Device for cooling a data center computer server by using a phase change material

Abstract

The present invention relates to a cooling device (1) for cooling at least one computer server for a data center, the device (1) comprising: - a phase change material (5) configured to exchange heat with at least one of the components of the server; - at least one heat exchanger (7) connected to a heat transfer fluid circuit (3); the device (1) being configured to cool at least one component of the server by storing heat generated by the component in the phase change material (5), and to release the heat stored in the phase change material (5) via the heat exchanger (7).

Description

DEVICE FOR COOLING A DATA CENTER COMPUTER SERVER BY USING A FLOW CHANGE MATERIAL PHASE

[0001] [The present invention relates to the field of computer servers in data centers, and more particularly to the thermal management of said computer servers, in particular their cooling, inter alia by the use of a phase change material.

[0002] Data centers are typically a building or space within a building dedicated to housing computer systems and associated components, such as telecommunications and storage systems.

[0003] Because the operations performed by computer systems are critical in technical, scientific, and / or business settings, a data center typically includes redundant or backup components and infrastructure for power supply, data communication connections, environmental controls (e.g., air conditioning, fire suppression), and various security features.

[0004] In addition, a data center must be operational 24 hours a day, so its operation involves the consumption of large quantities of electrical and / or thermal energy. Thermal energy consumption means that it is necessary to use energy to regulate the temperature of computer servers and / or the data center, for example by ensuring that the air entering the computer servers is cooled by electrically powered air conditioning systems. This temperature regulation is mandatory to ensure the proper functioning of the data center and its components, regardless of the country, whether it is in a temperate or tropical zone.

[0005] Thus, typically, air conditioning systems are configured to cool ambient air and circulate it through the servers, typically from the front to the back of the server, thereby cooling the components housed in the server. In addition, to facilitate this circulation of air flow through the servers, ventilation means are generally arranged at the rear of the servers. However, these ventilation means present a power consumption and maintenance costs (breakdowns, filter changes, etc.) that are far from negligible.

[0006] Furthermore, it is known to use renewable electrical energy sources, generally intermittent, such as photovoltaic panels, wind turbines, etc., associated with an electric storage battery, but this electric storage solution by battery is expensive and can present electrical and fire risks for high-power installations.

[0007] Thus, faced with the ever-increasing number of data centers in operation, it is urgent to find solutions to reduce their electricity consumption, their carbon footprint, and / or their operating costs while continuing to guarantee the best possible operating conditions for the servers in these data centers.

[0008] The present invention thus proposes to remedy at least one of the problems mentioned above by proposing a cooling solution using a phase change material (or "PCM" for "Phase Change Material" in English) advantageously associated with a renewable electrical energy source.

[0009] Thus, the present invention relates to a device for cooling at least one computer server for a data center, said device comprising: - a phase change material configured to exchange heat with at least one of the components of said server; - at least one heat exchanger connected to a heat transfer fluid circuit; said device being configured, on the one hand, to cool at least one component of said server, by storing the heat generated by said component in the phase change material, and on the other hand, to release the heat stored in the phase change material via said heat exchanger.

[0010] The cooling device therefore allows simple and rapid thermal management of the components of a server, by storing thermal energy generated by said components in a phase change material, as well as delayed management over time of the thermal energy thus stored in said material, for example during periods when this management of calories is more ecological and / or less expensive.

[0011] Advantageously, the phase change material is configured to exchange heat directly with one or more components of the computer server, i.e. the heat transfer from the server component to be cooled to the phase change material is mainly by conduction. The phase change material may thus be in direct contact with the component(s) or via one or more thermally conductive intermediate elements (e.g. a heat exchanger, thermal paste, a soleplate, etc.).

[0012] It should be noted that the phase change material may also exchange heat indirectly with one or more components of said server. "Indirect heat exchange" means that the heat transfer between a component and the phase change material takes place via a fluid, such as a gas (e.g. air), or a liquid (e.g. water).

[0013] Advantageously, the cooling device is configured to cool a computer server rack. It will be noted that each rack generally comprises storage components (or hard drives), as well as one or more hubs (or concentrators) and / or network switches. The fact that each rack is associated with a cooling device according to the invention allows optimized and personalized thermal management of the rack components, thus making it possible to improve the lifespan of said components and / or to minimize the electrical energy consumed to cool a computer server rack and its components.

