Light module of a motor vehicle signalling device, and motor vehicle signalling device incorporating same

Abstract

The invention relates to a light module (1) of a motor vehicle signalling device, comprising an array of light sources (2) mounted on an interconnection substrate (3) that comprises a stack of insulating layers (33) alternating with conducting layers (34) interconnected by means of vias (35). The light module (1) comprises at least one electronic component (4) for controlling and powering the array of light sources (2), the electronic component being buried in an internal layer of the interconnection substrate (3). This substrate (3) comprises a plurality of control vias (35a) electrically connecting the electronic component (4) to the array of light sources (2), the electronic component (4) being arranged to electrically power and selectively control each of the light sources (2) of the array by means of the plurality of control vias (35a).

Description

Description Title of the invention: LIGHT MODULE OF A SIGNALING DEVICE OF A MOTOR VEHICLE AND SIGNALING DEVICE OF A MOTOR VEHICLE INCORPORATING IT

[0001] The invention relates to the field of automotive lighting and light signaling. More specifically, the invention relates to the field of screens integrated into light modules for lighting or light signaling of motor vehicles.

[0002] It is known to integrate screens into lighting devices of motor vehicles, for example in rear lights, in front headlights, in bumpers or even on the front panel of the vehicle. These screens are for example produced by means of matrices of a large number of selectively controllable light sources, the dimensions of which are sufficiently small so that it is possible to display information on these screens, for example in the form of a message or pictogram, with a satisfactory resolution. This information thus makes it possible to improve the signaling of the motor vehicle, for example by contextualizing or accompanying a given signaling function with a message.

[0003] These light sources are generally mounted on a substrate, for example a printed circuit board, on the back of which are mounted one or more controllers, each allowing selective control of a portion of these light sources. This controller is generally an integrated circuit encapsulated in a package, allowing mechanical and electrical interfacing of the integrated circuit with the substrate, and ensuring thermal dissipation of the heat generated by the integrated circuit. The packages of modern controllers are generally equipped with a matrix of connectors, for example of the ball grid array (BGA) or land grid array (LGA) type, which is only optimized to dissipate heat on the side of the mounting face of the package on the substrate.

[0004] These encapsulated controllers therefore have various disadvantages.

[0005] From a thermal point of view, heat is generated significantly by the light sources and must therefore be dissipated, in order to avoid degrading their performance. It goes without saying that this heat cannot be dissipated from the side of the light sources, and that it must therefore be transmitted to the back of the substrate. However, the presence of the controllers on this side of the substrate reduces the space available for heat exchange, in particular for the arrangement of heat sinks. Similarly, it is necessary to keep a large space on this side of the substrate, both to arrange mechanical assembly solutions for the screen to the lighting device and to arrange solutions for connecting the screen to control and / or power supply units for this screen.

[0006] From a manufacturing point of view, these controllers must be assembled to the substrates by being soldered to them, which complicates the production of the lighting devices incorporating the screens, reduces their reliability and increases their cost. In addition, it is necessary to provide a connection harness between the screen and its control and / or power supply unit, which further complicates assembly and increases the cost of the lighting system.

[0007] From an electromagnetic compatibility point of view, the housing in which the controller is encapsulated must be shielded, in order to prevent the controller from emitting electromagnetic disturbances likely to impact the operation of another electronic component of the lighting device, or even of the motor vehicle, and vice versa.

[0008] Finally, from a reliability point of view, the greater the distance between the light sources and their controller, the more the control signals emitted by the controller to these light sources are likely to be weakened or interfered with during their transmission before reaching the light sources, which can create reliability problems when displaying an image on the screen, with regard to the display instruction given to it.

[0009] There is thus a need for a light module capable of forming a screen of a signaling device of a motor vehicle, equipped with light sources and one or more controllers of these sources, and which resolves the drawbacks of the light devices mentioned above.

[0010] The present invention is placed in this context, and aims to meet this need.

