Layered electronic device and method for making such a device

Abstract

A layered electronic device comprising: a first layer (2) made from a first thermoplastic polymer material, the first layer (2) comprising a through-cavity (8); an electronic module (7) at least partially inserted into the through-cavity (8) of the first layer (2); and an adhesive second layer (3) made from a second material having adhesion superior to that of the first material, the adhesive second layer (3) being at least partially in contact with the first layer (2) and with the electronic module (7); the first layer (2) being at least partially in contact with the electronic module (7).

Description

[0001] Laminated electronic device and method of manufacturing such a device

[0002] TECHNICAL FIELD

[0003] The present invention relates to laminated electronic devices, in particular to laminated electronic devices obtained using pressing.

[0004] STATE OF THE ART

[0005] Currently, identification cards, such as credit cards, identity cards, driving licenses, cards for advertising purposes, ski passes, or loyalty cards for discounts, etc., are produced using a laminated electronic device. Such a device comprises an electronic module integrated within a stack of layers of materials. The materials used are generally thermoplastic polymers that deform, or are also said to flow, under the action of pressing, and more particularly hot pressing, called lamination.

[0006] Typically, the electronic module is assembled with the material layers, some of which may contain information to be protected, such as identity information, to obtain a laminated electronic device. The laminated electronic device is then heat-pressed to fuse the material layers together to obtain a single-piece card body incorporating an electronic module and information to be protected, called the final product or functional laminate. The final product preserves the integrity of the electronic module and the various information written on the material layers, preventing its disassembly and making it highly resistant to fraud. However, integrating an electronic module within a stack of material layers causes stresses between the module and the material layers and creates weak areas in the materials, which are often the starting points for material failure.These stresses can have a destructive impact on the cards. When the cards are subjected to mechanical stresses such as daily wear and tear, the tension is released in the form of cracks, particularly microcracks, in the material layers surrounding the module. Such microcracks contribute to premature aging of the cards. Cracking can also be accelerated by mechanical stresses such as bending and twisting that occur naturally during the life of the card.

[0007] For example, US patent application US2015 / 0298389 A1 discloses a method for protecting an electrical component in a support layer of a functional laminate comprising the steps of providing the support layer with a first hole, a second hole, and an opening connecting the first and second holes together, positioning an electrical component inside the first hole, placing a plastic pellet in the second hole, and causing the pellet material to flow through the opening of the second hole toward the first hole, bypassing the electrical component to surround it. However, such a method is complex and requires an operation of filling the first hole to obtain a functional laminate having a smooth appearance to be consistent with other boards.

[0008] We can cite the European patent application EP3005244 A1, which discloses an intermediate electronic device comprising a support body provided with a cavity, an electronic module, a space existing at the interface between the module and the support body, and a flexible or elastic material arranged in the device so as to fill or cover at least partially the space between the module and the support body. But a gap may remain all around the electronic module, between the module and the support, and the electronic module is less well maintained within the device.

[0009] Also citeable is US patent application US2012 / 0201994 A1, which discloses a laminated device comprising a thermoplastic film as a substrate layer; an opening in the substrate layer; a functional component disposed in the opening; an additional film on the substrate layer; and a flexible, elastic, temperature-resistant encapsulating material having a coefficient of thermal expansion greater than or equal to that of the substrate layer, surrounding the functional component. But a large amount of encapsulating material having a specific coefficient of thermal expansion must be used, which makes the manufacturing process very expensive.

[0010] One objective is therefore to provide means to limit the creation of cracks within a laminated electronic device, in particular at the level of electronic modules integrated within such devices. Another objective is to provide means to keep the electronic module sufficiently immobile within the device while limiting the occurrence of microcracks within the device. Another objective is to provide a laminated electronic device that is simple to manufacture while allowing manufacturing costs to be reduced.

[0011] SUMMARY

[0012] According to one aspect, there is provided a laminated electronic device, comprising:

[0013] - a first layer of a first thermoplastic polymer material, the first layer comprising a through cavity;

[0014] - an electronic module inserted at least partially within the through cavity of the first layer; and

[0015] - a second adhesive layer of a second material having an adhesion greater than that of the first material, the second adhesive layer being at least partially in contact with the first layer and with the electronic module.

[0016] The first layer is at least partially in contact with the electronic module.

[0017] Thus, by providing a device where the first layer is at least partially in contact with the electronic module, good mechanical strength of the module is promoted. The second adhesive layer makes it possible to limit movement of the electronic module towards the first layer during a pressing step at a temperature allowing the first material to flow, called the lamination step. This limits the generation of stresses exerted by the electronic module on the first layer in the direction of movement of the electronic module. This avoids creating stresses in a particular direction which could promote the creation of cracks within the first layer.Furthermore, during pressing, the first layer flows towards the electronic module, held in position by the second adhesive layer, and when the first layer comes at least partially into contact with the electronic module, the stresses exerted by the first layer on the electronic module are distributed homogeneously around the electronic module.

[0018] According to another aspect, there is provided a method of manufacturing a laminated electronic device, comprising an assembly for obtaining a laminated electronic device, the assembly comprising:

[0019] - a provision of a first layer of a first thermoplastic polymer material, the first layer comprising a through cavity;

[0020] - an insertion of an electronic module at least partially within the through cavity of the first layer so that the electronic module is located at a distance from the first layer;

[0021] - a provision of a second adhesive layer of a second material having greater adhesion than the first material; and

[0022] - bringing the second adhesive layer into contact at least partially with the first layer and with the electronic module.

