Electronic device including audio input device

Abstract

An electronic device includes a housing including a microphone hole and a duct connected to the microphone hole, a first substrate including at least one first through hole connected to the duct, and audio input device configured to convert a sound wave introduced from the microphone hole into an audio signal and coupled to the first substrate.

Description

[Technical Field]

[0001] The description below relates to electronic devices including an audio input device.[Background Art]

[0002] An electronic device may include an audio input device (e.g., a microphone) for providing an audio signal. The audio input device may convert an analog signal (e.g., a sound wave) received from outside of the electronic device into the audio signal that is an electrical signal. The audio signal may be outputted to the outside of the electronic device through an audio output device (e.g., a speaker). In order for the sound wave to reach a diaphragm, the electronic device may include a duct and a microphone hole. As the structure of electronic devices diversifies, the length of such ducts may shorten. As the length of the duct shortens, air and / or foreign bodies or substances may more easily reach the audio input device.

[0003] The above-described information may be provided as a related art for the purpose of helping understand the present disclosure. No assertion or determination is made as to whether any of the above-described information comprises prior art for the present disclosure.[Disclosure] [Technical Solution]

[0004] An electronic device is provided. The electronic device may include a housing, a first substrate, and an audio input device. The housing may comprise a microphone hole and a duct. The duct may comprise a first end connected to the microphone hole and a second end. The first substrate may comprise a first surface and a second surface. The substrate may comprise at least one first through hole. The at least one first through hole may be connected to the second end of the duct on the first surface. The audio input device may be configured to convert into an audio signal by receiving a sound wave introduced from the microphone hole through the duct and the at least one first through hole. The audio input device may be coupled on the second surface. The audio input device may comprise a diaphragm and an opening portion. The diaphragm may be disposed to face the second surface. The diaphragm may be configured to vibrate based on the sound wave. The opening portion may be connected to the at least one first through hole on the second surface so that the sound wave is transmitted to the diaphragm. The opening portion may be formed at a position overlapping a partial area of the first substrate adjacent to the at least one first through hole and the diaphragm so that the sound wave is transmitted to the diaphragm.

[0005] An audio input device is provided. The audio input device may comprise a first substrate, a diaphragm, and an opening portion. The first substrate may comprise a first surface and a second surface. The first substrate may comprise at least one first through hole. The diaphragm may be disposed to face the second surface. The diaphragm may be configured to vibrate by receiving a sound wave through the at least one first through hole. The opening portion may be connected to the at least one first through hole on the second surface so that the sound wave is transmitted to the diaphragm. The opening portion may be formed at a position overlapping the partial area of the first substrate adjacent to the at least one first through hole and the diaphragm so that the sound wave is transmitted to the diaphragm.

[0006] An electronic device is provided. The electronic device may include a housing, a first substrate, and an audio input device. The housing may comprise a microphone hole and a duct. The duct may comprise a first end connected to the microphone hole and a second end. The first substrate may comprise at least one first through hole. The at least one first through hole may be connected to the second end of the duct. The audio input device may be configured to convert into an audio signal by receiving a sound wave introduced from the microphone hole through the duct and the at least one first through hole. The audio input device may comprise a diaphragm, a second substrate, and an opening portion. The diaphragm may be disposed to face the first substrate. The diaphragm may be configured to vibrate based on the sound wave. The second substrate may be disposed between the diaphragm and the first substrate, and coupled to the first substrate. The opening portion may form a second path so that a path to which the sound wave is transmitted transmits from a first path passing through the at least one first through hole to the second path connected to the first path and having a different direction from a direction of the first path. The second substrate may be disposed between the first substrate and the diaphragm. The at least one first through hole may be located so that the diaphragm is covered by at least one of a portion of the first substrate and a portion of the second substrate, when viewing the audio input device at the second end of the duct. According to the present invention there are provided apparatus and methods as set forth in the appended claims. Other features of the invention will be apparent from the dependent claims, and the description which follows.[Description of the Drawings]

[0007] FIG. 1 is a block diagram of an electronic device according to an embodiment, in a network environment. FIG. 2 illustrates an exemplary electronic device. FIG. 3 is a cross-sectional view of the exemplary electronic device of FIG. 2 cut along A-A' of FIG. 2. FIG. 4 illustrates an exemplary audio input device disposed in an electronic device. FIG. 5A illustrates a second surface of a first substrate. FIG. 5B is a cross-sectional view of the first substrate of FIG. 5A cut along B-B' of FIG. 5A. FIG. 6 illustrates an exemplary audio input device disposed in an electronic device. FIG. 7A is a top plan view of an exemplary electronic device in a first state. FIG. 7B is a top plan view of an exemplary electronic device in a second state. FIG. 8A is an exploded perspective view of an exemplary electronic device. FIG. 8B is a cross-sectional view of an exemplary electronic device in a first state. FIG. 8C is a cross-sectional view of an exemplary electronic device in a second state. FIG. 9 illustrates a portion of an exemplary electronic device. FIG. 10A is a graph indicating performance of an audio input device. FIG. 10B illustrates an electronic device including an audio input device according to a comparative example. FIG. 11A illustrates an unfolded state of an exemplary electronic device. FIG. 11B illustrates a folded state of an exemplary electronic device. FIG. 12 is a cross-sectional view of the exemplary electronic device of FIG. 11A cut along C-C' of FIG. 11A. [Mode for Invention]

[0008] FIG. 1 is a block diagram illustrating an electronic device 101 in a network environment 100.

[0009] Referring to FIG. 1, the electronic device 101 in the network environment 100 may communicate with an electronic device 102 via a first network 198, e.g., a short-range wireless communication network, or at least one of an electronic device 104 or a server 108 via a second network 199, e.g., a long-range wireless communication network. The electronic device 101 may communicate with the electronic device 104 via the server 108. The electronic device 101 includes a processor 120, memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connecting terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module 196, and an antenna module 197. In other embodiments, at least one of the components, e.g., the connecting terminal 178, may be omitted from the electronic device 101, or one or more other components may be added in the electronic device 101. Some of the components, e.g., the sensor module 176, the camera module 180, or the antenna module 197, may be implemented as a single component, e.g., the display module 160.

[0010] The processor 120 may execute, for example, software, e.g., a program 140, to control at least one other component, e.g., a hardware or software component, of the electronic device 101 coupled with the processor 120, and may perform various data processing or computation. As at least part of the data processing or computation, the processor 120 may store a command or data received from another component, e.g., the sensor module 176 or the communication module 190, in volatile memory 132, process the command or the data stored in the volatile memory 132, and store resulting data in non-volatile memory 134The processor 120 may include a main processor 121, e.g., a central processing unit "CPU" or an application processor "AP", or an auxiliary processor 123, e.g., a graphics processing unit "GPU", a neural processing unit "NPU", an image signal processor "ISP", a sensor hub processor, or a communication processor "CP", that is operable independently from, or in conjunction with, the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be specific to a specified function. The auxiliary processor 123 may be implemented as separate from, or as part of the main processor 121.

[0011] The auxiliary processor 123 may control at least some of functions or states related to at least one component, e.g., the display module 160, the sensor module 176, or the communication module 190, among the components of the electronic device 101, instead of the main processor 121 while the main processor 121 is in an inactive, e.g., sleep, state, or together with the main processor 121 while the main processor 121 is in an active state, e.g., executing an application. The auxiliary processor 123, e.g., an image signal processor or a communication processor, may be implemented as part of another component, e.g., the camera module 180 or the communication module 190, functionally related to the auxiliary processor 123. The auxiliary processor 123, e.g., the neural processing unit, may include a hardware structure specified for artificial intelligence model processing. An artificial intelligence model may be generated by machine learning. Such learning may be performed, e.g., by the electronic device 101 where the artificial intelligence is performed or via a separate server, e.g., the server 108. Learning algorithms may include, but are not limited to, e.g., supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be a deep neural network "DNN", a convolutional neural network "CNN", a recurrent neural network "RNN", a restricted boltzmann machine "RBM", a deep belief network "DBN", a bidirectional recurrent deep neural network "BRDNN", deep Q-network or a combination of two or more thereof but is not limited thereto. The artificial intelligence model may, additionally or alternatively, include a software structure other than the hardware structure.

[0012] The memory 130 may store various data used by at least one component, e.g., the processor 120 or the sensor module 176, of the electronic device 101. The various data may include, for example, software, e.g., the program 140, and input data or output data for a command related thereto. The memory 130 may include the volatile memory 132 or the non-volatile memory 134.

[0013] The program 140 may be stored in the memory 130 as software, and may include, for example, an operating system "OS" 142, middleware 144, or an application 146.

[0014] The input module 150 may receive a command or data to be used by another component, e.g., the processor 120, of the electronic device 101, from the outside, e.g., a user, of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key e.g., a button,, or a digital pen e.g., a stylus pen.

[0015] The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing audio recordings. The receiver may be used for receiving incoming calls. The receiver may be implemented as separate from, or as part of the speaker.

[0016] The display module 160 may visually provide information to the outside, e.g., to a user of the electronic device 101. The display module 160 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. The display module 160 may include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the intensity of force incurred by the touch.

[0017] The audio module 170 may convert a sound into an electrical signal and vice versa. The audio module 170 may obtain the sound via the input module 150, or output the sound via the sound output module 155 or a headphone of an external electronic device, e.g., an electronic device 102 directly coupled with the electronic device 101. This coupling may be over a wired, or wireless connection.

[0018] The sensor module 176 may detect an operational state, e.g., power or temperature, of the electronic device 101 or an environmental state, e.g., a state of a user, external to the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. The sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared "IR" sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0019] The interface 177 may support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device, e.g., the electronic device 102, directly. This coupling may be over a wired or wireless connection. The interface 177 may include, for example, a high definition multimedia interface "HDMI", a universal serial bus "USB" interface, a secure digital "SD" card interface, or an audio interface.

[0020] A connecting terminal 178 may include a connector via which the electronic device 101 may be physically connected with the external electronic device, e.g., the electronic device 102. According to an embodiment, the connecting terminal 178 may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector e.g., a headphone connector.

[0021] The haptic module 179 may convert an electrical signal into a mechanical stimulus, e.g., a vibration or a movement, or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. The haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0022] The camera module 180 may capture a still image or moving images. The camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[0023] The power management module 188 may manage power supplied to the electronic device 101. The power management module 188 may be implemented as at least part of, for example, a power management integrated circuit "PMIC".

[0024] The battery 189 may supply power to at least one component of the electronic device 101. The battery 189 may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.

[0025] The communication module 190 may support establishing a direct, e.g., wired, communication channel or a wireless communication channel between the electronic device 101 and the external electronic device, e.g., the electronic device 102, the electronic device 104, or the server 108, and performing communication via the established communication channel. The communication module 190 may include one or more communication processors that are operable independently from the processor 120, e.g., the application processor "AP", and supports a direct, e.g., wired, communication or a wireless communication. The communication module 190 may include a wireless communication module 192, e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system "GNSS" communication module or a wired communication module 194, e.g., a local area network "LAN" communication module or a power line communication "PLC" module. A corresponding one of these communication modules may communicate with the external electronic device via the first network 198, e.g., a short-range communication network, such as Bluetooth ™< , wireless-fidelity "Wi-Fi" direct, or infrared data association "IrDA", or the second network 199, e.g., a long-range communication network, such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network, e.g. LAN or wide area network "WAN". These various types of communication modules may be implemented as a single component, e.g., a single chip, or may be implemented as multi components, e.g., multi chips, separate from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information, e.g., international mobile subscriber identity "IMSI", stored in the subscriber identification module 196.

[0026] The wireless communication module 192 may support a 5G network, after a 4G network, and next-generation communication technology, e.g., new radio "NR" access technology. The NR access technology may support enhanced mobile broadband "eMBB", massive machine type communications "mMTC", or ultra-reliable and low-latency communications "URLLC". The wireless communication module 192 may support a high-frequency band, e.g., the mmWave band, to achieve, e.g., a high data transmission rate. The wireless communication module 192 may support various technologies for securing performance on a high-frequency band, such as, e.g., beamforming, massive multiple-input and multiple-output "massive MIMO", full dimensional MIMO "FD-MIMO", array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device, e.g., the electronic device 104, or a network system, e.g., the second network 199. According to an embodiment, the wireless communication module 192 may support a peak data rate, e.g., 20Gbps or more, for implementing eMBB, loss coverage, e.g., 164dB or less, for implementing mMTC, or U-plane latency, e.g., 0.5ms or less for each of downlink "DL" and uplink "UL", or a round trip of 1ms or less for implementing URLLC.