[0011] For these purposes, the subject of the invention is a light module of a signaling device of a motor vehicle, comprising a first matrix of selectively controllable light sources mounted on a first interconnection substrate comprising a stack of insulating layers alternating with conductive layers, each conductive layer being interconnected with another conductive layer by means of at least one via passing through an insulating layer, characterized in that it comprises at least a first electronic component for controlling and supplying the first matrix of light sources, said first electronic component being buried in the first substrate at the level of an internal layer of this first substrate, and in that the first substrate comprises a first plurality of control vias electrically connecting the first electronic component to the first matrix of light sources,the first electronic component being arranged to electrically power and selectively control each of the light sources of the first matrix through said first plurality of control vias.,

[0012] The invention, and in particular the fact that the electronic component(s), capable of controlling and powering the light sources of the first matrix, is buried in the interconnection substrate, gives the light module various advantages. On the one hand, the interconnection substrate forms, due to the conductive layers, a shield against electromagnetic disturbances likely to be emitted or received by said electronic component. On the other hand, no soldering or assembly operation of a controller to the substrate is necessary, so that assembly is facilitated, the reliability of the light module is increased and the cost of the light module is reduced. Furthermore, the distance between the light sources and the electronic component controlling these light sources is reduced, so that the integrity of the control signals of the light sources emitted by this electronic component is improved. Finally, the face of the interconnection substrate opposite the receiving face of the light sources is freed, so that a large space, which may in particular correspond to more than 90% of this receiving face, is available for example to arrange heat dissipation solutions, mounting members of the light module to the signaling device, or even control and / or power supply units. In the latter case, in addition to reducing the overall size of the signaling device, it is possible to avoid the use of a connection harness between the light module and the control and / or power supply unit, which makes it possible to further reduce the size and cost of the signaling device.

[0013] In the present invention, the term "via" means a metallized hole, for example having a metal plating on its inner surface or being filled with a metal, such as copper and in particular equipped, at each of its ends, with a connection pad with a conductive layer. It may advantageously be a micro-via, that is to say a via whose diameter is substantially less than or equal to 350 microns, or even substantially less than or equal to 150 pm, in particular equal to 90 pm.

[0014] In the present invention, the interconnection substrate may be a printed circuit board, in which two successive conductive layers are separated by an insulating layer. If necessary, each conductive layer may be etched and drilled to define interconnection tracks connected to interconnection tracks of another conductive layer by means of vias. Each conductive layer may be interconnected with the immediately upper and / or lower conductive layer and / or with one or more conductive layers.The vias may thus be buried vias, i.e. extending into the substrate without opening onto either of the lower or upper faces of the substrate, blind vias extending into the substrate opening onto only one of the lower and upper faces of the substrate, or through vias, in particular thermal vias, extending into the substrate opening onto each upper or lower face of the substrate. Similarly, the vias may be arranged within the substrate in a stepped and / or stacked configuration.

[0015] In the invention, the term "electronic component" means one or more integrated circuits, possibly associated with one or more passive components necessary for the operation of this or these integrated circuits. Said passive components may be electronic components, for example multilayer ceramic capacitors, silicon capacitors, resistors or inductors, or may be formed by a specific arrangement of a part of one or more conductive layers, as two successive conductive layers which partially overlap to form a capacitor. Where appropriate, the or each electronic component may be bare, i.e. not encapsulated in a housing, or alternatively encapsulated in a housing provided with electrical connection elements.

[0016] Advantageously, the first electronic component is arranged in a cavity reserved in an internal insulating layer, i.e. distinct from an insulating layer of the substrate exposed to the air, and is electrically connected to the conductive layer immediately above and / or below this insulating layer. It is thus possible to provide said cavity during the manufacture of the substrate, so that the first electronic component can be buried in the substrate during this manufacture.

[0017] Advantageously, the first matrix of light sources comprises at least 50 light sources, or even at least 200 light sources, or even at least 500 light sources.

