior of the transducer support.

[0023] Furthermore, the circuit board features a second through-channel. This second through-channel is coaxial and / or coincident with the first through-channel of the MEMS transducer. The pressure generated when the diaphragm unit is deflected can thus be equalized by the first and second through-channels. The first and second through-channels together form a compensation channel. The first and second through-channels also connect to a rear volume of the transducer unit, and the acoustic properties of the transducer unit are determined by means of this rear volume.

[0024] It is advantageous if the circuit board has a component side facing the MEMS transducer, onto which the MEMS transducer is mounted in a contact area, so that the contact elements make contact with the connection elements. The circuit board can already have these contact areas integrated, making mass production of the transducer unit very easy. The contact area includes the contact elements.

[0025] Furthermore, the transducer unit comprises a circuit board on which the printed circuit board (PCB) with the MEMS transducer is mounted. The circuit board can be larger than the PCB. The unit consisting of the PCB and MEMS transducer is mounted on the circuit board. The circuit board also includes other electrical components required for the operation of the transducer unit. For example, the circuit board may include a control unit, an interface (especially a wireless one), a power unit, a storage unit, sensors, and / or an energy interface.

[0026] The circuit board, like the printed circuit board, can have conductive traces.

[0027] Furthermore, the printed circuit board is mounted on the circuit board using spacers. A single spacer may suffice. At least one spacer is thus positioned between the circuit board and the printed circuit board.

[0028] Furthermore, at least one electrical connector is arranged between the circuit board and the circuit board, so that electrical signals can be directed to and / or away from the MEMS transducer.

[0029] Additionally or alternatively, at least one spacer can electrically connect the printed circuit board and circuit board for the exchange of electrical signals. The spacer(s) can be electrically conductive. Additionally or alternatively, conductor tracks can be arranged in at least one spacer, so that multiple conductors pass through a single spacer.

[0030] It is advantageous if the transducer unit has a transducer housing in which at least the MEMS transducer and / or the circuit board are located. The transducer housing protects at least the MEMS transducer from dirt and damage.

[0031] It is advantageous if the transducer housing has a first coupling area for connecting an earpiece to the transducer housing. The earpiece can be made of a flexible material, such as rubber. The earpiece can be designed to be at least partially inserted into the ear canal when the transducer unit is used for in-ear headphones. The earpiece, or earplug, can adapt to the shape of the ear canal.

[0032] Additionally or alternatively, it is advantageous if the converter housing has a second coupling area for connecting a headphone unit to the converter housing. The headphone unit can, for example, contain a battery or a rechargeable battery.

[0033] It is advantageous if the transducer housing has an outlet for sound waves. If the transducer housing or transducer unit is used for in-ear headphones, the outlet is directed towards the ear canal or eardrum. The sound waves are thus guided directly to the ear.

[0034] To adapt the acoustic properties of the transducer unit, it is advantageous if the transducer housing has a front volume located between the outlet opening and the MEMS transducer.

[0035] It is advantageous if the transducer housing has dust and / or moisture protection. The dust protection can be located at the outlet opening and / or the moisture protection in the area between the front volume and the MEMS transducer. This prevents the ingress of dust and / or moisture.

[0036] Furthermore, the dust and / or moisture protection may be glued to the converter housing.

[0037] It is advantageous if the transducer unit has at least one second MEMS transducer, where one of the two MEMS transducers can be operated as a loudspeaker and the other as a microphone. This allows sound waves to be generated and, in particular, simultaneously detected.

[0038] It is advantageous to arrange both MEMS transducers side by side on the circuit board. This allows for a space-saving arrangement of the two MEMS transducers.

[0039] Alternatively, one of the two MEMS transducers can be mounted on top of the other MEMS transducer. For example, the MEMS transducer used as a microphone is mounted on top of the MEMS transducer used as a loudspeaker.

[0040] It is advantageous if the circuit board has a pressure equalization vent. This vent can be located next to at least one MEMS transducer. The pressure equalization vent also connects the front and rear volumes, thus equalizing any pressure between them.