[0023] The method comprises, after assembly, pressing the laminated electronic device at a temperature allowing flow of at least the first material so that the first layer flows towards the electronic module in order to be at least partially brought into contact with the electronic module.

[0024] BRIEF DESCRIPTION OF THE FIGURES

[0025] The aims, objects, as well as the characteristics and advantages of the invention will become more apparent from the detailed description of embodiments and implementations thereof, illustrated by the following accompanying drawings in which: Figure 1 schematically illustrates a sectional view of one embodiment of a laminated electronic device; Figures 2 to 7 schematically illustrate sectional views of the main steps of a method of manufacturing a laminated electronic device; Figure 8 schematically illustrates a top view of the method step illustrated in Figure 4; Figures 9 to 11 schematically illustrate sectional views of other embodiments of a laminated electronic device; Figures 12 and 13 schematically illustrate sectional views of other embodiments of a laminated electronic device;and Figure 14 schematically illustrates a top view of another embodiment of a laminated electronic device.;

[0026] The drawings are given by way of example and are not limiting of the invention. They constitute schematic representations of principle intended to facilitate the understanding of the invention and are not necessarily to the scale of practical applications.

[0027] DETAILED DESCRIPTION

[0028] Before commencing a detailed review of embodiments and implementations of the invention, optional features which may possibly be used in combination or alternatively are set out below.

[0029] - The electronic module has a front face and a back face, the first layer has a front face and a back face, and the second adhesive layer has a front face at least partially in contact with the back face of the electronic module and with the back face of the first layer. By placing an adhesive layer at least partially in contact with the back face of the electronic module, the amount of adhesive layer material to be used is limited.

[0030] - The second material has a hardness strictly greater than that of the first material. The hardness makes it possible to limit the deformation (or creep) of the second adhesive layer during pressing, in order to prevent the second adhesive layer from moving the electronic module towards the first layer in a direction of movement.

[0031] - The electronic module comprises a connection area and a logic circuit electrically coupled to the connection area, the device comprising an electrical circuit comprising an electrical wire having a first portion electrically coupled to the connection area and a second portion at least partially in contact with the first layer, the device comprising a third layer of a third thermoplastic polymer material, the third layer comprising a through cavity such that the electronic module is inserted at least partially within the through cavity of the third layer, the third layer being at least partially in contact with the first layer and with the first and second portions of the electrical wire. Thus, it is possible to provide a communicating electronic module, for example an RFID (or radio frequency identification) tag.

[0032] - The device comprises a fourth layer of a fourth thermoplastic polymer material, the fourth layer comprising a cavity such that the electronic module is inserted at least partially within the cavity of the fourth layer, the fourth layer being at least partially in contact with the third layer and with the electronic module, and wherein the third layer has a thickness greater than or equal to the sum of the thicknesses of the connection zone and the first portion, the thicknesses being measured along an axis passing through the first, second and third layers. Thus, the stresses exerted on the first portion of the electric wire by the fourth layer during pressing are limited.

[0033] - The electronic module comprises a base having a first face forming the rear face of the electronic module and a second face opposite the first face, the connection zone being in contact with the second face, a thickness of the first layer being greater than or equal to a thickness of the base, the thicknesses being measured along an axis passing through the first, second and third layers.

[0034] - The fourth layer has a thickness greater than or equal to a difference between a thickness of the electronic module and the sum of the thicknesses of the first layer and the third layer, the thicknesses being measured along an axis passing through the first, second, third and fourth layers. This ensures that the fourth layer is flush with or covers the front face of the electronic module.

[0035] - The first, third and fourth materials are based on the same thermoplastic polymer.

[0036] - The device comprises a support layer of a fifth thermoplastic polymer material, the support layer comprising an additional cavity, the second adhesive layer being inserted at least partially within the additional cavity and the support layer being at least partially in contact with the first layer.

[0037] - The second layer has a thickness less than or equal to that of the support layer, the thickness of the second layer being measured along an axis passing through the first, second and third layers.

[0038] - The electronic module has a front face and a rear face, the first layer has a front face and a rear face, and the second adhesive layer has a rear face at least partially in contact with the front face of the electronic module and with the front face of the first layer.

[0039] - The electronic module comprises a connection area and a logic circuit electrically coupled to the connection area, the device comprising a first antenna electrically coupled to the connection area and a second antenna at least partially in contact with the first layer and inductively coupled with at least the first antenna.

[0040] - The second antenna comprises a first portion arranged in a spiral around the first antenna so as to be inductively coupled to the first antenna, and a second portion arranged in a spiral around the first portion so as to be inductively coupled to an electronic device located remotely from the device.

[0041] - The device comprises a third layer of a third thermoplastic polymer material, the third layer being at least partially in contact with the first layer, with the second layer and with the second antenna.

[0042] - The device comprises an additional layer of an additional thermoplastic polymer material, the additional layer being at least partially in contact with the first layer and with the electronic module.

[0043] - The additional material has a hardness strictly greater than that of the first material.

[0044] - The device comprises a covering layer of a thermoplastic polymer covering material, the covering layer being at least partially in contact with the first layer and the additional layer.

[0045] - The device comprises an additional cover layer of an additional thermoplastic polymer material, the additional cover layer covering the third layer.

[0046] - The electronic module has a front face and a rear face, the first layer has a front face and a rear face, and the second adhesive layer has a front face, the assembly comprising bringing the second adhesive layer into contact at least partially with the rear face of the electronic module and with the rear face of the first layer.

