Pressure-sensitive adhesive composition

Abstract

The invention relates to a pressure-sensitive adhesive (PSA) composition comprising at least one base component selected from the group consisting of a polyacrylate PSA and a synthetic-rubber PSA, a salt component and a (polymer) electrolyte component, which is detached by application of an electrical DC voltage. The invention further relates to a process for producing the PSA composition and to a pressure-sensitive adhesive tape comprising a layer of a PSA composition. The invention also relates to a pressure-sensitive adhesive tape comprising at least one electrically conductive carrier material and at least one layer of a PSA composition.

Description

[0001] Pressure-sensitive adhesive composition

[0002] The present invention relates to a pressure-sensitive adhesive composition comprising at least one base component selected from the group consisting of a polyacrylate pressure-sensitive adhesive and a synthetic rubber pressure-sensitive adhesive, a salt component, and a (polymer) electrolyte component that is detached by applying a direct current. The invention further relates to a process for producing the pressure-sensitive adhesive composition and to a pressure-sensitive adhesive tape comprising a layer of a pressure-sensitive adhesive composition. Furthermore, the invention relates to a pressure-sensitive adhesive tape comprising at least one electrically conductive carrier material and at least one layer of a pressure-sensitive adhesive composition.

[0003] Adhesives containing ionic liquids are known, as are various ionic liquids that can generate conductivity in solids. US2001031367A1 and US2007269659A1 describe an electrochemically detachable composition with a matrix functionality and an electrolyte functionality. The bond between the detachable composition and a substrate can be weakened in a short time by the flow of an electric current through the bond between two substrates and the composition. Detachment of the electrochemically detachable composition requires two conductive substrates and the passage of an electric current through the detachable bond to induce a Faradaic reaction at the surface. One- and two-component curing adhesives based on reactive resins such as epoxies, phenolic resins, acrylates, polyurethanes, melamines, and maleimides are disclosed.

[0004] DE102005050632A1 and EP2825608A1 describe a hot-melt adhesive composition containing polyamides and copolymers of polyamides, polyurethanes, and polyesters, and reactive resins of epoxides and polyurethanes, which can be released by applying an electrical voltage. The matrix consists of a reactive resin and / or a hot-melt adhesive polymer, a polymeric electrolyte component, and a salt with a halogen-containing anion. The bond can be released again by applying an electrical voltage. EP3262132A1 describes a polyamide-based hot-melt adhesive that additionally contains an organic or inorganic salt and other additives. The bond produced can be released again by applying an electrical voltage. It is necessary to apply an electrical voltage in the direction from one substrate to the other, with the adhesive layer additionally being heated to 40 to 80°C.The bond can be removed again by applying an electrical voltage.

[0005] US2018340097A1 describes a method for the reversible bonding of two substrates using a hot-melt adhesive composition. The hot-melt adhesive composition consists of a polyurethane and an organic or inorganic salt. The structure uses a conductive ink layer to activate the electrically detachable adhesive layer. The bond can be released again by applying an electrical voltage, which requires two conductive substrates.

[0006] The adhesive compositions according to the state of the art are hot melt adhesive compositions that require two conductive substrates for detachment of the bond and must be heated for detachment.

[0007] The object of the invention is therefore to provide a pressure-sensitive adhesive composition that avoids, or largely avoids, the disadvantages of the aforementioned hot-melt adhesive compositions and processes. In particular, the pressure-sensitive adhesive composition should enable immediate bonding during joining without thermal stress on the parts to be joined and, if necessary, clean removal without damaging the substrate. A further advantage of the present invention is that the thickness of the pressure-sensitive adhesive composition layer is significantly smaller than the layers of the hot-melt adhesive compositions in the prior art.

[0008] This object is addressed by a pressure-sensitive adhesive composition comprising at least one base component selected from the group consisting of a polyacrylate pressure-sensitive adhesive and a synthetic rubber pressure-sensitive adhesive, a salt component, and a (polymer) electrolyte component, which is detached by applying a direct electrical voltage. The invention further relates to a process for producing the pressure-sensitive adhesive composition and to a pressure-sensitive adhesive comprising a layer of a pressure-sensitive adhesive composition. Furthermore, the invention relates to a pressure-sensitive adhesive tape comprising at least one electrically conductive carrier material and at least one layer of a pressure-sensitive adhesive composition. Advantageous developments, which can be implemented individually or in combination, are presented in the description and the dependent claims.

[0009] Therefore, the present invention relates to a tetraethylene glycol di(2-ethylhexanoate) comprising

[0010] (a) 35 to 90 wt.% of at least one base component is selected from the group consisting of a polyacrylate pressure-sensitive adhesive (a1) and a synthetic rubber pressure-sensitive adhesive (a2); wherein the polyacrylate pressure-sensitive adhesive (a1) is preparable from a polymerization mixture containing 70 to 99.95 wt.% of at least one (meth)acrylic acid ester monomer and 0.05 to 30 wt.% of at least one crosslinker monomer, each preferably selected from the group consisting of secondary amides and tertiary amides; wherein the synthetic rubber pressure-sensitive adhesive (a2) comprises 50 to 95 wt.% of a synthetic rubber component and 5 to 50 wt.% of an adhesive resin component;

[0011] (b) 2 to 15 wt.% of a salt component; and

[0012] (c) 5 to 50 wt.% of a (polymer) electrolyte component.

[0013] The crosslinking monomer is preferably selected from the group consisting of N-vinyl-caprolactam, N-vinylpyrrolidone, acrylamide, methacrylamide, N-methylacrylamide, methylmethacrylamide, N,N-dimethylacrylamide, diacetoneacrylamide and N,N-dimethylmethacrylamide, more preferably each is selected from the group consisting of N-vinyl-caprolactam, N-vinylpyrrolidone, N-methylacrylamide, N-methylmethacrylamide, N,N-dimethylacrylamide, diacetoneacrylamide and N,N-dimethylmethacrylamide, more preferably each is selected from the group consisting of N-vinyl-caprolactam, N-methylacrylamide, N-methylmethacrylamide, N,N-dimethylacrylamide and N,N-dimethylmethacrylamide, more preferably N,N-dimethylacrylamide.

[0014] According to the invention, a pressure-sensitive adhesive composition and / or a pressure-sensitive adhesive is understood, as is generally customary, to be a substance that is permanently tacky and adhesive, particularly at room temperature. A characteristic of a pressure-sensitive adhesive composition and / or a pressure-sensitive adhesive is that it can be applied to a substrate by pressure and remains adhered thereto, whereby the pressure to be applied and the duration of this pressure are not further defined. In some cases, depending on the exact type of pressure-sensitive adhesive composition and / or pressure-sensitive adhesive, the temperature and humidity, as well as the substrate, the application of short-term, minimal pressure, which does not go beyond a light touch for a brief moment, is sufficient to achieve the adhesion effect; in other cases, a longer exposure to high pressure may be necessary.

[0015] Pressure-sensitive adhesive compositions and / or pressure-sensitive adhesives have special, characteristic viscoelastic properties that lead to their permanent tackiness and adhesive strength. They are characterized by the fact that, when mechanically deformed, both viscous flow processes and the development of elastic restoring forces occur. The respective proportions of both processes are in a specific relationship to each other, depending on the precise composition, structure, and degree of crosslinking of the pressure-sensitive adhesive composition and / or pressure-sensitive adhesive, as well as the speed and duration of the deformation and the temperature.

[0016] The viscous flow component is necessary to achieve adhesion. Only the viscous components, caused by macromolecules with relatively high mobility, enable good wetting and flow onto the substrate to be bonded. A high proportion of viscous flow leads to high pressure-sensitive adhesion (also referred to as tack or surface adhesion) and thus often also to high adhesive strength. Highly cross-linked systems, crystalline, or glass-like polymers, are generally not or at least only slightly tacky due to the lack of flowable components.

[0017] The proportional elastic restoring forces are necessary to achieve cohesion. They are caused, for example, by very long-chain and highly entangled macromolecules, as well as by physically or chemically cross-linked macromolecules, and enable the transfer of forces acting on an adhesive bond. They ensure that an adhesive bond can sufficiently withstand continuous loading, for example, in the form of permanent shear stress, over an extended period of time.

[0018] For a more precise description and quantification of the degree of elastic and viscous components as well as the ratio of the components to each other, the quantities storage modulus (G 1) and loss modulus (G") can be used. G' is a measure of the elastic component, G" a measure of the viscous component of a material. Both quantities depend on the deformation frequency and the temperature. The quantities can be determined using a rheometer. The material to be tested is subjected to a sinusoidal oscillating shear stress in a plate-on-plate arrangement, for example. In shear stress-controlled devices, the deformation is measured as a function of time and the time offset of this deformation compared to the application of the shear stress. This time offset is referred to as the phase angle θ.

[0019] The storage modulus G' is defined as follows: G' = (T / Y) • cos(ö) (T = shear stress, y = deformation, ö = phase angle = phase shift between shear stress and deformation vector). The definition of the loss modulus G" is: G" = (T / Y) 'Sin(ö) (T = shear stress, y = deformation, ö = phase angle = phase shift between shear stress and deformation vector).

[0020] A substance is generally considered to be pressure-sensitively adhesive and is defined as pressure-sensitively adhesive in the sense of the invention if, at room temperature, here defined as 23°C, in the deformation frequency range of 10° to 10 1 rad / sec G' at least partly in the range of 10 3 up to 10 7 Pa and if G" also lies at least partly in this range. "Partially" means that at least a section of the G' curve lies within the window defined by the deformation frequency range from 10° to 10 1rad / sec (abscissa) and the range of G' values ​​from 10 3 up to and including 10 7 Pa (ordinate). This applies accordingly to G".

