Method for producing a structured component, and structured component

Abstract

The present invention relates to a method for producing a structured component (1), comprising the following steps: a. providing a substrate (2); b. applying a composite material to the substrate (2) to form a layer (3), wherein the composite material comprises a matrix material (M) and solid particles (F) incorporated therein; c. curing the layer (3); d. at least partially removing the matrix material (M) from the layer (3), wherein a structure (4) is introduced into the layer (3) prior to, during, and / or after the curing of the layer (3) to form a structural layer (5). A multifunctional component can be produced using such a method.

Description

[0001] The present invention relates to a method for producing a structured component. Furthermore, the invention relates to a structured component.

[0002] In particular, the present invention relates to the structuring of coated components, ie components in which a substrate is provided with a coating and in which a structure is or will be formed in or on the coating.

[0003] The coating of objects (substrates) made of metal, ceramic, glass, or plastic is well known. Coatings can be used to improve the service life, certain functions, or mechanical properties of the component. For example, a coating can improve corrosion, scratch, or wear resistance. Furthermore, a coating can influence the decorative or optical properties of the component.

[0004] In addition to the coating itself, a structure provided in or on such a coating can also provide various functions. Such a structure can, for example, provide optical functions. Furthermore, a structure can be used for the directed conduction of fluids (e.g., liquids or gases) along a component surface. Component structures can also influence their visual appearance or the component's haptics. Such structures can also provide pores or pore systems. Such structures can (in conjunction with a suitable coating material) promote the course of chemical reactions or catalytic processes or even enable them in the first place.

[0005] A wide variety of processes for the production of structured components are known from the state of the art. To provide specific component functions or application areas for a component, it is often necessary to use solid particles (e.g., inorganic particles, metallic particles, semi-metallic particles, organic particles, or other particles with a solid state) and incorporate them into the coating.

[0006] Known manufacturing processes involve adsorbing solids (e.g., in the form of powders) onto a surface (a substrate). The solids can then be converted into layers by firing. However, powders tend to atomize, migrate, and disperse throughout the room. Furthermore, solids—often depending on their particle size—may pose a threat to the environment and the health of living organisms. Furthermore, these manufacturing processes only allow the incorporation of one type of solid into a layer, which can limit certain functional scenarios and applications for the components manufactured in this way. Furthermore, these manufacturing processes often result in uncontrolled agglomeration of solid particles, making it difficult to precisely adjust porosity and surface area.Furthermore, it should be taken into account that the adhesion of such coatings depends on the interaction of the respective solid with the surface, so that many surface treatments are only slightly stable.

[0007] Based on this prior knowledge, it is an object of the present invention to propose a method for producing a structured component that does not have the aforementioned disadvantages, but at least provides an alternative to known methods. Furthermore, it is an object of the present invention to provide a structured component that can be used multifunctionally.

[0008] This object is achieved by a method according to claim 1 and a component according to claim 13.

[0009] First, the present invention relates to a method for producing a structured component, comprising the following steps: a. Providing a substrate; b. Applying a composite material to the substrate to form a layer, wherein the composite material comprises a matrix material and solid particles incorporated therein; c. Curing the layer; d. At least partially removing the matrix material from the layer.

[0010] According to the invention, a structure is introduced into the layer prior to, during and / or subsequent to the curing of the layer in order to form a structural layer from the layer.

[0011] The substrate can be a suitable body to which a composite material can be applied. The substrate can be rigid or flexible (e.g., bendable, foldable, rollable, etc.). The substrate can be a flat body, i.e., have a flat (level) surface. The substrate can be in the form of a film. The substrate can have a shape other than a flat body. The substrate can have a surface profile. The substrate can have a smooth surface or a rough surface in places or entirely. The substrate can be a three-dimensional object.

[0012] The substrate can be based on or formed from silicon, metal, glass, ceramic, or a plastic, for example. The substrate can be single-layered or multi-layered. The layers can be made of the same or different materials. The substrate can act as a holder / carrier for a layer placed (or to be placed) on it. The substrate can be a silicon or glass wafer. The substrate can be designed such that it can be rolled up onto a roll.