[0047] - The electronic module comprises a connection area and a logic circuit electrically coupled to the connection area, the assembly comprising a provision of an electrical circuit comprising an electrical wire having a first portion electrically coupled to the connection area and a second portion at least partially contacted with the first layer, a provision of a third layer of a third thermoplastic polymer material, the third layer comprising a through cavity for inserting the electronic module at least partially within the through cavity of the third layer, and contacting the third layer at least partially with the first layer and with the second portion such that the first portion is located at a distance from the third layer, and the pressing comprises a creeping of the third layer towards the first portion in order to be at least partially contacted with the first portion.

[0048] - The assembly comprises providing a fourth layer of a fourth thermoplastic polymer material, the fourth layer comprising a cavity for inserting the electronic module at least partially within the cavity of the fourth layer, and bringing the fourth layer into contact at least partially with the third layer, the third layer having a thickness greater than or equal to the sum of the thicknesses of the connection zone and the first portion, the thicknesses being measured along an axis passing through the first, second and third layers, the fourth layer being shaped to cover the first portion of the electric wire, and the pressing comprises flowing the fourth layer towards the electronic module in order to be brought into contact at least partially with the electronic module.

[0049] - The assembly comprises providing a backing layer of a fifth thermoplastic polymer material, and the backing layer covers a backside of the second adhesive layer and at least partially the backside of the first layer.

[0050] - The second adhesive layer has a rear face, and the assembly comprises bringing the second adhesive layer into contact at least partially with the front face of the electronic module and with the front face of the first layer.

[0051] - The assembly comprises a provision of a first antenna electrically coupled to the connection area and a second antenna brought into contact at least partially with the first layer such that the second antenna is inductively coupled with at least the first antenna.

[0052] A material, film or layer “based on” a material A means a material, film or layer comprising this material A only or this material A and possibly other materials.

[0053] In Figures 1 and 13, a laminated electronic device 1 is shown, in particular a functional device after having carried out a pressing step. A functional device is understood to mean a device 1 ready to be used, the device 1 preferably being an identification card, such as a credit card, identity card, driving license, a card for advertising purposes, a ski pass, or a loyalty card to benefit from reductions, etc. The device 1 is said to be laminated because it comprises a stack of several layers 2 to 6; and 203 to 205. The device 1 comprises at least one electronic module 7 inserted within the layers 2 to 6; and 203 to 205.

[0054] Generally, the device 1 comprises at least a first layer 2 of a first thermoplastic polymer material, the first layer 2 comprising a through cavity 8. The first layer 2 is intended to form a support for the electronic module 7. The thermoplastic polymer material is a material capable of flowing under the effect of pressing, in particular pressing at a specific temperature. For example, the thermoplastic polymer material may be based on polycarbonate. In this case, the specific temperature used during pressing may be between 165°C and 190°C. Furthermore, the electronic module 7 is inserted at least partially within the through cavity 8 of the first layer 2. The flowing of the layers 2, 4 to 6; and 203 to 205 makes it possible, in particular, to fill the interstices between the electronic module 7 and the different layers 2, 4 to 6; and 203 to 205, called support layers, during the manufacture of the device 1.

[0055] More particularly, the device 1 comprises a second adhesive layer 3 of a second material having an adhesion greater than that of the first material, preferably strictly greater than that of the first material. The second adhesive layer 3 is at least partially in contact with the first layer 2 and with the electronic module 7. The second adhesive layer 3 is configured to keep the electronic module 7 immobile during the pressing step. Indeed, the pressing causes creep of the layers 2, 4 to 6; and 203 to 205 which could move the module 7 and lead to the creation of weak zones. The second layer 3 may possibly creep slightly during the pressing step, but the material of the second layer 3 is chosen so that the second layer 3 creeps less than the other layers 2, 4 to 6; and 203 to 205 of the device 1.The positioning of the second adhesive layer 3 in contact with both the module 7 and the first layer 2 makes it possible to keep the electronic module 7 stationary while allowing the first layer 2 to flow towards the electronic module 7 during pressing. Thus, a device 1 is obtained in which the first layer 2 is at least partially in contact with the electronic module 7. This makes it possible to promote the maintenance of the electronic module 7 in position within the device 1.

[0056] For example, the second material is based on polyamide. In addition, the second material may have a bonding strength greater than or equal to 14 N / mm 2 . Bonding force is the force required to separate the second material from the substrate to which it is bonded. In other words, the force required is a shear force.

[0057] Generally, the device 1 comprises several layers 2 to 6; and 203 to 205, arranged one on top of the other, along a main axis X. Furthermore, the electronic module 7 has a front face 10 and a rear face 11, the first layer 2 has a front face 12 and a rear face 13, and the second adhesive layer 3 has a front face 14 and a rear face 15. More particularly, the front face 14 of the second adhesive layer 3 is at least partially in contact with the rear face 11 of the electronic module 7 and with the rear face 13 of the first layer 2. Preferably, the surface area of ​​the front face 14 of the second adhesive layer 3 is strictly greater than the surface area of ​​the rear face 11 of the electronic module 7. In other words, the second adhesive layer 3 covers the rear face 11 of the electronic module 7.When the device 1 comprises the first two layers 2, 3, the main axis X passes, successively, through the second layer 3 and the first layer 2. When the device 1 comprises several layers 2 to 6, the main axis X passes, successively, through the second layer 3 and the first layer 2, the third layer 4 and the fourth layer 5. In other words, the main axis X is perpendicular to the planes in which the faces 12, to 15 of the first and second layers 2, 3 mainly extend. More particularly, the main axis X is perpendicular to the planes in which the faces of the layers 2 to 6 of the device 1 mainly extend.