[0021] Preferably, the polyacrylate pressure-sensitive adhesive (a1) and / or the synthetic rubber pressure-sensitive adhesive (a2) has a deformation frequency range of 10° to 10 1 rad / sec at 23 °C a storage modulus G' and a loss modulus G" in the range of 10 3 up to 10 7 Pa, determined according to DIN EN ISO 6721 .

[0022] Pressure-sensitive adhesive compositions and / or pressure-sensitive adhesives comprise at least one polymer component, comprising one or more polymers, which may be homopolymers and / or copolymers of various mutually polymerizable monomers. The polymer component may already exhibit pressure-sensitive adhesive properties, as is typically the case with polyacrylate pressure-sensitive adhesives, or may acquire these properties only after suitable additives, for example, with resins, as is typically the case with synthetic rubber pressure-sensitive adhesives. The polymer component can, in principle, be produced from polymers of different chemical nature.The pressure-sensitive adhesive properties of the pressure-sensitive adhesive composition and / or the pressure-sensitive adhesive can be influenced, among other things, by the type and quantity ratios of the monomers used in the polymerization of the polymers underlying the pressure-sensitive adhesive, their average molecular weight and molecular weight distribution, as well as by the type and quantity of additives in the pressure-sensitive adhesive composition and / or the pressure-sensitive adhesive, such as adhesive resins, plasticizers and the like.

[0023] To achieve viscoelastic properties, the monomers on which the polymers underlying the pressure-sensitive adhesive composition and / or the pressure-sensitive adhesive are based, as well as any other components present in the pressure-sensitive adhesive composition and / or the pressure-sensitive adhesive, are selected in particular such that the pressure-sensitive adhesive composition and / or the pressure-sensitive adhesive has a glass transition temperature (according to DIN 53765) below the application temperature (i.e., usually below room temperature (23 °C)). By suitable cohesion-enhancing measures, such as crosslinking reactions (formation of bridge-forming links between the macromolecules), the temperature range in which a polymer mass exhibits pressure-sensitive adhesive properties can be increased and / or shifted. The application range of the pressure-sensitive adhesives can thus be optimized by adjusting the flowability and cohesion of the mass.

[0024] Preferably, the polyacrylate pressure-sensitive adhesive (a1) and / or the synthetic rubber pressure-sensitive adhesive (a2) has a glass transition temperature of < 23 °C, determined according to DIN 53765.

[0025] In contrast to pressure-sensitive adhesive compositions and / or pressure-sensitive adhesives, hot-melt adhesives, e.g. based on polyamides, polyurethanes or modified polyethylenes, do not exhibit any tack at room temperature (23 °C), although this is also the case in hot-melt adhesive compositions.

[0026] According to the general understanding of those skilled in the art, an "adhesive resin" is understood to mean an oligomeric or polymeric resin that increases the adhesion (tack, inherent adhesiveness) of the pressure-sensitive adhesive composition compared to the pressure-sensitive adhesive composition containing no adhesive resin but otherwise being identical. Resins in the sense of this invention are oligomeric and polymeric compounds with a number-average molecular weight M nof not more than 10,000 g / mol. For nonpolar pressure-sensitive adhesive compositions, resins advantageously used in the pressure-sensitive adhesive composition include partially or fully hydrogenated resins based on rosin and rosin derivatives, hydrogenated polymers of dicyclopentadiene, partially, selectively, or fully hydrogenated hydrocarbon resins based on C5, C5 / C9, or C9 monomer streams, polyterpene resins based on α-pinene and / or β-pinene and / or δ-limonene and / or α3-carene, and hydrogenated polymers of preferably pure C8 and C9 aromatics. The aforementioned adhesive resins can be used alone or in mixtures.

[0027] For polar pressure-sensitive adhesive compositions, polar resins are known to those skilled in the art to be compatible, for example, terpene-phenol or rosin-based resins. The above-mentioned rosins include, for example, natural rosin, polymerized rosin, partially hydrogenated rosin, fully hydrogenated rosin, esterified products of these rosins (such as glycerol esters, pentaerythritol esters, ethylene glycol esters, and methyl esters), and rosin derivatives (such as disproportionation rosin, fumaric acid-modified rosin, and lime-modified rosin).

[0028] Adhesive resins based on acrylates and methacrylates are also known.

[0029] Both solid and liquid resins can be used at room temperature. To ensure high aging and UV stability, hydrogenated resins with a degree of hydrogenation of at least 90%, preferably at least 95%, are preferred.

[0030] The presentation of the state of knowledge in the "Handbook of Pressure Sensitive Adhesive Technology" by Donatas Satas (van Nostrand, 1989) is expressly referred to.

[0031] The adhesive resin component in the synthetic rubber pressure-sensitive adhesive (a2) preferably comprises terpene-phenolic resin and polyterpene. The synthetic rubber pressure-sensitive adhesive according to (a2) may additionally contain 1 to 30 wt. % of a plasticizer component.

[0032] The plasticizer component is defined as a plasticizer commonly used in the field of pressure-sensitive adhesive formulation that is liquid at room temperature, such as plasticizer oils, liquid resins, or low-molecular-weight liquid polymers, such as low-molecular-weight polybutenes. The synthetic rubber pressure-sensitive adhesive (a2) can in each case preferably be selected from the group consisting of acrylonitrile-butadiene rubber with an acrylonitrile content of more than 20% by weight, preferably more than 30% by weight; acrylonitrile-butadiene-acrylate rubber with an acrylonitrile content of more than 20% by weight, preferably more than 30% by weight; fluororubber, and polyurethane elastomer. The synthetic rubber pressure-sensitive adhesive (a2) is preferably selected in each case preferably from the group consisting of acrylonitrile-butadiene rubber with an acrylonitrile content of more than 20% by weight, preferably more than 30% by weight; Acrylonitrile-butadiene-acrylate rubber with an acrylonitrile content of more than 20 wt.-%, preferably more than 30 wt.%, and fluororubber. Further preferably, the synthetic rubber pressure-sensitive adhesive (a2) is an acrylonitrile-butadiene rubber with an acrylonitrile content of more than 20 wt.%, preferably more than 30 wt.%.

[0033] The fluororubber is preferably selected from the group consisting of a fluorine-containing elastomer with at least one segment Ai consisting of a terpolymer of vinylidene fluoride / hexafluoropropylene / tetrafluoroethylene or vinylidene fluoride / chlorotrifluoroethylene / tetrafluoroethylene, and at least one segment Bi consisting of a copolymer of tetrafluoroethylene / ethylene or chlorotrifluoroethylene / ethylene or polyvinylidene fluoride, a fluorine-containing elastomer with at least one segment A2 consisting of a copolymer of tetrafluoroethylene / propylene and at least one segment B2 consisting of a copolymer of tetrafluoroethylene / ethylene and a fluorine-containing elastomer with at least one segment A3 consisting of a copolymer of tetrafluoroethylene / perfluoroalkyl vinyl ether and at least one segment B3 consisting of a copolymer of tetrafluoroethylene / perfluoroalkyl vinyl ether, wherein the content of perfluoroalkyl vinyl ether is lower than in segment A3.

[0034] The polyurethane elastomer is preferably a polyether polyurethane.

[0035] Preferably, the synthetic rubber pressure-sensitive adhesive according to (a2) has a Hildebrandt solubility parameter δ of at least 19 MPa 1 / 2 , preferably at least 21 MPa 1 / 2 , determined as Reference Example 1.

[0036] The present invention also relates to a pressure-sensitive adhesive composition comprising (a) 35 to 90 wt.% of a polyacrylate pressure-sensitive adhesive (a1) preparable from a

[0037] Polymerization mixture containing 70 to 99.95 wt.% of at least one (meth)acrylic acid ester monomer and 0.05 to 30 wt.% of at least one crosslinking monomer, wherein at least 50 wt.% of the polymerization mixture consists of monomers having a Hansen solubility parameter δ H of at least 11

[0038] MPa 1 ' 2 , determined as in Reference Example 2;

[0039] (b) 2 to 15 wt.% of a salt component; and

[0040] (c) 5 to 50 wt.% of a (polymer) electrolyte component.

[0041] There are basically no particular restrictions with regard to the (meth)acrylic acid ester monomer of the pressure-sensitive adhesive composition according to the invention. The (meth)acrylic acid ester monomer is preferably selected from the group consisting of methyl acrylate, ethyl acrylate, propyl acrylate, methyl methacrylate, ethyl methacrylate, benzyl acrylate, benzyl methacrylate, sec-butyl acrylate, tert-butyl acrylate, phenyl acrylate, phenyl methacrylate, isobornyl acrylate, isobornyl methacrylate, tert-butylphenyl acrylate, tert-butylphenyl methacrylate, dodecyl methacrylate, isodecyl acrylate, lauryl acrylate, n-undecyl acrylate, stearyl acrylate, tridecyl acrylate, behenyl acrylate, cyclohexyl methacrylate, cyclopentyl methacrylate, phenoxyethyl acrylate, phenoxyethyl methacrylate, 2-butoxyethyl methacrylate, 2-butoxyethyl acrylate, 3,3,5-trimethylcyclohexyl acrylate, 3,5-dimethyladamantyl acrylate, 4-cumylphenyl methacrylate, cyanoethyl acrylate, cyanoethyl methacrylate, 4-biphenyl acrylate, 4-biphenyl methacrylate, 2-naphthyl acrylate,2-Naphthylmethacrylat, Tetrahydrofufurylacrylat, Diethylaminoethylacrylat, Diethylaminoethylmethacrylat, Dimethylaminoethylacrylat, Dimethylaminoethylmethacrylat, 3-Methoxyacrylsäuremethylester, 3-Methoxybutylacrylat, 2- Phenoxyethylmethacrylat, Butyldiglykolmethacrylat, Ethylenglycolacrylat,