[0013] The composite material can be in any form in which it can be applied to the substrate. For example, the composite material can be flowable, especially liquid. The flowability is provided in particular by the matrix material. The solid particles can be distributed throughout the matrix material, for example, dispersed or suspended. The composite material can also be viscous.

[0014] The solid particles may have been incorporated into the matrix material before the composite material was applied to the substrate. The composite material is then initially composed of matrix material and solid particles incorporated into it.

[0015] Alternatively or additionally, solid particles can also be introduced into the matrix material during the application of the composite material to the substrate. If solid particles are introduced into the matrix material only during the application of the composite material to the substrate, it goes without saying that the "composite material" is generated "in situ" during application to the substrate.

[0016] It may also be provided to first apply only the matrix material to the substrate and only then to introduce the solid particles into the matrix material applied to the substrate.

[0017] Regardless of the time at which the solid particles are introduced into the matrix material, in each of the variants described above, a composite material is ultimately applied to the substrate.

[0018] "Curing" can be understood as complete curing or partial curing. Partial curing can mean that a curing process is completed to a certain degree (in terms of time) (e.g., curing is 80% complete), while partial curing can mean that certain (local) areas of the layer are fully cured, while other areas are not yet fully cured. In this case, partial curing can therefore refer to a local curing state.

[0019] The process of curing specifically refers to the "solidification" of the layer. Curing can occur through drying processes, e.g., through evaporation of solvent (which may be a component of the composite material), but also through chemical processes such as polymerization. Curing can be initiated or accelerated by applying thermal energy to the layer or irradiating it with electromagnetic radiation (of a suitable wavelength). Depending on the material, this can either initiate or accelerate curing.

[0020] A "structure" can be understood as a surface structure or a depth structure within the layer. A structure can be regular or irregular. A structure can have height structures and depth structures. A structure can have patterns that repeat periodically, for example. A structure can provide a surface profile. A structure is formed, in particular, by structural elements that are arranged adjacent to one another or in a pattern. Structural elements can be arranged regularly or irregularly. A structure can also be formed by different structural elements that can differ from one another, for example, in their size or shape. The layer mentioned can have a structure in places and no structure in places. However, the layer can also be structured throughout.

[0021] As mentioned, the structure can be introduced into the layer prior to curing. In this case, the structure can be introduced into the layer particularly easily, as the composite material is easily moldable and thus structurable because it has not yet cured. In this case, curing takes place after structuring. However, it can be provided that a tool used for structuring remains in the layer during curing and is only removed afterward (like a mask).

[0022] As mentioned, the structure can also be incorporated into the layer during curing. In this case, too, the structure can be incorporated into the layer particularly easily, as the composite material is easily moldable and thus structurable due to its incomplete curing. Structuring during curing can be advantageous, as the medium to be structured (here, the composite material) may already have a certain degree of strength (curing degree), thus preventing or reducing "flow" during shaping. This can improve stability during shaping.

[0023] A simple form of structuring can be achieved, for example, by stamping or embossing. A stamping tool, an embossing tool, or another shaping tool (e.g., a mask) can be placed in the layer for structuring. After the structure has been created, the tool can be removed and the curing process can begin. It is also possible to leave the tool in the layer during the curing process.

[0024] The structure can also be introduced into the layer after it has cured. This means that the layer is already fully cured before structuring takes place. In this case, structuring is carried out in particular by material ablation, i.e. material removal. Material ablation can be carried out chemically and / or mechanically. Mechanical material ablation can be engraving, for example, but can also be carried out by laser processing (laser structuring). Chemical material ablation can, for example, involve a wet-chemical process, in particular an etching or pickling process. Structuring can also be carried out by partially (selectively) dissolving the composite material, e.g. with a solvent. The solvent then dissolves the matrix material, which entrains the solid particles arranged therein.

[0025] Combinations of the preceding structuring variants are also possible, so that a structuring (i) preceding and during, or (ii) preceding, during and subsequent, or (iii) during and subsequent, or (iv) preceding and subsequent to cure the layer.

[0026] The method of removing matrix material from the layer can depend on the type of matrix material. If the matrix material is volatile, it can be removed, for example, by applying thermal energy (e.g., by liquefaction, evaporation, or sublimation). The matrix material can also be removed by irradiation with electromagnetic radiation (e.g., light of a suitable wavelength), chemically, or mechanically. Mechanical removal can also be achieved by laser processing.