[0058] Advantageously, the second material of the second adhesive layer 3 has a hardness strictly greater than that of the first material of the first layer 2, in order, in particular, to keep the electronic module 7 immobile during the pressing of the device 1. In addition, the hardness of the material of the second layer 3 makes it possible to limit its creep, during pressing, and thus to improve the holding of the electronic module 7 in position. For example, the second layer can be made of polyamide having a hardness of between 80 and 100 Shore D. The Shore D unit is a scale for measuring the hardness of materials, that is to say the measurement of the resistance of a material to penetration. The Shore D scale is produced from an instrument which makes it possible to measure the depth of penetration of a penetrator by application to the material. Furthermore, the first layer 2 can be made of polycarbonate having a hardness of between 60 and 78 Shore D.

[0059] According to another advantage, the electronic module 7 comprises a connection area 20 and a logic circuit 21 electrically coupled, by a conductive connection 22 to the connection area 20. Furthermore, the device 1 comprises an electrical circuit 23 comprising an electrical wire 24 having a first portion 25 electrically coupled to the connection area 20 and a second portion 26 at least partially in contact with the first layer 2. In particular, the first portion 25 is connected directly to the connection area 20. The second portion 26 is placed in contact with the first layer 2, for example the second portion 26 partially penetrates into the first layer 2, as illustrated in FIGS. 1; 4 to 11. Furthermore, the device 1 comprises a third layer 4 of a third thermoplastic polymer material to integrate the electrical circuit 23. The third layer 4 comprises a front face 27 and a rear face 28.The third layer 4 further comprises a through cavity 9 so that the electronic module 7 is inserted at least partially within the through cavity 9 of the third layer 4. In other words, the through cavity 9 of the third layer 4 is placed opposite, or facing, the through cavity 8 of the first layer 2. The third layer 4 is at least partially in contact with the first layer 2 and with the first and second portions 25, 26 of the electric wire 24. The electric circuit 24 may be an antenna, and a device 1 is thus provided comprising a communicating electronic module 7, for example an RFID tag.

[0060] Furthermore, the second layer 3 may have a thickness E3 less than or equal to that E2 of the first layer 2. The thicknesses E2, E3 of the first and second layers 2, 3 being measured along an axis passing through the first, second and third layers 2 to 4, in particular along the main axis X. Preferably, the thickness E3 of the second layer 3 is strictly less than that of the first layer 2, thus the quantity of the second material to be used can be reduced, compared to that of the first material.

[0061] According to another advantage, the electronic module 7 comprises a base 30 having a first face forming the rear face 14 of the electronic module 7 and a second face 31 opposite the first face. The electronic module 7 may comprise a housing 39 within which the logic circuit 21 is integrated. The housing 39 projects from the second face 31 of the electronic module 7. The connection zone 20 is in contact with the second face 31. Preferably, the thickness E2 of the first layer 2 is greater than or equal to a thickness Ee of the base 30, the thicknesses E2, Ee being measured along an axis passing through the first, second and third layers 2 to 4, in particular along the main axis X, as illustrated in FIG. 2.

[0062] Furthermore, the device 1 may comprise a fourth layer 5 of a fourth thermoplastic polymer material, the fourth layer 5 comprising a front face 60 and a rear face 61. The fourth layer 5 has front and rear faces 60, 61 having non-continuous surfaces. In other words, the fourth layer 5 comprises a cavity 62 so that the electronic module 7 is inserted at least partially within the cavity 62 of the fourth layer 5. The cavity 62 of the fourth layer 5 may be through or blind. Furthermore, the fourth layer 5 is at least partially in contact with the third layer 4 and with the electronic module 7. The fourth layer 5 has a thickness E5 greater than or equal to a difference between a thickness of the electronic module 7 and the sum of the thicknesses of the first layer E2 and the third layer E4, the thicknesses being measured along the main axis X.That is to say that E5 = Em - (E2+E4), where Em corresponds to the thickness of the electronic module 7 measured along the main axis X. As illustrated in figures 1, 6, 7, and 9 to 11, the front face 60 of the fourth layer 5 is flush with the front face 10 of the electronic module 7. The thickness E5 of the fourth layer 5 is measured along an axis passing through the first, second, third and fourth layers 2 to 5, in particular along the main axis X.

[0063] Furthermore, the third layer 4 has a thickness E4 greater than or equal to the sum of the thicknesses of the connection zone 20 and of the first portion 25 of the electric wire 24, the thicknesses being measured along the main axis X. Thus, the stresses exerted by the fourth layer 5 on the first portion 25 during creep of the fourth layer 5 during pressing are limited.

[0064] In particular, the front face 27 of the third layer 4 is at least partially in contact with the rear face 61 of the fourth layer 5.

[0065] The first, third and fourth materials may be based on the same thermoplastic polymer, preferably polycarbonate, and more preferably polycarbonate having a hardness of between 75 and 85 Shore D, in order to simplify the manufacture of the device 1. Advantageously, the second material has a hardness strictly greater than that of the first, third and fourth materials.