[0042] Ethylenglycolmonomethylacrylat, Methoxypolyethylenglykolmethacrylat 350,

[0043] Methoxypolyethylenglykolmethacrylat 500, Propylenglycolmonomethacrylat,

[0044] Butoxydiethylenglykolmethacrylat, Ethoxytriethylenglykolmethacrylat, Octafluoropentylacrylat, Octafluoropentylmethacrylat, 2,2,2-T rifluorethylmethacrylat, 1 , 1 , 1 ,3,3,3-

[0045] Hexafluoroisopropylacrylat, 1 ,1 ,1 ,3,3,3-Hexafluoroisopropylmethacrylat, 2, 2, 3,3,3-

[0046] Pentafluoropropylmethacrylat, 2,2,3,4,4,4-Hexafluorobutylmethacrylat, 2, 2, 3, 3, 4,4,4-

[0047] Heptafluorobutylacrylat, 2,2,3,3,4,4,4-Heptafluorobutylmethacrylat, 2, 2, 3, 3, 4, 4, 5, 5, 6, 6, 7, 7, 8,8,8- Pentadecafluorooctylmethacrylat, 2-Hydroxyethylacrylat, 3-Hydroxypropylacrylat, 4- Hydroxybutylacrylat, 6-Hydroxyhexylacrylat, 2-Hydroxyethylmethacrylat, 3- Hydroxypropylmethacrylat, 4-Hydroxybutylmethacrylat, 6-Hydroxyhexylmethacrylat, 2-(2- Ethoxyethoxy)ethylacrylat, 2-Phenoxyethylacrylat, Glycidylacrylat, Glycidylmethacrylat. n- Butylacrylat, n-Butylmethacrylat, n-Pentylacrylat, n-Pentylmethacrylat, n-Amylacrylat, n- Hexylacrylat, n-Hexylmethacrylat, n-Heptylacrylat, n-Octylacrylat, n-Octylmethacrylat, n- Nonylacrylat, Isobutylacrylat, Isooctylacrylat, Isooctylmethacrylat, 2-Ethylhexylacrylat, 2-Ethylhexylmethacrylat, 2-Propylheptylacrylat und 2-Propylheptylmethacrylat.Further preferably, the at least one (meth)acrylic acid ester monomer can each preferably be selected from the group consisting of 2-cyanoethyl acrylate, 2-(2-ethoxyethoxy)ethyl acrylate, 2-phenoxyethyl acrylate and 2-hydroxyethyl methacrylate, preferably each preferably is selected from the group consisting of 2-cyanoethyl acrylate, 2-(2-ethoxyethoxy)ethyl acrylate and 2-phenoxyethyl acrylate, further preferably each preferably is selected from the group consisting of 2-cyanoethyl acrylate and 2-(2-ethoxyethoxy)ethyl acrylate.

[0048] Optionally, the polyacrylate pressure-sensitive adhesive according to (a1) contains further olefinically unsaturated monomers which are copolymerizable with the acrylic acid ester and / or methacrylic acid ester, such as, for example, itaconic acid, maleic acid, fumaric acid, crotonic acid, aconitic acid, ß-acryloyloxypropionic acid, vinylacetic acid, vinylphosphonic acid, maleic anhydride, acrylonitrile, methacrylonitrile; vinyl ethers such as vinyl methyl ether, ethyl vinyl ether, vinyl isobutyl ether; vinyl esters such as vinyl acetate; vinyl halides, vinylidene halides, vinylpyridine, 4-vinylpyridine, N-vinylphthalimide, styrene, a- and p-methylstyrene, a-butylstyrene, 4-n-butylstyrene, 4-n-decylstyrene, 3,4-dimethoxystyrene.

[0049] The polyacrylate pressure-sensitive adhesive according to (a1) can preferably be prepared from a polymerization mixture containing 80 to 99.5% by weight, preferably 90 to 99.5% by weight or 81 to 89% by weight of at least one (meth)acrylic acid ester monomer.

[0050] The polyacrylate pressure-sensitive adhesive according to (a1) can preferably be prepared from a polymerization mixture containing 0.5 to 20% by weight, preferably 0.5 to 10% by weight or 11 to 19% by weight of at least one crosslinking monomer.

[0051] The crosslinking monomer is preferably selected in each case from the group consisting of N-vinyl-caprolactam, N-vinylpyrrolidone, acrylamide, methacrylamide, N-methylacrylamide, methylmethacrylamide, N,N-dimethylacrylamide, diacetoneacrylamide and N,N-dimethylmethacrylamide, preferably in each case from the group consisting of N-vinyl-caprolactam, N-vinylpyrrolidone, N-methylacrylamide, N-methylmethacrylamide, N,N-dimethylacrylamide, diacetoneacrylamide and N,N-dimethylmethacrylamide, further preferably in each case from the group consisting of N-vinyl-caprolactam, N-methylacrylamide, N-methylmethacrylamide, N,N-dimethylacrylamide and N,N-dimethylmethacrylamide, further preferred is N,N-dimethylacrylamide. The polyacrylate pressure-sensitive adhesive according to (a1) can preferably be prepared from a polymerization mixture containing 20 to 30% by weight of 2-cyanoethyl acrylate and 55 to 65% by weight of 2-(2-ethoxyethoxy)ethyl acrylate.

[0052] The polyacrylate pressure-sensitive adhesive according to (a1) can preferably be prepared from a polymerization mixture containing 11 to 19 wt.% N,N-dimethylacrylamide.

[0053] The polyacrylate pressure-sensitive adhesive according to (a1) can preferably be prepared from a polymerization mixture containing 20 to 30% by weight of 2-cyanoethyl acrylate, 55 to 65% by weight of 2-(2-ethoxyethoxy)ethyl acrylate and 11 to 19% by weight of N,N-dimethylacrylamide.

[0054] There are basically no particular restrictions with regard to the salt component according to (b) of the pressure-sensitive adhesive composition according to the invention. Common salt components such as lithium hexafluorophosphate, usually used in a concentration of 1 mol / l, can also be used in the pressure-sensitive adhesive composition according to the invention. UCIO4 is also soluble in many solvents and polymers at high concentrations and has large anions and a high dissociation constant. 0.75 mol / l UCIO4 can be dissolved in 10 wt.% plasticized PMMA. Lithium bis(trifluoromethylsulfonyl)imide (LiTFSI) is advantageous with regard to its moisture resistance. In principle, however, other cations such as Na + , K + , Cs + , Rb + , Ag + , Cu + , Cu 2+ , Mg 2+and other anions such as ClBr, ClClO4; SCNAsFe', CF3SO3; CH3CO2; bis(oxalato)borate (BOB), BF4; [PF3(CF2CF3)3]' (FAP), trifluoromethylbenzimidazole anion, difluorooxalatoborate (FOB), and C(CF3SO2)3' can be used pure or in mixtures. Ionic liquids, preferably with bis(trifluoromethylsulfonyl)imide or methanesulfonate anions, are also advantageous salt components. A preferred cation for ionic liquids is 1-ethyl-3-methylimidazole.

[0055] Preferably, the salt component according to (b) is in each case preferably selected from the group consisting of potassium hydrogen phthalate, lithium triflate, lithium perchlorate, lithium hexafluorophosphate, 1-ethyl-3-methyl-imidazolium tetrafluoroborate, 1-ethyl-3-methyl-imidazolium trifluoromethanesulfonate, 1-ethyl-3-methyl-imidazolium ethylsulfate, lithium bis-(trifluoromethylsulfonyl)imide, lithium hexafluorophosphate, lithium tetrafluoroborate, 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)amide, 1-ethyl-3-methylimidazolium tetrafluoroborate, 1-ethyl-3-methylimidazolium methanesulfonate, choline chloride, choline acesulfamate and choline saccharinate.More preferably, the salt component according to (b) is in each case preferably selected from the group consisting of lithium bis(trifluoromethylsulfonyl)imide, lithium hexafluorophosphate and lithium tetrafluoroborate, 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)amide, 1-ethyl-3-methylimidazolium tetrafluoroborate and 1-ethyl-3-methylimidazolium methanesulfonate.

[0056] The pressure-sensitive adhesive composition preferably comprises 2 to <4 wt.%, other preferably >13 to 15 wt.%, other preferably 4 to 13 wt.% of a salt component according to (b).

[0057] Polar organic compounds that exist as liquids below 100 °C and have a boiling point at 1013 mbar of 100 °C or more and those that do not have a boiling point at 1013 mbar but decompose at 100 °C or more can be used as (polymer) electrolyte components.

[0058] As the (polymer) electrolyte component according to (c), preferably cyclic carbonates such as ethylene carbonate (EC), vinylene carbonate (VC), propylene carbonate (PC), butylene carbonate (BC) or fluoroethylene carbonate (FEC), linear carbonates such as dimethyl carbonate (DMC), diethyl carbonate (DEC) or ethyl methyl carbonate (EMC), mixed carbonates, dimethylacetamide, ethyl methanesulfonate (EMS), gamma-butyrolactone, dimethyl sulfoxide, "glymes" such as diglyme, triglyme, tetraglyme, ethylene glycol diacetate, ketones, or various ethers or polyethers or mixtures thereof are used. According to the invention, diethyl carbonate (DEC) and / or ethylene carbonate (EC) are particularly preferably used as the (polymer) electrolyte component. Dimethylacetamide, in particular, can be used, for example, without significantly reducing the solubility of the conductive salt.