[0014] According to one possible feature, the device comprises at least one renewable electrical energy source, such as a solar panel, a wind turbine, etc., configured to supply electricity to the elements of said device, such as said heat transfer fluid circuit and its sub-elements.

[0015] According to one possible feature, the device comprises an electronic control unit configured to control the release of heat stored in the phase change material, for example so that the release is a function of the amount of energy available from a renewable electrical energy source and / or the price of energy.

[0016] It will be noted that the heat release, controlled by said unit, is advantageously deferred, that is to say that the moment when the phase change material stores heat and the moment when this heat is evacuated or released are distinct and independent moments, for example making the release a function of the quantity of electricity from a renewable electrical energy source and / or the price of electricity, thus making it possible to make the cooling of the servers more ecological and / or more economical.

[0017] The invention therefore makes it possible to defer the use of energy for cooling the phase change material to the most appropriate time. It is thus possible to cool the phase change material, and therefore store frigories, when electricity prices are most advantageous, for example at night, and thus use the stored frigories to eliminate or at least reduce electricity consumption during the day (when electricity prices are generally higher).

[0018] According to another possible characteristic, the heat transfer fluid circuit is thermally coupled to a “heat pump” type circuit or to a refrigeration system. Advantageously, the heat transfer fluid circuit is configured to be connected to a cold source which allows the heat stored in the phase change material to be released. The "heat pump" type circuit or a refrigeration system are generally systems requiring electricity to operate.

[0019] According to a first possible embodiment of the invention, the device comprises a ventilation unit configured to circulate an air flow through said server to the phase change material.

[0020] Advantageously, the ventilation unit is arranged to draw air from the server. Drawing air from the servers notably implies that the ventilation unit is advantageously arranged at the rear of the server, leaving the front of the server accessible for various operations, in particular maintenance operations. Furthermore, the ventilation unit advantageously comprises one or more motor-fan units, as well as an electric battery.

[0021] According to a possible characteristic of the first mode, the air flow coming from the ventilation unit is channeled into at least one cooling unit comprising said heat exchanger and said phase change material. These cooling units have, for example, substantially a column shape. The air flow thus cooled by its passage through the column of the cooling unit is then discharged into the ambient air of the building and / or the server room, or channeled (directly) towards the air inlets of one or more computer servers.

[0022] According to another possible feature of the first mode, the heat exchanger of the cooling unit comprises: - a first structure in which a conduit is arranged for the heat transfer fluid of the heat transfer fluid circuit; - a second structure surrounding the first structure and being configured to cool (by heat transfer to the phase change material) the air flow from the ventilation unit; said first and second structures being configured so that there is a space between said structures defining a housing in which said phase change material is arranged.

[0023] According to another possible feature of the first mode, the air flow from the ventilation unit circulates in the cooling unit from top to bottom. The air flow, heated by the server, will thus pass through the cooling unit, and for example the column of said unit according to its length, thus promoting the transfer of heat from the air flow to the phase change material.

[0024] According to another possible characteristic of the first mode, the heat transfer fluid circuit is configured so that the heat transfer fluid circulates through the heat exchanger from bottom to top. Advantageously, the phase change material is resolidified first at the material located at the bottom of said cooling unit.

[0025] According to another possible characteristic of the first mode, the ventilation speed of the ventilation unit is configured so that the temperature (measured by a suitably arranged sensor) of the air of the servers and / or the components of said servers is substantially stable.

[0026] According to a second possible embodiment of the invention, the device comprises a thermal conduction element connecting at least one of the components of said server to the phase change material. The heat conduction element is, for example, a structure in thermal contact, for example via a thermal paste, with a component whose temperature is to be lowered. Said heat conduction element is, for example, made of a material having good thermal conduction, such as a metal, for example copper, aluminum, etc.

[0027] According to another possible characteristic of the second mode, the thermal conduction element further comprises a Peltier effect thermoelectric module. A Peltier effect module can accelerate the decrease in the component's temperature and improve, or even force, the heat transfer from the component to the phase change material.