[0066] Advantageously, the device 1 comprises a support layer 6 of a fifth thermoplastic polymer material. Preferably, the fifth material is based on the same material as that of the first, third and fourth layers 2, 4 and 5. The support layer 6 has front and rear faces which can be continuous so as to cover the rear face 15 of the second adhesive layer 3 and at least partially the rear face 13 of the first layer 2, as illustrated in FIG. 10. Alternatively, the support layer 6 may comprise an additional through or blind cavity 63, for at least partially inserting the second adhesive layer 3. The additional cavity 63 may be blind, as illustrated in FIGS. 1, 7 and 9, when the front face of the support layer 6, that is to say the face at least partially in contact with the rear face 13 of the first layer 2, is continuous.In this case, the support layer 6 is at least partially in contact with the first layer 2. Alternatively, as illustrated in FIG. 11, the additional cavity 63 is through and the second adhesive layer 3 is at least partially inserted into the additional cavity 63.

[0067] In Figures 2 to 7, the main steps of a method for manufacturing the laminated electronic device 1 as defined above are shown. Generally, the method comprises an assembly to obtain a laminated electronic device 1. The assembly comprises a provision of the first layer 2 of a first thermoplastic polymer material, the first layer 2 comprising a through cavity 8, a provision of the electronic module 7 and the provision of the second adhesive layer 3 of a second material having an adhesion greater than that of the first material, as illustrated in Figure 2. The assembly further comprises an insertion of the electronic module 7 at least partially within the through cavity 8 of the first layer 2 so that the electronic module 7 is located at a distance from the first layer 2. In other words, there is a space 65 between the module 7 and the first layer 2.Then, the assembly comprises bringing the second adhesive layer 3 into contact at least partially with the first layer 2 and with the electronic module 7. For example, the module 7 can be mounted on the front face 14 of the second layer 3, then the second layer 3 is brought into contact with the first layer 2. The assembly can then comprise placing the portions 25, 26 of the electric wire 24 on the first layer 2 and the connection zone 20, illustrated in FIGS. 4 and 8. For example, the first portion 25 can be soldered to the connection zone 20. It is then possible to place the third layer 4 at least partially in contact with the first layer 2. Preferably, the rear face of the third layer 4 is brought at least partially into contact with the front face of the first layer 2, as illustrated in FIG. 5. It is also possible to place the fourth layer 5 at least partially in contact with the third layer 4, as illustrated in FIG. 6.According to one embodiment, illustrated in Figure 6, the third layer 4 has a thickness E4 greater than or equal to the sum of the thicknesses of the connection zone 20 and the first portion 25 of the electric wire 24. Thus, the fourth layer 5 can be in contact with the first portion 25 of the electric wire 24, by being placed on the first portion 25. Preferably, the third layer 4 has a thickness E4 strictly greater than the sum of the thicknesses of the connection zone 20 and the first portion 25 of the electric wire 24. In this case, the first portion 25 is located at a distance from the rear face 61 of the fourth layer 5, that is to say that the fourth layer 5 is not in contact with the first portion 25. Thus, the stresses exerted on the first portion 25 by the fourth layer 5 during pressing are further limited.This allows better flow of the fourth layer 5 towards the electronic module 7 to more easily cover the first portion 25 of the electric wire 24. Advantageously, the assembly can comprise at least partial contact of the support layer 6 with the first layer 2, as illustrated in figure 7.

[0068] The method comprises, after assembly, pressing the laminated electronic device 7 at a temperature allowing creep of at least the first material so that the first layer 2 creeps towards the electronic module 7 in order to be at least partially brought into contact with the electronic module 7. Advantageously, the specific temperature further allows creep of the materials of the first, third, fourth and fifth layers 2, 3 to 5, as well as creep of the material of the support layer 6. In other words, the specific temperature is chosen so as to be at least greater than or equal to the maximum value of the creep temperatures of each of the first, third to fifth materials.

[0069] In Figure 9, a device 1 is shown before the pressing step, comprising an additional layer 70 of a material, preferably identical to that of the first layer 2, to cover the electronic module 7. The additional layer 70 has front and rear faces having continuous surfaces to cover the electronic module 7 and the front face 60 of the fourth layer 5. Furthermore, the third layer 4 is located at a distance from the first portion 25 of the wire 24. For example, the first layer 2 has an internal edge 80 forming the through cavity 8 of the first layer 2, the third layer 4 has an internal edge 81 forming the through cavity 9 of the third layer 4, the internal edges 80, 81 being able to be offset along the main axis X, as illustrated in Figures 5 to 7, and 9 to 11, or being aligned along the main axis X.Preferably, the third layer 4 is located at a distance from the first portion 25 to avoid exerting stresses on the first portion 25 during the creep of the third layer 4. The first portion 25 is inserted at least partially within the through cavity 9 of the third layer 4. In this case, the creep of the third layer 4 and the fourth layer 5 is encouraged to cover the first portion 25 of the wire 24.

[0070] According to yet another variant, the through cavity 9 of the third layer 4 has a diameter greater than or equal to that of the through cavity 8 of the first layer 2. The diameters are measured along an axis perpendicular to the main axis X.

[0071] In Figure 10, a device 1 is shown before the pressing step, in which the fourth layer 5 comprises an additional cavity 100, that is to say that the front and rear faces 60, 61 of the fourth layer 5 are not continuous. In Figure 11, a device 1 is shown before pressing in which the support layer 6 comprises a through cavity 63 for at least partially inserting the second adhesive layer 3.