[0018] In one embodiment of the invention, each of the light sources comprises at least one light-emitting semiconductor chip whose dimensions are between 150 pm and 400 pm. Such a chip is known in particular as a miniLED. Where appropriate, the light sources may be arranged on a first face of the substrate so as to be spaced apart from each other by a distance of less than 1 millimeter. Alternatively, each of the light sources comprises at least one light-emitting semiconductor chip whose dimensions are between 5 pm and 150 pm. Such a chip is known in particular as a microLED. Where appropriate, the light sources may be arranged on a first face of the substrate so as to be spaced apart from each other by a distance of between 200 and 400 pm, or even less than or equal to 300 pm.Here, the term "distance between two light sources" means the distance separating the center of one of these light sources from the center of the other of these light sources.

[0019] In one embodiment of the invention, the first matrix of light sources is mounted on a first face of the first interconnection substrate. Where appropriate, the light module comprises a control unit capable of generating a control instruction for the first electronic component for the selective control of each of the light sources of the first matrix and / or a power supply control unit capable of generating an electrical supply for the first electronic component for the power supply of the light sources of the first matrix, said control unit and / or said power supply control unit being mounted on a second face of the first interconnection substrate opposite the first face. This makes use of the space freed up at the second face of the first substrate to arrange such a control unit or such a control unit there.

[0020] “Control unit” means a unit capable of receiving, from a connector of the light module, an instruction to display an image by the first matrix of sources light sources, the instruction being able in particular to contain said image, and arranged to generate a control instruction for each of the light sources from said instruction. The term "power supply control unit" means a unit capable of receiving, from a connector of the light module, an external power supply and arranged to convert this external power supply into a power supply suitable for powering the first matrix of light sources and the first electronic component.

[0021] Preferably, said control unit and / or said power supply control unit may be connected to the first electronic component by at least one via of the substrate connected, directly or indirectly, to at least one conductive layer, called distribution layer, of the substrate. If necessary, said distribution layer may be connected to one or more connection pins of the first electronic component. If desired, said control unit and said conversion unit may be mounted on the same electronic circuit board attached to the second face of the first substrate.

[0022] Advantageously, the first matrix of light sources forms a passive matrix and the first electronic component is arranged to control said passive matrix through said first plurality of control vias according to the control instruction received from the control unit. For example, each control via will be able to control a row or a column of the first matrix of light sources.

[0023] In an alternative or cumulative embodiment, the first matrix of light sources is mounted on a first face of the first interconnection substrate, and the light module comprises a heat sink of the light module, said heat sink being mounted on a second face of the first interconnection substrate opposite the first face. The space freed up at the second face of the first substrate is thus used to arrange a heat sink therein for dissipating heat emitted by the light sources and by the first electronic component. It will also be noted that it is possible to distribute this heat over the entire surface of this second face, in order to optimize dissipation. The heat sink may be provided with dissipation fins and / or be made of a material having significant thermal conduction.

[0024] According to an exemplary embodiment of the invention, the light module comprises a second matrix of selectively controllable light sources mounted on the first interconnection substrate, and at least one second electronic component for controlling and powering the second matrix of light sources, said second electronic component being buried in the first substrate at an internal layer of this first substrate. Where appropriate, the first substrate comprises a second plurality of control vias electrically connecting the second electronic component to the second matrix of light sources, the second electronic component being arranged to electrically power and selectively control each of the light sources of the second matrix through said second plurality of control vias. In this example, it is planned to be possible to produce a screen with several matrices of light sources mounted on the same substrate, each matrix being controlled and powered independently by an electronic component buried in this substrate.

[0025] According to another exemplary embodiment of the invention, the light module comprises a second matrix of selectively controllable light sources mounted on a second interconnection substrate, and at least one second electronic component for controlling and powering the second matrix of light sources, said second electronic component being buried in the second substrate at an internal layer of this second substrate, the first substrate being arranged adjacent to the second substrate. In this example, the screen is thus segmented into a plurality of juxtaposed sub-modules, each formed by a matrix of light sources mounted on a substrate in which the electronic component controlling and powering this matrix of light sources is buried. Preferably, the second substrate has characteristics that are substantially identical to the first substrate.This type of architecture makes it possible to increase the manufacturing yield of the screen, to be able to standardize the sub-modules while offering great freedom in terms of the shape and dimensions of the screen, and to facilitate its repairability.