[0028] According to another possible characteristic of the second mode, the phase change material is housed in said heat exchanger connected to the heat transfer fluid circuit.

[0029] According to another possible characteristic of the second mode, the heat exchanger: - a first structure in which a conduit is arranged for the heat transfer fluid of the heat transfer fluid circuit; - a second structure surrounding the first structure, in contact with one or more components of the server, and which is configured to cool (by heat transfer to the phase change material) the component(s) of the server; said first and second structures being configured so that there is a space between said structures which defines a housing in which said phase change material is arranged.

[0030] According to another possible characteristic, the device comprises a heat transfer fluid circuit comprising at least one pump and a heat exchanger associated with a refrigerant fluid circuit, for example configured to operate in a “heat pump” mode.

[0031] According to another possible characteristic, the device comprises at least two temperature sensors from the following list: a temperature sensor of the air flow leaving the server, a temperature sensor of the air flow entering the cooling unit, a temperature sensor of the air flow leaving the cooling unit, a temperature sensor of the phase change material, a device for measuring the latent charge rate (solidification) of the phase change material, such as a temperature sensor and / or a pressure sensor.

[0032] According to another possible characteristic, the electronic control unit is configured to control: the “heat pump” type circuit, the heat transfer fluid circuit, the ventilation unit and / or the cooling device. More particularly, said control unit is configured to control the flow rate of heat transfer fluid in said circuit, the flow rate of the fluid circulating in a “heat pump” type circuit, any element of the cooling device, and / or the flow rate of the air flow of the ventilation unit, etc.

[0033] Advantageously, said control unit is configured to adjust the flow rate parameters of at least one fluid (air, heat transfer fluid, etc.) as a function of the real-time power consumed by the server or one of the racks of said server, in order to stabilize the temperature of the server or one of its elements.

[0034] According to a second possible embodiment of the invention, all the exothermic elements of the rack are mounted directly on the units of cooling containing phase change material and / or heat transfer fluid conduit. This configuration is valid for new stand-alone rack concepts with an integrated cooling system. The presence of the phase change material allows heat to be stored directly in the rack for subsequent elimination without requiring strong ventilation. Other weakly exothermic elements can be cooled by convection or by light, low-power ventilation.

[0035] The invention also relates to the use of cold sources to optimize the "recharge" (generally solidification by cooling) of phase change materials depending on the presence of the collected intermittent energy. In the event of a prolonged absence of the latter, the cooling device will be powered directly by the network ("sector").

[0036] It should be noted that the PCM can be advantageously cooled and resolidified at around 15°C (non-limiting) to simultaneously condense and eliminate any excess moisture in the cooling airflow, but without limitations for other climatic conditions (from the desert to the pole).

[0037] In the case of direct cooling of exothermic elements, it is advantageous to use a material that solidifies at room temperature, around, but not limited to, 20°C to 24°C, to avoid any condensation on the columns and in the racks.

[0038] It should be noted that it is possible to use any refrigerant fluid to cool the phase change material, including a network of refrigerated water (or any other gas or liquid) from a heat pump, or any other means of refrigeration, including the Peltier effect.

[0039] The invention will be better understood, and other objects, details, characteristics and advantages thereof will appear more clearly during the following description of particular embodiments of the invention, given solely for illustrative and non-limiting purposes, with reference to the appended drawings, in which: - figure 1, referenced [Fig. 1], illustrates a very schematic view of a cooling device according to the invention intended for the thermal regulation of at least a server; - figure 2, referenced [Fig. 2], illustrates a very schematic view of a cooling device according to an alternative embodiment of the invention; - figure 3, referenced [Fig. 3], illustrates a schematic and partial view of a cooling unit of a cooling device according to one embodiment; - figure 4, referenced [Fig. 4], illustrates a very schematic view of a cooling device according to another variant embodiment of the invention; - Figure 4, referenced [Fig. 4], illustrates a schematic and perspective view of a heat exchanger of the cooling unit of Figure 4; - Figure 5, referenced [Fig. 5], illustrates a schematic and cross-sectional view of the heat exchanger of Figure 4.

[0040] It should also be noted that in the various figures, the same references designate identical or similar elements.