[0072] In Figures 12 to 14, another embodiment of the laminated electronic device 1 is shown. According to this other embodiment, the second adhesive layer 3 has a rear face 15 at least partially in contact with the front face 10 of the electronic module 7 and with the front face 12 of the first layer 2. Preferably, the surface area of ​​the rear face 15 of the second adhesive layer 3 is strictly greater than the surface area of ​​the front face 10 of the electronic module 7. In other words, the second adhesive layer 3 covers the front face 10 of the electronic module 7. The main axis X passes, successively, through the first layer 2 and the second layer 3.

[0073] According to another advantage, the device 1 comprises a first antenna 200 electrically coupled to the connection zone 20 of the electronic module 7, and a second antenna 201 at least partially in contact with the first layer 2. More particularly, the second antenna 201 is coupled by inductive effect with at least the first antenna 200. In other words, the second antenna 201 is not electrically connected by an electric wire to the first antenna 200. The coupling of the first and second antennas 200, 201 to each other by inductive effect is also noted magnetic coupling. The first and second antennas 200, 201 are intended to allow an exchange of data, by means of electromagnetic waves, with an electronic device located at a distance from the device, for example a credit card reader.Thus, the energy of the electromagnetic waves originating from, or transmitted to, the second antenna 201 has little effect on the electronic module 7 because there is no wired electrical connection between the second antenna 201 and the electronic module 7. In particular, the first antenna 200 forms a closed circuit with the logic circuit 21 in order to be able to receive or provide an electrical signal. For example, the first and second antennas 200, 201 each comprise an electrical wire and the first and second antennas 200, 201 are said to be wired. Alternatively, an antenna 200, 201, or each antenna 200, 201, may comprise an electrically conductive flat strip. According to another alternative, an antenna 200, 201, or each antenna 200, 201, may be produced by depositing an electrically conductive ink.

[0074] Generally, the second antenna 201 comprises at least one portion 210, 211 arranged in a spiral around the first antenna 200. Advantageously, to improve the exchange of data, the second antenna 201 may comprise a first portion 210 arranged in a spiral around the first antenna 200 so as to be coupled by an inductive effect to the first antenna 200, and a second portion 211 arranged in a spiral around the first portion 210 so as to be coupled by an inductive effect to an electronic device located at a distance from the device. Generally, each antenna 200, 201 comprises an electrically conductive element (such as an electrical wire, an electrically conductive strip, or an electrically conductive ink) arranged within the spiral device in order to produce and receive a magnetic field allowing coupling by an inductive effect between the antennas 200, 201.For example, the first and second antennas 200, 201 are planar coils.

[0075] In particular, the first and second parts 210, 211 are respectively arranged in spirals so that the diameters of the turns of the second part 211 are strictly greater than those of the turns of the first part 210. We also note the first part 210, small loop 210, and the second part 211, large loop 211, because the diameters of the turns of the large loop 211 are strictly greater than those of the small loop 210. More particularly, a distance separates the turn of the large loop 211 most proximal to the electronic module 7 with the turn of the small loop 210 most distal to the electronic module 7. The distance is strictly greater than a gap between the turns of the small loop 210. Thus, the large loop 211 is configured to exchange data with an electronic device located at a distance from the device 1.Furthermore, the small loop 210 is configured to exchange this data with the first antenna 200, to transmit and receive this data with the electronic module 7, in particular with the logic circuit 21 of the module 7. In this case, the small loop 210 acts as a relay for the exchange of data between the electronic module 7 and the electronic device located at a distance from the device 1. The second antenna 201 is also called a power antenna, because it is configured to receive electromagnetic waves having a frequency between 10 and 20 MHz. More particularly, the large loop 211 is electrically coupled to the small loop 210. For example, the same electrically conductive element is arranged in spirals to form the small and large loops 210, 211 respectively. For example, the same electrically conductive element forming the small and large loops may have its two ends connected together.

[0076] In the embodiment illustrated in Figures 12 and 13, the device 1 may comprise the third layer 4, as defined above, of the third thermoplastic polymer material. In this embodiment, the third layer 4 is at least partially in contact with the first layer 2, with the second layer 3 and with the second antenna 201. The third layer 4 makes it possible to protect the electronic module 7 and the second antenna 201, and more particularly to improve the resistance of the electronic module 7 with the first layer 2. The device 1 may further comprise an additional layer 203 of an additional thermoplastic polymer material, the additional layer 203 being at least partially in contact with the first layer 2 and with the electronic module 7. The additional layer 203 has a front face 300 intended to be in contact with the electronic module 7, and a rear face 301.Preferably, the additional layer 203 covers the rear face 11 of the electronic module 7, in other words the surface area of ​​the front face 300 of the additional layer 203 is strictly greater than that of the rear face 11 of the electronic module 7.

[0077] The device 1 may also comprise a covering layer 204 of a thermoplastic polymer covering material, the covering layer 204 being at least partially in contact with the first layer 2 and the additional layer 203. For example, the additional layer 203 comprises at least one adhesive face 300, 301. Preferably, the rear face 301 of the additional layer 203 is adhesive. Thus, the adhesive rear face 301 of the additional layer 203 makes it possible to keep a portion of the covering layer 204 located opposite the electronic module 7 immobile during the pressing step. Indeed, the pressing causes the layers 2, 4 to 6 to creep; and 203 to 205 which could move the part of the covering layer 204 located opposite the electronic module 7 and lead to the creation of weak zones between the rear face 11 of the electronic module 7 and the covering layer 204.For example, the additional layer 203 may comprise a polycarbonate support layer having a face on which an adhesive is placed. The adhesive may be a polyurethane resin, or an epoxy resin, i.e. an epoxy polymer (or polyepoxide). According to another example, the additional layer 203 comprises an additional material made of thermoplastic polymer that can be polymerized by ultraviolet radiation. In this case, the additional layer 203 is placed, in the form of a paste, in contact with the covering layer 204, and then the additional layer 203 is polymerized by ultraviolet radiation. The polymerization results in a hardening of the additional layer 203 which adheres to the covering layer 204. Advantageously, the additional material of the additional layer 203 has a hardness strictly greater than that of the first material. For example, the hardness of the additional material may be between 80 and 100 Shore D.For example, the additional material is based on polyamide. For example, the additional material is identical to the second material of the second layer 3.