[0059] The (polymer) electrolyte component according to (c) may also comprise one or more polymers (wherein these polymers are also understood to include oligomers in the context of the present invention) and may have a linear or branched structure. It must ensure solvation of the salt component according to (b) contained in the pressure-sensitive adhesive composition according to the invention.

[0060] The (polymer) electrolyte component according to (c) can comprise at least one polymer(s) with a melting point below 100°C. For the purposes of this invention, this also means the upper limit of a melting range if the polymer or polymer mixture does not have an exact melting point. In particular, therefore, polymers which are in the liquid phase in the temperature range from 20°C to 100°C are suitable for the (polymer) electrolyte component (c). Furthermore, polymers which have a viscosity in the range from 1 mPas to 1000 Pas at 23°C are particularly suitable for the (polymer) electrolyte component (c). Particular preference is given to polymers which are in the liquid phase at 23°C and / or have a viscosity in the range from 10 mPas to 100 Pas. (Polymer) electrolyte components (c) with such melting points or viscosities ensure good dispersibility orMiscibility of the (polymer) electrolyte component (c) with the salt component (b).

[0061] Furthermore, the (polymer) electrolyte component according to (c) is preferably of a molecular weight of 200 to 4000 g mol' 1 It has also been found that for many applications a molar mass of 200 to 1500 g mol -1 is useful to ensure mobility of the (polymer) electrolyte component (c).

[0062] The (polymer) electrolyte component according to (c) is preferably selected from the group consisting of polyethers, polyesters, polyimines, polysulfides, and polyphosphazenes. Suitable examples include PEO (polyethylene oxide), PPG (polypropylene oxide), polyethylene succinate, polyethyleneimine, polymethylene sulfide, polyethylene adipate, and poly-b-propionlactone.

[0063] Preferably, the (polymer) electrolyte component according to (c) is in each case preferably selected from the group consisting of polyethylene carbonate, polyvinylene carbonate, polypropylene carbonate, polybutylene carbonate, polyfluoroethylene carbonate, polydimethyl carbonate, polydiethyl carbonate, polyethyl methyl carbonate, polydimethylacetamide, polyethyl methanesulfonate, polygammabutyrolactone, polydimethyl sulfoxide, polyethylene glycol diacetate and poly(ethylene glycol) bis(2-ethoxyhexanoate). Further preferably, the (polymer) electrolyte component according to (c) is in each case preferably selected from the group consisting of polydiethylene carbonate, polyethylene carbonate and poly(ethylene glycol) bis(2-ethoxyhexanoate). Further preferably, the (polymer) electrolyte component according to (c) is in each case preferably polyethylene carbonate and poly(ethylene glycol) bis(2-ethoxyhexanoate).

[0064] Preferably, the (polymer) electrolyte component according to (c) is in each case preferably selected from the group consisting of ethylene carbonate, vinylene carbonate, propylene carbonate, butylene carbonate, fluoroethylene carbonate, dimethyl carbonate, diethyl carbonate, ethyl methyl carbonate, dimethylacetamide, ethyl methanesulfonate, gamma butyrolactone, dimethyl sulfoxide, ethylene glycol diacetate, tri(ethylene glycol) bis(2-ethoxyhexanoate) and tetra(ethylene glycol) di(2-ethylhexanoate), more preferably in each case preferably selected from the group consisting of diethylene carbonate, ethylene carbonate, tri(ethylene glycol) bis(2-ethoxyhexanoate) and tetra(ethylene glycol) di(2-ethylhexanoate), more preferably in each case preferably selected from the group consisting of ethylene carbonate, tri(ethylene glycol) bis(2-ethoxyhexanoate) and tetra(ethylene glycol) di(2-ethylhexanoate).

[0065] The pressure-sensitive adhesive composition preferably comprises 5 to <7 wt.% of a (polymer) electrolyte component according to (c). This lessens the impact on the wet / warm resistance of the bond. Furthermore, the pressure-sensitive adhesive composition preferably comprises >40 to 50 wt.% of a (polymer) electrolyte component according to (c). This allows for faster detachment of the adhesive bond. Furthermore, the pressure-sensitive adhesive composition preferably comprises 7 to 40 wt.% of a (polymer) electrolyte component according to (c).

[0066] The base component (a) preferably contains a polyacrylate pressure-sensitive adhesive according to (a1).

[0067] The base component (a) preferably contains a synthetic rubber pressure-sensitive adhesive according to (a2).

[0068] The pressure-sensitive adhesive composition may contain further components such as (further) adhesive resins, plasticizers, crosslinkers or reactive resins, initiators, fillers, particularly preferably expandable or expanded microspheres, or anti-aging agents, whereby the list of additives is to be understood only as an example and not as limiting.

[0069] The present invention further relates to a process for producing the pressure-sensitive adhesive composition, wherein the polyacrylate pressure-sensitive adhesive according to (a1) is produced by solvent polymerization in a solvent. The solvent is preferably selected from the group consisting of acetone, ethyl acetate, methyl ethyl ketone, ethanol, propanol, and isopropanol. The solvent polymerization is preferably carried out in at least 50 wt.% solvent.

[0070] Furthermore, the present invention relates to a pressure-sensitive adhesive tape comprising at least one layer of the pressure-sensitive adhesive composition according to the invention.

[0071] The present invention further relates to a pressure-sensitive adhesive tape comprising at least one electrically conductive carrier material and at least one layer of the pressure-sensitive adhesive composition of the invention. A pressure-sensitive adhesive tape is preferred in which at least one electrically conductive carrier material is arranged between at least two layers of the pressure-sensitive adhesive composition of the invention.

[0072] Also preferred is a pressure-sensitive adhesive tape wherein at least one electrically conductive carrier material is arranged between at least one layer of a pressure-sensitive adhesive composition according to the invention and at least one adhesive layer different from the pressure-sensitive adhesive composition according to the invention.

[0073] Also preferred is a pressure-sensitive adhesive tape wherein at least one layer of the pressure-sensitive adhesive composition according to the invention is arranged between at least two layers of an electrically conductive carrier material.

[0074] An electrically conductive substrate has a sheet resistance of no more than 1000 ohms / square. The sheet resistance of a layer can be measured using, for example, the four-point method, the special Van der Pauw method, or a non-contact measurement with a special eddy current tester.

[0075] All electrically conductive carrier materials known to those skilled in the art from the adhesive tape sector can be used as the electrically conductive carrier material for the adhesive tape. Preference is given to using metal foils and metallized polymer films, papers, fabrics, nonwovens, or film composites. A carrier material can form a continuous or perforated layer. Particular preference is given to metallized polymer films, in particular those with a metallization comprising aluminum. Very particular preference is given to an aluminized polyester film. The metal layer of the metallized polymer film, in particular of the aluminized polyester film, is preferably protected against corrosion with a further polymeric layer, for example a lacquer, wherein the thickness of the further polymeric layer does not exceed 20 μm. This enables improved storage stability of the adhesive tape.

[0076] The present invention further relates to a pressure-sensitive adhesive tape comprising at least one layer of the pressure-sensitive adhesive composition according to the invention and at least one perforated carrier material, wherein the pressure-sensitive adhesive composition substantially fills the perforations in the carrier material. This enables a current conduction path through the perforated carrier material. With regard to the thickness of the layer of the pressure-sensitive adhesive composition according to the invention in a pressure-sensitive adhesive tape, there are fundamentally no particular restrictions. Typical thicknesses are in the range from 1 to 2000 μm. The layer of the pressure-sensitive adhesive composition according to the invention in a pressure-sensitive adhesive tape preferably has a thickness of 1 μm to 50 μm, more preferably a thickness of 1 μm to 30 μm, more preferably a thickness of 1 μm to 10 μm, more preferably a thickness of 1 μm to 4 μm.

[0077] The general term "pressure-sensitive adhesive tape" encompasses, within the meaning of this invention, all flat structures whose extent in two spatial directions (x-direction and y-direction; length and width) is substantially greater than in the third spatial direction (z-direction; thickness), such as films or film sections, tapes with extended length and limited width, tape sections, die-cuts, labels and the like.

[0078] A “pressure-sensitive adhesive tape” comprises, on the one hand, a carrier material which is provided with a pressure-sensitive adhesive composition on one or both sides and may optionally have further intermediate layers.

[0079] The pressure-sensitive adhesive tape can be produced in roll form, i.e., wound upon itself in the shape of an Archimedean spiral, or covered on the adhesive side with release materials such as siliconized paper or siliconized film. Pressure-sensitive adhesive tapes can also be produced that use a single, double-sided release liner instead of two liners. The pressure-sensitive adhesive layer is then covered on its upper side with one side of a double-sided release liner, and its underside with the back of the double-sided release liner, particularly on an adjacent winding on a bale or roll.

[0080] The term "pressure-sensitive adhesive tape" within the meaning of the present invention also includes so-called "transfer pressure-sensitive adhesive tapes," i.e., pressure-sensitive adhesive tapes without a carrier. Rather, with a transfer pressure-sensitive adhesive tape, the pressure-sensitive adhesive composition is applied between flexible liners provided with a release layer and / or having anti-adhesive properties prior to application. For application, one liner is usually removed first, the pressure-sensitive adhesive composition is applied, and then the second liner is removed. The pressure-sensitive adhesive composition can thus be used directly to bond two surfaces. Such a pressure-sensitive, carrier-free transfer pressure-sensitive adhesive tape enables very precise bonding in terms of positioning and dosage. Pressure-sensitive adhesive tapes coated on one or both sides with a pressure-sensitive adhesive composition are usually wound or cross-wound into a roll in the shape of an Archimedean spiral at the end of the manufacturing process.In order to prevent the pressure-sensitive adhesive compositions of double-sided adhesive tapes—especially pressure-sensitive adhesive tapes—from coming into contact with one another, or in the case of single-sided pressure-sensitive adhesive tapes, to prevent the pressure-sensitive adhesive composition from sticking to the carrier, the pressure-sensitive adhesive tapes are covered with a release liner (also referred to as a release material) prior to winding, which is wound up together with the pressure-sensitive adhesive tape. Such release liners are known to those skilled in the art as liners or release liners. In addition to covering single- or double-sided pressure-sensitive adhesive tapes, liners are also used to cover pure pressure-sensitive adhesive compositions (transfer tape) and pressure-sensitive adhesive tape sections (e.g., labels). These liners also ensure that the pressure-sensitive adhesive composition is not contaminated prior to use.