[0041] [Fig. 1] is thus a very schematic and partial representation of a cooling device 1 according to a first embodiment intended to cool at least one server S or group of computer servers (servers which may comprise one or more “racks”) for a data center.

[0042] The device 1 according to the invention can be adapted to cool each server S and / or collectively cool a set of servers without limitation of the number of servers.

[0043] Said device 1 comprises at least one cooling unit 2, as well as a ventilation unit V configured to circulate an air flow F through said at least one server S to the cooling unit 2.

[0044] The ventilation unit V comprises, for example, one or more fans and / or a motor-fan unit, including at least one fan arranged to draw air through said at least one server S, for example by being arranged at the rear of said at least one server S. The ventilation unit V may also comprise one or more electric batteries to power the fan(s) and / or motor-fan units, in particular during possible power cuts and / or to use electricity produced and stored previously at a lower cost (or more ecologically).

[0045] Said cooling device 1 thus comprises: - a phase change material 5 configured to exchange heat (here via the air flow F) with at least one of the components of said at least one server S; - at least one heat exchanger 7 connected to a heat transfer fluid circuit 3.

[0046] More particularly, Figure 1 illustrates an embodiment of the invention in which the device 1 comprises the thermal cooling unit 2 which houses the heat exchanger 7 connected to the heat transfer fluid circuit 3, as well as the phase change material 5.

[0047] Said device 1 being configured, on the one hand, to cool at least one component of said server S, by storing the heat generated by one of said components of the server S in the phase change material 5, and on the other hand, to release the heat stored in the phase change material 5 via said heat exchanger 7 (and via the heat transfer fluid circuit 3).

[0048] The heat transfer is here achieved by means of the air flow F passing through the server S, the latter giving up calories to the air flow F (therefore heating it), then said air flow F giving up its calories via the exchanger 7 to the phase change material 5.

[0049] It should be noted that a phase-change material 5 (or “PCM” for “Phase-Change Material” in English) is a material capable of changing physical state in a restricted temperature range (latent heat) and of storing and releasing calories by this means.

[0050] Said phase change material 5 advantageously has a melting temperature of between -10°C and 25°C (this for energy storage), and preferably between -5°C and 20°C, and even more preferably between 12°C and 18°C ​​or 18°C ​​and 28°C in the case of direct cooling detailed below.

[0051] Figure 2 illustrates a very schematic and partial view of an alternative embodiment of the cooling device 1, in which the cooling unit 2 has substantially the shape of a column in which the heat exchanger 7 connected to the heat transfer fluid circuit 3 is housed, as well as the phase change material 5. It will be noted that the device 1 may comprise one or more cooling units 2.

[0052] Said cooling unit 2 is thus configured so that the air flow F coming from the ventilation unit V is channeled through the cooling unit 2, the air flow being cooled by its passage through the column of the cooling unit 2 is then discharged into the ambient air of the building and / or the server room, or channeled (directly) towards the air inlets of one or more computer servers. It will be noted that the air flow coming from the ventilation unit V circulates preferentially in the cooling unit 2 from top to bottom.

[0053] The heat transfer fluid circuit 3 comprises, for its part, a pump 9 configured to circulate the heat transfer fluid in said circuit 3, and in particular in the heat exchanger 7 of the cooling unit 2, preferably from bottom to top, as well as another heat exchanger 23, called a coupling exchanger, which is thermally coupled to a cold source (not shown).

[0054] Thus, the heat transfer fluid circuit 3 is connected to a cold source which allows the heat stored in the phase change material 5 to be released, via the heat transfer fluid.

[0055] Figure 3 is a schematic and sectional view of an exemplary embodiment of a cooling unit 2 of the device 1 illustrated in Figures 1 and 2.

[0056] The heat transfer fluid circuit 3 thus comprises: - pump 9 for circulating the heat transfer fluid in said circuit 3; - a stop valve 11, said valve 11 being configured to stop the circulation of the heat transfer fluid in said circuit 3, stopping the circulation of the heat transfer fluid limits, or even stops, the storage or release of calories between the heat transfer fluid and the phase change material 5; - at least one additional and optional means 13 for circulating the air flow, said circulation means 13 being configured to circulate the air flow F along said heat exchanger 7.