[0041] It is advantageous to have a dam arrangement around the pressure equalization opening. This prevents adhesive, such as that used to bond the circuit board to the converter housing, from entering the pressure equalization opening and blocking it.

[0042] Furthermore, a method for manufacturing a sound transducer unit, in particular for an in-ear headphone, for generating and / or capturing sound waves in the audible wavelength range and / or in the ultrasound range is proposed.

[0043] The sound transducer unit can be designed according to at least one feature of the preceding and / or following description.

[0044] In this process, at least one MEMS transducer is placed on a printed circuit board.

[0045] Furthermore, in this process, at least one connection element of the MEMS transducer is electrically connected to at least one contact element of the circuit board. This creates an electrical connection between the circuit board and the MEMS transducer.

[0046] According to the invention, the at least one MEMS transducer is a surface-mountable component that is connected to the printed circuit board (PCB) via surface mounting. Surface mounting allows the MEMS transducer to be automatically placed onto the PCB. The electrical connection between the PCB and the MEMS transducer can also be automated. As a result, the manufacturing process can be simplified.

[0047] A sound generation unit with a sound transducer unit for generating and / or detecting sound waves in the audible wavelength range and / or the ultrasonic range is also proposed. The sound generation unit could be, for example, an in-ear headphone, a smartphone, a telephone, and / or a music system. The sound generation unit could also be another mobile device.

[0048] According to the invention, the sound transducer unit is configured according to at least one feature of the preceding and / or following description. Additionally or alternatively, the sound transducer unit can be configured according to at least one feature of the preceding and / or following description.

[0049] Furthermore, it is advantageous if the sound generation unit includes an ear element located in the first coupling area of ​​the transducer unit. This ear element could be, for example, an earplug. The ear element is flexible, for instance made of rubber, so that it can adapt to the shape of the ear canal when inserted. In this case, the sound generation unit is an in-ear headphone.

[0050] Additionally or alternatively, the sound generation unit includes a headphone unit, which is located in a second coupling area of ​​the transducer unit. The headphone unit may, for example, contain a battery and / or a rechargeable battery. The sound generation unit is also an in-ear headphone.

[0051] Further advantages of the invention are described in the following exemplary embodiments. These show: Figure 1 a perspective, schematic view of a sound transducer unit with a circuit board and a MEMS sound transducer, Figure 2 a perspective, schematic view of a sound transducer unit with a printed circuit board and a MEMS sound transducer on a circuit board, Figure 3a a side sectional view of a transducer unit with transducer housing, Figure 3b a perspective sectional view of the Figure 3a , Figure 4a side sectional view of a sound transducer unit with a pressure equalization opening, Figure 5 a side sectional view of the MEMS transducer with a section of the circuit board, Figure 6a, b two lateral sectional views of a transducer unit, each with a second MEMS transducer and Figure 7 A side view of an in-ear headphone.

[0052] Figure 1 Figure 1 shows a perspective, schematic view of a transducer unit 1 with a circuit board 2 and a MEMS transducer 3. The MEMS transducer 3 can be used to generate and / or detect sound waves. When sound waves are generated, the MEMS transducer 3, or the transducer unit 1, is operated as a loudspeaker. Additionally or alternatively, the MEMS transducer 3, or the transducer unit 1, can also be operated as a microphone to detect the sound waves.

[0053] The sound transducer unit 1 can also be used for a sound generation unit 41, which is located in Figure 7 for example, it is trained as an in-ear headphone 41.

[0054] The circuit board 2 further comprises, in the present embodiment, at least one connection element 4. In the embodiment shown here Figure 1 For the sake of clarity, only one connection element 4 is marked with a reference symbol, although the printed circuit board 2 has several connection elements 4. The connection element 4 can be designed as a connection surface, as shown here. The connection element 4, in particular the connection surface, is arranged on and / or at a component side 7. The printed circuit board 2 also has a bottom surface 8 opposite the component side 7.

[0055] The MEMS transducer 3 further comprises at least one contact element 5, which here is designed as a contact base. For the sake of clarity, only one contact element 5 is again designated with a reference numeral, although the MEMS transducer 3 has several contact elements 5. The contact elements 5 are arranged such that each contact element 5 rests on a terminal element 4 when the MEMS transducer 3 is positioned on component side 7.