[0027] The antenna module 197 may transmit or receive a signal or power to or from the outside e.g., the external electronic device, of the electronic device 101. The antenna module 197 may include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a substrate, e.g., a printed circuit board "PCB". The antenna module 197 may include a plurality of antennas, e.g., array antennas. In such a case, at least one antenna appropriate for a communication scheme used in the communication network, such as the first network 198 or the second network 199, may be selected, for example, by the communication module 190, e.g., the wireless communication module 192, from the plurality of antennas. The signal or the power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. Another component, e.g. a radio frequency integrated circuit "RFIC", other than the radiating element may be additionally formed as part of the antenna module 197.

[0028] The antenna module 197 may form a mmWave antenna module. The mmWave antenna module may include a printed circuit board, a RFIC disposed on a first surface, e.g., the bottom surface, of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high-frequency band, e.g., the mmWave band,, and a plurality of antennas, e.g., array antennas, disposed on a second surface, e.g. the top or a side surface,) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high-frequency band.

[0029] At least some of the above-described components may be coupled mutually and communicate signals, e.g. commands or data, therebetween via an inter-peripheral communication scheme, e.g., a bus, general purpose input and output "GPIO", serial peripheral interface "SPI", or mobile industry processor interface "MIPI".

[0030] Commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199. Each of the electronic devices 102 or 104 may be a device of a same type as, or a different type, from the electronic device 101. All or some of operations to be executed at the electronic device 101 may be executed at one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 101. The electronic device 101 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, mobile edge computing "MEC", or client-server computing technology may be used, for example. The electronic device 101 may provide ultra low-latency services using, e.g. distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet-of-things "IoT" device. The server 108 may be an intelligent server using machine learning and / or a neural network. The external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services, e.g., smart home, smart city, smart car, or healthcare, based on 5G communication technology or IoT-related technology.

[0031] FIG. 2 illustrates an exemplary electronic device.

[0032] Referring to FIG. 2, an electronic device 101 may include a housing 210 forming an exterior of the electronic device 101. The housing 210 may include a first surface, or a front surface, 200A, a second surface, or a rear surface 200B, and a third surface, or a side surface 200C surrounding the space between the first surface 200A and the second surface 200B.

[0033] The electronic device 101 may include a substantially transparent first plate 202. The first plate 202 may form at least a portion of the first surface 200A. The first plate 202 may be formed for example as a glass plate including various coating layers, or a polymer plate, but other constructions are possible.

[0034] The electronic device 101 may include a substantially opaque second plate 211. The second plate 211 may form at least a portion of the second surface 200B. The second plate 211 may be formed of coated or colored glass, ceramic, polymer, metal, e.g., aluminum, stainless steel or magnesium, or a combination of at least two of the above materials.

[0035] The electronic device 101 may include a frame 218. The frame 218 may form at least a portion of a third surface 200C of the electronic device 101 by being coupled with the first plate 202 and / or the second plate 211. For example, the frame 218 may entirely form the third surface 200C of the electronic device 101. For example, the frame 218 may form the third surface 200C of the electronic device 101 together with the first plate 202 and / or the second plate 211.

[0036] The electronic device 101 may include at least one of a display 201, an audio module 203, 204, and 207, a sensor module (not illustrated), a camera module 205, 212, and 213, a key input device 217, a light emitting device (not illustrated), and / or a connector hole 208. The electronic device 101 may omit at least one, e.g. the key input device 217 or the light emitting device (not illustrated)) of the components or may additionally include one or more other components.

[0037] At least a portion of the display 201, e.g., a display module 160 of FIG. 1, may be visible through the first plate 202 forming the first surface 200A. The display 201 may be disposed on the rear surface of the first plate 202.

[0038] An outer shape of the display 201 may be formed substantially the same as an outer edge shape of the first plate 202 adjacent to the display 201. In order to expand the area to which the display 201 is visually exposed, a gap between an outer edge of the display 201 and an outer edge of the first plate 202 may be formed to be substantially the same.

[0039] The display 201, or the first surface 200A of the electronic device 101, may include a screen display area 201A. The display 201 may provide visual information to a user through the screen display area 201A. When viewing the first surface 200A in front, as illustrated the screen display area 201A is spaced apart from an outer edge of the first surface 200A and is located inside the first surface 200A. When viewing the first surface 200A in front, at least a portion of an edge of the screen display area 201A may substantially coincide with the edge of the first surface 200A, or the first plate 202.

[0040] The screen display area 201A may include a sensing area 201B configured to obtain biometric information of the user. Here, a meaning of "the screen display area 201A includes the sensing area 201B" should be understood to mean that at least a portion of the sensing area 201B overlaps the screen display area 201A. That is, the sensing area 201B is an area in which visual information may be displayed by the display 201 like any other area of the screen display area 201A, and the biometric information, e.g. a fingerprint, of the user may in addition be obtained by this area. The sensing area 201B may alternatively be formed in the key input device 217.

[0041] The display 201 may include an area in which a first camera module 205, corresponding to the camera module 180 of FIG. 1, is located. An opening is formed in the area of the display 201, and the first camera module 205 may be disposed at least partially in the opening to face the first surface 200A. In this case, the first camera module 205 comprises a punch hole camera and the screen display area 201A surrounds at least a portion of an edge of the opening. In an alternative embodiment, the first camera module 205 is may be disposed under the display 201 to overlap the area of the display 201. In this case, the first camera module 205 comprises an under display camera "UDC", and the display 201 provides the visual information to the user through the overlapping area of the display 201, and additionally, the first camera module 205 is arranged to obtains images in a direction toward the first surface 200A through the area of the display 201.

[0042] The display 201 may optionally be coupled to, or disposed adjacent to, a touch sensing circuit, a pressure sensor capable of measuring intensity of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0043] The audio module, corresponding to the audio module 170 of FIG. 1, includes microphone holes 203, 204 and a speaker hole 207.

[0044] The microphone holes 203,204 may comprise a first microphone hole 203 formed in a partial area of the third surface 200C and a second microphone hole 204 formed in a partial area of the second surface 200B. An audio input device, corresponding to audio input device 400 of FIG. 3, for obtaining an external sound is disposed inside the microphone holes 203, 204. The audio input device 400 may include a plurality of microphones to enable sensing of the direction of incoming sounds.

[0045] The second microphone hole 204 formed in the partial area of the second surface 200B may be disposed adjacent to the camera modules 212, 213. For example, the second microphone hole 204 may receive and detect incoming sound in response to operation of one of the camera modules 212, 213. However, operation of the second microphone hole 204 is not limited thereto.

[0046] The speaker hole 207 may include the external speaker hole 207 and a receiver hole (not illustrated) for a call. The external speaker hole 207 may be formed in a portion of the third surface 200C of the electronic device 101. The external speaker hole 207 is in an alternative embodiment implemented as one single hole together also operating as the microphone hole 203. Although not illustrated, a receiver hole for calls may be formed in another portion of the third surface 200C. For example, the receiver hole for the call may be formed on the third surface 200C on an opposite side of the external speaker hole 207. As illustrated in FIG. 2, the external speaker hole 207 may be formed on the third surface 200C corresponding to a lower end portion of the electronic device 101. The receiver hole for the call may be formed on the third surface 200C corresponding to an upper end portion of the electronic device 101. However, in other examples, the receiver hole for the call may be formed in a position other than the third surface 200C. For example, the receiver hole for the call may be formed by a space spaced apart between the first plate 202, or the display 201, and the frame 218.

[0047] The electronic device 101 may include at least one speaker (not illustrated) configured to output sound to outside of the housing 210 through the external speaker hole 207 and / or the receiver hole for the call.

[0048] The sensor module (not illustrated) corresponding to the sensor module 176 of FIG. 1 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 101. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared "IR" sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0049] The camera module 205, 212, 213 corresponding to the camera module 180 of FIG. 1 includes the first camera module 205 disposed to face the first surface 200A of the electronic device 101, the second camera module 212 disposed to face the second surface 200B, and a flash 213.

[0050] The second camera module 212 may include a plurality of cameras or may include one single camera only. In examples where the second camera module 212 includes a plurality of cameras, these may be formed as a dual, tripe or quad camera.

[0051] The first camera module 205 and the second camera module 212 may include one single lens or a plurality of lenses, an image sensor, and / or an image signal processor.

[0052] The flash 213 may be provided as, for example, a light emitting diode or a xenon lamp. In some examples, two or more lenses, such as an infrared camera, wide-angle and telephoto lens, and related image sensors may be disposed on one surface of the electronic device 101.

[0053] The key input device 217 corresponding to the input module 150 of FIG. 1 may be disposed on the third surface 200C of the electronic device 101. In other example embodiments, the electronic device 101 may not include the key input device 217, and the functions of the key input device 217 may be implemented in another form, such as a soft key, on the display 201.

[0054] The connector hole 208 may be formed on the third surface 200C of the electronic device 101 so that a connector of an external device may be accommodated. A connecting terminal corresponding to the connecting terminal 178 of FIG. 1 is electrically connected to the connector of the external device may be disposed in the connector hole 208. The electronic device 101 includes an interface module corresponding to the interface 177 of FIG. 1 for processing electrical signals transmitted and received through the connecting terminal.

[0055] The electronic device 101 may include a light emitting device (not illustrated). For example, the light emitting device may be disposed on the first surface 200A of the housing 210. The light emitting device may provide state information of the electronic device 101 by emitting suitable light signals. For example, the light emitting device may comprise a light source that is functionally interlocked with an operation of the first camera module 205. For example, the light emitting device may include one or more of an LED, an IR LED, and a xenon lamp.

[0056] The electronic device 101 may include an audio input device corresponding to the audio input device 400 of FIG. 3. The audio input device 400 may include a microphone. The audio input device 400 may be configured to convert an analog signal in the form of a sound wave received from outside of the electronic device 101 into an electrical signal in the form of an audio signal). Suitably, the audio input device 400 may include a diaphragm corresponding to the diaphragm 310 of FIG. 3 configured to generate the electrical signal by vibrating based on the sound wave.

[0057] The housing 210 may include the microphone hole 203 and a duct corresponding to a duct 206 of FIG. 3. The microphone hole 203 may be an inlet for the sound wave to be introduced from the outside into the inside of the housing 210. By extending from the microphone hole 203 to the audio input device 400, the duct 206 may provide an acoustic path so that the sound wave introduced into the inside of the housing 210 through the microphone hole 203 may be transmitted to the audio input device 400.

[0058] As the range of shapes, form factors and structures housings that form the exterior of electronic devices, such as the electronic device 101 diversifies, and many electronic components are mounted in the housing, the volume and / or length of duct may be reduced according to a reduction in available space inside the electronic device. In cases where the volume and / or length of the duct is reduced, air and / or a foreign substances, foreign matter or foreign bodies such as a pin introduced into the audio input device through the microphone hole and the duct from the outside of the housing may reach a diaphragm. The diaphragm may be damaged by pressure of the air and / or the foreign substances etc. that are introduced.

[0059] Audio input devices 400 according to example embodiments have a structure for reducing damage to the diaphragm 410 due to the pressure of the air and / or the foreign substances that are introduced through the duct 206. Hereinafter, an electronic device 101 including the exemplary audio input device 400 is described with reference to the drawings.

[0060] FIG. 3 is a cross-sectional view of an exemplary electronic device cut along A-A' of FIG. 2. FIG. 4 illustrates an exemplary audio input device 400 disposed in an electronic device.

[0061] Referring to FIG. 3, an exemplary electronic device 101 may include a housing 210, a first substrate 310, and an audio input device 400 disposed in the housing 210. In addition to the above components, the exemplary electronic device 101 may further include components described with reference to FIGS. 1 and / or 2. In describing an example embodiment as shown, the first substrate 310 is described as a component independent of the audio input device 400, but this is not essential for all embodiments. For example, the first substrate 310 may in other embodiments be implemented with some of the other components included in the audio input device 400.