[0081] A liner, or more generally, a temporary carrier, is not a component of a pressure-sensitive adhesive tape, but merely an aid for its production, storage, and / or further processing by die-cutting. Furthermore, unlike a permanent carrier, a liner is not permanently bonded to a pressure-sensitive adhesive composition layer, but rather functions as a temporary carrier, i.e., a carrier that can be removed from the pressure-sensitive adhesive composition layer. "Permanent carriers" are synonymously referred to in the present application as simply "carriers" or "carrier material."

[0082] Any carrier material known to those skilled in the art from the adhesive tape sector can be used as the carrier material for the adhesive tape. Polymer films, papers, fabrics, nonwovens, metal foils, or film composites are preferred. A carrier material can form a continuous or perforated layer. Particular preference is given to polymer films, which can be single-layered or multi-layered. A multi-layer structure can be achieved by coextrusion, lamination using an adhesive, or extrusion coating. The polymer films can be made from any of the plastics commonly used in film production. Examples of these include, but are not limited to:

[0083] Polyethylene - in particular HDPE, MDPE, LDPE, LLDPE, or co- and block copolymers of ethylene, polypropylene - in particular oriented polypropylene produced by mono- or biaxial stretching (OPP), where HOMO-PP, HECO-PP or rPP can be used as the polymer, ionomers based on ethylene or propylene, MSA-grafted polymers, cyclic olefin copolymers (COC), polyvinyl chloride (PVC), polyester - in particular biaxially stretched polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), ethylene vinyl alcohol (EVOH), polyethylene vinyl acetate (EVA), polyvinylidene chloride (PVDC), polyvinylidene fluoride (PVDF), polyacrylonitrile (PAN), polycarbonate (PC), polyamide (PA), cellulose acetate, polymethyl methacrylate (PMMA), polyvinyl alcohol, polyurethane (PU), polyethersulfone (PES), paper or polyimide (PI).The aforementioned exemplary polymers can be used as a 100% system, as a blend with one or more other of the aforementioned exemplary polymers or in combination with other additives such as fillers, antioxidants, lubricants, antiblocking agents, dyes, pigments.

[0084] The present invention further relates to adhesion promoters comprising the pressure-sensitive adhesive composition of the invention and at least one solvent or dispersant. The preferred solvents are each preferably selected from the group consisting of acetone, ethyl acetate, methyl ethyl ketone, ethanol, propanol, and isopropanol.

[0085] Furthermore, the present invention relates to an adhesive bond comprising a layer of the pressure-sensitive adhesive composition according to the invention.

[0086] There are fundamentally no particular restrictions regarding the thickness of the layer of the pressure-sensitive adhesive composition according to the invention in an adhesive bond. An adhesive bond in which the layer of the pressure-sensitive adhesive composition according to the invention has a thickness of 1 μm to 50 μm, preferably a thickness of 1 μm to 30 μm, more preferably a thickness of 1 μm to 10 μm, and more preferably a thickness of 1 μm to 4 μm is preferred.

[0087] Furthermore, the present invention relates to a method for releasing a pressure-sensitive adhesive bond, wherein an electrical direct voltage of between 10 and 240 V is applied to at least one layer of a pressure-sensitive adhesive substantially perpendicular to the layer plane.

[0088] The present invention further relates to a method for releasing a pressure-sensitive adhesive bond, wherein an electrical direct voltage of between 10 and 240 V, preferably between 10 and 60 V or between 60 and 240 V, is applied to at least one layer of the pressure-sensitive adhesive composition according to the invention substantially perpendicular to the layer plane. The electrical direct voltage is preferably applied for a period of between 1 second and 20 minutes. Furthermore, at least one layer of the pressure-sensitive adhesive composition according to the invention is preferably heated simultaneously to a temperature of between 35 and 80°C, more preferably to a temperature of between 45 and 75°C, more preferably to a temperature of between 55 and 70°C.

[0089] The present invention, as described above, is further described by the following set of embodiments and combinations of embodiments, wherein the combinations result from the corresponding dependencies and references. In particular, it should be noted that in those places where a range of embodiments is mentioned—for example, in connection with an expression such as “pressure-sensitive adhesive composition according to any one of embodiments 1 to 5”—each individual embodiment in this range is explicitly disclosed to the person skilled in the art, and this expression is therefore understood by the person skilled in the art as synonymous with the expression “pressure-sensitive adhesive composition according to any one of embodiments 1, 2, 3, 4, and 5.”Furthermore, it should be explicitly pointed out that the following set of embodiments does not represent the set of patent claims determining the scope of protection, but rather a suitably structured part of the description directed to general and preferred aspects of the present invention.

[0090] 1. Pressure-sensitive adhesive composition comprising

[0091] (a) 35 to 90 wt.% of at least one base component is selected from the group consisting of a polyacrylate pressure-sensitive adhesive (a1) and a synthetic rubber pressure-sensitive adhesive (a2); wherein the polyacrylate pressure-sensitive adhesive (a1) is preparable from a polymerization mixture containing 70 to 99.95 wt.% of at least one (meth)acrylic acid ester monomer and 0.05 to 30 wt.% of at least one crosslinker monomer, each preferably selected from the group consisting of secondary amides and tertiary amides; wherein the synthetic rubber pressure-sensitive adhesive (a2) comprises 50 to 95 wt.% of a synthetic rubber component and 5 to 50 wt.% of an adhesive resin component;

[0092] (b) 2 to 15 wt.% of a salt component; and

[0093] (c) 5 to 50 wt.% of a (polymer) electrolyte component. 2. Pressure-sensitive adhesive composition according to embodiment 1, wherein the adhesive resin component is preferably selected from the group consisting of terpene-phenolic resin and polyterpene.

[0094] 3. Pressure-sensitive adhesive composition according to embodiment 1 or 2, wherein the synthetic rubber pressure-sensitive adhesive according to (a2) additionally contains 1 to 30 wt.% of a plasticizer component.

[0095] 4. Pressure-sensitive adhesive composition according to one of embodiments 1 to 3, wherein the synthetic rubber pressure-sensitive adhesive according to (a2) is in each case preferably selected from the group consisting of acrylonitrile-butadiene rubber with an acrylonitrile content of more than 20% by weight, preferably more than 30% by weight; acrylonitrile-butadiene-acrylate rubber with an acrylonitrile content of more than 20% by weight, preferably more than 30% by weight; fluororubber and polyurethane elastomer, further preferably in each case preferably selected from the group consisting of acrylonitrile-butadiene rubber with an acrylonitrile content of more than 20% by weight, preferably more than 30% by weight; Acrylonitrile-butadiene-acrylate rubber with an acrylonitrile content of more than 20 wt.%, preferably more than 30 wt.% and fluororubber, more preferably the synthetic rubber pressure-sensitive adhesive according to (a2) consists of an acrylonitrile-butadiene rubber with an acrylonitrile content of more than 20 wt.%, preferably more than 30 wt.-%.

[0096] 5. Pressure-sensitive adhesive composition according to embodiment 4, wherein the fluororubber is preferably selected from the group consisting of a fluorine-containing elastomer having at least one segment Ai consisting of a terpolymer of vinylidene fluoride / hexafluoropropylene / tetrafluoroethylene or vinylidene fluoride / chlorotrifluoroethylene / tetrafluoroethylene, and at least one segment Bi consisting of a copolymer of tetrafluoroethylene / ethylene or chlorotrifluoroethylene / ethylene or polyvinylidene fluoride, a fluorine-containing elastomer having at least one segment A2 consisting of a copolymer of tetrafluoroethylene / propylene and at least one segment B2 consisting of a copolymer of tetrafluoroethylene / ethylene and a fluorine-containing elastomer having at least one segment A3 consisting of a copolymer of tetrafluoroethylene / perfluoroalkyl vinyl ether and at least one segment B3 consisting of a copolymer of tetrafluoroethylene / perfluoroalkyl vinyl ether,where the content of perfluoroalkyl vinyl ether is lower than in segment A3.,

[0097] 6. Pressure-sensitive adhesive composition according to embodiment 4, wherein the polyurethane elastomer is a polyether polyurethane. Pressure-sensitive adhesive composition according to any one of embodiments 1 to 6, wherein the synthetic rubber pressure-sensitive adhesive according to (a2) has a Hildebrandt solubility parameter δ of at least 19 MPa 1 / 2 , preferably at least 21 MPa 1 / 2 , determined as Reference Example 1. Pressure-sensitive adhesive composition comprising

[0098] (a) 35 to 90 wt.% of a polyacrylate pressure-sensitive adhesive (a1) preparable from a polymerization mixture containing 70 to 99.95 wt.% of at least one (meth)acrylic acid ester monomer and 0.05 to 30 wt.% of at least one crosslinker monomer, wherein at least 50 wt.% of the polymerization mixture consists of monomers which have a Hansen solubility parameter δ H of at least 11 MPa1 / 2, determined as in Reference Example 2;