[0026] In particular, it may be possible to envisage that the light module comprises more than two sub-modules and in particular at least 10 sub-modules juxtaposed with each other to form a screen.

[0027] Advantageously, an edge of the first substrate adjoins, in a jointed or non-jointed manner, an edge of the second substrate, so that the first matrix of light sources abuts the second matrix of light sources. Preferably, the distance separating a first light source from the first matrix located at said edge of the first substrate and a second light source from the second matrix located at said edge of the second substrate and closest to the first light source is substantially less than or equal to the distance between two light sources of the first and / or second matrix. It is thus possible to mask the spaces between the sub-modules of the screen.

[0028] Advantageously, the first, respectively the second, matrix of light sources is mounted on a first face of the first, respectively the second, interconnection substrate and the first and second interconnection substrates are mounted on the same support, in particular the same printed circuit board, via a second face opposite their first face. This support can thus serve on the one hand as a support for a control unit and / or for controlling the power supply of the different sub-modules and on the other hand as a mechanical fixing member for the screen formed by the sub-modules to the signaling device.

[0029] Advantageously, said second face of each of the substrates supports an electrical connector mechanically coupled to said support and capable of transmitting an instruction of control and / or a power supply to the electronic component buried in said substrate. In other words, each substrate is mechanically supported by said electrical connector. For example, the electrical connector supported by each substrate may be connected, by a via, to the distribution layer connected to the electronic component buried in said substrate.

[0030] According to an exemplary embodiment, the module may comprise a control unit capable of generating a control instruction for each electronic component for the selective control of each of the light sources of each matrix and / or a power supply control unit capable of generating an electrical supply for each electronic component for the power supply of the light sources of each matrix, the control unit and / or the power supply control unit being mounted on the support. Where appropriate, the light module may comprise an inlet connector for a display instruction and / or an external electrical supply, said inlet connector being mounted on the support.

[0031] For example, the control instruction generated by the control unit from the display instruction and / or the power supply converted from the external power supply may pass through the support, in particular via electrical tracks formed on this support, to the sub-modules, to which they are distributed for example via the connectors.

[0032] According to another example, the electronic component of each substrate is connected to at least one electronic component of another substrate so that all of the electronic components form a network, the electronic component of at least one substrate, in particular of each substrate, being capable of transmitting a control instruction to an electronic component of another substrate of said network to which this electronic component is connected. For example, it may be provided that this control instruction is dedicated to this other electronic component and contains an address associated with this other electronic component, or alternatively that this control instruction is contained in a global instruction by being associated with an address of this other electronic component.The electronic components may be interconnected to form a network using a linear topology, also known as a daisy chain, or a network using a mesh topology, or any other topology. In this example, it is possible, for example, to transmit power to each sub-module via the medium while the control instructions are distributed by another means, for example by wires, cables or connection harnesses interconnecting the sub-modules or by wireless communication.

[0033] Advantageously, each substrate comprises a wireless data receiver. Where appropriate, said receiver may be buried in an inner layer of said substrate or alternatively be mounted on the first face of said substrate. Where appropriate, said con- control may comprise a wireless data transmitter capable of transmitting said control instructions of the electronic components to the receivers of the substrates in which these components are buried, the receiver of each substrate being connected, for example via the distribution layer, to the electronic component buried in this substrate to transmit said control instruction received from the transmitter of the control unit to said electronic component.

[0034] In an exemplary embodiment of the invention, each substrate, and in particular the first face of each substrate, has a square or rectangular shape. Where appropriate, each matrix of light sources may comprise 64, 144, 256, 576 or 1024 light sources, arranged in 8 rows by 8 columns, or in 12 rows by 12 columns, or in 16 rows by 16 columns, or in 24 rows by 24 columns, or in 32 rows by 32 columns. The distance between two light sources may be identical for all the matrices of light sources, or in a distinct variant from one matrix of light sources to another.

[0035] According to another exemplary embodiment of the invention, each substrate, and in particular the first face of each substrate, has a triangular or hexagonal shape. Alternatively, the shape of each substrate may be a diamond. More generally, it may be provided that each substrate may have a shape without a right angle. This type of configuration makes it possible to increase the density of light sources on the first face of the substrate, and therefore to reduce the distance between the light sources, compared to a square or rectangular configuration.