[0027] It is fundamentally conceivable that the at least partial removal of the matrix material from the layer also takes place before and / or during the curing of the layer (i.e. the above-mentioned step c).

[0028] As mentioned, solid particles are incorporated into the composite material. These remain in the layer after curing and at least partial removal of the matrix material. They are also contained in the structural layer, which is formed by incorporating the structure into the layer.

[0029] This process not only enables the gentle and environmentally friendly introduction of solid particles into a layer applied to a substrate, but also the introduction of solid particles into a structured layer (structural layer). The solid particles thus enable the targeted adjustment of certain properties of the layer, for example, the targeted adjustment of porosity, pore size (distribution), pore shapes, etc. At the macroscopic level, however, the structure introduced into the layer can impart specific functions to the component. This process also allows the introduction of various types of solids into a layer.

[0030] The proposed process enables the customized design and adjustment of specific component properties or functionalities, namely, on the one hand, by the solid particles in the layer and, on the other hand, by the structure introduced into the layer. Certain properties can be influenced by both the solid particles and the structure, while other properties or functionalities can be influenced only by the solid particles or the structure.

[0031] The structure incorporated into the layer can increase the surface area of ​​the component, which can be advantageous when used as a catalyst, particularly a photocatalyst. The catalytically active (accessible) surface area is thus increased. Catalytic activity of the layer can be achieved particularly when the solid particles are made of a metal, particularly a conductor or semiconductor.

[0032] The structure can also increase the absorption surface for incident light. The structure can also be used to provide specific optical functions. Adjustment parameters can include the layer thickness of the structural elements forming the structure, the shape of the structural elements, and their dimensions.

[0033] Further embodiments of the proposed method are specified in the subclaims and in the following description. The features specified in the subclaims are described in detail below. Further possible embodiments are also discussed. The embodiments and features described and specified in the subclaims can specify the invention across categories. This means that those features claimed or described in the context of the proposed method can also be embodiments or features of the proposed component, and vice versa.

[0034] According to a first embodiment of a method proposed by the invention, the structure can be a nanostructure. This means, in particular, that the structural elements forming the structure are nanostructure elements. Nanostructure elements have dimensions that are generally less than 100 nm. However, the structural elements can also have dimensions of 100 nm or larger, down to a few micrometers, and in this case can therefore also be referred to as microstructure elements. Structural elements can (regardless of their size) have different shapes, for example a disk shape, a rod shape, a cylinder shape, a tube shape, a pyramid shape, a cone shape, a cuboid shape, etc. In cross-section, structural elements can have a polygonal shape or a rounded shape (e.g., circular, oval, etc.). Any other shapes are possible.

[0035] Structural elements can be raised relative to the layer or the substrate. In this case, each structural element protrudes from a surface of the layer or a surface of the substrate away from this surface. This directly enlarges the component surface. A raised arrangement of the structural elements relative to a surface can result in advantageous optical properties. This can, for example, be used to specifically form a diffraction grating structure, a desired reflection surface structure, or an optical trap. The structural elements can also be embedded in the layer. For example, this can mean that the structural elements are realized in the form of holes formed in the layer. The structure can be designed such that electromagnetic radiation of specific wavelengths or wavelength ranges is absorbed or reflected.

[0036] However, it is not absolutely necessary for the structure to be composed solely of nanostructure elements or microstructure elements. A mixture of nanostructure elements and microstructure elements is also possible.

[0037] The structural elements can be arranged in an ordered or random (i.e., random) manner. In an ordered arrangement, the structural elements can be arranged in a pattern. This could, for example, be a periodically repeating pattern.

[0038] Furthermore, the structure does not necessarily have to be composed of clearly defined structural elements such as nanostructure elements or microstructure elements. The structure can also be generally referred to as a nanostructure or microstructure. A microstructure is a microscopically resolvable fine structure, which, for example, describes the microstructure of a material. A nanostructure describes the smallest arrangements whose size lies between microstructures and molecular structures. A nanostructure can also include a fine structure. A fine structure can be regular or irregular.