[0062] The housing 210 may include a microphone hole 203 and a duct 206. The microphone hole 203 may be formed in at least a portion of the frame 218 forming a side surface, e.g., the third surface 200C of FIG. 2, of the housing 210. For example, the microphone hole 203 may be formed by punching the portion of the frame 218. A sound wave outside the housing 210 may be introduced into the inside of the housing 210 through the microphone hole 203. The microphone hole 203 may provide an inlet through which sound waves are introduced into inside of the housing 210.

[0063] According to an example, the duct 206 extends from the microphone hole 203 to the internal space of the housing 210 in which the audio input device 400 is disposed. In the example shown, the duct 206 may extend from a first end 206a to a second end 206b opposite to the first end 206a. For example, the duct 206 may extend to the second end 206b separated from the first end 206a by a certain distance.

[0064] The first end 206a may be connected to the microphone hole 203 in the example shown. The second end 206b may be connected to the internal space of the housing 210 in which the audio input device 400 is disposed, distanced from the first end 206a. The second end 206b in the example shown is in contact with a space on a support member 243 in which the audio input device 400 is disposed. The duct 206 extending from the first end 206a to the second end 206b may provide a transmission path for sound waves introduced into the inside of the housing 210 through the microphone hole 203. The sound waves are transmitted to the audio input device 400 through vibration of air in the duct 206.

[0065] The duct 206 has a shape that guides sound waves so that the path of the sound waves is changed through a curved area 206c. The curved area 206c is formed to be curved in a certain area, such that sound waves are transmitted to the second end 206b when the sound waves introduced through the first end 206a move through the duct 206.

[0066] The first substrate 310 may be disposed in the internal space of the housing 210 and is connected to the second end 206b of the duct 206. The first substrate 310 in the example shown comprises a printed circuit board configured to provide an electrical connection between a plurality of electronic components. For example, the first substrate 310 may include at least one conductive layer, configured as the at least one conductive layer 310c of FIG. 5B and at least one non-conductive layer configured as the at least one non-conductive layer 310d of FIG. 5B that is alternately laminated with the at least one conductive layer 310c. The first substrate 310 may be configured to provide an electrical connection between the first substrate 310 and / or a plurality of electronic components disposed outside the first substrate 310 through wires and conductive vias formed on the at least one conductive layer 310c.

[0067] The first substrate 310 may include a first surface 311 and a second surface 312 opposite to the first surface 311. For example, the first surface 311 may be a surface of the first substrate 310 facing the second end 206b of the duct 206. For example, the second surface 312 may be a surface of the first substrate 310 coupled to the audio input device 400.

[0068] The first substrate 310 may include at least one first through hole 313. The at least one first through hole 313 may be formed as an opening in at least a portion of the first surface 311, with an empty space is formed so that the sound wave may pass between the first surface 311 and the second surface 312 through the at least one first through hole 313. The empty space may be form to be connected to an opening formed in at least a portion of the second surface 312 so that sound waves may move to a second through hole 421 through the at least one first through hole 313. The at least one first through hole 313 may be connected to the second end 206b of the duct 206 on the first surface 311. For example, the at least one first through hole 313 may extend from a third end, e.g., a third end 313a of FIG. 4, to a fourth end, e.g., a fourth end 313b of FIG. 4, opposite to the third end 313a. For example, the third end 313a may be located on substantially the same plane as the first surface 311. The third end 313a may be connected to the second end 206b of the duct 206 on the first surface 311. For example, the fourth end 313b may be located on substantially the same plane as the second surface 312. The fourth end 313b may be in contact with a portion, e.g., a second substrate 420, of the audio input device 400.

[0069] The audio input device 400 is suitably coupled and / or disposed on the second surface 312. In such examples, the audio input device 400 may be electrically connected to a conductive layer exposed on the second surface 312. The audio input device 400 may be configured to receive a sound wave introduced from the microphone hole 203 through the duct 206, the at least one first through hole 313, and the opening portion, e.g., a opening portion 401 of FIG. 4, and convert them into an audio signal.

[0070] Referring to FIG. 4, the audio input device 400 may include a micro electro mechanical system "MEMS" 402, a signal processing circuit 460, the second substrate 420, and / or a case 430.

[0071] The MEMS 402 may be an element capable of converting the sound wave, which is an analog signal, into the audio signal, which is an electrical signal. The MEMS 402 may include a diaphragm 410, a die 440, and a plate 450. The diaphragm 410 may be supported by the die 440. The die 440 may be disposed on the second substrate 420. As the diaphragm 410 is supported by the die 440 and spaced apart from the second surface 312, the diaphragm 410 may be disposed to face the second surface 312. As the diaphragm 410 is supported by the die 440, a front chamber C1 may be formed between the diaphragm 410 and the second substrate 420.

[0072] In the example shown, the plate 450 may be supported by the die 440. The plate 450 may be spaced apart from the diaphragm 410. For example, the plate 450 may be referred to as a back plate of a microphone including an electrode for generating the electrical signal by being spaced backward from the diaphragm 410 vibrating by the sound wave. The plate 450 may include a plurality of holes through which air may flow between the diaphragm 410 and the plate 450. As will be understood, the diaphragm 410 is vibrated by sound waves. As the diaphragm 410 vibrates, a distance between the diaphragm 410 and the plate 450 may change. A change between the diaphragm 410 and the plate 450 may cause a change in capacitance. The plate 450 is configured to include a first electrode disposed on a surface facing the diaphragm 410. The diaphragm 410 is configured to include a second electrode disposed on a surface facing the plate 450. When the diaphragm 410 vibrates, a distance between the first electrode and the second electrode may change. Due to a change in the distance between the first electrode and the second electrode, capacitance between the first electrode and the second electrode may be changed.

[0073] The signal processing circuit 460 may be configured to generate the audio signal based on the change in the capacitance. For example, the signal processing circuit 460 may include a detection circuit for detecting the change in the capacitance and an amplifier for amplifying a detected signal. The signal processing circuit 460 may include an application-specific integrated circuit "ASIC", but other implementations are possible. The signal processing circuit 460 may be configured to generate the audio signal, which is the electrical signal, based on a change in capacitance between the diaphragm 410 and the plate 450. For example, the signal processing circuit 460 may be configured to detect the change in the capacitance caused by a change in the distance between the diaphragm 410 and the plate 450. The signal processing circuit 460 may be electrically connected to the detection circuit or the amplifier. Thus, an audio signal corresponding to the sound wave may be obtained and processed through the detection circuit or the amplifier that detects the change in the capacitance according to the change in the distance between the diaphragm 410 and the plate 450.

[0074] The signal processing circuit 460 may be configured to generate the audio signal, which is the electrical signal, based on the detected change in the capacitance. The signal processing circuit 460 may be configured to transmit the generated audio signal to the processor through the first substrate 310 and the second substrate 420. The signal processing circuit 460 may be electrically connected to the diaphragm 410 and the plate 450 through a first lead wire 403. The signal processing circuit 460 may be electrically connected to the second substrate 420 through a second lead wire 404. The second substrate 420 may be electrically connected to the first substrate 310 by being disposed on the second surface 312. The second substrate 420 may electrically connect the audio input device 400 to another electronic component such as e.g., a processor 120 of FIG. 1, by being electrically connected to the first substrate 310.

[0075] The case 430 may be disposed on the second substrate 420. The case 430 may surround at least a portion of the diaphragm 410 and the plate 450. The cover may form a back chamber C2, which is a space opposite to a space into which the sound wave is introduced, based on the diaphragm 410.

[0076] Referring to FIG. 4, the at least one first through hole 313 may be blocked by a portion of the audio input device 400. For example, the fourth end 313b of the at least one first through hole 313 may be blocked by the surface of the second substrate 420 by contacting at least a portion of the surface of the second substrate 420 contacting the second surface 312 of the first substrate 310. For example, when viewing the audio input device 400 from the diaphragm 410 in a direction toward the first substrate 310, the at least one first through hole 313 may not be exposed by being blocked by the second substrate 420.

[0077] As described above, in order for the audio input device 400 to generate the audio signal, a structure in which the sound wave introduced through the microphone hole 203 pass through the duct 206 and the at least one first through hole 313 to reach the diaphragm 410 is desirable. At least a partial area of the at least one first through hole 313 is blocked by another external material, e.g., a partial surface of the second substrate 420, so that the at least one first through hole 313 and the front chamber C1, e.g., a space between the diaphragm 410 and the second substrate 420, are not directly connected. At least a partial area of the at least one first through hole 313 is blocked by another external material, e.g., a partial surface of the second substrate 420, so that the at least one first through hole 313 and the front chamber C1, e.g., a space between the diaphragm 410 and the second substrate 420, are not directly connected by a straight-line path. The audio input device 400 may include an opening portion, e.g., an opening portion 401 of FIG. 4, connecting between the at least one first through hole 313 and the front chamber C1 so that sound waves that have passed through the at least one first through hole 313 may be transmitted to the diaphragm 410 through the front chamber C1.

[0078] The opening portion 401 may connect the at least one first through hole 313 and a space, e.g., the front chamber C1, facing the diaphragm 410. For example, the opening portion 401 may be formed at a position overlapping with the diaphragm 410 and a partial area 314 of the first substrate 310 adjacent to the at least one first through hole 313. When viewing the audio input device 400 from the diaphragm 410 in the direction toward the first substrate 310, the opening portion 401 may overlap the partial area 314 adjacent to the at least one first through hole 313 and the diaphragm 410. The opening portion 401 may be implemented in various ways. For example, the opening portion 401 may be formed by removing a portion of the first substrate 310 included in the partial area 314. For example, the opening portion 401 may be formed by removing a portion of the second substrate 320 adjacent to the partial area 314.

[0079] The opening portion 401 may be connected to the space, e.g., the front chamber C1, facing the at least one first through hole 313 and the diaphragm 410. Sound waves introduced into the at least one first through hole 313 through the duct 206 are transmitted to the opening portion 401 connected to the at least one first through hole 313. Since the opening portion 401 overlaps the partial area 314 of the first substrate 310 adjacent to the at least one first through hole 313 and the diaphragm 410, the sound waves transmitted to the opening portion 401 may be transmitted to the diaphragm 410 through the front chamber C1 facing the partial area 314 and the diaphragm 410. As the opening portion 401 connects the at least one first through hole 313 and the front chamber C1, the sound waves that have passed through the at least one first through hole 313 are transmitted to the diaphragm 410.

[0080] Sound waves introduced into the duct 206 through the microphone hole 203 are transmitted to the at least one first through hole 313. The sound waves that have passed through the at least one first through hole 313 pass through the opening portion 401 and reach the diaphragm 410. Since the at least one first through hole 313 is blocked by the second substrate 420, the sound wave that has passed through the at least one first through hole 313 may not be directly transmitted to the diaphragm 410 but may be transmitted to the diaphragm 410 by bypassing the second substrate 420 through the opening portion 401. For example, when the sound wave is transmitted, a direction of a path, e.g., a first path P1 of FIG. 4, of the sound wave passing through the at least one first through hole 313 and a direction of a path, e.g., a second path P2 of FIG. 4, of the sound wave passing through the opening portion 401 may be different from each other. For example, the opening portion 401 may form the second path P2 so that a path through which the sound wave is transmitted is transmitted from the first path P1 passing through the at least one first through hole 313 to the second path P2 having a different direction from the first path P2.