[0036] If necessary, each matrix of light sources may be organized in rows and columns in a checkerboard pattern or, alternatively, in rows and columns in a staggered pattern. Preferably, the rows and columns may be arranged parallel to the edges of the substrate. This characteristic makes it possible in particular to avoid aliasing effects at the edges of the substrate which would make the abutment of the sub-modules of the screen visible. Alternatively, it may be provided that the light sources of each matrix are organized according to a mesh with a square pattern or a triangular pattern.

[0037] It will be possible to combine the different embodiments cited above without departing from the scope of the present invention, in particular by providing a plurality of sub-modules each equipped with several matrices of light sources each controlled by an electronic component buried in the substrate of the sub-module.

[0038] The invention also relates to a signaling device for a motor vehicle, characterized in that it comprises a light module according to the invention, said light module forming a screen of the device.

[0039] The present invention is now described using examples which are purely illustrative and in no way limitative of the scope of the invention, and from the appended drawings, drawings in which the various figures represent:

[0040] [Fig. 1] represents, schematically and partially, a sectional view of a light module according to an exemplary embodiment of the invention;

[0041] [Fig. 2] represents, schematically and partially, a side view of a light module according to another exemplary embodiment of the invention; and

[0042] [Fig. 3] represents, schematically and partially, a front view of the module of [Fig. 2],

[0043] In the following description, elements which are identical, by structure or by function, appearing in different figures retain, unless otherwise specified, the same references.

[0044] [Fig. 1] describes a sectional view of a light module 1 according to one embodiment of the invention. In the example described, this light module 1 is intended to be integrated into a rear light of a motor vehicle, the light module 1 forming a screen. It may be provided to integrate the light module 1 into another element of the motor vehicle, such as a headlight or a front light or a shield or an element of the front facade of the vehicle, without departing from the scope of the present invention.

[0045] The light module 1 comprises a matrix of light sources 2 mounted on a substrate 3.

[0046] In the example described, each of the light sources 2 comprises at least one light-emitting semiconductor chip, called a microLED, whose dimensions are between 5 pm and 150 pm. The light module 1 comprises 64 light sources 2, arranged in a matrix manner, on 8 columns and 8 rows, the light sources 2 being distant from each other by a distance less than or equal to 300 pm. It should be noted that other dimensions of the light sources, other distances between the light sources, other numbers of light sources or even other distributions of the light sources could be envisaged, without departing from the scope of the present invention.

[0047] The substrate 3 is a printed circuit board, or PCB, having a first face 31 and a second face 32 opposite the first face. The light sources 2 are mounted on the first face 31 of the substrate, which faces the outside of the signaling device in which the light module 1 is integrated.

[0048] It should be noted that, in the example described, the substrate 3 is a so-called multilayer PCB, comprising a stack of insulating layers 33 alternating with conductive layers 34, between the first and second faces 31 and 32.

[0049] Each conductive layer 34 is interconnected with another conductive layer 34 by means of at least one via 35 passing through an insulating layer 33. Each conductive layer 34 is etched and drilled to define interconnection tracks connected to interconnection tracks of another conductive layer 34 by means of the vias 35. It will be noted that the first face 31 and the second face 32 are formed by faces of insulating layers 33 oriented towards the outside of the substrate 3 and perforated to be able to access the first, respectively the last conductive layer 34 and thus be able to mount electronic components on the surface of the substrate 3.

[0050] The light sources 2 are thus mounted on the surface of the substrate 3, at the level of the holes, or openings, provided in the first face 32, and electrically connected, by welding or by bridging (also called in English “wire bonding”), to the first conductive layer 34 in order to be interconnected to the substrate 3.

[0051] The light module 1 comprises an electronic component 4 for controlling and supplying the matrix of light sources 2. This electronic component 4 is buried in the substrate 3 at the level of an internal insulating layer 33 of this substrate 3.