[0039] According to a further embodiment of a method proposed by the invention, it can be provided that an organic material, in particular an organic lacquer, is used as the matrix material. Organic materials are based on carbon compounds. The use of an organic material or an organic lacquer as the matrix material does not mean that the matrix cannot contain other components (e.g., of an inorganic nature) in addition to organic materials. A lacquer, including an organic lacquer, can also comprise binders, film formers, non-volatile or volatile auxiliaries, solvents (organic or water-based), pigments, fillers, etc.

[0040] A resist, whether organic or inorganic, can be in liquid or powder form. A resist can be applied to an object such as a substrate and built up into a solid film (layer) through chemical and / or physical processes (e.g., the evaporation of a solvent). The resist can be a photoresist.

[0041] According to a further embodiment of a method proposed by the invention, inorganic or organic particles can be used as solid particles. The solid particles can be semiconductor materials, insulating materials, or conductive materials. Various of the aforementioned solid particles can also be provided. The solid particles can comprise graphene.

[0042] If the solid particles are semiconductor materials, the semiconductor material can be metal oxides, nitrides, carbon compounds (gC 3 N 4 ), transition metal dichalcogenides (TMDs), MXENE, etc. and combinations thereof.

[0043] According to a further embodiment of a method proposed by the invention, the composite material can be applied to the substrate by spraying, spinning, pouring, brushing, printing, rinsing, or by immersing the substrate in the composite material. "Spraying" can be understood as spray coating. The composite material, which is in a flowable, e.g., liquid, state (the solid particles can be dispersed in the liquid matrix material), can be atomized into a mist and sprayed onto the substrate. An air spray system, an ultrasonic spray system, or even an electrostatic spray system (so-called electrospray) can be used. "Spin coating" can be understood, for example, as "spin coating." "Pouring" involves pouring the flowable composite material onto the substrate completely or in places.Depending on its fluidity and surface tension, the composite material can spread (flow) itself to a certain extent across the substrate's surface. "Spreading" composite material is usually done using a spreading tool, e.g., a flat brush, a roller, a paintbrush, or the like. Printing can be letterpress, gravure, planographic, stencil, pad printing, stamping, embossing, direct thermal printing, thermal transfer printing, thermal sublimation printing, screen printing, or 3D printing. Printing can include digital printing. "Spraying" can be understood as a slot die coating. "Dipping" involves immersing a substrate in a pre-coated composite material. This can be a dip coating. Furthermore, the composite material can be applied using a flooding technique (flooding the substrate with composite material).The composite material can also be rolled onto the substrate.

[0044] According to a further embodiment of a method proposed by the invention, it can be provided that the layer is heated and / or exposed during curing. In the simplest case, the substrate together with the layer applied thereto is arranged for curing in a room or container in which a temperature higher than room temperature (normal temperature) prevails (heating). Heating can also be carried out specifically using a heating device or heating container. Heating can also be achieved by irradiation with electromagnetic radiation, e.g., by irradiation with infrared radiation. Heating can enable or accelerate curing processes, e.g., by evaporation of solvent. Heating, as well as exposure, can also initiate or accelerate chemical curing reactions. This can, for example, provide the activation energy required for a chemical reaction.Exposure means irradiation with electromagnetic radiation of a suitable wavelength.

[0045] According to a further embodiment of a method proposed by the invention, the matrix material can be at least partially removed by thermal treatment, chemical treatment, physical treatment, and / or mechanical processing of the layer. In the simplest case, thermal treatment can mean exposing the matrix material to an ambient temperature above room temperature (normal temperature). This can also be done in a suitable heating device or a corresponding heating container. Thermal treatment can also be carried out by applying electromagnetic radiation. Depending on the wavelength of the electromagnetic radiation, thermal energy can also be introduced with the application of the radiation (e.g., when irradiating with IR radiation).The application of laser radiation or electron beams can also be considered thermal treatment, but can also be considered mechanical processing (laser ablation). Laser processing is therefore a hybrid of thermal and mechanical treatment or processing. Chemical treatment can, in particular, be wet-chemical treatment, e.g., with an acid (etching), an alkali (e.g., NaOH or KOH), or another suitable agent. The matrix material can also be dissolved or removed with a solvent (as a remover), for example, with acetone, 1-methyl-2-pyrrolidone, dimethyl sulfoxide, etc. Chemical treatment can also involve removing the matrix material by means of dry-chemical combustion in an oxygen plasma (so-called O2 ashing). Plasma etching, which is mentioned here as an example of a possible treatment, is a hybrid of chemical and physical treatment.A physical treatment can, for example, be understood as a simple application of pressure. Under a certain pressure, certain substances can evaporate. Mechanical processing can be understood as milling, drilling, cutting or, as mentioned, laser processing, etc. The matrix material can be completely or partially removed. If only partially removed, a portion of the matrix material remains in the layer. The porosity of the layer can be adjusted by removing the matrix material. Other options for completely or partially removing the matrix material include the following processes: material ablation (e.g. laser ablation, electron beam ablation), the use of ion beams (e.g. focused ion beams, FIB for short), sputtering (e.g. Ar or He sputtering) as a purely physical process, the use of radiological radiation (e.g.alpha or beta radiation) or microwave radiation, plasma processes (e.g. reactive ion etching, RIE for short).