[0081] In case that a space between the diaphragm 410 and the at least one first through hole 313 is entirely aligned, air and / or a foreign substance introduced through the microphone hole 203 may easily reach the diaphragm 410. In cases where the space between the diaphragm 410 and the at least one first through hole 313 is formed with at least a partially curved shape or no curved portion, the air and / or the foreign substance introduced through the microphone hole 203 may directly reach the diaphragm 410. For example, in such cases, when high-pressure air is introduced, the diaphragm 410 may be easily damaged by pressure of the air. In such cases, whena foreign body, e.g., a pin, is inserted, the foreign body reaches the diaphragm 410, and the diaphragm 410 may be damaged. By having a structure in which the space between the at least one first through hole 313 and the diaphragm 410 is not entirely aligned, damage to the diaphragm 410 may be reduced. For example, even if the high-pressure air is introduced, since the air passes through the at least one first through hole 313 and then bypasses the opening portion 401 to reach the diaphragm 410, pressure applied to the diaphragm 410 may be reduced. Thus, robustness against pneumatic damage of the audio input device 400 may be improved without a separate structure. Also, even if a foreign body or substance is introduced into the microphone hole 203 and the duct 206, since the fourth end 313b of the at least one first through hole 313 is blocked by the second substrate 420, it may be difficult to reach the diaphragm 410.

[0082] The second substrate 420 may be mounted on the first substrate 310 by using a surface mounted technology "SMT". For example, the audio input device 400 may be electrically connected to the first substrate 310 through the second substrate 420. The second substrate 420 may include the second through hole 421 at least partially overlapping the diaphragm 410. For example, the second through hole 421 may be connected to the front chamber C1.

[0083] The second through hole 421 may be connected to the opening portion 401. Since the second through hole 421 at least partially overlaps the diaphragm 410, the second through hole 421 may connect the opening portion 401 and the front chamber C1. Sound waves that have passed through the at least one first through hole 313 and the opening portion 401 may be transmitted to the front chamber C1 and the diaphragm 410 through the second through hole 421.

[0084] The second through hole 421 may be at least partially misaligned with the at least one first through hole 313. For example, the at least one first through hole 313 and the second through hole 421 may not be directly connected, but may be connected to each other through the opening portion 401. For example, sound waves that have passed through the at least one first through hole 313 may be introduced into the second through hole 421 through the opening portion 401. Sound waves pass through the second through hole 421 and are transmitted to the diaphragm 410, and the diaphragm 410 vibrates based on the sound waves that have passed through the second through hole 421.

[0085] Suitably, an area, size, path, or shape of the second through hole 421 and the first through hole 313 are formed differently from each other, so that the air including the sound wave introduced into inside of the electronic device 101 by passing through the first through hole 313 may change the pressure, flow, direction, or intensity of the air while passing through the first through hole 313 and the second through hole 421. For example, as the intensity of the air pressure is weakened while passing through the second through hole 421 than the pressure when passing through the first through hole 313, influence on the diaphragm 410 is attenuated, and the diaphragm 410 may be protected from damage.

[0086] If the at least one first through hole 313 and the second through hole 421 are entirely aligned with each other, the diaphragm 410 may be more easily damaged by the air and / or the foreign bodies or substances. However, in this example, as the second through hole 421 and the at least one first through hole 313 are at least partially misaligned, the damage to the diaphragm 410 may be reduced. Even if high-pressure air is introduced, since the air passes through the at least one first through hole 313 and then passes through the second through hole 421 through the opening portion 401, pressure transmitted to the diaphragm 410 is reduced. Also, even if a foreign body or substance is inserted into the at least one first through hole 313, since the second through hole 421 are at least partially misaligned with the at least one first through hole 313, the foreign body or substance may not reach the diaphragm 410.

[0087] Referring again to FIG. 3, the electronic device 101 may include at least one sealant 470 for sealing between the duct 206 and the first substrate 310. For example, the first substrate 310 may be disposed on the support member 243. A gap may exist between the first substrate 310 and the duct 206. When sound waves are transmitted through the duct 206, leakage through the gap may occur, and thus the audio signal generated by the audio input device 400 may become distorted. The sealant 470 is configured to seal the gap. The sealant 470 may be in contact with the first surface 311 of the first substrate 310. For example, the sealant 470 may comprise compressible poron, but other materials or configurations are also possible.

[0088] A portion of the duct 206 is for example formed with a curved shape, along its length. That is, the duct 206 may not extend straightly from the microphone hole 203 but may be curved between the first end 206a and the second end 206b. The first through hole 313 and the second through hole 421 may be formed not to be aligned with each other through the curved area 206c. For example, the curved area 206c may be formed in one or a plurality of separate sections of the duct 206, and formation of the curved area 206c is not limited to one curve. The curved area 206c may include not only a curved shape, but also a change in a size of the duct. For example, in the curved area 206c, in order to interfere with flow of the air, a size, area, or volume of the duct through which the air is introduced from the first end 206a to the curved area 206c may be narrowed or widened. In one example, the curved area 206c is not a substantially curved portion of the duct, rather the curved areas 206c divides the duct between a section of the duct 206 from the first end 206a to the curved area 206c, and a section of the duct 206 from the curved area 206c to the second end 206b. In this example the size and volume of both sections may be formed differently based on the curved area 206c. For example, the duct 206 may be formed to be larger in size or larger in volume of the section from the curved area 206c to the second end 206b than from the first end 206a to the curved area 206c. As the air introduced through this duct configuration enters from a narrow area and moves to a wide area, the flow or a pressure of the air is reduced, thereby reducing the impact on the diaphragm. Referring to FIG. 3, the duct 206 may include the curved area 206c whose direction changes, extending from the first end 206a connected to the microphone hole 203. For example, a direction extending from the first end 206a to the curved area 206c may be different from a direction extending from the curved area 206c to the second end 206b. As the direction along which the duct 206 extends is curved, the damage to the diaphragm 410 due to air and / or foreign bodies / substances may be reduced. For example, even if the high-pressure air is introduced, the pressure of the air may decrease when passing through the curved area 206c, so the pressure transmitted to the diaphragm 410 may be reduced. Furthermore, even if the foreign substance is inserted into the duct 206, since at least a portion of the duct 206 is curved by the curved area 206c, the foreign substance may not reach the diaphragm 410.

[0089] FIG. 5A illustrates a second surface of a first substrate. FIG. 5B is a cross-sectional view of a first substrate cut along B-B' of FIG. 5A.

[0090] Referring to FIG. 5A, in order for at least one electronic component to be electrically connected to a first substrate 310, the first substrate 310 may include a plurality of areas 317 in which at least one conductive layer 310c is exposed. For example, in the plurality of areas 317, by removing a cover layer, e.g., a second cover layer 310b of FIG. 5B, forming the second surface 312, at least one conductive layer 310c providing an electrical connection between a plurality of electronic components may be exposed. A portion of the layer 310b may be located in a removed partial area 314. The partial area 314 may include an area 316 that overlaps a second through hole 421 of a second substrate 420.

[0091] The electronic component may be electrically connected to the first substrate 310 by being connected to the at least one conductive layer 310c exposed to outside. For example, an audio input device, e.g., an audio input device 400 of FIG. 3, may be electrically connected to at least one exposed conductive layer 310c. For example, the first substrate 310 may provide an electrical connection between a processor, e.g., a processor 120 of FIG. 1, electrically connected to the at least one conductive layer 310c and the audio input device 400.

[0092] Referring to FIG. 5B, the first substrate 310 may include a plurality of layers. For example, referring to FIG. 5B, the first substrate 310 may include the at least one conductive layer 310c and at least one non-conductive layer 310d stacked on each other.

[0093] The first substrate 310 may include a first cover layer 310a, a second cover layer 310b, the at least one conductive layer 310c, and the at least one non-conductive layer 310d. The at least one non-conductive layer 310d may include an insulating substrate, e.g., prepreg. Copper foil may be attached to both surfaces of the at least one non-conductive layer 310d. By removing a portion of the copper foil according to a designated circuit design, the at least one conductive layer 310c may be formed. Although not illustrated, the first substrate 310 may include a conductive via that provides an electrical connection between different conductive layers. For example, the first cover layer 310a and the second cover layer 310b may be coating layers for protecting a surface of the first substrate 310. For example, the first cover layer 310a and the second cover layer 310b may include a solder resist. For example, the first cover layer 310a may form the first surface 311. For example, the second cover layer 310b may form the second surface 312. In other embodiments, alternative configurations for the plurality of layers forming the first substrate 310 are envisaged, compared to the example illustrated in FIG. 5B.

[0094] At least one first through hole 313 may comprise a plurality of through holes. For example, the at least one first through hole 313 may include four through holes spaced apart from each other. A circumference of each of the plurality of through holes may be about 0.2 π. However, the number and circumference of the plurality of through holes are exemplary only.

[0095] The plurality of through holes may overlap the partial area 314 from which a portion of the second cover layer 310b is removed. For example, when viewing the first substrate 310 from above, an end of the plurality of through holes formed on the second surface 312 may be located in the partial area 314 from which a portion of the second cover layer 310b is removed. For example, the partial area 314 may include the area 316 that overlaps the second through hole 421 of the second substrate 420. In order not to interfere with the contact portion 422 of the second substrate 420 electrically connected to the first substrate 310, the plurality of through holes may be spaced apart from the contact portion 422 of the second substrate 420 in contact with the at least one conductive layer 310c.

[0096] An opening portion 401 may overlap the partial area 314 and the second through hole 421 of the first substrate 310 adjacent to the at least one first through hole 313. For example, the partial area 314 may be formed in an internal area of a position where a plurality of through holes spaced apart from each other are formed. The opening portion 401 may overlap the second through hole 421 and a diaphragm 410 of the second substrate 420.

[0097] The second through hole 421 may be at least partially misaligned with the at least one first through hole 313. For example, when viewing the second substrate 420 from above, the second through hole 421 may be spaced apart from the at least one first through hole 313 without overlapping the at least one first through hole 313. For example, the area 316 in which the first substrate 310 overlaps the second through hole 421 may be spaced apart from each of the plurality of through holes without contacting the plurality of through holes. As described above, as the second through hole 421 is at least partially misaligned with the at least one first through hole 313, robustness against pneumatic damage of the audio input device 400 may be improved. For example, pressure of air that has passed through the at least one first through hole 313 may be reduced while being transmitted to the second through hole 421 that is misaligned with the at least one first through hole 313. Since the pressure of the air is reduced and then transmitted to the diaphragm 410, damage to the diaphragm 410 due to the pressure of the air may be reduced. Since the air is not directly transmitted to the diaphragm 410 but passes through the at least one first through hole 313 and the second through hole 421 that are misaligned with each other, the damage to the diaphragm 410 may be reduced. For example, in case that a rigid foreign body or substance is inserted into a microphone hole 203 and a duct 206, since the at least one first through hole 313 and the second through hole 421 are misaligned with each other, the foreign body or substance may not reach the diaphragm 410. In case that the at least one first through hole 313 includes the plurality of through holes, the second through hole 421 may at be least partially misaligned with each of the plurality of through holes. The opening portion 401 may connect the plurality of through holes and the second through hole 421 so that the sound wave that has passed through the plurality of through holes may reach the diaphragm 410. Thus, as described, the opening portion 401 may be implemented through a path portion 315 of the first substrate 310.

[0098] The first substrate 310 may include the path portion 315. Referring to FIG. 5B, the path portion 315 may be formed by at least partially removing the second cover layer 310b and / or at least one conductive layer 310c included in the partial area 314 of the first substrate 310.

[0099] For example, a fourth end 313b of the at least one first through hole 313 may be blocked by the second substrate 420 by contacting the second substrate 420. In the partial area 314 of the first substrate 310 adjacent to the at least one first through hole 313, the second cover layer 310b and the path portion 315 from which the at least one conductive layer 310c is at least partially removed may be in contact with the at least one first through hole 313. For example, the path portion 315 may be connected to each of the plurality of through holes spaced apart from each other in the partial area 314. Since the path portion 315 is formed in the partial area 314 adjacent to the at least one first through hole 313, the path portion 315 may be connected to each of the plurality of through holes. Since the partial area 314 and the second through hole 421 overlap each other, the path portion 315 may be in contact with the second through hole 421. As the path portion 315 is connected to each of the at least one first through hole 313 and the second through hole 421, the at least one second through hole 421 may be connected to the at least one first through hole 313 through the path portion 315.