[0052] More precisely, a cavity 33a was reserved in the internal insulating layer 33 during the manufacture of this layer 33 and the electronic component 4 was placed in this cavity, then electrically connected to the conductive layer 34 immediately below this insulating layer, in order to continue the manufacture of the substrate 3. It may be provided that the electronic component 4 is electrically connected to the conductive layer 34 immediately above, without departing from the scope of the present invention.

[0053] The electronic component 4 comprises an integrated circuit associated with passive components. It should be noted that the integrated circuit may be bare, as opposed to an integrated circuit encapsulated in a housing, or “packaged”. It may be provided that the integrated circuit is encapsulated in a housing without departing from the scope of the present invention.

[0054] A plurality of control vias 35a electrically connects the electronic component 4 to the matrix of light sources 2. The matrix of light sources 2 forms a passive matrix where each row and each column of light sources 2 can be controlled by the electronic component 4 by means of a control via addressing this row or this column, in particular to control the electrical power supplied to the light sources of this row or this column. The electronic component 4 can thus electrically power and selectively control each of the light sources 2 through said plurality of control vias 35a, for example by successively scanning the rows then the columns of the matrix to control the electrical power supplied to each of the light sources 2.

[0055] The light module 1 comprises a connector (not shown) for receiving a display instruction from said plurality of light sources 2. This may be an instruction issued by a computer of the motor vehicle or the signaling device for the display of a logo, a message, a pattern or a pictogram. For example, this may be an instruction to display a pictogram intended to inform an outside observer of the opening of a door of the motor vehicle, a pictogram intended to inform a motorist following the motor vehicle of the presence of black ice on the road or information relating to motor traffic or a pictogram intended to inform a pedestrian of the possibility or not of crossing the road. Said display instruction may include a representation of said pictogram.

[0056] The light module 1 also includes a connector (not shown) for receiving an external power supply, for example from an electric battery of the vehicle. automobile.

[0057] The light module 1 comprises a power supply control and piloting unit 5 connected to the connectors to receive the display instruction and the external power supply. The unit 5 is supported by a printed circuit board mounted on the second face 32 of the substrate 1 in line with a day, or opening, made in the second face 32, in which is arranged a connector 51 connected to the unit 5 and electrically connected to the last conductive layer 34 in order to interconnect the unit 5 to the substrate 3.

[0058] The unit 5 is capable of generating, on the one hand, a control instruction for the electronic component 4, from the display instruction that it receives, for the selective control of each of the light sources 2 so that the matrix displays the pictogram of the display instruction. On the other hand, the unit 5 is capable of converting the external power supply into a power supply suitable for powering the matrix of light sources 2 and the electronic component 4. The control instruction and the converted power supply are thus distributed to the electronic component 4, via the connector 51 then vias 35 and conductive layers 34, called distribution layers.

[0059] The controller 4 is thus arranged to control each of the sources 2 of the passive matrix according to the control instruction received from the unit 5 and to power these sources 2 using the electrical power supply converted by the unit 5.

[0060] Furthermore, the light module 1 comprises a heat sink 6 mounted on the second face 32 of the substrate 3. In the example described, this sink 6 is a part made of thermally conductive material, in particular aluminum, and provided with dissipation fins. The face 32 may be partially covered with a layer of gold or nickel, so that the sink 6 can be soldered to the substrate 3.

[0061] It will thus be noted that the second face 32 of the substrate 3 thus offers a space allowing the unit 5 and the heat sink 6 to be arranged there, so as to improve the thermal performance of the light module 1, to avoid the use of connection harnesses to a control or power supply unit remote from the substrate 3 and to reduce the distance between the unit 5, the electronic component 4 and the matrix of light sources 2. It will be noted that the second face 32 of the substrate also offers solutions for the arrangement of members for fixing the light module 1 to the rear light, or any other element, in which it must be integrated. In addition, the fact that the electronic component 4 is buried makes it possible to simplify the design of the light module 1 and to take advantage of the conductive layers 34 to provide shielding for the electronic component 4.

[0062] [Fig. 2] shows a sectional view of a light module 10 according to another embodiment of the invention.