[0056] According to the invention, the MEMS transducer 3 is designed as a surface-mountable component, which is connected to the circuit board 2 by means of surface mounting. Consequently, each contact element 5 is assigned a connection element 4, so that these two can form an electrical connection.

[0057] According to the present embodiment, a contact element 5 is connected to the associated terminal element 4 by means of a soldered connection 6, thus forming the electrical connection. For clarity, the soldered connection 6 is shown only between one contact element 5 and one terminal element 4. Of course, a soldered connection 6 can exist between all contact elements 5 and their respective associated terminal elements 4. Instead of a soldered connection 6, another type of bonded connection can also be formed between the terminal element 4 and the contact element 5. This connection is an electrical connection.

[0058] Surface mounting allows the MEMS transducer 3 to be connected to the circuit board 2 automatically and quickly.

[0059] The circuit board 2 also has a multitude of conductor tracks 9, although for the sake of clarity only one conductor track 9 is labelled with a reference symbol. The conductor tracks 9 are electrically connected to the terminal elements 4. The conductor tracks 9 are shown only schematically. The conductor tracks 9 can converge and / or run parallel. Furthermore, the conductor tracks 9 can extend through the circuit board 2 to the underside 8.

[0060] The circuit board 2 further comprises a contact area 48 in which the MEMS transducer 3 is or can be arranged. The connection elements 4 are preferably arranged in the contact area.

[0061] Figure 2 shows a perspective, schematic view of a sound transducer unit 1 with a circuit board 2 and a MEMS sound transducer 3 on a circuit board 10.

[0062] Furthermore, for the sake of simplicity, features and their effects already described in the preceding figures are not explained again. Additionally, features with the same or at least similarly effective effects are identified by the same reference symbols compared to the preceding and / or subsequent figures. For example, features may be described only in later figures for the sake of clarity.

[0063] Circuit board 2 and the MEMS transducer 3 mounted on it are located on circuit board 10. Circuit board 10 is larger than circuit board 2. This allows for the placement of additional components required for the operation of the transducer unit 1. Circuit board 10 also serves as a main circuit board.

[0064] According to the present embodiment, the circuit board 2 is arranged on the circuit board 10 by means of spacers 11. These spacers separate the circuit board 2 from the circuit board 10.

[0065] The circuit board 10 has a top surface 14 and an opposing bottom surface 15. The printed circuit board 2 is arranged on the top surface 14. Electronic components 12 are also arranged on the top surface 14, although for clarity not all electronic components 12 are labeled. The electronic components 12 can be, for example, control units, memory units, resistors, inductors, capacitors, radio modules, and / or sensors. Furthermore, the circuit board 10 has conductive traces 13, which are shown as examples. All components are electrically connected to each other by means of the conductive traces 13. Additionally or alternatively, an electronic component 12, which is shown schematically here, can also be arranged on the bottom surface 15. The circuit board 10 can also be a PCB (printed circuit board).

[0066] According to the present embodiment, the circuit board 2 and the circuit board 10 are round and arranged coaxially to each other.

[0067] In order to be able to exchange electrical signals between the circuit board 2 and the circuit board 10, the present embodiment has a connector 47.

[0068] Additionally or alternatively, the electrical signals can also be routed through the spacers 11. For example, at least one electrical supply voltage can be routed through the spacers to the MEMS transducer 3 or other components.

[0069] Figures 3a and 3b The transducer unit 1 with a transducer housing 16 is shown in a side sectional view ( Fig. 3a ) and in a perspective view ( Fig. 3b ). In the sectional view of the Figure 3a The cut surfaces are not shown hatched.

[0070] Furthermore, for the sake of simplicity, features and their effects already described in the preceding figures are not explained again. Additionally, features with the same or at least similarly effective effects are identified by the same reference symbols compared to the preceding and / or subsequent figures. For example, features may be described only in later figures for the sake of clarity.