[0100] the opening portion 401 may be implemented through the path portion 315. For example, the sound wave that has introduced through the at least one first through hole 313 may be transmitted to the diaphragm 410 through the path portion 315. Since the path portion 315 is connected to the at least one first through hole 313 and the second through hole 421, the sound wave may pass through the at least one first through hole 313 and then be transmitted to the second through hole 421 through the path portion 315. As the sound wave passes through the second through hole 421 and is transmitted to the diaphragm 410, the diaphragm 410 may vibrate. By vibration of the diaphragm 410, the sound wave may be converted into an audio signal. The plurality of through holes may be formed in substantially the same shape so that the sound wave that has passed through the plurality of through holes do not interfere with each other such as by destructive interference. For example, a length, volume, and diameter of the plurality of through holes may be substantially the same.

[0101] FIG. 6 illustrates an exemplary audio input device disposed in an electronic device.

[0102] Referring to FIG. 6, an opening portion 401 may be implemented through a path portion 423 of a second substrate 420. The path portion 423 may be formed by removing at least one first through hole 313, a second through hole 421, and a portion of the second substrate 420 overlapping a diaphragm 410. The path portion 423 may be formed by removing a partial layer of the second substrate 420 in contact with a first substrate 310. Since the at least one first through hole 313 is formed by penetrating from a first surface 311 to a second surface 312, at least a portion of a path, e.g., a first path P1, of a sound wave passing through the at least one first through hole 313 may face a direction from the first surface 311 toward the second surface 312. Since the path portion 423 is formed by removing the portion of the second substrate 420, at least a portion of a path, e.g., a second path P2, of a sound wave passing through the path portion 423 may face a different direction from the first path P1. For example, the direction of the second path P2 may be substantially perpendicular to the direction of the first path P1, but other alternative arrangements are possible.

[0103] The path portion 423 may connect the second through hole 421 that is misaligned with the at least one first through hole 313 to the at least one first through hole 313. Sound waves that have been introduced into the at least one first through hole 313 through a duct 206 may be transmitted to the second through hole 421 through the path portion 423. The sound waves may pass through the second through hole 421 and are transmitted to the diaphragm 410, and the diaphragm 410 vibrates based on the sound wave.

[0104] Since the second through hole 421 is misaligned with the at least one first through hole 313, robustness of an audio input device 400 may be improved. For example, even if high-pressure air is introduced, the air may be not directly transmitted to the diaphragm 410, but may pass through the path portion 423 and then be transmitted to the diaphragm 410. Since the direction of the first path P1 and the direction of the second path P2 are different, pressure of air transmitted to the diaphragm 410 is reduced, and thus damage to the diaphragm 410 may be reduced. Also, even if a foreign substance is inserted into the at least one first through hole 313, since it is difficult to pass through the path portion 423, damage to the diaphragm 410 may be reduced / prevented.

[0105] The above-described arrangements may be applied without being limited to the particular structure and / or shape of an electronic device such as the electronic device 101. For example, the electronic device 101 illustrated in FIG. 2 is shown as a general bar type electronic device 101, but the structure and / or shape of the electronic device 101 may be one of various others while still gaining the benefit of the arrangements described. For example, the electronic device 101 may include a housing 210 having a structure and / or shape with elements that are movably or rotatably coupled to each other. Hereinafter, electronic devices 101 having various structures and / or shapes, and applicability of the audio input device 400 to such electronic devices 101 are introduced with reference to the drawings.

[0106] FIG. 7A is a top plan view of an exemplary electronic device in a first state.

[0107] Referring to FIG. 7A, the electronic device 101 may include a first housing 710, a second housing 720 movable with respect to the first housing 710 in a first direction 761 parallel to a y-axis or in a second direction 762 parallel to the y-axis and opposite to the first direction 761, and a display 730. Hereinafter, an operation in which the second housing 720 moves with respect to the first housing 710 is described, but it is not limited thereto. For example, the electronic device 101 may have a structure in which an overall size of the electronic device 101 may be changed according to a change in a relative positional relationship between the first housing 710 and the second housing 720. For example, the relative positional relationship between the first housing 710 and the second housing 720 may be changed by an operation of a driving unit, e.g., a driving unit 860 of FIG. 8A, as described later. For example, by the driving unit 860, the first housing 710 or the second housing 720 may move, or both the first housing 710 and the second housing 720 may move. For example, the first housing 710 may include a microphone hole 203. For example, the microphone hole 203, e.g., at least one first through hole 313 may be formed on a side surface of the first housing 710 facing a -y direction, but is not limited thereto.

[0108] The electronic device 101 is configurable in a first state. In the first state, the second housing 720 may be movable with respect to the first housing 710 in the first direction 761 among the first direction 761 and the second direction 762. That is, in the first state, the second housing 720 may not be movable in the second direction 762 with respect to the first housing 710.

[0109] In the first state, the display 730 may provide a display area having a small size. For example, in the first state, the display area may correspond to a first area 730a illustrated in FIG. 7A. For example, although not illustrated in FIG. 7A, in the first state, a second area, e.g., a second area 730b of FIG. 7B, of the display 730 different from the first area 730a, which is the display area, may be contained in the first housing 710. For example, in the first state, the second area 730b may be covered by the first housing 710. For example, in the first state, the second area 730b may be rolled into the first housing 710.

[0110] Thus, the first state may be referred to as a slide-in state or a closed state in terms of at least a portion of the second housing 720 being located in the first housing 710. Also, the first state may be referred to as a reduced state in terms of providing the display area having a small size.

[0111] The electronic device 101 may change configuration from the first state to a second state. The first state may be changed to the second state through intermediate states between the first state and the second state. The same applies to intermediate states between the second state and the first state as the configuration of the electronic device changes therebetween.

[0112] The first state (or the second state) may be changed to the second state (or the first state) based on a user input. For example, the first state (or the second state) may be changed to the second state (or the first state) in response to a user input to a physical button exposed through a portion of the first housing 710 or the portion of the second housing 720. For example, the first state (or the second state) may be changed to the second state (or the first state) in response to a touch input for an executable object displayed in the display area. For example, the first state (or the second state) may be changed to the second state (or the first state) in response to a touch input having a contact point on the display area and having a pressing intensity greater than or equal to a reference intensity. For example, the first state (or the second state) may be changed to the second state (or the first state) in response to a voice input received through a microphone of the electronic device 101. For example, the first state (or the second state) may be changed to the second state (or the first state) in response to an external force applied to the first housing 710 and / or the second housing 720 to move the second housing 720 with respect to the first housing 710. For example, the first state (or the second state) may be changed to the second state (or the first state) in response to a user input identified in an external electronic device (e.g., earbuds or smart watch) connected to the electronic device 101.

[0113] FIG. 7B is a top plan view of an exemplary electronic device in a second state.

[0114] Referring to FIG. 7B, an electronic device 101 may be in the second state (e.g., a slide-out state or an open state). For example, in the second state, the second housing 720 may be movable with respect to a first housing 710 in a second direction 762 among a first direction 761 and the second direction 762. For example, in the second state, the second housing 720 may not be movable in the first direction 761 with respect to the first housing 710.

[0115] In the second state, the display 730 may provide the display area having the largest size. For example, in the second state, the display area may correspond to an area 730c including a first area 730a and a second area 730b. For example, the second area 730b that was included in the first housing 710 in the first state may be exposed in the second state.

[0116] The second state may be referred to as a slide-out state or an open state in terms of that at least a portion of the second housing 720 disposed outside the first housing 710 extends with respect to the first state. The second state may be referred to as an extended state in terms of providing the display area having the largest size. However, it is not limited thereto.

[0117] Although not illustrated in FIGS. 7A and 7B, the electronic device 101 may be in an intermediate state between the first state and the second state. For example, a size of the display area in the intermediate state may be larger than a size of the display area in the first state and smaller than a size of the display area in the second state. For example, the display area in the intermediate state may correspond to an area including the first area 730a and a portion of the second area 730b. For example, in the intermediate state, a portion of the second area 730b is exposed, and another portion (or remaining portion) of the second area 730b may be covered by the first housing 710 or may be rolled into the first housing 710.

[0118] FIG. 8A is an exploded perspective view of an exemplary electronic device. FIG. 8B is a cross-sectional view of an exemplary electronic device in a first state. FIG. 8C is a cross-sectional view of an exemplary electronic device in a second state.

[0119] Referring to FIGS. 8A and 8B, an electronic device 101 may include a first housing 710, a second housing 720, a display 730, and a driving unit 860.

[0120] For example, the first housing 710 may include a first cover 811, a first plate 812, and a frame 813.

[0121] The first cover 811 may at least partially form a side surface portion of an outer surface of the electronic device 101. The first cover 811 may include a surface supporting the first plate 812. The first cover 811 may be coupled to the first plate 812. The first cover 811 may include the frame 813, and / or the first cover 811 may be coupled to the frame 813.

[0122] The first plate 812 may at least partially form a rear portion of the outer surface. For example, the first plate 812 may be disposed on the surface of the first cover 811.

[0123] The frame 813 may be at least partially surrounded by the first cover 811.

[0124] The frame 813 may be at least partially surrounded by the display 730. For example, the frame 813 is at least partially surrounded by the display 730, but a position of the frame 813 may be maintained independently of movement of the display 730. The frame 813 may include rails 813a that provide, or guide, a path of movement of at least one component of the display 730.

[0125] The frame 813 may be coupled with at least one structure of the electronic device 101 for a plurality of states including the first state and the second state. For example, the frame 813 may hold fast a motor 861 of the driving unit 860.

[0126] The second housing 720 may include a second cover 821 and a second plate 822.

[0127] The second cover 821 may be at least partially surrounded by the display 730. For example, unlike the frame 813, the second cover 821 may be coupled with at least a portion of a first area, e.g., a first area 730a of FIG. 7A, of the display 730 surrounding the second cover 821 so that the display 730 moves according to the second housing 720 moving with respect to the first housing 710.

[0128] The second cover 821 may be coupled with at least one component of the electronic device 101. The second cover 821 may be coupled with a printed circuit board "PCB".

[0129] The second cover 821 may be coupled with the at least one structure of the electronic device 101 for the plurality of states including the first state and the second state. For example, the second cover 821 may fix a rack gear 863 of the driving unit 860.

[0130] The second cover 821 may be coupled with the second plate 822.

[0131] The second plate 822 may be coupled with the second cover 821 to protect at least one component of the electronic device 101 coupled in the second cover 821 and / or at least one structure of the electronic device 101 coupled in the second cover 821.

[0132] The electronic device 101 may include a support member 831 for supporting at least a portion of the display 730. For example, the support member 831 may comprise a plurality of bars, e.g. a plurality of bars that are coupled to one another. The support member 831 thus may support a second area, e.g., a second area 730b of FIG. 7B, of the display 730.

[0133] The driving unit 860 may include the motor 861, a pinion gear 862, and the rack gear 863.

[0134] The motor 861 may operate based on power from a battery, such as a battery corresponding to the battery 189 of FIG. 1. For example, the power may be provided to the motor 861 in response to user input.

[0135] The pinion gear 862 may be coupled with the motor 861 through a shaft. The pinion gear 862 may be rotated based on the operation of the motor 861 transmitted through the shaft.

[0136] The rack gear 863 may be arranged in cooperative relation with the pinion gear 862, such that teeth of the rack gear 863 may engage with teeth of the pinion gear 862. In this way, the rack gear 863 may be moved in the first direction 761 or the second direction 762 according to the rotation of the pinion gear 862. Correspondingly, the second housing 720 may be moved in the first direction 761 and the second direction 762 by the rack gear 863 that moves according to the rotation of the pinion gear 862 due to the operation of the motor 861. In this way, the first state of the electronic device 101 may be changed to a state, e.g., the one or more intermediate states or the second state, different from the first state through the movement of the second housing 720 in the first direction 761. Furthermore, the second state of the electronic device 101 may be changed to a state, e.g., the one or more intermediate states or the first state, different from the second state through the movement of the second housing 720 in the second direction 762. The change of the first state to the second state by the driving unit 860 and the change of the second state to the first state by the driving unit 860 are illustrated by FIGS. 8B and 8C.