[0063] In this example, the light module 10 comprises a plurality of sub-modules 11 each comprising a matrix of light sources 2 which can be selectively controlled and mounted on an interconnection substrate 3, an electronic control and power supply component 4 mentation of the matrix of light sources 2 being buried in the substrate 3. The structure of each substrate 3 is similar to that of the module 1 shown in [Fig. 1] and will therefore not be developed again.

[0064] The sub-modules 11 are arranged adjacent to each other to together form a screen for a rear light, or other element, of a motor vehicle. Although only three sub-modules 11 have been shown in [Fig. 2], a substantially greater number of sub-modules may be provided without departing from the scope of the present invention.

[0065] In the example described, the substrates 3 of the sub-modules 11 are mounted on a common support 7, in this case the same printed circuit board. More precisely, the second face 32 of each of the substrates 3 supports an electrical connector 8 mechanically coupled to the board 7.

[0066] The card 8 also supports a power supply control and piloting unit 5, similar to that of the module 1 of [Fig. 1], with the difference that this unit is capable of issuing control instructions and distributing an electrical supply to the various sub-modules 11, via the electrical connectors 8 which transmit the control instructions and the converted electrical supply which they receive to the electronic components 4 buried in the substrates 3 of these sub-modules 11.

[0067] For example, it could be envisaged that the control unit subdivides the pictogram of the display instruction into sub-images, each intended to be displayed by the matrix of light sources 2 of one of the sub-modules 11 so that the display of all the sub-images forms this pictogram, then generates, for each of the sub-modules 11, an instruction to control the electronic component 4 of this sub-module 11 for the display of this sub-image.

[0068] In examples not shown, it could be envisaged that only the electrical power supply converted by the unit 5 passes through the card 7 to the connectors 8, the control instructions generated by the unit 5 being distributed to the sub-modules 11 by another means of connection, such as a wired connection connecting the unit 5 to each of the sub-modules 11 to form a star network or by a wired connection connecting the unit 5 to a sub-module 11, each sub-module 11 then being connected to another sub-module 11 to form a linear network, or by a wireless connection according to which the unit 5 and submodules 11 comprise wireless data transmitters and receivers.

[0069] [Fig. 3] shows a front view of an example arrangement of the sub-modules 11.

[0070] Each substrate 3 has a triangular shape. Other shapes, in particular diamond or hexagonal, may be provided without departing from the scope of the present invention.

[0071] It can be seen that the matrices of light sources 2 are organized, for each sub-module 11, in rows and columns arranged parallel to the edges of the substrate 3. The distances between the light sources 2 of the same sub-module 11 are identical from one sub-module to another.

[0072] An edge 3a of the substrate 3 of each sub-module 11 adjoins, without being joined, an edge 3a of a substrate 3 of an adjacent sub-module 11. It can thus be seen that the matrices of light sources 2 of two adjacent sub-modules 11 are substantially abutting, the distance separating the light sources 2 of these neighboring sub-modules 11 and located at the edges 3a being substantially less than or equal to the distance between two light sources 2 of the same sub-module 11.

[0073] Each sub-module 11 thus forms a standard sub-module, the sub-modules being able to be organized to form a free-form screen, due to the triangular shape, the resolution of which is satisfactory, with regard to the distribution and density of the light sources 2 on the triangular substrates and the abutment of the matrices, and which is easily repairable, taking into account the segmentation of the screen into sub-modules 11.

[0074] The preceding description clearly explains how the invention makes it possible to achieve the objectives it has set for itself, by proposing to bury the controller of the light sources of a screen of a luminous device of a motor vehicle in the substrate supporting these light sources, so as to free the rear face of this substrate.

[0075] In any event, the invention cannot be limited to the embodiments specifically described in this document, and extends in particular to any equivalent means and to any technically effective combination of these means. In particular, it will be possible to provide a substrate with another organization of the internal layers and / or the vias, which is rigid or flexible, straight or curved. It will also be possible to provide other types of light sources than that described, and in particular light sources of larger dimensions, for example between 150pm and 400pm, such as microLEDs. It will be possible to envisage other types of electronic components than that described. It will also be possible to envisage other types of heat dissipation members than that described, and in particular a dissipation member integrating a ventilation member.