[0099] (b) 2 to 15 wt.% of a salt component; and

[0100] (c) 5 to 50 wt.% of a (polymer) electrolyte component. Pressure-sensitive adhesive composition according to embodiments 1 or 8, wherein the at least one (meth)acrylic acid ester monomer is preferably selected from the group consisting of 2-cyanoethyl acrylate, 2-(2-ethoxyethoxy)ethyl acrylate, 2-phenoxyethyl acrylate and 2-hydroxyethyl methacrylate, preferably preferably selected from the group consisting of 2-cyanoethyl acrylate, 2-(2-ethoxyethoxy)ethyl acrylate and 2-phenoxyethyl acrylate, further preferably selected from the group consisting of 2-cyanoethyl acrylate and 2-(2-ethoxyethoxy)ethyl acrylate. Pressure-sensitive adhesive composition according to one of embodiments 1 or 8 to 9, wherein the polyacrylate pressure-sensitive adhesive according to (a1) is preparable from a polymerization mixture comprising 80 to 99.5 wt.%, preferably 90 to 99.5 wt.% or 81 to 89 % by weight of at least one (meth)acrylic acid ester monomer.Pressure-sensitive adhesive composition according to one of embodiments 1 or 8 to 10, wherein the polyacrylate pressure-sensitive adhesive according to (a1) can be prepared from a polymerization mixture comprising 0.5 to 20% by weight, preferably 0.5 to 10% by weight or 11 to 19% by weight of at least one crosslinking monomer.Pressure-sensitive adhesive composition according to one of embodiments 1 or 8 to 12, wherein the crosslinking monomer is preferably selected in each case from the group consisting of N-vinylcaprolactam, N-vinylpyrrolidone, acrylamide, methacrylamide, N-methylacrylamide, methylmethacrylamide, N,N-dimethylacrylamide, diacetoneacrylamide and N,N-dimethylmethacrylamide, preferably in each case from the group consisting of N-vinylcaprolactam, N-vinylpyrrolidone, N-methylacrylamide, N-methylmethacrylamide, N,N-dimethylacrylamide, diacetoneacrylamide and N,N-dimethylmethacrylamide, further preferably in each case from the group consisting of N-vinylcaprolactam, N-methylacrylamide, N-methylmethacrylamide, N,N-dimethylacrylamide and N,N-dimethylmethacrylamide, further preferably N,N-Dimethylacrylamide.The pressure-sensitive adhesive composition according to any one of embodiments 1 or 8 to 12, wherein the polyacrylate pressure-sensitive adhesive according to (a1) is preparable from a polymerization mixture comprising 20 to 30 wt. % 2-cyanoethyl acrylate and 55 to 65 wt. % 2-(2-ethoxyethoxy)ethyl acrylate. The pressure-sensitive adhesive composition according to any one of embodiments 1 or 8 to 13, wherein the polyacrylate pressure-sensitive adhesive according to (a1) is preparable from a polymerization mixture comprising 11 to 19 wt. % N,N-dimethylacrylamide. Pressure-sensitive adhesive composition according to any one of embodiments 1 or 8 to 14, wherein the polyacrylate pressure-sensitive adhesive according to (a1) is preparable from a polymerization mixture comprising 20 to 30 wt. % 2-cyanoethyl acrylate, 55 to 65 wt. % 2-(2-ethoxyethoxy)ethyl acrylate, and 11 to 19 wt. % N,N-dimethylacrylamide. Pressure-sensitive adhesive composition according to any one of embodiments 1 to 15, wherein the.

[0101] Salt component according to (b) is preferably selected from the group consisting of potassium hydrogen phthalate, lithium triflate, lithium perchlorate, lithium hexafluorophosphate, 1-ethyl-3-methyl-imidazolium tetrafluoroborate, 1-ethyl-3-methyl-imidazolium trifluoromethanesulfonate, 1-ethyl-3-methyl-imidazolium ethylsulfate, lithium bis-(trifluoromethylsulfonyl)imide, lithium hexafluorophosphate,

[0102] Lithium tetrafluoroborate, 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)amide, 1-ethyl-3-methylimidazolium tetrafluoroborate, 1-ethyl-3-methylimidazolium methanesulfonate, choline chloride, choline acesulfamate and choline saccharinate, each preferably selected from the group consisting of lithium bis(trifluoromethylsulfonyl)imide, lithium hexafluorophosphate and lithium tetrafluoroborate, 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)amide, 1-ethyl-3-methylimidazolium tetrafluoroborate and 1-ethyl-3-methylimidazolium methanesulfonate.

[0103] 17. Pressure-sensitive adhesive composition according to any of embodiments 1 to 16, wherein the pressure-sensitive adhesive composition comprises 2 to <4 wt.%, other preferably >13 to 15 wt.%, other preferably 4 to 13 wt.% of a salt component according to (b).

[0104] 18. Pressure-sensitive adhesive composition according to any one of embodiments 1 to 17, wherein the

[0105] (Polymer) electrolyte component according to (c) is preferably selected from the group consisting of polyethylene carbonate, polyvinylene carbonate,

[0106] polypropylene carbonate, polybutylene carbonate, polyfluoroethylene carbonate,

[0107] polydimethyl carbonate, polydiethyl carbonate, polyethyl methyl carbonate,

[0108] Polydimethylacetamide, polyethyl methanesulfonate, polygammabutyrolactone,

[0109] Polydimethyl sulfoxide, polyethylene glycol diacetate and poly(ethylene glycol) bis(2-ethoxyhexanoate), preferably each preferably selected from the group consisting of polydiethylene carbonate, polyethylene carbonate and poly(ethylene glycol) bis(2-ethoxyhexanoate), more preferably each preferably polyethylene carbonate and poly(ethylene glycol) bis(2-ethoxyhexanoate).

[0110] 19. Pressure-sensitive adhesive composition according to any one of embodiments 1 to 17, wherein the (polymer) electrolyte component according to (c) is preferably selected in each case from the group consisting of ethylene carbonate, vinylene carbonate, propylene carbonate, butylene carbonate, fluoroethylene carbonate, dimethyl carbonate, diethyl carbonate, ethyl methyl carbonate, dimethylacetamide, ethyl methanesulfonate, gamma-butyrolactone, dimethyl sulfoxide, ethylene glycol diacetate, tri(ethylene glycol) bis(2-ethoxyhexanoate) and tetra(ethylene glycol) di(2-ethylhexanoate), more preferably each is preferably selected in each case from the group consisting of diethylene carbonate, ethylene carbonate, tri(ethylene glycol) bis(2-ethoxyhexanoate) and tetra(ethylene glycol) di(2-ethylhexanoate), more preferably each is preferably selected in each case from the group consisting of ethylene carbonate, Tri(ethylene glycol) bis(2-ethoxyhexanoate) and tetra(ethylene glycol) di(2-ethylhexanoate).

[0111] 20. Pressure-sensitive adhesive composition according to any one of embodiments 1 to 19, wherein the

[0112] Pressure-sensitive adhesive composition comprises 5 to <7 wt.%, otherwise preferably >40 to 50 wt.%, otherwise preferably 7 to 40 wt.% of a (polymer) electrolyte component according to (c).

[0113] 21. Pressure-sensitive adhesive composition according to embodiment 1, wherein the base component according to (a) contains a polyacrylate pressure-sensitive adhesive according to (a1).

[0114] 22. Pressure-sensitive adhesive composition according to embodiment 1, wherein the base component according to (a) contains a synthetic rubber pressure-sensitive adhesive according to (a2).

[0115] 23. A process for preparing the pressure-sensitive adhesive composition according to any one of embodiments 1 or 8 to 22, wherein the polyacrylate pressure-sensitive adhesive according to (a1) is prepared by means of solvent polymerization in a solvent.

[0116] 24. The process according to embodiment 23, wherein the solvent is preferably selected from the group consisting of acetone, ethyl acetate, methyl ethyl ketone, ethanol, propanol and isopropanol.

[0117] 25. The process according to embodiment 23 or 24, wherein the solvent polymerization is carried out in at least 50 wt% solvent.

[0118] 26. Pressure-sensitive adhesive tape comprising at least one layer of a pressure-sensitive adhesive composition according to any one of embodiments 1 to 22.

[0119] 27. Pressure-sensitive adhesive tape comprising at least one electrically conductive carrier material and at least one layer of a pressure-sensitive adhesive composition according to any one of embodiments 1 to 22.

[0120] 28. Pressure-sensitive adhesive tape according to embodiment 27, wherein at least one electrically conductive carrier material is arranged between at least two layers of the pressure-sensitive adhesive composition according to any one of embodiments 1 to 22.