[0137] Referring to FIGS. 8B and 8C, the motor 861 may operate based at least in part on the above-defined user input received in the first state 891. The pinion gear 862 may be rotated in a first rotation direction 801 based on the operation of the motor 861. The rack gear 863 is thus moved in the first direction 761 based on the rotation of the pinion gear 862 in the first rotation direction 801. Since the second cover 821 in the second housing 720 fixes the rack gear 863, the second housing 720 may be moved in the first direction 761 based on the movement of the rack gear 863 in the first direction 761. Since the second cover 821 in the second housing 720 is coupled to at least a portion of the first area 730a of the display 730 and fixes the rack gear 863, the display 730 may be moved based on the movement of the rack gear 863 in the first direction 761. That is, the display 730 may be moved along the rails 813a. As will be appreciated, a shape of at least some of the plurality of bars of the support member 831 of the display 730 may be changed when the state 891 is changed to the state 892.

[0138] The second area 730b of the display 730 may be moved according to the movement of the display 730. When the first state 891 is changed to the second state 892 according to the above-defined user input, the second area 730b may be moved through a space between the first cover 811 and the frame 813. The second area 730b in the second state 892 may be exposed, in contrast to the second area 730b being rolled into the space in the first state 891.

[0139] Since the second cover 821 in the second housing 720 is coupled with a PCB 824 connected to the other end of a FPCB 825 and fixes the rack gear 863, a shape of the FPCB 825 is changed when the first state 891 is changed to the second state 892.

[0140] The motor 861 may be operated based at least in part on the above-defined user input received in the state 892. The pinion gear 862 may be rotated in a second rotation direction 802 based on the operation of the motor 861. the rack gear 863 may thus be moved in the second direction 762 based on the rotation of the pinion gear 862 in the second rotation direction 802. Since the second cover 821 in the second housing 720 fixes the rack gear 863, the second housing 720 may be moved in the second direction 762, based on the movement of the rack gear 863 in the second direction 762. Since the second cover 821 of the second housing 720 is coupled to the at least a portion of the first area 730a of the display 730 and fixes the rack gear 863, the display 730 may be moved based on the movement of the rack gear 863 in the second direction 762. That is, the display 730 may be moved along the rails 813a. As will be appreciated, the shape of at least some of the plurality of bars of the support member 831 of the display 730 may be changed when the second state 892 is changed to the first state 891. The support member 831 may be moved with respect to the first housing 710. The support member 831, when stored inside the first housing 710 in the first state 891 may be located between the first cover 811 and the frame 813. The display 730 may be moved with respect to the first housing 710 according to movement of the support member 831.

[0141] The second area 730b of the display 730 may be moved according to the movement of the display 730. When the second state 892 is changed to the first state 891 according to the above-defined user input, the second area 730b may be moved through the space between the first cover 811 and the frame 813. The second area 730b in the first state 891 is rolled into the space, in contrast to the second area 730b being exposed in the second state 892.

[0142] Since the second cover 821 of the second housing 720 is coupled with the PCB 824 connected to the other end of the FPCB 825 and fixes the rack gear 863, the shape of the FPCB 825 is changed when the second state 892 is changed to the first state 891.

[0143] FIG. 9 illustrates a portion of an exemplary electronic device.

[0144] An audio input device 400 illustrated in FIG. 9 may be substantially the same as the audio input device 400 described with reference to FIGS. 3 to 6. The same reference numerals are assigned to the same component as the above-described component, and thus repetitious overlapping description is omitted.

[0145] Referring to FIG. 9, the housing 210 may include a first housing 710 and a second housing 720. The first housing 710 may include a microphone hole 203 and a duct 206. The microphone hole 203 and the duct 206 may be formed outside the first housing 710 surrounding at least a portion of a display 730. The microphone hole 203 may be formed on a side surface 710a of the first housing 710 facing a second direction 762 in which the display 730 slides in. The duct 206 may extend from the microphone hole 203 to inside of the first housing 710. The audio input device 400 may be disposed in an internal space of the first housing 710 connected to the duct 206. The electronic device 101 may include a sealant 470 for sealing between the duct 206 and the internal space.

[0146] A first substrate 310 may include at least one first through hole 313. The at least one first through hole 313 may be connected to the duct 206. The audio input device 400 may include a diaphragm 410 and a plate 450. The audio input device 400 may include an opening portion 401 so that sound waves introduced into the at least one first through hole 313 through the microphone hole 203 and the duct 206 may be transmitted to the diaphragm 410. The opening portion 401 may be formed at a position overlapping the diaphragm 410 and a partial area 314 adjacent to the at least one first through hole 313. The opening portion 401 may be connected to the at least one first through hole 313. Sound waves that have passed through the at least one first through hole 313 are transmitted to the diaphragm 410 through the opening portion 401. Sound waves that have passed through the at least one first through hole 313 may not be directly transmitted to the diaphragm 410, but may be transmitted after passing through the opening portion 401. The opening portion 401 here corresponds to the opening portion 401 described through FIGS. 5A, 5B, and 6.

[0147] Since the first housing 710 surrounds at least a portion of the display 730, a structure of the duct 206 may be limited. In order for the second housing 720 to be movably coupled to the first housing 710, the first housing 710 may include a space for accommodating at least a portion of the second housing 720 and the display 730. For example, the first housing 710 may include a recess 710b for accommodating at least a portion of the second housing 720 and the display 730. At least a portion of the second housing 720 and the display 730 may be disposed in the recess 710b. Since the first housing 710 includes the recess 710b, the duct 206 is disposed outside compared to a structure ,e.g., a driving unit 860 of FIG. 8A, for driving the second housing 720 and the display 730, and the space of the first housing 710 for accommodating a length of the duct 206 may be insufficient. For example, when the duct 206 extends from the microphone hole 203 formed in the side surface 710a, the length of the duct 206 may be limited by the size of the recess 710b. In some examples, the duct 206 may be formed integrally with the microphone hole 203. In some examples, when punching the side surface 710a of the first housing 710 to form the microphone hole 203, the microphone hole 203 and the duct 206 may be integrally formed by adjusting the depth of the perforation.

[0148] In case of the bar type electronic device 101 described with reference to FIGS. 2 to 6, since the duct 206 of a predetermined length or more may be accommodated, the duct 206 may include a curved portion, e.g., a curved area 206c of FIG. 3. In case of a rollable type of electronic device 101 illustrated in FIGS. 7A to 9, since the length of the duct 206 is limited, it may be difficult to form and / or house the curved area 206c of the duct 206. In some examples, the duct 206 may extend straightly from the microphone hole 203. However, in case that the length of the duct 206 is short and extends rectilinearly, the diaphragm 410 may be easily damaged by pressure of air transmitted through the duct 206 and / or a foreign body or foreign substance inserted into the duct 206.

[0149] Table 1 below indicates a result of pneumatic robustness tests for an exemplary electronic device (electronic device 101 of FIG. 9) and another electronic device ( electronic device 1001 of FIG. 10B) to give to a comparative example. When air having a maximum pressure of 0.9 MPa is sprayed into the duct 206 of FIG. 9 of the exemplary electronic device 101 and the duct 1006 of FIG. 10B, the pressure of the air at the diaphragm 410 of FIG. 9 or the diaphragm 1011 of FIG. 10B may be measured. [Table 1]TestThe electronic device 1001 acting as a comparative exampleExemplary electronic device 101#10.6MPanot broken#20.7MPanot broken#30.6MPanot broken#40.6MPanot broken#50.6MPanot broken

[0150] Referring to the Table 1, in case of the electronic device 1001 that acts as a comparative example, when the air having the pressure of about 0.6 MPa to about 0.7 MPa is reaches the diaphragm 1001, the diaphragm 1011 may be damaged. In the case of the electronic device 1001 that acts as a comparative example, since the air that has passed through at least one first through hole 1012 directly reaches the diaphragm 1011, pressure applied to the diaphragm 1011 is relatively large. Since the diaphragm 1011 has a thin thickness, it may be easily damaged by such air. On the contrary, in case of the exemplary electronic device 101, even if air having pressure of about 0.9 MPa is sprayed, the diaphragm 410 is not damaged. Since the air passes through at least one first through hole 313 and then bypasses to the opening portion 401 to reach the diaphragm 410, the pressure may be relatively reduced.

[0151] The audio input device 400 has a structure for transmitting sound waves through the opening portion 401 connected to at least one first through hole 313, thereby reducing damage to the diaphragm 410. For example, as the opening portion 401 is formed at a position overlapping the partial area 314 of the first substrate 310 adjacent to the at least one first through hole 313 and the diaphragm 410, the sound waves that have passed through the at least one through hole 313 are transmitted to the diaphragm 410. Even if high-pressure air and / or foreign bodies or substances are introduced into inside of the duct 206, the air and / or the foreign bodies or substances are not directly transmitted to the diaphragm 410, by being blocked by a portion of the audio input device 400. For example, a portion of the second substrate 420 of FIG. 3 may perform such blocking. Through use of this sort of structure, damage to the diaphragm 410 may be reduced, and robustness of the audio input device 400 may be improved. For example, even if a cleaning process using an air gun is performed in a manufacturing process of the electronic device 101, damage to the audio input device 400 may be reduced, so a process defect rate of the electronic device 101 may be reduced.

[0152] FIG. 10A is a graph indicating performance of an audio input device. FIG. 10B illustrates an electronic device including an audio input device according to a comparative example.

[0153] For example, the audio input device ( the audio input device 400 of FIG. 9) may provide an audio signal corresponding to frequency bands of the received sound waves. Graphs G1 and G2 in FIG. 10A indicate intensity measured in decibel units "dB" of an audio signal provided by the audio input device 400 when a sound wave on a specific frequency band is transmitted to the diaphragm 410 of FIG. 9. The first graph G1 indicates the intensity of the audio signal according to frequency in the electronic device 101 including the exemplary audio input device 400. The exemplary audio input device 400 may be referred to as the audio input device 400 described with reference to FIG. 9. The second graph G2 indicates the intensity of the audio signal according to the frequency in an electronic device 1001 of FIG. 10B including another audio input device, in this case an audio input device 1010 of FIG. 10B, by way of a comparative example. An x-axis of the graph is the frequency measures in Hertz "Hz", and a y-axis of the graph is the intensity of the audio signal measured in dB.

[0154] Referring to FIG. 10B, the audio input device 1010 included in the electronic device 1001 that acts as a comparative example includes a first substrate 1013 including at least one first through hole 1012 aligned with the diaphragm 1011. At least a portion of a display 1200 is curved into the first housing 1100. The first housing 1100 includes a recess 1100a for accommodating at least a portion of the display 1200. The audio input device 1010 is disposed in the recess 1100a of the first housing 1100 in which a portion of the display 1200 is curved. Since the first housing 1100 includes the recess 1100a, the length of a duct 1006 is relatively limited. In case of the electronic device 1001 that forms the comparative example, since the length of the duct 1006 is limited, it may be difficult to form a curved area, that is in this example a curved area 206c of the duct 1006as shown in FIG. 3. Thus, in such examples the duct 1006 extends rectilinearly from a microphone hole 1003. Sound waves introduced through the microphone hole 1003 pass through the duct 1006 and the at least one first through hole 1012 and are transmitted to the diaphragm 1011. Since the at least one first through hole 1012 and the diaphragm 1011 are aligned, sound waves are directly transmitted to the diaphragm 1011. Except for the above-described structure, the electronic device 1001 and the audio input device 1010 illustrated in FIG. 10B may be substantially the same as an exemplary electronic device 101 and the audio input device 400 illustrated in FIG. 9.

[0155] Comparing the first graph G1 and the second graph G2, the intensity of the audio signal provided from the audio input devices 400 and 1010 does not show a substantial difference. For example, the first graph G1 and the second graph G2 indicate intensity of a similar audio signal in the audible frequency band up to about 20,000 Hz. Thus, the electronic device 101 including the exemplary audio input device 400 may provide substantially the same quality of the generated audio signal as the electronic device 1001 that acts as the comparative example while securing robustness of the audio input device 400. That is, in case of the electronic device 101 having a relatively short length duct 206, by connecting at least one first through hole 313 through an opening portion 401 overlapping the diaphragm 410, damage to the diaphragm 410 may be reduced.

[0156] FIG. 11A illustrates an unfolded state of an exemplary electronic device. FIG. 11B illustrates a folded state of an exemplary electronic device.

[0157] Referring to FIGS. 11A and 11B, an electronic device 101 according to an embodiment includes a first housing 1110, a second housing 1120, and a display 1130.