[0071] The converter housing 16 contains at least the MEMS transducer 3 and / or the circuit board 2, so that at least the MEMS transducer 3 is protected from dirt and damage.

[0072] Furthermore, circuit board 10 is also shown, wherein the circuit board 2 with the spacers 11 shown in figure 2, but not shown here, is arranged on the circuit board 10.

[0073] The transducer housing 16 has an outlet opening 21 through which sound waves can exit and / or enter the transducer housing 16. When the transducer unit 1 is used for an in-ear headphone, the outlet opening 21 faces the ear when the in-ear headphone is worn.

[0074] On the side of the transducer housing 16 opposite the outlet opening 21, an insertion opening 26 is arranged through which the MEMS transducer 3 and / or the circuit board 2 can be inserted into the transducer housing 16 or an interior 27 of the transducer housing 16.

[0075] The interior space 27 is limited by the converter housing 16 and the outlet opening 21 and the insertion opening 26.

[0076] According to the present embodiment, the circuit board 10 is larger than the insertion opening 26. The circuit board 10 closes the insertion opening 26.

[0077] The converter housing 16 further comprises a first socket arrangement 22 onto which the circuit board 10 can be placed. The first socket arrangement 22 surrounds the insertion opening 26.

[0078] The converter housing 16 also has a second socket arrangement 23, which is located in the area of ​​the interior 27 and onto which the circuit board 2 can be placed.

[0079] The transducer housing 16 also has a third base arrangement 24, which is located in the interior 27 and onto which a moisture barrier 18 can be placed. The moisture barrier 18 is positioned here between the outlet opening 21 and the MEMS transducer 3, so that the MEMS transducer 3 is protected from moisture that could enter through the outlet opening 21. The moisture barrier 18 can, for example, be a membrane that retains moisture but allows sound waves to pass through.

[0080] The converter housing 16 further features a fourth socket arrangement 25, onto which a dust cover 17 can be placed. The dust cover 17 prevents dust and / or dirt from entering the interior 27 of the converter housing 16.

[0081] When the MEMS transducer 3 and / or the circuit board 2 are arranged in the transducer housing 16, they divide the interior 27 into a front volume 19 and a rear volume 20. The front volume 19 is located between the outlet opening 21 and the MEMS transducer 3. The rear volume 20 is located between the MEMS transducer 3 and the inlet opening 26 or the circuit board 10. The spacers 11, not shown here, are at least partially located in the rear volume 20.

[0082] According to the in Figure 3bIn the illustrated embodiment, it can be seen that the converter housing 16 is rotationally symmetrical. Accordingly, the outlet opening 21, the dust cover 17, the circuit board 10, the printed circuit board 2, and / or the four socket arrangements 22-25 are round. The interior 27 is also rotationally symmetrical.

[0083] The transducer housing 16 further comprises a first coupling area 28. An ear element 42, described later, can be arranged in the first coupling area 28. The ear element 42 is advantageously flexible and / or made of rubber so that it can be inserted into the wearer's ear canal, conforming to the inner contour of the ear canal. The ear element 42 improves the wearing comfort of the in-ear headphones 41 when the transducer unit 1 is used for this purpose.

[0084] The transducer housing 16 further comprises a first projection 30, which prevents the ear element 42 arranged in the first coupling area 28 from slipping off the transducer housing 16. The first projection 30 is adjacent to the first coupling area 28.

[0085] The transducer housing 16 further comprises a second coupling area 29. A headphone unit 43, described later, can be arranged in the second coupling area 29. The headphone unit 43 includes the elements required in addition to the transducer unit 1 when the transducer unit 1 is used in an in-ear headphone 41. Such elements include, for example, an energy storage device 44, a charging socket for charging the energy storage device 44, and / or additional sensors 45.

[0086] The converter housing 16 also has a second projection 31, which prevents the headphone unit 43, located in the second coupling area 29, from sliding off the converter housing 16. The second projection 31 is adjacent to the second coupling area 29.

[0087] The first and / or the second coupling area 28, 29 is also cylindrical in design.

[0088] Figure 4 Figure 1 shows a lateral sectional view of a sound transducer unit 1 with a pressure equalization opening 32. The cut surfaces are again not shown hatched.