[0057] It should be noted that the heat transfer fluid is advantageously water, glycolated water (i.e. water mixed with glycol), glycol, etc., but can also be a refrigerant.

[0058] The additional circulation means 13 is for example a motor-fan unit or a fan (such as a centrifugal fan) making it possible to suck (or "push") air through the unit 2 and to circulate the air along the exchanger 7 so that the latter cools or heats up through it (and by extension the room into which the air emerges).

[0059] According to alternative embodiments not shown, the heat exchanger 7 may have different geometries and / or comprise different elements so that the air can circulate in the center and / or on the edges of said heat exchanger 7.

[0060] The unit 2 further comprises a housing 32 in which are housed, for example, the heat exchanger 7, the circulation means 13, a part of the circuit 3, the stop valve 11, etc.

[0061] Said housing 32 also comprises an air inlet 32a and an air outlet 32b to allow the circulation of air by means of said additional circulation means 13 and / or the ventilation unit V. It will also be noted that the air inlet 32a can be configured to draw in air from outside (generally dry) and / or air already thermally conditioned by the unit 2 (also referred to as recycled air).

[0062] Advantageously, the part of the circuit 3 which is not arranged in the housing 32 is thermally insulated from the external environment, for example by means of a thermal insulator 46. This thermal insulation makes it possible to limit heat losses before the heat transfer fluid reaches the level of the phase change material 5 (this is all the more relevant as the loop outside the housing is large).

[0063] In addition, said unit 2 may also comprise a sheath in which said heat exchanger 7 is preferably arranged, said sheath 21 being advantageously made of a thermally insulating material.

[0064] Said unit 2 also includes: - an electronic management entity 15 configured to control, among other things, the circulation of the heat transfer fluid in said circuit 3 and / or the circulation (flow rate, speed, etc.) of the air flow in the unit 2 and / or in said at least one server S (therefore controlling the ventilation unit V and / or the additional circulation means 13); - a human-machine interface 17, said human-machine interface (or user interface) being the set of elements allowing the user to interact with the unit, and more particularly to control the unit and / or to exchange information with it.

[0065] The human-machine interface includes, for example, one or more of the following elements: button(s), keyboard, screen, touch screen, wheel(s), indicator lights, etc.

[0066] Figure 4, for its part, illustrates a very schematic and partial view of a device 1 according to another variant of the first embodiment of the invention, in which the cold source (of the device 1 of Figure 2) is a circuit of the “heat pump” type 4. Said device 1 then comprises a circuit of the heat pump type 4 (in which circulates for example a refrigerant fluid) which is thermally coupled via the heat exchanger 23 to the heat transfer fluid circuit 3.

[0067] Said heat pump type circuit 4 further comprises: a compressor C, an expansion valve Di (or expansion member), a heat exchanger Hi (for example acting as an evaporator), and a heat exchanger H2 (for example acting as a condenser). Said circuit 4 also advantageously comprises a bypass branch comprising a two-way valve V of the coupling exchanger 23. Said circuit 4 and its various elements are therefore configured to carry out a thermodynamic cycle aimed at capturing calories at the level of the exchanger 23 (therefore at the heat transfer fluid) and evacuating them at the level of the exchanger Hi, for example by giving up calories to an air flow F passing through said exchanger Hi.

[0068] In another variant embodiment not shown, said coupling exchanger 23 is coupled to a refrigeration system, in which, for example, a refrigerant fluid circulates.

[0069] It should be noted, however, that whatever the variant or embodiment and without this leading to any technical contraindication, the said unit 2 may include at least two temperature sensors (not shown) from the following list: a temperature sensor of the airflow leaving the server, a temperature sensor of the airflow entering the cooling unit, a temperature sensor of the airflow leaving the cooling unit, a temperature sensor of the phase change material, a device for measuring the latent charge rate (solidification) of the phase change material, such as a temperature sensor and / or a pressure sensor.

[0070] Thus, the electronic management entity 15 is advantageously configured to control: the “heat pump” type circuit, the heat transfer fluid circuit, the ventilation unit, the additional circulation means and / or the cooling device.

[0071] More particularly, said electronic management entity 15 can be configured to control the flow rate of heat transfer fluid in said circuit 3, the flow rate of the fluid (for example refrigerant) circulating in the “heat pump” type circuit 4, and / or the flow rate of the air flow from the ventilation unit V, etc., and generally any element of the cooling device.