[0078] The device 1 may further comprise an additional covering layer 205 of an additional thermoplastic polymer material, the additional covering layer 205 covering the third layer 4.

[0079] The covering and additional materials may be based on the same thermoplastic polymer as that of the first layer 2, preferably polycarbonate, and more preferably polycarbonate having a hardness of between 75 and 85 Shore D, in order to simplify the manufacture of the device 1.

[0080] When the device 1 comprises layers 2 to 4; 203 to 205, the main axis X passes, successively, through the covering layer 204, the additional layer 203, the first layer 2, the second layer 3, the third layer 4 and the additional covering layer 205.

[0081] Furthermore, Figures 12 and 13 illustrate the main steps of another embodiment of the method for manufacturing the laminated device 1. According to this other embodiment, the assembly comprises bringing the second adhesive layer 3 into contact at least partially with the front face 10 of the electronic module 7. Then, simultaneously or preferably after bringing it into contact with the front face, the method comprises bringing the second adhesive layer 3 into contact with the front face 12 of the first layer 2. Furthermore, the assembly may comprise, before bringing the second adhesive layer 3 into contact with the front face 10 of the electronic module 7, an electrical coupling, for example by welding, of the first antenna 200 to the connection zone 20 of the electronic module. Then, the method may comprise bringing the second antenna 201 into contact at least partially with the first layer 2.

Claims

Claims 1. A laminated electronic device, comprising: - a first layer (2) of a first thermoplastic polymer material, the first layer (2) comprising a through cavity (8); - an electronic module (7) inserted at least partially within the through cavity (8) of the first layer (2); and - a second adhesive layer (3) of a second material having an adhesion greater than that of the first material, the second adhesive layer (3) being at least partially in contact with the first layer (2) and with the electronic module (7); characterized in that the first layer (2) is at least partially in contact with the electronic module (7).

2. Device according to the preceding claim, in which the electronic module (7) has a front face (10) and a rear face (11), the first layer (2) has a front face (12) and a rear face (13), and the second adhesive layer (3) has a front face (14) at least partially in contact with the rear face (11) of the electronic module (7) and with the rear face (13) of the first layer (2).

3. Device according to any one of the preceding claims, wherein the electronic module (7) comprises a connection area (20) and a logic circuit (21) electrically coupled to the connection area (20), the device comprising an electrical wire (24) having a first portion (25) electrically coupled to the connection area (20) and a second portion (26) at least partially in contact with the first layer (2), the device comprising a third layer (4) of a third thermoplastic polymer material, the third layer (4) comprising a through cavity (9) so that the electronic module (7) is inserted at least partially within the through cavity (9) of the third layer (4), the third layer (4) being at least partially in contact with the first layer (2) and with the first and second portions (25, 26) of the electrical wire (24).

4. Device according to the preceding claim, comprising a fourth layer (5) of a fourth thermoplastic polymer material, the fourth layer (5) comprising a cavity (62) so that the electronic module (7) is inserted at least partially within the cavity (62) of the fourth layer (5), the fourth layer (5) being at least partially in contact with the third layer (4) and with the electronic module (7), and in which the third layer (4) has a thickness (E4) greater than or equal to the sum of the thicknesses of the connection zone (20) and of the first portion (25), the thicknesses being measured along an axis (X) passing through the first, second and third layers (2 to 4).