[0089] Furthermore, for the sake of simplicity, features and their effects already described in the preceding figures are not explained again. Additionally, features that are identical or at least similarly effective have the same reference symbols compared to the preceding and / or subsequent figures. For example, features may only be described in later figures for the sake of clarity. Moreover, features already known from the preceding figures are not marked with a reference symbol again.

[0090] The circuit board 2 and / or the MEMS transducer 3 divide the interior space 27 into the front volume 19 and the rear volume 20. The front volume 19 extends from the circuit board 2 and / or the MEMS transducer 3 to the outlet opening 21, preferably also through the moisture protection 18. A pressure difference between the front and rear volumes 19, 20, which arises when the MEMS transducer 3 is operated, can be equalized by means of the pressure equalization opening 32. The pressure equalization opening 32 can have a diameter of less than 0.5 mm. At this size, the pressure equalization opening 32 is essentially impermeable to sound waves. However, the pressure difference can be equalized. The pressure equalization opening 32 is located in the circuit board 2, although multiple pressure equalization openings 32 would also be conceivable.

[0091] The pressure equalization openings 32 are surrounded by a dam arrangement 33. The dam arrangement 33 prevents adhesive from entering the pressure equalization openings 32 when the circuit board 2 is bonded to the converter housing 16.

[0092] Figure 5 Figure 1 shows a sectional view of the MEMS transducer 3 with a section of the circuit board 2. Here, the MEMS transducer 3 is shown in more detail.

[0093] Furthermore, for the sake of simplicity, features and their effects already described in the preceding figures are not explained again. Additionally, features that are identical or at least similarly effective have the same reference symbols compared to the preceding and / or subsequent figures. For example, features may only be described in later figures for the sake of clarity. Moreover, features already known from the preceding figures are not marked with a reference symbol again.

[0094] The MEMS transducer 3 comprises a transducer carrier 34, which can be designed as a transducer substrate. The MEMS transducer 3 is mounted on the circuit board 2 by means of the transducer carrier 34.

[0095] A transducer element 35 is arranged on the transducer carrier 34 by means of foot elements 38. The transducer element 35 can comprise at least one piezo actuator and / or at least one piezoelectric layer, so that the transducer element 35 can convert electrical signals into displacements and / or displacements into electrical signals. When the electrical signals are converted into displacements, the MEMS transducer 3 is operated as a loudspeaker. When the displacements are converted into electrical signals, the MEMS transducer 3 is operated as a microphone. The electrical signals can be audio signals.

[0096] The MEMS transducer 3 further comprises a diaphragm unit 37, which is coupled to the transducer element 35 by means of a coupling element 36. Displacements can thus be exchanged between the diaphragm unit 37 and the transducer element.

[0097] With the aid of the diaphragm unit 37, the air above it can be set into vibration by the deflections, thus generating sound waves. The MEMS transducer 3 is therefore operated as a loudspeaker. Conversely, sound waves can also set the diaphragm unit 37 into vibration, resulting in deflections of the diaphragm unit 37. The deflections are converted into electrical signals by the transducer element 35. The MEMS transducer 3 is therefore operated as a microphone. The audio signals can be fed to and / or away from the MEMS transducer 3 by means of the circuit board 2 and / or the circuit board 10.

[0098] The aforementioned deflections have a direction along a stroke axis H. The converter element 35 and the diaphragm unit 37 are also deflected along the stroke axis H.

[0099] A first through-channel 39 is arranged in the transducer carrier 34. A second through-channel 40 is arranged in the circuit board 2. Both through-channels 39, 40 are arranged coaxially and congruently with each other. Both through-channels 39, 40 form a compensating channel. When the diaphragm unit 37, which is preferably closed, deflects along the stroke axis H, alternating negative and positive pressure arises on the side facing the circuit board 2 in the area of ​​the transducer element 35 and / or the diaphragm unit 37. This, however, impedes the movement of the diaphragm unit 37. A connection to the rear volume 20 can be formed with the aid of the first and second through-channels 39, 40, so that the negative and positive pressure is attenuated and the diaphragm unit 37 can be deflected more easily. The two through-channels 39, 40 serve to improve the acoustics of the MEMS transducer 3.