[0072] As more particularly illustrated in Figures 5 and 6, which are respectively a cross-sectional view and a perspective view of the exchanger 7, this heat exchanger 7 comprises: - a first structure 110 in which a conduit 110a is arranged for the heat transfer fluid, for example in its center; - a second structure 120 surrounding the first structure 110 (and therefore the conduit 110a), for example concentrically with respect to the first structure 110.

[0073] Said first 110 and second 120 structures are configured so that there is a space between said structures 110 and 120 defining a housing in which the phase change material 5 is arranged (or stored).

[0074] It will also be noted that the heat exchanger 7 and its first and second structures 110 and 120 are advantageously produced in the form of independent columns made of a thermally conductive metallic material, such as aluminum. The number and size of columns depends on the power requirement to bridge the intermittency of the energy source(s).

[0075] The heat exchanger 7 is for example produced by extrusion. In addition, the exchanger 7 is preferably of elongated shape, this so that the heat transfer fluid conduit is as long as possible, so that it gives off or recovers calories from the phase change material 5.

[0076] Thus, in one possible embodiment, the heat exchanger 7 comprises two extruded aluminum profiles 110 and 120 arranged concentrically with respect to each other. Each of the profiles has, for example, circular, square, rectangular, etc. sections. The first extruded profile, respectively the first structure 110, comprises, arranged in its center, the conduit 110a of the heat transfer fluid.

[0077] The air flow F is therefore cooled and / or heated by means of the second structure 120 of said exchanger 7, in particular via its external surface. In addition, the structures 110 and 120 advantageously comprise fins 111, 121 and 122, said fins making it possible to increase the contact surfaces and therefore to maximize the heat exchanges.

[0078] More particularly, the fins 111 of the first structure 110 extend away in the direction of the second structure 120 of said exchanger 7, the fins 111 thus deploy in the volume or space where the phase change material 5 is stored, thus increasing the contact surface between said material 5 and the first structure 110 and promoting thermal exchanges between the heat transfer fluid F circulating in the conduit 110a and said material 5.

[0079] The fins 121 and 122 of the second structure 120 may, for their part, extend away from the second structure 120 (from its external surface), called external fins 121, and / or extend towards the first structure 110 (from the internal surface of the structure 120), called internal fins 122.

[0080] The external fins 121 increase the contact surface between the thermal regulation flow F (here an air flow) and the second structure 120, facilitating thermal exchanges, while the internal fins 122 increase the contact surface with the phase change material 5, facilitating a heat transfer between the material 5 and the heat transfer fluid and / or the air flow F.

[0081] It will be noted that certain fins 111 of the first structure 110 and the internal fins 122 are configured to cooperate with each other to guarantee a constant spacing between said structures 110 and 120, as well as good mechanical strength of the assembly.

[0082] It will also be noted that the sheath 21 more particularly surrounds said at least one exchanger 7 so that there is a space between the internal surface of the sheath 21 and the second structure 120 of said exchanger 7, the space thus formed defining a conduit for the thermal regulation fluid F, such as air, and making it possible to channel the latter and to maximize the thermal exchanges between the air flow F and the exchanger 7.

[0083] Advantageously, the outer perimeter defined by the external fins 121 has a geometric shape, such as a square or more generally rectangular shape, thus facilitating the manufacture of a sheath 21 which is fitted onto the exchanger 7.

[0084] Whatever the variation or embodiment of the invention, the device 1 advantageously comprises at least one source of renewable electrical energy, such as a solar panel, a wind turbine, etc., configured to supply electricity to the elements of said device 1, such as said heat transfer fluid circuit 3 and its sub-elements.

[0085] The device comprises an electronic control unit configured to control the release of heat stored in the phase change material, for example so that the release is a function of the amount of energy available from a renewable electrical energy source and / or the price of energy.

[0086] In another embodiment, called the second embodiment, not shown, the phase change material 5 is configured to exchange thermally in a direct manner with one or more components of the computer server S, that is to say that the heat transfer from the component of the server S to the phase change material 5 takes place mainly by conduction.