5. Device according to any one of claims 3 to 4, in which the module The electronic module (7) comprises a base (30) having a first face forming the rear face (11) of the electronic module (7) and a second face (31) opposite the first face, the connection zone (20) being in contact with the second face (31), a thickness (E2) of the first layer (2) being greater than or equal to a thickness (Ee) of the base (30), the thicknesses (E2, Ee) being measured along an axis passing through the first, second and third layers (2 to 4). Device according to the preceding claim, in which the fourth layer (5) has a thickness (E5) greater than or equal to a difference between a thickness of the electronic module (7) and the sum of the thicknesses of the first layer (E2) and of the third layer (E4), the thicknesses being measured along an axis (X) passing through the first, second, third and fourth layers (2 to 5).Device according to claim 5, wherein the first, third and fourth materials are based on the same thermoplastic polymer. Device according to the preceding claim, comprising a support layer (6) of a fifth thermoplastic polymer material, the support layer (6) comprising an additional cavity (63), the second adhesive layer (3) being inserted at least partially within the additional cavity (63) and the support layer (6) being at least partially in contact with the first layer (2). Device according to the preceding claim, wherein the second layer (3) has a thickness (E3) less than or equal to that of the support layer (6), the thickness (E3) of the second layer (3) being measured along an axis (X) passing through the first, second and third layers (2 to 4).Device according to claim 1, wherein the electronic module (7) has a front face (10) and a rear face (11), the first layer (2) has a front face (12) and a rear face (13), and the second adhesive layer (3) has a rear face (15) at least partially in contact with the front face (10) of the electronic module (7) and with the front face (12) of the first layer (2). Device according to the preceding claim, wherein the electronic module (7) comprises a connection area (20) and a logic circuit (21) electrically coupled to the connection area (20), the device comprising a first antenna (200) electrically coupled to the connection area (20) and a second antenna (201) at least partially in contact with the first layer (2) and coupled by inductive effect with at least the first antenna (200).Device according to the preceding claim, wherein the second antenna (201) comprises a first part (210) arranged in a spiral around the first antenna (200) so as to be coupled by inductive effect to the first antenna (200), and a second part (211) arranged in a spiral around the first part (210) so as to be coupled by inductive effect to an electronic device located at a distance from the device. Device according to one of claims 10 to 12, comprising a third layer (4). of a third thermoplastic polymer material, the third layer (4) being at least partially in contact with the first layer (2), with the second layer (3) and with the second antenna (201). Device according to the preceding claim, comprising an additional layer (203) of an additional thermoplastic polymer material, the additional layer (203) being at least partially in contact with the first layer (2) and with the electronic module (7). Device according to the preceding claim, wherein the additional material has a hardness strictly greater than that of the first material. Device according to claim 14 or 15, comprising a covering layer (204) of a covering material made of thermoplastic polymer, the covering layer (204) being at least partially in contact with the first layer (2) and the additional layer (203).Device according to the preceding claim, comprising an additional covering layer (205) of an additional thermoplastic polymer material, the additional covering layer (205) covering the third layer (4). Device according to any one of the preceding claims, wherein the second material has a hardness strictly greater than that of the first material. Method of manufacturing a laminated electronic device, comprising an assembly to obtain a laminated electronic device (1), the assembly comprising:. - a provision of a first layer (2) of a first thermoplastic polymer material, the first layer (2) comprising a through cavity; - an insertion of an electronic module (7) at least partially within the through cavity of the first layer (2) so that the electronic module (7) is located at a distance from the first layer (2); - a provision of a second adhesive layer (3) of a second material having an adhesion greater than that of the first material; and - bringing the second adhesive layer (3) into contact at least partially with the first layer (2) and with the electronic module (7); characterized in that the method comprises, after assembly, pressing the laminated electronic device (1) at a temperature allowing flow of at least the first material so that the first layer (2) flows towards the electronic module (7) in order to be at least partially brought into contact with the electronic module (7). Method according to the preceding claim, in which the electronic module (7) has a front face and a rear face, the first layer (2) has a front face and a rear face, and the second adhesive layer (3) has a front face, the assembly comprising bringing the second adhesive layer (3) into contact at least partially with the rear face of the electronic module (7) and with the rear face of the first layer (2).

21. Method according to the preceding claim, wherein the electronic module (7) comprises a connection area and a logic circuit electrically coupled to the connection area, the assembly comprising a provision of an electrical wire (24) having a first portion electrically coupled to the connection area and a second portion brought into contact at least partially with the first layer (2), a provision of a third layer (4) of a third thermoplastic polymer material, the third layer (4) comprising a through cavity for inserting the electronic module (7) at least partially within the through cavity of the third layer (4), and a contacting of the third layer (4) at least partially with the first layer (2) and with the second portion so that the first portion is located at a distance from the third layer (4),and the pressing comprises a creeping of the third layer (4) towards the first portion in order to be brought into contact at least partially with the first portion., 22. Method according to the preceding claim, wherein the assembly comprises providing a fourth layer (5) of a fourth thermoplastic polymer material, the fourth layer (5) comprising a cavity for inserting the electronic module (7) at least partially within the cavity of the fourth layer (5), and bringing the fourth layer (5) into contact at least partially with the third layer (4), the third layer (4) having a thickness (E4) greater than or equal to the sum of the thicknesses of the connection zone (20) and of the first portion (25), the thicknesses being measured along an axis (X) passing through the first, second and third layers (2 to 4), the fourth layer (5) being shaped to cover the first portion of the electric wire (24), and the pressing comprises creeping the fourth layer (5) towards the electronic module (7) in order to be brought into contact at least partially with the electronic module (7).

23. Method according to the preceding claim, in which the assembly comprises providing a support layer (6) of a fifth thermoplastic polymer material, and the support layer (6) covers a rear face (15) of the second adhesive layer (3) and at least partially the rear face of the first layer (2).

24. Method according to claim 19, in which the electronic module (7) has a front face (10) and a rear face (11), the first layer (2) has a front face (12) and a rear face (13), and the second adhesive layer (3) has a rear face (15), the assembly comprising bringing the second adhesive layer (3) into contact at least partially with the front face (10) of the electronic module (7) and with the front face (12) of the first layer (2).

25. Method according to the preceding claim, in which the electronic module (7) comprises a connection area (20) and a logic circuit (21) electrically coupled to the connection area (20), the assembly comprising a provision of a first antenna (200) electrically coupled to the connection area (20) and a second antenna (201) brought into contact at least partially with the first layer (2) so that the second antenna (201) is coupled by inductive effect with at least the first antenna (200). Method according to the preceding claim, in which the second antenna (201) comprises a first part (210) arranged in a spiral around the first antenna (200) so as to be inductively coupled to the first antenna (200), and a second portion (211) arranged in a spiral around the first portion (210) so as to be inductively coupled to an electronic device located remotely from the device.

Images