[0046] According to a further embodiment of a method proposed by the invention, it can be provided that a porosity in the layer is adjusted by adjusting an initial proportion of solid particles in the composite material and / or by the amount of matrix material removed from the layer. A targeted adjustment of the porosity can be important for a wide variety of applications, for example, in catalytic applications. Many chemical-catalytic processes depend on the pore system, in particular the porosity. The absorption of gas molecules or liquid is also influenced by porosity. In addition to the porosity itself, a pore size distribution or specific pore shapes can also be adjusted.

[0047] According to a further embodiment of a method proposed by the invention, it can be provided that the structure, in particular the nanostructure or microstructure, is introduced into the layer in such a way that it has a specific surface functionality, for example an optical functionality. A surface functionality can mean a functionality of a surface in relation to the interaction with substances arranged thereon or environmental substances. For example, a specific surface functionality can mean hydrophilic, hydrophobic, lipophilic, or lipophobic properties of the surface. The specific surface functionality can mean wettability with certain substances. The provision of a lotus effect can be an example of a specific surface functionality. Absorption properties of the structure (or the surface) in relation to the attachment and interaction of substances (e.g.The absorption of electromagnetic radiation (e.g., gases, liquids, or individual molecules) or electromagnetic radiation can provide a specific surface functionality, for example, the targeted absorption of electromagnetic radiation (e.g., radar waves, microwaves, etc.) of specific wavelengths or wavelength ranges. Electrical properties of the structure or surface can also provide specific surface functionalities, for example, the surface can provide a transistor function and be activated by electromagnetic radiation. Magnetic properties can also provide a specific surface functionality.

[0048] According to a further embodiment of a method proposed by the invention, the material of the solid particles, the size of the solid particles, the shape of the solid particles, and / or the proportion of solid particles in the composite material can be selected such that the solid particles perform a catalytic, in particular photocatalytic, function, an electrically conductive function, a material transport function, and / or an electrode function. The aforementioned selection of the material, size, shape, and / or proportion of solid particles in the composite material can also be made such that certain absorption properties of the structure can be provided, be this with regard to the absorption of substances (e.g., gases, liquids, or individual molecules) or the absorption of electromagnetic radiation of specific wavelengths or wavelength ranges (e.g., radar waves or microwaves).This can also apply to the targeted reflection of electromagnetic radiation.

[0049] What is essential for the present invention is that it is precisely the interaction of the generated (macroscopic) structure with (intrinsic) properties of the introduced solid particles, i.e., e.g., the material of the introduced solid particles, the size of the solid particles, the shape of the solid particles, and / or the proportion of solid particles in the composite material, that opens up the possibility of tailoring certain of the aforementioned properties (e.g., the specific surface functionalities mentioned).

[0050] According to a further embodiment of a method proposed by the invention, it can be provided that different types of solid particles are used with regard to material, size, and / or shape. The different types of solid particles can be present in predetermined proportions (which may vary) relative to the matrix material. The use of different types of solid particles increases the multifunctional design of the component, thus its multifunctional applicability.