[0121] 29. Pressure-sensitive adhesive tape according to embodiment 27 or 28, wherein at least one electrically conductive carrier material is arranged between at least one layer of a pressure-sensitive adhesive composition according to any one of embodiments 1 to 22 and at least one adhesive layer different from the pressure-sensitive adhesive composition. Pressure-sensitive adhesive tape according to embodiment 27, wherein at least one layer of a pressure-sensitive adhesive composition according to any one of embodiments 1 to 22 is arranged between at least two layers of an electrically conductive carrier material. Pressure-sensitive adhesive tape comprising at least one layer of a pressure-sensitive adhesive composition according to any one of embodiments 1 to 22 and at least one perforated carrier material, wherein the pressure-sensitive adhesive composition substantially fills the perforations in the carrier material.Pressure-sensitive adhesive tape according to any of embodiments 26 to 31, wherein the layer of the pressure-sensitive adhesive composition according to any of embodiments 1 to 22 has a thickness of 1 μm to 50 μm, preferably a thickness of 1 μm to 30 μm, further preferably a thickness of 1 μm to 10 μm, further preferably a thickness of 1 μm to 4 μm. Adhesion promoter comprising a pressure-sensitive adhesive composition according to any of embodiments 1 to 22 and at least one solvent or a dispersant. Adhesive bond comprising a layer of a pressure-sensitive adhesive composition according to any of embodiments 1 to 22. Adhesive bond according to embodiment 34, wherein the layer of the pressure-sensitive adhesive composition according to any of embodiments 1 to 22 has a thickness of 1 μm to 50 μm, preferably a thickness of 1 μm to 30 μm, further preferably a thickness of 1 μm to 10 μm, further preferably a thickness of 1 μm to 4 μm.A method for releasing a pressure-sensitive adhesive bond, wherein an electrical direct voltage of between 10 and 240 V is applied to at least one layer of a pressure-sensitive adhesive substantially perpendicular to the layer plane. A method for releasing a pressure-sensitive adhesive bond, wherein an electrical direct voltage of between 10 and 240 V is applied to at least one layer of a pressure-sensitive adhesive composition according to any one of embodiments 1 to 22, substantially perpendicular to the layer plane. 38. A method according to embodiment 36 or 37, wherein the electrical direct voltage is applied for a period of between 1 second and 20 minutes.

[0122] 39. The process according to any one of embodiments 36 to 38, wherein the at least one layer of the pressure-sensitive adhesive composition is simultaneously heated to a temperature of 35 to 80°C, preferably to a temperature of 45 to 75°C, more preferably to a temperature of 55 to 70°C.

[0123] Short description of the characters

[0124] In detail:

[0125] Figures 1 to 2: Two embodiments of a pressure-sensitive adhesive tape comprising an electrically conductive carrier material 11 and two layers of a pressure-sensitive adhesive composition 10 according to the invention in contact with two electrically conductive substrates 12. Depending on the electrical wiring, the level of release of the adhesive bond can be controlled.

[0126] Figure 3: Embodiment of a pressure-sensitive adhesive tape comprising an electrically conductive carrier material 11, a layer of a pressure-sensitive adhesive composition 10 according to the invention in contact with an electrically conductive substrate 12 and a layer of a (permanent) adhesive 13.

[0127] Figure 4: Embodiment of a pressure-sensitive adhesive tape comprising an electrically conductive carrier material 11, a layer of a pressure-sensitive adhesive composition 10 according to the invention in contact with an electrically conductive substrate 12, in which a reversal of the polarity of the applied DC voltage in Fig. 4b in comparison to Figure 4a (detachment at the substrate) causes detachment at the electrically conductive carrier material.

[0128] Figure 5: Embodiment of a pressure-sensitive adhesive tape comprising an electrically conductive carrier material 11, a layer of a pressure-sensitive adhesive composition 10 according to the invention in contact with an electrically conductive substrate 12 and a layer of a (permanent) adhesive 13 in contact with an electrically non-conductive substrate 14.

[0129] Figure 6: Embodiment of a pressure-sensitive adhesive tape comprising a layer of a pressure-sensitive adhesive composition 10 according to the invention in contact with two electrically conductive substrates 12. Figure 7: Embodiment of a pressure-sensitive adhesive tape comprising two electrically conductive substrates 12 and two layers of a pressure-sensitive adhesive composition 10 according to the invention in contact with a perforated carrier material, thereby enabling the flow of ions through the entire pressure-sensitive adhesive tape.

[0130] Figure 8: Embodiment of a pressure-sensitive adhesive tape comprising two electrically non-conductive substrates 14, a layer of a pressure-sensitive adhesive composition 10 according to the invention in contact with two layers of an electrically conductive carrier material, each of which is in contact with the substrate 14 with a layer of an adhesive composition 13.

[0131] Description of the embodiments

[0132] Reference examples

[0133] Reference Example 1: Hildebrandt Solubility Parameter

[0134] The Hildebrandt solubility parameter is taken from the literature or calculated from available values ​​for the cohesive energy density (e.g., Allan FM Barton: Handbook of Solubility Parameters and Other Cohesion Parameters, Second Edition CRC 1991). If no literature value is available, the Hildebrand solubility parameter is calculated as the square root of the sum of the squares of the Hansen parameters.

[0135] Reference Example 2: Hansen Solubility Parameter

[0136] The values ​​for the Hansen solubility parameters are taken from the literature (e.g. Hansen C.: Hansen Solubility Parameters: a User's Handbook, 2 nded., CRC Press, 2007 or https: / / www.stevenabbott.co.uk / practical-solubility / hsp-basics.php, accessed August 18, 2020). If solubility parameters are not available in the literature, they are calculated using the group contribution method of Stefanis-Panayiotou (Int. J. Thermophys 2008, Vol. 29, pages 568 to 585).

[0137] Reference example 3: Adhesive strength

[0138] The adhesive strength is determined analogously to ISO 29862 (Method 3) at 23 °C and 50% relative humidity, at a peel speed of 300 mm / min and a peel angle of 180°. The thickness of the pressure-sensitive adhesive composition is 50 μm in each case. An etched PET film with a thickness of 50 μm, available from Coveme (Italy), is used as the reinforcing film.

[0139] Steel plates are used as the substrate in accordance with the standard. The test strip is applied using a 4 kg rolling machine at a temperature of 23 °C. The pressure-sensitive adhesive tapes are removed immediately after application or after a storage period of 24 hours. The measured value (in N / cm) is the average of three individual measurements.

[0140] Production of the polyacrylate pressure-sensitive adhesive

[0141] To produce the polyacrylate pressure-sensitive adhesive, 300 g of a monomer mixture consisting of 25 wt.% 2-cyanoethyl acrylate, 60 wt.% 2-(2-ethoxyethoxy)ethyl acrylate, and 15 wt.% N,N-dimethylacrylamide were reacted in an acetone solution under evaporative cooling in a conventional 2-liter glass reactor suitable for radical polymerization. N-acetylcysteine ​​was used as a regulator at a rate of half the amount based on the monomer content.

[0142] Preparation of the pressure-sensitive adhesive composition

[0143] 30 wt.% lithium bis(trifluoromethylsulfonyl)imide and 70 wt.% ethylene carbonate were dissolved in the polyacrylate pressure-sensitive adhesive solution, resulting in a solids content of 15 wt.%. The mixture was then diluted with ethyl acetate to achieve a final solids content of 38 wt.%. The mixture was stirred with a dissolver for 30 minutes until a homogeneous solution and sufficient dispersion were achieved. The pressure-sensitive adhesive composition was then coated onto a siliconized film using a doctor blade on a laboratory coating table. The coatings were then dried at 120 °C for 15 min.

[0144] Production of the pressure-sensitive adhesive tape

[0145] For the tests, a double-sided electrically detachable pressure-sensitive adhesive tape was constructed from the transfer samples of the electrically detachable pressure-sensitive adhesive composition. A 23 μm thick aluminum foil was laminated to the pressure-sensitive adhesive composition (50 μm). A further 50 μm thick pressure-sensitive adhesive layer was laminated to the free side of the film, creating a double-sided pressure-sensitive adhesive tape. One side was then laminated with a 23 μm thick PET film etched with trichloroacetic acid as a reinforcing film.

[0146] After applying an electrical voltage to the steel plate and the conductive aluminum substrate (48V DC, 5 min), the measured adhesive strength is reduced as shown in Table 1. If the test specimens are heated to 65°C, the adhesive strength is also reduced. If an electrical voltage is applied to the steel plate and the conductive aluminum substrate (48V, 5 min) and the bond is simultaneously heated to 65°C, the adhesive strength is almost completely lost.

[0147] Table 1: Adhesive strength measurement determined as in Reference Example 3

[0148] List of reference symbols

[0149] 10 electrically detachable pressure-sensitive adhesive composition

[0150] 11 electrically conductive carrier material

[0151] 12 electrically conductive substrate

[0152] 13 Adhesive composition

[0153] 14 electrically non-conductive substrate (possibly thermally sensitive)

[0154] 15 perforated carrier material, openings essentially filled with pressure-sensitive adhesive composition (10)