[0087] The phase change material 5 can thus be directly in contact with the component(s) or via one or more thermally conductive intermediate elements (for example a heat exchanger, thermal paste, a sole, etc.).

[0088] Thus, in this second embodiment, the device 1 comprises a thermal conduction element connecting at least one of the components of said server S to the phase change material 5.

[0089] The heat conduction element is, for example, a structure in thermal contact, for example via a thermal paste, with a component whose temperature is to be lowered. Said heat conduction element is, for example, made of a material having good thermal conduction, such as a metal, for example copper, aluminum, etc.

[0090] The heat conduction element may further comprise a Peltier effect thermoelectric module.

[0091] However, the phase change material 5 is still advantageously housed in a heat exchanger connected to the heat transfer fluid circuit 3.

[0092] Thus, in this second embodiment not shown, the heat exchanger: - a first structure in which a conduit is arranged for the heat transfer fluid of the heat transfer fluid circuit; - a second structure surrounding the first structure, in contact with one or more components of the server, and which is configured to cool (by heat transfer to the phase change material) the component(s) of the server.

[0093] Said first and second structures being configured so that there is a space between said structures which defines a housing in which said phase change material is disposed.

[0094] Furthermore, in a variant of the second embodiment, all exothermic elements of the server S are mounted directly on the cooling columns or units containing phase change material 5, the cooling units being inside and forming an integral part of the server (or at least of a rack of the server).

Claims

CLAIMS [Claims 1] [Cooling device (1) for at least one computer server for a data center, said device (1) comprising: - a phase change material (5) configured to exchange heat with at least one of the components of said server; - at least one heat exchanger (7) connected to a heat transfer fluid circuit (3); said device (1) being configured, on the one hand, to cool at least one component of said server, by storing the heat generated by said component in the phase change material (5), and on the other hand, to release the heat stored in the phase change material (5) via said heat exchanger (7). [Claims 2] Device (1) according to the preceding claim, characterized in that the device (1) comprises at least one renewable electrical energy source configured to supply electricity to the elements of said device (1). [Claims 3] Device (1) according to any one of the preceding claims, characterized in that the device (1) comprises an electronic control unit (15) configured to control the release of heat stored in the phase change material (5). [Claims 4] Device (1) according to any one of the preceding claims, characterized in that the heat transfer fluid circuit (3) is thermally coupled to a “heat pump” type circuit or to a refrigeration system. [Claims 5] Device (1) according to any one of the preceding claims, characterized in that the device (1) comprises a ventilation unit (V) configured to circulate an air flow through said server to the phase change material (5). [Claims 6] Device (1) according to the preceding claim, characterized in that the ventilation unit (V) is arranged so as to suck air from the server. [Claims 7] Device (1) according to claim 5 or 6, characterized in that the air flow (F) coming from the ventilation unit (V) is channeled into at least one cooling unit (2) comprising said heat exchanger (7) and said phase change material (5). [Claims 8] Device (1) according to the preceding claim, characterized in that the heat exchanger (7) of the cooling unit (2) comprises: - a first structure (110) in which a conduit (110a) is arranged for the heat transfer fluid of the heat transfer fluid circuit (3); - a second structure (120) surrounding the first structure (110) and being configured to cool (by heat transfer to the phase change material 5) the air flow (F) coming from the ventilation unit (V); said first and second structures (110, 120) being configured so that there is a space between said structures defining a housing in which said phase change material (5) is arranged. [Claims 9] Device (1) according to claim 7 or 8, characterized in that the air flow from the ventilation unit (V) circulates in the cooling unit (2) from top to bottom. [Claims 10] Device (1) according to any one of claims 7 to 9, characterized in that the heat transfer fluid circuit (3) is configured so that the heat transfer fluid circulates through the heat exchanger (7) from bottom to top. [Claims 11] Device (1) according to any one of claims 1 to 4, characterized in that the device comprises a thermal conduction element connecting at least one of the components of said server to the phase change material (5). [Claims 12] Device (1) according to the preceding claim, characterized in that the thermal conduction element further comprises a Peltier effect thermoelectric module. [Claims 13] Data center (aka "datacenter") comprising one or more servers (S) equipped with a cooling device (1) according to any one of the preceding claims]

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