[0158] The first housing 1110 may include a first surface 1111, a second surface 1112 opposite to the first surface 1111, and a first side surface 1113 surrounding at least a portion of the first surface 1111 and the second surface 1112. The electronic device 101 may further include at least one camera 1134 exposed through a portion of the second surface 1112.

[0159] The second housing 1120 may include a third surface 1121, a fourth surface 1122 opposite to the third surface 1121, and a second side surface 1123 surrounding at least a portion of the third surface 1121 and the fourth surface 1122.

[0160] The second housing 1120 may be pivotably connected to the first housing 1110 with respect to a folding axis f. The pivotable connection is an example of a general rotatable connection. For example, a hinge structure 1150 disposed between the first housing 1110 and the second housing 1120 may pivotably connect the first housing 1110 and the second housing 1120. The hinge structure 1150 may include a first hinge plate and a second hinge plate. The first hinge plate may be connected to the first housing 1110, and the second hinge plate may be connected to the second housing 1120.

[0161] The display 1130 may include a first area 1131 disposed on the first surface 1111 of the first housing, a second area 1132 disposed on the third surface 1121 of the second housing, and a third area 1133 between the first area 1131 and the second area 1132. At least a portion of the third area 1133 may be disposed on the hinge structure 1150.

[0162] According to an embodiment, an opening may be formed in a portion of a screen display area of the display 1130, or a recess or the opening may be formed in a support member, e.g., a bracket, supporting the display 1130. The electronic device 101 may include at least one camera aligned with the recess or the opening. For example, the first area 1131 may further include at least one camera 1136 capable of obtaining an image from outside through a portion of the first area 1131.

[0163] The hinge structure 1150 may be configured to pivotably connect the first housing 1110 and the second housing 1120. A hinge cover 1155 surrounding the hinge structure 1150 may be exposed at least partially between the first housing 1110 and the second housing 1120 while the electronic device 101 is in a folded state. The hinge cover 1155 may be covered by the first housing 1110 and the second housing 1120 while the electronic device 101 is in an unfolded state.

[0164] The electronic device 101 may be folded with respect to the folding axis f passing through the hinge cover 1155. For example, the hinge cover 1155 may be disposed between the first housing 1110 and the second housing 1120 of the electronic device 101 in order to allow the electronic device 101 to be bent, curved, or folded. For example, the first housing 1110 may be connected to the second housing 1120 through the hinge structure 1150 disposed on the hinge cover 1155 and may rotate with respect to the folding axis f.

[0165] The first housing 110 and the second housing 120 may be folded to face each other by rotating with respect to the folding axis f. In an embodiment, the electronic device 101 may be folded so that the first housing 1110 and the second housing 1120 are overlapped or superimposed each other.

[0166] The hinge structure 1150 may include a hinge plate. For example, the hinge structure 1150 may include a hinge gear that makes the first housing 1110 and the second housing 1120 pivotable.

[0167] The electronic device 101 may include a microphone hole 203. For example, the microphone hole 203 may be formed on a side surface of the first housing 1110 and / or a side surface of the second housing 1120. Sound waves transmitted from outside of the electronic device 101 to an audio input device, e.g., an audio input device 400 of FIG. 12, disposed inside the electronic device 101 through the microphone hole 203.

[0168] FIG. 12 is a cross-sectional view of an exemplary electronic device cut along C-C' of FIG. 11A.

[0169] The audio input device 400 illustrated in FIG. 12 may be substantially the same as the audio input device 400 described with reference to FIGS. 3 to 6. The same reference numerals are assigned to the same component as the above-described component, and an overlapping description may be omitted. In the electronic device 101 illustrated in FIG. 12, other components aside from a structure of a housing 210, which includes a first housing 1110 and a second housing 1120 rotatably connected to one another may be substantially the same as described in relation to the electronic device 101 illustrated in FIGS. 3 to 6.

[0170] Referring to FIG. 12, the first housing 1110 and / or the second housing 1120 includes a microphone hole 203 and a duct 206. The microphone hole 203 may be formed on an outer surface of the first housing 1110 and / or an outer surface of the second housing 1120. The duct 206 may extend from the microphone hole 203 into the first housing 1110 and / or the second housing 1120. The duct 206 may include a curved area 206c in which the direction of the duct changes as the duct extends from a first end 206a connected to the microphone hole 203. The curved area 206c is the area at which the axial extent of the duct is curved. The audio input device 400 may be disposed in an internal space of the first housing 1110 and / or the second housing 1120 connected to the duct 206.

[0171] The first substrate 310 may include at least one first through hole 313. The at least one first through hole 313 may be connected to the duct 206. The audio input device 400 may include a diaphragm 410 and a plate 450. The audio input device 400 may include an opening portion 401 so that sound waves introduced into the at least one first through hole 313 through the microphone hole 203 and the duct 206 may be transmitted to the diaphragm 410. The opening portion 401 is formed at a position overlapping the diaphragm 410 and a partial area 314 adjacent to the at least one first through hole 313. The opening portion 401 may be connected to the at least one first through hole 313. Sound waves that have passed through the at least one first through hole 313 are transmitted to the diaphragm 410 through the opening portion 401. Sound waves that have passed through the at least one first through hole 313 are not directly transmitted to the diaphragm 410, rather are transmitted after passing through the opening portion 401. The opening portion 401 corresponds to the opening portion 401 as described with reference to FIGS. 5A, 5B, and 6.

[0172] The audio input device 400 has a structure for transmitting sound waves through the opening portion 401 connected to at least one first through hole 313, thereby reducing damage to the diaphragm 410. As the opening portion 401 is formed at a position overlapping the partial area 314 of the first substrate 310 adjacent to the at least one first through hole 313 and the diaphragm 410, the sound wave that has passed through the at least one through hole 313 is transmitted to the diaphragm 410. Even if high-pressure air and / or foreign bodies or substances are introduced to the duct 206, these may not be directly transmitted to the diaphragm 410, as they are blocked by a portion, e.g., a second substrate 420 of FIG. 3, of the audio input device 400. Through such structural configuration, damage to the diaphragm 410 may be reduced or avoided, and robustness of the audio input device 400 thereby improved.

[0173] An electronic device (e.g., an electronic device 101 of FIG. 3) is provided. An exemplary electronic device may include a housing (e.g., a housing 210 of FIG. 3), a first substrate (e.g., a first substrate 310 of FIG. 3), and an audio input device (e.g., an audio input device 400 of FIG. 3). The housing may comprise a microphone hole (e.g., a microphone hole 230 of FIG. 3) and a duct (e.g., a duct 206 of FIG. 3). The duct may comprise a first end (e.g., a first end 206a of FIG. 3) connected to the microphone hole and a second end (e.g., a second end 206b of FIG. 3) opposite to the first end. The first substrate may comprise a first surface (e.g., a first surface 311 of FIG. 3) and a second surface (e.g., a second surface 312 of FIG. 3) opposite to the first surface. The substrate may comprise at least one first through hole (e.g., at least one first through hole 313 of FIG. 3). The at least one first through hole may be connected to the second end of the duct on the first surface. The audio input device may be configured to convert into an audio signal by receiving a sound wave introduced from the microphone hole through the duct and the at least one first through hole. The audio input device may be coupled on the second surface. The audio input device may comprise a diaphragm (e.g., a diaphragm 410 of FIG. 3) and an opening portion (e.g., an opening portion 401 of FIG. 4). The diaphragm may be disposed to face the second surface. The diaphragm may be configured to vibrate based on the sound wave. The opening portion may be connected to the at least one first through hole on the second surface so that the sound wave is transmitted to the diaphragm. The opening portion may be formed at a position overlapping a partial area (e.g., a partial area 314 of FIG. 4) of the first substrate adjacent to the at least one first through hole and the diaphragm so that the sound wave is transmitted to the diaphragm. According to an example, the at least one first through hole and a space (e.g., a front chamber) facing the diaphragm may not be directly connected, but may be connected through the opening portion. The opening portion may be formed at a position overlapping the partial area of the first substrate adjacent to the at least one first through hole and the diaphragm. The at least one first through hole may be blocked by a portion (e.g., a second substrate) of the audio input device. According to an example, since a space between the at least one first through hole and the diaphragm is not entirely aligned, damage to the diaphragm may be reduced. For example, even if high pressure air is introduced, the air passes through the at least one first through hole and then bypasses the opening portion to reach the diaphragm, so the pressure applied to the diaphragm may be reduced. For example, even if a foreign substance is inserted into the microphone hole and the duct, it may be difficult for the foreign substance to reach the diaphragm because the at least one first through hole is blocked by the second substrate. According to an example, robustness of the audio input device may be improved.

[0174] According to an example, the first substrate may comprise a first cover layer (e.g., a first cover layer 310a of FIG. 5B), a second cover layer (e.g., a second cover layer 310b of FIG. 5B), at least one conductive layer (e.g., at least one conductive layer 310c of FIG. 5B), and a path portion (e.g., a path portion 315 of FIG. 5B). The first cover layer may form the first surface. The second cover layer may form the second surface. The at least one conductive layer may be disposed between the first cover layer and the second cover layer. The path portion may be formed by at least partially removing the second cover layer and at least one conductive layer included in the partial area of the first substrate. The path portion may be connected to the at least one first through hole. The opening portion may comprise the path portion. According to an example, the opening portion may be implemented through the path portion of the first substrate. The path portion may be formed by at least partially removing the second cover layer included in the partial area of the first substrate. The path portion may provide a path of the sound wave so that the sound wave passing through at least one first through hole reaches the diaphragm. By the path portion, a space (e.g., a front chamber) facing the diaphragm and the at least one first through hole may be connected without being aligned with each other.

[0175] According to an example, the audio input device may further include a second substrate (e.g., a second substrate 420 of FIG. 4). The second substrate may comprise a second through hole (e.g., a second through hole 421 of FIG. 4) overlapping at least partially with the diaphragm. The second substrate may be disposed on the second surface. The opening portion may be connected to the second through hole.

[0176] According to an example, the first substrate may comprise a first cover layer, a second cover layer, at least one conductive layer, and a path portion. The first cover layer may form the first surface. The second cover layer may form the second surface. The at least one conductive layer may be disposed between the first cover layer and the second cover layer. The path portion may be formed by at least partially removing the second cover layer and at least one conductive layer included in the partial area of the first substrate. The second through hole may be at least partially misaligned with the at least one first through hole. The second through hole may be connected to the at least one first through hole through the path portion. According to an example, the second substrate may provide an electrical connection between the audio input device and the first substrate. The second through hole may provide a path through which a sound wave is transmitted to the diaphragm. The second through hole may be misaligned with at least one first through hole. As the second through hole is misaligned with the at least one first through hole, robustness of the audio input device may be secured.

[0177] According to an example, the at least one first through hole may comprise a plurality of through holes. For example, the at least one first through hole may include four through holes spaced apart from each other.

[0178] According to an example, the at least one first through hole may include a third end (e.g., a third end 313a of FIG. 4) and a fourth end (e.g., a fourth end 313b of FIG. 4). The third end may be connected to the duct on the first surface. The fourth end may be opposite to the third end. The fourth end may be in contact with a part of the audio input device. According to an example, the fourth end is in contact with a part (e.g., a second substrate) of the audio input device, so that the at least one first through hole may not be directly connected to a space facing the diaphragm.

[0179] According to an example, the audio input device may further comprise a case (e.g., a case 430 of FIG. 4). The case may be disposed on the second surface. The case may form a back chamber (e.g., a back chamber C2 of FIG. 4) by covering the diaphragm. According to an example, the case may form the back chamber for an audio signal generated from the audio input device. For example, sensitivity of the audio input device may be determined based on a volume of the back chamber.

[0180] According to an example, the audio input device may further comprise a die (e.g., a die 440 of FIG. 4) and a plate (e.g., a plate 450 of FIG. 4). The die may space the diaphragm from the second surface by supporting the diaphragm. The plate may comprise a plurality of holes. The plate may be supported by the die. The plate may be spaced apart from the diaphragm in a direction in which the second surface faces. According to an example, the die may form a front chamber (e.g., a front chamber C1 of FIG. 4) facing the diaphragm. The front chamber may be connected to at least one first through hole through an opening portion.