[0100] Furthermore, the at least one contact element 5 can be arranged on the transducer carrier 34, which can preferably also be designed as a contact surface. The at least one contact element 5 can be arranged on an outer or circumferential side of the MEMS transducer 3 or the transducer carrier 34. The MEMS transducer 3 can be soldered directly onto the circuit board 2 via the at least one contact surface. Preferably, the MEMS transducer 3 or the transducer carrier 34 has several contact surfaces, which are arranged to correspond to the connection elements 4.

[0101] The Figures 6a and 6b Figures show a transducer unit 1 with a second MEMS transducer 3b in two different configurations.

[0102] Furthermore, for the sake of simplicity, features and their effects already described in the preceding figures are not explained again. Additionally, features that are identical or at least similarly effective have the same reference symbols compared to the preceding and / or subsequent figures. For example, features may only be described in later figures for the sake of clarity. Moreover, features already known from the preceding figures are not marked with a reference symbol again.

[0103] The functions of the two MEMS transducers 3a, 3b are described in Figure 5 described.

[0104] If the transducer unit 1 has two MEMS transducers 3a, 3b, one MEMS transducer 3a, 3b can be operated as a loudspeaker and the other MEMS transducer 3a, 3b as a microphone. This allows the transducer unit 1 to be operated as a loudspeaker and as a microphone, particularly simultaneously.

[0105] In the Figure 6a One MEMS transducer 3b is arranged on top of another MEMS transducer 3a. This is advantageous when there is little space available on the circuit board 2.

[0106] In Figure 6b Both MEMS transducers 3a and 3b are arranged side by side on the circuit board 2. This is advantageous when a height limit needs to be imposed.

[0107] Figure 7Figure 1 shows a lateral sectional view of an in-ear headphone 41, at least partially depicted. The transducer unit 1 is primarily used as a loudspeaker in the in-ear headphone 41. The in-ear headphone 41 shown here is an example of a sound generation unit 41. The transducer unit 1 can also be located in another device, such as a smartphone, PC, etc.

[0108] Furthermore, for the sake of simplicity, features and their effects already described in the preceding figures are not explained again. Additionally, features that are identical or at least similarly effective have the same reference symbols compared to the preceding and / or subsequent figures. For example, features may only be described in later figures for the sake of clarity. Moreover, features already known from the preceding figures are not marked with a reference symbol again.

[0109] In this Figure 7 It is better shown that 10 electronic components 12a, 12b can be arranged on both sides of the circuit board.

[0110] According to the present embodiment, the ear element 42 is arranged in the first coupling area 28 of the transducer housing 16. The ear element 42 forms a positive-locking connection with the first coupling area 28 and the first projection 30, so that the ear element 42 cannot slip off the transducer housing 16.

[0111] The ear element 42 further has an ear element opening 46, which, according to the present embodiment, is coaxial with the exit opening 21.

[0112] In the second coupling area 29, the headphone unit 43 is coupled to the converter housing 16. The headphone unit 43 forms a positive-locking connection with the second coupling area 29 and the second projection 31, so that the headphone unit 43 cannot slip off the converter housing 16.

[0113] According to the present embodiment, the headphone unit 43 includes, by way of example, an energy storage device 44 and another sensor 45. Of course, the headphone unit 43 can also include other components for the in-ear headphones 41.

[0114] Although the transducer unit 1 is described here in conjunction with the in-ear headphones 41, it can also be used with other mobile devices. Transducer unit 1 can also be used with a smartphone, a radio, a television, etc. The in-ear headphones 41 are just one example of a mobile device.