Claims

Demands

1. A light module (1, 10) of a signaling device for a motor vehicle, comprising a first array of selectively controllable light sources (2) mounted on a first interconnect substrate (3) comprising a stack of insulating layers (33) alternating with conductive layers (34), each conductive layer being interconnected with another conductive layer by means of at least one via (35) passing through an insulating layer, characterized in that it comprises at least one first electronic component (4) for controlling and powering the first array of light sources, said first electronic component being embedded in the first substrate at the level of an internal layer of this first substrate, and in that the first substrate comprises a first plurality of control vias (35a) electrically connecting the first electronic component to the first array of light sources,the first electronic component being arranged to electrically power and selectively control each of the light sources of the first matrix through said first plurality of control vias.

2. Light module (1, 10) according to any one of the preceding claims, characterized in that the first matrix of light sources (2) is mounted on a first face (31) of the first interconnect substrate (3), in that it comprises a control unit (5) capable of generating a control instruction of the first electronic component (4) for the selective control of each of the light sources of the first matrix and / or a power control unit (5) capable of generating a power supply of the first electronic component for the power supply of the light sources of the first matrix, said control unit and / or said power control unit being mounted on a second face (32) of the first interconnect substrate opposite to the first face.

3. Light module (1, 10) according to the preceding claim, wherein the first matrix of light sources (2) forms a passive matrix and wherein the first electronic component (4) is arranged to control said passive matrix through said first plurality of control vias (35a) according to the control instruction received from the control unit (5).

4. Light module (1, 10) according to any one of the preceding claims, characterized in that the first matrix of light sources (2) is mounted on a first face (31) of the first interconnecting substrate (3), in that it comprises a heat sink (6) of the light module, said heat sink being mounted on a second face (32) of the first interconnecting substrate opposite the first face.

5. A light module (1, 10) according to any one of the preceding claims, characterized in that it comprises a second matrix of selectively controllable light sources (2) mounted on the first interconnecting substrate (3), in that it comprises at least a second electronic component (4) for controlling and powering the second matrix of light sources, said second electronic component being buried in the first substrate at an internal layer (33) of that first substrate, and in that the first substrate comprises a second plurality of control vias (35a) electrically connecting the second electronic component to the second matrix of light sources, the second electronic component being arranged to electrically power and selectively control each of the light sources of the second matrix through said second plurality of control vias.

6. A light module (1, 10) according to any one of claims 1 to 4, characterized in that it comprises a second matrix of selectively controllable light sources (2) mounted on a second interconnect substrate (3), characterized in that it comprises at least one second electronic component (4) control and power supply of the second matrix of light sources, said second electronic component being buried in the second substrate at the level of an internal layer (33) of this second substrate, and in that the first substrate is arranged adjacent to the second substrate.

7. Light module (1, 10) according to the preceding claim, characterized in that the first, respectively the second, matrix of light sources (2) is mounted on a first face (31) of the first, respectively the second, interconnecting substrate (3) and in that the first and second interconnecting substrates are mounted on the same support (7), via a second face (32) opposite their first face.

8. Light module (1, 10) according to the preceding claim, characterized in that said second face (32) of each of the substrates (3) supports an electrical connector (8) mechanically coupled to said support (7) and capable of transmitting a control instruction and / or an electrical supply to the electronic component (4) buried in said substrate.

9. Light module (1, 10) according to any one of claims 6 to 8, characterized in that the electronic component (4) of each substrate (3) is connected to at least one electronic component of another substrate so that the set of electronic components forms a network, the electronic component of each substrate being able to transmit a control instruction to an electronic component of another substrate of said network to which this electronic component is connected.

10. Light module (1, 10) according to any one of claims 6 to 9, characterized in that each substrate (3) comprises a wireless data receiver.

11. Light module (1, 10) according to any one of claims 6 to 10, wherein each substrate (3) has a triangular or hexagonal shape.

12. Signaling device for a motor vehicle, characterized in that it comprises a light module (1, 10) according to one of the preceding claims, said light module forming a screen of the device.

Images