Claims

Patent claims for pressure-sensitive adhesive composition, comprising (a) 35 to 90 wt.% of at least one base component is selected from the Group consisting of a polyacrylate pressure-sensitive adhesive (a1) and a synthetic rubber pressure-sensitive adhesive (a2); wherein the polyacrylate pressure-sensitive adhesive (a1) is producible from a polymerization mixture containing 70 to 99.95 wt.% of at least one (meth)acrylic acid ester monomer and 0.05 to 30 wt.% of at least one crosslinking monomer, each preferably selected from the group consisting of secondary amides and tertiary amides; wherein the synthetic rubber pressure-sensitive adhesive (a2) comprises 50 to 95 wt.% of a synthetic rubber component and 5 to 50 wt.% of an adhesive resin component; (b) 2 to 15% by weight of a salt component; and (c) 5 to 50 wt.% of a (polymer) electrolyte component. Pressure-sensitive adhesive composition according to claim 1, wherein the synthetic rubber pressure-sensitive adhesive according to (a2) further comprises 1 to 30 wt.% of a plasticizer component. Pressure-sensitive adhesive composition according to claim 1 or 2, wherein the synthetic rubber pressure-sensitive adhesive according to (a2) is each preferably selected from the group consisting of acrylonitrile butadiene rubber with an acrylonitrile content of more than 20 wt.%, preferably more than 30 wt.%; acrylonitrile butadiene acrylate rubber with an acrylonitrile content of more than 20 wt.%, preferably more than 30 wt.%; fluororubber and polyurethane elastomer, each more preferably selected from the group consisting of acrylonitrile butadiene rubber with an acrylonitrile content of more than 20 wt.%, preferably more than 30 wt.%; Acrylonitrile butadiene acrylate rubber with an acrylonitrile content of more than 20 wt.%, preferably more than 30 wt.%.-% and fluororubber, more preferably the synthetic rubber pressure-sensitive adhesive according to (a2) consists of an acrylonitrile-butadiene rubber with an acrylonitrile content of more than 20 wt.%, preferably more than 30 wt.%. Pressure-sensitive adhesive composition according to one of claims 1 to 3, wherein the synthetic rubber pressure-sensitive adhesive according to (a2) has a Hildebrandt solubility parameter θ of at least 19 MPa1 / 2, preferably of at least 21 MPa1 / 2, determined as in reference example 1. Pressure-sensitive adhesive composition, comprising (a) 35 to 90 wt% of a polyacrylate pressure-sensitive adhesive (a1) producible from a polymerization mixture comprising 70 to 99.95 wt% of at least one (meth)acrylic ester monomer and 0.05 to 30 wt% of at least one crosslinking monomer, wherein at least 50 wt% of the polymerization mixture consists of monomers having a Hansen solubility parameter θH of at least 11 MPa1 / 2, as determined in Reference Example 2; (b) 2 to 15% by weight of a salt component; and (c) 5 to 50 wt.% of a (polymer) electrolyte component. Pressure-sensitive adhesive composition according to claim 1 or 5, wherein the at least one (meth)acrylic acid ester monomer is preferably selected from the group consisting of 2-cyanoethyl acrylate, 2-(2-ethoxyethoxy)ethyl acrylate, 2-phenoxyethyl acrylate and 2-hydroxyethyl methacrylate, preferably selected from the group consisting of 2-cyanoethyl acrylate, 2-(2-ethoxyethoxyethyl acrylate and 2-phenoxyethyl acrylate), further preferably selected from the group consisting of 2-cyanoethyl acrylate and 2-(2-ethoxyethoxyethyl acrylate).Pressure-sensitive adhesive composition according to one of embodiments 1 or 5 to 6, wherein the crosslinking monomer is preferably selected from the group consisting of N-vinyl caprolactam, N-vinylpyrrolidone, acrylamide, methacrylamide, N-methylacrylamide, methyl methacrylamide, N,N-dimethylacrylamide, diacetone acrylamide and N,N-dimethyl methacrylamide, preferably selected from the group consisting of N-vinyl caprolactam, N-vinylpyrrolidone, N-methylacrylamide, N-methyl methacrylamide, N,N-dimethyl acrylamide, diacetone acrylamide and N,N-dimethyl methacrylamide, further preferably selected from the group consisting of N-vinyl caprolactam, N-methyl acrylamide, N-methyl methacrylamide, N,N-dimethyl acrylamide and N,N-dimethyl methacrylamide, further preferably N,N-dimethyl acrylamide.Pressure-sensitive adhesive composition according to one of embodiments 1 or 5 to 7, wherein the polyacrylate pressure-sensitive adhesive according to (a1) can be produced from a polymerization mixture containing 20 to 30 wt% 2-cyanoethyl acrylate and 55 to 65 wt% 2-(2-ethoxyethoxy)ethyl acrylate.

9. Pressure-sensitive adhesive composition according to one of embodiments 1 or 5 to 8, wherein the polyacrylate pressure-sensitive adhesive according to (a1) can be produced from a polymerization mixture containing 11 to 19 wt.% N,N-dimethylacrylamide.

10. Pressure-sensitive adhesive composition according to one of embodiments 1 or 5 to 9, wherein the polyacrylate pressure-sensitive adhesive according to (a1) can be produced from a polymerization mixture containing 20 to 30 wt.% 2-cyanoethyl acrylate, 55 to 65 wt.% 2-(2-ethoxyethoxy)ethyl acrylate and 11 to 19 wt.% N,N-dimethylacrylamide.

11. Pressure-sensitive adhesive composition according to any one of claims 1 to 10, wherein the salt component according to (b) is preferably selected from the group consisting of potassium hydrogen phthalate, lithium triflate, lithium perchlorate, lithium hexafluorophosphate, 1-ethyl-3-methyl-imidazolium tetrafluoroborate, 1-ethyl-3-methyl-imidazolium trifluoromethanesulfonate, 1-ethyl-3-methyl-imidazolium ethyl sulfate, lithium bis-(trifluoromethylsulfonyl)imide, lithium hexafluorophosphate, Lithium tetrafluoroborate, 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)amide, 1-ethyl-3-methylimidazolium tetrafluoroborate, 1-ethyl-3-methylimidazolium methanesulfonate, choline chloride, choline acesulfamate and choline saccharinate, preferably each separately, is preferably selected from the group consisting of lithium bis-(trifluoromethylsulfonyl)imide, lithium hexafluorophosphate and lithium tetrafluoroborate, 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)amide, 1-ethyl-3-methylimidazolium tetrafluoroborate and 1-ethyl-3-methylimidazolium methanesulfonate.

12. Pressure-sensitive adhesive composition according to any one of claims 1 to 11, wherein the The (polymer) electrolyte component according to (c) is each preferably selected from the group consisting of polyethylene carbonate, polyvinyl carbonate, polypropylene carbonate, polybutylene carbonate, polyfluoroethylene carbonate, polydimethyl carbonate, polydiethyl carbonate, polyethyl methyl carbonate, Polydimethylacetamide, polyethyl methanesulfonate, polygammabutyrolactone, Polydimethyl sulfoxide, polyethylene glycol diacetate and poly(ethylene glycol) bis-(2-ethoxyhexanoate), each preferably selected separately from the group consisting of polydiethylene carbonate, polyethylene carbonate and poly(ethylene glycol) bis-(2-ethoxyhexanoate), further preferably each separately from polyethylene carbonate and poly(ethylene glycol) bis-(2-ethoxyhexanoate) and / or wherein the (polymer) electrolyte component according to (c) is each preferably selected separately from of the group consisting of ethylene carbonate, vinylene carbonate, propylene carbonate, butylene carbonate, fluoroethylene carbonate, dimethyl carbonate, diethyl carbonate, ethyl methyl carbonate, dimethylacetamide, ethyl methanesulfonate, gamma butyrolactone, dimethyl sulfoxide, ethylene glycol diacetate, tri(ethylene glycol)-bis-(2-ethoxyhexanoate) and tetra(ethylene glycol)-di-(2-ethylhexanoate), each more preferably selected individually from the group consisting of diethylene carbonate, ethylene carbonate, tri(ethylene glycol)-bis-(2-ethoxyhexanoate) and tetra(ethylene glycol)-di-(2-ethylhexanoate), each more preferably selected individually from the group consisting of ethylene carbonate, tri(ethylene glycol)-bis-(2-ethoxyhexanoate) and tetra(ethylene glycol)-di-(2-ethylhexanoate). Method for producing the pressure-sensitive adhesive composition according to one of claims 1 or 5 to 12, wherein the polyacrylate pressure-sensitive adhesive according to (a1) is produced by solvent polymerization in a solvent.Adhesive tape comprising at least one layer of an adhesive composition according to any one of claims 1 to 12. Adhesive tape comprising at least one electrically conductive carrier material and at least one layer of an adhesive composition according to any one of claims 1 to 12. Adhesive tape according to claim 15, wherein at least one electrically conductive carrier material is arranged between at least two layers of the adhesive composition according to any one of claims 1 to 12. Adhesive tape according to claim 15 or 16, wherein at least one electrically conductive carrier material is arranged between at least one layer of an adhesive composition according to any one of claims 1 to 12 and at least one adhesive layer other than the adhesive composition.Adhesive tape according to claim 15, wherein at least one layer of an adhesive composition according to one of claims 1 to 12 is arranged between at least two layers of an electrically conductive carrier material. Adhesive tape comprising at least one layer of an adhesive composition according to any one of claims 1 to 12 and at least one perforated carrier material, wherein the adhesive composition substantially fills the perforations of the carrier material. Adhesive tape according to any one of claims 14 to 19, wherein the layer of the adhesive composition according to any one of claims 1 to 12 has a thickness of 1 pm to 50 pm, preferably a thickness of 1 pm to 30 pm, more preferably a thickness of 1 pm to 10 pm, and more preferably a thickness of 1 pm to 4 pm. Adhesion promoter comprising an adhesive composition according to any one of claims 1 to 12 and at least one solvent or dispersant. Adhesive bond comprising a layer of an adhesive composition according to any one of claims 1 to 12.Adhesive bond according to claim 22, wherein the layer of the pressure-sensitive adhesive composition according to any one of claims 1 to 12 has a thickness of 1 pm to 50 pm, preferably a thickness of 1 pm to 30 pm, more preferably a thickness of 1 pm to 10 pm, and more preferably a thickness of 1 pm to 4 pm. Method for releasing a pressure-sensitive adhesive bond, wherein a direct current voltage of 10 to 240 V is applied to at least one layer of a pressure-sensitive adhesive composition, substantially perpendicular to the layer plane. Method for releasing a pressure-sensitive adhesive bond, wherein a direct current voltage of 10 to 240 V is applied to at least one layer of a pressure-sensitive adhesive composition according to any one of claims 1 to 12, substantially perpendicular to the layer plane.Method according to claim 24 or 25, wherein the at least one layer of the pressure-sensitive adhesive composition is heated simultaneously to a temperature of 35 to 80 °C, preferably to a temperature of 45 to 75 °C, more preferably to a temperature of 55 to 70 °C.

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