[0115] The present invention is not limited to the embodiments shown and described. Modifications within the scope of the claims are possible, as is a combination of the features, even if these are shown and described in different embodiments. Reference symbol list

[0116] 1 Transducer unit 2 Circuit board 3 MEMS transducer 4 Connection element 5 Contact element 6 Solder connection 7 Component side 8 Bottom side 9 Conductor trace 10 Circuit board 11 Spacer 12 Electronic component 13 Conductor trace 14 Circuit board top side 15 Circuit board bottom side 16 Transducer housing 17 Dust cover 18 Moisture cover 19 Front volume 20 Rear volume 21 Outlet opening 22 First socket arrangement 23 Second socket arrangement 24 Third socket arrangement 25 Fourth socket arrangement 26 Insertion opening 27 Interior 28 First coupling area 29 Second coupling area 30 First projection 31 Second projection 32 Pressure equalization opening 33 Dam arrangement 34 Transducer support 35 Transducer element 36 Coupling element 37 Membrane unit 38 Foot element 39 First through-channel 40 Second passage channel 41 In-ear headphones 42 Ear element 43 Headphone unit 44 Energy storage 45 Sensor 46 Ear element opening 47 Plug connection 48 Contact area H-hub axle

Claims

1. A sound transducer unit (1), in particular for an in-ear headphone, for generating and / or detecting sound waves in the audible wavelength spectrum and / or in the ultrasonic range comprising a circuit board (2) and at least one MEMS sound transducer (3) arranged thereon, wherein at least one connector element (4) of the circuit board (2) is electrically conductively connected to at least one contact element (5) of the MEMS sound transducer (3), wherein the MEMS sound transducer (3) is designed as a surface-mount device, which is connected to the circuit board (2) with the aid of surface-mount technology wherein the MEMS sound transducer (3) comprises a diaphragm unit (37), which is coupled to a transducer element (35) of the MEMS sound transducer (3) wherein the sound waves can be generated and / or detected by means of the diaphragm unit (37), wherein the MEMS sound transducer (3) comprises a transducer support (34), the MEMS sound transducer (3) is arranged on the circuit board (2) with the aid of the transducer support (34), the transducer support (34) comprises a first through-channel (39) and wherein the circuit board (2) comprises a second through-channel (40), which is preferably coaxial and / or congruent with the first through-channel (39) characterized in that the diaphragm unit (37) is coupled to the transducer element (35) by means of a coupling element (36)so that deflections can be exchanged between the diaphragm unit (37) and the transducer element (35), so that the transducer element (35) can generate electrical signals from the deflections and deflections from electrical signals the diaphragm unit (37) is made of a heat-resistant diaphragm material, the heat-resistant diaphragm material is a polyimide, a polyamide, or a silicone, and the sound transducer unit (1) comprises a printed wiring board (10), on which the circuit board (2) comprising the MEMS sound transducer (3) is arranged, wherein the circuit board (2) is arranged on the printed wiring board (10) with the aid of spacers (11), wherein at least one electrical plug connection (47) is arranged between the circuit board (2) and the printed wiring board (10), and / or at least one spacer (11) electrically connects the circuit board (2) and the printed wiring board (10) for exchanging electrical signals.

2. The sound transducer unit as claimed in the preceding claim, characterized in that the connector element (4) and the contact element (5) are electrically connected to one another with the aid of an integral connection, in particular a soldered connection (6).

3. The sound transducer unit as claimed in one or more of the preceding claims, characterized in that the at least one contact element (5) is designed as a contact surface and / or that the at least one contact element (5) is arranged at the transducer support (34) and / or that the transducer support (34) comprises electrical lines for the transducer element (35).

4. The sound transducer unit as claimed in one or more of the preceding claims, characterized in that the circuit board (2) comprises a component side (7) facing the MEM sound transducer (3), onto which the MEMS sound transducer (3) is placed in a contact region (48), so that the contact elements (5) contact the connector elements (4).

5. The sound transducer unit as claimed in one or more of the preceding claims, characterized in that the sound transducer unit (1) comprises a transducer housing (16), in which at least the MEMS sound transducer (3) and / or the circuit board (2) are / is arranged, wherein the transducer housing (16) comprises a first coupling region (28) for coupling an ear element (42) to the transducer housing (16), and / or that the transducer housing (16) comprises a second coupling region (29) for coupling a headphone unit (43) to the transducer housing (16).