[0051] According to a further embodiment of a method proposed by the invention, it can be provided that a functional metal structure is applied to the layer, in particular by vapor deposition or sputtering, wherein the functional metal structure is formed in particular in island-like fashion, and wherein the functional metal structure in particular has a plasmonic function and / or a co-catalytic function. However, it should be emphasized that the aforementioned properties can also be provided by the solid particles per se, i.e., the application of a separate functional metal structure is not mandatory but merely optional.

[0052] To provide a plasmonic function, the functional metal structure or solid particles can be made of gold, silver, platinum, palladium, copper, aluminum, ruthenium, a mixture of the above-mentioned metals, or a doped semiconductor compound. Gold and silver, in particular, exhibit advantageous plasmonic properties.

[0053] The solid particles can be formed from an electrochemically, particularly photoelectrochemically, active material or can provide such a layer. Photoelectrochemistry deals with semiconductor-electrolyte systems when irradiated with light. The semiconductor represents an electrode, as does the layer mentioned here, which, together with an electrolyte, forms a half-cell. When light is irradiated, an electron-hole pair is formed, which participates in a subsequent electrochemical reaction. The component proposed by the invention can thus be used as an electrode in a half-cell. The electrode surface forms the layer on its own, or the layer together with the structure incorporated therein. The latter simultaneously effect a more efficient (easier) formation of electron-hole pairs when irradiated with light of certain wavelengths.

[0054] According to a further embodiment of the invention, it can be provided that the layer with the structure incorporated therein forms an optical grating, and / or a nanoantenna structure, and / or a conductor, and / or a material transport layer, and / or an electrode.

[0055] An optical grating can also be referred to as a diffraction grating. The structural elements that make up the structure, or the nanostructure or microstructure, form structures that diffract light.

[0056] The nanoantenna structure can be a plasmonic nanoantenna structure. Plasmonic nanoantennas are metallic structures with typical dimensions smaller than the wavelength of light (e.g., from a few tens or hundreds of nanometers to a few micrometers). These structures enable the conversion of optical radiation incident on a surface into very intense, local fields on the surface itself. In the structural elements forming the plasmonic nanoantenna structure, the electrons are excited into collective oscillations – the plasmons – which in turn can lead to high field enhancements at the edges of a subwavelength structure. Standing waves perpendicular to the propagation direction of the incident light form in the nanoantennas; the evanescent field extends beyond the physical boundaries of the structure.These standing waves can be thought of as two charge carrier density oscillations with opposite directions and therefore canceling momentum. The standing wave is triggered by the oscillating electric field, whose frequency is determined by the material and geometry of the nanoantenna. The precise geometry allows for a discrete number of possible resonances.

[0057] A "conductor" can be understood as an electrical conductor. An electrical conductor is designed to conduct electrical current and is based on the electrical conductivity of the materials used.

[0058] Due to its structure, the layer can also be used to conduct (especially flow) materials (substances). Depending on the structure, preferential flow surfaces or channels can be defined along which a substance can be (directly) transported or flowed. In particular, the layer can be used to conduct fluids such as gases or liquids. The structure can also be used to specifically adjust flow velocities, retention rates, turbulence levels, etc. of fluids.

[0059] As mentioned, the invention also relates to a structured component as such.

[0060] The structured component according to the invention comprises: a. a substrate, and b. a structural layer formed on the substrate, which comprises solid particles and optionally a matrix material at least partially surrounding the solid particles.

[0061] The structural layer has a porosity that is specifically adjusted by an initial proportion of solid particles in the composite material and / or by selective removal of matrix material.

[0062] It can be provided that a structure with an optical functionality is incorporated into the structural layer.

[0063] The structured component can be produced using a method according to the invention.

[0064] The present invention is further specified by the exemplary embodiments and features shown in the figures. The features and exemplary embodiments shown in the figures may be advantageous embodiments of the proposed structured component and the proposed method. The figures show: Fig. 1 a schematic representation of a substrate on which a composite material is applied; Fig. 2 a schematic representation of the substrate with composite material fromFig. 1 , wherein a structure is introduced into the layer; Fig. 3 shows a schematic representation of a component according to the invention, wherein the matrix material has been completely removed;

[0065] The Figures 1 to 3 schematically illustrate the essential steps of the method proposed by the present invention.

[0066] This is a method for producing a structured component 1 (the component is in Fig. 3 shown).