[0181] According to an example, the audio input device may further comprise a signal processing circuit (e.g., a signal processing circuit 460 of FIG. 3). The signal processing circuit may be configured to generate an electrical signal based on a change in capacitance between the diaphragm and the plate. According to an example, the signal processing circuit may be configured to generate an audio signal based on vibration of the diaphragm. The generated audio signal may be transmitted to a processor through a first substrate a second substrate.

[0182] According to an example, the duct may include a curved area (e.g., a curved area 206c of FIG. 3). In the curved area, a direction extending from the first end may be curved. According to an example, the curved area may reduce damage to the audio input device. For example, the curved area may reduce high-pressure air and / or a foreign body or substance from being introduced to the audio input device.

[0183] An electronic device according to an example may further comprise a sealant (e.g., a sealant 470 of FIG. 3). The sealant may be in contact with the first surface. The sealant may seal between the duct and the first substrate. According to an example, the sealant may reduce distortion of an audio signal by sealing a gap between the first substrate and the duct.

[0184] According to an example, the housing may comprise a first housing (e.g., a first housing 710 of FIG. 9) and a second housing (e.g., a second housing 720 of FIG. 9). The second housing may be coupled to the first housing so as to be slidable in a first direction and in a second direction opposite to the first direction with respect to the first housing. The electronic device may further comprise a display (e.g., a display 730 of FIG. 9). The display may comprise a first area (e.g., a first area 730a of FIG. 8C) and a second area (e.g., a second area 730b of FIG. 8C). The first area may be disposed on the second housing. The second area may extend from the first area. The second area may be exposed to the outside along the second housing slid in the first direction. The second area may be rolled into the first housing along the second housing slid in the second direction. The microphone hole may be disposed on one side surface of the first housing. The audio input device may be disposed in the first housing. According to an example, the housing may comprise the first housing and the second housing that are slidably coupled to each other. For example, the electronic device may be referred to as a rollable electronic device. The microphone hole and the duct may be formed in the first housing that supports the display and the second housing.

[0185] According to an example, the duct may be formed integrally with the microphone hole. According to an example, since a first housing has a structure to accommodate a display and a second housing, a length of the duct may be limited. Since the length of the duct is limited, the duct may be formed integrally with the microphone hole. For example, when drilling one side surface of the first housing to form the microphone hole, the microphone hole and the duct may be integrally formed by adjusting the depth of the hole.

[0186] According to an example, the duct may extend straightly from the microphone hole. According to an example, since a length of the duct is limited, the duct may extend straightly without including a curved area. Even if the duct extends straightly, at least one first through hole may be blocked by a portion (e.g., a second substrate) of the audio input device and may be connected to a space facing a diaphragm through an opening portion. By the structure, robustness of the audio input device may be secured.

[0187] According to an example, the housing may comprise a first housing (e.g., a first housing 1110 of FIG. 11A) and a second housing (e.g., a second housing 1120 of FIG. 11A). The second housing may be rotatably connected to the first housing with respect to a folding axis (e.g., a folding axis f of FIG. 11A). The electronic device may further comprise a display (e.g., a display 1130 of FIG. 11A). The display may include a first area (e.g., a first area 1131 of FIG. 11A), a second area (e.g., a second region area of FIG. 11A), and a third area (e.g., a third area 1133 of FIG. 11A). The first area may be disposed on the first housing. The second area may be disposed on the second housing. The third area may be disposed along the folding axes. The third area may be located between the first area and the second area. The electronic device may further comprise a hinge structure (e.g., a hinge structure 1150 of FIG. 11A). The hinge structure may change the electronic device from an unfolding state of the electronic device in which the first area and the second area face the same direction to a folding state of the electronic device in which the first area faces the second area. The microphone may be disposed on one side surface of the first housing. The audio input device may be disposed in the first housing. According to an example, the housing may comprise the first housing and the second housing rotatably coupled to each other. For example, the electronic device may be referred to as a foldable electronic device. The microphone hole and the duct may be formed in the first housing and / or the second housing.

[0188] An audio input device is provided. An exemplary audio input device may comprise a first substrate, a diaphragm, and an opening portion. The first substrate may comprise a first surface and a second surface opposite to the first surface. The first substrate may comprise at least one first through hole. The diaphragm may be disposed to face the second surface. The diaphragm may be configured to vibrate by receiving a sound wave through the at least one first through hole. The opening portion may be connected to the at least one first through hole on the second surface so that the sound wave is transmitted to the diaphragm. The opening portion may be formed at a position overlapping the partial area of the first substrate adjacent to the at least one first through hole and the diaphragm so that the sound wave is transmitted to the diaphragm.

[0189] According to an example, the first substrate may comprise a first cover layer forming the first surface, a second cover layer forming the second surface, at least one conductive layer disposed between the first cover layer and the second cover layer, and a path portion in which the second cover layer and at least one conductive layer included in the partial area of the first substrate are at least partially removed. The path portion may be connected to the at least one first through hole. The opening portion comprise the path portion.

[0190] According to an example, an audio input device may further comprise a second substrate. The second substrate may comprise a second through hole overlapping at least partially with the diaphragm. The second substrate may be disposed on the second surface. The opening portion may be connected to the second through hole.

[0191] According to an example, the audio input device may further comprise a die that supports the diaphragm to space the diaphragm apart from the second surface, and a plate comprising a plurality of holes, supported by the die, and spaced apart from the diaphragm in a direction in which the second surface faces.

[0192] According to an example, the audio input device may further comprise a signal processing circuit configured to generate an electrical signal based on a change in capacitance between the diaphragm and the plate.

[0193] An electronic device is provided. The electronic device may include a housing, a first substrate, and an audio input device. The housing may comprise a microphone hole and a duct. The duct may comprise a first end connected to the microphone hole and a second end. The first substrate may comprise at least one first through hole. The at least one first through hole may be connected to the second end of the duct. The audio input device may be configured to convert into an audio signal by receiving a sound wave introduced from the microphone hole through the duct and the at least one first through hole. The audio input device may comprise a diaphragm, a second substrate, and an opening portion. The diaphragm may be disposed to face the first substrate. The diaphragm may be configured to vibrate based on the sound wave. The second substrate may be disposed between the diaphragm and the first substrate, and coupled to the first substrate. The opening portion may form a second path so that a path to which the sound wave is transmitted transmits from a first path passing through the at least one first through hole to the second path connected to the first path and having a different direction from a direction of the first path. The second substrate may be disposed between the first substrate and the diaphragm. The at least one first through hole may be located so that the diaphragm is covered by at least one of a portion of the first substrate and a portion of the second substrate, when viewing the audio input device at the second end of the duct.

[0194] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic devices may include, for example, a portable communication device such as a smartphone, a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.

[0195] It should be appreciated that various embodiments of the present disclosure and the terms used therein are not intended to limit the technological features set forth herein to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment. With regard to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It is to be understood that a singular form of a noun corresponding to an item may include one or more of the things unless the relevant context clearly indicates otherwise. As used herein, each of such phrases as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C," may include any one of or all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as "1st" and "2nd," or "first" and "second" may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). It is to be understood that if an element (e.g., a first element) is referred to, with or without the term "operatively" or "communicatively", as "coupled with," or "connected with" another element (e.g., a second element), it means that the element may be coupled with the other element directly such as through a wired connection), wirelessly, or via a third element.

[0196] As used in connection with various embodiments of the disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, "logic," "logic block," "part," or "circuitry". A module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented in a form of an application-specific integrated circuit "ASIC".

[0197] Various embodiments as set forth herein may be implemented as software (e.g., the program 140) including one or more instructions that are stored in a storage medium (e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g., the electronic device 101). For example, a processor (e.g., the processor 120) of the machine (e.g., the electronic device 101) may invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to the at least one instruction invoked. The one or more instructions may include a code generated by a complier or a code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein, the term "non-transitory" simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between a case in which data is semi-permanently stored in the storage medium and a case in which the data is temporarily stored in the storage medium.

[0198] According to an embodiment, a method according to various embodiments of the disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory "CD-ROM"), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., PlayStore ™< ), or between two user devices (e.g., smart phones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's server, a server of the application store, or a relay server.

[0199] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to various embodiments, operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added.

Claims

1. An electronic device comprising: a housing comprising a microphone hole and a duct comprising a first end connected to the microphone hole and a second end; a first substrate comprising a first surface and a second surface, and comprising at least one first through hole connected to the second end of the duct on the first surface; and an audio input device configured to convert a received sound wave into an audio signal by receiving a sound wave introduced from the microphone hole through the duct and the at least one first through hole, and coupled to the second surface, wherein the audio input device comprises: a diaphragm disposed to face the second surface and configured to vibrate in response to the received sound wave, and an opening portion connected to the at least one first through hole on the second surface so that the sound wave is transmitted to the diaphragm, and formed at a position overlapping a partial area of the first substrate adjacent to the at least one first through hole and the diaphragm.

2. The electronic device of claim 1, wherein the first substrate comprises: a first cover layer forming the first surface, a second cover layer forming the second surface, at least one conductive layer disposed between the first cover layer and the second cover layer, and a path portion in which the second cover layer and at least one conductive layer included in the partial area of the first substrate are at least partially removed, wherein the path portion is connected to the at least one first through hole, and wherein the opening portion comprises the path portion.

3. The electronic device of claim 1 or 2, wherein the audio input device further comprises a second substrate comprising a second through hole overlapping at least partially with the diaphragm and disposed on the second surface, and wherein the opening portion is connected to the second through hole.

4. The electronic device of claim 3, wherein the second through hole is at least partially misaligned with the at least one first through hole and connected to the at least one first through hole through the path portion.

5. The electronic device of any one of claims 1 to 4, wherein the at least one first through hole comprises a plurality of through holes.

6. The electronic device of any one of claims 1 to 5, wherein the at least one first through hole comprises a third end connected to the duct on the first surface and a fourth end, and wherein the fourth end contacts a part of the audio input device.

7. The electronic device of any one of claims 1 to 6, wherein the audio input device further comprises a case disposed on the second surface and forming a back chamber by covering the diaphragm.

8. The electronic device of any one of claims 1 to 7, wherein the audio input device further comprises: a die that supports the diaphragm to space the diaphragm apart from the second surface, and a plate comprising a plurality of holes, supported by the die, and spaced apart from the diaphragm in a direction in which the second surface faces.

9. The electronic device of claim 8, wherein the audio input device further comprises a signal processing circuit configured to generate an electrical signal based on a change in capacitance between the diaphragm and the plate.

10. The electronic device of any one of claims 1 to 9, wherein the duct comprises a curved area, in which the direction extending from the first end is changed.

11. The electronic device of any one of claims 1 to 10, further comprising a sealant that contacts the first surface and seals between the duct and the first substrate.

12. The electronic device of any one of claims 1 to 11, wherein the housing comprises a first housing, and a second housing coupled to the first housing so as to be slidable in a first direction and a second direction with respect to the first housing, wherein the electronic device further comprises a display, the display comprising: a first area disposed on the second housing, and a second area extending from the first area, the second area exposed to the outside along the second housing when slid in the first direction or rolled into the first housing along the second housing when slid in the second direction, wherein the microphone hole is disposed on one side surface of the first housing, and wherein the audio input device is disposed within the first housing.

13. The electronic device of any one of claims 1 to 12,, wherein the duct is formed integrally with the microphone hole.

14. The electronic device of any one of claims 1 to 13,, wherein the duct extends substantially rectilinearly from the microphone hole.

15. The electronic device of any one of claims 1 to 11, wherein the housing comprises a first housing and a second housing rotatably connected to the first housing with respect to a folding axis, wherein the electronic device further comprises: a display comprising a first area disposed on the first housing, a second area disposed on the second housing, and a third area located along the folding axis and located between the first area and the second area; and a hinge structure for changing from an unfolding state of the electronic device in which the first area and the second area face the same direction to a folding state of the electronic device in which the first area faces the second area, wherein the microphone is disposed on one side surface of the first housing, and wherein the audio input device is disposed within the first housing.

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