6. The sound transducer unit as claimed in one or more of the preceding claims, characterized in that the transducer housing (16) comprises an exit opening (21) for sound waves, and / or that the transducer housing (16) comprises a front volume (19), which is arranged between the exit opening (21) and the MEMS sound transducer (3).

7. The sound transducer unit as claimed in one or more of the preceding claims, characterized in that the transducer housing (16) comprises a dust barrier (17) and / or a moisture barrier (18), wherein the dust barrier (17) is preferably arranged in the area of the exit opening (21) and / or the moisture barrier (18) is arranged in the area between the front volume (19) and the MEMS sound transducer (3) and / or the dust barrier (17) and / or the moisture barrier (18) are / is adhered to the transducer housing (16).

8. The sound transducer unit as claimed in one or more of the preceding claims, characterized in that the sound transducer unit (1) comprises at least one second MEMS sound transducer (3a, 3b), wherein one of the two MEMS sound transducers (3a, 3b) is operable as a loudspeaker and the other MEMS transducer (3a, 3b) is operable as a microphone and wherein the two MEMS sound transducers (3a, 3b) are preferably arranged next to one another on the circuit board (2), or wherein one of the two MEMS sound transducers (3a, 3b) is arranged on the other MEMS sound transducer (3a, 3b).

9. The sound transducer unit as claimed in one or more of the preceding claims, characterized in that the circuit board (2) comprises a pressure compensation opening (32), wherein a dam arrangement (33) is preferably arranged around the pressure compensation opening (32).

10. A method for manufacturing a sound transducer unit (1), in particular for an in-ear headphone, for generating and / or detecting sound waves in the audible wavelength spectrum and / or in the ultrasonic range, wherein the sound transducer unit is designed as claimed in one or more of the preceding claims, in which at least one MEMS sound transducer (3) is placed onto a circuit board (2), and in which at least one connector element (4) of the MEMS sound transducer (3) is electrically connected to at least one contact element (5) of the circuit board (2), wherein the at least one MEMS sound transducer (3) is a surface-mount device, which is arranged on the circuit board (2) with the aid of surface-mount technology wherein the MEMS sound transducer (3) comprises a diaphragm unit (37), which is coupled to a transducer element (35) of the MEMS sound transducer (3) wherein the sound waves can be generated and / or detected by means of the diaphragm unit (37), wherein the MEMS sound transducer (3) comprises a transducer support (34), the MEMS sound transducer (3) is arranged on the circuit board (2) with the aid of the transducer support (34), the transducer support (34) comprises a first through-channel (39) and wherein the circuit board (2) comprises a second through-channel (40), which is preferably coaxial and / or congruent with the first through-channel (39) characterized in that the diaphragm unit (37) is coupled to the transducer element (35) by means of a coupling element (36) so that deflections can be exchanged between the diaphragm unit (37) and the transducer element (35), so that the transducer element (35) can generate electrical signals from the deflections and deflections from electrical signals, the diaphragm unit (37) is made of a heat-resistant diaphragm material, the heat-resistant diaphragm material is a polyimide, a polyamide, or a silicone, and the sound transducer unit (1) comprises a printed wiring board (10), on which the circuit board (2) comprising the MEMS sound transducer (3) is arranged, wherein the circuit board (2) is arranged on the printed wiring board (10) with the aid of spacers (11), wherein at least one electrical plug connection (47) is arranged between the circuit board (2) and the printed wiring board (10), and / or at least one spacer (11) electrically connects the circuit board (2) and the printed wiring board (10) for exchanging electrical signals.

11. A sound-generating unit (41), in particular an in-ear headphone, comprising a sound transducer unit (1) for generating and / or detecting sound waves in the audible wavelength spectrum and / or in the ultrasonic range, characterized in that the sound transducer unit (1) is designed as claimed in one or more of the preceding claims 1 to 9.

12. The sound-generating unit as claimed in the preceding claim, characterized in that the sound-generating unit (41) comprises an ear element (42), which is arranged in a first coupling region (28) of the sound transducer unit (1), and / or that the sound-generating unit (41) comprises a headphone unit (43), which is arranged in a second coupling region (29) of the sound transducer unit (1).

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