[0067] After providing a substrate 2, a composite material is applied to the substrate 2 to form a layer 3, wherein the composite material comprises a matrix material M and solid particles F incorporated therein, cf. Fig. 1 . The solid particles F are distributed in the matrix material M, e.g. dispersed therein.

[0068] Layer 3 can then cure (not shown). The matrix material M can be (at least partially) removed from layer 3.

[0069] Fig. 3 shows an example of the component with matrix material M completely removed from layer 3.

[0070] According to the present method, a structure 4 is introduced into the layer 3 prior to, during and / or subsequent to the curing of the layer 3 in order to form a structural layer 5 from the layer 3. Figure 2 illustrates a structure 4 introduced into layer 3 before removal of the matrix material M. Structure 4 is indicated by dashed lines, here in the form of a triangular structure. Any structural shape is possible.

[0071] By removing matrix material, pores can be specifically formed in layer 3 and porosity can be adjusted accordingly ( Fig. 3 ). Reference to funding

[0072] The inventors thank the Federal Ministry for Economic Affairs and Climate Protection of the Federal Republic of Germany for its financial support (COSMOS, 49VF210041). List of reference symbols

[0073] 1Component 2Substrate 3Layer 4Structure 5Structural layer FFolite particles MMatrix PPore

Claims

1. A method for producing a structured component (1), comprising the following steps: a. providing a substrate (2); b. applying a composite material to the substrate (2) to form a layer (3), wherein the composite material comprises a matrix material (M) and solid particles (F) introduced therein, c. curing the layer (3); d. at least partially removing the matrix material (M) from the layer (3), wherein prior to, during and / or subsequent to the curing of the layer (3), a structure (4) is introduced into the layer (3) in order to form a structural layer (5) from the layer (3).

2. The method according to claim 1, wherein the structure (4) is a nanostructure or microstructure.

3. The method according to claim 1 or 2, wherein an organic material, in particular an organic lacquer, is used as matrix material (M).

4. Process according to one of the preceding claims, wherein inorganic or organic particles are used as solid particles (F).

5. Method according to one of the preceding claims, wherein the composite material is applied to the substrate (2) by spraying, spinning, pouring, painting, printing, rinsing, or by immersing the substrate (2) in the composite material.

6. Method according to one of the preceding claims, wherein the layer (3) is heated and / or exposed during curing.

7. Method according to one of the preceding claims, wherein the matrix material (M) is at least partially removed by thermal treatment, chemical treatment, physical treatment, and / or mechanical processing of the layer (3).

8. Method according to one of the preceding claims, wherein a porosity in the layer (3) is adjusted by adjusting an initial proportion of the solid particles (F) in the composite material and / or by the amount of matrix material (M) removed from the layer (3).

9. Method according to one of the preceding claims, wherein the structure (4), in particular the nanostructure or microstructure, is introduced into the layer (3) in such a way that it has a specific surface functionality, for example an optical functionality.

10. Method according to one of the preceding claims, wherein the material of the solid particles (F), the size of the solid particles (F), the shape of the solid particles (F), and / or the proportion of the solid particles (F) in the composite material is selected such that the solid particles (F) form a catalytic, in particular photocatalytic, function, an electrically conductive function, a material transport function, and / or an electrode function.

11. Method according to one of the preceding claims, wherein different solid particles (F) are used with regard to material, size and / or shape.

12. Method according to one of the preceding claims, wherein a functional metal structure is applied to the layer (3), in particular by vapor deposition or sputtering, wherein the functional metal structure is formed in particular in the form of an island, and wherein the functional metal structure has in particular a plasmonic function and / or a co-catalytic function.

13. Structured component (1), comprising a. a substrate (2), and b. a structural layer (5) formed on the substrate (2), which comprises solid particles (F) and optionally a matrix material (M) at least partially surrounding the solid particles (F). wherein the structural layer (5) has a porosity that is specifically adjusted by an initial proportion of the solid particles (F) in the composite material and / or by selective removal of matrix material (M).

14. Structured component (1) according to claim 13, wherein a structure (4) with an optical functionality is introduced into the structural layer (5).

15. Structured component (1) according to claim 13, wherein it is produced by a method according to one of claims 1 to 12.

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